CN115206677A - Common mode filter capacitor structure, PCB and wiring method thereof - Google Patents
Common mode filter capacitor structure, PCB and wiring method thereof Download PDFInfo
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- CN115206677A CN115206677A CN202210946307.5A CN202210946307A CN115206677A CN 115206677 A CN115206677 A CN 115206677A CN 202210946307 A CN202210946307 A CN 202210946307A CN 115206677 A CN115206677 A CN 115206677A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 173
- 238000000034 method Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 114
- 229910052802 copper Inorganic materials 0.000 claims abstract description 114
- 239000010949 copper Substances 0.000 claims abstract description 114
- 238000005253 cladding Methods 0.000 claims abstract description 28
- 238000004804 winding Methods 0.000 claims description 12
- 230000007935 neutral effect Effects 0.000 claims description 10
- 230000008878 coupling Effects 0.000 abstract description 8
- 238000010168 coupling process Methods 0.000 abstract description 8
- 238000005859 coupling reaction Methods 0.000 abstract description 8
- 238000001914 filtration Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 63
- 238000010586 diagram Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
The invention discloses a common mode filter capacitor structure, a PCB and a wiring method thereof, wherein the common mode filter capacitor structure comprises a circuit layer and a grounding layer which are arranged in a back-to-back manner; the circuit layer is provided with a power live wire and a power zero wire, at least one first copper clad is arranged along the power live wire, and at least one second copper clad is arranged along the power zero wire; a third copper clad is arranged on the grounding layer opposite to the first copper clad and the second copper clad; the first copper cladding and the third copper cladding are used as two polar plates of a first common mode filter capacitor and used as filling media to form the first common mode filter capacitor, and the second copper cladding and the third copper cladding are used as two polar plates of a second common mode filter capacitor and used as filling media to form the second common mode filter capacitor. The invention can avoid near-field coupling and improve the filtering performance.
Description
Technical Field
The invention relates to the technical field of PCBs (printed circuit boards), in particular to a common-mode filter capacitor structure, a PCB and a wiring method of the PCB.
Background
A filter circuit is an essential part of circuit design as an important means for suppressing electromagnetic interference. The conventional filter circuit is usually configured with a common mode choke coil and a conventional capacitor, and is used for attenuating and bypassing electromagnetic interference. However, most of the conventional capacitors are vertical capacitors, and a large amount of leakage magnetic flux exists around the common mode choke coil, so that the conventional capacitors are easy to generate near field coupling with the common mode choke coil, and the filtering performance of the filter circuit is reduced.
Disclosure of Invention
The invention provides a common-mode filter capacitor structure, a PCB and a wiring method thereof, which can avoid near-field coupling between a capacitor and a common-mode choke coil and improve the filtering performance.
In a first aspect, the invention provides a common mode filter capacitor structure, a PCB and a wiring method thereof, wherein the common mode filter capacitor structure comprises a circuit layer and a ground layer which are arranged oppositely; the circuit layer is provided with a power supply live wire and a power supply zero line, at least one first copper clad is arranged along the power supply live wire, and at least one second copper clad is arranged along the power supply zero line; a third copper clad is arranged on the grounding layer opposite to the first copper clad and the second copper clad; the first copper cladding and the third copper cladding are used as two pole plates of a first common-mode filter capacitor and a plate of the PCB is used as a filling medium to form the first common-mode filter capacitor, and the second copper cladding and the third copper cladding are used as two pole plates of a second common-mode filter capacitor and a plate of the PCB is used as a filling medium to form the second common-mode filter capacitor.
Furthermore, the first copper clad is arranged on the power supply live wire, and the second copper clad is arranged on the power supply zero wire.
Furthermore, the first copper clad is arranged on the circuit layer and is parallel to the power supply live wire, and the second copper clad is arranged on the circuit layer and is parallel to the power supply zero line; the first copper clad is connected with the live wire of the power supply through a jumper, and the second copper clad is connected with the zero line of the power supply through the jumper.
Further, a plurality of the first copper clad and a plurality of the second copper clad are included; the plurality of first copper-clad plates are sequentially arranged on the circuit layer and are all parallel to the power supply live wire, and the plurality of second copper-clad plates are sequentially arranged on the circuit layer and are all parallel to the power supply zero line; each first copper clad and each third copper clad form one first common-mode filter capacitor, and each second copper clad and each third copper clad form one second common-mode filter capacitor.
Furthermore, a ground wire is further arranged on the ground layer and is respectively connected with the live wire and the null wire of the power supply, and the third copper cladding is arranged on the ground wire.
In a second aspect, the present invention further provides a PCB board, which includes any one of the common mode filter capacitor structures described above.
Further, the filter comprises a common mode choke coil and a first common mode filter capacitor and a second common mode filter capacitor in the common mode filter capacitor structure; one end of a first winding of the common mode choke coil is connected with a power live wire in the common mode filter capacitor structure, the other end of the first winding of the common mode choke coil is connected with the first common mode filter capacitor, one end of a second winding of the common mode choke coil is connected with a power zero wire in the common mode filter capacitor structure, the other end of the second winding of the common mode choke coil is connected with the second common mode filter capacitor, and the first common mode filter capacitor and the second common mode filter capacitor are further connected with an interference source.
Furthermore, the PCB further comprises a first capacitor and a second capacitor, wherein the first capacitor and the second capacitor are arranged on the PCB, one end of the first capacitor is connected with a ground wire, the other end of the first capacitor is connected with the live wire of the power supply, one end of the second capacitor is connected with the ground wire, and the other end of the second capacitor is connected with the zero line of the power supply.
The power supply further comprises a third capacitor and a fourth capacitor, and the third capacitor and the fourth capacitor are respectively connected with the live wire and the ground wire of the power supply.
In a third aspect, the present invention further provides a PCB wiring method, applied to any one of the above PCBs, including:
the PCB comprises a PCB and is characterized in that a power supply live wire and a power supply zero line are arranged on the same layer of the PCB, and a first copper clad and a second copper clad are respectively arranged along the power supply live wire and the power supply zero line, wherein the parameters of the first copper clad and the second copper clad are the same;
a third copper-clad plate is arranged on the circuit board on the layer different from the layer of the PCB on which the live wire and the null wire of the power supply are arranged;
arranging the circuit board provided with the first copper clad laminate and the second copper clad laminate and the circuit board provided with the third copper clad laminate in a laminated manner, and taking a plate of the circuit board as a filling medium;
the first copper-clad plate and the third copper-clad plate are used as two polar plates of a first common-mode filter capacitor to form the first common-mode filter capacitor, and the second copper-clad plate and the third copper-clad plate are used as two polar plates of a second common-mode filter capacitor to form the second common-mode filter capacitor.
According to the common mode filter capacitor structure, the PCB and the wiring method of the common mode filter capacitor structure, the power supply live wire and the power supply zero line are arranged on the circuit layer, the first copper clad and the second copper clad are arranged along the power supply live wire and the power supply zero line, the third copper clad is arranged on the grounding layer, the first copper clad, the third copper clad, the second copper clad and the third copper clad are respectively used as two polar plates of the first common mode filter capacitor and two polar plates of the second common mode filter capacitor, and the first common mode filter capacitor and the second common mode filter capacitor are formed by taking a plate of the circuit board as a filling material and are parallel plate capacitors, so that near field coupling cannot be generated with the common mode choke coil, and therefore the generation of near field coupling is avoided, and the filter performance is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a common-mode filter capacitor structure according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a common-mode filter capacitor structure according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a PCB board according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a PCB board according to a second embodiment of the present invention;
fig. 5 is a schematic flow chart of a PCB wiring method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of a common-mode filter capacitor structure according to a first embodiment of the present invention; fig. 2 is a schematic structural diagram of a common-mode filter capacitor structure according to a second embodiment of the present invention; as shown in fig. 1, the common mode filter capacitor structure provided by the present invention includes a circuit layer 10 and a ground layer 20 disposed opposite to each other; the circuit layer 10 is provided with a power live wire L and a power zero wire N, and is provided with at least one first copper-clad S1 along the power live wire L and at least one second copper-clad S2 along the power zero wire N; a third copper clad S3 is arranged on the grounding layer 20 opposite to the first copper clad S1 and the second copper clad S2; the first copper S1 and the third copper S3 are used as two polar plates of a first common-mode filter capacitor C1 and used as filling media to form the first common-mode filter capacitor C1, and the second copper S2 and the third copper S3 are used as two polar plates of a second common-mode filter capacitor C2 and used as filling media to form the second common-mode filter capacitor C2.
Specifically, for a single-layer circuit board, i.e., a circuit board including only one circuit layer 10 and one ground layer 20, the circuit layer 10 may be provided as a top layer and the ground layer 20 may be provided as a bottom layer, or the circuit layer 10 may be provided as a bottom layer and the ground layer 20 may be provided as a top layer, and the circuit layer 10 and the ground layer 20 may be provided in a stacked manner. There are power live wire L and power zero line N on circuit layer 10 cloth to be provided with first copper S1 and second copper S2 along power live wire L and power zero line N, as shown in fig. 1, first copper S1 that covers can set up the position department that is equipped with power live wire L on circuit layer 10, simultaneously, be equipped with the third copper S3 that covers with first copper S1 corresponding position department on ground plane 20, simultaneously, can set up ground wire PE on ground plane 20, make power live wire L and ground wire PE lay wire between the different layers in the PCB board. The area of the first copper-clad S1 can be enlarged as required, and the size of the first copper-clad S1 is related to the capacitance value of the formed first common-mode filter capacitor C1. The first common mode filter capacitor C1 is formed by taking the first copper-clad S1 and the third copper-clad S3 as two polar plates of the first common mode filter capacitor C1 and taking a board of a PCB (printed circuit board) as a filling medium between the first copper-clad S1 and the third copper-clad S3, the forming principle of the second common mode filter capacitor C2 is the same as that of the first common mode filter capacitor C1, and the description is not expanded here. The first common-mode filter capacitor C1 and the second common-mode filter capacitor C2 are used as parallel-plate capacitors, and can bypass common-mode interference on a live wire L and a null wire N of the power supply to a ground wire PE.
When the PCB is a multi-layer board, that is, the PCB includes a plurality of circuit layers 10 and ground layers 20 stacked one on another, the capacitance values of the first common-mode filter capacitor C1 and the second common-mode filter capacitor C2 can be changed by disposing the power supply live line L and the power supply neutral line N, and the first copper clad S1 and the second copper clad S2 on different circuit layers 10.
In a further embodiment, the first copper clad S1 is disposed on the power supply live wire L, and the second copper clad S2 is disposed on the power supply neutral wire N.
The first copper-clad S1 can be arranged on the live power line L, and the second copper-clad S2 can be arranged on the neutral power line N, as shown in fig. 1, the capacitance values of the first common-mode filter capacitor C1 and the second common-mode filter capacitor C2 formed by changing the area of the first copper-clad S1 and the area of the second copper-clad S2 are adjusted, and it should be noted that the areas of the first copper-clad S1 and the second copper-clad S2 are the same.
As a further embodiment, the first copper clad S1 is disposed on the circuit layer 10 and is parallel to the power supply live wire L, and the second copper clad S2 is disposed on the circuit layer 10 and is parallel to the power supply neutral wire N; the first copper-clad S1 is connected with the power live wire L through a jumper wire, and the second copper-clad S2 is connected with the power zero line N through the jumper wire.
As shown in fig. 2, a first copper-clad portion S1 is disposed at a position parallel to a power live wire L, a second copper-clad portion S2 is disposed at a position parallel to a power zero line N, the first copper-clad portion S1 is connected to the power live wire L through a jumper wire, the second copper-clad portion S2 is connected to the power zero line N through a jumper wire, and the first copper-clad portion S1 and the third copper-clad portion S3 form a first common mode filter capacitor C1, and the second copper-clad portion S2 and the third copper-clad portion S3 form a second common mode filter capacitor C2. When the first common-mode filter capacitor C1 is not needed and/or the second common-mode filter capacitor C2 is not needed, a jumper wire between the first copper-clad S1 and the power live wire L and/or a jumper wire between the second copper-clad S2 and the power live wire L can be disconnected, and the first common-mode filter capacitor C1 and the second common-mode filter capacitor C2 can be flexibly connected.
As a further example, a plurality of the first copper-clad S1 and a plurality of the second copper-clad S2; the plurality of first copper-clad S1 are sequentially arranged on the circuit layer 10 and are all parallel to the power live wire L, and the plurality of second copper-clad S2 are sequentially arranged on the circuit layer 10 and are all parallel to the power zero wire N; each first copper cladding S1 and each third copper cladding S3 form one first common mode filter capacitor C1, and each second copper cladding S2 and each third copper cladding S3 form one second common mode filter capacitor C2.
The first common-mode filter capacitor C1 and the second common-mode filter capacitor C2 may be adjusted by a plurality of first copper-clad S1 and a plurality of second copper-clad S2, so as to meet the requirements of different filter circuits, and it should be noted that the number of the first copper-clad S1 is the same as the number of the second copper-clad S2. When the PCB board is a multi-layer board, similar structures may be provided on the circuit layers 10 of different layers as well.
As a further embodiment, a ground line PE is further disposed on the ground layer 20, and the ground line PE is respectively connected to the power supply live line L and the power supply neutral line N, wherein the third copper cladding S3 is disposed on the ground line PE.
When only the differential mode interference needs to be eliminated, the third copper clad S3 may not be connected with the ground wire PE, and when the common mode interference needs to be eliminated, the third copper clad S3 may be disposed on the ground wire PE.
As shown in fig. 3 to 4, fig. 3 is a schematic structural diagram of a PCB board according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a PCB according to a second embodiment of the present invention, and as shown in fig. 3, the present invention further discloses a PCB including any one of the common mode filter capacitor structures described above.
As a further embodiment, the filter 30 is further included, and the filter 30 includes a common mode choke coil L and a first common mode filter capacitor C1 and a second common mode filter capacitor C2 in the common mode filter capacitor structure; one end of a first winding of the common mode choke coil L is connected with a live power line L in the common mode filter capacitor structure, the other end of the first winding is connected with the first common mode filter capacitor C1, one end of a second winding of the common mode choke coil L is connected with a neutral power line N in the common mode filter capacitor structure, the other end of the second winding of the common mode choke coil L is connected with the second common mode filter capacitor C2, and the first common mode filter capacitor C1 and the second common mode filter capacitor C2 are further connected with an interference source a.
As shown in fig. 3, the principle that the first copper cladding S1 and the third copper cladding S3 form the first common mode filter capacitor C1 and the principle that the second copper cladding S2 and the third copper cladding S3 form the common mode filter capacitor are the same as the above. The common mode choke coil L, the first common mode filter capacitor C1 and the second common mode filter capacitor C2 form a filter 30, and the first common mode filter capacitor C1 and the second common mode filter capacitor C2 are parallel plate capacitors, so that compared with a conventional capacitor, parasitic capacitance parameters are reduced, near-field coupling with the common mode choke coil L is avoided, and high-frequency common mode interference can be bypassed to the ground wire PE. As shown in fig. 4, if the controller on which the PCB is located has a larger heat sink, and the heat sink can replace the copper clad on the ground layer 20, the filter 30 can bypass the high frequency common mode interference to the heat sink, so as to provide a loop for the interference generated by the parasitic capacitance between the power device of the controller and the heat sink.
As a further embodiment, the power supply further comprises a first capacitor Y1 and a second capacitor Y2, the first capacitor Y1 and the second capacitor Y2 are arranged on the PCB, one end of the first capacitor Y1 is connected to the ground wire PE, the other end of the first capacitor Y1 is connected to the power supply live wire L, one end of the second capacitor Y2 is connected to the ground wire PE, and the other end of the second capacitor Y2 is connected to the power supply neutral wire N.
As a further embodiment, the power supply further includes a third capacitor X1 and a fourth capacitor X4, and the third capacitor X1 and the fourth capacitor X4 are both connected to the power supply live line L and the power supply ground line PE, respectively.
The first capacitor Y1 and the second capacitor Y2 are Y capacitors (ceramic capacitors) for eliminating common mode interference, and are usually large-capacity capacitors, and the third capacitor X1 and the fourth capacitor X4 are X capacitors (metal thin film capacitors) for eliminating differential mode interference. As shown in fig. 3, the third copper clad S3 below the current loop reduces magnetic field radiation generated by a high-frequency differential mode current loop formed by the interference source a through the power supply live wire L, the power supply zero wire N and the third capacitor X1, and reduces near-field coupling with components in the PCB and magnetic field radiation of the PCB, wherein the interference source a may be a PFC circuit or a DC-DC circuit. It should be noted that, a common mode filter capacitor structure may also be formed by disposing a metal plate having the same size as the PCB, disposing the ground layer 20 in close contact with the metal plate, and replacing the third copper-clad S3 with the metal plate.
Referring to fig. 5, fig. 5 is a schematic flow chart of a PCB board wiring method according to an embodiment of the present invention, the PCB board wiring method according to an embodiment of the present invention can be applied to any one of the above PCBs, and as shown in fig. 5, the control method includes steps S110 to S140.
And S110, arranging a power live wire and a power zero wire on the same layer of circuit board of the PCB, and respectively arranging a first copper-clad part and a second copper-clad part along the power live wire and the power zero wire, wherein the parameters of the first copper-clad part and the second copper-clad part are the same.
In the embodiment of the invention, the power supply live wire and the power supply zero line are firstly arranged on the same layer of circuit board of the PCB, namely the power supply live wire and the power supply zero line are required to be arranged on the same layer of circuit board, and the first copper clad and the second copper clad are arranged along the power supply live wire and the power supply zero line, wherein the first copper clad can be arranged on the power supply live wire or can be arranged in parallel with the power supply live wire, when the first copper clad is arranged in parallel with the power supply live wire, the first copper clad can be connected with the power supply live wire through a jumper wire, and the second copper clad is the same.
And S120, arranging a third copper-clad plate on the circuit board on the layer different from the layer of the power live wire and the layer of the power zero wire on the PCB.
In the embodiment of the invention, a third copper clad is arranged on the other layer of the circuit board, and the third copper clad can be connected with a ground wire or not, depending on whether common mode interference needs to be eliminated or not.
And S130, laminating the circuit board provided with the first copper clad layer and the second copper clad layer and the circuit board provided with the third copper clad layer, and taking the plate of the circuit board as a filling medium.
In the embodiment of the invention, the circuit board provided with the first copper-clad plate and the second copper-clad plate can be a circuit layer, the circuit board provided with the third copper-clad plate can be a grounding layer, and a PCB plate is used as a filling material between the circuit layer and the grounding layer.
S140, the first copper-clad plate and the third copper-clad plate are used as two polar plates of a first common-mode filter capacitor to form the first common-mode filter capacitor, and the second copper-clad plate and the third copper-clad plate are used as two polar plates of a second common-mode filter capacitor to form the second common-mode filter capacitor.
In the embodiment of the invention, when a plurality of first copper-clad plates and a plurality of second copper-clad plates are arranged, a plurality of first common-mode filter capacitors and a plurality of second common-mode filter capacitors can be formed, and the capacitance values of the corresponding capacitors can be adjusted by adjusting the areas of the first copper-clad plates and the second copper-clad plates.
According to the invention, the power supply live wire and the power supply zero line are arranged on the same layer of circuit board of the PCB, the first copper-clad plate and the second copper-clad plate are arranged along the power supply live wire and the power supply zero line, the third copper-clad plate is arranged on the other layer of circuit board, and the plate of the PCB is used as a filling medium, so that the first common-mode filter capacitor and the second common-mode filter capacitor are formed, and the first common-mode filter capacitor and the second common-mode filter capacitor are used as parallel plate capacitors and cannot generate near-field coupling with the common-mode choke coil, so that the filtering performance of the filter circuit or the filter cannot be reduced.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A common mode filter capacitor structure is applied to a PCB and is characterized by comprising a circuit layer and a grounding layer which are arranged oppositely;
the circuit layer is provided with a power live wire and a power zero wire, at least one first copper clad is arranged along the power live wire, and at least one second copper clad is arranged along the power zero wire;
a third copper clad is arranged on the grounding layer opposite to the first copper clad and the second copper clad;
the first copper cladding and the third copper cladding are used as two pole plates of a first common-mode filter capacitor and a plate of the PCB is used as a filling medium to form the first common-mode filter capacitor, and the second copper cladding and the third copper cladding are used as two pole plates of a second common-mode filter capacitor and a plate of the PCB is used as a filling medium to form the second common-mode filter capacitor.
2. A common-mode filter capacitor structure according to claim 1, wherein the first copper cladding is provided on the power supply live wire and the second copper cladding is provided on the power supply zero wire.
3. The common-mode filter capacitor structure of claim 1, wherein the first copper clad is disposed on the circuit layer and parallel to the power line, and the second copper clad is disposed on the circuit layer and parallel to the power neutral; the first copper-clad part is connected with the power live wire through a jumper wire, and the second copper-clad part is connected with the power zero line through the jumper wire.
4. A common-mode filter capacitor structure according to claim 3, comprising a plurality of said first copper clad and a plurality of said second copper clad;
the plurality of first copper-clad plates are sequentially arranged on the circuit layer and are all parallel to the live wire of the power supply, and the plurality of second copper-clad plates are sequentially arranged on the circuit layer and are all parallel to the zero line of the power supply;
each first copper cladding and each third copper cladding form one first common mode filter capacitor, and each second copper cladding and each third copper cladding form one second common mode filter capacitor.
5. The common mode filter capacitor structure of claim 1, wherein the ground plane is further provided with a ground line, the ground line is connected to the power supply live line and the power supply neutral line, respectively, and the third copper clad is provided on the ground line.
6. A PCB board comprising the common mode filter capacitor structure of any one of claims 1 to 5.
7. The PCB board of claim 6, further comprising a filter comprising a common mode choke and first and second common mode filter capacitances in the common mode filter capacitance structure;
one end of a first winding of the common mode choke coil is connected with a power live wire in the common mode filter capacitor structure, the other end of the first winding of the common mode choke coil is connected with the first common mode filter capacitor, one end of a second winding of the common mode choke coil is connected with a power zero wire in the common mode filter capacitor structure, the other end of the second winding of the common mode choke coil is connected with the second common mode filter capacitor, and the first common mode filter capacitor and the second common mode filter capacitor are further connected with an interference source.
8. The PCB board of claim 7, further comprising a first capacitor and a second capacitor, wherein the first capacitor and the second capacitor are disposed on the PCB board, and one end of the first capacitor is connected to a ground line, and the other end of the first capacitor is connected to the live line of the power supply, and one end of the second capacitor is connected to the ground line, and the other end of the second capacitor is connected to the neutral line of the power supply.
9. The PCB board of claim 8, further comprising a third capacitor and a fourth capacitor, wherein the third capacitor and the fourth capacitor are each connected to the hot power line and the ground power line, respectively.
10. A PCB wiring method applied to the PCB of any one of claims 6 to 9, the method comprising:
the PCB comprises a PCB and is characterized in that a power supply live wire and a power supply zero line are arranged on the same layer of the PCB, and a first copper clad and a second copper clad are respectively arranged along the power supply live wire and the power supply zero line, wherein the parameters of the first copper clad and the second copper clad are the same;
a third copper-clad plate is arranged on the circuit board on the layer different from the layer of the PCB on which the live wire and the null wire of the power supply are arranged;
arranging the circuit board provided with the first copper clad laminate and the second copper clad laminate and the circuit board provided with the third copper clad laminate in a laminated manner, and taking a plate of the circuit board as a filling medium;
the first copper-clad plate and the third copper-clad plate are used as two polar plates of a first common-mode filter capacitor to form the first common-mode filter capacitor, and the second copper-clad plate and the third copper-clad plate are used as two polar plates of a second common-mode filter capacitor to form the second common-mode filter capacitor.
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| CN202210946307.5A CN115206677B (en) | 2022-08-08 | 2022-08-08 | Common mode filter capacitor structure, PCB and wiring method thereof |
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| CN202210946307.5A CN115206677B (en) | 2022-08-08 | 2022-08-08 | Common mode filter capacitor structure, PCB and wiring method thereof |
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| CN115206677A true CN115206677A (en) | 2022-10-18 |
| CN115206677B CN115206677B (en) | 2024-07-23 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201689786U (en) * | 2010-05-21 | 2010-12-29 | 深圳市共进电子有限公司 | Dielectric capacitor for printed circuit board |
| US20110273245A1 (en) * | 2010-05-04 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and common mode filter thereof |
| CN204013202U (en) * | 2014-07-30 | 2014-12-10 | 成都天奥测控技术有限公司 | A kind of power supply entrance filter structure that improves Electro Magnetic Compatibility |
| CN206452292U (en) * | 2017-01-24 | 2017-08-29 | 成都新欣神风电子科技有限公司 | Power-supply filter |
| CN109819588A (en) * | 2019-02-27 | 2019-05-28 | 珠海格力电器股份有限公司 | power filter and air conditioner |
| CN110277907A (en) * | 2019-06-17 | 2019-09-24 | 珠海格力电器股份有限公司 | Filtering device, power supply and filtering method thereof |
-
2022
- 2022-08-08 CN CN202210946307.5A patent/CN115206677B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110273245A1 (en) * | 2010-05-04 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and common mode filter thereof |
| CN201689786U (en) * | 2010-05-21 | 2010-12-29 | 深圳市共进电子有限公司 | Dielectric capacitor for printed circuit board |
| CN204013202U (en) * | 2014-07-30 | 2014-12-10 | 成都天奥测控技术有限公司 | A kind of power supply entrance filter structure that improves Electro Magnetic Compatibility |
| CN206452292U (en) * | 2017-01-24 | 2017-08-29 | 成都新欣神风电子科技有限公司 | Power-supply filter |
| CN109819588A (en) * | 2019-02-27 | 2019-05-28 | 珠海格力电器股份有限公司 | power filter and air conditioner |
| CN110277907A (en) * | 2019-06-17 | 2019-09-24 | 珠海格力电器股份有限公司 | Filtering device, power supply and filtering method thereof |
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| Publication number | Publication date |
|---|---|
| CN115206677B (en) | 2024-07-23 |
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