CN115312467B - Semiconductor electronic transistor - Google Patents
Semiconductor electronic transistor Download PDFInfo
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- CN115312467B CN115312467B CN202211042834.XA CN202211042834A CN115312467B CN 115312467 B CN115312467 B CN 115312467B CN 202211042834 A CN202211042834 A CN 202211042834A CN 115312467 B CN115312467 B CN 115312467B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 70
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000005452 bending Methods 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The invention provides a semiconductor electronic transistor, the sliding component also comprises a first swing arm, a second swing arm, a first inclined block, a baffle, a second inclined plate, a roller and a tin frame, wherein the first swing arm is arranged on two sides of a transverse plate, the second swing arm is slidably nested at one end of the first swing arm far away from the transverse plate, the first inclined block is arranged in the second swing arm near the inner part of one end of the first swing arm, the baffle is arranged at one end of the second swing arm far away from the first swing arm, the second inclined plate is arranged at one end of the first swing arm near the second swing arm, the baffle is arranged in the tin frame, one end of the baffle can be extruded to one end of a tin wire in the tin frame, one end of the tin wire extends to the surface of a circuit board, at the moment, the tin wire is positioned on two sides of the welding frame, and the welding fixation of a frame and the circuit board is facilitated, the situation that the tin wire needs to be manually added when the traditional electronic transistor is welded with the circuit board is avoided, the welding end of the frame is attached to the circuit board, and the tin wire extends at the same time, and the subsequent welding is facilitated.
Description
Technical Field
The present disclosure relates to semiconductor technology, and more particularly, to a semiconductor electronic transistor.
Background
An electronic transistor, as a type of variable current switch, is capable of controlling the output current based on the input voltage. Different from a common mechanical switch, the transistor utilizes an electric signal to control the opening and closing of the transistor, the switching speed can be very high, the electronic transistor achieves the electrifying effect by embedding the electrode into other electronic elements of the circuit board, when voltage is applied to the grid electrode, effective charges are accumulated in the channel to form a channel which is conducted from the source electrode to the drain electrode, the electronic transistor can control the electric signal, and the technical teaching of the electronic transistor is aimed at;
research into electronic transistors has found the following problems:
when the electronic transistor is mounted with the circuit board, the electronic transistor needs to be welded through a tin wire and a welding gun, and when the electronic transistor is welded, the added tin wire is usually needed to be manually taken, the adding amount of the tin wire cannot be controlled, the situation that too much soldering tin is easy to occur between the electronic transistor and the circuit board after welding, and the tin wire cannot be automatically added when the electronic transistor is attached to the circuit board;
currently, CN202011015902.4 in the prior art is a high electron mobility transistor device and method, disclosing an electronic transistor, the invention is a first heterostructure and a second heterostructure on a substrate and facing each other, each heterostructure of the first heterostructure and the second heterostructure comprising a first semiconductor layer on a first surface of the substrate, a second semiconductor layer on the first surface of the substrate, and a two-dimensional electrode gas layer between the first semiconductor layer and the second semiconductor layer, the doped semiconductor layer being arranged between the first heterostructure and the second heterostructure, and the source contact being arranged on the first heterostructure and the second heterostructure;
the invention can mainly solve the problem that the electronic transistor can not automatically add tin wires when being attached to the circuit board.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a semiconductor electronic transistor to solve the problems described in the background art.
The invention discloses a semiconductor electronic transistor, which is realized by the following specific technical means: the semiconductor electronic transistor comprises a frame, wherein two ends of the frame are respectively provided with a welding frame and an electrode, the welding frame penetrates through one end of the frame, the frame is welded and installed with a circuit board, and the welding frame is arranged at one end of the frame close to the circuit board.
Further, the welding frame is provided with a groove at one end far away from the frame, and a sliding component which is convenient for welding the frame and the circuit board is arranged on the inner side of the welding frame.
Further, one end of the electrode is connected with other electronic components of the circuit board in a nested manner, and the frame is connected with other electronic component power supply loops of the circuit board through the electrode.
