CN115261954A - 电镀装置及利用其的电镀方法 - Google Patents
电镀装置及利用其的电镀方法 Download PDFInfo
- Publication number
- CN115261954A CN115261954A CN202110526823.8A CN202110526823A CN115261954A CN 115261954 A CN115261954 A CN 115261954A CN 202110526823 A CN202110526823 A CN 202110526823A CN 115261954 A CN115261954 A CN 115261954A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- anode
- plating
- substrate
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000009713 electroplating Methods 0.000 title claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 185
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 230000033001 locomotion Effects 0.000 claims abstract description 16
- 239000007921 spray Substances 0.000 claims abstract description 10
- 238000005507 spraying Methods 0.000 claims description 8
- 239000000243 solution Substances 0.000 description 76
- 238000011084 recovery Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004680 force modulation microscopy Methods 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002198 insoluble material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 239000002195 soluble material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2021-0056477 | 2021-04-30 | ||
| KR1020210056477A KR20220149188A (ko) | 2021-04-30 | 2021-04-30 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115261954A true CN115261954A (zh) | 2022-11-01 |
Family
ID=83745647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110526823.8A Pending CN115261954A (zh) | 2021-04-30 | 2021-05-14 | 电镀装置及利用其的电镀方法 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20220149188A (ko) |
| CN (1) | CN115261954A (ko) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3862891A (en) * | 1973-09-24 | 1975-01-28 | Gte Automatic Electric Lab Inc | Uniform plating current apparatus and method |
| CN203096212U (zh) * | 2013-02-03 | 2013-07-31 | 余胜东 | 金属纳米电镀设备 |
| KR20180000133A (ko) * | 2016-06-22 | 2018-01-02 | (주)포인텍 | 애노드 이동형 수평도금장치 |
| KR20180089731A (ko) * | 2017-02-01 | 2018-08-09 | 주식회사 에스이에이 | 수평식 도금장치 및 이를 이용한 도금방법 |
| WO2019190115A1 (ko) * | 2018-03-28 | 2019-10-03 | 주식회사 익스톨 | 수평 도금 장치 및 방법 |
| CN111378997A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 电镀设备和使用该电镀设备的电镀方法 |
| CN111378996A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 电镀设备和使用该电镀设备的电镀方法 |
| CN111379007A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 用于电铸的设备以及用于水平电铸的设备 |
-
2021
- 2021-04-30 KR KR1020210056477A patent/KR20220149188A/ko not_active Application Discontinuation
- 2021-05-14 CN CN202110526823.8A patent/CN115261954A/zh active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3862891A (en) * | 1973-09-24 | 1975-01-28 | Gte Automatic Electric Lab Inc | Uniform plating current apparatus and method |
| CN203096212U (zh) * | 2013-02-03 | 2013-07-31 | 余胜东 | 金属纳米电镀设备 |
| KR20180000133A (ko) * | 2016-06-22 | 2018-01-02 | (주)포인텍 | 애노드 이동형 수평도금장치 |
| KR20180089731A (ko) * | 2017-02-01 | 2018-08-09 | 주식회사 에스이에이 | 수평식 도금장치 및 이를 이용한 도금방법 |
| WO2019190115A1 (ko) * | 2018-03-28 | 2019-10-03 | 주식회사 익스톨 | 수평 도금 장치 및 방법 |
| CN111886366A (zh) * | 2018-03-28 | 2020-11-03 | 易伺特株式会社 | 水平电镀装置以及方法 |
| CN111378997A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 电镀设备和使用该电镀设备的电镀方法 |
| CN111378996A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 电镀设备和使用该电镀设备的电镀方法 |
| CN111379007A (zh) * | 2018-12-31 | 2020-07-07 | 乐金显示有限公司 | 用于电铸的设备以及用于水平电铸的设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220149188A (ko) | 2022-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |