CN115243466A - A kind of depth control drilling tool and PCB back drilling depth control method - Google Patents

A kind of depth control drilling tool and PCB back drilling depth control method Download PDF

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Publication number
CN115243466A
CN115243466A CN202210949971.5A CN202210949971A CN115243466A CN 115243466 A CN115243466 A CN 115243466A CN 202210949971 A CN202210949971 A CN 202210949971A CN 115243466 A CN115243466 A CN 115243466A
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drilling
pcb
depth
drill
contact
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舒梦烛
刘梦茹
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Shengyi Electronics Co Ltd
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Shengyi Electronics Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention relates to the technical field of PCBs (printed circuit boards), and discloses a depth control drill and a PCB back drilling depth control method. The depth control drill comprises a drill handle, a drill neck and a cutter body, wherein the cutter body comprises a guide part and a drill tip; the depth-control drilling tool also comprises a baffle part; the blocking part is arranged at a preset height position on the drill neck or the cutter body, so that the length of the cutter body between the bottom surface of the blocking part and the end surface of the drill tip is the target drilling depth, and the projection of the blocking part on the back drilling surface of the PCB is not overlapped with the corresponding back drilling hole in the back drilling working state. According to the embodiment of the invention, when the partition part moves downwards along with the cutter body to the height position of the back drilling surface of the PCB, the partition part can be abutted against the back drilling surface, so that the cutter body is prevented from moving downwards continuously, and the actual drilling depth of the cutter body in the PCB is the vertical distance between the bottom surface of the partition part and the end surface of the drill point, namely the preset target drilling depth. Therefore, the invention can simply and accurately control the back drilling depth to reach the target drilling depth.

Description

一种控深钻刀及PCB背钻控深方法A kind of depth control drilling tool and PCB back drilling depth control method

技术领域technical field

本发明涉及PCB(Printed Circuit Boards,印制电路板)技术领域,尤其涉及一种控深钻刀及PCB背钻控深方法。The invention relates to the technical field of PCB (Printed Circuit Boards, printed circuit boards), in particular to a depth-controlling drill and a depth-controlling method for PCB back drilling.

背景技术Background technique

随着5G无线网络的技术发展,通讯产品对PCB的高频、高速要求越来越高。在PCB制作工艺中,由于背钻的目的在于“去除金属化通孔信号层的多余孔铜,减少信号损失,避免信号失真”,因此背钻已然成为电路板制作工艺中的关键工序,而在该关键工序中如何提高背钻深度的控制精度尤为关键,然而目前并未能实现高精度的背钻深度控制。With the development of 5G wireless network technology, communication products have higher and higher requirements for high frequency and high speed of PCB. In the PCB manufacturing process, since the purpose of back drilling is to "remove redundant copper holes in the signal layer of metallized through holes, reduce signal loss and avoid signal distortion", back drilling has become a key process in the circuit board manufacturing process. In this key process, how to improve the control accuracy of the back drilling depth is particularly critical. However, high-precision back drilling depth control has not yet been achieved.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种控深钻刀及PCB背钻控深方法,以克服现有技术存在的背钻深度控制精度较低的缺陷。The purpose of the present invention is to provide a depth-controlling drill and a method for controlling the depth of PCB back-drilling, so as to overcome the defect of the low-precision back-drilling depth control existing in the prior art.

为达此目的,本发明采用以下技术方案:For this purpose, the present invention adopts the following technical solutions:

一种控深钻刀,包括沿长度方向依次设置的钻柄、钻颈和刀体,所述刀体包括导向部和钻尖,且所述导向部连接于钻颈和钻尖之间,所述控深钻刀还包括隔档部;A depth-controlling drill, comprising a drill shank, a drill neck and a cutter body arranged in sequence along a length direction, the cutter body comprising a guide portion and a drill tip, and the guide portion is connected between the drill neck and the drill tip, so that the The control depth drill also includes a partition;

所述隔档部安装于钻颈或刀体上的预设高度位置,使得所述刀体的位于隔档部底面与钻尖端面之间部分的长度为目标钻深,且在背钻工作状态下所述隔档部在PCB的背钻入钻面上的投影与对应背钻孔不重合。The partition portion is installed at a preset height position on the drill neck or the cutter body, so that the length of the portion of the cutter body located between the bottom surface of the partition portion and the drill tip surface is the target drilling depth, and in the back-drilling working state The projections of the partitions described below on the back-drilled drilling surface of the PCB do not coincide with the corresponding back-drilled holes.

可选的,所述隔档部包括本体和设于本体底部的接触部;Optionally, the baffle portion includes a body and a contact portion disposed at the bottom of the body;

所述接触部,用于与PCB的背钻入钻面的导电层接触电连接,或者与PCB的背钻入钻面的压力传感器接触。The contact portion is used for electrical connection with the conductive layer of the back-drilled surface of the PCB, or contact with the pressure sensor of the back-drilled surface of the PCB.

可选的,所述本体套设于所述钻颈或者所述导向部外周。Optionally, the body is sleeved on the drill neck or the outer periphery of the guide portion.

可选的,所述接触部凸设于所述本体的底面,且所述接触部与所述导向部之间形成有预设间隙。Optionally, the contact portion is protruded from the bottom surface of the body, and a predetermined gap is formed between the contact portion and the guide portion.

可选的,所述接触部为一体成型且接触面为平面的中空结构,均匀围设于所述导向部的外周。Optionally, the contact portion is an integrally formed hollow structure with a flat contact surface, uniformly surrounding the outer periphery of the guide portion.

可选的,所述导向部的外侧沿其长度方向设有至少两个安装位,每个安装位对应不同的目标钻深;Optionally, the outer side of the guide portion is provided with at least two installation positions along its length direction, and each installation position corresponds to a different target drilling depth;

所述隔档部可拆卸式安装于与当前目标钻深相对应的安装位。The baffle portion is detachably installed at an installation position corresponding to the current target drilling depth.

一种PCB背钻控深方法,包括:A method for controlling the depth of PCB back drilling, comprising:

提供制作有金属化通孔的PCB;Provide PCBs with metallized through holes;

应用如上任一项所述的控深钻刀,在所述金属化通孔的对应位置,从所述PCB的背钻入钻面开始背钻;Using the depth-controlling drill as described in any one of the above, at the corresponding position of the metallized through hole, back-drilling is started from the back-drilling surface of the PCB;

在识别到所述隔档部下行至与所述PCB的背钻入钻面相接触时,控制所述控深钻刀停止背钻。When it is recognized that the partition portion descends to come into contact with the back-drilling drilling surface of the PCB, the depth-controlling drill is controlled to stop back-drilling.

可选的,所述PCB的背钻入钻面设置有导电层;所述隔档部包括本体和设于本体底部的接触部,所述接触部用于与PCB的背钻入钻面的导电层接触电连接;Optionally, the back-drilling surface of the PCB is provided with a conductive layer; the baffle part includes a body and a contact part provided at the bottom of the body, and the contact part is used for conducting electricity with the back-drilling surface of the PCB. Layer contact electrical connection;

识别所述隔档部是否下行至与所述PCB的背钻入钻面相接触的方法包括:在钻孔过程中,实时检测所述接触部与所述导电层之间的电导通状态,在所述电导通状态由断路切换为短路时,判定所述隔档部已下行至与所述PCB的背钻入钻面相接触。The method for identifying whether the partition portion descends to be in contact with the back-drilling surface of the PCB includes: during the drilling process, detecting the electrical conduction state between the contact portion and the conductive layer in real time, When the electrical conduction state is switched from open circuit to short circuit, it is determined that the baffle portion has descended to contact with the back drilling surface of the PCB.

可选的,所述PCB的背钻入钻面于所述隔档部的投影位置设置有压力传感器;所述隔档部包括本体和设于本体底部的接触部;所述接触部,用于与PCB的背钻入钻面的压力传感器接触;Optionally, a pressure sensor is provided on the projection position of the back-drilling drill surface of the PCB at the partition portion; the partition portion includes a main body and a contact portion provided at the bottom of the main body; the contact portion is used for Contact with the pressure sensor on the back-drilled surface of the PCB;

识别所述隔档部是否下行至与所述PCB的背钻入钻面相接触的方法包括:实时检测所述压力传感器的压力值,在所述压力值激增时,判定所述隔档部已下行至与所述PCB的背钻入钻面相接触。The method for identifying whether the partition portion descends to contact with the back drilling surface of the PCB comprises: detecting the pressure value of the pressure sensor in real time, and determining that the partition portion has descended when the pressure value increases sharply to make contact with the back-drilled surface of the PCB.

可选的,所述PCB的背钻入钻面还设有保护层。Optionally, the back-drilling surface of the PCB is further provided with a protective layer.

与现有技术相比,本发明的有益效果为:Compared with the prior art, the beneficial effects of the present invention are:

本发明实施例可以根据目标钻深来设置隔档部在钻刀的具体安装高度位置,以保证刀体的位于隔档部底面至钻尖端面之间部分的长度为目标钻深。由于隔档部的投影落入PCB的背钻入钻面的板面区域(非背钻孔区域),因此在隔档部随刀体下行至PCB的背钻入钻面的高度位置时,隔档部会与PCB的背钻入钻面相抵触,从而阻止刀体继续下行,而刀体当前于PCB内的实际钻入深度为隔档部底面至钻尖端面之间的垂直距离,也即预设的目标钻深。因此,基于该控深钻刀,只需要根据目标钻深来设计隔档部的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。In the embodiment of the present invention, the specific installation height of the partition portion on the drill cutter can be set according to the target drilling depth, so as to ensure that the length of the cutter body between the bottom surface of the partition portion and the drill tip surface is the target drilling depth. Since the projection of the partition part falls into the board surface area (non-back-drilling area) of the back-drilling surface of the PCB, when the partition part descends with the cutter body to the height of the back-drilling surface of the PCB, the The stopper will conflict with the back drilling surface of the PCB, thus preventing the cutter body from continuing to descend, and the actual drilling depth of the cutter body in the PCB is the vertical distance from the bottom surface of the stopper to the drill tip surface, which is the preset target drilling depth. Therefore, based on the depth-controlling drill, it is only necessary to design the installation position of the partition according to the target drilling depth, that is, the back-drilling depth can be controlled simply and accurately to reach the target drilling depth.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

图1为本发明实施例提供的控深钻刀的结构示意图。FIG. 1 is a schematic structural diagram of a depth control drill provided by an embodiment of the present invention.

图2为本发明实施例提供的控深钻刀的应用方法示意图。FIG. 2 is a schematic diagram of an application method of a depth control drill provided by an embodiment of the present invention.

图3为本发明实施例提供的PCB背钻控深方法流程图。FIG. 3 is a flowchart of a method for controlling depth of PCB back drilling provided by an embodiment of the present invention.

附图标记说明:控深钻刀1、钻柄11、导向部12、钻尖13、隔档部14、本体141、接触部142、PCB 2。Description of reference numerals: depth control drill 1 , drill shank 11 , guide portion 12 , drill tip 13 , partition portion 14 , body 141 , contact portion 142 , PCB 2 .

具体实施方式Detailed ways

为使得本发明的发明目的、特征、优点能够更加的明显和易懂,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,下面所描述的实施例仅仅是本发明一部分实施例,而非全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

为提高背钻控深精度,本发明实施例提供了一种控深钻刀1,该控深钻刀1在应用于背钻时能够精准的实现背钻深度控制。请参阅图1和图2,本发明实施例提供的控深钻刀1包括:沿长度方向依次设置的钻柄11、钻颈和刀体,刀体包括导向部12和钻尖13,且导向部12连接于钻颈和钻尖13之间。In order to improve the depth control accuracy of back drilling, an embodiment of the present invention provides a depth control drill 1, which can accurately control the depth of back drilling when applied to back drilling. Referring to FIGS. 1 and 2, the depth control drill 1 provided by the embodiment of the present invention includes: a drill shank 11, a drill neck and a cutter body arranged in sequence along the length direction, the cutter body includes a guide portion 12 and a drill tip 13, and the guide The portion 12 is connected between the drill neck and the drill tip 13 .

其中,钻柄11为本控深钻刀1上供装夹用的部分,并用以传递钻孔所需的动力(扭矩和轴向力);钻颈,为位于钻柄11和刀体之间的过渡部分;钻体,为控深钻刀1的工作部分,由钻尖13(即切削部分)和导向部12分组成。Among them, the drill shank 11 is the part for clamping the deep drill 1, and is used to transmit the power (torque and axial force) required for drilling; the drill neck is located between the drill shank 11 and the cutter body The transition part of the drill body, which is the working part of the depth control drill 1, is composed of the drill tip 13 (ie the cutting part) and the guide part 12.

不同于传统钻刀结构,本发明实施例的控深钻刀1还包括隔档部14,该隔档部14安装于钻颈或刀体上的预设高度位置,使得刀体的位于隔档部14底面与钻尖13端面之间部分的长度为目标钻深,且在背钻工作状态下隔档部14在PCB 2的背钻入钻面上的投影与对应背钻孔不重合。Different from the conventional drill structure, the depth control drill 1 of the embodiment of the present invention further includes a partition portion 14, and the partition portion 14 is installed at a predetermined height position on the drill neck or the cutter body, so that the cutter body is located in the partition The length of the part between the bottom surface of the part 14 and the end surface of the drill tip 13 is the target drilling depth, and the projection of the baffle part 14 on the back drilling surface of the PCB 2 does not coincide with the corresponding back drilling in the back drilling working state.

需要说明的是,本发明实施例中,可以根据目标钻深来设置隔档部14在钻刀的具体安装高度位置,以保证刀体的位于隔档部14底面至钻尖13端面之间部分的长度为目标钻深。由于隔档部14的投影落入PCB 2的背钻入钻面的板面区域(非背钻孔区域),因此在隔档部14随刀体下行至PCB 2的背钻入钻面的高度位置时,隔档部14会与PCB 2的背钻入钻面相抵触,从而阻止刀体继续下行,而刀体当前于PCB 2内的实际钻入深度为隔档部14底面至钻尖13端面之间的垂直距离,也即预设的目标钻深。因此,基于该控深钻刀1,只需要根据目标钻深来设计隔档部14的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。It should be noted that, in the embodiment of the present invention, the specific installation height position of the partition portion 14 on the drill can be set according to the target drilling depth, so as to ensure that the cutter body is located between the bottom surface of the partition portion 14 and the end face of the drill tip 13 . The length is the target drilling depth. Since the projection of the baffle portion 14 falls into the board surface area (non-back-drilled area) of the back-drilling drilling surface of the PCB 2, the baffle portion 14 descends with the cutter body to the height of the back-drilling drilling surface of the PCB 2 When in position, the partition portion 14 will interfere with the back drilling surface of the PCB 2, thereby preventing the cutter body from continuing to descend, and the actual drilling depth of the cutter body in the PCB 2 is from the bottom surface of the partition portion 14 to the end face of the drill tip 13. The vertical distance between them, that is, the preset target drilling depth. Therefore, based on the depth-controlling drill 1 , it is only necessary to design the installation position of the baffle portion 14 according to the target drilling depth, that is, the back-drilling depth can be simply and accurately controlled to reach the target drilling depth.

在一种可选的实施方式中,隔档部14包括本体141和设于本体141底部的接触部142;该接触部142,用于与PCB 2的背钻入钻面的导电层接触电连接,或者与PCB 2的背钻入钻面的压力传感器接触。In an optional embodiment, the baffle portion 14 includes a body 141 and a contact portion 142 provided at the bottom of the body 141 ; the contact portion 142 is used for electrical connection with the conductive layer of the back-drilled surface of the PCB 2 . , or in contact with the pressure sensor on the back-drilled surface of PCB 2.

由于在接触部142下行至与位于背钻入钻面的导电层接触时,接触部142与导电层之间的电导通状态会由断路切换为短路;或者在接触部142下行至与位于背钻入钻面的压力传感器接触时,压力传感器的压力检测值会发生激增(即迅速增大)。因此,在该实施方式中,可以在该接触部142和导电层/压力传感器的配合作用下,自动、快速且准确的识别出隔档部14是否随刀体下行至与PCB 2的背钻入钻面相接触,进而自动的控制背钻停止,以避免控深钻刀1在下行受限后因仍然继续旋转而损坏PCB 2板面。Because when the contact portion 142 descends to contact with the conductive layer located on the back drill surface, the electrical conduction state between the contact portion 142 and the conductive layer will be switched from open circuit to short circuit; When the pressure sensor on the drilling surface contacts, the pressure detection value of the pressure sensor will surge (ie, increase rapidly). Therefore, in this embodiment, under the cooperative action of the contact portion 142 and the conductive layer/pressure sensor, it can be automatically, quickly and accurately identified whether the partition portion 14 descends with the cutter body to the back-drilling with the PCB 2 The drilling surfaces are in contact with each other, and the back drilling is automatically controlled to stop, so as to avoid damage to the PCB 2 board surface due to the continuous rotation of the depth control drill 1 after being restricted in downward movement.

本体141可套设于钻颈或者导向部12外周,这样可实现简单快速的装配。接触部142凸设于本体141的底面,且接触部142与所述导向部12之间形成有预设间隙。这样可以避免接触部142与导向部12之间因紧密而互相干扰,同时保证钻孔质量和控制精度。当然,在其他实施方式中,本体141也可采用其他各种常规方式安装。The body 141 can be sleeved on the drill neck or the outer periphery of the guide portion 12, so that simple and fast assembly can be realized. The contact portion 142 is protruded from the bottom surface of the main body 141 , and a predetermined gap is formed between the contact portion 142 and the guide portion 12 . In this way, mutual interference between the contact portion 142 and the guide portion 12 can be avoided due to the tightness, and at the same time, the drilling quality and control accuracy can be ensured. Of course, in other embodiments, the body 141 may also be installed in various other conventional manners.

示例性的,接触部142为一体成型且接触面为平面的中空结构,均匀围设于导向部12的外周,这样可以有效提升针对隔档部14是否与背钻入钻面接触进行检测的检测精度。Exemplarily, the contact portion 142 is an integrally formed hollow structure with a flat contact surface, and is evenly arranged around the outer circumference of the guide portion 12, which can effectively improve the detection of whether the baffle portion 14 is in contact with the back drilling surface. precision.

为提升控深钻刀1的通用性,导向部12的外侧沿其长度方向设有至少两个安装位,每个安装位对应不同的目标钻深;隔档部14可拆卸式安装于与当前目标钻深相对应的安装位。基于此,在应用前,可以根据当前设定的目标钻深,来选择匹配的隔档部14安装位,满足了不同的钻深需求。In order to improve the versatility of the depth control drill 1, the outer side of the guide portion 12 is provided with at least two installation positions along its length direction, and each installation position corresponds to a different target drilling depth; The installation position corresponding to the target drilling depth. Based on this, before application, a matching installation position of the baffle portion 14 can be selected according to the currently set target drilling depth, so as to meet different drilling depth requirements.

请参阅图3,本发明实施例还提供了一种PCB 2背钻控深方法,包括:Referring to FIG. 3 , an embodiment of the present invention further provides a method for controlling the depth of back drilling of PCB 2, including:

步骤101、提供制作有金属化通孔的PCB 2。Step 101 , providing a PCB 2 with metallized through holes.

步骤102、应用控深钻刀1,在金属化通孔的对应位置,从PCB 2的背钻入钻面开始背钻。Step 102 , using the depth-controlling drill 1 , at the corresponding position of the metallized through hole, start back-drilling from the back-drilling surface of the PCB 2 .

本步骤中的控深钻刀1,包括:沿长度方向依次设置的钻柄11、钻颈和刀体,刀体包括导向部12和钻尖13,且导向部12连接于钻颈和钻尖13之间;还包括隔档部14,该隔档部14安装于钻颈或刀体上的预设高度位置,使得刀体的位于隔档部14底面与钻尖13端面之间部分的长度为目标钻深,且在背钻工作状态下隔档部14在PCB 2的背钻入钻面上的投影与对应背钻孔不重合。The depth control drill 1 in this step includes: a drill shank 11, a drill neck and a cutter body arranged in sequence along the length direction, the cutter body includes a guide portion 12 and a drill tip 13, and the guide portion 12 is connected to the drill neck and the drill tip 13; also includes a baffle portion 14, the baffle portion 14 is installed at a preset height position on the drill neck or the cutter body, so that the length of the portion of the cutter body between the bottom surface of the baffle portion 14 and the end face of the drill tip 13 It is the target drilling depth, and the projection of the baffle portion 14 on the back-drilling surface of the PCB 2 does not coincide with the corresponding back-drilling hole in the back-drilling working state.

步骤103、在背钻过程中,实时识别隔档部14是否下行至与PCB 2的背钻入钻面相接触,若是,则控制控深钻刀1停止背钻。Step 103: During the back-drilling process, identify in real time whether the partition portion 14 descends to contact the back-drilling surface of the PCB 2, and if so, control the depth-controlling drill 1 to stop the back-drilling.

由于与传统钻刀结构相比,本发明实施例的控深钻刀1还包括安装于钻颈/刀体上的预设高度位置的隔档部14,该隔档部14能够在下行至PCB 2板面的高度位置时与PCB 2板面,进而阻止刀体继续下行,此时已钻入PCB 2的刀体长度即隔档部14底面至钻尖13端面的垂直距离,也即预设的目标钻深。因此,本发明实施例只需要根据目标钻深来设计隔档部14的安装位置,即可以简单且精准的控制背钻深度达到目标钻深。Compared with the conventional drill structure, the depth control drill 1 of the embodiment of the present invention further includes a partition portion 14 installed on the drill neck/blade body at a predetermined height position, and the partition portion 14 can descend to the PCB The height of the 2 board surface is the same as the PCB 2 board surface, thereby preventing the cutter body from continuing to descend. At this time, the length of the cutter body that has been drilled into the PCB 2 is the vertical distance from the bottom surface of the partition part 14 to the end surface of the drill tip 13, that is, the preset target drilling depth. Therefore, in the embodiment of the present invention, the installation position of the partition portion 14 only needs to be designed according to the target drilling depth, that is, the back drilling depth can be controlled simply and accurately to reach the target drilling depth.

为了避免控深钻刀1在下行受限后因仍然继续旋转而损坏PCB 2板面,本发明实施例提供了两种有效解决方案,以自动识别是否下行受限,从而实现快速控制背钻停止,以有效减少控深钻刀1对PCB 2板面施加的不良作用力。In order to avoid damage to the board surface of the PCB 2 due to the continuous rotation of the depth-controlling drill 1 after the downward movement is restricted, the embodiment of the present invention provides two effective solutions to automatically identify whether the downward movement is restricted, so as to realize the rapid control of the back-drilling stop , in order to effectively reduce the adverse force exerted by the depth control drill 1 on the PCB 2 board surface.

第一种解决方案:First solution:

PCB 2的背钻入钻面设置有导电层;隔档部14包括本体141和设于本体141底部的接触部142,该接触部142用于与PCB 2的背钻入钻面的导电层接触电连接;导电层可以为铝片或者导电胶。The back-drilling surface of the PCB 2 is provided with a conductive layer; the baffle portion 14 includes a body 141 and a contact portion 142 disposed at the bottom of the body 141, and the contact portion 142 is used for contacting the conductive layer of the back-drilling surface of the PCB 2 Electrical connection; the conductive layer can be aluminum sheet or conductive glue.

基于此,识别隔档部14是否下行至与PCB 2的背钻入钻面相接触的方法包括:在钻孔过程中,实时检测接触部142与导电层之间的电导通状态,在电导通状态由断路切换为短路时,判定隔档部14已下行至与PCB 2的背钻入钻面相接触。Based on this, the method for identifying whether the baffle portion 14 descends to contact with the back-drilling surface of the PCB 2 includes: during the drilling process, real-time detection of the electrical conduction state between the contact portion 142 and the conductive layer, in the electrical conduction state When switching from open circuit to short circuit, it is determined that the baffle portion 14 has descended to come into contact with the back drilling surface of the PCB 2 .

第二种解决方案:Second solution:

PCB 2的背钻入钻面于隔档部14的投影位置设置有压力传感器;隔档部14包括本体141和设于本体141底部的接触部142;接触部142,用于与PCB2的背钻入钻面的压力传感器接触。The back drilling surface of PCB 2 is provided with a pressure sensor at the projected position of the partition part 14; the partition part 14 includes a main body 141 and a contact part 142 arranged at the bottom of the main body 141; the contact part 142 is used for back drilling with the PCB2 Contact the pressure sensor on the drilling face.

基于此,识别隔档部14是否下行至与所述PCB 2的背钻入钻面相接触的方法包括:实时检测压力传感器的压力值,在压力值激增时,判定隔档部14已下行至与PCB 2的背钻入钻面相接触。Based on this, the method for identifying whether the baffle portion 14 has descended to contact with the back-drilling surface of the PCB 2 includes: detecting the pressure value of the pressure sensor in real time, and when the pressure value surges, determining that the baffle portion 14 has descended to contact with the back-drilling surface of the PCB 2 . The back-drilled PCB 2 is in contact with the drilled surface.

该方式中,PCB 2的背钻入钻面还可增设一层保护层,用于保护背钻入钻面。In this method, a layer of protective layer can be added to the back-drilling surface of the PCB 2 to protect the back-drilling surface.

以上所述,以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The technical solutions described in the embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A depth-control drilling tool comprises a drill handle (11), a drill neck and a tool body which are sequentially arranged along the length direction, wherein the tool body comprises a guide part (12) and a drill tip (13), the guide part (12) is connected between the drill neck and the drill tip (13), and the depth-control drilling tool is characterized in that,
the depth control drill (1) further comprises a baffle part (14);
the blocking part (14) is arranged at a preset height position on the drill neck or the cutter body, so that the length of the cutter body between the bottom surface of the blocking part (14) and the end surface of the drill tip (13) is the target drilling depth, and the projection of the blocking part (14) on the back drilling surface of the PCB (2) is not overlapped with the corresponding back drilling hole in the back drilling working state.
2. The depth-control drill bit according to claim 1, wherein the stopper (14) comprises a body (141) and a contact portion (142) provided at the bottom of the body (141);
the contact part (142) is used for being in contact electrical connection with a conductive layer of the back drilling surface of the PCB (2) or in contact with a pressure sensor of the back drilling surface of the PCB (2).
3. The depth-controlling drill bit as claimed in claim 2, wherein the body (141) is sleeved on the periphery of the drill neck or the guide portion (12).
4. The depth-control drill insert as claimed in claim 3, wherein the contact portion (142) is protruded from a bottom surface of the body (141), and a predetermined gap is formed between the contact portion (142) and the guide portion (12).
5. The depth-control drill bit as claimed in claim 4, wherein the contact portion (142) is a hollow structure with a plane contact surface, and is uniformly arranged around the periphery of the guide portion (12).
6. The depth-control drill bit according to claim 1, characterized in that the outer side of the guide part (12) is provided with at least two mounting positions along the length direction thereof, and each mounting position corresponds to different target drilling depths;
the blocking part (14) is detachably arranged at an installation position corresponding to the current target drilling depth.
7. A PCB back drilling depth control method is characterized by comprising the following steps:
providing a PCB (2) with a metalized through hole;
applying the depth-controlling drilling tool (1) according to any one of claims 1 to 6, back-drilling from the back-drilled drilling surface of the PCB (2) at the corresponding position of the metallized through hole;
and controlling the depth control drilling cutter (1) to stop back drilling when the stop part (14) is recognized to descend to be in contact with the back drilling surface of the PCB (2).
8. The PCB back-drilling depth control method according to claim 7, wherein the back-drilling surface of the PCB (2) is provided with a conductive layer; the baffle part (14) comprises a body (141) and a contact part (142) arranged at the bottom of the body (141), and the contact part (142) is used for being in contact and electric connection with a conductive layer of a back drilling surface of the PCB (2);
the method of identifying whether the standoff portion (14) is lowered into contact with the back-drilled surface of the PCB (2) comprises: and detecting the electric conduction state between the contact part (142) and the conductive layer in real time during the drilling process, and judging that the baffle part (14) descends to be in contact with the back drilling surface of the PCB (2) when the electric conduction state is switched from open circuit to short circuit.
9. The PCB back-drilling depth control method according to claim 7, wherein a pressure sensor is arranged at the projection position of the back-drilling surface of the PCB (2) on the barrier part (14); the baffle part (14) comprises a body (141) and a contact part (142) arranged at the bottom of the body (141); the contact part (142) is used for contacting with a pressure sensor of a back drilling surface of the PCB (2);
the method of identifying whether the kicker (14) is down into contact with the backdrilling surface of the PCB (2) comprises: and detecting the pressure value of the pressure sensor in real time, and judging that the barrier part (14) descends to contact with the back drilling surface of the PCB (2) when the pressure value is increased sharply.
10. The PCB back-drilling depth control method according to claim 9, wherein the back-drilling surface of the PCB (2) is further provided with a protective layer.
CN202210949971.5A 2022-08-09 2022-08-09 A kind of depth control drilling tool and PCB back drilling depth control method Pending CN115243466A (en)

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US20040116953A1 (en) * 2002-10-02 2004-06-17 Linda Dixon Intradermal color introducing needle device, and apparatus and method involving the same
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