CN115209611A - Circuit board with copper blocks embedded and manufacturing process thereof - Google Patents

Circuit board with copper blocks embedded and manufacturing process thereof Download PDF

Info

Publication number
CN115209611A
CN115209611A CN202210820230.7A CN202210820230A CN115209611A CN 115209611 A CN115209611 A CN 115209611A CN 202210820230 A CN202210820230 A CN 202210820230A CN 115209611 A CN115209611 A CN 115209611A
Authority
CN
China
Prior art keywords
semi
cured sheet
circuit board
copper block
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210820230.7A
Other languages
Chinese (zh)
Inventor
苏惠武
叶何远
陈小杨
曹东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Fuchangfa Circuit Technology Co ltd
Original Assignee
Jiangxi Fuchangfa Circuit Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Fuchangfa Circuit Technology Co ltd filed Critical Jiangxi Fuchangfa Circuit Technology Co ltd
Priority to CN202210820230.7A priority Critical patent/CN115209611A/en
Publication of CN115209611A publication Critical patent/CN115209611A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a copper block embedded circuit board and a manufacturing process thereof, belongs to the technical field of circuit boards, and aims to solve the problems of poor heat dissipation performance and shortened service life of the circuit board. According to the copper block embedded circuit board and the manufacturing process thereof, when the manufactured circuit board is used, heat generated by an electric element can be effectively dissipated through the copper block, the heat dissipation performance of the circuit board is greatly improved, the heat dissipation effect is good, and the service life of the circuit board is prolonged.

