CN115209687A

CN115209687A - Electronic assembly for a motor vehicle

Info

Publication number: CN115209687A
Application number: CN202210387815.4A
Authority: CN
Inventors: B·邦潘; F·贝格
Original assignee: Robert Bosch GmbH
Current assignee: Robert Bosch GmbH
Priority date: 2021-04-13
Filing date: 2022-04-13
Publication date: 2022-10-18
Also published as: DE102021203625A1

Abstract

The invention relates to an electronic assembly for a motor vehicle, comprising: at least one electronic unit (62, 66) having at least one electronic component (64); at least one housing (52, 54) surrounding an electronic unit (62, 66) having an electronic component (64), wherein the electronic component (64) is thermally conductively connected to the housing (52, 54), characterized in that at least one heat dissipation structure (60) or a component having a high thermal conductivity is arranged outside the housing (52, 54) in order to dissipate heat from the electronic component (62) at least partially outside the housing (52, 54).

Description

Electronic assembly for a motor vehicle

Technical Field

The invention relates to an electronic assembly of a motor vehicle of the type according to the independent claim.

Background

A central vehicle component mounting arrangement with an electrical interface is known from DE 10105292 A1, in which a plurality of electrical devices, such as an audio unit, a display unit, a navigation unit and an air conditioning unit operating unit, are combined into a one-piece construction as a component, the electrical devices being arranged almost centrally in the transverse direction of the vehicle dashboard.

An electronic control device, in particular a module carrier with plug-in positions for plug-in modules that can be ventilated externally, is known from DE 10244607 A1.

Disclosure of Invention

The purpose of the invention is: an electronic assembly for simple adaptation to different thermal requirements is proposed. The object is achieved by the features of the independent claims.

By arranging at least one heat dissipation structure or a component having a high thermal conductivity outside the housing of a particularly replaceable electronic component of a motor vehicle in order to dissipate heat from the electronic component at least partially outside the housing, an almost complete design freedom is provided on the inside of the housing with approximately the same thermal behavior by transferring the thermal conductivity structure to the outside of the housing. In addition, the heat dissipation structure can be used for targeted mechanical fastening or stabilization of components of the electronic assembly, for example. Furthermore, modular construction can thus be carried out in the following manner: that is, the heat dissipation structures, which are each suitable for the respective power loss to be dissipated, are assembled in a manner easily accessible from the outside and can be replaced later if necessary, for example, if the power loss changes in the case of a replaced electronic component or an upgrade of the software of the electronic component. By means of the modularity thus achieved in the design of the heat dissipation structure and in the housing design, a flexible adaptation to the environmental conditions and to the heat flows to be conducted is possible. Thus, for example, a more powerful heat dissipation structure, for example in the form of a vapor chamber, can be used in the case of a change in the layout of components with higher power losses. In particular, the replaceable electronic components can be particularly computationally intensive functions in the field of motor vehicles, i.e., for example, semi-automatic or automatic driving, communication modules, gateway functions, infotainment, security applications, etc. These functions may be implemented separately in replaceable electronic components. The interchangeability also allows for subsequent retrofitting of current hardware as follows: i.e. the electronic components can be easily replaced.

In an advantageous development, the heat dissipation structure is at least one vapor chamber and/or heat pipe and/or pulsating heat pipe and/or at least one thermally conductive foil and/or coating and/or a component with good thermal conductivity, such as, for example, copper or aluminum or the like. By means of a suitable material or technical choice, the respectively required heat dissipation structure can be arranged for each electronic component individually, without the need for adapting the housing and the electronic component itself.

In an advantageous further development, it is proposed that: the housing of the electronic assembly is formed as a die casting, in particular an aluminum die casting, as an extrusion or as a sheet metal part. Thereby further improving the degree of freedom in design.

In an advantageous development, the heat dissipation structure is arranged at the housing between an edge region of the housing and the electronic component. This makes it possible to effectively dissipate heat from the heat sink which is preferably connected to the edge of the housing. In an advantageous development, the heat dissipation structure is connected to the housing material in order to minimize the thermal resistance, in particular by a soldered connection. In this way, the desired heat dissipation can be carried out particularly preferably also outside the housing.

In an advantageous development, the housing and/or an edge region of the housing can be connected to a receptacle of a further housing for receiving and dissipating heat from the replaceable electronic component. In this arrangement, a further housing can be provided, which can accommodate a plurality of replaceable electronic components and via which lost heat is conducted away.

In an advantageous further development, it is proposed that: the housing comprises at least one heat conducting structure, in particular a recess of a surface of the housing which projects towards the electronic unit, wherein the heat conducting structure is in heat conducting connection with the electronic component. As a result, in particular, a low power loss can also be dissipated via the housing itself, which further increases the flexibility of the heat-conducting design.

In an advantageous further development, it is proposed that: at least two housing halves each have edge regions which overlap in the assembled state, in particular by being screwed and/or clamped by a connecting mechanism. In particular, it is preferred that the connecting means for connecting the housing, in particular with the receptacle, and/or for connecting the two housing halves, are designed such that the connecting means act on the edge region and on the receptacle of the other housing for releasable fastening. In particular, good heat transfer to the other housing can thereby be achieved by clamping. For this purpose, it is particularly preferably provided that: the connecting means is arranged between an edge region of the housing and the receptacle, and the edge region of the housing is arranged between the connecting means and a further receptacle of the further housing. Preferably, the receptacle is an integral part of the other housing. Thereby, the fixation and the heat transfer can be further improved.

In an advantageous further development, it is proposed that: at least one of the housing halves has at least one recess and the other housing half has at least one elevation, which in the assembled state engage in one another. This allows a positionally accurate assembly of the two housing halves relative to one another.

In an advantageous further development, it is proposed that: the two electronic units each carry electronic components on sides facing away from one another in the assembled state. The heat dissipation of the electronic component can thus take place particularly simply towards the respective two sides of the housing.

In particular, it is advantageous to provide a device for accommodating replaceable electronic components, wherein at least one housing made of a thermally conductive material is provided, which at least partially encloses the replaceable electronic components, and at least one front side, which is detachably connected to the housing and via which the replaceable electronic components, which can be arranged in the interior of the housing, can be accessed, wherein at least one cooler is arranged at least one outer side of the housing in order to cool at least one of the replaceable electronic components. In particular, the arrangement of the cooler on the outer side of the housing makes it possible to adapt the system flexibly and modularly to the respective performance requirements in a particularly simple manner.

Further advantageous developments emerge from the further dependent claims and the description.

Drawings

The figures show:

fig. 1 shows a rear side of a device for accommodating replaceable electronic components in a motor vehicle;

figure 2 shows the front side of the device;

FIG. 3 shows a detail view of a housing of the apparatus with a cooler;

FIG. 4 shows an exploded view of an overall view of a device having a plurality of replaceable electronic components;

FIG. 5 shows a perspective view of the replaceable electronic component from above;

fig. 6 shows a perspective view of the replaceable electronic component from below;

FIG. 7 shows an exploded view of a perspective overall view of the replaceable electronic component;

FIG. 8 shows a side view of an electronic assembly; and

fig. 9 shows the illustration according to fig. 8 with the heat dissipation structure depicted.

Detailed Description

The present invention is schematically illustrated according to an embodiment and described in detail below with reference to the accompanying drawings.

Fig. 1 shows a perspective view of a device 10 for receiving replaceable electronic components 50 of a motor vehicle, viewed toward the rear. For example, the device 10 is rectangular in configuration. The device 10 comprises a housing 11. The housing 11 is closed at the rear via a housing cover 22 at the rear, in particular by mechanical fasteners 24, i.e. for example screws. The rear housing cover 22 can be, for example, a die cast part, particularly preferably an aluminum die cast part. As will be shown later, the rear housing cover 22 carries a circuit board 34 oriented perpendicular to the replaceable electronic component 50. Depending on the application, a plurality of plugs 30 project through the rear housing cover 22. The seal 26 is preferably arranged between the housing cover 22 on the rear side and the housing 11.

At least one cooler 40 is disposed at least one side of the housing 11. In this exemplary embodiment, the cooler 40 is of rectangular design. The cooler has, for example, two connections 42. The interface 42 is oriented parallel to the plug 30 in the direction of the rear side. The cooling medium can be introduced or removed via the connection 42. For example, a fluid, such as water or air, may be used as the cooling medium. In this embodiment, the coolers 40 are mounted to the two side surfaces 14 of the housing 11, respectively. The outer surface of the cooler 40 is flush with the outer edge of the fastening structure 12. The cooler 40 is located between the two fastening structures 12. The cooler 40 is in heat-conducting connection with the housing 11. For example, the cooler 40 may be connected to the housing 11 by a material connection such as a welded connection. The cooler 40 serves to dissipate heat generated in the electronic component 50, which reaches the cooler 40 via the thermally conductive housing 11 and is dissipated. Depending on the power losses that occur, passive or active cooling can be performed. For example, active cooling may be performed by air or a suitable fluid. However, by selecting the cooler 40 accordingly, a harmonically scalable thermal design can be achieved depending on the specific application without having to adapt the housing 11 or the like.

A plurality of fastening structures 12 are provided on the housing 11. In this embodiment, the fastening structure 12 is configured as a rail and is used for accommodating a corresponding holder arranged in the vehicle. The fastening structure 12 preferably extends at the corners of the device 10 between the housing cover 22 on the rear side and the front side 20 of the device 10. The fastening structure 12 is an integral component of the housing 11, which is shown in more detail in fig. 3.

Fig. 2 shows a perspective view of the device 10 for receiving a replaceable electronic component 50 for a motor vehicle, viewed in the direction of the front side 20. The front side 20 is mounted to an inlet of a replaceable electronic component 50 arranged in the interior of the device 10. The front side 20 can be opened and closed via mechanical fasteners 24. For example, the front side 20 may be constructed of a sheet material. For example, the mechanical fastener 24 may be configured as a threaded connection. For example, a threaded sleeve extruded here can be integrated as a component of the fastening element 24 in the housing 11.

Fig. 3 shows the housing 11 with the respective laterally arranged coolers 40. The housing 11 is constructed in one piece. The housing 11 has a substantially rectangular cross-section. The side 14 of the housing 11 is configured to receive the cooler 40. A plurality of receiving portions 18 are provided on the inner side 16 of the side surface 14 of the housing 11. The substantially rail-shaped receptacle 18 serves to receive, push in and/or clamp the replaceable electronic component 50. For this purpose, at least two receptacles 18, which are arranged parallel to one another and via which the housing edge of the electronic module 50 can be clamped, are provided for the replaceable electronic module 50. The receptacles 18 each extend parallel between the front side 20 and the rear side. Particularly preferably, the receptacle 18 is an integral component of the housing 11. The housing 11 is made of a heat conductive material. In this embodiment, for example, aluminum is proposed. The housing 11 is designed as a one-piece basic housing. The housing 11 can be scaled appropriately in the X, Y and Z directions depending on the application, i.e., depending on the size of the replaceable electronic component 50 to be accommodated. Depending on the application, a corresponding different rear housing cover 22 can be used, which represents a corresponding plug design or the replaceable electronic components 50 used. Furthermore, a recess 28 for accommodating the seal 26 is provided in the housing 11 on at least one end side, preferably on both end sides. The recess 28 serves to accommodate the radial sealing profile at the housing 11. Thereby, specific IP and EMV protection levels can be achieved. The recess 28 may be adapted by suitable milling of the housing 11 so that the seal 26 may be accommodated. The housing 11 is preferably configured as an extruded profile. Particularly preferably, the housing 11 is formed from an extruded aluminum profile.

Fig. 4 shows an exploded view of an overall view of the device 10 with a plurality of replaceable electronic components 50. The housing cover 22 on the rear side has corresponding ribs 32 or shields on the side oriented toward the interior 16 of the housing 11. The ribs 32 project slightly inwardly. In this embodiment, the ribs surround the upper or lower opening for receiving the plug 30, respectively. The housing cover 22 on the rear side has a well visible receptacle 23 in this view. The accommodating portions 23 are respectively arranged at the side portions of the housing cover 22 on the rear side, and are used to fix the circuit board 34.

The circuit board 34 is arranged parallel to the housing cover 22 on the rear side. On the circuit board 34, the plug 30 is contacted on the side facing away from the interior 16 of the housing 11, said plug projecting through the housing cover 22 on the rear side for contact in the vehicle. On the other side of the circuit board 34, corresponding plug connectors 31 are provided, via which the replaceable electronic component 50 is in contact with the plug 30 in the pushed-in state. The plug connection device 31 may be, for example, a so-called board edge connector or the like.

Several replaceable electronic components 50 have been pushed into the interior 16 of the housing 11. The structure of the replaceable electronic component 50 is shown, for example, in the front region. The replaceable electronic component 50 includes a housing 52. The housing 52 is formed, for example, by two housing halves 54. The housing halves 54 enclose at least one

electronics unit

62, 66 or a circuit board on which the

electronics components

64, 66 are arranged. The housing 52 may be constructed of two metal plate halves 54 that are threaded together.

