CN115219748A - Test needle seat structure applied to high-frequency measurement - Google Patents

Test needle seat structure applied to high-frequency measurement Download PDF

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Publication number
CN115219748A
CN115219748A CN202110407031.9A CN202110407031A CN115219748A CN 115219748 A CN115219748 A CN 115219748A CN 202110407031 A CN202110407031 A CN 202110407031A CN 115219748 A CN115219748 A CN 115219748A
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CN
China
Prior art keywords
circuit board
probes
frequency measurement
movable circuit
flexible film
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Pending
Application number
CN202110407031.9A
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Chinese (zh)
Inventor
陈福全
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Guanquan Technology Industry Co ltd
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Guanquan Technology Industry Co ltd
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Application filed by Guanquan Technology Industry Co ltd filed Critical Guanquan Technology Industry Co ltd
Priority to CN202110407031.9A priority Critical patent/CN115219748A/en
Publication of CN115219748A publication Critical patent/CN115219748A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The invention provides a test needle seat structure applied to high-frequency measurement, which comprises: a needle seat, which comprises an upper plate, a lower plate and a plurality of probe slots, wherein a plurality of probes are arranged in the probe slots, and a plurality of first slots and a plurality of second slots are arranged between the upper plate and the lower plate; a movable circuit board, which is arranged at the top side of the upper board, wherein a telescopic gap is arranged between the upper board, and a plurality of through holes for the penetration of a plurality of locking components are arranged at the positions corresponding to the plurality of second grooves; the periphery of the flexible film is attached to the lower surface of the movable circuit board, the flexible film is coated and attached to the bottom side of the lower board, a plurality of conductive top blocks are arranged at positions corresponding to the plurality of probes, and an object to be detected is arranged at the bottom side of the flexible film at intervals of a pushing gap.

Description

Test needle seat structure applied to high-frequency measurement
Technical Field
The invention relates to a test needle seat structure applied to high-frequency measurement, in particular to a test needle seat structure which is characterized in that a telescopic film and a plurality of conductive top blocks arranged in the telescopic film are arranged between a plurality of probes and a plurality of contacts of an object to be measured so as to achieve the purpose of measuring the object to be measured with high-frequency signals without generating noise, and simultaneously ensure that the contact force between the probes and the plurality of contacts of the object to be measured is moderate so as to avoid the damage between the probes and the plurality of contacts of the object to be measured due to hard force or rapid abrasion.
Background
The Probe Card is applied to the packaging engineering after the test point conduction or disconnection test is performed on the bare chip by the Probe (Probe) before the Integrated Circuit (IC) is packaged, and then the defective product is screened out. Therefore, the probe card is an important process for testing the integrated circuit; the probe card testing process can increase the yield of the finished product from 70% to 90%, wherein the yield contribution of 20% is very significant and necessary for the semiconductor manufacturer whose yield is believed to be the correct one. The probe card is an interface between a testing machine and a Wafer (Wafer), each integrated circuit needs at least one corresponding probe card for testing, and the purpose of testing the probe card is to enable the Wafer to pass the test good product and enter the next packaging process after cutting, and to avoid larger waste caused by the continuous processing of the defective product.
In a Wafer (Wafer) or Printed Circuit Board (PCB) testing apparatus currently used in the industry, a testing fixture sets a plurality of probes through a probe card, so that the plurality of probes are electrically connected with a plurality of test points of the Wafer or PCB to be tested, and electronic signals of the test points are obtained by the probes and transmitted to a testing machine through a plurality of wires, the testing machine displays whether the plurality of test points of the Wafer or PCB to be tested are in a conducting or breaking state, but the contact point of the probe and the plurality of test points of the device to be tested have not too large amount of pressing contact force, otherwise the test points will be damaged, and further, in response to the requirement of applying the test to the high-frequency device to be tested, the length of the probe inside the probe card needs to be greatly shortened, so that no additional noise exists during the transmission of the test signals and the accuracy of the measurement is maintained, but the relative hardness of the probe increases due to the reduction of the length of the probe, and the applied force of the test points forming the device to be tested increases, and the damage of the device to be tested and the test points of the device to be tested are damaged. In addition, the increased hardness of the probe also creates a situation in which the probe is prone to wear, which is a problem in measuring high frequency devices under test and needs to be solved in the industry.
Disclosure of Invention
Therefore, in view of the above problems and disadvantages, the inventor of the present invention has developed an invention for designing a test socket structure for high frequency measurement by collecting relevant data and performing multiple evaluations and considerations.
In order to achieve the purpose, the invention adopts the technical scheme that:
a test needle seat structure applied to high-frequency measurement is characterized by comprising:
a needle seat, which comprises an upper plate and a lower plate, wherein a plurality of probe grooves for positioning a plurality of probes are arranged between the upper plate and the lower plate in a penetrating way, the plurality of probes comprise a butting head part with larger diameter and positioned at the top side of the upper plate, the butting head part extends to one side to form a needle body with smaller diameter and positioned at the bottom side of the lower plate, the upper plate is also provided with a plurality of first grooves for accommodating a plurality of elastic pieces, and one side of the plurality of first grooves is provided with a plurality of second grooves extending from the upper plate to the lower plate;
a movable circuit board, which is arranged at the top side of the upper board, wherein a telescopic gap is arranged between the upper board, a plurality of through holes for a plurality of locking elements to penetrate are arranged at the positions corresponding to the plurality of second grooves, the rod body of the locking element penetrates the upper board of the second groove, a locking part with external threads at the tail end of the locking element is locked at the lower board of the second groove, and the head part of the locking element is positioned at the upper surface of the movable circuit board; and
the periphery of the flexible film is attached to the lower surface of the movable circuit board, the flexible film is coated and attached to the bottom side of the lower board, a plurality of conductive jacking blocks are arranged at positions corresponding to the plurality of probes, a to-be-tested object is arranged at the bottom side of the flexible film at intervals of a pushing gap, a plurality of contacts which correspond to the plurality of conductive jacking blocks and can be electrically connected are arranged in the to-be-tested object, the movable circuit board moves towards the direction of the pin base and causes the plurality of elastic pieces to be compressed, the bottom surface of the movable circuit board pushes the plurality of probes to move towards the direction of the to-be-tested object, the plurality of probes are abutted against and push the plurality of conductive jacking blocks and expand the flexible film, the plurality of probes are pushed by the movable circuit board and form a lateral bending deformation state, the plurality of conductive jacking blocks are electrically connected with the plurality of contacts of the to-be-tested object, and after a conduction state signal of the plurality of contacts of the to-be-tested object is obtained, the movable circuit board moves towards the direction of the pin base and returns to the elastic pieces, and the elastic jacking blocks return to the upright state, and the plurality of probes move towards the flexible film.
The test needle seat structure applied to high-frequency measurement is characterized in that: the upper surface of the movable circuit board is pasted with a strengthening pad, and the strengthening pad can strengthen the pasting position of the movable circuit board structurally.
The test needle seat structure applied to high-frequency measurement is characterized in that: the non-sticky and high-friction anti-slip glue is coated between the telescopic film and the bottom side of the lower plate, and the anti-slip glue is composed of acrylic emulsion resin.
The test needle seat structure applied to high-frequency measurement, wherein: the distance range of the probe pushed by the movable circuit board is 0.08 mm-0.12 mm.
The test needle seat structure applied to high-frequency measurement is characterized in that: the needle body of the probe is provided with a circular arc-shaped butting circular point at the position far away from the butting head part.
The test needle seat structure applied to high-frequency measurement is characterized in that: the conductive top block is T-shaped in appearance, a flat pushing surface is arranged at the contact position of the conductive top block and the probe, and a pair of contacts which are arc-shaped and electrically connected with the contacts of the object to be detected are extended from the pushing surface to one side in a narrowing mode.
The test needle seat structure applied to high-frequency measurement is characterized in that: the telescopic gap distance is larger than the pushing gap distance, so that the plurality of probes form a lateral bending deformation state when being pushed to the position between the movable circuit board and the telescopic film.
The test needle seat structure applied to high-frequency measurement is characterized in that: the conductive top block is made of nickel-palladium alloy.
The test needle seat structure applied to high-frequency measurement, wherein: the locking element is a first-class high screw with a smooth shank.
The test needle seat structure applied to high-frequency measurement, wherein: the elastic member is composed of a spring, one end of the elastic member extends into the telescopic gap, and the other end of the elastic member abuts against the top surface of the lower plate.
The invention has the advantages that the flexible film and the conductive top blocks arranged in the flexible film are arranged between the plurality of probes and the plurality of contacts of the object to be measured, so that no noise is generated when the object to be measured with high-frequency signals is measured, and the moderate contact force between the probes and the plurality of contacts of the object to be measured is ensured, thereby avoiding the damage between the probes and the plurality of contacts of the object to be measured caused by hard force or rapid abrasion.
Drawings
Fig. 1 is a side sectional view of a test needle holder of the present invention before measurement.
Fig. 2 is a partially enlarged view of fig. 1.
Fig. 3 is a side sectional view of the test needle holder of the present invention at the time of measurement.
Fig. 4 is a partially enlarged view of fig. 2.
Description of reference numerals: 1-a needle seat; 10-a probe slot; 11-upper plate; 12-a lower plate; 13-a probe; 131-a holding head; 132-a needle body; 133-holding dots; 14-a resilient member; 15-a first groove; 16-a second groove; 2-a movable circuit board; 20-a telescopic gap; 21-punching; 3-a locking element; 31-a head; 32-a shaft; 33-a lock; 331-external threads; 4-a flexible membrane; 41-peripheral edge; 42-a conductive top block; 421-pushing the flour; 422-docking point; 5-an object to be tested; 50-lapse gap; 51-contacts; 6-strengthening the mat.
Detailed Description
To achieve the above objects and advantages, and in accordance with the purpose of the invention, as embodied and broadly described herein, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 to 4, which are a side sectional view of a test socket before measurement, a partially enlarged view of fig. 1, a side sectional view of a test socket during measurement, and a partially enlarged view of fig. 2, it can be clearly seen from the drawings that the test socket applied to high frequency measurement of the present invention includes: a needle seat 1, a movable circuit board 2, a locking element 3, a flexible membrane 4, a reinforced pad 6, whose main components and features are detailed as follows:
the needle seat 1 includes an upper plate 11 and a lower plate 12, a plurality of probe slots 10 for positioning a plurality of probes 13 are arranged between the upper plate 11 and the lower plate 12, the plurality of probes 13 include a butting head 131 with a larger diameter and positioned on the top side of the upper plate 11, the butting head 131 extends to one side to form a needle 132 with a smaller diameter and positioned on the bottom side of the lower plate 12, the upper plate 11 further has a plurality of first slots 15 for accommodating a plurality of elastic members 14, and a plurality of second slots 16 extending from the upper plate 11 to the lower plate 12 are arranged on one side of the plurality of first slots 15.
The movable circuit board 2 is disposed at the top side of the upper board 11, and a flexible gap 20 is formed between the upper board 11, and a plurality of through holes 21 for passing a plurality of locking elements 3 are disposed at the positions corresponding to the plurality of second slots 16, the locking elements 3 are equal-height screws having smooth shafts 32, the shafts 32 of the locking elements 3 pass through the upper board 11 of the second slots 16, and the locking portion 33 having external threads 331 at the end of the locking elements 3 is locked at the lower board 12 of the second slots 16, and the head 31 of the locking elements 3 is positioned at the upper surface of the movable circuit board 2.
