CN115287460A - Method for preparing high-hardness and high-toughness copper-based brazing filler metal by utilizing electronic waste - Google Patents

Method for preparing high-hardness and high-toughness copper-based brazing filler metal by utilizing electronic waste Download PDF

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Publication number
CN115287460A
CN115287460A CN202211067813.3A CN202211067813A CN115287460A CN 115287460 A CN115287460 A CN 115287460A CN 202211067813 A CN202211067813 A CN 202211067813A CN 115287460 A CN115287460 A CN 115287460A
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metal
electronic waste
waste
hardness
brazing filler
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Inventor
鲍丽
龙伟民
杨骄
吕国志
秦建
赵爱春
丁天然
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Zhengzhou Research Institute of Mechanical Engineering Co Ltd
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Zhengzhou Research Institute of Mechanical Engineering Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/001—Dry processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B1/00—Preliminary treatment of ores or scrap
    • C22B1/005—Preliminary treatment of scrap
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/02—Obtaining noble metals by dry processes
    • C22B11/021—Recovery of noble metals from waste materials
    • C22B11/025—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0002—Preliminary treatment
    • C22B15/0004—Preliminary treatment without modification of the copper constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0026—Pyrometallurgy
    • C22B15/0028—Smelting or converting
    • C22B15/0052—Reduction smelting or converting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0026—Pyrometallurgy
    • C22B15/0056—Scrap treating
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0026—Pyrometallurgy
    • C22B15/006—Pyrometallurgy working up of molten copper, e.g. refining
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B19/00—Obtaining zinc or zinc oxide
    • C22B19/30—Obtaining zinc or zinc oxide from metallic residues or scraps
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B23/00—Obtaining nickel or cobalt
    • C22B23/02—Obtaining nickel or cobalt by dry processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/02—Obtaining tin by dry processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/06—Obtaining tin from scrap, especially tin scrap
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B30/00—Obtaining antimony, arsenic or bismuth
    • C22B30/02—Obtaining antimony
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B30/00—Obtaining antimony, arsenic or bismuth
    • C22B30/06—Obtaining bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B34/00—Obtaining refractory metals
    • C22B34/30—Obtaining chromium, molybdenum or tungsten
    • C22B34/32—Obtaining chromium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B34/00—Obtaining refractory metals
    • C22B34/30—Obtaining chromium, molybdenum or tungsten
    • C22B34/34—Obtaining molybdenum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B47/00—Obtaining manganese
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B58/00—Obtaining gallium or indium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/05—Refining by treating with gases, e.g. gas flushing also refining by means of a material generating gas in situ
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C22C1/03—Making non-ferrous alloys by melting using master alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Environmental & Geological Engineering (AREA)
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Abstract

The invention relates to the technical field of solder preparation, in particular to a method for preparing a high-hardness and high-toughness copper-based solder by utilizing electronic wastes. According to the scheme, metal in the waste circuit board is screened out and used as a raw material for preparation, and elemental metal smelting is adopted in the existing brazing filler metal preparation process; and 0.5-9% of P element is added in the alloying smelting process, so that the performance of the brazing filler metal prepared by the electronic waste can reach the performance of pure metal preparation. The method has the advantages that the method avoids the smelting process of gradually refining elemental metal to recover electronic waste, realizes short-process recovery treatment, achieves the effect of changing waste into valuable, greatly shortens the process flow, saves energy, reduces emission, avoids the generation of pollutants such as electrolyte, acidic leachate and the like, and realizes efficient comprehensive utilization of resources while recycling most of metal elements in the electronic waste.

Description

Method for preparing high-hardness and high-toughness copper-based brazing filler metal by utilizing electronic waste
Technical Field
The invention relates to the technical field of solder preparation, in particular to a method for preparing a high-hardness and high-toughness copper-based solder by utilizing electronic wastes.
Background
Electronic waste, commonly known as electronic garbage, includes various rejected electronic instruments and equipment. With the rapid development of social science and technology, the electronic devices are updated at a very fast speed, which results in the generation of a large amount of electronic waste. However, the metal portion of the electronic waste accounts for up to forty percent, and includes more than 20 metals, such as copper, tin, iron, nickel, aluminum, zinc, gold, silver, platinum, palladium, manganese, molybdenum, bismuth, antimony, chromium, cadmium, gallium, and the like, so from another perspective, the electronic waste is also called "urban mine", in which a large amount of mineral resources are contained.
The brazing filler metal is used as a filling alloy of a brazing process, is an alloy formed by smelting a plurality of metal elements, and has various components along with the change of a brazing base metal. However, the existing brazing filler metal is prepared by adopting pure metal as a raw material, and if the metal in the electronic waste can be recycled as brazing filler metal alloy and the performance of the brazing filler metal prepared by the brazing filler metal alloy can reach the performance of pure metal preparation, the recycling of the electronic waste is realized, and the efficient comprehensive utilization of resources is also realized.
Disclosure of Invention
The invention has the technical problem that the high-content Fe element in the waste circuit board is easy to form intermetallic compounds to deteriorate the soldering performance in the process of soldering stainless steel by using the copper-based solder.
The basic scheme provided by the invention is as follows: a method for preparing high-hardness and high-toughness copper-based solder by using electronic wastes comprises the following steps:
s1: separating the electronic waste according to metal and nonmetal, putting the separated metal into an induction heating furnace and heating to 950-1150 ℃;
s2: after the metal is smelted to a molten state, smelting the P element and the separated metal in a CuP alloy form according to a certain proportion;
s3: introducing reducing gas, adding covering agent on the molten metal surface, and keeping heating for 20-30min;
s4: and pouring to obtain the copper-based brazing filler metal.
The principle and the advantages of the invention are as follows: in the S1, the electronic waste is separated according to metal and nonmetal, the electronic waste metal including the waste circuit board is screened out to be used as a raw material for preparation, a smelting process of refining simple substance metal one by one in a gradient manner is omitted, short-flow recycling treatment of the electronic waste can be realized, the process flow is greatly shortened, energy is saved, emission is reduced, pollutants such as electrolyte, acidic leaching solution and the like are avoided, and high-efficiency comprehensive utilization of resources is realized while most metal elements in the electronic waste are recycled.
In S2, the P element can form a compound phase with the Fe element, so that the P element is added during smelting to prevent the Fe element and other alloy elements from generating intermetallic compound brittle phases, and the processing of the alloy solder is facilitated. In addition, the P element can form a "driving force" to separate the phase containing FeNiP as a main element from the phase containing CuSn as a main element during brazing of the stainless steel base material. Wherein, the phase with CuSn as the main element has good toughness, the phase with FeNiP as the main element has higher hardness, and the former is wrapped around the latter to form a soldered joint with high toughness at the periphery and high strength in the middle.
And in the S3, reducing gas is introduced, so that the oxidation in the smelting process can be prevented while the original oxidation impurities are reduced.
Further, the electronic waste metal comprises a waste circuit board.
Has the beneficial effects that: among electronic wastes, the waste circuit boards are parts with relatively high metal content, wherein the highest metal content is Cu (30-65 wt.%), the relatively high metal content includes common basic metals such as Sn, fe, ni, zn and the like, rare and precious metals such as Au, ag, pt, pd and the like, and elements such as Mn, mo, bi, sb, cr, cd, ga and the like. And Cu in the waste circuit board can be used as a main component of the brazing filler metal to prepare the copper-based brazing filler metal, and most other elements are almost used as alloy components to improve the performance of the copper-based brazing filler metal. Therefore, the metal in the waste circuit board is selected as the raw material, the process flow is greatly shortened, and the beneficial effects of energy conservation and emission reduction can be achieved.
Further, the proportion of the P element in the S2 is 0.5-9%.
