CN115209638B - Lead-free reflow soldering machine for circuit board - Google Patents
Lead-free reflow soldering machine for circuit board Download PDFInfo
- Publication number
- CN115209638B CN115209638B CN202210838810.9A CN202210838810A CN115209638B CN 115209638 B CN115209638 B CN 115209638B CN 202210838810 A CN202210838810 A CN 202210838810A CN 115209638 B CN115209638 B CN 115209638B
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- fixedly arranged
- frame
- reflow soldering
- outer frame
- soldering machine
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- 238000005476 soldering Methods 0.000 title claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 49
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 36
- 239000003973 paint Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a lead-free reflow soldering machine for a circuit board, and relates to the field of circuit board manufacturing. The circuit board leadless reflow soldering machine comprises an outer frame, wherein a coating table is fixedly arranged on one side of the inner surface of the outer frame near the top, electric slide rails are fixedly arranged on one side of the outer surface of the coating table and one side of the inner surface of the outer frame near the coating table, an oil cylinder control frame is slidably arranged between the inner parts of the electric slide rails, a third heating pipe is fixedly arranged at the upper end of the oil cylinder control frame, a feeding hole is fixedly arranged on one side of the upper end of the oil cylinder control frame, a plurality of micro oil cylinders are fixedly arranged at the top of the inner surface of the oil cylinder control frame, a material bearing table is fixedly arranged at the opening of the lower end of the oil cylinder control frame, and a plurality of discharging holes are formed in the upper end and the lower end of the material bearing table in a penetrating mode. The lead-free reflow soldering machine for the circuit board can automatically smear solder paste, and the working efficiency and the soldering quality are greatly improved through three processing bins in the processing process.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to a lead-free reflow soldering machine for a circuit board.
Background
Reflow soldering is one of three main processes in SMT mounting process, and is mainly used for soldering a circuit board on which components are mounted, melting solder paste by heating to fuse and solder the components of the mounted components with a bonding pad of the circuit board, and cooling the solder paste by cooling the reflow soldering to solidify the components with the bonding pad, however, most of the reflow soldering machines are understood as reflow soldering machines, namely, machines for completing the soldering of components on a PCB board by reflow soldering, and are a very wide application at present.
The current patent (CN 210937568U) discloses a mobile phone PCB circuit board leadless reflow soldering machine, including leadless reflow soldering machine body, the access hole has been seted up on leadless reflow soldering machine body's right side, circular draw-in groove has all been seted up to access hole inner wall's front side and rear side, the inside movable mounting of access hole has sealing door, and the bar groove has all been seted up to sealing door top's front side and rear side, and the equal fixed mounting in inside in two bar grooves has joint mechanism, and circular through-hole has all been seted up to sealing door's front side and rear side. According to the utility model, the lead-free reflow soldering machine body, the overhaul port, the circular clamping groove, the strip-shaped groove, the clamping mechanism, the extrusion spring, the pushing block, the pushing handle, the circular block, the circular through hole, the square groove, the sliding rod, the sliding sleeve, the lifting groove and the hinging seat are matched for use, so that the problem that the quick maintenance is not facilitated when the existing internal parts are damaged is solved.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a lead-free reflow soldering machine for a circuit board, which solves the problems of preparation work and complicated working process in the existing mounting process.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the circuit board leadless reflow soldering machine comprises an outer frame, wherein a coating table is fixedly arranged at one side of the inner surface of the outer frame near the top, electric slide rails are fixedly arranged at one side of the outer surface of the coating table and one side of the inner surface of the outer frame near the coating table, an oil cylinder control frame is slidably arranged between the inner parts of the two electric slide rails, a third heating pipe is fixedly arranged at the upper end of the oil cylinder control frame, a feeding port is fixedly arranged at one side of the upper end of the oil cylinder control frame, a plurality of micro-cylinders are fixedly arranged at the top of the inner surface of the oil cylinder control frame, a material bearing table is fixedly arranged at the opening of the lower end of the oil cylinder control frame, a plurality of discharging ports are formed at the upper end and the lower end of the material bearing table in a penetrating manner, and an air pump is fixedly arranged at one side of the bottom of the inner surface of the outer frame near the coating table;
