CN115200818B

CN115200818B - Semiconductor test equipment

Info

Publication number: CN115200818B
Application number: CN202210784847.8A
Authority: CN
Inventors: 彭劲松
Original assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Current assignee: Jiangsu Aisi Semiconductor Technology Co ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2023-06-20
Anticipated expiration: 2042-06-29
Also published as: CN115200818A

Abstract

The invention discloses semiconductor test equipment, which relates to the field of semiconductor test, and comprises a box body, wherein the upper part of the side wall of the box body is hinged with a box cover, the bottom of the inner cavity of the box body is fixedly connected with a driving motor, the side wall of a rotating shaft of the driving motor is fixedly connected with a first turntable, and the top end of the rotating shaft of the driving motor is fixedly connected with a universal ball; according to the invention, through the cooperation between the temperature controller and the temperature regulating pipe, an overheat or supercooling environment is simulated in the box body, and the temperature in the box body can be more rapidly converted into an overheat or supercooling state along with the rotation of the second turntable, so that the testing efficiency of the device is improved; and then, the second turntable is dithered by utilizing the impact effect between the dithering block and the impact block, so that a more complex testing environment is simulated, the anti-seismic performance of the welding element on the semiconductor wafer can be more effectively tested, and the production quality of the semiconductor wafer is ensured.

Description

Semiconductor test equipment

Technical Field

The invention relates to the technical field of semiconductor testing, in particular to semiconductor testing equipment.

Background

Semiconductors, as their name implies, are a class of objects that have electrical conductivity between conductors and insulators. The conductivity of the material is altered by the incorporation of impurities, which is the underlying basis of semiconductor technology. With this extension, this characteristic can be used to fabricate various transistors with different current-voltage characteristics. Tens of thousands of millions of transistors are integrated together and perform certain circuit functions to form an integrated circuit. Roughly speaking, an integrated circuit is designed, manufactured, packaged and tested to form a complete chip, which is usually a stand-alone entity that can be immediately used. After the semiconductor is produced, in order to achieve the yield of the semiconductor chips, it is necessary to perform a test of all the semiconductor chips before shipment.

At present, most of the existing semiconductor test equipment can only perform test in a normal-temperature environment and cannot adjust the temperature of the test environment, so that the limitation exists in the test of the semiconductor, and the test effect is poor; in addition, in the semiconductor test, the shock resistance of the self-welding element is also an important detection item, the conventional semiconductor test equipment cannot simulate shock resistance detection in different environments, in the traditional shock resistance detection, the clamping stability of a semiconductor is poor, the situation that the semiconductor is separated easily occurs, so that the test process is influenced, and the semiconductor is damaged.

Disclosure of Invention

The invention aims to solve the defects that in the prior art, a better shock resistance detection scene cannot be simulated in different environments and the clamping stability of a semiconductor is poor.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

a semiconductor test apparatus comprising:

the box body, box body lateral wall upper portion articulates there is the case lid, box body inner chamber bottom fixedly connected with driving motor, driving motor axis of rotation lateral wall fixedly connected with first carousel, driving motor axis of rotation top fixedly connected with universal ball, universal ball top swing joint has the second carousel, second carousel upper surface middle part fixedly connected with sucking disc, second carousel upper surface edge annular is provided with the joint seat, second carousel upper surface is located the annular and is provided with first spring between sucking disc and the joint seat;

the absorption clamping assembly is arranged in the second turntable, the extending end of the absorption clamping assembly is in sliding connection with the inner cavity of the clamping seat, the suction end of the absorption clamping assembly is communicated with the inner cavity of the sucker, and the absorption clamping assembly is used for clamping and fixing the semiconductor material and can be tightened more and more in the rotation process;

the temperature adjusting component is arranged on the inner side wall of the box cover and is used for simulating different temperature environments in the box body;

and the shaking assembly is arranged between the first turntable and the second turntable and used for shaking the second turntable so as to simulate a shaking environment.

Preferably, the adsorption clamping assembly comprises a sealing groove, the sealing groove is annularly arranged in the inner cavity of the second turntable, the inner wall of the sealing groove is slidably connected with a piston plate, a second spring is fixedly connected to one side, away from the sucker, of the side wall of the piston plate and the sealing groove, a counterweight ball is fixedly connected to one side, close to the sucker, of the side wall of the piston plate and the sealing groove, and one side, close to the sucker, of the sealing groove is communicated with the inner cavity of the sucker.

Preferably, the fastening groove is formed in the inner cavity of the clamping seat, the fastening groove is communicated with one side, far away from the sucker, of the sealing groove, the inner cavity of the fastening groove is slidably connected with the fastening plate, and the outer side wall of the fastening plate is fixedly connected with the rubber pad.

Preferably, the first spring and the sucker are the same in height, the sucker is made of a hard rubber material, the distance from the first spring and the sucker to the upper surface of the second turntable is greater than the lowest surface of the clamping seat, and the lowest end of the rubber pad is flush with the upper surface of the first spring.

Preferably, the temperature adjusting assembly comprises a temperature adjusting pipe, the temperature adjusting pipe is fixedly connected with the middle part of the inner side wall of the box cover, the temperature adjusting pipe is communicated with the middle part of the inner side wall of the box cover in a head-tail mode, the outer side wall of the box cover is fixedly connected with a temperature controller, and the temperature controller is electrically connected with the temperature adjusting pipe.

Preferably, the sealed box of case lid inside wall upper portion fixedly connected with, sealed box inner wall sliding connection has the stripper plate, one side fixedly connected with that the stripper plate kept away from the case lid triggers the piece, and triggers the piece and run through sealed box lateral wall, and trigger and be sliding connection between the sealed box, trigger piece and sealed box be close to one side fixedly connected with third spring of case lid, and trigger the piece and can contact with the joint seat lateral wall.

Preferably, the sealing box is communicated with the temperature regulating pipe through a guide pipe, purified water is filled in the temperature regulating pipe and the sealing box, the contact surfaces of the triggering block and the clamping seat are processed by arc-shaped fillets, and the distance from the triggering block to the upper surface of the second turntable after the box cover is closed is smaller than the height of the clamping seat.

Preferably, the shake subassembly includes the spring telescopic link, the upper and lower end of spring telescopic link respectively with second carousel and first carousel fixed connection, second carousel bottom fixedly connected with shake piece, the equal fixedly connected with striking piece in box inner wall both sides, and the striking piece can be with shake the piece and contact.

Preferably, the distance from the lowest end of the shaking block to the first rotating disc is smaller than the distance from the uppermost end of the impact block to the first rotating disc, and the contact surfaces of the impact block and the shaking block are all processed by arc-shaped round corners.

Preferably, the bottom of the inner cavity of the box body is provided with an annular chute, a supporting rod is annularly arranged in the annular chute, the supporting rod is in sliding connection with the annular chute, and the upper end of the supporting rod is fixedly connected with the bottom of the first rotating disc.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the invention, through the cooperation between the temperature controller and the temperature regulating pipe, an overheat or supercooling environment is simulated in the box body, and the temperature in the box body can be more rapidly converted into an overheat or supercooling state along with the rotation of the second turntable, so that the testing efficiency of the device is improved; in addition, in the rotating process of the second turntable, the clamping seat can be in interference sliding with the trigger block, so that the heated or cooled purified water in the temperature-regulating pipe flows rapidly, and the temperature-regulating pipe can obtain a better heating or cooling effect; and then, the second turntable is dithered by utilizing the impact effect between the dithering block and the impact block, so that a more complex testing environment is simulated, the anti-seismic performance of the welding element on the semiconductor wafer can be more effectively tested, and the production quality of the semiconductor wafer is ensured.

