CN115200818A - Semiconductor test equipment - Google Patents
Semiconductor test equipment Download PDFInfo
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- CN115200818A CN115200818A CN202210784847.8A CN202210784847A CN115200818A CN 115200818 A CN115200818 A CN 115200818A CN 202210784847 A CN202210784847 A CN 202210784847A CN 115200818 A CN115200818 A CN 115200818A
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- fixedly connected
- side wall
- box
- temperature adjusting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
- G01M7/027—Specimen mounting arrangements, e.g. table head adapters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses semiconductor test equipment, which relates to the field of semiconductor test and comprises a box body, wherein the upper part of the side wall of the box body is hinged with a box cover, the bottom of the inner cavity of the box body is fixedly connected with a driving motor, the side wall of a rotating shaft of the driving motor is fixedly connected with a first turntable, and the top end of the rotating shaft of the driving motor is fixedly connected with a universal ball; according to the invention, through the matching between the temperature controller and the temperature adjusting pipe, an overheating or supercooling environment is simulated in the box body, and the temperature in the box body can be more rapidly converted into an overheating or supercooling state along with the rotation of the second turntable, so that the testing efficiency of the device is improved; and then, the second turntable is shaken by utilizing the impact effect between the shaking block and the impact block, so that a more complicated test environment is simulated, the anti-seismic performance of the welding elements on the semiconductor wafer can be tested more effectively, and the production quality of the semiconductor wafer is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to semiconductor testing equipment.
Background
Semiconductors, as the name implies, are a class of objects that have electrical conductivity between a conductor and an insulator. The conductivity of the material is changed by doping impurities, which is the bottom base of semiconductor technology. By this extension, the characteristic can be used to manufacture various transistors with different current-voltage characteristics. Billions of transistors are integrated together to realize certain circuit functions, and then an integrated circuit is formed. Roughly, an integrated circuit is designed, fabricated, packaged, and tested to form a complete chip, which is usually a single unit ready for use. After the semiconductor is manufactured, all semiconductor chips need to be tested before shipment in order to achieve a yield of semiconductor chips.
At present, most of the existing semiconductor test equipment can only test in a normal-temperature environment and cannot adjust the temperature of the test environment, so that the semiconductor test has limitation and poor test effect; in addition, in the semiconductor test, the shock resistance of the self-welding element is also an important detection item, the existing semiconductor test equipment cannot simulate the shock resistance detection in different environments, and in the traditional shock resistance detection, the clamping stability of the semiconductor is poor, the semiconductor is easy to break away, so that the test process is influenced, and the semiconductor can be damaged.
Disclosure of Invention
The invention aims to solve the defects that a better shock resistance detection scene cannot be simulated in different environments and the clamping stability of a semiconductor is poorer in the prior art, and provides semiconductor testing equipment.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor test apparatus, comprising:
the box body, the upper part of the side wall of the box body is hinged with a box cover, the bottom of the inner cavity of the box body is fixedly connected with a driving motor, the side wall of the rotating shaft of the driving motor is fixedly connected with a first rotary table, the top end of the rotating shaft of the driving motor is fixedly connected with a universal ball, the top of the universal ball is movably connected with a second rotary table, the middle part of the upper surface of the second rotary table is fixedly connected with a sucker, the edge of the upper surface of the second rotary table is annularly provided with a clamping seat, and the upper surface of the second rotary table is annularly provided with a first spring between the sucker and the clamping seat;
the adsorption clamping assembly is arranged in the second turntable, the extension end of the adsorption clamping assembly is in sliding connection with the inner cavity of the clamping seat, the suction end of the adsorption clamping assembly is communicated with the inner cavity of the sucker, and the adsorption clamping assembly is used for clamping and fixing a semiconductor material and can be tightened in the rotating process;
the temperature adjusting component is arranged on the inner side wall of the box cover and is used for simulating different temperature environments inside the box body;
the shaking component is arranged between the first rotary table and the second rotary table and used for shaking the second rotary table, so that a shaking environment is simulated.
Preferably, adsorb centre gripping subassembly includes the seal groove, the seal groove ring shape is seted up at second carousel inner chamber, seal groove inner wall sliding connection has the piston board, one side fixedly connected with second spring that the sucking disc was kept away from to piston board lateral wall and seal groove, one side fixedly connected with counterweight ball that piston board lateral wall and seal groove are close to the sucking disc, and one side that the seal groove is close to the sucking disc communicates with the sucking disc inner chamber.
Preferably, fastening grooves are formed in the inner cavity of the clamping seat, one sides, away from the sucking disc, of the fastening grooves and the sealing groove are communicated, fastening plates are connected to the inner cavities of the fastening grooves in a sliding mode, and rubber pads are fixedly connected to the outer side walls of the fastening plates.
Preferably, the height of first spring and sucking disc is the same, and the sucking disc is but hard rubber material makes, the distance of first spring and sucking disc to second carousel upper surface is greater than the lowest surface of joint seat, and rubber pad least significant end and first spring upper surface looks parallel and level.
Preferably, the temperature adjusting component comprises a temperature adjusting pipe, the temperature adjusting pipe is fixedly connected with the middle part of the inner side wall of the box cover, the temperature adjusting pipe is communicated end to end, the outer side wall of the box cover is fixedly connected with a temperature controller, and the temperature controller is electrically connected with the temperature adjusting pipe.
Preferably, case lid inside wall upper portion fixedly connected with seal box, seal box inner wall sliding connection has the stripper plate, one side fixedly connected with that the case lid is kept away from to the stripper plate triggers the piece, and triggers the piece and run through the seal box lateral wall, and triggers and be sliding connection between piece and the seal box, trigger the piece and be close to one side fixedly connected with third spring of case lid with the seal box, and trigger the piece can contact with the joint seat lateral wall.
Preferably, be linked together through the pipe between seal box and the pipe that adjusts the temperature, and adjust the temperature the pipe and all fill with the pure water with seal box inside, trigger block and joint seat contact surface each other all adopt the arc fillet to handle, and the case lid is closed the back and trigger block is less than the joint seat height to the distance of second carousel upper surface.
Preferably, the shake subassembly includes the spring telescopic link, the upper and lower end of spring telescopic link respectively with second carousel and first carousel fixed connection, the piece is trembled to second carousel bottom fixedly connected with, the equal fixedly connected with striking piece in box inner wall both sides, and striking piece can contact with the shake piece.
Preferably, the distance from the lowermost end of the shaking block to the first rotating disc is smaller than the distance from the uppermost end of the impact block to the first rotating disc, and the contact surfaces of the impact block and the shaking block are processed by arc-shaped fillets.
Preferably, an annular sliding groove is formed in the bottom of the inner cavity of the box body, a supporting rod is annularly arranged in the annular sliding groove and is in sliding connection with the annular sliding groove, and the upper end of the supporting rod is fixedly connected with the bottom of the first rotary table.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the cooperation between the temperature controller and the temperature adjusting pipe, an overheat or supercool environment is simulated in the box body, and the temperature in the box body can be more rapidly converted into an overheat or supercool state along with the rotation of the second turntable, so that the testing efficiency of the device is improved; in the rotating process of the second turntable, the clamping seat and the trigger block are abutted and slid, so that the heated or cooled purified water in the temperature adjusting pipe flows rapidly, and the temperature adjusting pipe can obtain a better heating or cooling effect; and the second turntable is shaken by utilizing the impact effect between the shaking block and the impact block, so that a more complex test environment is simulated, the anti-seismic performance of the welding elements on the semiconductor wafer can be tested more effectively, and the production quality of the semiconductor wafer is ensured.
2. According to the invention, under the centrifugal force effect generated by rotation of the second turntable, the counterweight balls extrude the piston plate, so that gas in the sealing groove enters the fastening groove, and the fastening plate is pushed outwards, so that the rubber pad is tightly attached to the side wall of the semiconductor wafer, and the clamping and fixing effects of the device on the semiconductor wafer are further improved; and the other side of the sealing groove can generate adsorption action, and the adsorption action is transmitted into the sucker, so that the sucker is more tightly attached to the bottom of the semiconductor wafer, and the clamping and fixing effects of the device are further improved.
Drawings
Fig. 1 is a schematic front view of an overall structure of a semiconductor test apparatus according to the present invention;
FIG. 2 is a schematic side view of a semiconductor test apparatus according to the present invention;
FIG. 3 is a schematic diagram of an overall partially sectioned structure of a semiconductor test apparatus according to the present invention;
FIG. 4 is a schematic diagram of an internal structure of a box of a semiconductor test apparatus according to the present invention;
FIG. 5 is an enlarged schematic view of the area A in FIG. 4 of a semiconductor test apparatus according to the present invention;
FIG. 6 is an enlarged schematic view of a region B in FIG. 4 of a semiconductor test apparatus according to the present invention;
FIG. 7 is a schematic view of a partial cross-sectional structure of a case cover of a semiconductor test apparatus according to the present invention;
fig. 8 is an enlarged structural schematic diagram of a region C in fig. 7 of a semiconductor test apparatus according to the present invention.
In the figure: 1. a box body; 101. an annular chute; 102. a support bar; 2. a box cover; 3. a first turntable; 31. a universal ball; 32. a second turntable; 33. a suction cup; 34. a clamping seat; 35. a first spring; 4. adsorbing the clamping assembly; 41. a sealing groove; 42. a piston plate; 43. a second spring; 44. a counterweight ball; 45. a fastening plate; 46. a rubber pad; 5. a temperature regulating component; 51. a temperature regulating tube; 52. a sealing box; 53. a pressing plate; 54. a trigger block; 55. a third spring; 6. a dithering component; 61. a spring telescopic rod; 62. a dither block; 63. and (4) striking the block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 8, a semiconductor test apparatus includes:
the box body 1 is hinged with a box cover 2 on the upper portion of the side wall of the box body 1, a driving motor is fixedly connected to the bottom of an inner cavity of the box body 1, a first rotary disc 3 is fixedly connected to the side wall of a rotating shaft of the driving motor, a universal ball 31 is fixedly connected to the top end of the rotating shaft of the driving motor, a second rotary disc 32 is movably connected to the top of the universal ball 31, a sucking disc 33 is fixedly connected to the middle of the upper surface of the second rotary disc 32, a clamping seat 34 is annularly arranged at the edge of the upper surface of the second rotary disc 32, and a first spring 35 is annularly arranged on the upper surface of the second rotary disc 32 between the sucking disc 33 and the clamping seat 34;
the adsorption clamping assembly 4 is arranged in the second turntable 32, the extending end of the adsorption clamping assembly 4 is in sliding connection with the inner cavity of the clamping seat 34, the suction end of the adsorption clamping assembly 4 is communicated with the inner cavity of the sucker 33, and the adsorption clamping assembly 4 is used for clamping and fixing a semiconductor material and can be tightened more and more in the rotating process;
the temperature adjusting component 5 is arranged on the inner side wall of the box cover 2, and the temperature adjusting component 5 is used for simulating different temperature environments in the box body 1;
and the shaking assembly 6 is arranged between the first rotating disc 3 and the second rotating disc 32, and the shaking assembly 6 is used for shaking the second rotating disc 32 so as to simulate a vibration environment.
