CN115250584A - Circuit board with heat dissipation function and manufacturing method thereof - Google Patents
Circuit board with heat dissipation function and manufacturing method thereof Download PDFInfo
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- CN115250584A CN115250584A CN202110468463.0A CN202110468463A CN115250584A CN 115250584 A CN115250584 A CN 115250584A CN 202110468463 A CN202110468463 A CN 202110468463A CN 115250584 A CN115250584 A CN 115250584A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 title abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 114
- 239000002184 metal Substances 0.000 claims abstract description 114
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 326
- 239000000463 material Substances 0.000 claims description 15
- -1 potassium nitride Chemical class 0.000 claims description 12
- 238000000926 separation method Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 239000011591 potassium Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 12
- 239000007769 metal material Substances 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920006380 polyphenylene oxide Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
The application provides a manufacturing method of a circuit board with a heat dissipation function, which comprises the following steps: providing a substrate; forming a first conductive circuit layer on the substrate; forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer; filling metal in the first through hole to form a first heat conducting part; forming a second conductive circuit layer, a second insulating layer and a copper foil layer on the first insulating layer to obtain an intermediate; a groove is formed in the intermediate body; forming a second heat conduction part in the groove; forming a copper plating layer on the copper foil layer and the second heat conduction portion; and etching the copper plating layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board. The circuit board manufactured by the manufacturing method has a good heat dissipation effect. The application also provides a circuit board manufactured by the manufacturing method.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation function and a manufacturing method thereof.
Background
With the development of the 5G technology, electronic products are being developed toward high integration and miniaturization, so that the packaging density of electronic components is higher and higher, and the power consumption is higher and higher. Therefore, the heat dissipation requirement of the circuit board in the electronic product is also higher and higher. The heat dispersion of present circuit board can not satisfy the demand.
Disclosure of Invention
In view of this, the present application provides a method for manufacturing a circuit board with a good heat dissipation effect.
In addition, a circuit board manufactured by the manufacturing method is also needed to be provided.
The application provides a manufacturing method of a circuit board, which comprises the following steps:
providing a substrate, wherein the substrate comprises a metal layer and an adhesive layer, the metal layer comprises a body and a first cylinder convexly arranged on the body, a slot is formed between the body and the first cylinder, and the adhesive layer is arranged in the slot;
forming a first conductive circuit layer on the surface of the substrate to thermally conduct the first conductive circuit layer with the first pillar;
forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer and corresponds to the first conductive circuit layer;
filling metal in the first through hole to form a first heat conducting part;
forming a second conductive circuit layer on the first insulating layer, wherein the second conductive circuit layer is in thermal conduction with the first conductive circuit layer through the first heat conduction part;
sequentially forming a second insulating layer and a copper foil layer on the second conductive circuit layer to obtain an intermediate;
a groove is formed in the intermediate body, the groove sequentially penetrates through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part;
filling the metal in the groove to form a second heat conducting part;
forming a copper plated layer on the copper foil layer and the second heat conduction portion; and
and etching the copper plating layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board.
The present application further provides a circuit board, including:
the substrate comprises a metal layer and an adhesive layer, the metal layer comprises a body and a first cylinder convexly arranged on the body, a slot is formed between the body and the first cylinder, and the adhesive layer is arranged in the slot;
a first conductive trace layer on a surface of the substrate, the first conductive trace layer in thermal communication with the first pillar;
a first insulating layer located on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer, corresponds to the first conductive circuit layer, and is filled with metal to form a first heat conducting part;
a second conductive trace layer on the first insulating layer, the second conductive trace layer being in thermal communication with the first conductive trace layer through the first heat conduction portion;
the second insulating layer is positioned on the second conducting circuit layer; and
the third conductive circuit layer is positioned on the second insulating layer;
the circuit board is provided with a groove, the groove penetrates through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, the groove corresponds to the first heat conducting portion, and the groove is filled with metal to form a second heat conducting portion.
This application sets up on the base plate first conducting wire layer second conducting wire layer and third conducting wire layer, and set up under the second conducting wire layer first heat-conducting portion, and set up under the third conducting wire layer second heat-conducting portion, thereby make the heat that first conducting wire layer produced transmits the metal level, the heat that second conducting wire layer produced transmits first heat-conducting portion, the heat that third conducting wire layer produced transmits the second heat-conducting portion, and makes first conducting wire layer second conducting wire layer with can heat switch on between the third conducting wire layer, and then improved the radiating effect of circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a substrate according to some embodiments of the present disclosure.
Fig. 2 is a schematic structural diagram after first conductive trace layers are respectively formed on two opposite surfaces of the substrate shown in fig. 1.
Fig. 3 is a schematic structural diagram after a first insulating layer is formed on the first conductive trace layer shown in fig. 2.
Fig. 4 is a schematic structural diagram of the first insulating layer shown in fig. 3 after a first through hole is formed therein and a metal is filled in the first through hole.
Fig. 5 is a structural diagram illustrating a second conductive trace layer formed on the first insulating layer shown in fig. 4.
Fig. 6 is a schematic structural view illustrating a second insulating layer and a copper foil layer sequentially formed on the second conductive trace layer shown in fig. 5.
Fig. 7 is a schematic structural view of the intermediate body shown in fig. 6 after a groove and a second through hole are formed therein.
Fig. 8 is a schematic structural diagram of the groove and the second through hole shown in fig. 7 after metal is electroplated and filled.
Fig. 9 is a schematic view of the structure after plating metals on the copper foil layer, the second thermal conductive portion, and the third thermal conductive portion shown in fig. 8.
Fig. 10 is a schematic structural view of a wiring board obtained by etching the copper-plated layer and the copper foil layer shown in fig. 9.
Description of the main elements
First conductive trace layer 20
First insulating layer 30
First through hole 301
First heat conduction part 31
Second conductive trace layer 40
Second insulating layer 50
Intermediate 70
Second via hole 72
Second heat conduction part 75
Third heat conduction part 76
Third conductive trace layer 90
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
Some embodiments of the present application provide a method for manufacturing a circuit board, including the steps of:
in step S11, please refer to fig. 1, a substrate 10 is provided.
In some embodiments, the substrate 10 includes a metal layer 11 and two glue layers 12 disposed in the metal layer 11. The metal layer 11 includes a body 111, at least two first pillars 112, and a second pillar 113. The first cylinder 112 and the second cylinder 113 are both arranged on the surface of the body 111 in a protruding manner. The second pillar 113 has a width greater than that of the first pillar 112 in the extending direction of the metal layer 11. A slot 13 is defined between the body 111 and the first column 112 and between the body 111 and the second column 113. Wherein, two of the glue layers 12 are respectively located in the slot 13, and the surface of the first pillar 112 or the second pillar 113 is substantially flush with the surface of the glue layer 12.
In some embodiments, the metal layer 11 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive portion and the heat conductive portion are in different positions.
In some embodiments, the material of the metal layer 11 is aluminum nitride or potassium nitride. The metal layer 11 has good heat conductivity and certain electrical conductivity. In some embodiments, the glue layer 12 may be an acrylic glue (AD glue).
In step S12, referring to fig. 2, first conductive trace layers 20 are respectively formed on two opposite surfaces of the substrate 10.
Specifically, copper foil layers (not shown) are respectively formed on two opposite surfaces of the substrate 10, and the two copper foil layers are respectively etched to form two first conductive trace layers 20. The second pillars 113 correspond to the line gaps of the first conductive line trace layer 20.
The two first conductive circuit layers 20 are connected to the first pillar 112, so as to be thermally conducted to the metal layer 11, so that heat generated by the two first conductive circuit layers 20 is transmitted to the metal layer 11, and the metal layer 11 is made of a metal material, so that the heat can be absorbed or dissipated to the outside, and thus the temperature of the two first conductive circuit layers 20 is reduced.
In step S13, referring to fig. 3, first insulating layers 30 are respectively formed on the two first conductive trace layers 20.
The material of the first insulating layer 30 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the material of the first insulating layer 30 is polypropylene.
In step S14, referring to fig. 4, at least one first through hole 301 is formed in each of the two first insulating layers 30.
Specifically, the first through hole 301 may be formed by laser cutting.
Each of the first through holes 301 penetrates through the first insulating layer 30, and each of the first through holes 301 corresponds to the first conductive line layer 20. That is, the bottom of each first via hole 301 is the first conductive trace layer 20.
In step S15, each of the first through holes 301 is filled with metal to form a first heat conducting portion 31.
The first heat conducting portion 31 is in thermal conduction with the corresponding first conductive trace layer 20.
In some embodiments, the metal is a thermoelectric separation metal.
In some embodiments, the metal is aluminum nitride or potassium nitride.
In step S16, referring to fig. 5, second conductive trace layers 40 are respectively formed on the two first insulating layers 30.
Specifically, two copper foil layers (not shown) are formed on the two first insulating layers 30, respectively, and are etched to form two second conductive trace layers 40, respectively.
The heat generated by the two second conductive trace layers 40 can be transmitted to the first heat conducting portion 31, and the first heat conducting portion 31 is made of a metal material, so that the heat can be absorbed, and the temperature of the two second conductive trace layers 40 is reduced. Meanwhile, the first heat conducting part 31 is in thermal conduction with the first conductive circuit layer 20, so that heat generated by the second conductive circuit layer 40 can also be transmitted to the metal layer 11 sequentially through the first heat conducting part 31 and the first conductive circuit layer 20, and the metal layer 11 absorbs the heat or radiates the heat to the outside.
In step S17, referring to fig. 6, a second insulating layer 50 and a copper foil layer 60 are sequentially formed on the two second conductive trace layers 40, respectively, so as to obtain an intermediate 70.
The material of the second insulating layer 50 may be the same as the material of the first insulating layer 30, and specifically, the material of the first insulating layer 30 may be referred to, which is not described herein again.
In step S18, referring to fig. 7, at least two grooves 71 and at least one second through hole 72 are formed in the middle body 70.
Specifically, the groove 71 and the second through hole 72 may be formed by laser cutting.
Wherein, two grooves 71 are respectively positioned on two opposite surfaces of the middle body 70. Each of the grooves 71 sequentially penetrates the copper foil layer 60 and the second insulating layer 50. The bottom of each groove 71 corresponds to the second conductive trace layer 40, and each groove 71 corresponds to the first heat conducting portion 31.
In some embodiments, each of the grooves 71 includes an opening 701 formed on the copper foil layer 60, and the inner diameter of the groove 71 decreases from the opening 701 to the bottom of the groove 71.
Each of the second through holes 72 penetrates the intermediate body 70. Specifically, each of the second through holes 72 sequentially penetrates through the copper foil layer 60, the second insulating layer 50, the second conductive trace layer 40, the first insulating layer 30, the first conductive trace layer 20, the substrate 10, the first conductive trace layer 20, the first insulating layer 30, the second conductive trace layer 40, the second insulating layer 50, and the copper foil layer 60.
In step S19, referring to fig. 8, at least the inner walls of each of the grooves 71 and each of the second through holes 72 are plated with metal to form a first metal layer 73 and a second metal layer 74, and then each of the grooves 71 having the first metal layer 73 and each of the second through holes 72 having the second metal layer 74 are filled with the metal to form a second heat conducting portion 75 and a third heat conducting portion 76, respectively.
In some embodiments, the first metal layer 73 is disposed on the inner wall of the groove 71 and the bottom of the groove 71. In other embodiments, the first metal layer 73 may be disposed only on the inner wall of the groove 71. Wherein the second metal layer 74 is disposed on an inner wall of the second via hole 72.
In some embodiments, the material of the first metal layer 73 and the second metal layer 74 may be copper.
In step S20, referring to fig. 9, metal is plated on each of the copper foil layers 60, the second thermal conductive portions 75, and the third thermal conductive portions 76 to form two copper plated layers 80.
In step S21, referring to fig. 10, each copper plating layer 80 and each copper foil layer 60 are etched to form two third conductive trace layers 90, respectively, so as to obtain the circuit board 100.
The heat generated by the two third conductive circuit layers 90 can be transmitted to the second heat conduction portion 75, and the second heat conduction portion 75 is made of a metal material, so that the heat can be absorbed, and the temperature of the two third conductive circuit layers 90 is reduced. Meanwhile, the second heat conducting portion 75 is in thermal conduction with the first metal layer 73 and the second conductive circuit layer 40, so that heat generated by the third conductive circuit layer 90 can also be transmitted to the metal layer 11 sequentially through the second heat conducting portion 75, the first metal layer 73, the second conductive circuit layer 40, the first heat conducting portion 31 and the first conductive circuit layer 20, and the metal layer 11 absorbs the heat or radiates the heat to the outside.
In addition, the heat generated by the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90 can also be transmitted to the third heat conducting portion 76, and since the third heat conducting portion 76 is made of a metal material, the heat can be absorbed, so that the temperature of the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90 itself is reduced. Meanwhile, the heat generated by the second conductive trace layer 40 and the third conductive trace layer 90 can also be directly transmitted to the metal layer 11 through the third thermal conduction portion 76, and the metal layer 11 absorbs the heat or emits the heat to the outside.
The second metal layer 74 can be used to electrically connect the first conductive trace layer 20, the second conductive trace layer 40 and the third conductive trace layer 90.
The present application may also mount electronic components (not shown) on each of the third conductive trace layers 90. Heat generated by the electronic component may be transmitted to the first heat conduction portion 31, the second heat conduction portion 75, the third heat conduction portion 76, and the metal layer 11.
Referring to fig. 10, some embodiments of the present application further provide a circuit board 100, where the circuit board 100 includes a substrate 10, a first conductive trace layer 20, a first insulating layer 30, a second conductive trace layer 40, a second insulating layer 50, and a third conductive trace layer 90.
In some embodiments, the substrate 10 includes a metal layer 11 and two glue layers 12 disposed in the metal layer 11. The metal layer 11 includes a body 111, at least two first pillars 112, and a second pillar 113. The first cylinder 112 and the second cylinder 113 are both arranged on the surface of the body 111 in a protruding manner. The second pillar 113 has a width greater than that of the first pillar 112 in the extending direction of the metal layer 11. A slot 13 is defined between the body 111 and the first column 112 and between the body 111 and the second column 113. Wherein, two of the glue layers 12 are respectively located in the slot 13, and the surface of the first pillar 112 or the second pillar 113 is substantially flush with the surface of the glue layer 12.
In some embodiments, the metal layer 11 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive portion and the heat conductive portion are located at different positions.
In some embodiments, the material of the metal layer 11 is aluminum nitride or potassium nitride. The metal layer 11 has good heat conductivity and certain electrical conductivity. In some embodiments, the glue layer 12 may be an acrylic glue (AD glue).
The two first conductive circuit layers 20 are respectively located on two opposite surfaces of the substrate 10. The second pillars 113 correspond to line gaps of the first conductive line layers 20.
The two first conductive circuit layers 20 are connected to the first pillar 112, so as to be thermally conducted to the metal layer 11, so that heat generated by the two first conductive circuit layers 20 is transmitted to the metal layer 11, and the metal layer 11 is made of a metal material, so that the heat can be absorbed or dissipated to the outside, and thus the temperature of the two first conductive circuit layers 20 is reduced.
The two first insulating layers 30 are respectively located on the two first conductive trace layers 20. The material of the first insulating layer 30 may be one selected from epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene Oxide (PPO), polyimide (PI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), and the like. In this embodiment, the material of the first insulating layer 30 is polypropylene.
At least one first through hole 301 is formed in each of the two first insulating layers 30. Each of the first through holes 301 penetrates through the first insulating layer 30, and each of the first through holes 301 corresponds to the first conductive line layer 20. That is, the bottom of each first via hole 301 is the first conductive line layer 20. Each of the first through holes 301 is filled with metal to form a first heat conduction portion 31. The first heat conducting portion 31 is in thermal conduction with the corresponding first conductive trace layer 20.
In some embodiments, the metal is a thermoelectric separation metal.
In some embodiments, the metal is aluminum nitride or potassium nitride.
The two second conductive trace layers 40 are respectively located on the two first insulating layers 30. The heat generated by the two second conductive trace layers 40 can be transmitted to the first heat conducting portion 31, and the first heat conducting portion 31 is made of a metal material, so that the heat can be absorbed, and the temperature of the two second conductive trace layers 40 is reduced. Meanwhile, the first heat conducting part 31 is in thermal conduction with the first conductive circuit layer 20, so that heat generated by the second conductive circuit layer 40 can also be transmitted to the metal layer 11 sequentially through the first heat conducting part 31 and the first conductive circuit layer 20, and the metal layer 11 absorbs the heat or radiates the heat to the outside.
The two second insulating layers 50 are respectively located on the two second conductive trace layers 40. The material of the second insulating layer 50 may be the same as the material of the first insulating layer 30, and reference may be made to the material of the first insulating layer 30, which is not described herein again.
The two third conductive trace layers 90 are respectively located on the two second insulating layers 50. At least two grooves 71 and at least one second through hole 72 are formed in the circuit board 100. Each of the grooves 71 penetrates the second insulating layer 50. The bottom of each groove 71 corresponds to the second conductive trace layer 40, and each groove 71 corresponds to the first heat conducting portion 31. In some embodiments, each of the grooves 71 includes an opening 701 formed on the third conductive trace layer 90, and an inner diameter of the groove 71 decreases from the opening 701 to a bottom of the groove 71. Each of the second through holes 72 penetrates the circuit board 100.
At least the inner walls of each of the grooves 71 and each of the second through holes 72 are plated with metal to form a first metal layer 73 and a second metal layer 74, respectively, and then each of the grooves 71 having the first metal layer 73 and each of the second through holes 72 having the second metal layer 74 are filled with the metal to form a second heat conduction portion 75 and a third heat conduction portion 76, respectively.
In some embodiments, the first metal layer 73 is disposed on the inner wall of the groove 71 and the bottom of the groove 71. In other embodiments, the first metal layer 73 may be disposed only on the inner wall of the groove 71. Wherein the second metal layer 74 is disposed on an inner wall of the second via hole 72.
In some embodiments, the material of the first metal layer 73 and the second metal layer 74 may be copper.
The heat generated by the two third conductive circuit layers 90 can be transmitted to the second heat conduction portion 75, and the second heat conduction portion 75 is made of a metal material, so that the heat can be absorbed, and the temperature of the two third conductive circuit layers 90 is reduced. Meanwhile, the second heat conducting portion 75 is in thermal communication with the first metal layer 73 and the second conductive trace layer 40, so that heat generated by the third conductive trace layer 90 can be transmitted to the metal layer 11 sequentially through the second heat conducting portion 75, the first metal layer 73, the second conductive trace layer 40, the first heat conducting portion 31 and the first conductive trace layer 20, and the metal layer 11 absorbs the heat or emits the heat to the outside.
In addition, the heat generated by the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90 can also be transmitted to the third heat conducting portion 76, and since the third heat conducting portion 76 is made of a metal material, the heat can be absorbed, so that the temperature of the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90 itself is reduced. Meanwhile, the heat generated by the second conductive trace layer 40 and the third conductive trace layer 90 can also be directly transmitted to the metal layer 11 through the third thermal conduction portion 76, and the metal layer 11 absorbs the heat or emits the heat to the outside.
The second metal layer 74 can be used to electrically connect the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90.
The present application may also mount electronic components (not shown) on each of the third conductive trace layers 90. Heat generated by the electronic component may be transmitted to the first heat conduction portion 31, the second heat conduction portion 75, the third heat conduction portion 76, and the metal layer 11.
This application sets up on the base plate 10 first conducting wire layer 20, second conducting wire layer 40 and third conducting wire layer 90, and set up under second conducting wire layer 40 first heat-conducting portion 31, and set up under third conducting wire layer 90 second heat-conducting portion 75, thereby make the heat that first conducting wire layer 20 produced transmit to metal level 11, the heat that second conducting wire layer 40 produced transmits to first heat-conducting portion 31, the heat that third conducting wire layer 90 produced transmits to second heat-conducting portion 75, and makes first conducting wire layer 20 second conducting wire layer 40 with can heat switch on between the third conducting wire layer 90, and then improved the radiating effect of circuit board 100.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment. Other modifications and variations to the technical concept of the present application should fall within the scope of the present application for those skilled in the art.
Claims (10)
1. A manufacturing method of a circuit board is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a metal layer and an adhesive layer, the metal layer comprises a body and a first cylinder convexly arranged on the body, a slot is formed between the body and the first cylinder, and the adhesive layer is arranged in the slot;
forming a first conductive circuit layer on the surface of the substrate, so that the first conductive circuit layer is thermally conducted with the first pillar;
forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer and corresponds to the first conductive circuit layer;
filling metal in the first through hole to form a first heat conducting part;
forming a second conductive circuit layer on the first insulating layer, wherein the second conductive circuit layer is in thermal conduction with the first conductive circuit layer through the first heat conduction part;
sequentially forming a second insulating layer and a copper foil layer on the second conductive circuit layer to obtain an intermediate;
a groove is formed in the intermediate body, the groove sequentially penetrates through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part;
filling the metal in the groove to form a second heat conducting part;
forming a copper plated layer on the copper foil layer and the second heat conduction portion; and
and etching the copper plating layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board.
2. The method for manufacturing a wiring board according to claim 1, wherein after the recess is formed in the intermediate body, the method further comprises:
forming a second through hole in the intermediate body, wherein the through hole penetrates through the intermediate body;
filling the second through hole with the metal to form a third heat conduction part; and
forming the copper plating layer on the third heat conduction portion.
3. The method of manufacturing a wiring board according to claim 2, wherein after the recess is formed in the intermediate body, the method further comprises:
forming a first metal layer on at least an inner wall of the groove; and
a second metal layer is formed on at least an inner wall of the second via.
4. The method of claim 1, wherein the recess comprises an opening formed in the copper foil layer, and an inner diameter of the recess decreases from the opening to a bottom of the recess.
5. The method for manufacturing a circuit board according to claim 1, wherein the metal layer further includes a second post protruding from the body, the slot is formed between the body and the second post, and a width of the second post is greater than a width of the first post along an extending direction of the metal layer.
6. The method for manufacturing a circuit board according to claim 1, wherein the metal layer and the metal are both thermoelectric separation metals, and the thermoelectric separation metals are made of aluminum nitride or potassium nitride.
7. A circuit board, comprising:
the substrate comprises a metal layer and an adhesive layer, the metal layer comprises a body and a first cylinder convexly arranged on the body, a slot is formed between the body and the first cylinder, and the adhesive layer is arranged in the slot;
a first conductive trace layer on a surface of the substrate, the first conductive trace layer in thermal communication with the first pillar;
a first insulating layer located on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer, corresponds to the first conductive circuit layer, and is filled with metal to form a first heat conducting part;
a second conductive trace layer on the first insulating layer, the second conductive trace layer being in thermal communication with the first conductive trace layer through the first heat conduction portion;
the second insulating layer is positioned on the second conductive circuit layer; and
the third conductive circuit layer is positioned on the second insulating layer;
the circuit board is provided with a groove, the groove penetrates through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, the groove corresponds to the first heat conducting portion, and the groove is filled with metal to form a second heat conducting portion.
8. The wiring board of claim 7, wherein a second via is further formed in the wiring board, and the metal is filled in the second via to form a third heat conducting portion.
9. The wiring board of claim 8, wherein a first metal layer is formed at least on an inner wall of said recess, and a second metal layer is formed at least on an inner wall of said second via.
10. The wiring board according to claim 7, wherein the metal layer and the metal are both a thermoelectric separation metal, and the material of the thermoelectric separation metal is aluminum nitride or potassium nitride.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110468463.0A CN115250584A (en) | 2021-04-28 | 2021-04-28 | Circuit board with heat dissipation function and manufacturing method thereof |
| TW110140857A TWI823176B (en) | 2021-04-28 | 2021-11-02 | Circuit board with heat dissipation function and the making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110468463.0A CN115250584A (en) | 2021-04-28 | 2021-04-28 | Circuit board with heat dissipation function and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115250584A true CN115250584A (en) | 2022-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110468463.0A Pending CN115250584A (en) | 2021-04-28 | 2021-04-28 | Circuit board with heat dissipation function and manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN115250584A (en) |
| TW (1) | TWI823176B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4309448B2 (en) * | 2007-11-27 | 2009-08-05 | 株式会社東芝 | Multilayer printed wiring board, build-up printed wiring board manufacturing method, and electronic device |
| TWM408911U (en) * | 2011-01-13 | 2011-08-01 | Mao Bang Electronic Co Ltd | Multilayer circuit board structure |
| CN104113994A (en) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | Method for manufacturing printed circuit board by using novel and improved semi-additive process |
| TWI641095B (en) * | 2017-08-30 | 2018-11-11 | 欣興電子股份有限公司 | Structure and manufacture method of heat dissipation substrate, and package structure and method thereof |
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2021
- 2021-04-28 CN CN202110468463.0A patent/CN115250584A/en active Pending
- 2021-11-02 TW TW110140857A patent/TWI823176B/en active
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| TWI823176B (en) | 2023-11-21 |
| TW202243580A (en) | 2022-11-01 |
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