A starting point frame is fixed at the bottom of the coating table, a finishing point frame is fixedly arranged at the position, close to the upper end, of one side, far away from the coating table, of the inner surface of the outer frame, a plurality of rollers are rotatably arranged between the finishing point frame and the starting point frame, an electric board table is movably arranged at one end, close to the starting point frame, of the upper ends of the rollers, a base is fixedly arranged at the lower end of the outer frame, and three supporting feet are fixedly arranged at the front end and the rear end of the bottom of the base;
The utility model discloses a coating machine, including frame, electric board platform, outer frame, air inlet, cooling bin, heating bin, cooling bin's bottom is fixed to be provided with the cooling tube between the inner surface both sides department of being close to the coating platform, the inner surface top of outer frame is fixed to be provided with the second heating pipe by middle department, the bottom of outer frame is fixed to be provided with the cooler by end point frame one side department, the cooling bin has been seted up by cooling machine's one side department to the inner end of outer frame, the spiral is provided with the cooling tube between the inner surface both sides of cooling bin, the outer surface of cooling bin is fixed to be provided with the heating bin near one side department of coating platform, the fixed first heating pipe that is provided with between the inner surface both sides of heating bin, two bottom air baffles are fixed to be provided with three first fans between the inner surface both sides of heating bin and are fixed to be provided with the aviation baffle.
Preferably, the number of the micro-cylinders can be adjusted more or less.
Preferably, the number of the discharge holes is the same as that of the micro cylinders, and the lower ends of the micro cylinders and the inside of the discharge holes are arranged in a two-by-two penetrating manner.
Preferably, the output end of the air pump is fixedly connected to the air outlet and the coating platform, and the input end of the air pump is fixedly connected to the air inlet and the outside.
Preferably, the output end and the input end of the cooling pipe are fixedly connected to the cooler.
Preferably, the third heating pipe and the second heating pipe are both low-power heating pipes, and the first heating pipe is a high-power heating pipe.
Preferably, the base is fixedly provided with a ground wire inside and connected to a ground wire of a factory.
Preferably, the lower ends of the six supporting legs are fixedly provided with insulating pads.
Working principle: when the reflow soldering machine is used, a worker firstly places a PCB to be mounted in the electric board table, then the oil cylinder control frame slides downwards to enable the material bearing table to be close to the PCB, meanwhile, the micro oil cylinder contracts according to a preset position, the air pump pressurizes the interior, so that tin paste in the interior is extruded onto the PCB, automatic tin paste smearing is achieved, after the tin paste smearing is completed, the electric board table carries the PCB and starts to move through the rollers, when the electric board table moves to the position of the fixed port, the worker places the electronic component to be mounted on the tin paste, after the electronic component is placed, the electronic component continues to move, when the electronic component moves to the preheating bin, the second heating pipe starts to work to preheat the PCB, when the electronic component moves to the heating bin, the first heating pipe starts to work to heat the PCB, the electronic component is completely attached to the PCB, the first fan starts to work, and heat flows through the air return plate and the bottom plate, at the moment, when the electric board table continues to move to the cooling bin, the second fan starts to work to enable the tin paste on the PCB to solidify, and finally, the electronic component moves to the cooling bin is completed, and the electronic board is moved to the end point.
(III) beneficial effects
The invention provides a lead-free reflow soldering machine for a circuit board. The beneficial effects are as follows:
1. Compared with the traditional reflow soldering machine, the reflow soldering machine can automatically smear the solder paste, and the precision of a device for smearing the solder paste can be changed according to the size of a PCB, so that the working efficiency is greatly improved, and the cost of a manufacturing device is controlled.
