CN115268235B - Double-light-source exposure system of photoetching machine - Google Patents
Double-light-source exposure system of photoetching machine Download PDFInfo
- Publication number
- CN115268235B CN115268235B CN202211031003.2A CN202211031003A CN115268235B CN 115268235 B CN115268235 B CN 115268235B CN 202211031003 A CN202211031003 A CN 202211031003A CN 115268235 B CN115268235 B CN 115268235B
- Authority
- CN
- China
- Prior art keywords
- exposure
- light source
- bolts
- light
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a dual-light-source exposure system of a photoetching machine, which comprises an exposure rack, an adjusting component arranged at a groove at the bottom in the exposure rack, and a control panel arranged at the right end of the exposure rack through a bolt, wherein a guide rail component is arranged on the inner side wall of the exposure rack through a bolt, an exposure platform is arranged on a displacement block at the right end of the adjusting component through a bolt, the adjusting component is electrically connected with the control panel, external air flow is driven to enter a filter cotton layer through a fan plate for filtering through the arrangement of a flow guide mechanism at the top of the exposure rack, the air flow forms clean air flow through negative ions of an ion generator, the surface of a workpiece is swept through the flow guide of a reversing valve and a sweeping pipe, the cleaning effect on the exposed workpiece is favorably improved, the exposure mechanism is arranged at the front end of the guide rail component, a side plate exposure device and a leveling push rod are driven to carry out horizontal displacement adjustment through the arrangement of the side plate, and then the alignment sensor carries out displacement alignment action on the exposed workpiece.
Description
Technical Field
The invention relates to the field of exposure equipment, in particular to a dual-light-source exposure system of a photoetching machine.
Background
The photoetching machine is a core device for manufacturing a chip, and a technology similar to photo development is adopted to print a fine pattern on a mask plate on a silicon chip through exposure of light; the photolithography technology is a core technology in the field of semiconductor processing, and is derived in order to reduce the processing cost of the optical mask plate along with the gradual reduction of the size of a mask pattern.
At present, the production efficiency of the traditional maskless exposure system is sharply reduced under the condition that the photoetching resolution ratio is continuously improved, and a plurality of maskless photoetching systems are combined together to form a plurality of sets of exposure devices in order to improve the production efficiency; the multiple exposure devices have large volume, so that the multiple exposure layout cannot be efficiently realized within the size range of the substrate, and the exposure efficiency and the production efficiency cannot be improved; moreover, hardware cost is increased due to the combination of a plurality of sets of exposure devices; when the traditional equipment carries out developing action, chip patterns at the edge are easy to topple or deform, and the chip yield of the whole silicon wafer is directly reduced; the preprocessing action to exposing the piece is lacked to conventional equipment before exposing the action, and current equipment lacks effective regulation and direction to the light source when exposing simultaneously, and then influences the exposure effect easily.
Disclosure of Invention
Therefore, in order to solve the above-mentioned disadvantages, the present invention provides a dual light source exposure system for a lithography machine.
The invention is realized in such a way, a dual-light-source exposure system of a photoetching machine is constructed, the device comprises an exposure rack, an adjusting component arranged at a bottom groove in the exposure rack, a control panel arranged at the right end of the exposure rack through a bolt, a guide rail component arranged on the inner side wall of the exposure rack through a bolt, an exposure platform arranged at the right end of the adjusting component through a bolt, a flow guide mechanism arranged at the top of the exposure rack, an exposure mechanism arranged at the front end of the guide rail component, an installation side plate arranged at the front end of a displacement sliding block of the guide rail component through a bolt, leveling push rods arranged at the left side and the right side of the front end of the installation side plate through a bolt, and an alignment sensor arranged at the bottom of the installation side plate through a bolt, wherein an exposure piece is arranged at the bottom of the adjustment rod through a bolt, a mask plate and a negative photoresist are fixedly arranged at the inner side of the leveling push rod, and a circuit pattern plate fixedly adhered at the bottom of the leveling push rod is electrically connected with the control panel.
Preferably, the exposure casing at installation curb plate front end is installed including the bolt to the exposure ware, it glues glutinous being provided with light trap and bolt and installs at the inside fixed support body of exposure casing to expose casing bottom, fixed support body bottom left side bolt is installed miniature power and bolt and is installed at the left first exposure light source in fixed support body top and the printing opacity mirror of fixed mounting internal cell wall, fixed support body top right side is equipped with the polymerization subassembly, the second exposure light source is installed to first exposure light source top bolt, miniature power and first exposure light source and second exposure light source all are connected with control panel electricity.
Preferably, the polymerization subassembly includes that the screw thread is installed at the adjusting screw on fixed support body top right side, adjusting screw fixed mounting is in first light screen bottom, first light screen top welding has the hinge joint ring, the hinge joint ring welding is in second light screen bottom, the equal bolted mounting of left wall has laser instrument and fixed mounting at the inside condensing lens of first exposure light source and second exposure light source in first exposure light source and the second exposure light source, first exposure light source and second exposure light source inner wall respectively with polymerization grating and parallel grating frame wall bolted connection, the laser instrument is connected with the control panel electricity.
Preferably, water conservancy diversion mechanism includes that the bolt is installed at the filter box at exposure frame top, filter box rear end bolt installation has fan board and bolt to install the filter cotton layer and the bolt of filter box inside rear side and install the ion generator at filter box top, filter box front end pipe-line installation has tensile trachea, tensile trachea bottom and switching-over valve top pipe connection, both ends air outlet pipe-line installation has the heat exchange tube of sweeping pipe and pipe installation in the switching-over valve bottom about the switching-over valve, sweep the equal pipe-line installation in pipe and heat exchange tube bottom and have rubber sleeve, fan board and ion generator and switching-over valve all are connected with control panel electricity.
Preferably, the circuit pattern board is provided with a shading part for shielding, and the top of the shading part is provided with a resin adhesive layer for adhering.
Preferably, an included angle formed between the first light shielding plate and the second light shielding plate is 150 degrees, and the surfaces of the first light shielding plate and the second light shielding plate are both provided with reflecting surfaces.
Preferably, the shading part is made of plastic.
Preferably, the mask is made of plastic.
The invention has the following advantages: the invention provides a dual-light source exposure system of a photoetching machine through improvement, compared with the same type of equipment, the invention has the following improvements:
according to the dual-light-source exposure system of the photoetching machine, the diversion mechanism is arranged on the top of the exposure frame, external air flow is driven to enter the filter cotton layer through the fan plate to be filtered, negative ions emitted by the ion generator enable the air flow to form clean air flow, and the surface of a workpiece is swept through diversion of the reversing valve and the sweeping pipe, so that the cleaning effect on the exposed workpiece is improved.
According to the dual-light-source exposure system of the photoetching machine, the exposure mechanism is arranged at the front end of the guide rail assembly, the exposure device and the leveling push rod are driven to carry out horizontal displacement adjustment through the mounting side plate, the alignment sensor carries out displacement alignment on the exposure device, and the leveling push rod drives the shading piece and the mask plate to carry out leveling action, so that the adjustment and the shielding effect of the exposure source are improved.
According to the dual-light-source exposure system of the photoetching machine, the exposure device is arranged at the front end of the mounting side plate, the micro power supply is used for providing electric energy for the first exposure light source and the second exposure light source, and the light-transmitting lens is used for providing guiding actions for the light sources in the first exposure light source and the second exposure light source, so that the protection and guiding effects on the first exposure light source and the second exposure light source are improved.
The photo-etching machine double-light-source exposure system is provided with the polymerization component on the top of the fixed frame body, emits light through the laser, performs light condensation action under the gathering action of the condenser lens and the polymerization grating, and transmits the exposure source under the action of parallel light guide and angle light guide of the parallel grating, the first light shading plate and the second light shading plate.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic perspective view of the interior of the exposure frame and the exposure mechanism of the present invention;
FIG. 3 is a schematic perspective view of an exposure mechanism according to the present invention;
FIG. 4 is an enlarged schematic view of the invention at A in FIG. 3;
FIG. 5 is a schematic view of the internal structure of the exposure apparatus according to the present invention;
FIG. 6 is a schematic perspective view of an exposure tool and a polymerization assembly according to the present invention;
FIG. 7 is a schematic perspective exploded view of a polymeric assembly of the present invention;
fig. 8 is a schematic perspective view of the flow guide mechanism of the present invention.
Wherein: the device comprises an exposure rack-1, a flow guide mechanism-2, an adjusting assembly-3, an exposure platform-4, a control panel-5, a guide rail assembly-6, an exposure mechanism-7, a filter cabinet-21, a fan plate-22, a filter cotton layer-23, an ionizer-24, a stretching air pipe-25, a reversing valve-26, a purging pipe-27, a heat exchange pipe-28, a rubber sleeve-29, a mounting side plate-71, an exposure device-72, a leveling push rod-73, a shading piece-74, a mask plate-75, a negative photoresist-76, a circuit pattern plate-77, an alignment sensor-78, an exposure shell-721, a light hole-722, a fixing frame body-723, a micro power supply-724, a first exposure light source-725, a second exposure light source-727, a polymerization assembly-727, a light transmitting mirror-728, an adjusting screw-7271, a first shading plate-7272, a loop-7273, a second shading plate-7274, a laser-7275, a condenser lens-7276, a polymerization grating-7 and a parallel grating-8.
Detailed Description
The present invention will be described in detail below with reference to fig. 1 to 8, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the dual light source exposure system of the lithography machine of the present invention includes an exposure frame 1, an adjusting component 3 disposed at a bottom groove in the exposure frame 1, and a control panel 5 mounted at the right end of the exposure frame 1 by a bolt, wherein a guide rail component 6 is mounted on the inner side wall of the exposure frame 1 by a bolt, an exposure platform 4 is mounted on the right end of the adjusting component 3 by a bolt of a displacement block, and the adjusting component 3 is electrically connected with the control panel 5.
Referring to fig. 2, 3 and 4, the dual-light-source exposure system of the lithography machine of the present invention further includes a flow guiding mechanism 2 installed on the top of the exposure frame 1 and an exposure mechanism 7 installed on the front end of the guide rail assembly 6, the exposure mechanism 7 includes an installation side plate 71 installed on the front end of the displacement slider of the guide rail assembly 6 by bolts to provide an adjusting effect for the displacement of the installation side plate 71, an exposure device 72, leveling push rods 73 installed on the middle side of the front end of the installation side plate 71 by bolts and installed on the left and right sides of the front end of the installation side plate 71 by bolts, and an alignment sensor 78 installed on the bottom of the installation side plate 71 by bolts, the positioning effect is provided for the displacement of the installation side plate 71 by the alignment sensor 78, a light shielding member 74 is installed on the bottom of the adjustment rod 73 by bolts, a mask plate 75 and a negative photoresist 76 are fixedly installed on the inner side of the light shielding member 74 through the groove wall, and a circuit pattern plate 77 adhesively fixed on the bottom of the light shielding member 74 are provided on the mask 75 and the circuit pattern plate 76 by the light shielding member 74, the leveling push rod 73 is electrically connected to the control panel 5 to provide electric energy for the push rod 73, the circuit pattern plate 73, the light shielding member 74 is provided with the light shielding member 74, and the photoresist layer 74 is provided on the top of the mask 74 to improve the circuit pattern plate 74.
Referring to fig. 4, 5 and 6, in the dual light source exposure system of the lithography machine of the present invention, the exposure device 72 includes an exposure housing 721 installed at the front end of the installation side plate 71 by bolts, the bottom of the exposure housing 721 is adhesively provided with a light transmission hole 722 and a fixing frame 723 installed inside the exposure housing 721 by bolts, the fixing frame 723 is provided with a protection effect by the exposure housing 721, the left side of the bottom of the fixing frame 723 is bolted with a micro power 724, a first exposure light source 725 installed at the left side of the top of the fixing frame 723 by bolts, and a light transmission mirror 728 fixedly installed at the inner wall of the fixing frame 723 provides a light guide effect for the exposure source by the light transmission mirror 728, the right side of the top of the fixing frame 723 is provided with a polymerization component 727, the top of the first exposure light source 725 is bolted with a second exposure light source 726, the micro power 724, the first exposure light source 725, and the second exposure light source 726 are electrically connected to the control panel 5, and provide electric energy for the micro power 724, the first exposure light source 725, and the second exposure light source 726.
Referring to fig. 6 and 7, in the dual light source exposure system of the lithography machine of the present invention, the converging component 727 includes an adjusting screw 7271 installed at the right side of the top of the fixed frame 723 through a screw thread, the adjusting screw 7271 is fixedly installed at the bottom of the first light baffle 7272, an adjusting effect is provided for the angle of the first light baffle 7272 through the adjusting screw 7271, a hinged loop 7273 is welded at the top of the first light baffle 7272, the hinged loop 7273 is welded at the bottom of the second light baffle 7274, the first exposure light source 725 and the second exposure light source 726 are both bolted with a laser 7275 and a condenser 7276 installed inside the first exposure light source 725 and the second exposure light source 726, a protective effect is provided for the laser 7275 through the first exposure light source 725 and the second exposure light source 726, the inner walls of the first exposure light source 725 and the second exposure light source 726 are respectively bolted with the converging grating 7277 and the parallel grating frame 7278, the laser 7275 is electrically connected with the control panel 5, an electric energy is provided for the laser 7275, an included angle formed between the first light baffle 7272 and the second light baffle 7274, and the second light guide surface 7274 is both provided with the first light baffle 7272 and the second baffle 7274.
Referring to fig. 8, in the dual-light-source exposure system of the lithography machine of the present invention, the flow guide mechanism 2 includes a filter case 21 installed on the top of the exposure frame 1 by bolts, a fan plate 22 installed on the rear end of the filter case 21 by bolts, a filter cotton layer 23 installed on the rear side inside the filter case 21 by bolts, and an ionizer 24 installed on the top of the filter case 21 by bolts, the filter cotton layer 23 and the ionizer 24 provide cleaning effect for air flow, a stretching air pipe 25 installed on the front end pipe of the filter case 21, the bottom of the stretching air pipe 25 connected with the top pipe of the reversing valve 26 by bolts, a purging pipe 27 installed on the left and right end air outlet pipe of the reversing valve 26, and a heat exchange pipe 28 installed on the bottom of the reversing valve 26 by pipes, rubber sleeves 29 installed on the bottoms of the purging pipe 27 and the heat exchange pipe 28, the fan plate 22, the ionizer 24 and the reversing valve 26 are electrically connected with the control panel 5, and provide electric energy for the fan plate 22, the ionizer 24 and the reversing valve 26.
The invention provides a double-light-source exposure system of a photoetching machine by improvement, and the working principle is as follows;
firstly, when the equipment is used, the equipment is placed in a working area, and then the device is connected with an external power supply, so that the power supply required by the work of the equipment can be provided;
secondly, when exposure is carried out, a worker firstly fixes an exposure workpiece in the exposure rack 1 through the exposure platform 4 and carries out position adjustment action on the exposure workpiece through the adjusting component 3, at the moment, the synchronous control guide rail component 6 drives the installation side plate 71 and the exposure device 72 to move, the alignment sensor 78 carries out alignment action on the displacement of the exposure workpiece and the exposure device 72, and then the leveling push rod 73 is controlled to drive the shading piece 74 and the mask plate 75 to carry out leveling action, so that the shading piece 74, the mask plate 75, the negative photoresist 76 and other components can form a vertical relation with the light hole 722 at the bottom of the exposure device 72, and the adjustment and the masking effect on an exposure source are improved;
thirdly, the micro power 724 supplies electric energy to the first exposure light source 725 and the second exposure light source 726, so that the laser 7275 emits light rays and performs condensation action under the converging action of the condenser 7276 and the converging grating 7277, then the parallel grating 7278 transmits the light rays to the first light baffle 7272 in parallel, because the two groups of lasers 7275 are arranged at different heights, the angles of the first light baffle 7272 and the second light baffle 7274 are slightly adjusted through the adjusting screw 7271 and the hinged ring 7273, so that the first light baffle 7272 and the second light baffle 7274 can converge the two light rays into single-strand light rays, and the light-transmitting mirror 728 provides guiding action for the light sources in the first exposure light source 725 and the second exposure light source 726, which is beneficial to improving the protection and guiding effects on the first exposure light source 725 and the second exposure light source 726, the laser passes through the mask plate 75, the negative photoresist 76 and the circuit graphic plate 77 in sequence to perform filtering and developing actions, and the light rays are shielded by the shading piece 74;