2. According to the invention, under the centrifugal force effect generated by the rotation of the second turntable, the counterweight ball extrudes the piston plate, so that gas in the sealing groove enters the fastening groove, and the fastening plate is pushed outwards, so that the rubber pad is tightly attached to the side wall of the semiconductor wafer, and the clamping and fixing effects of the device on the semiconductor wafer are improved; and the other side of the sealing groove can generate an adsorption effect and transmit the adsorption effect into the sucker, so that the sucker is tightly attached to the bottom of the semiconductor wafer, and the clamping and fixing effect of the device is further improved.

Drawings

FIG. 1 is a schematic diagram of a front view overall structure of a semiconductor test apparatus according to the present invention;

FIG. 2 is a schematic diagram showing a side view of a semiconductor test apparatus according to the present invention;

FIG. 3 is a schematic view of a semiconductor test apparatus according to the present invention;

FIG. 4 is a schematic diagram showing an internal structure of a case of a semiconductor test apparatus according to the present invention;

FIG. 5 is an enlarged schematic view of the area A in FIG. 4 of a semiconductor test apparatus according to the present invention;

FIG. 6 is an enlarged schematic view of the area B in FIG. 4 of a semiconductor test apparatus according to the present invention;

FIG. 7 is a schematic diagram showing a partial cross-sectional structure of a case cover of a semiconductor test apparatus according to the present invention;

fig. 8 is an enlarged schematic view of the structure of the region C in fig. 7 of a semiconductor test apparatus according to the present invention.

In the figure: 1. a case; 101. an annular chute; 102. a support rod; 2. a case cover; 3. a first turntable; 31. a universal ball; 32. a second turntable; 33. a suction cup; 34. a clamping seat; 35. a first spring; 4. an adsorption clamping assembly; 41. sealing grooves; 42. a piston plate; 43. a second spring; 44. a weight ball; 45. a fastening plate; 46. a rubber pad; 5. a temperature regulating assembly; 51. a temperature adjusting tube; 52. a seal box; 53. an extrusion plate; 54. a trigger block; 55. a third spring; 6. a dithering assembly; 61. a spring telescoping rod; 62. a dithering block; 63. and (5) impacting the block.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.

Referring to fig. 1-8, a semiconductor test apparatus includes:

the box body 1, the upper portion of the side wall of the box body 1 is hinged with a box cover 2, the bottom of the inner cavity of the box body 1 is fixedly connected with a driving motor, the side wall of a driving motor rotating shaft is fixedly connected with a first rotary table 3, the top end of the driving motor rotating shaft is fixedly connected with a universal ball 31, the top of the universal ball 31 is movably connected with a second rotary table 32, the middle part of the upper surface of the second rotary table 32 is fixedly connected with a sucker 33, the edge of the upper surface of the second rotary table 32 is annularly provided with a clamping seat 34, and the upper surface of the second rotary table 32 is annularly provided with a first spring 35 between the sucker 33 and the clamping seat 34;

the absorption clamping component 4 is arranged inside the second turntable 32, the extending end of the absorption clamping component 4 is in sliding connection with the inner cavity of the clamping seat 34, the suction end of the absorption clamping component 4 is communicated with the inner cavity of the sucker 33, and the absorption clamping component 4 is used for clamping and fixing the semiconductor material and can be tightened more and more in the rotation process;

the temperature adjusting component 5 is arranged on the inner side wall of the box cover 2, and the temperature adjusting component 5 is used for simulating different temperature environments in the box body 1;

the shake assembly 6, shake assembly 6 is installed between first carousel 3 and second carousel 32, shake assembly 6 is used for making second carousel 32 take place the shake to simulate vibrations environment.

Referring to fig. 3 and 4, the adsorption clamping assembly 4 includes a sealing groove 41, the sealing groove 41 is annularly opened in an inner cavity of the second turntable 32, a piston plate 42 is slidably connected to an inner wall of the sealing groove 41, a second spring 43 is fixedly connected to a side of a side wall of the piston plate 42, which is far away from the sucker 33, with the sealing groove 41, a counterweight ball 44 is fixedly connected to a side of a side wall of the piston plate 42, which is close to the sucker 33, with the sealing groove 41, and a side, which is close to the sucker 33, is communicated with the inner cavity of the sucker 33;

referring to fig. 5, a fastening groove is formed in the inner cavity of the clamping seat 34, the fastening groove is communicated with one side, far away from the sucker 33, of the sealing groove 41, a fastening plate 45 is slidably connected in the inner cavity of the fastening groove, and a rubber pad 46 is fixedly connected to the outer side wall of the fastening plate 45;

through the arrangement of the structure, firstly, the semiconductor wafer is placed in the clamping seat 34, the bottom is attached to the first spring 35 and the sucker 33, then the box cover 2 is closed, the driving motor is started, the first rotating disk 3 and the second rotating disk 32 are driven to synchronously rotate under the action of rotation of the output shaft of the driving motor, under the centrifugal force effect generated by the rotation, the counterweight ball 44 in the sealing groove 41 can squeeze the piston plate 42 to slide to one side far away from the sucker 33, so that the gas in the cavity communicated with the sealing groove 41 and the fastening groove is compressed, and the compressed gas enters the fastening groove, so that the fastening plate 45 is pushed outwards, the rubber pad 46 is tightly attached to the side wall of the semiconductor wafer, and further the clamping and fixing effects of the semiconductor wafer are improved; when the piston plate 42 slides to the side far away from the sucker 33, the inner part of the cavity where the sealing groove 41 is communicated with the sucker 33 will generate adsorption action, and the adsorption action is transferred into the sucker 33, so that the sucker 33 is tightly attached to the bottom of the semiconductor wafer, and the clamping and fixing effect of the device is further improved.

Referring to fig. 1 and 2, the height of the first spring 35 is the same as that of the suction cup 33, the suction cup 33 is made of a hard rubber material, the distance from the first spring 35 to the suction cup 33 to the upper surface of the second turntable 32 is greater than the lowest surface of the clamping seat 34, and the lowest end of the rubber pad 46 is flush with the upper surface of the first spring 35;

through the arrangement of the structure, the semiconductor wafer can be ensured to be attached to the first spring 35 and the sucker 33, and the rubber pad 46 can be ensured to be attached to the side wall of the semiconductor wafer, so that the arrangement rationality of the device is ensured.

Referring to fig. 7 and 8, the temperature adjusting assembly 5 comprises a temperature adjusting pipe 51, the temperature adjusting pipe 51 is fixedly connected with the middle part of the inner side wall of the box cover 2, the temperature adjusting pipe 51 is communicated with the end to end, the outer side wall of the box cover 2 is fixedly connected with a temperature controller, and the temperature controller is electrically connected with the temperature adjusting pipe 51;

referring to fig. 8, a sealing box 52 is fixedly connected to the upper portion of the inner side wall of the case cover 2, an extrusion plate 53 is slidably connected to the inner wall of the sealing box 52, a trigger block 54 is fixedly connected to one side of the extrusion plate 53 away from the case cover 2, the trigger block 54 penetrates through the outer side wall of the sealing box 52, the trigger block 54 is slidably connected with the sealing box 52, a third spring 55 is fixedly connected to one side of the trigger block 54, close to the case cover 2, of the sealing box 52, and the trigger block 54 can be in contact with the side wall of the clamping seat 34;

the sealing box 52 is communicated with the temperature regulating tube 51 through a conduit, purified water is filled in the temperature regulating tube 51 and the sealing box 52, the contact surfaces of the trigger block 54 and the clamping seat 34 are processed by arc-shaped fillets, and the distance from the trigger block 54 to the upper surface of the second turntable 32 after the box cover 2 is closed is smaller than the height of the clamping seat 34;

through the arrangement of the structure, the temperature controller and the temperature regulating pipe 51 are matched, wherein the temperature controller adopts a Joker APC-TMS2000 series digital display temperature controller, the temperature regulating pipe 51 is connected with a cold and hot compressor inside the temperature controller, the cold and hot compressor adopts a small ZR125KC-TFD-522 compressor, and purified water in the temperature regulating pipe 51 can be heated or refrigerated by the cold and hot compressor;

when the case cover 2 is closed, the temperature regulating tube 51 is heated or cooled, so that an overheat or supercooling environment is simulated in the case 1, and different test requirements of semiconductor wafers are met, so that the test effect of the device is improved, and the flow speed of gas in the case 1 is accelerated along with the rotation of the second turntable 32, so that the gas flow rapidly and uniformly passes through the temperature regulating tube 51, and the temperature in the case 1 can be rapidly converted into an overheat or supercooling state, so that the test efficiency of the device is improved; and in the rotation process of the second turntable 32, the clamping seat 34 is also contacted with the trigger block 54, and under the extrusion effect generated by rotation, the trigger block 54 is retracted towards the inside of the sealing box 52, so that the extruding plate 53 extrudes purified water in the sealing box 52, and as the sealing box 52 and the temperature regulating tube 51 are mutually communicated, the above extrusion effect can enable the heated or cooled purified water in the temperature regulating tube 51 to flow rapidly, thereby enabling the temperature regulating tube 51 to obtain better and faster heating or cooling effect, further improving the generation of overheat or supercooling state of the device in the rotation process, and further improving the testing efficiency and testing effect of the device.

Referring to fig. 4, the shaking assembly 6 includes a spring telescopic rod 61, wherein the upper and lower ends of the spring telescopic rod 61 are respectively and fixedly connected with the second turntable 32 and the first turntable 3, a shaking block 62 is fixedly connected with the bottom of the second turntable 32, impact blocks 63 are fixedly connected with both sides of the inner wall of the box 1, and the impact blocks 63 can be in contact with the shaking block 62;

referring to fig. 4, the distance from the lowest end of the dithering block 62 to the first rotating disc 3 is smaller than the distance from the highest end of the striking block 63 to the first rotating disc 3, and the contact surfaces of the striking block 63 and the dithering block 62 are all processed by arc-shaped fillets;

through the arrangement of the structure, in the process of rotating the second turntable 32, the shaking block 62 arranged at the bottom of the shaking block contacts with the impact block 63, and the shaking of the spring telescopic rod 61 occurs due to the squeezing action generated by rotation, so that the shaking of the second turntable 32 occurs and finally acts on the semiconductor wafer, and the shaking of the semiconductor wafer occurs due to the effect of the second turntable 32 in the overheat or supercooled environment, so that a more complex testing environment is simulated, the anti-shaking performance of the welding element on the semiconductor wafer can be tested more effectively, the testing effect of the device is improved, the phenomenon that the semiconductor wafer with unstable welding appears on the market is effectively avoided, and the production quality of the semiconductor wafer is ensured.

Referring to fig. 3, an annular chute 101 is formed at the bottom of an inner cavity of the box body 1, a supporting rod 102 is annularly arranged in the annular chute 101, the supporting rod 102 is in sliding connection with the annular chute 101, and the upper end of the supporting rod 102 is fixedly connected with the bottom of the first rotating disc 3;

through the arrangement of the structure, the first rotating disc 3 can be well supported, and normal sliding of the first rotating disc is not hindered, so that the overall stability of the device during rotation is improved.