Description

Circuit board with copper blocks embedded and manufacturing process thereof
Technical Field
The invention relates to the technical field of circuit boards, in particular to a copper block embedded circuit board and a manufacturing process thereof.
Background
The circuit board generally refers to a circuit board, which makes the circuit miniaturized and visualized, plays an important role in mass production of fixed circuits and optimization of electrical appliance layout, and is divided into three major categories, namely a single-sided board, a double-sided board and a multilayer circuit board according to the number of layers.
The single panel is arranged on the most basic PCB, parts are concentrated on one surface, and wires are concentrated on the other surface, and the single panel is usually simple to manufacture and low in manufacturing cost, but has the defect that the single panel cannot be applied to a complex product; the double-sided board is an extension of a single-sided board, when single-layer wiring cannot meet the requirements of electronic products, the double-sided board is used, copper-clad wires are coated on both sides of the double-sided board, and the circuit between the two layers can be conducted through a via hole to form required network connection; the multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.
Chinese patent publication No. CN102111954B discloses a circuit board and a manufacturing process thereof, in which a metal layer and a barrier layer are formed on a dielectric layer, and then an intaglio pattern and a blind via are formed on the dielectric layer by using a laser beam. Then, a first conductive layer and a second conductive layer are formed in the intaglio pattern and the blind hole in sequence, so as to form a circuit with two different conductive layers in the same circuit layer. In addition, during the etching process, the barrier layer can be used as an etching stop layer for removing the first conductive layer and the second conductive layer outside the intaglio pattern and the blind holes, and the metal layer can be used as an etching stop layer of the barrier layer. Therefore, the manufacturing process of the circuit board can have better manufacturing process qualification rate and reliability.
The Chinese patent with publication number CN113518516A discloses a process for manufacturing a flexible circuit board, which belongs to the field of circuit boards, and specifically comprises the steps of manufacturing a double-sided board by adopting a polyimide film, drilling a hole on the double-sided board to metalize the hole, then electroplating the metalized hole to conduct the hole, and then sequentially carrying out circuit manufacturing, etching, surface mounting, laminating, solder resist manufacturing, character printing and surface treatment to obtain the double-sided flexible circuit board. However, the above patents have the following drawbacks:
the circuit board manufactured by the manufacturing process has the advantages that the copper block is not embedded in the circuit board, so that heat generated by an electric element cannot be effectively dissipated when the circuit board is used, the heat dissipation performance is poor, and the service life of the circuit board is reduced to a certain extent.
Disclosure of Invention
The invention aims to provide a circuit board with a copper block embedded and a manufacturing process thereof, wherein when the manufactured circuit board is used, heat generated by an electric element can be effectively dissipated through the copper block, the heat dissipation performance of the circuit board is greatly improved, the heat dissipation effect is good, the service life of the circuit board is prolonged, and the problems in the background art are solved.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a bury copper billet circuit board, includes the circuit board body, the last copper billet that has buried of circuit board body, the circuit board body includes circuit substrate, first prepreg, upper core, lower prepreg and lower floor's core, the upper surface of circuit substrate is provided with first prepreg, be provided with upper core on the first prepreg, the lower surface of circuit substrate is provided with lower prepreg, be provided with lower floor's core on the prepreg down.
Furthermore, upper embedded holes are formed in the upper semi-cured sheet and the upper core plate, copper blocks are arranged in the upper embedded holes, the side end faces of the copper blocks are tightly attached to the upper semi-cured sheet and the upper core plate, the surface of each copper block protrudes out of the upper core plate, and the surface of each copper block is flush with the surface of the upper core plate.
Furthermore, the number of the groups of the upper embedded holes is not less than one, the number of the upper embedded holes in each group is two, and the two upper embedded holes are symmetrically distributed at two ends of the upper prepreg and the upper core plate.
Furthermore, lower embedded holes are formed in the lower prepreg and the lower core plate, copper blocks are arranged in the lower embedded holes, the side end faces of the copper blocks are tightly attached to the lower prepreg and the lower core plate, and the surfaces of the copper blocks protrude out of the lower core plate and are flush with the surfaces of the lower core plate.
Furthermore, the number of the groups of the lower embedded holes is not less than one, the number of the lower embedded holes in each group is two, and the two lower embedded holes are symmetrically distributed at two ends of the lower prepreg and the lower core plate.
Furthermore, a side end face of the copper block protruding out of the upper core plate is provided with fins, the fins are connected to the copper block in parallel and at equal intervals, a side end face of the copper block protruding out of the lower core plate is also provided with fins, and the fins are connected to the copper block in parallel and at equal intervals.
According to another aspect of the invention, a manufacturing process of the copper block embedded circuit board is provided, which comprises the following steps:
s1: milling grooves in the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate to form an upper embedded embedding hole and a lower embedded embedding hole in the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate;
s2: placing an upper semi-cured sheet on the upper end of the circuit substrate, placing an upper-layer core board on the upper semi-cured sheet, and after the upper semi-cured sheet and the upper-layer core board are aligned, loading a copper block into the upper embedded embedding hole;
s3: placing a lower prepreg at the lower end of the circuit substrate, placing a lower core board on the lower prepreg, and after the lower prepreg is aligned with the lower core board, loading a copper block into the lower embedded hole;
s4: and putting the assembled circuit substrate, the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate into a laminating machine, and pressing and combining the circuit substrate, the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate into a whole through the laminating machine.
Further, when the laminating machine is adopted to press the circuit substrate, the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate, the upper semi-cured sheet and the lower semi-cured sheet are heated and melted through a hot pressing plate arranged on the laminating machine, so that the upper core plate and the lower core plate are fastened on the circuit substrate.
Further, the upper semi-cured sheet is heated to melt and then fills a gap between the circuit substrate and the upper core plate and wraps the copper block, and the lower semi-cured sheet is heated to melt and then fills a gap between the circuit substrate and the lower core plate and wraps the copper block.
Furthermore, the upper semi-cured sheet and the lower semi-cured sheet adopt a 1080 model semi-cured sheet, and filling is full through the cooperation of a plurality of semi-cured sheets.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a copper block embedded circuit board and a manufacturing process thereof, wherein a groove is milled on an upper semi-cured sheet, an upper core plate, a lower semi-cured sheet and a lower core plate, so that an upper embedded embedding hole and a lower embedded embedding hole are formed on the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate, the upper semi-cured sheet is placed at the upper end of a circuit substrate, the upper core plate is placed on the upper semi-cured sheet, the copper block is placed in the upper embedded embedding hole after the upper semi-cured sheet and the upper core plate are aligned, the lower semi-cured sheet is placed at the lower end of the circuit substrate, the lower core plate is placed on the lower semi-cured sheet, the copper block is placed in the lower embedded embedding hole after the lower semi-cured sheet and the lower core plate are aligned, the assembled circuit substrate, the upper semi-cured sheet, the upper core plate, the lower semi-cured sheet and the lower core plate are placed in a laminating machine, the circuit substrate, the upper semi-cured sheet, the lower semi-cured sheet and the lower core plate are laminated into a circuit board through the laminating machine.
Drawings
Fig. 1 is a schematic view of a copper block-embedded circuit board according to a first embodiment of the invention;
fig. 2 is an expanded view of a copper-embedded block circuit board according to a first embodiment of the invention;
fig. 3 is a schematic view of a copper block-embedded circuit board according to a second embodiment of the invention;
fig. 4 is a schematic view of a copper block-embedded circuit board according to a third embodiment of the present invention;
fig. 5 is an exploded view of a buried copper block circuit board according to a third embodiment of the present invention;
FIG. 6 is a schematic view of a copper block with fins according to a third embodiment of the present invention;
fig. 7 is a top view of a buried copper block wiring board according to a fourth embodiment of the present invention;
fig. 8 is a bottom view of a copper block-embedded circuit board according to a fourth embodiment of the present invention;
fig. 9 is a bottom view of a copper block-embedded wiring board according to a fifth embodiment of the present invention.
In the figure: 1. a circuit board body; 11. a circuit substrate; 12. an upper semi-cured sheet; 13. an upper core board; 14. a lower prepreg; 15. a lower core board; 2. a copper block; 3. an upper embedding hole; 4. a lower embedded embedding hole; 5. a fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-2, a circuit board with a copper block embedded therein includes a circuit board body 1, the circuit board body 1 is embedded with the copper block 2, the circuit board body 1 includes a circuit substrate 11, an upper semi-cured sheet 12, an upper core board 13, a lower semi-cured sheet 14 and a lower core board 15, the upper semi-cured sheet 12 is disposed on the upper surface of the circuit substrate 11, the upper core board 13 is disposed on the upper semi-cured sheet 12, the lower semi-cured sheet 14 is disposed on the lower surface of the circuit substrate 11, and the lower core board 15 is disposed on the lower semi-cured sheet 14.
An upper embedding hole 3 is formed in the upper semi-curing sheet 12 and the upper core plate 13, a copper block 2 is arranged in the upper embedding hole 3, the side end face of the copper block 2 is tightly attached to the upper semi-curing sheet 12 and the upper core plate 13, the surface of the copper block 2 protrudes out of the upper core plate 13, and the surface of the copper block 2 is flush with the surface of the upper core plate 13.
The number of the groups of the upper embedded holes 3 is one, the number of the upper embedded holes 3 in each group is two, and the two upper embedded holes 3 are symmetrically distributed at two ends of the upper prepreg 12 and the upper core plate 13.
In order to better show the manufacturing process of the copper block-embedded circuit board, this embodiment provides a method for manufacturing a copper block-embedded circuit board, which includes the following steps:
s1: milling grooves in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 to form upper embedded holes 3 and lower embedded holes 4 in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15;
s2: placing an upper semi-cured sheet 12 on the upper end of the circuit substrate 11, placing an upper core plate 13 on the upper semi-cured sheet 12, aligning the upper semi-cured sheet 12 and the upper core plate 13, and then loading the copper block 2 into the upper embedded hole 3;
s3: placing a lower prepreg 14 at the lower end of the circuit substrate 11, placing a lower core board 15 on the lower prepreg 14, and after the lower prepreg 14 and the lower core board 15 are aligned, loading the copper block 2 into the lower embedded hole 4;
s4: and putting the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a laminating machine, and laminating and integrating the circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a whole through the laminating machine.
Example two
Referring to fig. 3, the copper block-embedded circuit board comprises a circuit board body 1, wherein a copper block 2 is embedded in the circuit board body 1, the circuit board body 1 comprises a circuit substrate 11, an upper semi-cured sheet 12, an upper core plate 13, a lower semi-cured sheet 14 and a lower core plate 15, the upper semi-cured sheet 12 is arranged on the upper surface of the circuit substrate 11, the upper core plate 13 is arranged on the upper semi-cured sheet 12, the lower semi-cured sheet 14 is arranged on the lower surface of the circuit substrate 11, and the lower core plate 15 is arranged on the lower semi-cured sheet 14.
An upper embedding hole 3 is formed in the upper semi-curing sheet 12 and the upper core plate 13, a copper block 2 is arranged in the upper embedding hole 3, the side end face of the copper block 2 is tightly attached to the upper semi-curing sheet 12 and the upper core plate 13, the surface of the copper block 2 protrudes out of the upper core plate 13, and the surface of the copper block 2 is flush with the surface of the upper core plate 13.
The number of the groups of the upper embedded holes 3 is three, the number of the upper embedded holes 3 in each group is two, and the two upper embedded holes 3 are symmetrically distributed at two ends of the upper prepreg 12 and the upper core plate 13.
In order to better show the manufacturing process of the copper block-embedded circuit board, this embodiment provides a method for manufacturing a copper block-embedded circuit board, which includes the following steps:
s1: milling grooves in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 to form upper embedded embedding holes 3 and lower embedded embedding holes 4 in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15;
s2: placing an upper semi-cured sheet 12 on the upper end of the circuit substrate 11, placing an upper core plate 13 on the upper semi-cured sheet 12, aligning the upper semi-cured sheet 12 and the upper core plate 13, and then loading the copper block 2 into the upper embedded hole 3;
s3: placing a lower prepreg 14 at the lower end of the circuit substrate 11, placing a lower core board 15 on the lower prepreg 14, and after the lower prepreg 14 and the lower core board 15 are aligned, loading the copper block 2 into the lower embedded hole 4;
s4: and putting the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a laminating machine, and laminating and integrating the circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a whole through the laminating machine.
EXAMPLE III
Referring to fig. 4-6, a circuit board with a copper block embedded comprises a circuit board body 1, wherein the circuit board body 1 is embedded with a copper block 2, the circuit board body 1 comprises a circuit substrate 11, an upper semi-cured sheet 12, an upper core board 13, a lower semi-cured sheet 14 and a lower core board 15, the upper semi-cured sheet 12 is arranged on the upper surface of the circuit substrate 11, the upper core board 13 is arranged on the upper semi-cured sheet 12, the lower semi-cured sheet 14 is arranged on the lower surface of the circuit substrate 11, and the lower core board 15 is arranged on the lower semi-cured sheet 14.