Further, the slip subassembly includes diaphragm, sleeve, base, support, sand grip, return bend and slide rail, and the base is installed in the centre of welding frame, and the sleeve slides and nests in the outside of base, and the diaphragm slides in the one end that the base was kept away from to the sleeve, and the support is located the base and is close to telescopic one end, and the sand grip is inlayed in the inboard of support, and the inside of base is located to the slide rail, and the return bend slides and extends to the outside of slide rail.
The transverse plate is positioned at one end of the welding frame far away from the frame, is transversely distributed, is positioned at the outer side of the welding frame when in a static state, and is in the same horizontal plane with the side surface of the welding frame when sliding.
Further, the sleeve is vertically and slidably nested with the base, the inside of the base is hollow, the support and the convex strips are located inside the sleeve, the inside of the sleeve is provided with the convex blocks, and when the sleeve slides on the inner side of the welding frame, one ends of the convex blocks and the convex strips are slidably extruded.
Further, the support surrounds in the one end of base, and the support is 35-50 degrees setting of slope, and the support is located 4-6, sand grip and support supporting setting.
Further, one end of the bent pipe is connected with the convex strips, the number of the bent pipe is matched with that of the convex strips, the thickness of the convex strips is 0.2-0.3cm, the whole bent pipe is in a V shape, and the interval between the other end of the bent pipe and one end of the convex strips is less than 1 cm.
Further, the side surface of the sliding rail is arranged in a semicircular shape, the semicircular angle is 180 degrees, and the overlooking angle of the sliding rail is arranged in a circular ring shape.
Further, the sliding component further comprises a first swing arm, a second swing arm, a first inclined block, a baffle, a second inclined plate, rollers and a tin frame, wherein the first swing arm is arranged on two sides of the transverse plate, the second swing arm is slidably nested at one end of the first swing arm, which is far away from the transverse plate, the first inclined block is arranged inside the second swing arm, which is close to one end of the first swing arm, the baffle is arranged at one end of the second swing arm, which is far away from the first swing arm, the second inclined plate is arranged at one end of the first swing arm, which is close to the second swing arm, the rollers rotate at one end of the second inclined plate, which is far away from the second swing arm, and the tin frame is arranged on two sides of the inside of the welding frame.
Further, the first swing arm and the second swing arm are inclined by 5-15 degrees, one end of the second swing arm is located in the welding frame, a groove is formed in one end, close to the first swing arm, of the second swing arm, and the first inclined block is located in the groove.
Further, the track has been seted up to the one end that first sloping block is close to the second swash plate, and track length is less than 1cm, and gyro wheel rotatory slip is in orbital inside, and second swash plate and first sloping block all are the triangle setting, and the inclined plane of second swash plate and first sloping block is the laminating of slope slip, and the second swash plate is in the inside slip laminating of second swing arm simultaneously.
Further, the baffle is inclined at 25-45 degrees, the baffle is positioned in the tin frame, holes are formed in two sides of the tin frame, the holes penetrate through tin wires movably, and the inclined surface of the baffle and the tin wires are vertically extruded in a sliding mode.
Further, the rollers are arranged in a transverse H shape, and the shape of the inner track of the first inclined block is matched with the rollers.
Further, pins are bent at the inner side of the electrode, and cushion blocks are inlaid at the two sides of one end, far away from the frame, of the electrode.
Further, the stitch is wavy setting, and stitch thickness is the half of electrode thickness, and the stitch is the folding end of electrode, and stitch material is the same with the electrode, and the cushion is insulating material, like rubber material.
The beneficial effects are that:
1. one end of the welding frame is manually attached to the welding point of the circuit board, the upper end of the circuit board is extruded to one end of the transverse plate, the transverse plate is extruded to one end of the sleeve, and as the inside of the sleeve is provided with the convex blocks, when the sleeve slides on the inner side of the welding frame, the convex blocks and one end of the convex strips are extruded in a sliding way, meanwhile, the thickness of the convex strips is 0.2-0.3cm, so that the convex strips can be inclined and deformed on one side of the bracket when being extruded by the convex blocks in the sleeve conveniently;
2. when the convex strips move obliquely, the convex strips drive one end of the bent pipe to slide towards the inside of the sliding rail, and the other end of the bent pipe synchronously slides towards one end far away from the sliding rail, and because the interval between the other end of the bent pipe and one end of the convex strips is less than 1cm, the other end of the bent pipe can be extruded to one end of the convex strips at the moment, the bent pipe can assist the convex strips to return, the convex strips can be reversely extruded to one end of the convex blocks in the sleeve, and the sleeve can drive the transverse plate to return and slide at one end of the circuit board, so that the transverse plate can reversely attach to the welding point of the circuit board, and the follow-up attaching and welding are facilitated;
3. when the transverse plate slides to one end of the welding frame, the first swing arms on two sides of the transverse plate synchronously slide to one end of the welding frame, the second inclined plate at one end of the first swing arm is positioned in the second swing arm, meanwhile, the first swing arm and the first swing arm are both inclined by 5-15 degrees, at the moment, the roller rolls in the track of the first inclined block, and the length of the track is smaller than 1cm, so that the roller is extruded to one end of the first inclined block after the roller rolls for a short time, the first swing arm is extruded to one end of the first inclined block through the roller, the second swing arm is convenient to slide in the welding frame, the second swing arm assists the baffle to slide in the tin frame, and the baffle is arranged at 25-45 degrees in an inclined way, so that one end of the baffle can be extruded to one end of a tin wire in the tin frame, one end of the tin wire extends to the surface of the circuit board, at the same time, the two sides of the tin wire are positioned on the welding frame, the frame and the circuit board are convenient to weld and fix, the condition that the tin wire needs to be manually added when the traditional electronic transistor is welded with the circuit board is avoided, the welding end of the frame is attached to the circuit board, and the subsequent welding is convenient to extend the tin wire;
4. after the frame and the circuit board are welded, the pins are bent manually, the electrode is bent at an angle through the pins, the electrode can be prevented from being broken in the bending process, meanwhile, the electrode is convenient to be connected with other electronic elements of the circuit board, and when the electrode is bent integrally, the cushion block is positioned at a joint gap between the electrode and the electronic elements, so that the protection effect is achieved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic view of the structure of the welding frame of the present invention.
Fig. 3 is a schematic view of a base structure of the present invention.
Fig. 4 is a schematic view of a partial structure of a stent according to the present invention.
FIG. 5 is a schematic view of the cross plate assembly of the present invention.
Fig. 6 is a schematic diagram of the first swing arm and the second swing arm according to the present invention.
Fig. 7 is a schematic view of the structure of the tin frame of the present invention.
Fig. 8 is a schematic view of the electrode bending structure of the present invention.
In fig. 1 to 8, the correspondence between the component names and the reference numerals is:
1-frame, 101-welding frame, 102-electrode, 2-transverse plate, 201-sleeve, 202-base, 203-bracket, 204-convex strip, 3-elbow, 301-slide rail, 4-first swing arm, 401-second swing arm, 4011-first oblique block, 402-baffle, 403-second oblique plate, 404-roller, 5-tin frame, 6-stitch, 601-cushion.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
Examples
As shown in fig. 1 to 8:
example 1: the semiconductor electronic transistor comprises a frame 1, wherein two ends of the frame 1 are respectively provided with a welding frame 101 and an electrode 102, the welding frame 101 penetrates through one end of the frame 1, the frame 1 is welded and installed with a circuit board, and the welding frame 101 is arranged at one end of the frame 1 close to the circuit board;
wherein: the welding frame 101, one end of the welding frame 101 far away from the frame 1 is provided with a groove, and the inner side of the welding frame 101 is provided with a sliding component which is convenient for welding the frame 1 and the circuit board;
the electrode 102, one end of the electrode 102 is connected with other electronic components of the circuit board in a nested way, and the frame 1 is connected with other electronic component power supply loops of the circuit board through the electrode 102;
the other electronic components of the circuit board can be any one of a triode, a diode or a capacitor;
example 2: referring to fig. 1-4 of the drawings, it can be seen that the difference between embodiment 2 and embodiment 1 is that the sliding assembly comprises a cross plate 2, a sleeve 201, a base 202, a bracket 203, a protruding strip 204, an elbow 3 and a sliding rail 301, wherein the base 202 is mounted in the middle of the welding frame 101, the sleeve 201 is slidably nested outside the base 202, the cross plate 2 is slidably arranged at one end of the sleeve 201 far away from the base 202, the bracket 203 is arranged at one end of the base 202 near the sleeve 201, the protruding strip 204 is inlaid inside the bracket 203, the sliding rail 301 is arranged inside the base 202, and the elbow 3 is slidably extended outside the sliding rail 301;
wherein: the transverse plate 2 is positioned at one end of the welding frame 101 far away from the frame 1, the transverse plate 2 is transversely arranged, when the transverse plate 2 is in a static state, the transverse plate 2 is positioned at the outer side of the welding frame 101, and when the transverse plate 2 slides, one end of the transverse plate 2 and the side surface of the welding frame 101 are in the same horizontal plane;
the sleeve 201 is vertically and slidably nested with the base 202, the inside of the base 202 is hollow, the bracket 203 and the raised strips 204 are positioned in the sleeve 201, the inside of the sleeve 201 is provided with the convex blocks, and when the sleeve 201 slides on the inner side of the welding frame 101, one ends of the convex blocks and the raised strips 204 are slidably extruded;
the base 202 and the support 203, the support 203 surrounds one end of the base 202, the support 203 is inclined by 35-50 degrees, the supports 203 are arranged in 4-6, and the convex strips 204 are matched with the supports 203;
the device comprises a convex strip 204 and a bent pipe 3, wherein one end of the bent pipe 3 is connected with the convex strip 204, the bent pipe 3 is arranged in a matched mode with the convex strip 204 in number, the thickness of the convex strip 204 is 0.2-0.3cm, the bent pipe 3 is arranged in a V shape overall, and the interval between the other end of the bent pipe 3 and one end of the convex strip 204 is less than 1 cm;
the thickness of the raised strips 204 is 0.2-0.3cm, so that when the raised strips 204 are extruded by the convex blocks in the sleeve 201, the raised strips 204 can be inclined and deformed on one side of the bracket 203;
when the convex strip 204 moves obliquely, the convex strip 204 drives one end of the bent pipe 3 to slide towards the inside of the sliding rail 301, and the other end of the bent pipe 3 synchronously slides towards one end far away from the sliding rail 301, and the other end of the bent pipe 3 is separated from one end of the convex strip 204 by less than 1cm, so that the other end of the bent pipe 3 can be extruded to one end of the convex strip 204;
the sliding rail 301 is arranged in a semicircular arc shape on the side surface of the sliding rail 301, the semicircular arc angle is 180 degrees, and the overlooking angle of the sliding rail 301 is arranged in a circular ring shape;
the side surfaces of the sliding rails 301 are arranged in a semicircular arc shape, so that the sliding angle of the bent pipe 3 can be limited, and the situation that the sliding directions of the two ends of the bent pipe 3 in the base 202 are the same is avoided;
wherein: manually attaching one end of the welding frame 101 to a welding point of a circuit board, extruding the upper end of the circuit board to one end of a transverse plate 2, extruding the transverse plate 2 to one end of a sleeve 201, wherein a convex block is arranged in the sleeve 201, so that when the sleeve 201 slides on the inner side of the welding frame 101, the convex block and one end of a convex strip 204 are extruded in a sliding manner, and meanwhile, the thickness of the convex strip 204 is 0.2-0.3cm, so that when the convex strip 204 is extruded by the convex block in the sleeve 201, the convex strip 204 can deform obliquely on one side of a bracket 203;
when the convex strips 204 move obliquely, the convex strips 204 drive one end of the bent pipe 3 to slide towards the inside of the sliding rail 301, and the other end of the bent pipe 3 synchronously slides towards one end far away from the sliding rail 301, because the interval between the other end of the bent pipe 3 and one end of the convex strips 204 is less than 1cm, the other end of the bent pipe 3 can be extruded to one end of the convex strips 204, the bent pipe 3 can assist the return of the convex strips 204, the convex strips 204 can be reversely extruded to one end of the convex blocks in the sleeve 201, the sleeve 201 can drive the transverse plate 2 to slide in a return manner at one end of the circuit board, so that the transverse plate 2 can reversely attach to the welding points of the circuit board, and the subsequent attaching and welding are convenient;
example 3: referring to fig. 2 and 5-7 of the drawings, embodiment 3 is different from embodiments 1 and 2 in that the sliding assembly further comprises a first swing arm 4, a second swing arm 401, a first inclined block 4011, a baffle 402, a second inclined plate 403, a roller 404 and a tin frame 5, wherein the first swing arm 4 is arranged at two sides of the transverse plate 2, the second swing arm 401 is slidably nested at one end of the first swing arm 4 far away from the transverse plate 2, the first inclined block 4011 is arranged inside one end of the second swing arm 401 near the first swing arm 4, the baffle 402 is arranged at one end of the second swing arm 401 far away from the first swing arm 4, the second inclined plate 403 is arranged at one end of the first swing arm 4 near the second swing arm 401, the roller 404 is rotated at one end of the second inclined plate 403 far away from the second swing arm 401, and the tin frame 5 is arranged at two sides of the interior of the welding frame 101;
wherein: the first swing arm 4 and the second swing arm 401 are inclined by 5-15 degrees, one end of the second swing arm 401 is positioned in the welding frame 101, a groove is formed in one end, close to the first swing arm 4, of the second swing arm 401, and the first inclined block 4011 is positioned in the groove;
the first inclined block 4011 and the second inclined plate 403, one end of the first inclined block 4011, which is close to the second inclined plate 403, is provided with a track, the length of the track is less than 1cm, the roller 404 rotationally slides in the track, the second inclined plate 403 and the first inclined block 4011 are all arranged in a triangle shape, the inclined surfaces of the second inclined plate 403 and the first inclined block 4011 are in inclined sliding fit, and meanwhile, the second inclined plate 403 is in sliding fit in the second swing arm 401;
the tin rack comprises a baffle plate 402 and a tin rack 5, wherein the baffle plate 402 is inclined at 25-45 degrees, the baffle plate 402 is positioned in the tin rack 5, holes are formed in two sides of the interior of the tin rack 5, the interior of each hole movably penetrates through a tin wire, and the inclined surface of the baffle plate 402 and the tin wire are vertically extruded in a sliding manner;
the roller 404, the roller 404 is arranged in a transverse shape, and the shape of the track inside the first inclined block 4011 is matched with the roller 404;
wherein: when the transverse plate 2 slides to one end of the welding frame 101, the first swing arms 4 on two sides of the transverse plate 2 synchronously slide to one end of the welding frame 101, and the second inclined plate 403 on one end of the first swing arm 4 is positioned in the second swing arm 401, meanwhile, the first swing arm 4 and the second swing arm 401 are both inclined by 5-15 degrees, at the moment, the roller 404 rolls in the track of the first inclined block 4011, and the length of the track is smaller than 1cm, so that the roller 404 presses one end of the first inclined block 4011 after the roller 404 rolls for a short time, the first swing arm 4 presses one end of the first inclined block 4011 through the roller 404, so that the second swing arm 401 can conveniently slide in the welding frame 101, the second swing arm 401 assists the baffle 402 to slide in the tin frame 5, and the baffle 402 is positioned in the tin frame 5 at an inclined angle of 25-45 degrees, one end of the baffle 402 can be pressed to one end of the tin wire in the tin frame 5, and one end of the tin wire extends to the surface of the circuit board, at the moment, the tin wire is positioned on two sides of the welding frame 101, the frame 1 is convenient to fix the frame 1 with the circuit board, the condition that the existing electronic transistor needs to be welded with the circuit board, and the condition that a plurality of manual tin wires need to be added when the circuit board is welded is needed, and the condition that the subsequent welding condition is avoided;
example 4: as can be seen from fig. 1 and 8 of the specification, embodiment 4 is different from embodiments 1, 2 and 3 in that the inner side of the electrode 102 is bent with the stitch 6, and two sides of one end of the electrode 102 far from the frame 1 are embedded with the pad 601;
wherein: stitch 6 and pad 601, stitch 6 is the wave setting, stitch 6 thickness is half of electrode 102 thickness, stitch 6 is electrode 102's folding end, stitch 6 material is the same with electrode 102, the pad 601 is insulating material, such as rubber material;
when the electrode 102 is integrally bent, the cushion block 601 is positioned at a connecting gap between the electrode 102 and other electronic components of the circuit board;
wherein: after the frame 1 and the circuit board are welded, the stitch 6 is bent manually, the electrode 102 is bent at an angle through the stitch 6, the electrode 102 can be prevented from being broken in the bending process, meanwhile, the electrode 102 is convenient to be connected with other electronic components of the circuit board, and when the electrode 102 is bent integrally, the cushion block 601 is positioned at a connecting gap of the electrode 102 and the electronic components, so that the protection effect is achieved.
Claims (8)
1. A semiconductor electronic transistor comprising a frame (1), characterized in that: the two ends of the frame (1) are respectively provided with a welding frame (101) and an electrode (102), the welding frame (101) penetrates through one end of the frame (1), the frame (1) is welded and installed with a circuit board, and the welding frame (101) is arranged at one end, close to the circuit board, of the frame (1);
a groove is formed in one end, far away from the frame (1), of the welding frame (101), and a sliding component which is convenient for welding the frame (1) and the circuit board is arranged on the inner side of the welding frame (101);
the sliding assembly comprises a transverse plate (2), a sleeve (201), a base (202), a support (203), a convex strip (204), an elbow (3) and a sliding rail (301), wherein the base (202) is arranged in the middle of the welding frame (101), the sleeve (201) is slidably nested on the outer side of the base (202), the transverse plate (2) is slidably arranged at one end, far away from the base (202), of the sleeve (201), the support (203) is arranged at one end, close to the sleeve (201), of the base (202), the convex strip (204) is inlaid on the inner side of the support (203), the sliding rail (301) is arranged in the base (202), and the elbow (3) is slidably arranged and extends to the outer side of the sliding rail (301);
the sliding assembly further comprises a first swing arm (4), a second swing arm (401), a first inclined block (4011), a baffle (402), a second inclined plate (403), rollers (404) and a tin frame (5), wherein the first swing arm (4) is arranged on two sides of the transverse plate (2), the second swing arm (401) is slidably nested at one end, far away from the transverse plate (2), of the first swing arm (4), the first inclined block (4011) is arranged inside, close to one end of the first swing arm (4), of the second swing arm (401), the baffle (402) is arranged at one end, far away from the first swing arm (4), of the second swing arm (401), the second inclined plate (403) is arranged at one end, close to the second swing arm (401), of the roller (404) is rotated at one end, far away from the second swing arm (401), of the tin frame (5) is arranged on two sides, inside the welding frame (101).
2. A semiconductor electronic transistor according to claim 1, characterized in that: and one end of the electrode (102) is connected with other electronic components of the circuit board in a nested way, and the frame (1) is connected with other electronic component power supply loops of the circuit board through the electrode (102).
3. A semiconductor electronic transistor according to claim 1, characterized in that: the transverse plate (2) is positioned at one end of the welding frame (101) far away from the frame (1), the transverse plate (2) is transversely arranged, when the transverse plate (2) is in a static state, the transverse plate (2) is positioned at the outer side of the welding frame (101), and when the transverse plate (2) slides, one end of the transverse plate (2) and the side surface of the welding frame (101) are in the same horizontal plane;
the welding device comprises a sleeve (201), wherein the sleeve (201) is vertically and slidably nested with a base (202), the inside of the base (202) is hollow, a support (203) and a convex strip (204) are arranged inside the sleeve (201), a protruding block is arranged inside the sleeve (201), and when the sleeve (201) slides inside a welding frame (101), one end of the protruding block and one end of the convex strip (204) are slidably extruded.
4. A semiconductor electronic transistor according to claim 1, characterized in that: the support (203) surrounds one end of the base (202), the support (203) is inclined by 35-50 degrees, the number of the supports (203) is 4-6, and the convex strips (204) are matched with the supports (203);
the pipe bending device comprises raised strips (204) and bent pipes (3), wherein one ends of the bent pipes (3) are connected with the raised strips (204), the bent pipes (3) are arranged in a matched mode with the number of the raised strips (204), the thickness of the raised strips (204) is 0.2-0.3cm, the bent pipes (3) are integrally arranged in a V shape, and the intervals between the other ends of the bent pipes (3) and one ends of the raised strips (204) are less than 1 cm.
5. A semiconductor electronic transistor according to claim 1, characterized in that: the side surface of the sliding rail (301) is arranged in a semicircular shape, the semicircular angle is 180 degrees, and the overlooking angle of the sliding rail (301) is arranged in a circular ring shape.
6. A semiconductor electronic transistor according to claim 1, characterized in that: the first swing arm (4) and the second swing arm (401) are both inclined by 5-15 degrees, one end of the second swing arm (401) is positioned in the welding frame (101), a groove is formed in one end, close to the first swing arm (4), of the second swing arm (401), and the first inclined block (4011) is positioned in the groove;
the first inclined block (4011) and the second inclined block (403), one end of the first inclined block (4011) close to the second inclined block (403) is provided with a track, the length of the track is smaller than 1cm, the roller (404) rotationally slides in the track, the second inclined block (403) and the first inclined block (4011) are arranged in a triangular shape, inclined surfaces of the second inclined block (403) and the first inclined block (4011) are in inclined sliding fit, and meanwhile the second inclined block (403) is in sliding fit in the second swing arm (401);
the device comprises a baffle plate (402) and a tin frame (5), wherein the baffle plate (402) is inclined at 25-45 degrees, the baffle plate (402) is positioned in the tin frame (5), holes are formed in two sides of the interior of the tin frame (5), the interior of the holes movably penetrate through tin wires, and the inclined surface of the baffle plate (402) and the tin wires are vertically and slidably extruded;
the roller (404), the roller (404) is arranged in a transverse H shape, and the shape of the internal track of the first inclined block (4011) is matched with the roller (404).
7. A semiconductor electronic transistor according to claim 1, characterized in that: the inner side of the electrode (102) is bent with pins (6), and two sides of one end, far away from the frame (1), of the electrode (102) are inlaid with cushion blocks (601).
8. The semiconductor electronic transistor according to claim 7, wherein: the stitch (6) is arranged in a wavy manner, the thickness of the stitch (6) is one half of that of the electrode (102), the stitch (6) is a folding end of the electrode (102), and the stitch (6) is the same as the electrode (102).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211042834.XA CN115312467B (en) | 2022-08-29 | 2022-08-29 | Semiconductor electronic transistor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211042834.XA CN115312467B (en) | 2022-08-29 | 2022-08-29 | Semiconductor electronic transistor |
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| CN115312467A CN115312467A (en) | 2022-11-08 |
| CN115312467B true CN115312467B (en) | 2023-06-13 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125898A (en) * | 1996-09-02 | 1998-05-15 | Fuji Electric Co Ltd | Non-contact semiconductor contactor |
| CN106211628A (en) * | 2016-08-31 | 2016-12-07 | 安徽赛福电子有限公司 | Electronic component fast welding T-Ring |
| CN212485317U (en) * | 2020-06-16 | 2021-02-05 | 无锡芯硅科技有限公司 | Stably-connected stacked transistor |
| WO2022032789A1 (en) * | 2020-08-11 | 2022-02-17 | 苏州海凌达电子科技有限公司 | Electronic component welding apparatus for circuit board production |
| CN217183576U (en) * | 2022-02-14 | 2022-08-12 | 马鞍山市世辰半导体科技有限公司 | Tin feeding device convenient for circuit board welding |
-
2022
- 2022-08-29 CN CN202211042834.XA patent/CN115312467B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125898A (en) * | 1996-09-02 | 1998-05-15 | Fuji Electric Co Ltd | Non-contact semiconductor contactor |
| CN106211628A (en) * | 2016-08-31 | 2016-12-07 | 安徽赛福电子有限公司 | Electronic component fast welding T-Ring |
| CN212485317U (en) * | 2020-06-16 | 2021-02-05 | 无锡芯硅科技有限公司 | Stably-connected stacked transistor |
| WO2022032789A1 (en) * | 2020-08-11 | 2022-02-17 | 苏州海凌达电子科技有限公司 | Electronic component welding apparatus for circuit board production |
| CN217183576U (en) * | 2022-02-14 | 2022-08-12 | 马鞍山市世辰半导体科技有限公司 | Tin feeding device convenient for circuit board welding |
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|---|---|
| CN115312467A (en) | 2022-11-08 |
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