CN115243466A - A kind of depth control drilling tool and PCB back drilling depth control method - Google Patents
A kind of depth control drilling tool and PCB back drilling depth control method Download PDFInfo
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- CN115243466A CN115243466A CN202210949971.5A CN202210949971A CN115243466A CN 115243466 A CN115243466 A CN 115243466A CN 202210949971 A CN202210949971 A CN 202210949971A CN 115243466 A CN115243466 A CN 115243466A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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Abstract
Description
技术领域technical field
本发明涉及PCB(Printed Circuit Boards,印制电路板)技术领域,尤其涉及一种控深钻刀及PCB背钻控深方法。The invention relates to the technical field of PCB (Printed Circuit Boards, printed circuit boards), in particular to a depth-controlling drill and a depth-controlling method for PCB back drilling.
背景技术Background technique
随着5G无线网络的技术发展,通讯产品对PCB的高频、高速要求越来越高。在PCB制作工艺中,由于背钻的目的在于“去除金属化通孔信号层的多余孔铜,减少信号损失,避免信号失真”,因此背钻已然成为电路板制作工艺中的关键工序,而在该关键工序中如何提高背钻深度的控制精度尤为关键,然而目前并未能实现高精度的背钻深度控制。With the development of 5G wireless network technology, communication products have higher and higher requirements for high frequency and high speed of PCB. In the PCB manufacturing process, since the purpose of back drilling is to "remove redundant copper holes in the signal layer of metallized through holes, reduce signal loss and avoid signal distortion", back drilling has become a key process in the circuit board manufacturing process. In this key process, how to improve the control accuracy of the back drilling depth is particularly critical. However, high-precision back drilling depth control has not yet been achieved.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种控深钻刀及PCB背钻控深方法,以克服现有技术存在的背钻深度控制精度较低的缺陷。The purpose of the present invention is to provide a depth-controlling drill and a method for controlling the depth of PCB back-drilling, so as to overcome the defect of the low-precision back-drilling depth control existing in the prior art.
为达此目的,本发明采用以下技术方案:For this purpose, the present invention adopts the following technical solutions:
一种控深钻刀,包括沿长度方向依次设置的钻柄、钻颈和刀体,所述刀体包括导向部和钻尖,且所述导向部连接于钻颈和钻尖之间,所述控深钻刀还包括隔档部;A depth-controlling drill, comprising a drill shank, a drill neck and a cutter body arranged in sequence along a length direction, the cutter body comprising a guide portion and a drill tip, and the guide portion is connected between the drill neck and the drill tip, so that the The control depth drill also includes a partition;
所述隔档部安装于钻颈或刀体上的预设高度位置,使得所述刀体的位于隔档部底面与钻尖端面之间部分的长度为目标钻深,且在背钻工作状态下所述隔档部在PCB的背钻入钻面上的投影与对应背钻孔不重合。The partition portion is installed at a preset height position on the drill neck or the cutter body, so that the length of the portion of the cutter body located between the bottom surface of the partition portion and the drill tip surface is the target drilling depth, and in the back-drilling working state The projections of the partitions described below on the back-drilled drilling surface of the PCB do not coincide with the corresponding back-drilled holes.
可选的,所述隔档部包括本体和设于本体底部的接触部;Optionally, the baffle portion includes a body and a contact portion disposed at the bottom of the body;
所述接触部,用于与PCB的背钻入钻面的导电层接触电连接,或者与PCB的背钻入钻面的压力传感器接触。The contact portion is used for electrical connection with the conductive layer of the back-drilled surface of the PCB, or contact with the pressure sensor of the back-drilled surface of the PCB.
可选的,所述本体套设于所述钻颈或者所述导向部外周。Optionally, the body is sleeved on the drill neck or the outer periphery of the guide portion.
可选的,所述接触部凸设于所述本体的底面,且所述接触部与所述导向部之间形成有预设间隙。Optionally, the contact portion is protruded from the bottom surface of the body, and a predetermined gap is formed between the contact portion and the guide portion.
可选的,所述接触部为一体成型且接触面为平面的中空结构,均匀围设于所述导向部的外周。Optionally, the contact portion is an integrally formed hollow structure with a flat contact surface, uniformly surrounding the outer periphery of the guide portion.
可选的,所述导向部的外侧沿其长度方向设有至少两个安装位,每个安装位对应不同的目标钻深;Optionally, the outer side of the guide portion is provided with at least two installation positions along its length direction, and each installation position corresponds to a different target drilling depth;
所述隔档部可拆卸式安装于与当前目标钻深相对应的安装位。The baffle portion is detachably installed at an installation position corresponding to the current target drilling depth.
一种PCB背钻控深方法,包括:A method for controlling the depth of PCB back drilling, comprising:
提供制作有金属化通孔的PCB;Provide PCBs with metallized through holes;
应用如上任一项所述的控深钻刀,在所述金属化通孔的对应位置,从所述PCB的背钻入钻面开始背钻;Using the depth-controlling drill as described in any one of the above, at the corresponding position of the metallized through hole, back-drilling is started from the back-drilling surface of the PCB;
在识别到所述隔档部下行至与所述PCB的背钻入钻面相接触时,控制所述控深钻刀停止背钻。When it is recognized that the partition portion descends to come into contact with the back-drilling drilling surface of the PCB, the depth-controlling drill is controlled to stop back-drilling.
可选的,所述PCB的背钻入钻面设置有导电层;所述隔档部包括本体和设于本体底部的接触部,所述接触部用于与PCB的背钻入钻面的导电层接触电连接;Optionally, the back-drilling surface of the PCB is provided with a conductive layer; the baffle part includes a body and a contact part provided at the bottom of the body, and the contact part is used for conducting electricity with the back-drilling surface of the PCB. Layer contact electrical connection;
识别所述隔档部是否下行至与所述PCB的背钻入钻面相接触的方法包括:在钻孔过程中,实时检测所述接触部与所述导电层之间的电导通状态,在所述电导通状态由断路切换为短路时,判定所述隔档部已下行至与所述PCB的背钻入钻面相接触。The method for identifying whether the partition portion descends to be in contact with the back-drilling surface of the PCB includes: during the drilling process, detecting the electrical conduction state between the contact portion and the conductive layer in real time, When the electrical conduction state is switched from open circuit to short circuit, it is determined that the baffle portion has descended to contact with the back drilling surface of the PCB.
可选的,所述PCB的背钻入钻面于所述隔档部的投影位置设置有压力传感器;所述隔档部包括本体和设于本体底部的接触部;所述接触部,用于与PCB的背钻入钻面的压力传感器接触;Optionally, a pressure sensor is provided on the projection position of the back-drilling drill surface of the PCB at the partition portion; the partition portion includes a main body and a contact portion provided at the bottom of the main body; the contact portion is used for Contact with the pressure sensor on the back-drilled surface of the PCB;
识别所述隔档部是否下行至与所述PCB的背钻入钻面相接触的方法包括:实时检测所述压力传感器的压力值,在所述压力值激增时,判定所述隔档部已下行至与所述PCB的背钻入钻面相接触。The method for identifying whether the partition portion descends to contact with the back drilling surface of the PCB comprises: detecting the pressure value of the pressure sensor in real time, and determining that the partition portion has descended when the pressure value increases sharply to make contact with the back-drilled surface of the PCB.
可选的,所述PCB的背钻入钻面还设有保护层。Optionally, the back-drilling surface of the PCB is further provided with a protective layer.
与现有技术相比,本发明的有益效果为:Compared with the prior art, the beneficial effects of the present invention are:
本发明实施例可以根据目标钻深来设置隔档部在钻刀的具体安装高度位置,以保证刀体的位于隔档部底面至钻尖端面之间部分的长度为目标钻深。由于隔档部的投影落入PCB的背钻入钻面的板面区域(非背钻孔区域),因此在隔档部随刀体下行至PCB的背钻入钻面的高度位置时,隔档部会与PCB的背钻入钻面相抵触,从而阻止刀体继续下行,而刀体当前于PCB内的实际钻入深度为隔档部底面至钻尖端面之间的垂直距离,也即预设的目标钻深。因此,基于该控深钻刀,只需要根据目标钻深来设计隔档部的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。In the embodiment of the present invention, the specific installation height of the partition portion on the drill cutter can be set according to the target drilling depth, so as to ensure that the length of the cutter body between the bottom surface of the partition portion and the drill tip surface is the target drilling depth. Since the projection of the partition part falls into the board surface area (non-back-drilling area) of the back-drilling surface of the PCB, when the partition part descends with the cutter body to the height of the back-drilling surface of the PCB, the The stopper will conflict with the back drilling surface of the PCB, thus preventing the cutter body from continuing to descend, and the actual drilling depth of the cutter body in the PCB is the vertical distance from the bottom surface of the stopper to the drill tip surface, which is the preset target drilling depth. Therefore, based on the depth-controlling drill, it is only necessary to design the installation position of the partition according to the target drilling depth, that is, the back-drilling depth can be controlled simply and accurately to reach the target drilling depth.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.
图1为本发明实施例提供的控深钻刀的结构示意图。FIG. 1 is a schematic structural diagram of a depth control drill provided by an embodiment of the present invention.
图2为本发明实施例提供的控深钻刀的应用方法示意图。FIG. 2 is a schematic diagram of an application method of a depth control drill provided by an embodiment of the present invention.
图3为本发明实施例提供的PCB背钻控深方法流程图。FIG. 3 is a flowchart of a method for controlling depth of PCB back drilling provided by an embodiment of the present invention.
附图标记说明:控深钻刀1、钻柄11、导向部12、钻尖13、隔档部14、本体141、接触部142、PCB 2。Description of reference numerals:
具体实施方式Detailed ways
为使得本发明的发明目的、特征、优点能够更加的明显和易懂,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,下面所描述的实施例仅仅是本发明一部分实施例,而非全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
为提高背钻控深精度,本发明实施例提供了一种控深钻刀1,该控深钻刀1在应用于背钻时能够精准的实现背钻深度控制。请参阅图1和图2,本发明实施例提供的控深钻刀1包括:沿长度方向依次设置的钻柄11、钻颈和刀体,刀体包括导向部12和钻尖13,且导向部12连接于钻颈和钻尖13之间。In order to improve the depth control accuracy of back drilling, an embodiment of the present invention provides a
其中,钻柄11为本控深钻刀1上供装夹用的部分,并用以传递钻孔所需的动力(扭矩和轴向力);钻颈,为位于钻柄11和刀体之间的过渡部分;钻体,为控深钻刀1的工作部分,由钻尖13(即切削部分)和导向部12分组成。Among them, the
不同于传统钻刀结构,本发明实施例的控深钻刀1还包括隔档部14,该隔档部14安装于钻颈或刀体上的预设高度位置,使得刀体的位于隔档部14底面与钻尖13端面之间部分的长度为目标钻深,且在背钻工作状态下隔档部14在PCB 2的背钻入钻面上的投影与对应背钻孔不重合。Different from the conventional drill structure, the
需要说明的是,本发明实施例中,可以根据目标钻深来设置隔档部14在钻刀的具体安装高度位置,以保证刀体的位于隔档部14底面至钻尖13端面之间部分的长度为目标钻深。由于隔档部14的投影落入PCB 2的背钻入钻面的板面区域(非背钻孔区域),因此在隔档部14随刀体下行至PCB 2的背钻入钻面的高度位置时,隔档部14会与PCB 2的背钻入钻面相抵触,从而阻止刀体继续下行,而刀体当前于PCB 2内的实际钻入深度为隔档部14底面至钻尖13端面之间的垂直距离,也即预设的目标钻深。因此,基于该控深钻刀1,只需要根据目标钻深来设计隔档部14的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。It should be noted that, in the embodiment of the present invention, the specific installation height position of the
在一种可选的实施方式中,隔档部14包括本体141和设于本体141底部的接触部142;该接触部142,用于与PCB 2的背钻入钻面的导电层接触电连接,或者与PCB 2的背钻入钻面的压力传感器接触。In an optional embodiment, the
由于在接触部142下行至与位于背钻入钻面的导电层接触时,接触部142与导电层之间的电导通状态会由断路切换为短路;或者在接触部142下行至与位于背钻入钻面的压力传感器接触时,压力传感器的压力检测值会发生激增(即迅速增大)。因此,在该实施方式中,可以在该接触部142和导电层/压力传感器的配合作用下,自动、快速且准确的识别出隔档部14是否随刀体下行至与PCB 2的背钻入钻面相接触,进而自动的控制背钻停止,以避免控深钻刀1在下行受限后因仍然继续旋转而损坏PCB 2板面。Because when the
本体141可套设于钻颈或者导向部12外周,这样可实现简单快速的装配。接触部142凸设于本体141的底面,且接触部142与所述导向部12之间形成有预设间隙。这样可以避免接触部142与导向部12之间因紧密而互相干扰,同时保证钻孔质量和控制精度。当然,在其他实施方式中,本体141也可采用其他各种常规方式安装。The
示例性的,接触部142为一体成型且接触面为平面的中空结构,均匀围设于导向部12的外周,这样可以有效提升针对隔档部14是否与背钻入钻面接触进行检测的检测精度。Exemplarily, the
为提升控深钻刀1的通用性,导向部12的外侧沿其长度方向设有至少两个安装位,每个安装位对应不同的目标钻深;隔档部14可拆卸式安装于与当前目标钻深相对应的安装位。基于此,在应用前,可以根据当前设定的目标钻深,来选择匹配的隔档部14安装位,满足了不同的钻深需求。In order to improve the versatility of the
请参阅图3,本发明实施例还提供了一种PCB 2背钻控深方法,包括:Referring to FIG. 3 , an embodiment of the present invention further provides a method for controlling the depth of back drilling of
步骤101、提供制作有金属化通孔的PCB 2。
步骤102、应用控深钻刀1,在金属化通孔的对应位置,从PCB 2的背钻入钻面开始背钻。
本步骤中的控深钻刀1,包括:沿长度方向依次设置的钻柄11、钻颈和刀体,刀体包括导向部12和钻尖13,且导向部12连接于钻颈和钻尖13之间;还包括隔档部14,该隔档部14安装于钻颈或刀体上的预设高度位置,使得刀体的位于隔档部14底面与钻尖13端面之间部分的长度为目标钻深,且在背钻工作状态下隔档部14在PCB 2的背钻入钻面上的投影与对应背钻孔不重合。The
步骤103、在背钻过程中,实时识别隔档部14是否下行至与PCB 2的背钻入钻面相接触,若是,则控制控深钻刀1停止背钻。Step 103: During the back-drilling process, identify in real time whether the
由于与传统钻刀结构相比,本发明实施例的控深钻刀1还包括安装于钻颈/刀体上的预设高度位置的隔档部14,该隔档部14能够在下行至PCB 2板面的高度位置时与PCB 2板面,进而阻止刀体继续下行,此时已钻入PCB 2的刀体长度即隔档部14底面至钻尖13端面的垂直距离,也即预设的目标钻深。因此,本发明实施例只需要根据目标钻深来设计隔档部14的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。Compared with the conventional drill structure, the
为了避免控深钻刀1在下行受限后因仍然继续旋转而损坏PCB 2板面,本发明实施例提供了两种有效解决方案,以自动识别是否下行受限,从而实现快速控制背钻停止,以有效减少控深钻刀1对PCB 2板面施加的不良作用力。In order to avoid damage to the board surface of the
第一种解决方案:First solution:
PCB 2的背钻入钻面设置有导电层;隔档部14包括本体141和设于本体141底部的接触部142,该接触部142用于与PCB 2的背钻入钻面的导电层接触电连接;导电层可以为铝片或者导电胶。The back-drilling surface of the
基于此,识别隔档部14是否下行至与PCB 2的背钻入钻面相接触的方法包括:在钻孔过程中,实时检测接触部142与导电层之间的电导通状态,在电导通状态由断路切换为短路时,判定隔档部14已下行至与PCB 2的背钻入钻面相接触。Based on this, the method for identifying whether the
第二种解决方案:Second solution:
PCB 2的背钻入钻面于隔档部14的投影位置设置有压力传感器;隔档部14包括本体141和设于本体141底部的接触部142;接触部142,用于与PCB2的背钻入钻面的压力传感器接触。The back drilling surface of
基于此,识别隔档部14是否下行至与所述PCB 2的背钻入钻面相接触的方法包括:实时检测压力传感器的压力值,在压力值激增时,判定隔档部14已下行至与PCB 2的背钻入钻面相接触。Based on this, the method for identifying whether the
该方式中,PCB 2的背钻入钻面还可增设一层保护层,用于保护背钻入钻面。In this method, a layer of protective layer can be added to the back-drilling surface of the
以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The technical solutions described in the embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
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