Has the beneficial effects that: the inventors compared the strength of the solder-welded stainless steel weld joints obtained by adding different proportions of P content, and found that the shear strength of the weld joints slightly decreased when the P content was increased from 0.5% to 1%, and gradually increased with the increase in the P content when reaching 1%, but decreased when reaching 9%. Therefore, the preferable ratio is 0.5% to 9%.
Further, the reducing gas in S3 includes CO.
Further, the reducing gas in S3 comprises H 2 。
Has the advantages that: introduction of CO and H 2 Reducing gas reduces original oxidized impurities and prevents oxidation in the smelting process.
Drawings
Fig. 1 is a flow chart of a first embodiment of the method for preparing the high-hardness and high-toughness copper-based solder by using electronic waste.
FIG. 2 is a diagram of a brazed joint of Q235 stainless steel according to a first embodiment of the method for preparing a high-hardness and high-toughness copper-based brazing filler metal from electronic waste according to the present invention.
FIG. 3 is a cross-sectional view of a brazed joint of Q235 stainless steel according to a first embodiment of the method for preparing a high-hardness and high-toughness copper-based brazing filler metal from electronic waste according to the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
the specific implementation process is as follows:
example one
In one embodiment, as shown in fig. 1, a method for preparing a copper-based brazing filler metal with high hardness and toughness by using electronic waste comprises the following steps:
s1: separating the electronic waste according to metal and nonmetal, putting the separated metal into an induction heating furnace and heating to 950-1150 ℃;
the electronic waste in this embodiment mainly includes a waste circuit board, where the waste circuit board is a component with relatively high metal content in the electronic waste, where the metal with the highest content is Cu (30-65 wt.%), the metal with the relatively high content includes common basic metals such as Sn, fe, ni, and Zn, the noble metals such as Au, ag, pt, and Pd with relatively low content, and the elements such as Mn, mo, bi, sb, cr, cd, and Ga. Cu in the waste circuit board can be used as a main component of the brazing filler metal to prepare the copper-based brazing filler metal, most other elements are used as alloy components to improve the performance of the copper-based brazing filler metal, and only Fe with high content easily forms intermetallic compounds to deteriorate the brazing performance in the process of brazing stainless steel by the copper-based brazing filler metal. Therefore, the metal and the nonmetal of the waste circuit board are separated, the separated electronic waste metal is screened out to be used as raw materials to be prepared, the smelting process of refining simple substance metal one by one in a gradient manner is omitted, short-flow recovery processing of the electronic waste can be realized, the process flow is greatly shortened, energy is saved, emission is reduced, pollutants such as electrolyte and acidic leachate are avoided, and when most of metal elements in the electronic waste are recycled, high-efficiency comprehensive utilization of resources is realized.
S2: after the metal is smelted to a molten state, smelting the P element and the separated metal in a CuP alloy form according to a certain proportion;
after the metals and the non-metals of the electronic waste are separated by mechanical methods such as sorting and the like, 0.5 percent of P element is added in the form of CuP alloy in the alloying smelting process, so that the P element can be smelted with the metals of the electronic waste according to the proportion. On one hand, the P element and the Fe element can form a compound phase, and the Fe element and other alloy elements are prevented from generating intermetallic compound brittle phases, so that the processing of the alloy solder is facilitated. On the other hand, as shown in table 1, the inventors compared the strength of the solder-welded stainless steel weld joints obtained by adding different proportions of P content, and found that the shear strength of the weld joints slightly decreased when the P content was increased from 0.5% to 1%, and when reaching 1%, the shear strength gradually increased with the increase in the content, but decreased again when reaching 9%. Therefore, the best proportion is 0.5% -9%, so that the scheme adopts the mode of adding the P element with the content of 0.5% to improve the shearing strength.
TABLE 1 shear Strength Meter
Phosphorus content/%) Joint shear strength/Mpa
0 268
0.5 301
1 242
2 265
4 324
5 344
7 357
9 336
Further, as shown in fig. 2, the P element can form a kind of "driving force" to separate a phase having the FeNiP as a main element from a phase having the CuSn as a main element (a light-colored upper phase of the phase having the CuSn element as a main element and a dark-colored lower phase of the phase having the FeNiP as a main element in fig. 2) in brazing the stainless steel base material. As shown in fig. 3, the Q235 stainless brazed joint had a cross section including a large number of tough dimples formed of a phase containing CuSn as a main element, and a hard cross section formed of a phase containing FeNiP as a main element. The phase with CuSn as the main element has good toughness, the phase with FeNiP as the main element has higher hardness, and the former is wrapped around the latter to form a brazed joint with high toughness at the periphery and high strength in the middle.
S3: introducing reducing gas, adding covering agent on the molten metal surface, and heating for 20-30min.
When the metal is smelted to a molten state, adding a covering agent on the surface of the molten metal, and introducing CO or H 2 Reducing gas can reduce original oxidation impurities and prevent oxidation in the smelting process.
S4: and pouring to obtain the copper-based brazing filler metal.
The copper-based brazing filler metal prepared by the scheme has the advantages that the Cu element content is 30-85wt.%, the Sn element content is 0.5-40wt.%, the Fe element content is 0.5-20wt.%, the Ni element content is 0.5-35wt.%, the Zn element content is 0-30wt.%, the Cr element content is 0-15wt.%, the total content of rare and noble metal elements (Au, ag, pt and Pd) is 0-10wt.%, the P element content is 0.5-9wt.%, the Mn element content is 0-5wt.%, the Mo element content is 0-8wt.%, the Bi element content is 0-8wt.%, the Sb element content is 0-6wt.%, and the Ga element content is 0-5wt.%, the material performance of the copper-based brazing filler metal can reach the performance of pure metal preparation, the waste is changed into valuable, the electronic waste is fully utilized, and the efficient comprehensive utilization of resources is realized.
The foregoing are merely exemplary embodiments of the present invention, and no attempt is made to show structural details of the invention in more detail than is necessary for the fundamental understanding of the art, the description taken with the drawings making apparent to those skilled in the art how the several forms of the invention may be embodied in practice with the teachings of the invention. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims (5)

1. A method for preparing high-hardness and high-toughness copper-based solder by using electronic waste is characterized by comprising the following steps:
s1: separating the electronic waste according to metal and nonmetal, putting the separated metal into an induction heating furnace and heating to 950-1150 ℃;
s2: after the metal is smelted to a molten state, smelting the P element and the separated metal in a CuP alloy form according to a certain proportion;
s3: introducing reducing gas, adding covering agent on the molten metal surface, and heating for 20-30min;
s4: and pouring to obtain the copper-based brazing filler metal.
2. The method for preparing the high-hardness and high-toughness copper-based solder by using the electronic waste as claimed in claim 1, wherein the method comprises the following steps: the electronic waste metal comprises waste circuit boards.
3. The method for preparing the high-hardness and high-toughness copper-based solder by using the electronic waste as claimed in claim 1, wherein the method comprises the following steps: the proportion of the P element in the S2 is 0.5-9%.
4. The method for preparing the high-hardness and high-toughness copper-based solder by using the electronic waste as claimed in claim 1, wherein the method comprises the following steps: the reducing gas in S3 comprises CO.
5. The method for preparing the high-hardness and high-toughness copper-based solder by using the electronic waste as claimed in claim 1, wherein the method comprises the following steps: the reducing gas in S3 comprises H 2 。
CN202211067813.3A 2022-09-01 2022-09-01 Method for preparing high-hardness and high-toughness copper-based brazing filler metal by utilizing electronic waste Pending CN115287460A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004114158A (en) * 2003-11-07 2004-04-15 Sumitomo Special Metals Co Ltd Copper phosphorus brazing filler metal and brazing sheet
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