fourthly, the fan plate 22 is controlled to drive external air flow to enter the filtering cotton layer 23 to be filtered synchronously through the control panel 5, the air flow is enabled to form air flow with negative ions through negative ions emitted by the ion generator 24, the surface of the workpiece is swept through the diversion of the reversing valve 26 and the sweeping pipe 27, the cleaning effect and the static electricity removing effect on the exposed workpiece are improved, meanwhile, the air flow can be driven to enter the heat exchange pipe 28 through the reversing valve 26 to dissipate heat inside the exposure device 72, the heat dissipation air flow and the cleaning air flow are in opposite directions through the three groups of rubber sleeves 29, the heat dissipation air flow and the cleaning air flow can work synchronously, and the efficiency of exposure work is improved.
The invention provides a lithography machine double-light source exposure system by improvement, external air flow is driven by a fan plate 22 to enter a filter cotton layer 23 for filtering, negative ions at the emission part of an ion generator 24 enable the air flow to form clean air flow, the surface of a workpiece is swept by the diversion of a reversing valve 26 and a sweeping pipe 27, the cleaning effect of an exposed workpiece is favorably improved, an exposure device 72 and a leveling push rod 73 are driven by a mounting side plate 71 to perform horizontal displacement adjustment, at the moment, the alignment sensor 78 performs displacement alignment action, a shading piece 74 and a mask plate 75 are driven by a leveling push rod 73 to perform leveling action, the adjustment and covering effects of an exposure source are favorably improved, a micro power supply 724 is used for providing electric energy for a first exposure light source 725 and a second exposure light source 726, a light-transmitting mirror 728 is used for providing guiding actions for light sources inside the first exposure light source 725 and the second exposure light source 726, the protection and guiding effects for the first exposure light source 725 and the second exposure light source 726 are favorably improved, light is emitted by a laser 7275, the light is condensed under the condensation action of a condensing mirror 7276 and a converging grating 7, and the parallel light guiding action of a light source 7278 and light guide action of a light source 7278 under the parallel grating light-collecting action of a light source 7274 and a light-guiding action of a second light source 7274.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The double-light-source exposure system of the photoetching machine comprises an exposure rack (1), an adjusting component (3) arranged at a bottom groove in the exposure rack (1) and a control panel (5) arranged at the right end of the exposure rack (1) through bolts, wherein a guide rail component (6) is arranged on the bolt on the inner side wall of the exposure rack (1), an exposure platform (4) is arranged on a displacement block bolt at the right end of the adjusting component (3), and the adjusting component (3) is electrically connected with the control panel (5);
the method is characterized in that: the device is characterized by further comprising a flow guide mechanism (2) arranged at the top of the exposure rack (1) and an exposure mechanism (7) arranged at the front end of the guide rail component (6), wherein the exposure mechanism (7) comprises an installation side plate (71) arranged at the front end of the displacement slide block of the guide rail component (6) through bolts, leveling push rods (73) arranged at the left side and the right side of the front end of the installation side plate (71) through bolts and leveling sensors (78) arranged at the inner side of the bottom of the installation side plate (71) through bolts, an exposure piece (74) is arranged at the bottom of an adjustment rod of the leveling push rods (73) through bolts, a mask (75) and a negative photoresist (76) are fixedly arranged on the inner side through groove wall of the exposure piece (74), and a circuit pattern board (77) fixed at the bottom of the exposure piece (74) through adhesion, and the leveling push rods (73) are electrically connected with a control panel (5).