An upper embedding hole 3 is formed in the upper semi-curing sheet 12 and the upper core plate 13, a copper block 2 is arranged in the upper embedding hole 3, the side end face of the copper block 2 is tightly attached to the upper semi-curing sheet 12 and the upper core plate 13, the surface of the copper block 2 protrudes out of the upper core plate 13, and the surface of the copper block 2 is flush with the surface of the upper core plate 13.
The number of the groups of the upper embedded holes 3 is three, the number of the upper embedded holes 3 in each group is two, and the two upper embedded holes 3 are symmetrically distributed at two ends of the upper prepreg 12 and the upper core plate 13.
Lower embedded embedding holes 4 are formed in the lower prepreg 14 and the lower core plate 15, copper blocks 2 are arranged in the lower embedded embedding holes 4, the side end faces of the copper blocks 2 are tightly attached to the lower prepreg 14 and the lower core plate 15, the surfaces of the copper blocks 2 protrude out of the lower core plate 15, and the surfaces of the copper blocks 2 are flush with the surfaces of the lower core plate 15.
The number of the groups of the lower embedded holes 4 is not less than three, the number of the lower embedded holes 4 in each group is two, and the two lower embedded holes 4 are symmetrically distributed at two ends of the lower prepreg 14 and the lower core plate 15.
The end face of one side of the copper block 2 protruding the upper core plate 13 is provided with fins 5, the fins 5 are connected on the copper block 2 in parallel and at equal intervals, the end face of one side of the copper block 2 protruding the lower core plate 15 is also provided with fins 5, and the fins 5 are connected on the copper block 2 in parallel and at equal intervals.
In order to better show the manufacturing process of the copper block-embedded circuit board, this embodiment provides a method for manufacturing a copper block-embedded circuit board, which includes the following steps:
s1: milling grooves in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 to form upper embedded embedding holes 3 and lower embedded embedding holes 4 in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15;
s2: placing an upper semi-cured sheet 12 on the upper end of the circuit substrate 11, placing an upper core plate 13 on the upper semi-cured sheet 12, aligning the upper semi-cured sheet 12 and the upper core plate 13, and then loading the copper block 2 into the upper embedded hole 3;
s3: placing a lower prepreg 14 at the lower end of the circuit substrate 11, placing a lower core board 15 on the lower prepreg 14, and after the lower prepreg 14 and the lower core board 15 are aligned, loading the copper block 2 into the lower embedded hole 4;
s4: and putting the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a laminating machine, and laminating and integrating the circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a whole through the laminating machine.
Example four
Referring to fig. 7-8, a circuit board with a copper block embedded comprises a circuit board body 1, wherein the circuit board body 1 is embedded with the copper block 2, the circuit board body 1 comprises a circuit substrate 11, an upper semi-cured sheet 12, an upper core board 13, a lower semi-cured sheet 14 and a lower core board 15, the upper semi-cured sheet 12 is arranged on the upper surface of the circuit substrate 11, the upper core board 13 is arranged on the upper semi-cured sheet 12, the lower semi-cured sheet 14 is arranged on the lower surface of the circuit substrate 11, and the lower core board 15 is arranged on the lower semi-cured sheet 14.
Lower embedded embedding holes 4 are formed in the lower prepreg 14 and the lower core plate 15, copper blocks 2 are arranged in the lower embedded embedding holes 4, the side end faces of the copper blocks 2 are tightly attached to the lower prepreg 14 and the lower core plate 15, the surfaces of the copper blocks 2 protrude out of the lower core plate 15, and the surfaces of the copper blocks 2 are flush with the surfaces of the lower core plate 15.
The number of the groups of the lower embedded holes 4 is one, the number of the lower embedded holes 4 in each group is two, and the two lower embedded holes 4 are symmetrically distributed at two ends of the lower prepreg 14 and the lower core plate 15.
In order to better show the manufacturing process of the copper block-embedded circuit board, this embodiment provides a method for manufacturing a copper block-embedded circuit board, which includes the following steps:
s1: milling grooves in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 to form upper embedded embedding holes 3 and lower embedded embedding holes 4 in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15;
s2: placing an upper semi-cured sheet 12 on the upper end of the circuit substrate 11, placing an upper core plate 13 on the upper semi-cured sheet 12, aligning the upper semi-cured sheet 12 and the upper core plate 13, and then loading the copper block 2 into the upper embedded hole 3;
s3: placing a lower prepreg 14 at the lower end of the circuit substrate 11, placing a lower core board 15 on the lower prepreg 14, and after the lower prepreg 14 and the lower core board 15 are aligned, loading the copper block 2 into the lower embedded hole 4;
