CN115226313A - Method for producing electric pattern of liquid crystal polymer film - Google Patents
Method for producing electric pattern of liquid crystal polymer film Download PDFInfo
- Publication number
- CN115226313A CN115226313A CN202110430490.9A CN202110430490A CN115226313A CN 115226313 A CN115226313 A CN 115226313A CN 202110430490 A CN202110430490 A CN 202110430490A CN 115226313 A CN115226313 A CN 115226313A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- crystal polymer
- polymer film
- pattern
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Abstract
A method for manufacturing electric pattern of liquid crystal high molecular film includes such steps as preparing liquid crystal high molecular film from liquid crystal high molecular polymer, forming a shielding layer on the surface of said film, making hollow pattern on the shielding layer, blowing the metal particles from molten metal by pressurized gas, spraying the metal particles onto the surface of said film to form a metal molecular bonding layer, instantaneously cooling, removing the shielding layer, and taking out the liquid crystal high molecular film with electric pattern.
Description
Technical Field
The invention relates to the field of flexible circuit boards, in particular to a manufacturing method for forming an electric pattern on a liquid crystal polymer film.
Background
In response to the trend of high frequency of electronic and communication operation, the substrate material of the flexible printed circuit board tends to have a low dielectric constant (DK), and the liquid crystal polymer film is the preferred material. However, the conventional process for manufacturing the conductive pattern of the flexible printed circuit board has the following defects: 1. the copper-clad liquid crystal polymer film soft board is formed into a pattern shape by a shielding jig, and then a conductive pattern is formed by etching and stripping a shielding material, and a large amount of etching solution is required in the process. 2. The liquid crystal polymer film forms a conductive pattern by printing a conductive paint, and the intermediary of the conductive paint, such as resin and auxiliary agent, reduces conductivity and affects electrical characteristics. Therefore, how to solve the above problems is the subject of the urgent research of the related industry.
Disclosure of Invention
The main objective of the present invention is to directly form an electrical pattern of a metal molecule bonding layer on a liquid crystal polymer film without using the assistance of a medium, so as to be used for transmission and reception of electrical signals, electromagnetic interference (anti-Electromagnetic interference) shielding, and Electromagnetic shielding (Electromagnetic shielding), and achieve excellent electrical conductivity and electrical characteristics.
To achieve the above object, the method for manufacturing an electrical pattern of a liquid crystal polymer film of the present invention comprises the following steps: a) Taking the liquid crystal polymer film made of liquid crystal polymer; b) Forming a shielding layer on the surface of the liquid crystal polymer film, and manufacturing a hollow pattern on the shielding layer according to a preset pattern shape; c) Blowing metal particles formed by molten metal by using pressurized gas by using a normal-temperature air pressure meltallizing method, enabling the metal particles to pass through the hollow-out pattern of the shielding layer to be sprayed and fixed on the corresponding surface of the liquid crystal polymer film to form a metal molecule bonding layer, and instantly cooling the metal molecule bonding layer into the electric pattern; d) Removing the shielding layer on the liquid crystal polymer film, and taking out the liquid crystal polymer film with the electric pattern.
In the above method for manufacturing an electrical pattern of a liquid crystal polymer film, in the step b), the shielding layer is formed by using one of the methods selected from tape, printing, coating and shielding jig.
In the above method for fabricating an electrical pattern of a liquid crystal polymer film, in the step b), a laser beam is used to pass through the hollow pattern to process the corresponding surface of the liquid crystal polymer film into a rough portion, and then in the step c), the metal molecule bonding layer is sprayed and fixed on the rough portion.
In the method for fabricating an electrical pattern of a liquid crystal polymer film, in the step c), the metal molecule bonding layer is selected from one of the group consisting of zn, cu, ni, zn-cu alloy and cu-ni alloy.
In the above method for fabricating an electrical pattern of a liquid crystal polymer film, in the step c), the adhesion force of the metal molecule bonding layer to the surface of the liquid crystal polymer film is 9kgf/cm 2 ~11kgf/cm 2 And the porosity of the metal molecule bonding layer is 1-5%.
In the above method for manufacturing an electrical pattern of a liquid crystal polymer film, in the step d), the electrical pattern is a conductive circuit with a line width less than or equal to 0.15mm for electrical conduction.
In the above method for manufacturing an electrical pattern of a liquid crystal polymer film, in the step d), the electrical pattern is used for shielding electromagnetic wave interference or electromagnetic interference.
Drawings
FIG. 1 is a perspective cross-sectional view of the present invention showing a shielding layer formed on the surface of a liquid crystal polymer film.
FIG. 2 is a perspective cross-sectional view of a hollow pattern formed on a masking layer according to a predetermined pattern shape according to the present invention.
FIG. 3 is a perspective cross-sectional view of a liquid crystal polymer film with rough portions formed along hollow patterns according to the present invention.
FIG. 4 is a perspective cross-sectional view of a metal molecule bonding layer formed on a rough portion of a liquid crystal polymer film according to the present invention.
FIG. 5 is a perspective cross-sectional view of the liquid crystal polymer film and the shielding layer removed from the periphery of the electrical pattern according to the present invention.
Description of reference numerals:
1. liquid crystal polymer film
2. Shielding layer
3. Hollowed-out pattern
4. Roughness portion
5. Metal molecule bonding layer
6. An electrical pattern.
Detailed Description
To achieve the above objects, the present invention provides a technical means and its effects, which are described below with reference to the accompanying drawings as follows:
first, referring to fig. 1 to 5, the present invention mainly forms an electrical pattern 6 on the surface of a liquid crystal polymer film 1 directly without using the medium, and the manufacturing method of the present invention includes the following steps:
(a) Taking the liquid crystal polymer film 1 made of Liquid Crystal Polymer (LCP) (refer to FIG. 1);
(b) Forming a shielding layer 2 (see fig. 1) on the surface of the liquid crystal polymer film 1, wherein the shielding layer 2 can be formed by one of the methods selected from the group consisting of tape, printing, coating and shielding jig, then engraving a hollow pattern 3 (see fig. 2) on the shielding layer 2 by using a laser beam according to a predetermined pattern shape, and processing the corresponding surface of the liquid crystal polymer film 1 into a rough part 4 (see fig. 3) by using the laser beam to pass through the hollow pattern 3;
(c) Blowing metal particles formed by molten metal by using a pressurized gas through a normal-temperature air pressure meltallizing method, enabling the metal particles to pass through the hollow pattern 3 of the shielding layer 2 to be sprayed and fixed on the rough part 4 on the corresponding surface of the liquid crystal polymer film 1 to form a metal molecule bonding layer 5 (see figure 4), wherein the metal molecule bonding layer 5 can be one selected from a group consisting of zinc, copper, nickel, a zinc-copper alloy and a copper-nickel alloy, and the metal molecule bonding layer 5 is instantly cooled to form the electric pattern 6;
(d) The shielding layer 2 on the liquid crystal polymer film 1 is removed, and the liquid crystal polymer film 1 having the electrical pattern 6 is taken out (see fig. 5).
In the step (c), the spraying air pressure used by the normal-temperature air pressure meltallizing method is 3-12 atmospheric pressure (Bars); the melting temperature of the used melting and jetting machine can be adjusted according to different conductive materials, the voltage used by the melting and jetting machine is 20-50V, the current used is 185-295A, the metal is melted by arc mode, then the metal particles are formed by blowing pressurized gas, the metal particles are sprayed and fixed on the rough part 4, and the metal molecule bonding layer 5 is formed, and the temperature of the metal particles is instantly reduced to normal temperature, namely about 24-40 ℃. The adhesion force of the metal molecule bonding layer 5 of the invention to the rough part 4 is 9kgf/cm 2 ~11kgf/cm 2 And the porosity of the metal molecule bonding layer 5 is 1-5% to improve the bonding force and fineness. When the liquid crystal polymer film 1 and the electrical pattern 6 are applied to a flexible circuit board, the electrical pattern 6 can be a conductive circuit with a line width less than or equal to 0.15mm for electrical conduction, and the high-frequency requirement of electronic and communication working frequency is met. Furthermore, the electrical pattern 6 can also be used for EMI shielding.
The above-described embodiments are intended to be illustrative only and not limiting, and various changes and modifications that may be suggested to one skilled in the art without departing from the spirit and scope of the invention are intended to be included within the scope of the appended claims.
Claims (7)
1. A method for manufacturing an electric pattern of a liquid crystal polymer film comprises the following steps:
a) Taking the liquid crystal polymer film made of liquid crystal polymer;
b) Forming a shielding layer on the surface of the liquid crystal polymer film, and making a hollow pattern on the shielding layer according to a preset pattern shape;
c) Blowing metal particles formed by molten metal by using pressurized gas by using a normal-temperature air pressure meltallizing method, enabling the metal particles to pass through the hollow-out pattern of the shielding layer to be sprayed and fixed on the corresponding surface of the liquid crystal polymer film to form a metal molecule bonding layer, and instantly cooling the metal molecule bonding layer into the electric pattern;
d) Removing the shielding layer on the liquid crystal polymer film, and taking out the liquid crystal polymer film with the electric pattern.
2. The method for manufacturing an electrical pattern of a liquid crystal polymer film according to claim 1, wherein in the step b), the shielding layer is formed by one method selected from the group consisting of tape, printing, coating, and shielding.
3. The method for manufacturing an electrical pattern of a liquid crystal polymer film according to claim 1, wherein in the step b), a laser beam is used to pass through the hollow pattern to process the corresponding surface of the liquid crystal polymer film into a rough portion, and then in the step c), the metal molecule bonding layer is sprayed and fixed on the rough portion.
4. The method for fabricating an electrical pattern on a liquid crystal polymer film according to claim 1, wherein in the step c), the metal molecule bonding layer is selected from one of the group consisting of Zn, cu, ni, zn-Cu alloy and Cu-Ni alloy.
5. The method for manufacturing an electrical pattern of a liquid crystal polymer film according to claim 1, wherein in the step c), the adhesion force of the metal molecule bonding layer to the surface of the liquid crystal polymer film is 9kgf/cm 2 ~11kgf/cm 2 And the porosity of the metal molecule bonding layer is 1-5%.
6. The method for manufacturing an electrical pattern of a liquid crystal polymer film according to claim 1, wherein in the step d), the electrical pattern is provided as a conductive line having a line width of 0.15mm or less for electrical conduction.
7. The method for manufacturing an electrical pattern of a liquid crystal polymer film according to claim 1, wherein in the step d), the electrical pattern is used for shielding against electromagnetic interference (EMI) or EMI shielding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110430490.9A CN115226313A (en) | 2021-04-21 | 2021-04-21 | Method for producing electric pattern of liquid crystal polymer film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110430490.9A CN115226313A (en) | 2021-04-21 | 2021-04-21 | Method for producing electric pattern of liquid crystal polymer film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115226313A true CN115226313A (en) | 2022-10-21 |
Family
ID=83605600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110430490.9A Pending CN115226313A (en) | 2021-04-21 | 2021-04-21 | Method for producing electric pattern of liquid crystal polymer film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115226313A (en) |
-
2021
- 2021-04-21 CN CN202110430490.9A patent/CN115226313A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1236221A (en) | Method of manufacturing printed circuit boards | |
US2777193A (en) | Circuit construction | |
US20060145343A1 (en) | BGA package having half-etched bonding pad and cut plating line and method of fabricating same | |
CN107920415B (en) | Circuit board with thick copper circuit and manufacturing method thereof | |
CN109862705A (en) | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road | |
KR20040073387A (en) | Copper foil for high frequency circuit and method of production of same | |
CN101815409A (en) | Method for manufacturing circuit board through injection molding | |
JPH0681172A (en) | Formation of fine pattern | |
CN115226313A (en) | Method for producing electric pattern of liquid crystal polymer film | |
CN215835600U (en) | Liquid crystal polymer film electric pattern structure | |
TWI817108B (en) | Liquid crystal polymer film electrical pattern manufacturing method | |
TWM616420U (en) | Electrical pattern structure of liquid crystal polymer film | |
CN103167738A (en) | Metal image manufacturing method and metal image semi-finished plate | |
US9049779B2 (en) | Electrical components and methods of manufacturing electrical components | |
JP2001196738A (en) | Metal base circuit board and manufacturing method therefor | |
CN113660787B (en) | Manufacturing method, production line and high-frequency plate capable of enabling side copper of high-frequency plate to be flush with base material | |
CN114686884B (en) | Etching area control method for precisely preventing side etching | |
CN113543481B (en) | 3D circuit board manufacturing method | |
JP6121609B2 (en) | Method for etching carbon nanotube sheet material for electrical circuits and thin film thermal structures | |
CN113939105A (en) | Method for preparing circuit board by composite jet printing process and prepared circuit board | |
JP2000353726A (en) | Manufacture of film carrier | |
CN114222421A (en) | Circuit board printing method for preventing carbon oil leakage short circuit | |
CN113645764A (en) | Metallization processing method for plastic part surface | |
JPH1032281A (en) | Semiconductor circuit board with built-in resistor | |
CN114286499A (en) | PCB with different circuit heights and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |