CN115260823A - 一种无卤pcb防焊油墨剥离剂 - Google Patents
一种无卤pcb防焊油墨剥离剂 Download PDFInfo
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- XDDAORKBJWWYJS-UHFFFAOYSA-N glyphosate Chemical group OC(=O)CNCP(O)(O)=O XDDAORKBJWWYJS-UHFFFAOYSA-N 0.000 claims description 2
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- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical group C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
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- C09D9/00—Chemical paint or ink removers
- C09D9/04—Chemical paint or ink removers with surface-active agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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Abstract
本发明公开了一种无卤PCB防焊油墨剥离剂,包括:有机碱、表面活性剂,铜面保护剂,水;其中,各成分的含量按质量百分比计算,有机碱为10‑60%,表面活性剂的含量为0.5‑8%,铜面保护剂的含量为0.001‑0.2%,余量为水。本发明对无卤PCB防焊油墨的剥离效果极佳,且处理后的无卤PCB基材不会漏织纹和白圈。有效的解决了无卤PCB板易漏织纹和白圈的技术难点。也适用于各类PCB防焊油墨的剥除。剥离后的防焊油墨呈细粉末状沉于槽底,废液易处理。成分简单,成本低廉,具有巨大的市场应用价。
Description
技术领域
本发明涉及印制线路板化学清洗试剂技术领域,尤其涉及的是一种无卤PCB防焊油墨剥离剂。
背景技术
环氧树脂属于易燃物质,通过添加氯、溴等卤素元素可以提高环氧树脂的阻燃性能。目前最常用的是四溴双酚A阻燃剂。溴化阻燃剂在500-600℃无氧或缺氧条件下,易生成多溴代二苯并呋喃和多溴代二苯并二嗯英等有毒有害物质。且大部分溴化阻燃剂为脂溶性,容易累积在人体内,对身体造成很大的危害。因此,对无卤PCB板的研发和开发成为电路板领域的热点。
PCB的无卤化既要确保不用或少用(大部分标准规定卤素含量少于某一限值时即属于无卤产品)卤素添加剂,又要保证PCB的性能和质量符合相关标准。无卤PCB板通常是使用磷、氮、硅元素或具有特殊化学结构的阻燃型环氧树脂和无卤的防焊油墨。但磷、氮、硅元素的添加,较有卤PCB板而言,树脂基材的极性会降低。因此无卤PCB板浸泡在剥离剂中,润湿性会有明显的下降,导致防焊油墨不易清洗和清洗不净的问题。在实际的剥离过程中,发现,无卤PCB板的耐碱性明显较普通有卤PCB板的差,无卤PCB树脂基材有明显的漏织纹现象,在焊点位置,明显有白圈现象。
因此,现有技术存在缺陷,需要改进。
发明内容
本发明所要解决的技术问题是:提供一种解决无卤PCB防焊油墨在剥离过程中,极易出现漏织纹和白圈的问题,且能快速对防焊油墨进行剥离,铜面无损伤不发黑的无卤PCB防焊油墨剥离剂。
本发明的技术方案如下:一种无卤PCB防焊油墨剥离剂,包括:有机碱、表面活性剂,铜面保护剂,水;其中,各成分的含量按质量百分比计算,有机碱为10-60%,表面活性剂的含量为0.5-8%,铜面保护剂的含量为0.001-0.2%,余量为水。
应用于上述技术方案,所述的无卤PCB防焊油墨剥离剂中,所述表面活性剂为非离子表面活性剂、阴离子表面活性剂、阳离子表面活性剂中的至少两种表面活性剂。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述的表面活性剂为烷基苯磺酸表面活性剂、膦酰基盐类表面活性剂、氨基酸盐表面活性剂、聚季铵盐表面活性剂、聚醚表面活性剂,聚醇醚表面活性剂、聚乙烯吡咯烷酮、N-甲基吡咯烷酮、咪唑、乙烯基咪唑及咪唑杂环衍生物表面活性剂以及磷酸酯类表面活性剂中的两种或多种复配。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述烷基苯磺酸表面活性剂为十烷基二苯醚二磺酸钠、或十二烷基二苯醚二磺酸钠、或十二烷基苯磺酸。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述膦酰基类盐表面活性剂为N-(膦酰基甲基)甘氨酸异丙酸盐、或Alpha-膦酰基-Ω-(甲基苯氧基)-聚(氧-1,2-乙二基)二钾盐。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述氨基酸表面活性剂为N-(2-羟乙基)-N-(2-乙基己基)Β-丙氨酸单钠盐。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述季铵盐表面活性剂为聚季铵盐-6、或聚季铵盐-47、或聚季铵盐-28、或聚季铵盐-55。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述聚醚类表面活性剂为聚氧乙烯醚类表面活性剂、或聚环氧乙烷聚环氧丙烷单丁基醚、或聚醚改性硅氧烷类表面活性剂。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述磷酸酯类表面活性剂为十六醇磷酸酯、或三硅氧烷聚氧乙烯醚磷酸酯、或十二烷基磷酸酯、或月桂醇醚磷酸酯、或异辛醇聚氧乙烯醚磷酸酯。
应用于上述各个技术方案,所述的无卤PCB防焊油墨剥离剂中,所述有机碱为胆碱、四甲基氢氧化铵、四丁基氢氧化铵、乙二胺、二乙胺、三乙烯二胺、乙醇胺、三乙醇胺、二乙醇胺中的一种或多种;所述铜面保护剂为咪唑或氮唑及其衍生物。
本发明的有益效果为:本发明通过在无卤PCB防焊油墨剥离剂中添加表面活性剂,经过一定的研究配方,使用两种或多种表面活性剂的混合物,在合适的特定条件下,在一定的配比下,非离子、阴、阳离子表面活性剂混合可产生强烈的增效作用,可大大降低溶液的表面张力,进而,加速防焊油墨的清洗和脱落,从而使得本发明的无卤PCB防焊油墨剥离剂对无卤PCB防焊油墨的剥离效果极佳,且处理后的无卤PCB基材不会漏织纹和白圈。有效的解决了无卤PCB板易漏织纹和白圈的技术难点。同时,也适用于各类PCB防焊油墨的剥除。剥离后的防焊油墨呈细粉末状沉于槽底,废液易处理。成分简单,成本低廉,具有巨大的市场应用价。
具体实施方式
以下具体实施例,对本发明进行详细说明。
实施例1
实施例1涉及的无卤PCB防焊油墨剥离剂,由以下成分按照质量百分比配制而成。其中,胆碱:30%,聚乙烯吡咯烷酮:0.8%,聚季铵盐-6:2%,咪唑:0.1%,水:67.1%。按此比例混合,搅拌均匀。将烘烤后的无卤PCB板浸泡在75℃的该剥离试剂25min,并加以超声波清洗,用清水冲洗并吹干,完成PCB防焊油墨的剥离。
实施例2
实施例2涉及的无卤PCB防焊油墨剥离剂,由以下成分按照质量百分比配制而成。其中,胆碱:20%,乙醇胺:15%,聚乙烯吡咯烷酮:0.8%,聚季铵盐-6:2%,咪唑:0.1%,水:62.1%。按此比例混合,搅拌均匀。将烘烤后的无卤PCB板浸泡在75℃的该剥离试剂21min,并加以超声波清洗,用清水冲洗并吹干,完成PCB防焊油墨的剥离。
实施例3
实施例3涉及的无卤PCB防焊油墨剥离剂,由以下成分按照质量百分比配制而成。其中,四甲基氢氧化铵:20%,乙醇胺:15%,聚季铵盐-6:2%,十烷基二苯醚二磺酸钠:1%,咪唑:0.1%,水:61.9%。按此比例混合,搅拌均匀。将烘烤后的无卤PCB板浸泡在75℃的该剥离试剂18min,并加以超声波清洗,用清水冲洗并吹干,完成PCB防焊油墨的剥离。
实施例4
实施例4涉及的无卤PCB防焊油墨剥离剂,由以下成分按照质量百分比配制而成。三乙烯二胺:10%,乙二胺:30%,聚季铵盐-6:2%,十烷基二苯醚二磺酸钠:1%,苯并三氮唑:0.01%,水:56.9%。按此比例混合,搅拌均匀。将烘烤后的无卤PCB板浸泡在80℃的该剥离试剂28min,并加以超声波清洗,用清水冲洗并吹干,完成PCB防焊油墨的剥离。
以上实施例1-4配置的无卤PCB防焊油墨剥离剂对无卤PCB防焊油墨的剥离效果极佳,且处理后的无卤PCB基材不会漏织纹和白圈。有效的解决了无卤PCB板易漏织纹和白圈的技术难点。
以上仅为本发明的较佳实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种无卤PCB防焊油墨剥离剂,其特征在于,包括:有机碱、表面活性剂,铜面保护剂,水;其中,各成分的含量按质量百分比计算,有机碱为10-60%,表面活性剂的含量为0.5-8%,铜面保护剂的含量为0.001-0.2%,余量为水。
2.根据权利要求1所述的无卤PCB防焊油墨剥离剂,其特征在于,所述表面活性剂为非离子表面活性剂、阴离子表面活性剂、阳离子表面活性剂中的至少两种表面活性剂。
3.根据权利要求2所述的无卤PCB防焊油墨剥离剂,其特征在于,所述的表面活性剂为烷基苯磺酸表面活性剂、膦酰基盐类表面活性剂、氨基酸盐表面活性剂、聚季铵盐表面活性剂、聚醚表面活性剂,聚醇醚表面活性剂、聚乙烯吡咯烷酮、N-甲基吡咯烷酮、咪唑、乙烯基咪唑及咪唑杂环衍生物表面活性剂以及磷酸酯类表面活性剂中的两种或多种复配。
4.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,其特征在于:所述烷基苯磺酸表面活性剂为十烷基二苯醚二磺酸钠、或十二烷基二苯醚二磺酸钠、或十二烷基苯磺酸。
5.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,所述膦酰基类盐表面活性剂为N-(膦酰基甲基)甘氨酸异丙酸盐、或Alpha-膦酰基-Ω-(甲基苯氧基)-聚(氧-1,2-乙二基)二钾盐。
6.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,所述氨基酸表面活性剂为N-(2-羟乙基)-N-(2-乙基己基)Β-丙氨酸单钠盐。
7.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,所述季铵盐表面活性剂为聚季铵盐-6、或聚季铵盐-47、或聚季铵盐-28、或聚季铵盐-55。
8.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,所述聚醚类表面活性剂为聚氧乙烯醚类表面活性剂、或聚环氧乙烷聚环氧丙烷单丁基醚、或聚醚改性硅氧烷类表面活性剂。
9.根据权利要求3所述的无卤PCB防焊油墨剥离剂,其特征在于,所述磷酸酯类表面活性剂为十六醇磷酸酯、或三硅氧烷聚氧乙烯醚磷酸酯、或十二烷基磷酸酯、或月桂醇醚磷酸酯、或异辛醇聚氧乙烯醚磷酸酯。
10.根据权利要求1所述的无卤PCB防焊油墨剥离剂,其特征在于,所述有机碱为胆碱、四甲基氢氧化铵、四丁基氢氧化铵、乙二胺、二乙胺、三乙烯二胺、乙醇胺、三乙醇胺、二乙醇胺中的一种或多种;所述铜面保护剂为咪唑或氮唑及其衍生物。
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