s4: and putting the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a laminating machine, and laminating and integrating the circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a whole through the laminating machine.
EXAMPLE five
Referring to fig. 9, a circuit board with a copper block embedded comprises a circuit board body 1, wherein the circuit board body 1 is embedded with a copper block 2, the circuit board body 1 comprises a circuit substrate 11, an upper semi-cured sheet 12, an upper core plate 13, a lower semi-cured sheet 14 and a lower core plate 15, the upper semi-cured sheet 12 is arranged on the upper surface of the circuit substrate 11, the upper core plate 13 is arranged on the upper semi-cured sheet 12, the lower semi-cured sheet 14 is arranged on the lower surface of the circuit substrate 11, and the lower core plate 15 is arranged on the lower semi-cured sheet 14.
Lower embedded embedding holes 4 are formed in the lower prepreg 14 and the lower core plate 15, copper blocks 2 are arranged in the lower embedded embedding holes 4, the side end faces of the copper blocks 2 are tightly attached to the lower prepreg 14 and the lower core plate 15, the surfaces of the copper blocks 2 protrude out of the lower core plate 15, and the surfaces of the copper blocks 2 are flush with the surfaces of the lower core plate 15.
The number of the groups of the lower embedded holes 4 is three, the number of the lower embedded holes 4 in each group is two, and the two lower embedded holes 4 are symmetrically distributed at two ends of the lower prepreg 14 and the lower core plate 15.
In order to better show the manufacturing process of the copper block-embedded circuit board, this embodiment provides a method for manufacturing a copper block-embedded circuit board, which includes the following steps:
s1: milling grooves in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 to form upper embedded embedding holes 3 and lower embedded embedding holes 4 in the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15;
s2: placing an upper semi-cured sheet 12 on the upper end of the circuit substrate 11, placing an upper core plate 13 on the upper semi-cured sheet 12, aligning the upper semi-cured sheet 12 and the upper core plate 13, and then loading the copper block 2 into the upper embedded hole 3;
s3: placing a lower prepreg 14 at the lower end of the circuit substrate 11, placing a lower core board 15 on the lower prepreg 14, and after the lower prepreg 14 and the lower core board 15 are aligned, loading the copper block 2 into the lower embedded hole 4;
s4: and putting the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a laminating machine, and laminating and integrating the circuit substrate 11, the upper semi-cured sheet 12, the upper core board 13, the lower semi-cured sheet 14 and the lower core board 15 into a whole through the laminating machine.
Comparative example
The utility model provides a bury copper billet circuit board, includes circuit board body 1, and circuit board body 1 includes circuit substrate 11, first semi-solid piece 12, upper core 13, lower prepreg 14 and lower floor's core 15, and the upper surface of circuit substrate 11 is provided with first semi-solid piece 12, is provided with upper core 13 on first semi-solid piece 12, and the lower surface of circuit substrate 11 is provided with lower prepreg 14, is provided with lower floor's core 15 on the lower prepreg 14.
The manufacturing process is adopted to manufacture the circuit board, and the following quality detection is carried out on the circuit board with the copper blocks embedded:
1. testing the Heat dissipation Performance of the copper-clad Wiring Board (in accordance with the relevant provisions of GB/T13754)
And (3) placing a sample on a detection table, switching on the manufactured copper block embedded circuit board to enable the copper block embedded circuit board to work for a period of time, and then detecting the temperature of the copper block embedded circuit board by using a temperature detector and recording the temperature in detail.
After the heat dissipation performance of the copper block-embedded circuit board is detected, the heat dissipation rate of the copper block-embedded circuit board is as shown in the following table:
Figure BDA0003743977060000111
therefore, the heat dissipation performance of the copper block embedded circuit board manufactured by the manufacturing process is greatly improved.
In summary, in the copper block embedded circuit board and the manufacturing process thereof of the present invention, the groove milling is performed on the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15, so that the upper embedded embedding hole 3 and the lower embedded embedding hole 4 are formed on the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15, after the upper semi-cured sheet 12 and the upper core plate 13 are aligned, the copper block 2 is loaded into the upper embedded embedding hole 3, the lower semi-cured sheet 14 is loaded at the lower end of the circuit substrate 11, the lower core plate 15 is loaded on the lower semi-cured sheet 14, after the lower semi-cured sheet 14 and the lower core plate 15 are aligned, the copper block 2 is loaded into the lower embedded embedding hole 4, the assembled circuit substrate 11, the upper semi-cured sheet 12, the upper core plate 13, the lower semi-cured sheet 14 and the lower core plate 15 are loaded into the laminating machine, and the heat dissipation performance of the circuit board is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims (10)

1. The utility model provides a bury copper billet circuit board, includes circuit board body (1), its characterized in that, copper billet (2) have been buried on circuit board body (1), circuit board body (1) includes circuit substrate (11), last prepreg (12), upper core (13), prepreg (14) and lower floor's core (15) down, the upper surface of circuit substrate (11) is provided with last prepreg (12), be provided with upper core (13) on last prepreg (12), the lower surface of circuit substrate (11) is provided with prepreg (14) down, be provided with lower floor's core (15) on prepreg (14) down.
2. The circuit board with the embedded copper block as claimed in claim 1, wherein the upper semi-cured sheet (12) and the upper core (13) are provided with upper embedded holes (3), the upper embedded holes (3) are provided with copper blocks (2), the side end surfaces of the copper blocks (2) are tightly attached to the upper semi-cured sheet (12) and the upper core (13), the surface of the copper blocks (2) protrudes out of the upper core (13) and the surface of the copper blocks (2) is flush with the surface of the upper core (13).
3. The buried copper block circuit board according to claim 2, characterized in that the number of the groups of the upper buried embedding holes (3) is not less than one, the number of the upper buried embedding holes (3) in each group is two, and two of the upper buried embedding holes (3) are symmetrically distributed at both ends of the upper prepreg (12) and the upper layer chip (13).
4. The buried copper block circuit board according to claim 1, characterized in that the lower prepreg (14) and the lower core board (15) are provided with lower buried insertion holes (4), the lower buried insertion holes (4) are provided with copper blocks (2), the side end surfaces of the copper blocks (2) are tightly attached to the lower prepreg (14) and the lower core board (15), the surface of the copper blocks (2) protrudes out of the lower core board (15) and the surface of the copper blocks (2) is flush with the surface of the lower core board (15).
5. The buried copper block circuit board according to claim 4, characterized in that the number of the groups of the lower buried embedding holes (4) is not less than one, the number of the lower buried embedding holes (4) in each group is two, and two lower buried embedding holes (4) are symmetrically distributed at two ends of the lower prepreg (14) and the lower core board (15).
6. A buried copper block circuit board according to claim 1, characterized in that the end surface of the copper block (2) protruding from the upper core (13) is provided with fins (5), the fins (5) are connected to the copper block (2) in parallel and at equal intervals, the end surface of the copper block (2) protruding from the lower core (15) is also provided with fins (5), and the fins (5) are connected to the copper block (2) in parallel and at equal intervals.
7. A process for manufacturing a buried copper block circuit board according to any one of claims 1 to 6, comprising the steps of:
s1: milling grooves in the upper semi-cured sheet (12), the upper core plate (13), the lower semi-cured sheet (14) and the lower core plate (15) to form an upper embedded embedding hole (3) and a lower embedded embedding hole (4) in the upper semi-cured sheet (12), the upper core plate (13), the lower semi-cured sheet (14) and the lower core plate (15);
s2: placing an upper semi-cured sheet (12) at the upper end of a circuit substrate (11), placing an upper-layer core board (13) on the upper semi-cured sheet (12), and after the upper semi-cured sheet (12) is aligned with the upper-layer core board (13), loading a copper block (2) into an upper embedding hole (3);
s3: placing a lower prepreg (14) at the lower end of the circuit substrate (11), placing a lower core plate (15) on the lower prepreg (14), aligning the lower prepreg (14) and the lower core plate (15), and then loading the copper block (2) into the lower embedded embedding hole (4);
s4: the assembled circuit substrate (11), the upper semi-cured sheet (12), the upper core plate (13), the lower semi-cured sheet (14) and the lower core plate (15) are placed into a laminating machine, and the circuit substrate (11), the upper semi-cured sheet (12), the upper core plate (13), the lower semi-cured sheet (14) and the lower core plate (15) are pressed and integrated through the laminating machine.
8. The process for manufacturing a buried copper block circuit board according to claim 7, wherein when the circuit substrate (11), the upper semi-cured sheet (12), the upper core board (13), the lower semi-cured sheet (14) and the lower core board (15) are laminated by using a laminating machine, the upper semi-cured sheet (12) and the lower semi-cured sheet (14) are heated and melted by a hot-pressing plate provided on the laminating machine, so that the upper core board (13) and the lower core board (15) are fastened on the circuit substrate (11).
9. The process for manufacturing a buried copper block circuit board according to claim 7, wherein the upper semi-cured sheet (12) is heated to melt and fills the gap between the circuit substrate (11) and the upper core board (13) and covers the copper block (2), and the lower semi-cured sheet (14) is heated to melt and fills the gap between the circuit substrate (11) and the lower core board (15) and covers the copper block (2).
10. The manufacturing process of the buried copper block circuit board according to claim 7, wherein the upper semi-cured sheet (12) and the lower semi-cured sheet (14) adopt a 1080 model semi-cured sheet, and the full filling is ensured through matching of a plurality of sheets.
CN202210820230.7A 2022-07-13 2022-07-13 Circuit board with copper blocks embedded and manufacturing process thereof Pending CN115209611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210820230.7A CN115209611A (en) 2022-07-13 2022-07-13 Circuit board with copper blocks embedded and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210820230.7A CN115209611A (en) 2022-07-13 2022-07-13 Circuit board with copper blocks embedded and manufacturing process thereof

