CN115209638A - Lead-free reflow soldering machine for circuit board - Google Patents
Lead-free reflow soldering machine for circuit board Download PDFInfo
- Publication number
- CN115209638A CN115209638A CN202210838810.9A CN202210838810A CN115209638A CN 115209638 A CN115209638 A CN 115209638A CN 202210838810 A CN202210838810 A CN 202210838810A CN 115209638 A CN115209638 A CN 115209638A
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- frame
- fixedly arranged
- reflow soldering
- close
- outer frame
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- 238000005476 soldering Methods 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 34
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 239000003973 paint Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a lead-free reflow soldering machine for a circuit board, and relates to the field of circuit board manufacturing. This leadless reflow soldering machine of circuit board, including the frame, the fixed coating platform that is provided with of top department is leaned on to internal surface one side of frame, the surface one side of coating platform with the frame internal surface is close to one side of coating platform and all fixes being provided with electronic slide rail, two it is provided with the hydro-cylinder control frame to slide between the inside of electronic slide rail, the fixed third heating pipe that is provided with in upper end of hydro-cylinder control frame, the fixed charge door that is provided with in upper end one side of hydro-cylinder control frame, the fixed a plurality of miniature hydro-cylinders that are provided with in internal surface top of hydro-cylinder control frame, the fixed material platform that holds that is provided with of lower extreme opening part of hydro-cylinder control frame, the upper and lower end of holding the material platform runs through and has seted up a plurality of discharge gates. The lead-free reflow soldering machine for the circuit board can automatically paint solder paste, and the working efficiency and the soldering quality are greatly improved through the three processing bins in the processing process.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to a lead-free reflow soldering machine for a circuit board.
Background
Reflow soldering is one of three main processes in the SMT mounting process, and is mainly used for soldering a circuit board on which a component is mounted, melting solder paste by heating to fuse and solder the surface mounted component and a pad of the circuit board, and then cooling the solder paste by reflow soldering to solidify the component and the pad, but most of the understanding is that reflow soldering machines, that is, machines for soldering parts on a PCB by reflow soldering, are widely used at present.
Current patent (CN 210937568U) discloses a cell-phone PCB circuit board leadless backflow welding machine, including leadless backflow welding machine body, the access hole has been seted up on the right side of leadless backflow welding machine body, circular draw-in groove has all been seted up to the front side and the rear side of access hole inner wall, the inside movable mounting of access hole has the sealing door, and the bar groove has all been seted up to the front side and the rear side at sealing door top, and the equal fixed mounting in inside in two bar grooves has latch mechanism, and circular through-hole expert has all been seted up to the front side and the rear side of sealing door. The utility model discloses a, through setting up unleaded backflow welder body, the access hole, circular draw-in groove, the bar groove, latch mechanism, the extrusion spring, impel the piece, impel the handle, circular piece, circular through-hole, square groove, the slide bar, the sliding sleeve, carry the cooperation of drawing groove and articulated seat and use, solved and had now when inside part appears damaging, be unfavorable for the problem of quick maintenance, this cell-phone PCB circuit board unleaded backflow welder, possess the advantage that can quick maintenance, though the device can quick maintenance, but the paster process is too simple, thereby lead to operating mass to be high inadequately.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a lead-free reflow soldering machine for a circuit board, which solves the problems of complicated preparation work and working process in the current surface mounting process.
(II) technical scheme
In order to realize the purpose, the invention is realized by the following technical scheme: a lead-free reflow soldering machine for circuit boards comprises an outer frame, wherein a coating table is fixedly arranged on one side of the inner surface of the outer frame close to the top, electric slide rails are fixedly arranged on one side of the outer surface of the coating table and one side of the inner surface of the outer frame close to the coating table, an oil cylinder control frame is arranged between the two electric slide rails in a sliding manner, a third heating pipe is fixedly arranged at the upper end of the oil cylinder control frame, a feeding port is fixedly arranged on one side of the upper end of the oil cylinder control frame, a plurality of micro oil cylinders are fixedly arranged on the top of the inner surface of the oil cylinder control frame, a material bearing table is fixedly arranged at the opening of the lower end of the oil cylinder control frame, a plurality of discharge ports are arranged at the upper end and the lower end of the material bearing table in a penetrating manner, and an air pump is fixedly arranged on one side of the bottom of the inner surface of the outer frame close to the coating table;
a starting point frame is fixed at the bottom of the coating table, an end point frame is fixedly arranged on one side, far away from the coating table, of the inner surface of the outer frame close to the upper end of the inner surface of the outer frame, a plurality of rollers are rotatably arranged between the end point frame and the starting point frame, an electric board table is movably arranged at one end, close to the starting point frame, of the upper ends of the plurality of rollers, a base is fixedly arranged at the lower end of the outer frame, and three supporting legs are fixedly arranged at the front end and the rear end of the bottom of the base;
the utility model discloses a heating cabinet, including frame, electroplax platform, frame, cooling bin, frame, end frame, cooling bin, fixed mouthful has been seted up by electroplax platform one side department in the upper end of frame, the fixed preheating storehouse that has seted up by middle department in the inside of frame, the fixed second heating pipe that is provided with in middle department is leaned on in the internal surface top of frame, the fixed cooler that is provided with in end frame one side department is leaned on in the bottom of frame, the upper end of frame is leaned on one side department of end frame and has seted up the end mouth, the inside of frame is leaned on one side department of cooler and has seted up the cooling bin, the fixed three second fan that is provided with in bottom of cooling bin, the spiral is provided with the cooling tube between the internal surface both sides of cooling bin, the fixed heated bin that is provided with between the internal surface both sides of heating bin is provided with two leeward boards, two the upper end of leeward board all is fixed three first fan that is provided with, the internal surface both sides of heated bin are leaned on between the upper end and are fixed the return air board that is provided with.
Preferably, the number of the micro oil cylinders can be adjusted to be more or less.
Preferably, the number of the plurality of discharge ports is the same as that of the plurality of micro oil cylinders, and the lower ends of the plurality of micro oil cylinders and the interiors of the plurality of discharge ports are arranged in a pairwise penetrating manner.
Preferably, the output end of the air pump is fixedly connected to the air outlet and the coating platform, and the input end of the air pump is fixedly connected to the air inlet and the outside.
Preferably, the output end and the input end of the cooling pipe are both fixedly connected to the cooling machine.
Preferably, the third heating pipe and the second heating pipe are both low-power heating pipes, and the first heating pipe is a high-power heating pipe.
Preferably, the base is fixedly provided with a ground wire inside, and is connected to a factory ground wire.
Preferably, the lower ends of the six supporting legs are respectively fixedly provided with an insulating pad.
The working principle is as follows: when the reflow soldering machine is used, a worker firstly places a PCB (printed circuit board) to be pasted inside an electric board table, then an oil cylinder control frame can slide downwards to enable a material bearing table to be close to the PCB, meanwhile, a micro oil cylinder contracts according to a preset position, and an air pump pressurizes towards the inside, so that internal solder paste is extruded onto the PCB, automatic solder paste painting is achieved, after the painting is completed, the electric board table drives the PCB to start moving through rollers, when the electric board table moves to the position of a fixed port, the worker places electronic elements to be installed on the solder paste again, the electric board table moves continuously after the placement is completed, when the electric board table moves to a preheating bin, a second heating pipe starts to work to preheat the PCB, when the electric board table moves to a heating bin, a first heating pipe starts to work to heat the PCB, so that the electronic elements completely adhere to the PCB, when the electric board table is heated, the first fan starts to work, and forms heat flow with a bottom air plate through a return air plate, the PCB is better heated, when the electric board table moves to a cooling end point, and the electric board table moves to the final end point.
(III) advantageous effects
The invention provides a lead-free reflow soldering machine for a circuit board. The method has the following beneficial effects:
1. compared with the traditional reflow soldering machine, the reflow soldering machine can automatically paint solder paste, and the precision of a device for painting the solder paste can be changed according to the size of a PCB, so that the working efficiency is greatly improved, and the cost of a manufacturing device is controlled.
2. The invention provides a lead-free reflow soldering machine for a circuit board, which is provided with three processing bins, when a PCB enters a heating area, solvent and gas in soldering paste are evaporated, meanwhile, soldering flux in the soldering paste wets a pad, an end head of a component and a pin, the soldering paste softens, collapses and covers the pad, the pad and the pin of the component are isolated from oxygen, when the PCB enters a heat preservation area, the PCB and the component are fully preheated, so that the PCB is prevented from suddenly entering a high-temperature welding area to damage the PCB and the component, when the PCB enters the welding area, the temperature rapidly rises to enable the soldering paste to reach a molten state, liquid soldering tin wets, diffuses, overflows or reflows the pad, the end head of the component and the pin of the PCB to form a soldering tin joint, and finally the PCB enters a cooling area to solidify the welding point to finish reflow soldering, thereby greatly improving the working efficiency and the welding quality.