In this exemplary embodiment, an electronics unit 62 is provided, which extends over almost the entire width of the housing 11 and has several electronics components 64. The electronic unit 62 may be, for example, a circuit board or a so-called substrate or motherboard. For example, below the electronic unit 62 there is a further electronic unit 66 which has a further electronic component 64, in particular an electronic component 64 which generates lost heat. These electronic components 64 are preferably arranged on the respective

electronic unit

62, 66 such that their upper sides are each oriented toward the adjacent housing half 54. The

electronic units

62, 66 with the associated electronic components 64 comprise, in particular, a high-performance computer core, which assumes particularly computationally intensive functions in the motor vehicle. Here, these are, for example, automatic or semi-automatic driving functions, infotainment, communication interfaces or gateway functions between different bus systems (ethernet, CAN, LIN, etc.), specific security applications for granting authorization in order to also be able to access the motor vehicle, for example, from the outside, or other operations in the motor vehicle which are associated with a high computing capacity. The electronic component 64 is particularly preferably a powerful processor, a multicore processor or a highly integrated circuit (SoC, system on chip) which is characterized by a high loss of power.

The side faces each show a connecting means 58 for fastening and/or thermally contacting the replaceable electronic component 50 to the housing 11 in the respective receptacle 18. The connecting means 58 serve in particular to clamp the housing 52 to the housing 11. Good thermal contact from the electronic assembly 50 to the housing 11 is achieved by clamping. For example, a so-called wedge lock is used as the connecting mechanism 58. The housing edge of the housing 52 can preferably be releasably wedged or clamped with the receptacle 18 via the connecting means 58.

At least one heat dissipation structure 60 is disposed at the underside of the housing 52. Components with particularly good thermal conductivity, for example so-called vapor chambers, heat pipes, pulsating heat pipes, are used as the heat dissipation structure 60. Alternatively, for example, copper plates, heat-conducting foils or particularly heat-conducting layers can be used. The heat dissipation structure 60 serves to conduct the lost heat of the electronic component 64, which generates a particularly large amount of heat, out to the clamped edges or heat sinks of the electronic assembly 50.

Fig. 5 shows the replaceable electronic component 50 in an assembled state in a top view. As can be seen in greater detail there, the upper housing half 54 has a corresponding recess relative to the heat-conducting structure 56 in order to thus form a good thermal contact with the heat-generating electronic component 64. This serves for better heat dissipation via the housing halves 54.

In fig. 6, the replaceable electronic component 50 is shown in an assembled state in a bottom view, wherein two heat dissipation structures 60 of plate-like design are thermally conductively connected to the lower side or lower housing half 54 of the housing 52. As described above, the heat of the electronic components 64 arranged above it is conducted away in the direction of the side wall 16 of the housing 11 and the cooler 40 arranged there.

Fig. 7 shows an exploded view of an overall perspective view of the replaceable electronic component 50. It can be seen that the upper electronics unit 62 is fixed via corresponding screw connections to two further electronics units 66 which are each arranged below the electronics unit. The recesses or heat conducting structures 56 are configured such that the lower side of the recesses 56 interacts with the upper side of the respective electronic component 64. Thus, heat from the electronics components 64 of the upper electronics unit 62 can be conducted laterally out through the upper housing half 54. Furthermore, the upper housing half 54 is laterally shaped in such a way that, on the one hand, a lateral housing wall is formed. Furthermore, the upper housing half 54 ends in the edge region 69 after the new 90-degree bend. The edge region 69 is correspondingly oriented toward the receptacle 18 of the housing 11, as is the upper side of the upper housing half 54. Two recesses 67 are provided in the edge region 69, so that the edge region of the lower housing half 54 below said recesses is received there with the raised portion 65. The ridge 65 may be laterally angled for better introduction and precise assembly in position.

While the underside of the other electronics unit 66 is in thermally conductive connection with the lower housing half 54. Below which a plate-shaped heat dissipation structure 60 is arranged.

The more precise interaction is shown in the following figures 8 and 9. It can be seen that: the underside of the thermally conductive structure 56 is in contact with the upper side of the electronic component 64 of the upper electronic unit 62. A thermally conductive connecting layer, not shown in detail, may be provided here. In addition, a connection mechanism 68 is provided which connects the upper electronic unit 62 or circuit board with the lower housing half 54. In order to maintain a defined distance, a sleeve can be provided between the underside of the electronic unit 62 and the inside of the lower housing half 54. The electronic component 64 is now mounted on the underside on a further electronic unit 66 and is in heat-conducting contact with the inside of the lower housing half 54. The thermally conductive layer may in turn be disposed between the underside of the electronic component 64 and the inside of the lower housing half 54. The heat dissipation structure 60 is fastened at the lower side of the lower housing half 54 at the lower electronic component 66 at least in the region of the electronic component 64 up to or in the direction of the edge or receptacle 18 of the housing 11. Furthermore, a further fastening mechanism 68 is provided, which connects the further electronic unit 66 to the lower housing half 54 and/or the heat dissipation structure 60 to the lower housing half 54. A spacer sleeve may be provided between the underside of the further electronic unit 66 and the upper side of the lower housing half 54.

The upper housing half 54 forms side edges via a 90 ° bend and forms edge regions 69 via a further 90 ° bend. The edge region 69 overlaps with an outer edge region of the lower housing half 54. The edge region 69 at least partially overlaps the receptacle 18 in the pushed-in state. The connecting means 58 now presses the edge region 69 of the upper housing half 54 against the edge region of the lower housing half 54 and presses both against the upper side or the lower side of the receptacle 18.

The heat dissipation structure 60 is disposed on an exterior side of the housing 52 or an exterior side of the replaceable electronic component 50. By at least partially transferring the heat conduction to the outer side of the housing 52, almost complete design freedom can be achieved on the inner side of the housing 52 with approximately the same thermal performance.

The housing 52 can be produced flexibly with regard to production, for example by injection molding, aluminum injection molding, by extrusion or from sheet metal. The heat dissipation structure 60 or heat spreader, which at least partially transfers heat to the outer side of the housing 52, must be fixed on the outer side such that the additionally formed thermal resistance is minimal. This takes place, for example, by a material-fit connection, for example, by welding, in the metallic heat sink 60. The heat dissipation structure 60 itself can be flexibly selected in terms of shape, size and material. Possible examples are so-called vapor chambers (for heat dissipation of more than 300W) or (pulsating) heat pipes, heat-conducting foils or coatings. Depending on the power losses to be dissipated, possible materials for the heat dissipation structure 60 are, for example, aluminum (less than 50W heat dissipation) or copper (less than 100W heat dissipation). The complexity is significantly reduced since the function of the heat dissipation structure 60 or heat spreader is at least partially shifted to the outside of the housing 52.

Due to the modularity thus achieved in the design of the heat dissipation structure 60 or in the design of the housing, a flexible adaptation to the environmental conditions and the heat flow to be conducted off is possible. Thus, for example, in the case of a layout change with electronic components 64 having a higher power loss, a more powerful heat dissipation structure 60 can be used, and vice versa. The heat sink 60 can be replaced even during continuous operation, for example after a change in thermal conditions, for example after a software update. Thereby greatly improving flexibility.

The resulting heat flow, symbolized by the arrows of heat transfer 70, is shown in fig. 9. By providing the additional heat dissipation structure 60 on the lower side of the housing 52, heat dissipation is performed at the outer side of the housing 62 towards the heat sink, i.e. the major part of the cooler 40. A small portion of the heat is conducted away via the

housings

52, 54 themselves. Due to the good heat-conducting connection to the receptacle 18 (for example by being clamped by the connection 58), the heat flow reaches the cooler 40 via the receptacle 18 and the side 14 of the housing 11, which then leads away the heat flow.

The device 10 is used in particular in the field of motor vehicles in replaceable electronic components 50. In particular, in the motor vehicle sector, particularly computationally intensive functions, i.e. for example semi-automatic or automatic driving, communication modules, gateway functions, infotainment, security applications, etc., can be implemented in the replaceable electronic component 50. These functions may be implemented separately in the replaceable electronic component 50. The interchangeability also allows for subsequent retrofitting of current hardware as follows: i.e., the electronic component 50 can be easily replaced.

Claims

1. An electronic assembly for a motor vehicle, the electronic assembly comprising: at least one electronic unit (62, 66) having at least one electronic component (64); at least one housing (52, 54) surrounding the electronics unit (62, 66) having the electronics component (64), wherein the electronics component (64) is connected in a thermally conductive manner to the housing (52, 54), characterized in that at least one heat dissipation structure (60) or a component having a high thermal conductivity is arranged outside the housing (52, 54) in order to dissipate heat of the electronics component (62) at least partially outside the housing (52, 54).

2. Electronic assembly according to claim 1, characterized in that the heat dissipation structure (60) is at least one so-called vapor chamber and/or heat pipe and/or pulsating heat pipe and/or at least one heat conducting foil and/or coating and/or a component with good heat conductivity, such as for example copper or aluminum.

3. The electronic assembly according to any of the preceding claims, characterized in that the heat dissipation structure (60) is configured for mechanically reinforcing the housing (52, 54), the heat dissipation structure preferably being configured in a plate shape.

4. The electronic assembly according to one of the preceding claims, characterized in that the housing (52, 54) is configured as a die cast part, in particular as an aluminum die cast part, as an extrusion or as a sheet metal part.

5. The electronic assembly according to one of the preceding claims, characterized in that the heat dissipation structure (60) is arranged at the housing (52, 54) between the electronic assembly (64) and an edge region (69) of the housing (52, 54).

6. The electronic assembly according to one of the preceding claims, characterized in that the heat dissipation structure (60) is materially connected with the housing (52, 54) to minimize thermal resistance, in particular by a soldered connection.

7. Electronic assembly according to one of the preceding claims, characterized in that the housing (52, 54) and/or an edge region (69) of the housing (52, 54) can be connected with a receptacle (18) of a further housing (11) for receiving the replaceable electronic assembly (50) and for dissipating heat therefrom.

8. An electronic assembly according to any one of the preceding claims, characterised in that at least one further electronic unit (66) is provided, on which at least one electronic component (64) is arranged.

9. The electronic assembly according to one of the preceding claims, characterized in that the housing (52) comprises at least one heat conducting structure (56), in particular a recess of a surface of the housing (52, 54) protruding towards the electronic unit (62, 66), wherein the heat conducting structure (56) is in heat conducting connection with the electronic component (64).

10. The electronic assembly according to any of the preceding claims, characterized in that the housing (52, 54) is composed of at least two housing halves (54).

11. The electronic assembly according to one of the preceding claims, characterized in that at least two housing halves (54) each have an edge region (69) which in the assembled state overlap, in particular by screwing and/or clamping by a connecting mechanism (58).

12. The electronic assembly according to one of the preceding claims, characterized in that a connecting mechanism (58) for connecting the housing (52), in particular with the receptacle (18), and/or for connecting the two housing halves (54), is configured such that it acts not only on the edge region (69) but also on the receptacle (18) of the other housing (11) for the releasable fastening.

13. The electronic assembly according to one of the preceding claims, characterized in that the connecting mechanism (58) is arranged between the edge region (69) of the housing (52, 54) and the receptacle (18), and the edge region (69) of the housing (52, 54) is arranged between the connecting mechanism (58) and a further receptacle (18) of the further housing (11).

14. The electronic assembly according to any of the preceding claims, characterized in that at least one of the housing halves (54) has at least one recess (67) and the other housing half (54) has at least one ridge (65), which ridge and recess are in engagement with each other in the assembled state.

15. An electronic assembly according to any one of the preceding claims, characterised in that the two electronic units (62, 66) each carry an electronic component (64) on the sides facing away from each other in the assembled state.

16. Device for accommodating replaceable electronic components (50) according to one of the preceding claims, wherein at least one housing (11) made of a thermally conductive material at least partially enclosing the replaceable electronic components (50) and at least one front side (20) detachably connected to the housing (11) are provided, via which front side the replaceable electronic components (50) which can be arranged in the interior of the housing (11) are accessible, wherein at least one cooler (40) is arranged at least one outer side of the housing (11) in order to cool at least one of the replaceable electronic components (50).

17. Device according to any one of the preceding claims, characterized in that the housing (11) comprises at least one accommodation (18), in particular a rail or a profile, in the interior in order to accommodate at least one replaceable electronic component (50).

18. Device according to one of the preceding claims, characterized in that at least one upper and lower receptacle (18) is provided in order to receive and fix, in particular clamp, the replaceable electronic component (50).

19. Device according to one of the preceding claims, characterized in that the housing cover (22) on the rear side comprises at least one lead-through for at least one plug (30) and/or at least one shield (32) and/or at least one receptacle (23) for a circuit board (34) oriented parallel to the housing cover (22) for contacting the replaceable electronic component (50).