Referring to fig. 3 and 4, the suction clamping assembly 4 includes a sealing groove 41, the sealing groove 41 is annularly formed in the inner cavity of the second turntable 32, a piston plate 42 is slidably connected to the inner wall of the sealing groove 41, a second spring 43 is fixedly connected to the side wall of the piston plate 42 and the side of the sealing groove 41 far away from the suction cup 33, a counterweight ball 44 is fixedly connected to the side wall of the piston plate 42 and the side of the sealing groove 41 near the suction cup 33, and the side of the sealing groove 41 near the suction cup 33 is communicated with the inner cavity of the suction cup 33;
referring to fig. 5, a fastening groove is formed in an inner cavity of the clamping seat 34, the fastening groove is communicated with one side, away from the suction cup 33, of the sealing groove 41, a fastening plate 45 is connected to the inner cavity of the fastening groove in a sliding manner, and a rubber pad 46 is fixedly connected to the outer side wall of the fastening plate 45;
through the arrangement of the structure, firstly, the semiconductor wafer is placed in the clamping seat 34, so that the bottom of the semiconductor wafer is attached to the first spring 35 and the sucking disc 33, the box cover 2 is closed immediately, the driving motor is started, the first rotating disc 3 and the second rotating disc 32 are driven to synchronously rotate under the action of rotation of the output shaft of the driving motor, and under the centrifugal force effect generated by the rotation, the counter weight ball 44 in the sealing groove 41 extrudes the piston plate 42 to enable the piston plate to slide towards one side far away from the sucking disc 33, so that the gas in the cavity communicated with the fastening groove 41 in the sealing groove is compressed, and the compressed gas enters the fastening groove, and the fastening plate 45 is pushed outwards, so that the rubber pad 46 is tightly attached to the side wall of the semiconductor wafer, and the clamping and fixing effects of the device on the semiconductor wafer are improved; when the piston plate 42 slides to a side away from the suction cup 33, the inside of the cavity where the sealing groove 41 communicates with the suction cup 33 will generate a suction effect, and the suction effect is transmitted to the suction cup 33, so that the suction cup 33 and the bottom of the semiconductor wafer are more closely attached, thereby further improving the clamping and fixing effect of the device.
Referring to fig. 1 and 2, the first spring 35 and the suction cup 33 have the same height, the suction cup 33 is made of a hard rubber material, the distance between the first spring 35 and the suction cup 33 and the upper surface of the second turntable 32 is greater than the lowest surface of the clamping seat 34, and the lowest end of the rubber pad 46 is flush with the upper surface of the first spring 35;
through the arrangement of the structure, the semiconductor wafer, the first spring 35 and the suction disc 33 can be attached to each other, the rubber pad 46 and the side wall of the semiconductor wafer can be attached to each other, and the reasonability of the arrangement of the device is ensured.
Referring to fig. 7 and 8, the temperature adjusting assembly 5 includes a temperature adjusting pipe 51, the temperature adjusting pipe 51 is fixedly connected with the middle portion of the inner side wall of the case cover 2, the temperature adjusting pipe 51 is communicated end to end, the outer side wall of the case cover 2 is fixedly connected with a temperature controller, and the temperature controller is electrically connected with the temperature adjusting pipe 51;
referring to fig. 8, a sealing box 52 is fixedly connected to an upper portion of an inner side wall of the case cover 2, an extrusion plate 53 is slidably connected to an inner wall of the sealing box 52, a trigger block 54 is fixedly connected to a side of the extrusion plate 53 away from the case cover 2, the trigger block 54 penetrates through an outer side wall of the sealing box 52, the trigger block 54 is slidably connected to the sealing box 52, a third spring 55 is fixedly connected to one side of the trigger block 54 close to the case cover 2 and the sealing box 52, and the trigger block 54 can contact with a side wall of the clamping seat 34;
the sealing box 52 is communicated with the temperature adjusting pipe 51 through a guide pipe, purified water is filled in the temperature adjusting pipe 51 and the sealing box 52, the contact surfaces of the trigger block 54 and the clamping seat 34 are processed by arc-shaped fillets, and the distance from the trigger block 54 to the upper surface of the second turntable 32 is smaller than the height of the clamping seat 34 after the box cover 2 is closed;
through the arrangement of the structure, the temperature controller is matched with the temperature adjusting pipe 51, wherein the temperature controller adopts an approximate gram APC-TMS2000 series digital display temperature controller, the temperature adjusting pipe 51 is connected with a cold and hot compressor in the temperature controller, the cold and hot compressor adopts a small ZR125KC-TFD-522 compressor, and purified water in the temperature adjusting pipe 51 can be heated or refrigerated by the cold and hot compressor;
when the box cover 2 is closed, the temperature adjusting pipe 51 is heated or cooled, so that an overheating or supercooling environment is simulated inside the box body 1, different testing requirements of the semiconductor wafer are met, the testing effect of the device is improved, the flowing speed of gas inside the box body 1 is increased along with the rotation of the second turntable 32, and therefore the gas flow rapidly and uniformly penetrates through the temperature adjusting pipe 51, the temperature inside the box body 1 can be rapidly changed into an overheating or supercooling state, and the testing efficiency of the device is improved; in addition, in the rotating process of the second rotating disc 32, the clamping seat 34 is also in contact with the trigger block 54, and under the extrusion effect generated by rotation, the trigger block 54 retracts towards the inside of the sealing box 52, so that the extrusion plate 53 extrudes the purified water inside the sealing box 52, and the sealing box 52 is communicated with the temperature adjusting pipe 51, so that the heated or cooled purified water inside the temperature adjusting pipe 51 can rapidly flow due to the extrusion effect, the temperature adjusting pipe 51 can obtain a better and faster heating or cooling effect, the generation of an overheated or overcooled state of the device in the rotating process is further improved, and the testing efficiency and the testing effect of the device are further improved.
Referring to fig. 4, the shaking assembly 6 includes a spring telescopic rod 61, the upper and lower ends of the spring telescopic rod 61 are respectively fixedly connected with the second rotary table 32 and the first rotary table 3, the bottom of the second rotary table 32 is fixedly connected with a shaking block 62, both sides of the inner wall of the box body 1 are fixedly connected with striking blocks 63, and the striking blocks 63 can contact with the shaking block 62;
referring to fig. 4, the distance from the lowermost end of the shaking block 62 to the first rotating disk 3 is smaller than the distance from the uppermost end of the striking block 63 to the first rotating disk 3, and the contact surfaces of the striking block 63 and the shaking block 62 are processed by arc-shaped fillets;
through the setting of above-mentioned structure, at second carousel 32 pivoted in-process, the shaking piece 62 that its bottom set up will contact with striking piece 63, and through the extrusion that rotates the production, make spring telescopic link 61 take place the shake, thereby make second carousel 32 take place the shake, and finally act on the semiconductor disk, thereby in overheated or supercooled environment, along with second carousel 32 effect, make the semiconductor disk produce the shake, with this simulate out more complicated test environment, can test the anti-seismic performance of welding element on the semiconductor disk more effectively, thereby the test effect of the device has been improved, effectively avoid welding infirm semiconductor disk to appear on the market, the production quality of semiconductor disk has been ensured.
Referring to fig. 3, an annular chute 101 is formed in the bottom of the inner cavity of the box body 1, a support rod 102 is annularly arranged in the annular chute 101, the support rod 102 is slidably connected with the annular chute 101, and the upper end of the support rod 102 is fixedly connected with the bottom of the first rotary table 3;
through the arrangement of the structure, the first rotating disc 3 can be well supported, and the normal sliding of the first rotating disc is not hindered, so that the integral stability of the device during rotation is improved.
Referring to fig. 1-8, in the present invention, firstly, a semiconductor wafer is placed in a clamping seat 34, such that the bottom of the semiconductor wafer is attached to a first spring 35 and a suction cup 33, and then a box cover 2 is closed, a driving motor is started, and the first rotary disk 3 and the second rotary disk 32 are driven to synchronously rotate under the rotation of an output shaft of the driving motor, and under the centrifugal force effect generated by the rotation, a counterweight ball 44 in a sealing groove 41 extrudes a piston plate 42, such that the piston plate slides to one side far away from the suction cup 33, such that gas in a cavity communicating the sealing groove 41 and a fastening groove is compressed, and the compressed gas enters the fastening groove, such that a fastening plate 45 is pushed outwards, such that a rubber pad 46 is tightly attached to a sidewall of the semiconductor wafer; it should be noted that, during the moving process of the weight ball 44, the centrifugal force makes the air density on the side of the weight ball 44 close to the suction cup 33 smaller and the pressure intensity smaller, and according to the pressure intensity principle, the suction cup 33 can realize the adsorption effect on the semiconductor wafer due to the negative pressure; moreover, since the horn part of the suction cup 33 is covered with the soft rubber layer, the buffer effect on the semiconductor wafer is realized, a certain adsorption effect is generated in the adsorption process on the semiconductor wafer, and when the piston plate 42 slides to the side far away from the suction cup 33, the inside of the cavity of the seal groove 41 communicated with the suction cup 33 generates an adsorption effect and transmits the adsorption effect into the suction cup 33, so that the suction cup 33 is tightly attached to the bottom of the semiconductor wafer;
immediately, by utilizing the cooperation between the temperature controller and the temperature adjusting pipe 51, an overheating or supercooling environment is simulated inside the box body 1, and the flowing speed of the gas inside the box body 1 can be accelerated along with the rotation of the second rotating disc 32, it should be noted that the clamping seat 34 is driven to rotate synchronously by the rotation of the second rotating disc 32, so that the gas disturbance effect above the second rotating disc 32 is realized, the flowing speed of the gas above the second rotating disc 32 is accelerated, and the gas flow rapidly and uniformly passes through the temperature adjusting pipe 51, so that the temperature inside the box body 1 can be rapidly changed into an overheating or supercooling state; in the rotating process of the second rotating disk 32, the clamping seat 34 will also contact the trigger block 54, and under the extrusion effect generated by the rotation, the trigger block 54 retracts towards the inside of the sealed box 52, so that the extrusion plate 53 extrudes the purified water inside the sealed box 52, and because the sealed box 52 and the temperature adjusting pipe 51 are communicated with each other, the extrusion effect will enable the heated or cooled purified water inside the temperature adjusting pipe 51 to flow rapidly, so that the temperature adjusting pipe 51 can obtain a better and faster heating or cooling effect;
and in the pivoted in-process of second carousel 32, the shaking piece 62 that its bottom set up will contact with striking piece 63, and through the extrusion effect that the rotation produced, make spring telescopic link 61 take place the shake, thereby make second carousel 32 take place the shake, and finally act on the semiconductor wafer, thereby in the environment of overheated or subcooling, along with second carousel 32 effect, make the semiconductor wafer produce the shake, with this simulation out more complicated test environment, can test the anti-seismic performance of welding element on the semiconductor wafer more effectively, thereby the test effect of the device has been improved, the production quality of semiconductor wafer has been guaranteed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A semiconductor test apparatus, comprising:
the box body (1), a box cover (2) is hinged to the upper portion of the side wall of the box body (1), a driving motor is fixedly connected to the bottom of an inner cavity of the box body (1), a first rotary disc (3) is fixedly connected to the side wall of a rotating shaft of the driving motor, a universal ball (31) is fixedly connected to the top end of the rotating shaft of the driving motor, a second rotary disc (32) is movably connected to the top of the universal ball (31), a sucking disc (33) is fixedly connected to the middle of the upper surface of the second rotary disc (32), a clamping seat (34) is annularly arranged at the edge of the upper surface of the second rotary disc (32), and a first spring (35) is annularly arranged between the sucking disc (33) and the clamping seat (34) on the upper surface of the second rotary disc (32);
the adsorption clamping assembly (4) is installed inside the second rotary table (32), the extending end of the adsorption clamping assembly (4) is connected with the inner cavity of the clamping seat (34) in a sliding mode, the suction end of the adsorption clamping assembly (4) is communicated with the inner cavity of the sucker (33), and the adsorption clamping assembly (4) is used for being larger than a semiconductor material to clamp and fix and can be tightened more and more in the rotating process;
the temperature adjusting component (5) is arranged on the inner side wall of the box cover (2), and the temperature adjusting component (5) is used for simulating different temperature environments in the box body (1);
the shaking assembly (6), the shaking assembly (6) is installed between the first rotating disk (3) and the second rotating disk (32), and the shaking assembly (6) is used for shaking the second rotating disk (32), so that a shaking environment is simulated.
2. The semiconductor testing device according to claim 1, wherein the adsorption clamping assembly (4) comprises a sealing groove (41), the sealing groove (41) is annularly arranged in the inner cavity of the second turntable (32), a piston plate (42) is slidably connected to the inner wall of the sealing groove (41), a second spring (43) is fixedly connected to one side of the side wall of the piston plate (42) and one side of the sealing groove (41) far away from the suction cup (33), a counterweight ball (44) is fixedly connected to one side of the side wall of the piston plate (42) and one side of the sealing groove (41) close to the suction cup (33), and one side of the sealing groove (41) close to the suction cup (33) is communicated with the inner cavity of the suction cup (33).
3. The semiconductor testing device according to claim 2, wherein a fastening groove is formed in an inner cavity of the clamping seat (34), the fastening groove is communicated with one side, away from the suction cup (33), of the sealing groove (41), a fastening plate (45) is connected to the inner cavity of the fastening groove in a sliding manner, and a rubber pad (46) is fixedly connected to the outer side wall of the fastening plate (45).
4. The semiconductor testing apparatus according to claim 3, wherein the first spring (35) and the suction cup (33) have the same height, the suction cup (33) is made of a hard rubber material, the distance between the first spring (35) and the suction cup (33) to the upper surface of the second turntable (32) is greater than the lowest surface of the clamping seat (34), and the lowest end of the rubber pad (46) is flush with the upper surface of the first spring (35).
5. The semiconductor testing device according to claim 1, wherein the temperature adjusting assembly (5) comprises a temperature adjusting pipe (51), the temperature adjusting pipe (51) is fixedly connected with the middle portion of the inner side wall of the box cover (2), the temperature adjusting pipe (51) is communicated with the end portion of the inner side wall of the box cover, the outer side wall of the box cover (2) is fixedly connected with a temperature controller, and the temperature controller is electrically connected with the temperature adjusting pipe (51).
6. The semiconductor testing device according to claim 5, wherein a sealing box (52) is fixedly connected to the upper portion of the inner side wall of the box cover (2), a pressing plate (53) is slidably connected to the inner wall of the sealing box (52), a trigger block (54) is fixedly connected to one side, away from the box cover (2), of the pressing plate (53), the trigger block (54) penetrates through the outer side wall of the sealing box (52), the trigger block (54) and the sealing box (52) are slidably connected, a third spring (55) is fixedly connected to one sides, close to the box cover (2), of the trigger block (54) and the sealing box (52), and the trigger block (54) can be in contact with the side wall of the clamping seat (34).
7. The semiconductor testing equipment according to claim 6, wherein the sealing box (52) is communicated with the temperature adjusting tube (51) through a conduit, purified water is filled in the temperature adjusting tube (51) and the sealing box (52), the mutual contact surfaces of the trigger block (54) and the clamping seat (34) are processed by arc-shaped round corners, and the distance from the trigger block (54) to the upper surface of the second turntable (32) is smaller than the height of the clamping seat (34) after the box cover (2) is closed.
8. The semiconductor testing device according to claim 1, wherein the shaking assembly (6) comprises a spring telescopic rod (61), the upper end and the lower end of the spring telescopic rod (61) are fixedly connected with the second rotary table (32) and the first rotary table (3) respectively, the bottom of the second rotary table (32) is fixedly connected with a shaking block (62), both sides of the inner wall of the box body (1) are fixedly connected with striking blocks (63), and the striking blocks (63) can be in contact with the shaking block (62).
9. The semiconductor testing device according to claim 8, wherein the distance from the lowest end of the shaking block (62) to the first rotary table (3) is less than the distance from the highest end of the striking block (63) to the first rotary table (3), and the contact surfaces of the striking block (63) and the shaking block (62) are rounded in an arc shape.
10. The semiconductor testing device according to claim 1, wherein an annular chute (101) is formed in the bottom of an inner cavity of the box body (1), a support rod (102) is annularly arranged in the annular chute (101), the support rod (102) is slidably connected with the annular chute (101), and the upper end of the support rod (102) is fixedly connected with the bottom of the first turntable (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210784847.8A CN115200818B (en) | 2022-06-29 | 2022-06-29 | Semiconductor test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210784847.8A CN115200818B (en) | 2022-06-29 | 2022-06-29 | Semiconductor test equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115200818A true CN115200818A (en) | 2022-10-18 |
| CN115200818B CN115200818B (en) | 2023-06-20 |
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| CN202210784847.8A Active CN115200818B (en) | 2022-06-29 | 2022-06-29 | Semiconductor test equipment |
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| CN115200818B (en) | 2023-06-20 |
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