3. The invention provides a lead-free reflow soldering machine for a circuit board, which is provided with a grounding wire and an insulating pad, wherein the surface of an outer frame is coated with insulating paint, so that an operator can be effectively prevented from being electrically shocked when contacting the reflow soldering machine for operation, and the safety is greatly improved.
Drawings
FIG. 1 is an axial schematic view of the present invention;
FIG. 2 is a schematic front cross-sectional view of the present invention;
FIG. 3 is a schematic side sectional view of the preheating chamber of the present invention;
FIG. 4 is a schematic side sectional view of a heating chamber of the present invention;
FIG. 5 is a schematic side sectional view of a cooling silo of the present invention;
FIG. 6 is an enlarged view of the present invention at A.
Wherein, 1, an outer frame; 2. a start point frame; 3. an air pump; 4. supporting legs; 5. an insulating pad; 6. an air inlet; 7. a ground line; 8. a base; 9. a cooling bin; 10. a first heating pipe; 11. a bottom wind plate; 12. a first fan; 13. a second fan; 14. a terminal frame; 15. a cooling machine; 16. a cooling tube; 17. heating a bin; 18. a return air plate; 19. a second heating pipe; 20. preheating a bin; 21. a fixed port; 22. a roller; 23. a platen table; 24. a feed inlet; 25. an air outlet; 26. a material bearing platform; 27. a discharge port; 28. an oil cylinder control frame; 29. a third heating pipe; 30. a coating station; 31. an electric slide rail; 32. a micro oil cylinder; 33. and a terminal port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiment is as follows:
as shown in fig. 1-6, an embodiment of the present invention provides a lead-free reflow soldering machine for a circuit board, which includes an outer frame 1, wherein the surface of the outer frame 1 is coated with an insulating paint, which can effectively prevent an operator from getting an electric shock accidentally during an operation process, a coating table 30 is fixedly disposed near the top of one side of the inner surface of the outer frame 1, electric slide rails 31 are fixedly disposed on one side of the outer surface of the coating table 30 and one side of the inner surface of the outer frame 1, which is close to the coating table 30, an oil cylinder control frame 28 is slidably disposed between the two electric slide rails 31, which can be powered on to move the oil cylinder control frame 28 up and down, a third heating pipe 29 is fixedly disposed at the upper end of the oil cylinder control frame 28, which can properly heat the tin paste when the tin paste is too hard to be extruded out, a feeding port 24 is fixedly disposed at one side of the upper end of the oil cylinder control frame 28, which can be timely supplemented when the tin paste is exhausted, a plurality of micro oil cylinders 32 are fixedly disposed at the top of the inner surface of the oil cylinder control frame 28, which can function as a switch when the oil cylinder control frame extends to the discharging port 27, a lower end opening of the oil cylinder control frame 28 is fixedly disposed with a material support 26, a plurality of which is disposed at the upper end, a plurality of upper end of which is disposed through which is disposed with a plurality of 27, a plurality of material support platform 27, a plurality of which is disposed at the upper end of the support platform 26, a plurality of the upper end of the support platform 27, a plurality of the support platform 30, a plurality of the support platform 26, a plurality of the inner surface of the outer frame 1, and a pressure air pump 30, and a pressure pump, and a pressure plate 3 is disposed at the outer frame 1, and a pressure plate, and a pressure pump is disposed at the inner surface of the air pump;
a starting point frame 2 is fixed at the bottom of the coating table 30, an end point frame 14 is fixedly arranged on one side, far away from the coating table 30, of the inner surface of the outer frame 1 and close to the upper end, a plurality of rollers 22 are rotatably arranged between the end point frame 14 and the starting point frame 2, an electric board table 23 is movably arranged at one end, close to the starting point frame 2, of the upper ends of the rollers 22, when the rollers 22 rotate, the electric board table 23 above the rollers can be driven to move, a base 8 is fixedly arranged at the lower end of the outer frame 1, and three supporting legs 4 are fixedly arranged at the front end and the rear end of the bottom of the base 8, so that the whole device can be more stable;
the upper end of the outer frame 1 is provided with a fixed port 21 by one side of the electric plate table 23, the inside of the outer frame 1 is fixedly provided with a preheating bin 20 by the middle, the top of the inner surface of the outer frame 1 is fixedly provided with a second heating pipe 19 by the middle, the bottom of the outer frame 1 is fixedly provided with a cooling machine 15 by one side of the end point frame 14, so that a cooling pipe 16 can be kept at a low temperature all the time, the cooling efficiency is improved, the end point port 33 is arranged by one side of the end point frame 14 at the upper end of the outer frame 1, the cooling bin 9 is arranged by one side of the cooling machine 15 in the inner part of the outer frame 1, the bottom of the cooling bin 9 is fixedly provided with three second fans 13, the cooling pipe 16 is spirally arranged between two sides of the inner surface of the cooling bin 9, the heating bin 17 is fixedly arranged at one side of the outer surface of the coating table 30, the first heating pipe 10 is fixedly arranged between the middle of two sides of the inner surface of the heating bin 17, two bottom air plates 11 are fixedly arranged between two inner surfaces of the heating bin 17, the two bottom air plates 11, the upper ends of the two bottom air plates 11 are fixedly provided with three first fans 12, and the air plates 18 are fixedly arranged between the two inner surfaces of the heating bin 17, and the inner surface two inner surface sides are fixedly arranged between the air plates.
The quantity of the micro oil cylinders 32 is adjustable to be more or less, so that the applicability of the reflow soldering machine is strong, the quantity of the discharge ports 27 is the same as that of the micro oil cylinders 32, the lower ends of the micro oil cylinders 32 and the inside of the discharge ports 27 are arranged in a pairwise manner in a penetrating manner, the output end of the air pump 3 is fixedly connected to the air outlet 25 and the coating table 30, the input end of the air pump 3 is fixedly connected to the air inlet 6 and the outside, the inside of the oil cylinder control frame 28 can be pressurized, solder paste is discharged, the output end and the input end of the cooling pipe 16 are both fixedly connected to the cooler 15, the cooling pipe 16 can be kept at low temperature all the time, the cooling efficiency is greatly improved, the third heating pipe 29 and the second heating pipe 19 are both low-power heating pipes, the first heating pipe 10 is a high-power heating pipe, low-power preheating can be achieved, damage to a PCB can be prevented, high-power rapid heating is achieved, the grounding wire 7 is fixedly arranged inside of the base 8, the base is connected to a ground wire of a factory, surface leakage can be guided into the ground, safe production is achieved, the lower ends of the six supporting legs 4 are fixedly provided with insulating pads 5, leakage current can be effectively prevented from flowing into the ground, and harms to be prevented from being damaged to workers.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a leadless reflow soldering machine of circuit board, includes frame (1), its characterized in that: a coating platform (30) is fixedly arranged on one side of the inner surface of the outer frame (1) close to the top, electric slide rails (31) are fixedly arranged on one side of the outer surface of the coating platform (30) and one side of the inner surface of the outer frame (1) close to the coating platform (30), an oil cylinder control frame (28) is arranged between the two electric slide rails (31) in a sliding mode, a third heating pipe (29) is fixedly arranged at the upper end of the oil cylinder control frame (28), a feeding port (24) is fixedly arranged on one side of the upper end of the oil cylinder control frame (28), a plurality of micro oil cylinders (32) are fixedly arranged on the top of the inner surface of the oil cylinder control frame (28), a material bearing platform (26) is fixedly arranged at an opening at the lower end of the oil cylinder control frame (28), a plurality of material discharging ports (27) are formed in a penetrating manner at the upper end and the lower end of the material bearing platform (26), and an air pump (3) is fixedly arranged on one side of the bottom of the inner surface of the outer frame (1) close to the coating platform (30);
a starting point frame (2) is fixed at the bottom of the coating table (30), an end point frame (14) is fixedly arranged on one side, far away from the coating table (30), of the inner surface of the outer frame (1) and close to the upper end of the inner surface, a plurality of rollers (22) are rotatably arranged between the end point frame (14) and the starting point frame (2), an electric plate table (23) is movably arranged at one end, close to the starting point frame (2), of the upper ends of the rollers (22), a base (8) is fixedly arranged at the lower end of the outer frame (1), and three supporting legs (4) are fixedly arranged at the front end and the rear end of the bottom of the base (8);
a fixing opening (21) is arranged at one side of the upper end of the outer frame (1) close to the electric board platform (23), a preheating bin (20) is fixedly arranged in the outer frame (1) close to the middle, a second heating pipe (19) is fixedly arranged near the middle of the top of the inner surface of the outer frame (1), a cooling machine (15) is fixedly arranged at one side of the bottom of the outer frame (1) close to the end point frame (14), an end port (33) is arranged at one side of the upper end of the outer frame (1) close to the end point frame (14), a cooling bin (9) is arranged at one side of the inner part of the outer frame (1) close to the cooler (15), the bottom of the cooling bin (9) is fixedly provided with three second fans (13), a cooling pipe (16) is spirally arranged between the two sides of the inner surface of the cooling bin (9), a heating bin (17) is fixedly arranged at one side of the outer surface of the cooling bin (9) close to the coating platform (30), a first heating pipe (10) is fixedly arranged between the middle parts of the two sides of the inner surface of the heating bin (17), two bottom wind plates (11) are fixedly arranged between two sides of the inner surface of the heating bin (17), three first fans (12) are fixedly arranged at the upper ends of the two bottom wind plates (11), and an air return plate (18) is fixedly arranged between two sides of the inner surface of the heating bin (17) close to the upper end.
2. The lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the number of the micro oil cylinders (32) can be adjusted to be more or less.
3. The lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the number of the plurality of discharge holes (27) is the same as that of the plurality of micro oil cylinders (32), and the lower ends of the plurality of micro oil cylinders (32) and the interiors of the plurality of discharge holes (27) are arranged in a pairwise penetrating mode.
4. The lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the output end of the air pump (3) is fixedly connected to the air outlet (25) and the coating platform (30), and the input end of the air pump (3) is fixedly connected to the air inlet (6) and the outside.
5. A circuit board lead-free reflow soldering machine according to claim 1, wherein: the output end and the input end of the cooling pipe (16) are both fixedly connected to the cooling machine (15).
6. The lead-free reflow soldering machine for circuit boards as claimed in claim 1, wherein: the third heating pipe (29) and the second heating pipe (19) are both low-power heating pipes, and the first heating pipe (10) is a high-power heating pipe.
7. A circuit board lead-free reflow soldering machine according to claim 1, wherein: the base (8) is internally and fixedly provided with a grounding wire (7) and is connected to the grounding wire of a factory.
8. A circuit board lead-free reflow soldering machine according to claim 1, wherein: and the lower ends of the six supporting legs (4) are all fixedly provided with insulating pads (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210838810.9A CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210838810.9A CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115209638A true CN115209638A (en) | 2022-10-18 |
| CN115209638B CN115209638B (en) | 2024-06-25 |
Family
ID=83582989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210838810.9A Active CN115209638B (en) | 2022-07-13 | 2022-07-13 | Lead-free reflow soldering machine for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115209638B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903631A (en) * | 1988-05-27 | 1990-02-27 | Teledyne Industries, Inc. | System for soldering printed circuits |
| CN211321672U (en) * | 2019-12-31 | 2020-08-21 | 珠海市集利发展有限公司 | PCB reflow soldering production line |
| CN113363357A (en) * | 2021-06-02 | 2021-09-07 | 连云港瑞普森照明科技有限公司 | Intelligent manufacturing process and device of LED module |
| CN215658308U (en) * | 2021-08-24 | 2022-01-28 | 昆山索米特电子技术有限公司 | Welding device capable of realizing wave soldering and reflow soldering |
| CN215698653U (en) * | 2021-08-27 | 2022-02-01 | 江苏发现精密机械有限公司 | Eight-temperature-zone reflow soldering machine |
-
2022
- 2022-07-13 CN CN202210838810.9A patent/CN115209638B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4903631A (en) * | 1988-05-27 | 1990-02-27 | Teledyne Industries, Inc. | System for soldering printed circuits |
| CN211321672U (en) * | 2019-12-31 | 2020-08-21 | 珠海市集利发展有限公司 | PCB reflow soldering production line |
| CN113363357A (en) * | 2021-06-02 | 2021-09-07 | 连云港瑞普森照明科技有限公司 | Intelligent manufacturing process and device of LED module |
| CN215658308U (en) * | 2021-08-24 | 2022-01-28 | 昆山索米特电子技术有限公司 | Welding device capable of realizing wave soldering and reflow soldering |
| CN215698653U (en) * | 2021-08-27 | 2022-02-01 | 江苏发现精密机械有限公司 | Eight-temperature-zone reflow soldering machine |
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| Publication number | Publication date |
|---|---|
| CN115209638B (en) | 2024-06-25 |
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