Referring to fig. 1 to 8, in the present invention, firstly, a semiconductor wafer is placed in a clamping seat 34, so that the bottom is attached to a first spring 35 and a suction cup 33, then a case cover 2 is closed, a driving motor is started, the first rotary disk 3 and the second rotary disk 32 are driven to synchronously rotate under the action of rotation of an output shaft of the driving motor, under the centrifugal force effect generated by the rotation, a counterweight ball 44 in a sealing groove 41 extrudes a piston plate 42, so that the piston plate slides to one side far away from the suction cup 33, and then gas in a cavity communicated with the sealing groove 41 and the fastening groove is compressed, and the compressed gas enters the fastening groove, so that a fastening plate 45 is pushed outwards, and a rubber pad 46 is tightly attached to the side wall of the semiconductor wafer; it should be noted that, because the centrifugal force is in the process of moving the weight ball 44, the air density at one side of the weight ball 44 close to the suction cup 33 is smaller, the pressure intensity is smaller, and according to the pressure intensity principle, the suction cup 33 can realize the adsorption effect on the semiconductor wafer due to the negative pressure; the horn part of the sucker 33 is covered with a soft rubber layer, so that the buffer effect of the semiconductor wafer is realized, a certain adsorption effect is generated in the adsorption process of the semiconductor wafer, when the piston plate 42 slides to the side far away from the sucker 33, the adsorption effect is generated in the cavity where the sealing groove 41 is communicated with the sucker 33, and the adsorption effect is transmitted into the sucker 33, so that the sucker 33 is tightly attached to the bottom of the semiconductor wafer;

the overheat or supercooling environment is simulated in the box 1 by utilizing the cooperation between the temperature controller and the temperature regulating pipe 51, and the flow speed of the gas in the box 1 is accelerated along with the rotation of the second turntable 32, and it is to be noted that the rotation of the second turntable 32 synchronously drives the clamping seat 34 to rotate, so that the gas disturbance effect on the upper part of the second turntable 32 is realized, the flow speed of the gas on the upper part of the second turntable 32 is accelerated, and the gas flow passes through the temperature regulating pipe 51 rapidly and uniformly, so that the temperature in the box 1 can be converted into an overheat or supercooling state more rapidly; in the rotation process of the second turntable 32, the clamping seat 34 is also contacted with the trigger block 54, and under the extrusion effect generated by rotation, the trigger block 54 is retracted towards the inside of the sealing box 52, so that the extruding plate 53 extrudes purified water in the sealing box 52, and as the sealing box 52 is communicated with the temperature regulating tube 51, the heated or cooled purified water in the temperature regulating tube 51 flows rapidly due to the extrusion effect, and therefore, the temperature regulating tube 51 can obtain better and faster heating or cooling effect;

and in the process of the rotation of the second turntable 32, the shaking block 62 arranged at the bottom of the shaking block contacts with the impact block 63, and the shaking of the spring telescopic rod 61 occurs due to the squeezing action generated by the rotation, so that the shaking of the second turntable 32 occurs and finally acts on the semiconductor wafer, and the shaking of the semiconductor wafer occurs along with the effect of the second turntable 32 in the overheat or supercooled environment, so that a more complex testing environment is simulated, the anti-shaking performance of the welding element on the semiconductor wafer can be more effectively tested, the testing effect of the device is improved, and the production quality of the semiconductor wafer is ensured.

The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.

Claims

1. A semiconductor test apparatus, comprising:

the novel multifunctional box comprises a box body (1), wherein a box cover (2) is hinged to the upper portion of the side wall of the box body (1), a driving motor is fixedly connected to the bottom of an inner cavity of the box body (1), a first rotary table (3) is fixedly connected to the side wall of a rotating shaft of the driving motor, a universal ball (31) is fixedly connected to the top end of the rotating shaft of the driving motor, a second rotary table (32) is movably connected to the top of the universal ball (31), a sucker (33) is fixedly connected to the middle of the upper surface of the second rotary table (32), a clamping seat (34) is annularly arranged at the edge of the upper surface of the second rotary table (32), and a first spring (35) is annularly arranged between the sucker (33) and the clamping seat (34);

the adsorption clamping assembly (4), the adsorption clamping assembly (4) is arranged in the second turntable (32), the extending end of the adsorption clamping assembly (4) is slidably connected with the inner cavity of the clamping seat (34), the suction end of the adsorption clamping assembly (4) is communicated with the inner cavity of the sucker (33), and the adsorption clamping assembly (4) is used for clamping and fixing the semiconductor material and can be tightened more and more in the rotation process;

the adsorption clamping assembly (4) comprises a sealing groove (41), the sealing groove (41) is annularly arranged in the inner cavity of the second rotary table (32), a piston plate (42) is slidably connected to the inner wall of the sealing groove (41), a second spring (43) is fixedly connected to the side, away from the sucker (33), of the side wall of the piston plate (42) and the sealing groove (41), a counterweight ball (44) is fixedly connected to the side, close to the sucker (33), of the side wall of the piston plate (42) and the sealing groove (41), and one side, close to the sucker (33), of the sealing groove (41) is communicated with the inner cavity of the sucker (33);

the inner cavity of the clamping seat (34) is provided with a fastening groove, the fastening groove is communicated with one side, far away from the sucker (33), of the sealing groove (41), the inner cavity of the fastening groove is connected with a fastening plate (45) in a sliding manner, and the outer side wall of the fastening plate (45) is fixedly connected with a rubber pad (46);

the height of the first spring (35) is the same as that of the sucker (33), the sucker (33) is made of a hard rubber material, the distance from the first spring (35) to the sucker (33) to the upper surface of the second turntable (32) is larger than the lowest surface of the clamping seat (34), and the lowest end of the rubber pad (46) is flush with the upper surface of the first spring (35);

the temperature adjusting component (5) is arranged on the inner side wall of the box cover (2), and the temperature adjusting component (5) is used for simulating different temperature environments in the box body (1);

the shaking assembly (6) is arranged between the first rotating disc (3) and the second rotating disc (32), and the shaking assembly (6) is used for shaking the second rotating disc (32) so as to simulate a shaking environment;

the shaking assembly (6) comprises a spring telescopic rod (61), the upper end and the lower end of the spring telescopic rod (61) are respectively and fixedly connected with a second rotary table (32) and a first rotary table (3), shaking blocks (62) are fixedly connected to the bottom of the second rotary table (32), impact blocks (63) are fixedly connected to two sides of the inner wall of the box body (1), and the impact blocks (63) can be in contact with the shaking blocks (62);

the distance from the lowest end of the shaking block (62) to the first rotating disc (3) is smaller than the distance from the uppermost end of the striking block (63) to the first rotating disc (3), and the contact surfaces of the striking block (63) and the shaking block (62) are all processed by arc-shaped fillets;

annular chute (101) have been seted up to box (1) inner chamber bottom, annular chute (101) inside annular is provided with bracing piece (102), and is sliding connection between bracing piece (102) and annular chute (101), bracing piece (102) upper end and first carousel (3) bottom fixed connection.

2. The semiconductor test apparatus according to claim 1, wherein the temperature adjusting assembly (5) comprises a temperature adjusting tube (51), the temperature adjusting tube (51) is fixedly connected with the middle part of the inner side wall of the case cover (2), the temperature adjusting tube (51) is communicated with each other in an end-to-end mode, the outer side wall of the case cover (2) is fixedly connected with a temperature adjuster, and the temperature adjuster is electrically connected with the temperature adjusting tube (51).

3. The semiconductor test device according to claim 2, wherein the upper portion of the inner side wall of the case cover (2) is fixedly connected with a sealing case (52), the inner wall of the sealing case (52) is slidably connected with an extrusion plate (53), one side of the extrusion plate (53) away from the case cover (2) is fixedly connected with a trigger block (54), the trigger block (54) penetrates through the outer side wall of the sealing case (52), the trigger block (54) is slidably connected with the sealing case (52), one side, close to the case cover (2), of the sealing case (52) is fixedly connected with a third spring (55), and the trigger block (54) can be in contact with the side wall of the clamping seat (34).

4. A semiconductor testing device according to claim 3, wherein the sealing box (52) is communicated with the temperature regulating tube (51) through a conduit, purified water is filled in the temperature regulating tube (51) and the sealing box (52), the contact surfaces of the trigger block (54) and the clamping seat (34) are processed by arc fillets, and the distance from the trigger block (54) to the upper surface of the second turntable (32) after the box cover (2) is closed is smaller than the height of the clamping seat (34).