Publications (1)

Publication Number Publication Date
CN115209611A true CN115209611A (en) 2022-10-18

Family

ID=83579160

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210820230.7A Pending CN115209611A (en) 2022-07-13 2022-07-13 Circuit board with copper blocks embedded and manufacturing process thereof

Country Status (1)

Country Link
CN (1) CN115209611A (en)

Similar Documents

Publication Publication Date Title
JP5101542B2 (en) Chip built-in printed circuit board and manufacturing method thereof
KR100733253B1 (en) High density printed circuit board and manufacturing method thereof
KR101084250B1 (en) Electronic Components Embedded Printed Circuit Board and Method of Manufacturing the Same
CN101662895A (en) Multilayer circuit board, manufacturing method thereof and method for detecting alignment of circuit board
CN101861049A (en) Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
CN101472404A (en) Multi-layer circuit board and manufacturing method thereof
CN103260350B (en) Blind buried via hole plate compression method
JP2002541680A (en) Printed wiring board with metal core substrate for heat strengthening of ball grid array package and method of manufacturing the same
JPH05198946A (en) Manufacture of multilayer printed circuit board
KR20110028951A (en) Printed circuit board and manufacturing method thereof
CN110167289B (en) Method for manufacturing multilayer circuit board
CN211063845U (en) Mechanical blind hole HDI circuit board
CN107734859B (en) PCB manufacturing method and PCB
US7810232B2 (en) Method of manufacturing a circuit board
CN115209611A (en) Circuit board with copper blocks embedded and manufacturing process thereof
JPH05343856A (en) Multilayer printed wiring board and manufacture thereof
CN112351600A (en) High-speed ATE test board and manufacturing method thereof
JP4705261B2 (en) Build-up multilayer printed wiring board
KR100771320B1 (en) Embedded chip printed circuit board and fabricating method of the same
CN213847115U (en) Multilayer circuit board of high roughness
CN215871951U (en) Circuit board assembly
CN212278534U (en) Prevent multilayer circuit board structure of fretwork
CN220307461U (en) Circuit board and combined circuit board
CN215581874U (en) Blind buried orifice plate with asymmetric structure
CN116634662B (en) High-speed printed circuit board and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination