CN115295473B - Continuous film covering device for chip manufacturing - Google Patents
Continuous film covering device for chip manufacturing Download PDFInfo
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- CN115295473B CN115295473B CN202211212114.3A CN202211212114A CN115295473B CN 115295473 B CN115295473 B CN 115295473B CN 202211212114 A CN202211212114 A CN 202211212114A CN 115295473 B CN115295473 B CN 115295473B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention discloses a continuous film laminating device for chip manufacturing, which comprises two main body blocks, wherein the two main body blocks are in penetrating and rotating connection with two rotating columns through bearings, the two rotating columns are in interference fit with gears, the two gears are mutually meshed, the side wall of one main body block is fixedly connected with an air pump, two feeding devices are arranged in front of the two main body blocks, and a film laminating mechanism is arranged between the two main body blocks; the tectorial membrane mechanism includes two fixed pipes, fixed pipe with correspond the rotation post passes through the bearing and runs through the rotation to be connected, the common fixedly connected with three-way pipe of one end that fixed pipe is located outside two main part pieces, the three-way pipe passes through the connecting pipe intercommunication with the input of air pump. Has the advantages that: the invention can carry out the conveying, positioning and film covering of the continuous film and the chip, greatly improves the processing efficiency, improves the film covering effect and has lower manufacturing, maintenance and repair costs of equipment.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a continuous film laminating device for chip manufacturing.
Background
Electronic products are one of the common products in our lives, the main controller in the electronic products is an integrated circuit, and the classification methods of the integrated circuit are many and can be classified into the following according to the circuit analog or digital: the integrated circuits include photolithography, etching, thin film (chemical vapor deposition or physical vapor deposition), doping (thermal diffusion or ion implantation), and chemical mechanical planarization CMP, and after the chips are produced, the back surfaces of the integrated circuits are usually covered with films to protect the main structures of the chips.
Among the prior art, current tectorial membrane device carries the chip generally, fixes a position, and the rethread manipulator carries out the cover of membrane, and the device is moulded to reentrant heat carries out the tectorial membrane, and wherein the positioning process need use infrared positioner, and the cost is higher, and later maintenance cost of maintenance is also higher, simultaneously, does not at the tectorial membrane in-process, and the dust between membrane and chip also can influence the tectorial membrane effect.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a continuous film coating device for manufacturing a chip.
In order to achieve the purpose, the invention adopts the following technical scheme:
a continuous film covering device for chip manufacturing comprises two main body blocks, wherein the two main body blocks are connected with two rotating columns in a penetrating and rotating mode through bearings, the two rotating columns are respectively in interference fit with gears, the two gears are meshed with each other, an air pump is fixedly connected to the side wall of one main body block, two feeding devices are arranged in front of the two main body blocks, and a film covering mechanism is arranged between the two main body blocks;
the laminating mechanism comprises two fixing pipes, the fixing pipes are connected with the corresponding rotating columns in a penetrating and rotating mode through bearings, one ends of the fixing pipes, which are located outside the two main body blocks, are fixedly connected with a three-way pipe together, the three-way pipe is communicated with the input end of the air pump through a connecting pipe, the air pump is provided with two output ends, and is respectively and fixedly connected with a main exhaust pipe and an auxiliary exhaust pipe, a driving cavity, a cavity and a function cavity are formed in one main body block, one rotating column penetrates through the driving cavity, one end, which is far away from the air pump, of the main exhaust pipe penetrates through and extends into the driving cavity, the rotating columns are located at one section of side wall, which is located in the driving cavity, of each fan blade, a main conductive block is fixedly connected with the side wall, an auxiliary conductive block is fixedly embedded in the side wall of the driving cavity, one main body block penetrates through a fixedly connected with a discharge pipe, the discharge pipe communicates the driving cavity with the outside, and first electromagnetic valves are arranged in the discharge pipe and the main exhaust pipe.
Further, a section of the rotating column between the two main body blocks penetrates through the four suction pipes fixedly connected with, the fixing pipe is located on one section of the side wall inside the main body blocks and provided with a through hole, and the cross section of the through hole is arc-shaped.
Further, the film laminating mechanism further comprises a pump plate and a sliding plate, the pump plate is connected with the inner side wall of the cavity in a sealing and sliding manner, the sliding plate is connected with the inner side wall of the function cavity in a sealing and sliding manner, the function cavity is communicated with the outside through the cavity, the inner bottom wall of the cavity is fixedly connected with an electric push rod, the output end of the electric push rod is fixedly connected with the lower surface of the pump plate, the inner end wall of the function cavity is fixedly connected with a delay switch, a spring is fixedly connected between the sliding plate and the inner end wall of the function cavity, a main body block penetrates through a fixedly connected balance pipe, the function cavity is communicated with the outside through the balance pipe, a second electromagnetic valve is arranged in the balance pipe and an auxiliary exhaust pipe, and the delay switch, the first electromagnetic valve and the second electromagnetic valve are electrically connected through wires.
Further, two the main part piece runs through the rotation through the bearing and is connected with four conveying rollers, the conveying roller with correspond the cooperation has the hold-in range between the rotation post, two be provided with the device of moulding plastics between the main part piece.
Further, the three-way pipe fixed connection has a function pipe, the function pipe with one of them main part piece runs through fixed connection and extends to two between the main part piece, the concave piece of one end run through fixed connection that the function pipe is located between two main part pieces.
Furthermore, the suction pipe is kept away from the one end fixedly connected with sucking disc that rotates the post, the intercommunication department in cavity and function chamber, cavity and external intercommunication department all are provided with the check valve.
The invention has the following advantages:
1. the chip and the film are adsorbed by the suction pipe and the sucking disc through air suction of the air pump, and the adsorbed film and the chip are driven to rotate by the rotating column, so that the film and the chip are attached, automatic positioning is realized, an infrared positioning device is not required to be used for positioning and attaching as in the prior art, the equipment cost is greatly reduced, and the maintenance and repair cost of later equipment is reduced;
2. after the rotating column rotates to continuously attach the chip and the film, the chip and the film are sent to a conveying roller, and then the attached chip and the film are sent to a thermoplastic device through the conveying roller for film covering processing, so that the process is continuous and uninterrupted, and the processing efficiency is greatly improved;
3. the air pump can suck air through the functional pipe and the concave block in the process of adsorbing and conveying the chip and the film by the air suction pump, the air suction speed is higher through the arrangement of the concave block, air between the chip and the film is extracted in the process of laminating the chip and the film, so that dust between the chip and the film is extracted together, the phenomenon that the dust between the chip and the film influences the film laminating effect in the film laminating process is effectively avoided, meanwhile, the film and the chip are more tightly laminated through the extraction of the air, and the film laminating effect is further improved;
4. the invention can complete the conveying, jointing and positioning of the chip and the film only by using the air pump to carry out a power source, so that the efficiency of the device is higher.
Drawings
FIG. 1 is a schematic structural diagram of a continuous film coating apparatus for manufacturing chips according to the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
FIG. 3 is a side view of a continuous film coating apparatus for manufacturing chips according to the present invention;
FIG. 4 is a top view of a continuous film coating apparatus for manufacturing chips according to the present invention;
FIG. 5 is a cross-sectional view taken along line B-B of FIG. 4;
FIG. 6 is an enlarged view at C in FIG. 5;
fig. 7 is a side view from another perspective of a continuous film coating apparatus for manufacturing chips according to the present invention.
In the figure: the device comprises a main body block 1, a rotating column 2, a fixed pipe 3, a suction pipe 4, a sucking disc 5, a through hole 6, a gear 7, a three-way pipe 8, an air pump 9, a secondary exhaust pipe 901, a connecting pipe 10, a primary exhaust pipe 11, a driving cavity 12, fan blades 13, a discharge pipe 14, a first electromagnetic valve 15, a main conductive block 16, a secondary conductive block 17, a cavity 18, an electric push rod 19, a pump plate 20, a functional cavity 21, a sliding plate 22, a spring 23, a time delay switch 24, a balance pipe 25, a second electromagnetic valve 26, a functional pipe 27, a concave block 28, a conveying roller 29, a thermoplastic device 30, a synchronous belt 31 and a feeding device 32.
Detailed Description
Referring to fig. 1-7, a continuous film covering device for manufacturing a chip comprises two main body blocks 1, wherein the two main body blocks 1 are in penetrating rotation connection with two rotating columns 2 through bearings, the two rotating columns 2 are both in interference fit with gears 7, the two gears 7 are mutually meshed, the side wall of one main body block 1 is fixedly connected with an air pump 9, two feeding devices 32 are arranged in front of the two main body blocks 1, the feeding devices 32 can convey the chip and a film to a sucker 5, and a film covering mechanism is arranged between the two main body blocks 1 in the prior art;
the film covering mechanism comprises two fixed tubes 3, the fixed tubes 3 are in through rotating connection with corresponding rotating columns 2 through bearings, one ends of the fixed tubes 3, which are positioned outside two main body blocks 1, are fixedly connected with a three-way pipe 8 together, the three-way pipe 8 is provided with four openings, the three-way pipe 8 is communicated with an input end of an air pump 9 through a connecting pipe 10, the air pump 9 is provided with two output ends and is respectively and fixedly connected with a main exhaust pipe 11 and an auxiliary exhaust pipe 901, one main body block 1 is internally provided with a driving cavity 12, a cavity 18 and a functional cavity 21, one rotating column 2 penetrates through the driving cavity 12, one end of the main exhaust pipe 11, which is far away from the air pump 9, penetrates and extends into the driving cavity 12, one section of the side wall of the rotating column 2, which is positioned in the driving cavity 12, is fixedly connected with a plurality of fan blades 13, the fan blades 13 can rotate under the impact of air flow, and are provided with eight fan blades, even when a main conductive block 16 on the fan blades 13 is in contact with an auxiliary conductive block 17 for four times, the rotating column 2 just rotates 90 degrees, the side wall of the fan blade 13 far away from the rotating column 2 is fixedly connected with a main conductive block 16, an auxiliary conductive block 17 is fixedly embedded in the inner side wall of the driving cavity 12, the main conductive block 16 is in contact with the auxiliary conductive block 17, so that the electric push rod 19 is powered on, when the electric push rod and the auxiliary conductive block are separated, the electric push rod 19 is powered off, one main body block 1 penetrates through a fixedly connected discharge pipe 14, the discharge pipe 14 is used for communicating the driving cavity 12 with the outside, a first electromagnetic valve 15 is arranged in the discharge pipe 14 and a main exhaust pipe 11, air is sucked through an air pump 9, when the suction pipe 4 is communicated with the through hole 6, suction force is generated in the suction pipe 4, a chip is adsorbed with a film, the sucked air is pumped into the driving cavity 12, the fan blade 13 is impacted through air, the rotating column 2 rotates, and the two rotating columns 2 rotate in opposite directions through the meshing of two gears 7, after adsorbing chip and membrane, continue to rotate the transport to through two antiport that rotate post 2, make adsorbed membrane and chip rotate in step, and when rotating to two between the rotation post 2, laminate in step, thereby realize automatic positioning, need not to use infrared positioner to fix a position the laminating like prior art generally, greatly reduced equipment cost, reduced later stage equipment's maintenance and cost of maintenance simultaneously.
Rotate one section of post 2 and be located four suction pipes 4 of fixedly connected with that run through between two main part pieces 1, fixed pipe 3 is located 1 inside one section lateral wall of main part piece and has seted up through-hole 6, and the cross-section of through-hole 6 is the arc, like figure 1, the setting of through-hole 6 for sucking disc 5 just can produce suction after with chip and membrane contact, thereby avoid adsorbing the in-process of chip and membrane, still produce suction in the suction pipe 4, lead to the reduction of whole suction.
The laminating mechanism further comprises a pump plate 20 and a sliding plate 22, the pump plate 20 is connected with the inner side wall of the cavity 18 in a sealing sliding mode, the sliding plate 22 is connected with the inner side wall of the function cavity 21 in a sealing sliding mode, the function cavity 21 is communicated with the outside through the cavity 18, an electric push rod 19 is fixedly connected with the inner bottom wall of the cavity 18, the output end of the electric push rod 19 is fixedly connected with the lower surface of the pump plate 20, the electric push rod 19 can automatically reset after being powered off, in the prior art, the electric push rod 19 is powered on and powered off again, the pump plate 20 can be driven to reciprocate up and down once, air is pumped into the cavity 18 from the outside and then pumped into the function cavity 21, the pump plate 20 reciprocates up and down four times, the sliding plate 22 can be in contact with a delay switch 24 due to the pump air quantity, the delay switch 24 is fixedly connected with the inner end wall of the function cavity 21, after the delay switch 24 is triggered, the first electromagnetic valve 15 and the second electromagnetic valve 26 can be powered on for a period of time, then the power is cut off, a spring 23 is fixedly connected between the sliding plate 22 and the inner end wall of the functional cavity 21, the main body block 1 is fixedly connected with a balance pipe 25 in a penetrating way, the balance pipe 25 communicates the functional cavity 21 with the outside, the balance pipe 25 and the auxiliary exhaust pipe 901 are both internally provided with a second electromagnetic valve 26, the second electromagnetic valve 26 is a normally closed electromagnetic valve and is electrified to be opened, a delay switch 24, a first electromagnetic valve 15 and the second electromagnetic valve 26 are electrically connected through a lead, the fan blades 13 are impacted through air flow, the fan blades 13 rotate, and in the rotating process of the fan blades 13, the main conductive block 16 on each fan blade 13 is contacted with the auxiliary conductive block 17 once, so that the electric push rod 19 is electrified once, namely the pump plate 20 reciprocates up and down once, and after four times of contact, namely the rotating column 2 rotates 90 degrees, the sliding plate 22 and the delay switch 24 are triggered, so that the first electromagnetic valve 15 is electrified to be closed, at the moment, the rotating column 2 is locked to be incapable of rotating, the chip sent out by the feeding device 32 can be adsorbed to the film by the sucker 5, the second electromagnetic valve 26 is electrified to be opened to ensure the generation of suction force, meanwhile, under the elastic force of the spring 23, the sliding plate 22 resets, after a short time, the first electromagnetic valve 15 is electrified again to be opened, the second electromagnetic valve 26 is electrified again to be closed, the rotating column 2 continues to rotate at the moment, the adsorbed chip is attached to the film, the continuity of film coating is realized, the process is continuous and uninterrupted, and the processing efficiency is greatly improved.
Two main part pieces 1 are connected with four conveying rollers 29 through bearing through-rotation, as shown in fig. 1 and fig. 4, thin in the middle of the conveying roller 29, thick at both ends, thin in the middle of the middle guarantees that the suction tube 4 and the sucking disc 5 can pass through smoothly from the middle, and thick at both ends can guarantee to contact with the chip, send the chip into thermoplastic device 30, conveying roller 29 and the cooperation between the rotation post 2 that corresponds have hold-in range 31, as shown in fig. 4, conveying roller 29 top one end is provided with the tooth, it is provided with the tooth to rotate post 2 top one end, it cooperates with hold-in range 31 through the tooth, as shown in fig. 7 again, the rotation post 2 that is located the top cooperates with two conveying rollers 29 that are located the top jointly and has a hold-in range 31, the rotation post 2 that is located the below cooperates with two conveying rollers 29 that are located the below jointly and has a hold-in range 31, be provided with thermoplastic device 30 between two main part pieces 1.
The three-way pipe 8 is fixedly connected with a function pipe 27, the function pipe 27 is fixedly connected with one of the main body blocks 1 in a penetrating mode and extends to a position between the two main body blocks 1, one end, located between the two main body blocks 1, of the function pipe 27 is fixedly connected with a concave block 28 in a penetrating mode, the cross section of the concave block 28 is in a concave shape with an opening facing one side, the cross section of the groove is small, the air pump 9 can suck air through the function pipe 27 while sucking the air in the concave block 28, the cross section of the groove of the concave block 28 is small, air flow speed is high, air between the chip and the film is sucked through the air with high flow speed when the chip is in contact with the film, dust between the chip and the film is sucked together, influences of the dust on the film are avoided, meanwhile, the position where the flow speed of fluid is large is low, the pressure between the chip and the film is smaller than the pressure outside due to the fact that the air between the chip and the film flows fast, and the chip and the film are tightly attached to avoid bubbles in the film laminating process through pressure difference, and the film laminating effect is further improved.
One end fixedly connected with sucking disc 5 that rotation post 2 was kept away from to suction pipe 4, the intercommunication department of cavity 18 and function chamber 21, cavity 18 all is provided with the check valve with external intercommunication department, the check valve of the intercommunication department of cavity 18 and function chamber 21 only allows the air to get into in the function chamber 21 from cavity 18, the check valve of the intercommunication department of cavity 18 and external only allows the air to get into in cavity 18 from the external world, and cavity 18 has two departments with external intercommunication department, the intercommunication department that is located the top is provided with the check valve, and the intercommunication department of below does not set up the check valve, guarantee that pump plate 20 can freely move from top to bottom, suction pipe 5 set up the area of contact between 4 and chip and the membrane has been increased to make suction pipe 4 can be better adsorb chip and membrane, avoid breaking away from and position movement.
In the film laminating process, the air pump 9 is opened, the air pump sucks air through the connecting pipe 10, so that the fixed pipe 3 generates suction, meanwhile, the sucked air is discharged into the driving cavity 12 through the main exhaust pipe 11, the air discharged into the driving cavity 12 impacts the fan blades 13, so that the fan blades drive the rotating column 2 to rotate under the impact force, the rotating column 2 drives the four suction pipes 4 to rotate while rotating, and then the air is discharged through the discharge pipe 14.
When the fan blades 13 rotate, the eight main conductive blocks 16 are respectively contacted with the auxiliary conductive blocks 17, when the eight main conductive blocks are contacted with the auxiliary conductive blocks 17, the electric push rod 19 is powered on, air in the cavity 18 is pumped into the functional cavity 21, when the main conductive blocks 16 are separated from the auxiliary conductive blocks 17, the electric push rod 19 is powered off and reset, so that outside air is pumped into the cavity 18, the electric push rod 19 is powered on and powered off continuously along with the rotation of the fan blades 13, the pump plate 20 reciprocates continuously, air is pumped into the functional cavity 21, the sliding plate 22 slides towards the delay switch 24 continuously along with the pumping of the air, after four times of contact, namely the rotating column 2 rotates by 90 degrees, the sliding plate 22 and the delay switch 24 are triggered, so that the first electromagnetic valve 15 is powered on and closed, the rotating column 2 is locked and cannot rotate, the second electromagnetic valve 26 is powered on and opened, the generation of suction force is ensured, and the sliding plate 22 resets under the elasticity of the spring 23.
At the moment, the sucker 5 rotates to be in contact with the chip and the film sent out by the feeding device 32, meanwhile, the suction pipe 4 is communicated with the through hole 6, suction force is generated in the suction pipe 4, the chip and the film sent out by the feeding device 32 can be adsorbed, after short-time electrification, the first electromagnetic valve 15 is electrified again and opened, the second electromagnetic valve 26 is electrified again and closed, the rotating column 2 continues to rotate at the moment, air pumping continues to be carried out in the functional cavity 21 at the same time, the rotating column 2 stops after rotating for 90 degrees again, and the film and the chip are sent between the two rotating columns 2 and are attached together.
In the process of conveying the film to be attached to the chip by the rotating column 2, the air pump 9 can suck air through the functional pipe 27 while sucking air in the concave block 28, the sectional area of the groove of the concave block 28 is small, so that the air flow rate is high, the air between the chip and the film is extracted when the chip is in contact with the film through the air with high flow rate, so that dust between the chip and the film is sucked together, the influence of the dust on the film is avoided, meanwhile, the fluid flow rate is large and the pressure is low, the pressure between the chip and the film is lower than that of the outer side due to the rapid air flow between the chip and the film, and the chip is tightly attached to the film through the pressure difference, so that bubbles are prevented from being generated in the film covering process.
After the film and the chip are attached, the film and the chip are in contact with the conveying roller 29 after being dedusted and tightly attached, the attached film and the chip can be conveyed into the thermoplastic device 30 by the conveying roller 29 at the moment, the film is coated on the surface of the chip, and then the film is conveyed out under the conveying of the next group of conveying roller 29 and collected.
After a group of films and chips are subjected to thermoplastic film coating and are sent out, the rotating column 2 continues to rotate at the moment, the next group of films and chips to be subjected to thermoplastic film coating are sent into the thermoplastic device 30, and the steps are repeated in this way to carry out continuous film coating processing operation.
Claims (5)
1. The continuous film laminating device for chip manufacturing comprises two main body blocks (1), and is characterized in that the two main body blocks (1) are connected with two rotating columns (2) in a penetrating and rotating mode through bearings, the two rotating columns (2) are respectively provided with a gear (7) in an interference fit mode, the two gears (7) are meshed with each other, an air pump (9) is fixedly connected to the side wall of one main body block (1), two feeding devices (32) are arranged in front of the two main body blocks (1), and a film laminating mechanism is arranged between the two main body blocks (1);
the film coating mechanism comprises two fixed tubes (3), the fixed tubes (3) are in penetrating and rotating connection with the corresponding rotating columns (2) through bearings, one ends of the fixed tubes (3) which are positioned outside the two main body blocks (1) are fixedly connected with a three-way pipe (8) together, the three-way pipe (8) is communicated with the input end of an air pump (9) through a connecting pipe (10), the air pump (9) is provided with two output ends and is fixedly connected with a main exhaust pipe (11) and an auxiliary exhaust pipe (901) respectively, one of the main body blocks (1) is internally provided with a driving cavity (12), a cavity (18) and a functional cavity (21), one of the rotating columns (2) penetrates through the driving cavity (12), one end of the main exhaust pipe (11) far away from the air pump (9) penetrates through and extends into the driving cavity (12), one section of the side wall of the rotating column (2) which is positioned in the driving cavity (12) is fixedly connected with a plurality of fan blades (13), the side wall of the fan blades (13) far away from one side of the rotating column (2) is fixedly connected with a main conductive block (16), the driving cavity (12) is fixedly connected with an auxiliary conductive block (17), one of the inner side wall of the fixed tube (17) penetrates through the main exhaust pipe (14) and is communicated with an external discharge pipe (14), all be provided with first solenoid valve (15) in discharge pipe (14) and main exhaust pipe (11), rotate one section that post (2) is located between two main part pieces (1) and run through four suction pipes of fixedly connected with (4), through-hole (6) have been seted up to fixed pipe (3) the inside one section lateral wall that is located main part piece (1), the cross-section of through-hole (6) is the arc to when communicateing through suction pipe (4) and through-hole (6), produce suction in suction pipe (4), adsorb chip and membrane.
2. The continuous film laminating device for chip manufacturing according to claim 1, wherein the film laminating mechanism further comprises a pump plate (20) and a sliding plate (22), the pump plate (20) is connected with the inner side wall of the cavity (18) in a sealing and sliding manner, the sliding plate (22) is connected with the inner side wall of the function cavity (21) in a sealing and sliding manner, the cavity (18) communicates the function cavity (21) with the outside, the inner end wall of the cavity (18) is fixedly connected with an electric push rod (19), the output end of the electric push rod (19) is fixedly connected with the lower surface of the pump plate (20), the inner end wall of the function cavity (21) is fixedly connected with a time delay switch (24), a spring (23) is fixedly connected between the sliding plate (22) and the inner end wall of the function cavity (21), the main body block (1) is fixedly connected with a balance tube (25) in a penetrating manner, the balance tube (25) communicates the function cavity (21) with the outside, the balance tube (25) and a secondary exhaust pipe (901) are respectively provided with a second electromagnetic valve (26), and the time delay switch (24), and the first electromagnetic valve (15) are electrically connected through a wire.
3. The continuous film covering device for chip manufacturing according to claim 1, wherein four conveying rollers (29) are rotatably connected to the two main body blocks (1) through bearings, a synchronous belt (31) is fitted between each conveying roller (29) and the corresponding rotating column (2), and a thermoplastic device (30) is arranged between the two main body blocks (1).
4. The continuous film covering device for chip manufacturing according to claim 1, wherein a function pipe (27) is fixedly connected to the three-way pipe (8), the function pipe (27) is fixedly connected with one of the main body blocks (1) in a penetrating manner and extends to a position between the two main body blocks (1), and a concave block (28) is fixedly connected to one end, located between the two main body blocks (1), of the function pipe (27) in a penetrating manner.
5. The continuous film covering device for chip manufacturing according to claim 2, wherein a suction cup (5) is fixedly connected to one end of the suction tube (4) far away from the rotating column (2), and a communication position of the cavity (18) and the functional cavity (21) and a communication position of the cavity (18) and the outside are provided with one-way valves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211212114.3A CN115295473B (en) | 2022-09-30 | 2022-09-30 | Continuous film covering device for chip manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211212114.3A CN115295473B (en) | 2022-09-30 | 2022-09-30 | Continuous film covering device for chip manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115295473A CN115295473A (en) | 2022-11-04 |
| CN115295473B true CN115295473B (en) | 2022-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202211212114.3A Active CN115295473B (en) | 2022-09-30 | 2022-09-30 | Continuous film covering device for chip manufacturing |
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| CN112046835A (en) * | 2020-09-23 | 2020-12-08 | 刘亚刚 | Anti-damage wafer film pasting device for integrated circuit chip production |
| CN213649994U (en) * | 2020-11-24 | 2021-07-09 | 苏州展迪力电子材料有限公司 | COMES component pad pasting equipment |
| CN214848512U (en) * | 2021-06-02 | 2021-11-23 | 河南通用智能装备有限公司 | Wafer film sticking machine with wafer placing direction detection device |
| CN114801147A (en) * | 2022-03-31 | 2022-07-29 | 李青林 | Glass pad pasting processingequipment |
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