The periphery of the flexible film 4 is attached to the lower surface of the movable circuit board 2, the flexible film 4 is attached to the bottom side of the lower plate 12 and provided with a plurality of conductive top blocks 42 corresponding to the plurality of probes 13, the conductive top blocks 42 are made of nickel-palladium (Ni-Pd), the bottom side of the flexible film 4 is provided with a tested object 5 at intervals of a pushing gap 50, the tested object 5 is further provided with a plurality of contacts 51 corresponding to the plurality of conductive top blocks 42 and capable of forming electrical connection, the movable circuit board 2 moves towards the direction of the pin base 1 and causes the plurality of elastic members 14 to be compressed, the bottom surface of the movable circuit board 2 pushes the plurality of probes 13 to move towards the tested object 5, the plurality of probes 13 push and push the plurality of conductive top blocks 42 and expand the flexible film 4, the plurality of probes 13 are pushed by the movable circuit board 2 and resilient restoring force of the flexible film 4 to form a lateral bending deformation state, the plurality of conductive top blocks 42 and the contacts of the tested object 5 form a resilient restoring force, the plurality of contacts form a resilient restoring force, the resilient state of resilient pins 13 are pushed by the movable circuit board 2 and the resilient film 13 returns to the resilient state of the movable circuit board 2, the resilient pins 13 returns to the resilient state of the resilient pins 13, and the resilient pins move towards the resilient state of the resilient pins 1, the resilient circuit board 2, and the resilient pins 13 returns to the resilient state of the resilient pins to the resilient state of the resilient circuit board 2.
The upper surface of the movable circuit board 2 is further covered with a reinforcing pad 6, and the reinforcing pad 6 can form structural reinforcement at the covered part of the movable circuit board 2 so as to avoid the condition that the movable circuit board 2 is broken and damaged due to external stress.
An anti-slip glue (not shown) having no adhesion but high friction is further coated between the flexible film 4 and the bottom side of the lower plate 12, the anti-slip glue is composed of Acrylic acid polymer (Acrylic acid Polymers), the flexible film 4 can be tightly attached to the bottom side of the lower plate 12 by coating the anti-slip glue, so as to facilitate the accurate alignment of the probes 13 and the conductive top block 42, and the flexible film will not stick to the conductive top block after being supported by the probes 13, so that the flexible film 4 can be smoothly pushed to form an expanded state.
The distance range of the probe 13 pushed by the movable circuit board 2 is 0.08mm to 0.12mm (millimeter), and a circular arc-shaped holding dot 133 is formed on the needle body 132 of the probe 13 away from the holding head 131.
The conductive top block 42 is generally T-shaped in appearance, and has a flat pressing surface 421 at the contact position of the conductive top block 42 and the probe 13, and a pair of contacts 422 which are arc-shaped and electrically connected with the contacts 51 of the object 5 to be tested are extended and narrowed from the pressing surface 421 to one side.
The distance of the retractable gap 20 is greater than the distance of the movable gap 50, so that the plurality of probes 13 form a lateral bending deformation state when being pushed between the movable circuit board 2 and the retractable film 4, and the laterally bent probes 13 can ensure that the probes 13 are reliably abutted against the pressing surface 421 of the conductive top block 42.
The elastic member 14 is formed by a spring, and one end of the elastic member 14 extends into the telescopic gap 20 and the other end thereof abuts against the top surface of the lower plate 12.
When the test socket of the present invention performs high frequency test object detection, a mechanical force is applied from top to bottom to the upper surface of the movable circuit board 2 or the reinforcing pad 6, the movable circuit board 2 moves toward the socket 1 after being stressed and causes the plurality of elastic members 14 to be compressed, the bottom surface of the movable circuit board 2 abuts against the top surface of the upper plate 11, and the bottom surface of the movable circuit board 2 pushes the abutting head 131 of the plurality of probes 13 to move toward the direction of the test object 5, and the abutting dots 133 of the plurality of probes 13 abut against and push the plurality of conductive pads 42 and expand and extend the flexible film 4, and the plurality of probes 13 are pushed by the movable circuit board 2 and the elastic restoring force of the flexible film 4 to form a lateral bending deformation state (as shown in fig. 3 and 4), and it is particularly described that, since the distance of the flexible gap 20 is greater than the distance of the pushing gap 50, the plurality of probes 13 abut against the flexible film 4 first, the movable circuit board 2 still moves, and the plurality of probes 13 form a lateral bending state in compliance with the pushing force, and cause the plurality of conductive pads 42 to be connected with the plurality of conductive pads 51 of the test object 5, and the electrical connection point 51 of the test board 51, and the electrical connection point 51 is displayed after the electrical connection of the test object 5.
After the test machine measures the object to be tested 5 and obtains the measurement data, the movable circuit board 2 is moved toward the needle base 1 in the reverse direction and the plurality of elastic members 14 are restored to the original state, the plurality of probes 13 are pushed by the elastic restoring force of the stretchable film 4 and move toward the movable circuit board 2, and the plurality of probes 13 are restored to the upright state from the lateral bending state, by means of the stretchable film 4 and the plurality of conductive top blocks 42 arranged in the stretchable film 4 arranged between the plurality of probes 13 and the plurality of contacts 51 of the object to be tested 5 in the measurement process, the object to be tested 5 for measuring high-frequency signals can not generate noise, and the contact force between the probes 13 and the plurality of contacts 51 of the object to be tested 5 is ensured to be moderate, so that the damage caused by hard force or rapid wear between the probes 13 and the plurality of contacts 51 of the object to be tested 5 is avoided.
With reference to fig. 1 to 4, it can be understood that the present invention is a test needle seat structure for high frequency measurement, including: a needle seat, which comprises an upper plate, a lower plate and a plurality of probe slots, wherein a plurality of probes are arranged in the probe slots, and a plurality of first slots and a plurality of second slots are arranged between the upper plate and the lower plate; a movable circuit board, which is arranged at the top side of the upper plate, a telescopic gap is arranged between the upper plate, and a plurality of through holes for the penetration of a plurality of locking elements are arranged at the positions corresponding to the plurality of second grooves; the periphery of the flexible film is attached to the lower surface of the movable circuit board, the flexible film is attached to the bottom side of the lower board in a covering mode, a plurality of conductive top blocks are arranged at the positions, corresponding to the plurality of probes, of the bottom side of the flexible film, a to-be-detected object is arranged at intervals of a pushing gap at the bottom side of the flexible film, the flexible film is arranged between the plurality of probes and a plurality of contacts of the to-be-detected object, the flexible film and the plurality of conductive top blocks arranged in the flexible film are used, noise cannot be generated when the to-be-detected object with high-frequency signals is measured, meanwhile, the contact strength between the probes and the plurality of contacts of the to-be-detected object is ensured to be moderate, and damage caused by hard force or quick abrasion between the probes and the plurality of contacts of the to-be-detected object is avoided.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations, or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A test needle seat structure applied to high-frequency measurement is characterized by comprising:
a needle seat, which comprises an upper plate and a lower plate, wherein a plurality of probe grooves for positioning a plurality of probes are arranged between the upper plate and the lower plate in a penetrating way, the plurality of probes comprise a butting head part with larger diameter and positioned at the top side of the upper plate, the butting head part extends to one side to form a needle body with smaller diameter and positioned at the bottom side of the lower plate, the upper plate is also provided with a plurality of first grooves for accommodating a plurality of elastic pieces, and one side of the plurality of first grooves is provided with a plurality of second grooves extending from the upper plate to the lower plate;
a movable circuit board, which is arranged at the top side of the upper board, wherein a telescopic gap is arranged between the upper board, a plurality of through holes for a plurality of locking elements to penetrate are arranged at the positions corresponding to the plurality of second grooves, the rod body of the locking element penetrates the upper board of the second groove, a locking part with external threads at the tail end of the locking element is locked at the lower board of the second groove, and the head part of the locking element is positioned at the upper surface of the movable circuit board; and
the periphery of the flexible film is attached to the lower surface of the movable circuit board, the flexible film is attached to the bottom side of the lower board in a covering mode, a plurality of conductive jacking blocks are arranged at positions corresponding to the plurality of probes, a to-be-detected object is arranged at the bottom side of the flexible film at intervals of a pushing gap, a plurality of contacts which correspond to the plurality of conductive jacking blocks and can be electrically connected are arranged in the to-be-detected object, the movable circuit board moves towards the direction of the needle seat and enables the plurality of elastic pieces to be compressed, the bottom surface of the movable circuit board pushes the plurality of probes to move towards the direction of the to-be-detected object, the plurality of probes abut against and push the plurality of conductive jacking blocks and enable the flexible film to expand, the plurality of probes are pushed by the movable circuit board and elastic restoring force of the flexible film to form a laterally bent deformation state, the plurality of conductive jacking blocks are electrically connected with the plurality of contacts of the to-be-detected object, after conducting state signals of the plurality of contacts of the to-be-detected object are obtained, the movable circuit board moves towards the reverse direction and the plurality of elastic pieces restore the original state, the probes move towards the needle seat and the flexible film and the movable film moves towards the upright state, and the plurality of probes move towards the upright state.
2. The test hub structure for high frequency measurement according to claim 1, wherein: the upper surface of the movable circuit board is pasted with a strengthening pad, and the strengthening pad can strengthen the pasting position of the movable circuit board structurally.
3. The test hub structure for high frequency measurement according to claim 1, wherein: the non-sticky and high-friction anti-slip glue is coated between the telescopic film and the bottom side of the lower plate, and the anti-slip glue is composed of acrylic emulsion resin.
4. The test hub structure for high frequency measurement according to claim 1, wherein: the distance range of the probe pushed by the movable circuit board is 0.08 mm-0.12 mm.
5. The test hub structure for high frequency measurement according to claim 1, wherein: the needle body of the probe is provided with a circular arc-shaped butting circular point at the position far away from the butting head part.
6. The test hub structure for high frequency measurement according to claim 1, wherein: the conductive top block is T-shaped in appearance, a flat pushing surface is arranged at the contact position of the conductive top block and the probe, and a pair of contacts which are arc-shaped and electrically connected with the contacts of the object to be detected are extended from the pushing surface to one side in a narrowing mode.
7. The test hub structure for high frequency measurement according to claim 1, wherein: the telescopic gap distance is larger than the pushing gap distance, so that the plurality of probes form a lateral bending deformation state when being pushed to the position between the movable circuit board and the telescopic film.
8. The test hub structure for high frequency measurement according to claim 1, wherein: the conductive top block is made of nickel-palladium alloy.
9. The test hub structure for high frequency measurement according to claim 1, wherein: the locking element is a first-class high screw with a smooth shank.
10. The test hub structure for high frequency measurement according to claim 1, wherein: the elastic member is composed of a spring, one end of the elastic member extends into the telescopic gap, and the other end of the elastic member abuts against the top surface of the lower plate.
CN202110407031.9A 2021-04-15 2021-04-15 Test needle seat structure applied to high-frequency measurement Pending CN115219748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110407031.9A CN115219748A (en) 2021-04-15 2021-04-15 Test needle seat structure applied to high-frequency measurement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110407031.9A CN115219748A (en) 2021-04-15 2021-04-15 Test needle seat structure applied to high-frequency measurement

Publications (1)

Publication Number Publication Date
CN115219748A true CN115219748A (en) 2022-10-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110407031.9A Pending CN115219748A (en) 2021-04-15 2021-04-15 Test needle seat structure applied to high-frequency measurement

Country Status (1)

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CN (1) CN115219748A (en)

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