2. The dual light source exposure system of lithography machine according to claim 1, wherein: the exposure device (72) comprises an exposure shell (721) installed at the front end of the installation side plate (71) through bolts, and the bottom of the exposure shell (721) is provided with a light hole (722) in a sticky mode and a fixing frame body (723) installed inside the exposure shell (721) through bolts.
3. The dual light source exposure system of claim 2, wherein: the light-transmitting lens is characterized in that a micro power supply (724) and a first exposure light source (725) which is installed on the left side of the top of the fixing frame body (723) through a bolt are installed on the left side of the bottom of the fixing frame body (723) through a bolt, and a light-transmitting mirror (728) which is installed on the inner groove wall of the fixing frame body (723) is fixedly installed on the right side of the top of the fixing frame body (723) and is provided with a polymerization component (727).
4. The dual light source exposure system of claim 3, wherein: the second exposure light source (726) is installed on the top of the first exposure light source (725) through a bolt, and the micro power supply (724), the first exposure light source (725) and the second exposure light source (726) are electrically connected with the control panel (5).
5. The dual light source exposure system of claim 3, wherein: the polymerization assembly (727) comprises an adjusting screw rod (7271) which is installed on the right side of the top of the fixed frame body (723) in a threaded mode, the adjusting screw rod (7271) is fixedly installed at the bottom of a first light baffle plate (7272), an articulated ring (7273) is welded at the top of the first light baffle plate (7272), and the articulated ring (7273) is welded at the bottom of a second light baffle plate (7274).
6. The dual-light-source exposure system of the lithography machine according to claim 5, characterized in that: the laser (7275) and the condenser (7276) fixedly installed in the first exposure light source (725) and the second exposure light source (726) are installed on the inner left wall of each of the first exposure light source (725) and the second exposure light source (726) through bolts, the inner walls of the first exposure light source (725) and the second exposure light source (726) are respectively connected with the polymerization grating (7277) and the outer frame wall of the parallel grating (7278) through bolts, and the laser (7275) is electrically connected with the control panel (5).
7. The dual-light-source exposure system of the lithography machine according to claim 1, characterized in that: the flow guide mechanism (2) comprises a filter case (21) which is installed at the top of the exposure frame (1) through bolts, a fan plate (22) and a filter cotton layer (23) which is installed on the rear side inside the filter case (21) through bolts are installed at the rear end of the filter case (21) through bolts, and an ion generator (24) which is installed at the top of the filter case (21) through bolts, and a stretching air pipe (25) is installed on a front end pipeline of the filter case (21).
8. The dual light source exposure system of claim 7, wherein: tensile trachea (25) bottom and switching-over valve (26) top pipe connection, both ends air outlet pipe mounting has the heat exchange tube (28) of sweeping pipe (27) and pipe mounting in switching-over valve (26) bottom about switching-over valve (26), sweep the equal pipe mounting in pipe mounting (27) and heat exchange tube (28) bottom and have rubber sleeve (29), fan board (22) and ion generator (24) and switching-over valve (26) all are connected with control panel (5) electricity.
9. The dual light source exposure system of lithography machine according to claim 1, wherein: the circuit pattern board (77) is provided with shading parts (74) with a shading effect at the periphery, and the top of each shading part (74) is provided with a resin glue layer with a sticking effect.
10. The dual light source exposure system of claim 5, wherein: an included angle formed between the first shading plate (7272) and the second shading plate (7274) is 150 degrees, and the surfaces of the first shading plate (7272) and the second shading plate (7274) are provided with reflecting surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211031003.2A CN115268235B (en) | 2022-08-26 | 2022-08-26 | Double-light-source exposure system of photoetching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211031003.2A CN115268235B (en) | 2022-08-26 | 2022-08-26 | Double-light-source exposure system of photoetching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115268235A CN115268235A (en) | 2022-11-01 |
| CN115268235B true CN115268235B (en) | 2023-03-14 |
Family
ID=83756036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211031003.2A Active CN115268235B (en) | 2022-08-26 | 2022-08-26 | Double-light-source exposure system of photoetching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115268235B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152230U (en) * | 2009-05-12 | 2009-07-23 | 翊暉科技股▲ふん▼有限公司 | Exposure equipment |
| CN102809892A (en) * | 2012-07-20 | 2012-12-05 | 顾金昌 | Moving, compressing and shading mechanism for digital stereo image processing and method thereof |
| CN103543609A (en) * | 2012-07-12 | 2014-01-29 | 上海微电子装备有限公司 | Double-mercury lamp spliced exposure system for lithography equipment |
| CN106527060A (en) * | 2017-01-04 | 2017-03-22 | 广东海圣科技有限公司 | Double parallel LED light source mechanism for exposure machine |
| CN207051666U (en) * | 2017-07-31 | 2018-02-27 | 东莞市友辉光电科技有限公司 | Multistation 3D cover plate exposure machines |
| CN207502913U (en) * | 2017-10-01 | 2018-06-15 | 广东柔印机械有限公司 | The bis- light source exposure machines of flexographic plate lift UVA-LED |
-
2022
- 2022-08-26 CN CN202211031003.2A patent/CN115268235B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152230U (en) * | 2009-05-12 | 2009-07-23 | 翊暉科技股▲ふん▼有限公司 | Exposure equipment |
| CN103543609A (en) * | 2012-07-12 | 2014-01-29 | 上海微电子装备有限公司 | Double-mercury lamp spliced exposure system for lithography equipment |
| CN102809892A (en) * | 2012-07-20 | 2012-12-05 | 顾金昌 | Moving, compressing and shading mechanism for digital stereo image processing and method thereof |
| CN106527060A (en) * | 2017-01-04 | 2017-03-22 | 广东海圣科技有限公司 | Double parallel LED light source mechanism for exposure machine |
| CN207051666U (en) * | 2017-07-31 | 2018-02-27 | 东莞市友辉光电科技有限公司 | Multistation 3D cover plate exposure machines |
| CN207502913U (en) * | 2017-10-01 | 2018-06-15 | 广东柔印机械有限公司 | The bis- light source exposure machines of flexographic plate lift UVA-LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115268235A (en) | 2022-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7088424B2 (en) | Lithographic projection apparatus, reflector assembly for use therein, and device manufacturing method | |
| TW594846B (en) | EUV-transparent interface structure | |
| CN103149801B (en) | Laser direct plate marking device for plane screen print plate and device | |
| CN1591196A (en) | Lithographic apparatus and device manufacturing method | |
| CN115268235B (en) | Double-light-source exposure system of photoetching machine | |
| CN1619422A (en) | Radiation detector | |
| JP6807468B2 (en) | Silicon wafer processing equipment and methods | |
| CN103777470B (en) | For reducing the method and apparatus that the ultraviolet (UV) of getter action patterns | |
| US20090141257A1 (en) | Illumination optical apparatus, exposure apparatus, and method for producing device | |
| JP4685943B2 (en) | Lithographic apparatus, illumination system, and method of supplying a projection beam of EUV radiation | |
| CN209946632U (en) | Digital projection direct photosensitive imaging device | |
| EP1389747B1 (en) | Lithographic projection apparatus and reflector asembly for use in said apparatus | |
| CN211293604U (en) | Parallel light exposure machine for processing precise etching filter screen | |
| US7105837B2 (en) | Lithographic apparatus, device manufacturing method and radiation system | |
| TWI704018B (en) | System of cleaning lithography apparatus, device and method for cleaning collector of lithography apparatus | |
| US6356341B1 (en) | Exposure device, beam shape setting device and illuminating area setting device | |
| CN109212916B (en) | Exposure developing device and method | |
| CN112180692A (en) | Counter force counteracting device for photoetching machine motion platform | |
| CN218517936U (en) | Double-platform ultraviolet picosecond cutting device | |
| CN110095949A (en) | A kind of digital projection direct exposure imaging device and its technique | |
| CN116909107B (en) | Light source system for illumination of lithography equipment | |
| CN220305623U (en) | Light intensity uniformity automatic debugging's ray apparatus structure | |
| CN221113909U (en) | Acquisition device for railway tunnel limit and surface defect detection | |
| CN216083396U (en) | Semiconductor etching light shield convenient to adjust light distance | |
| CN215895222U (en) | Solar energy photoetching machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |