CN115267271B - Fixing device and chip testing machine with same - Google Patents
Fixing device and chip testing machine with same Download PDFInfo
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- CN115267271B CN115267271B CN202210946988.5A CN202210946988A CN115267271B CN 115267271 B CN115267271 B CN 115267271B CN 202210946988 A CN202210946988 A CN 202210946988A CN 115267271 B CN115267271 B CN 115267271B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to the technical field of wafer production, in particular to a fixing device and a chip tester with the same. A fixing device is applicable to the field of chip testing, and comprises: the fixing plate is provided with a fixing end, and the fixing end is provided with at least one first fixing part matched with the chip to be detected; the light transmission platform is provided with a groove suitable for placing the chip to be detected, the groove is provided with at least one second fixing part matched with the chip to be detected, the fixing end extends into the groove, and the second fixing part of the groove and the first fixing part of the fixing end are respectively arranged on two opposite sides of the chip to be detected, so that the chip to be detected is kept fixed. The invention solves the problem of inaccurate results caused by the deviation of the chip in normal temperature test, thereby providing the fixing device and the chip tester with the fixing device.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a fixing device and a chip tester with the same.
Background
The chip is made of sand, the component of the sand is silicon dioxide, silicon elements are extracted from the sand in the production process to prepare a thick and long single crystal silicon rod, and then the single crystal silicon rod is cut into thin round silicon wafers, namely the wafer. In the production process, the problems of cutting difficulty and efficiency are considered in the production of chips, and the linear cutting is naturally many times simpler than the curve cutting. The linear cutting process is simpler, and the yield of the chip is improved to a certain extent, so that the obtained chip is square, and the square is easier to cut, higher in utilization rate and least wasteful.
In the chip manufacturing process, the chip needs to be tested. In the normal temperature test process, the photosensitive surface of the chip is positioned on the back surface (the surface attached to the test bench), the chip can be contacted with parts such as a probe when PD (potential difference) detection is carried out, and if the position of the chip to be detected is deviated, the test result is inaccurate.
Disclosure of Invention
Therefore, the invention aims to overcome the defect of inaccurate results caused by the deviation of the positions of chips in normal temperature test in the prior art, thereby providing the fixing device and the chip tester with the fixing device.
In order to solve the above problems, the present invention provides a fixing device, which is applicable to the field of chip testing, and includes:
the fixing plate is provided with a fixing end, and the fixing end is provided with at least one first fixing part matched with the chip to be detected;
the light transmission platform is provided with a groove suitable for placing the chip to be detected, the groove is provided with at least one second fixing part matched with the chip to be detected, the fixing end extends into the groove, and the second fixing part of the groove and the first fixing part of the fixing end are respectively arranged on two opposite sides of the chip to be detected, so that the chip to be detected is kept fixed.
Optionally, the chip to be detected is rectangular, and the first fixing portion and the second fixing portion are both right-angle bayonets.
Optionally, the fixing plate is disposed at an acute angle to a surface of the groove.
Optionally, the device further comprises a horizontal adjusting seat, wherein one end, far away from the fixed end, of the fixed plate is fixedly connected with the horizontal adjusting seat, the horizontal adjusting seat is sequentially provided with a bottom plate and a first horizontal adjusting plate from bottom to top along the height direction, and the first horizontal adjusting plate is in sliding connection with the bottom plate.
Optionally, be equipped with the end that stretches out on the bottom plate, stretch out and be equipped with first horizontal adjustment spare on the end, first horizontal adjustment spare and the side butt of first horizontal adjustment board, first horizontal adjustment spare and fixed plate are located respectively the both sides of first horizontal adjustment board.
Optionally, the transparent table is made of glass.
The chip testing machine comprises the fixing device and further comprises a first disc, wherein the light transmission table is arranged on the first disc, and a light source arranged towards the light transmission table is arranged on the first disc.
Optionally, the probe device further comprises a first probe device arranged on the first disc, wherein the first probe device comprises a probe assembly and a probe adjusting seat, and the probe assembly is arranged on the probe adjusting seat.
Optionally, the test bench further comprises a base, a first disc and a second disc are arranged on the base at intervals, a third disc is further arranged in the second disc, the second disc is rotationally connected with the third disc, a test bench and a second probe device are arranged on the third disc, and the second probe device is located on one side of the test bench.
Optionally, the testboard is equipped with at least one air flue and at least one absorption hole, the absorption hole is suitable for placing wait to detect the chip, absorption hole and air flue link up the setting, the air flue is connected with the evacuation structure.
The technical scheme of the invention has the following advantages:
1. the fixing device provided by the invention is characterized in that the fixing plate is provided with a fixing end, and the fixing end is provided with at least one first fixing part matched with a chip to be detected; the light transmission platform is provided with a groove suitable for placing the chip to be detected, the groove is provided with at least one second fixing part matched with the chip to be detected, the fixing end extends into the groove, and the second fixing part of the groove and the first fixing part of the fixing end are respectively arranged on two opposite sides of the chip to be detected, so that the chip to be detected is kept fixed. The first fixing part and the second fixing part are respectively arranged on two opposite sides of the chip to be detected, the chip to be detected is fixed in two opposite directions, the chip to be detected is always kept fixed after being positioned, the problem that the result is inaccurate due to position deviation in the testing process is avoided, and the accuracy of the testing result is effectively improved.
2. According to the fixing device provided by the invention, the chip to be detected is rectangular, the first fixing part and the second fixing part are right-angle bayonets, the two right-angle sides of the rectangle are fixed by one right-angle bayonet, and the four right-angle sides of the rectangle are simultaneously fixed by the first fixing part and the second fixing part which are respectively arranged at two opposite sides of the chip to be detected, so that the chip to be detected is ensured to be fixed.
3. According to the fixing device provided by the invention, the fixing plate and the surface of the groove are arranged at an acute angle, so that the first fixing part stretches into the groove to be fixed.
4. The fixing device provided by the invention further comprises a horizontal adjusting seat, one end of the fixing plate, which is far away from the fixed end, is fixedly connected with the horizontal adjusting seat, the horizontal adjusting seat is sequentially provided with a bottom plate and a first horizontal adjusting plate along the height direction, and the first horizontal adjusting plate is in sliding connection with the bottom plate. The horizontal adjusting seat is used for fixing the fixing plate, and the first horizontal adjusting plate is connected with the bottom plate in a sliding mode so that the first horizontal adjusting plate can slide relative to the bottom plate.
5. According to the fixing device provided by the invention, the bottom plate is provided with the extending end, the extending end is provided with the first horizontal adjusting piece, the first horizontal adjusting piece is abutted with the side face of the first horizontal adjusting plate, and the first horizontal adjusting piece and the fixing plate are respectively arranged on two sides of the first horizontal adjusting plate. The first horizontal adjusting piece adjusts the first horizontal adjusting plate, so that the first horizontal adjusting plate slides relative to the bottom plate, and the first fixing part of the fixing plate is driven to move in the groove so as to fix chips with different sizes.
6. According to the fixing device provided by the invention, the transparent table is made of glass, and the glass is convenient to process to obtain the groove, so that the fixing device has the advantages of low cost and good transmittance.
7. The chip testing machine provided by the invention has the advantages of any one of the above because the fixing device of any one of the above is adopted. The light transmission platform is arranged on the first disc, and the light source arranged towards the light transmission platform is arranged on the first disc. The light source is arranged towards the light transmission platform, and the emitted light irradiates on the back surface of the chip to be detected through the light transmission platform so as to test the chip to be detected.
8. The invention provides a chip testing machine, which also comprises a first probe device arranged on a first disc, wherein the first probe device comprises a probe assembly and a probe adjusting seat, the probe assembly is arranged on the probe adjusting seat, and the probe adjusting seat is used for adjusting the position of a probe so as to enable the probe to be in contact with different positions of a chip.
9. The invention provides a chip testing machine, which further comprises a base, wherein a first disc and a second disc which are arranged at intervals are respectively arranged on the base, a third disc is arranged in the second disc, the second disc is rotationally connected with the third disc, a test table and a second probe device are arranged on the third disc, and the second probe device is positioned on one side of the test table. The third disc rotates relative to the second disc in the second disc so as to drive the test bench on the third disc to rotate, and the chip to be detected is placed on the test bench conveniently.
10. The invention provides a chip testing machine, wherein a testing table is provided with at least one air passage and at least one adsorption hole, the adsorption hole is suitable for placing a chip to be tested, the adsorption hole and the air passage are communicated, and the air passage is connected with a vacuumizing structure. When the chip to be detected needs to be fixed, the vacuumizing structure extracts air in the air passage and the adsorption hole, so that the chip to be detected is firmly placed on the surface of the test bench.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a base of a chip mounter according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the connection structure of a test bench, a chip to be tested and a fixing plate according to the embodiment of the invention;
fig. 3 is a schematic structural diagram of a chip to be tested placed in a groove according to an embodiment of the present invention;
FIG. 4 is a schematic view of a horizontal adjustment seat provided in an embodiment of the present invention;
fig. 5 is a schematic structural view of a first probe apparatus according to an embodiment of the present invention.
Reference numerals illustrate: 1. a horizontal adjustment seat; 2. a first probe device; 3. a light transmitting stage; 4. a first disc; 5. a base; 6. a second disc; 7. a third disc; 8. a test bench; 9. a second probe device; 10. a chip to be detected; 11. a fixing plate; 12. a groove; 13. a first horizontal adjustment member; 14. a first horizontal adjustment plate; 15. a bottom plate; 16. a probe assembly; 17. a height adjusting plate; 18. a height adjusting member; 19. a height fixing block; 20. a third level adjustment member; 21. a second horizontal adjustment member; 22. a third horizontal adjustment plate; 23. a second fixed block; 24. a second horizontal adjustment plate; 25. a first fixed block.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
One embodiment of the fixation device, as shown in fig. 1-5, includes: the surface is equipped with the printing opacity platform 3 of recess 12, locates the level adjustment seat 1 of printing opacity platform 3 one side, is equipped with fixed plate 11 on the level adjustment seat 1, and the stiff end of fixed plate 11 stretches into in the recess 12 of printing opacity platform 3. The light-transmitting table 3 is only suitable for testing the chip 10 to be tested at normal temperature. Specifically, the chip to be detected 10 is an APD (avalanche photodiode) array chip.
As shown in fig. 1, 2 and 3, a rectangular chip 10 to be detected is suitable to be placed in the groove 12 of the light-transmitting table 3. For fixing the chip 10 to be detected, a second fixing portion adapted to the chip 10 to be detected is disposed in the groove 12, the second fixing portion is a right-angle bayonet, a first fixing portion adapted to the chip 10 to be detected is disposed on the fixing end of the fixing plate 11, the first fixing portion is a right-angle bayonet, and the first fixing portion and the second fixing portion are respectively disposed on two opposite sides of the chip 10 to be detected (i.e., the first fixing portion and the second fixing portion are disposed on two ends of a diagonal line of the chip 10 to be detected), so that the chip 10 to be detected is always fixed. In particular, the recess 12 has a quarter-circle configuration with right angles. In order to facilitate the insertion of the fixed end into the recess 12, as shown in fig. 1, 2 and 3, the fixing plate 11 is disposed at an acute angle to the surface of the recess 12, and one end of the fixing plate 11 is disposed higher than the other end thereof in an inclined shape. In order to facilitate the light source to irradiate the surface of the chip 10 to be detected, which is contacted with the groove 12, through the light-transmitting table 3, the light-transmitting table 3 is made of glass.
As shown in fig. 1 and 4, the horizontal adjustment seat 1 is provided with a bottom plate 15 and a first horizontal adjustment plate 14 in sequence from bottom to top along the height direction, wherein the first horizontal adjustment plate 14 is slidably connected with the bottom plate 15. As shown in fig. 4, the bottom plate 15 is provided with an L-shaped extending end, the extending end is provided with a first horizontal adjusting member 13, the first horizontal adjusting member 13 is abutted against the side surface of the first horizontal adjusting plate 14, and the first horizontal adjusting member 13 and the fixing plate 11 are respectively provided on two opposite sides of the first horizontal adjusting plate 14. Specifically, the first leveling member 13 is a micro head. After the positions of the first horizontal adjusting plate 14 and the bottom plate 15 are adjusted, the locking member provided at one side of the first horizontal adjusting plate 14 is fixed. By adjusting the position of the first horizontal adjusting plate 14, the first fixing part of the fixing plate 11 is positioned at different positions in the groove 12 so as to adapt to chips 10 to be detected with different sizes placed in the groove 12.
The invention also provides a chip testing machine, which comprises the fixing device, as shown in fig. 1, and further comprises a first disc 4, wherein the horizontal adjusting seat 1 and the light transmission table 3 are arranged on the first disc 4, a light source arranged towards the light transmission table 3 is arranged in the first disc 4, namely, the light source and the chip to be tested 10 are respectively arranged at two sides of the light transmission table 3, and the light source penetrates through the light transmission table 3 from bottom to top and irradiates the chip to be tested 10.
In order to test the chip 10 to be tested, as shown in fig. 1 and 5, a first probe device 2 is further provided on the first disc 4, and the first probe device 2 includes a probe assembly 16 and a probe adjusting seat, where the probe assembly 16 is provided on the probe adjusting seat. As shown in fig. 5, the probe adjusting seat is provided with a first fixing block 25, a second horizontal adjusting plate 24, a second fixing block 23 and a third horizontal adjusting plate 22 in sequence from bottom to top along the height direction, wherein the first fixing block 25 is fixedly connected with the first disc 4, the second horizontal adjusting plate 24 is fixedly connected with the second fixing block 23, the first fixing block 25 is slidably connected with the second horizontal adjusting plate 24, the second fixing block 23 is slidably connected with the third horizontal adjusting plate 22, and the sliding directions of the second horizontal adjusting plate 24 and the third horizontal adjusting plate 22 are vertically set. The first fixing block 25 is provided with an L-shaped adjusting end, the adjusting end is provided with a second horizontal adjusting piece 21, and the second horizontal adjusting piece 21 is abutted with the side face of the second horizontal adjusting plate 24. Specifically, the second leveling member 21 is a micro head. After the positions of the second horizontal adjustment plate 24 and the first fixing block 25 are adjusted, they are fixed by a locking member provided at one side of the second horizontal adjustment plate 24. The second fixing block 23 is provided with an L-shaped adjusting end, the adjusting end is provided with a third horizontal adjusting piece 20, and the third horizontal adjusting piece 20 is abutted with the side face of the third horizontal adjusting plate 22. Specifically, the third leveling member 20 is a micro-head. After the positions of the third horizontal adjustment plate 22 and the second fixing block 23 are adjusted, they are fixed by a locking member provided at one side of the third horizontal adjustment plate 22. In order to adjust the probe assembly 16 along the height direction, as shown in fig. 5, a height fixing block 19 and a height adjusting plate 17 are further disposed on the third horizontal adjusting plate 22, the height fixing block 19 is fixedly connected with the third adjusting plate, the height fixing block 19 is slidably connected with the height adjusting plate 17, an L-shaped adjusting end is disposed on the height fixing block 19, a height adjusting member 18 is disposed on the adjusting end, and the height adjusting member 18 abuts against the side surface of the height adjusting plate 17. Specifically, the height adjustment member 18 is a differential head. After the positions of the height adjusting plate 17 and the height fixing block 19 are adjusted, they are fixed by a locking member provided at one side of the height adjusting plate 17.
In order to perform high-temperature detection on the chip 10 to be detected on the same chip tester, as shown in fig. 1, the chip tester further comprises a base 5, wherein a first disc 4 and a second disc 6 which are arranged at intervals are arranged on the base 5, a third disc 7 is arranged in the second disc 6, and the second disc 6 and the third disc 7 are coaxially arranged and rotationally connected. For placing the chip 10 to be tested, a test bench 8 and a second probe device 9 are arranged on the third disc 7, and the second probe device 9 is positioned on one side of the test bench 8, wherein the structures of the second probe device 9 and the first probe device 2 are identical. For the chip of fixed placement on testboard 8, testboard 8 is equipped with six absorption holes that an air flue and equidistant setting, and every absorption hole all link up the setting with the air flue, and the air flue mouth is connected with the evacuation structure. In order to raise the temperature of the test bench 8, a heater and a thermometer are also provided in the test bench 8.
In the specific implementation process, in the normal temperature test state, the light field of the photosensitive surface of the chip 10 to be detected needs to be tested, the chip 10 to be detected is placed in the groove 12, that is, the photosensitive surface is in the joint between the back surface and the surface of the groove 12, and one right angle of the chip 10 to be detected is in joint with the second fixing part of the groove 12, then the first horizontal adjusting plate 14 is moved to drive the first fixing part of the fixing plate 11 to move, and after the position of the first fixing part is adjusted, the first fixing part fixes the other right angle on the diagonal line of the chip 10 to be detected. The light source is turned on, light emitted by the light source irradiates the photosensitive surface, the probe assembly 16 is adjusted in the horizontal direction and the height direction through the probe adjusting seat, after adjustment, the probe is electrified in contact with the surface of the chip 10 to be detected, then a PD receiver of the chip tester receives light signals, the PD receiver is connected with a signal amplification acquisition board, the PD receiver converts the light signals into electric signals and transmits the electric signals to the signal amplification acquisition board for data acquisition, electric characteristic data calculation processing is carried out, and electric characteristic grade classification is carried out according to judgment conditions. Under the high temperature test state, the front of the chip 10 to be detected needs to be irradiated with light, the heater firstly heats the test bench 8, after the temperature detector detects that the temperature meets the requirement, the chip 10 to be detected is placed on the adsorption hole, the vacuumizing structure extracts air in the air passage and the adsorption hole, the chip 10 to be detected is firmly placed on the test bench 8, the probe assembly 16 is subjected to position adjustment in the horizontal and height directions through the probe adjusting seat, the probe is electrified in contact with the surface of the chip 10 to be detected after the adjustment is finished, and then the PD receiver of the chip tester receives the optical signals.
As an alternative embodiment, the first level adjustment member 13, the second level adjustment member 21, the third level adjustment member 20 and the height adjustment member 18 may also be screws.
Alternatively, the number of adsorption holes may be 1, 2, 3 or even more.
Alternatively, the recess 12 may be rectangular or other structures having a right angle.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (9)
1. The utility model provides a fixing device which characterized in that is applicable to the chip test field, includes:
the device comprises a fixing plate (11), wherein the fixing plate (11) is provided with a fixing end, and the fixing end is provided with at least one first fixing part matched with a chip (10) to be detected;
the light transmission table (3), the light transmission table (3) is provided with a groove (12) suitable for placing the chip (10) to be detected, the groove (12) is provided with at least one second fixing part matched with the chip (10) to be detected, the fixing end extends into the groove (12), and the second fixing part of the groove (12) and the first fixing part of the fixing end are respectively arranged on two opposite sides of the chip (10) to be detected, so that the chip (10) to be detected is kept fixed;
the groove (12) is of a quarter-circle structure with a right angle;
the fixing plate (11) is arranged at an acute angle with the surface of the groove (12).
2. The fixing device according to claim 1, wherein the chip (10) to be tested is rectangular, and the first fixing portion and the second fixing portion are right-angle bayonets.
3. The fixing device according to claim 1, further comprising a horizontal adjusting seat (1), wherein one end of the fixing plate (11) away from the fixing end is fixedly connected with the horizontal adjusting seat (1), the horizontal adjusting seat (1) is sequentially provided with a bottom plate (15) and a first horizontal adjusting plate (14) from bottom to top along the height direction, and the first horizontal adjusting plate (14) is in sliding connection with the bottom plate (15).
4. A fixing device according to claim 3, characterized in that the bottom plate (15) is provided with an extending end, the extending end is provided with a first horizontal adjusting member (13), the first horizontal adjusting member (13) is abutted against the side surface of the first horizontal adjusting plate (14), and the first horizontal adjusting member (13) and the fixing plate (11) are respectively arranged on two sides of the first horizontal adjusting plate (14).
5. The fixture according to claim 1, wherein the transparent table (3) is made of glass.
6. A chip testing machine, characterized by comprising the fixing device according to any one of claims 1-5, and further comprising a first disc (4), wherein the light-transmitting table (3) is arranged on the first disc (4), and a light source arranged towards the light-transmitting table (3) is arranged in the first disc (4).
7. The chip tester according to claim 6, further comprising a first probe device (2) provided on the first disk (4), the first probe device (2) comprising a probe assembly and a probe adjustment seat, the probe assembly being provided on the probe adjustment seat.
8. The chip tester according to claim 7, further comprising a base (5), wherein a first disc (4) and a second disc (6) are respectively arranged on the base (5) at intervals, a third disc (7) is further arranged in the second disc (6), the second disc (6) and the third disc (7) are rotationally connected, a test table (8) and a second probe device (9) are arranged on the third disc (7), and the second probe device (9) is located on one side of the test table (8).
9. Chip tester according to claim 8, characterized in that the test bench (8) is provided with at least one air channel and at least one suction hole, the suction hole being adapted to place the chip (10) to be tested, the suction hole and the air channel being arranged through, the air channel being connected with a vacuum-pumping structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210946988.5A CN115267271B (en) | 2022-08-08 | 2022-08-08 | Fixing device and chip testing machine with same |
| PCT/CN2022/117465 WO2024031770A1 (en) | 2022-08-08 | 2022-09-07 | Fixing device and chip testing machine having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210946988.5A CN115267271B (en) | 2022-08-08 | 2022-08-08 | Fixing device and chip testing machine with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115267271A CN115267271A (en) | 2022-11-01 |
| CN115267271B true CN115267271B (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210946988.5A Active CN115267271B (en) | 2022-08-08 | 2022-08-08 | Fixing device and chip testing machine with same |
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| Country | Link |
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| CN (1) | CN115267271B (en) |
| WO (1) | WO2024031770A1 (en) |
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| CN116296298B (en) * | 2023-05-19 | 2023-07-25 | 河北圣昊光电科技有限公司 | Optical fiber fixing structure and APD chip testing device |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08146082A (en) * | 1994-11-17 | 1996-06-07 | Oki Electric Ind Co Ltd | Method and apparatus for testing bare chip |
| CN203241443U (en) * | 2013-05-09 | 2013-10-16 | 金英杰 | Clamp of unpacked chip testing tool |
| CN103645352A (en) * | 2013-11-22 | 2014-03-19 | 上海华力微电子有限公司 | Micro-size chip fixing device |
| JP6692282B2 (en) * | 2016-12-05 | 2020-05-13 | 三菱電機株式会社 | Semiconductor chip test apparatus and semiconductor chip test method |
| CN208705518U (en) * | 2018-05-24 | 2019-04-05 | 深圳鑫振华光电科技有限公司 | A kind of optical chip group and optical chip group quality of finish check device |
| CN110579699A (en) * | 2019-09-20 | 2019-12-17 | 武汉电信器件有限公司 | Chip testing device |
| CN210668281U (en) * | 2019-12-06 | 2020-06-02 | 加特兰微电子科技(上海)有限公司 | Chip testing device and antenna packaging chip |
| CN211238205U (en) * | 2020-03-26 | 2020-08-11 | 深圳市长泰峰元器件有限公司 | Automatic clamping device for testing IC chip |
| CN111323696A (en) * | 2020-04-19 | 2020-06-23 | 大连优迅科技有限公司 | Laser chip testing device and testing method |
| CN111579964A (en) * | 2020-05-18 | 2020-08-25 | 马鞍山芯海科技有限公司 | Chip testing device with limiting structure |
| CN111653497A (en) * | 2020-06-12 | 2020-09-11 | 长江存储科技有限责任公司 | Test structure and test method |
| CN113237517A (en) * | 2021-06-07 | 2021-08-10 | 英铂科学仪器(上海)有限公司 | System and device for comprehensively detecting photoelectric characteristics of two sides of chip |
| CN113447792A (en) * | 2021-06-21 | 2021-09-28 | 武汉光迅科技股份有限公司 | Chip performance test system and test method |
| CN114325351A (en) * | 2022-03-15 | 2022-04-12 | 武汉普赛斯电子技术有限公司 | Laser chip testing device and laser chip testing method |
| CN114859214A (en) * | 2022-07-05 | 2022-08-05 | 深圳市标谱半导体科技有限公司 | Chip testing device |
-
2022
- 2022-08-08 CN CN202210946988.5A patent/CN115267271B/en active Active
- 2022-09-07 WO PCT/CN2022/117465 patent/WO2024031770A1/en unknown
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| Publication number | Publication date |
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| WO2024031770A1 (en) | 2024-02-15 |
| CN115267271A (en) | 2022-11-01 |
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