2. The invention provides a lead-free reflow soldering machine for a circuit board, which is provided with three processing bins, wherein when a PCB enters a heating zone, solvents and gases in soldering paste are evaporated, meanwhile, soldering flux in the soldering paste wets a bonding pad, component ends and pins, the soldering paste softens, slumps and covers the bonding pad to isolate the bonding pad and the component pins from oxygen, the PCB enters a heat preservation zone to fully preheat the PCB and the components so as to prevent the PCB from suddenly entering a welding high-temperature zone to damage the PCB and the components, when the PCB enters the welding zone, the temperature is quickly increased to enable the soldering paste to reach a molten state, and finally, the liquid soldering paste wets, diffuses, overflows or reflows the bonding pad, the component ends and the pins of the PCB to form a soldering joint, and finally, the PCB enters a cooling zone to solidify the bonding pad, thereby completing reflow soldering and greatly improving the working efficiency and the soldering quality.
3. The invention provides a lead-free reflow soldering machine for a circuit board, which is provided with a grounding wire and an insulating pad, wherein the surface of an outer frame is coated with insulating paint, so that workers can be effectively prevented from being electrically shocked when the workers contact the reflow soldering machine for operation, and the safety is greatly improved.
Drawings
FIG. 1 is an isometric view of the present invention;
FIG. 2 is a schematic front cross-sectional view of the present invention;
FIG. 3 is a schematic side cross-sectional view of a pre-heat cartridge of the present invention;
FIG. 4 is a schematic side cross-sectional view of a heating cartridge of the present invention;
FIG. 5 is a schematic side cross-sectional view of a cooling cartridge of the present invention;
Fig. 6 is an enlarged view of the invention at a.
Wherein, 1, the outer frame; 2. a starting point frame; 3. an air pump; 4. supporting feet; 5. an insulating pad; 6. an air inlet; 7. a ground wire; 8. a base; 9. a cooling bin; 10. a first heating pipe; 11. a bottom air plate; 12. a first fan; 13. a second fan; 14. an end point frame; 15. a cooling machine; 16. a cooling tube; 17. a heating bin; 18. a return air plate; 19. a second heating pipe; 20. preheating a bin; 21. a fixed port; 22. a roller; 23. an electric board table; 24. a feed inlet; 25. an air outlet; 26. a material bearing table; 27. a discharge port; 28. an oil cylinder control frame; 29. a third heating pipe; 30. a coating station; 31. an electric slide rail; 32. a miniature oil cylinder; 33. a terminal port.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples:
as shown in fig. 1-6, the embodiment of the invention provides a lead-free reflow soldering machine for a circuit board, which comprises an outer frame 1, wherein insulating paint is coated on the surface of the outer frame 1, so that unexpected electric shock of workers in the operation process can be effectively prevented, a paint table 30 is fixedly arranged at the top of one side of the inner surface of the outer frame 1, electric sliding rails 31 are fixedly arranged on one side of the outer surface of the paint table 30 and one side of the inner surface of the outer frame 1, which is close to the paint table 30, an oil cylinder control frame 28 is slidably arranged between the inner parts of the two electric sliding rails 31, the oil cylinder control frame 28 can be electrified to enable the oil cylinder control frame 28 to move up and down, a third heating pipe 29 is fixedly arranged at the upper end of the oil cylinder control frame 28, a charging port 24 is fixedly arranged at one side of the upper end of the oil cylinder control frame 28, timely replenishing can be realized when solder paste is exhausted, a plurality of micro-oil cylinders 32 are fixedly arranged at the top of the inner surface of the oil cylinder control frame 28, a switch can be realized when the solder paste is extended to a discharge port 27, a material bearing table 26 is fixedly arranged at the lower end opening of the oil cylinder control frame 28, a plurality of discharge ports 27 are arranged at the upper and lower ends of the material bearing table 26, and a pressurizing function is provided at one side of the inner surface of the outer frame 1, which is fixedly arranged at the bottom of the inner surface of the outer frame 3;
The bottom of the coating platform 30 is fixedly provided with a starting point frame 2, the position, close to the upper end, of one side, far away from the coating platform 30, of the inner surface of the outer frame 1 is fixedly provided with an end point frame 14, a plurality of rollers 22 are rotatably arranged between the end point frame 14 and the starting point frame 2, one end, close to the starting point frame 2, of the upper ends of the rollers 22 is movably provided with an electric plate table 23, when the rollers 22 rotate, the upper electric plate table 23 can be driven to move, the lower end of the outer frame 1 is fixedly provided with a base 8, and three supporting feet 4 are fixedly arranged at the front end and the rear end of the bottom of the base 8, so that the whole device can be more stable;
The upper end of frame 1 is by electric board platform 23 one side department has seted up fixed mouthful 21, the inside of frame 1 is by the fixed preheating bin 20 of having seted up in centre department, the inside surface top of frame 1 is by the fixed second heating pipe 19 that is provided with in centre department, the bottom of frame 1 is by fixed cooling machine 15 that is provided with in centre department of terminal frame 14 one side department, make cooling pipe 16 can remain low temperature all the time, the efficiency of cooling is improved, terminal port 33 has been seted up to the upper end of frame 1 by terminal frame 14 one side department, cooling bin 9 has been seted up to the inside of frame 1 by cooling machine 15 one side department, the fixed three second fans 13 that are provided with in bottom of cooling bin 9, the spiral is provided with cooling pipe 16 between the internal surface both sides of cooling bin 9, the surface of cooling bin 9 is provided with the heating bin 17 by fixed in one side department that is close to coating platform 30, be provided with first heating pipe 10 between the internal surface both sides intermediate department of heating bin 17 fixedly, fixedly provided with two bottom air baffles 11 between the internal surface both sides of heating bin 17, the upper end of two bottom air baffles 11 all fixedly provided with three first fans 12, the internal air return 18 between the internal surface both sides of heating bin 17 are provided with between the upper end.
The quantity of a plurality of miniature hydro-cylinders 32 can be adjusted more or less for the suitability of this reflow soldering machine is strong, the quantity of a plurality of discharge gates 27 is the same with the quantity of a plurality of miniature hydro-cylinders 32, and the lower extreme of a plurality of miniature hydro-cylinders 32 and the inside two-to-two run through setting of a plurality of discharge gates 27, the output of air pump 3 is fixed to air outlet 25 and coating platform 30, the input of air pump 3 is fixed to air inlet 6 and external world, can pressurize hydro-cylinder control frame 28 inside, the discharge solder paste, the output and the input of cooling tube 16 are all fixed to cooler 15, can make cooling tube 16 remain low temperature throughout, the efficiency of cooling has been improved greatly, third heating tube 29 and second heating tube 19 are the low-power heating tube, first heating tube 10 is the high-power heating tube, the low-power can realize preheating prevents damaging the PCB board, the high-power quick heating that is provided with earth connection 7, and be connected to the earth connection of mill's ground wire, can be with the leak into the subsurface with the surface, safety in production, the lower extreme of six supporting legs 4 is fixed with insulating pad 5, can effectively prevent electric conduction from flowing into the ground to the staff.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a leadless reflow soldering machine of circuit board, includes frame (1), its characterized in that: a paint table (30) is fixedly arranged on one side of the inner surface of the outer frame (1) near the top, an electric sliding rail (31) is fixedly arranged on one side of the outer surface of the paint table (30) and one side of the inner surface of the outer frame (1) near the paint table (30), an oil cylinder control frame (28) is slidably arranged between the inner parts of the electric sliding rails (31), a third heating pipe (29) is fixedly arranged at the upper end of the oil cylinder control frame (28), a feeding port (24) is fixedly arranged on one side of the upper end of the oil cylinder control frame (28), a plurality of micro oil cylinders (32) are fixedly arranged on the top of the inner surface of the oil cylinder control frame (28), a material bearing table (26) is fixedly arranged at the opening of the lower end of the oil cylinder control frame (28), a plurality of discharge ports (27) are formed in a penetrating mode at the upper end and the lower end of the material bearing table (26), and an air pump (3) is fixedly arranged on one side of the inner surface of the outer frame (1) near the paint table (30);
A starting point frame (2) is fixed at the bottom of the coating table (30), an end point frame (14) is fixedly arranged at the upper end of one side, far away from the coating table (30), of the inner surface of the outer frame (1), a plurality of rollers (22) are rotatably arranged between the end point frame (14) and the starting point frame (2), an electric plate table (23) is movably arranged at one end, close to the starting point frame (2), of the upper end of each roller (22), a base (8) is fixedly arranged at the lower end of the outer frame (1), and three supporting feet (4) are fixedly arranged at the front end and the rear end of the bottom of the base (8);
A fixing opening (21) is formed in one side, close to an electric board (23), of the upper end of the outer frame (1), a preheating bin (20) is fixedly formed in the middle of the inner side of the outer frame (1), a second heating pipe (19) is fixedly arranged in the middle of the top of the inner surface of the outer frame (1), a cooler (15) is fixedly arranged in one side, close to a terminal frame (14), of the bottom of the outer frame (1), a terminal opening (33) is formed in one side, close to the terminal frame (14), of the upper end of the outer frame (1), a cooling bin (9) is formed in one side, close to the cooler (15), of the inner side of the outer frame (1), three second fans (13) are fixedly arranged at the bottom of the cooling bin (9), cooling pipes (16) are spirally arranged between two sides of the inner surface of the cooling bin (9), a heating bin (17) is fixedly arranged at one side of the outer surface of the cooling bin (9) close to the coating table (30), a first heating pipe (10) is fixedly arranged between two middle parts of two sides of the inner surface of the heating bin (17), two bottom air plates (11) are fixedly arranged between two sides of the inner surface of the heating bin (17), three first fans (12) are fixedly arranged at the upper ends of the two bottom air plates (11), and a return air plate (18) is fixedly arranged between the two sides of the inner surface of the heating bin (17) and the upper end of the heating bin.
2. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the number of the micro cylinders (32) can be adjusted more or less.
3. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the number of the discharge holes (27) is the same as that of the micro cylinders (32), and the lower ends of the micro cylinders (32) and the inside of the discharge holes (27) are arranged in a two-by-two penetrating mode.
4. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the output end of the air pump (3) is fixedly connected to the air outlet (25) and the coating table (30), and the input end of the air pump (3) is fixedly connected to the air inlet (6) and the outside.
5. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the output end and the input end of the cooling pipe (16) are fixedly connected to the cooler (15).
6. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the third heating pipe (29) and the second heating pipe (19) are low-power heating pipes, and the first heating pipe (10) is a high-power heating pipe.
7. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the base (8) is internally fixedly provided with a ground wire (7) and is connected to the ground wire of the factory.
8. A lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the lower ends of the six supporting legs (4) are fixedly provided with insulating pads (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210838810.9A CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210838810.9A CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115209638A CN115209638A (en) | 2022-10-18 |
| CN115209638B true CN115209638B (en) | 2024-06-25 |
Family
ID=83582989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210838810.9A Active CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115209638B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211321672U (en) * | 2019-12-31 | 2020-08-21 | 珠海市集利发展有限公司 | PCB reflow soldering production line |
| CN113363357A (en) * | 2021-06-02 | 2021-09-07 | 连云港瑞普森照明科技有限公司 | Intelligent manufacturing process and device of LED module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903631A (en) * | 1988-05-27 | 1990-02-27 | Teledyne Industries, Inc. | System for soldering printed circuits |
| CN215658308U (en) * | 2021-08-24 | 2022-01-28 | 昆山索米特电子技术有限公司 | Welding device capable of realizing wave soldering and reflow soldering |
| CN215698653U (en) * | 2021-08-27 | 2022-02-01 | 江苏发现精密机械有限公司 | Eight-temperature-zone reflow soldering machine |
-
2022
- 2022-07-13 CN CN202210838810.9A patent/CN115209638B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211321672U (en) * | 2019-12-31 | 2020-08-21 | 珠海市集利发展有限公司 | PCB reflow soldering production line |
| CN113363357A (en) * | 2021-06-02 | 2021-09-07 | 连云港瑞普森照明科技有限公司 | Intelligent manufacturing process and device of LED module |
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| CN115209638A (en) | 2022-10-18 |
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