CN115195219A - 一种复合功能电子设备机壳及其制备方法 - Google Patents

一种复合功能电子设备机壳及其制备方法 Download PDF

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CN115195219A
CN115195219A CN202210856641.1A CN202210856641A CN115195219A CN 115195219 A CN115195219 A CN 115195219A CN 202210856641 A CN202210856641 A CN 202210856641A CN 115195219 A CN115195219 A CN 115195219A
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付学林
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Jiangxi Desien New Material Co ltd
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Abstract

本发明公开了一种复合功能电子设备机壳及其制备方法，其中所述复合功能电子设备机壳，包含本体；所述本体由多层基础材料层制成；所述本体上还设置有功能层；所述所述功能层具备散热或吸波或屏蔽或信号发射功能；所述的复合功能电子设备机壳的制备方法，先将选中的基础材料纤维制成基础材料纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的玻璃纤维预浸料之间对应手机的电池及无线充电位置夹一功能层：一张人工石墨散热片；再140~240摄氏度，3~30分钟热压成型；所述复合功能电子设备机壳结构简单，同时能增加复合功能；所述复合功能电子设备机壳的制备方法简单、可操作性强。

Description

一种复合功能电子设备机壳及其制备方法
技术领域
本发明涉及一种复合功能电子设备机壳的改进，特指一种结构简单，同时能增加复合功能的复合功能电子设备机壳及其制备方法。
背景技术
目前，随着4G/5G的普及，电子产品的功能越来越强大，如手机；随之，各种功能模块越来越多，如散热模块、吸波模块、屏蔽模块、天线等都需要在手机中分别设置安装，这就造成手机的结构越来越复杂。
现有的手机外壳通常采用铝制材料机加工，也有采用金属材料机加工或玻璃材料热成型或者塑料材料注塑等工艺而成；还有其他小众的陶瓷外壳等。现有的手机外壳的功能单一，只是用来放置手机上的零部件。
为此，我们研发了一种结构简单，同时能增加复合功能的复合功能电子设备机壳及其制备方法。
发明内容
本发明目的是为了克服现有技术的不足而提供一种结构简单，同时能增加复合功能的复合功能电子设备机壳及其制备方法。
为达到上述目的，本发明采用的技术方案是：一种复合功能电子设备机壳，包含本体；所述本体由多层基础材料层制成；所述本体上还设置有功能层；所述所述功能层具备散热或吸波或屏蔽或信号发射功能。
优选的，所述功能层设置在相邻所述基础材料层之间或本体的最内面上或本体的最外面上。
优选的，所述基础材料层至少由碳纤维、玻璃纤维、芳纶纤维中的一种制成。
优选的，所述功能层是片层结构。
优选的，所述复合功能电子产品外壳为复合功能手机外壳。
优选的，所述基础材料层厚度为0.1~5mm, 基础材料层有2~10层，每层厚度0.02~0.5mm。
优选的，所述基础材料层有6层，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层。
优选的，所述的复合功能电子设备机壳的制备方法，选用基础材料纤维制成基础材料纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再140~240度，3~30分钟热压成型。
优选的，所述的复合功能电子设备机壳的制备方法，所述功能层由人工石墨散热片制成，其对应需要散热的区域设置。
优选的，所述的复合功能电子设备机壳的制备方法，所述功能层具备散热、吸波、屏蔽、信号发射功能中的一种或多种功能。
由于上述技术方案的运用，本发明与现有技术相比具有下列优点：
本发明所述的复合功能电子设备机壳及其制备方法，其中，所述复合功能电子设备机壳上设置有功能层；所述功能层设置在相邻所述基础材料层之间或本体的最内面上或本体的最外面上；所述功能层由散热片或吸波材料或屏蔽材料或天线制成；所述复合功能电子设备机壳结构简单，同时能增加复合功能；所述复合功能电子设备机壳的制备方法简单、可操作性强。
附图说明
下面结合附图对本发明技术方案作进一步说明：
附图1为本发明所述的复合功能电子设备机壳的主视图的局部剖视图；
附图2为本发明所述的复合功能电子设备机壳的左视图的剖视图；
其中：1、本体；2、功能层；3、基础材料层。
具体实施方式
下面结合附图及具体实施例对本发明作进一步的详细说明。
实施例一
复合散热功能手机壳
附图1-2为本发明所述的复合功能电子设备机壳是一复合功能手机壳，包含本体1；所述本体1由多层基础材料层制成；其中，设定的相邻所述基础材料层之间还设置有功能层；所述功能层由散热片制成。
所述基础材料为玻璃纤维；生产时，按照设计的厚度、外观要求及功能要求，选择基础材料，再将选择的基础材料制成预浸料，再并进行铺层到模具，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再根据树脂的固化及塑性温度进行热压或真空热压或压力罐热压；所述功能层由人工石墨散热片制成，成片状，再进行压合成型，使功能性材料嵌到设定的相邻基础材料层中间。
下面以复合散热功能的玻璃纤维手机壳的制备方法为例进行详细说明：
如附图1-2所示，本体1的厚度为0.56mm, 基础材料层3有6层，每层厚度0.08mm；选用玻璃纤维为基础材料，先将玻璃纤维制成玻璃纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层之间的玻璃纤维预浸料之间对应手机的电池及无线充电位置夹一功能层2：一张人工石墨散热片；再150~170摄氏度，3~5分钟热压成型。
这种复合散热功能的玻璃纤维手机壳在无线充电时散热性能好。
实施例二
复合屏蔽功能机壳
附图1-2为本发明所述的复合功能电子设备机壳是一复合屏蔽功能机壳，包含本体1；所述本体1由多层基础材料层制成；其中，设定的相邻所述基础材料层之间还设置有功能层；所述功能层由屏蔽材料制成。
所述基础材料为碳纤维；生产时，按照设计的厚度、外观要求及功能要求，选择基础材料，再将选择的基础材料制成预浸料，再并进行铺层到模具，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再根据树脂的固化及塑性温度进行热压或真空热压或压力罐热压；所述功能层由屏蔽材料制成，成片状，再进行压合成型，使功能性材料嵌到设定的相邻基础材料层中间。
下面以复合屏蔽功能碳纤维机壳的制备方法为例进行详细说明：
本体的厚度为0.56mm,基础材料层3有6层，每层厚度0.08mm；选用碳纤维为基础材料，先将碳纤维制成碳纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层的碳纤维预浸料之间对应位置设置一功能层：一张多孔铝薄膜；再150~200摄氏度，3~25分钟热压成型。
这种复合屏蔽功能碳纤维机壳具有很好的屏蔽功能。
实施例三
复合信号发射功能手机壳
附图1-2为本发明所述的复合功能电子设备机壳是一复合信号发射功能手机壳，包含本体1；所述本体1由多层基础材料层制成；其中，设定的相邻所述基础材料层之间还设置有功能层；所述功能层由手机天线制成。
所述基础材料为芳纶纤维；生产时，按照设计的厚度、外观要求及功能要求，选择基础材料，再将选择的基础材料制成预浸料，再并进行铺层到模具，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再根据树脂的固化及塑性温度进行热压或真空热压或压力罐热压；所述功能层为手机天线，再进行压合成型，使功能性材料嵌到设定的相邻基础材料层中间。
下面以复合信号发射功能手机壳的制备方法为例进行详细说明：
如附图1-2所示，本体1的厚度为0.56mm, 基础材料层3有6层，每层厚度0.08mm；选用芳纶纤维为基础材料，先将芳纶纤维成芳纶纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层之间的芳纶纤维预浸料之间对应手机天线位置夹一功能层2：一张片层金属天线；再140~170摄氏度，10~30分钟热压成型。
这种复合信号发射功能手机壳在信号发射性能好。
实施例四
复合屏蔽功能便携电脑机壳
本发明所述的复合功能电子设备机壳是一复合屏蔽功能便携电脑机壳，包含本体；所述本体由多层基础材料层制成；其中，设定的相邻所述基础材料层之间还设置有功能层；所述功能层由屏蔽材料制成。
所述基础材料为碳纤维；生产时，按照设计的厚度、外观要求及功能要求，选择基础材料，再将选择的基础材料制成预浸料，再并进行铺层到模具，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再根据树脂的固化及塑性温度进行热压或真空热压或压力罐热压；所述功能层由屏蔽材料制成，成片状，再进行压合成型，使功能性材料嵌到设定的相邻基础材料层中间。
下面以复合屏蔽功能碳纤维机壳的制备方法为例进行详细说明：
本体的厚度为0.56mm,基础材料层有6层，每层厚度0.08mm；选用碳纤维为基础材料，先将碳纤维制成碳纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层的碳纤维预浸料之间对应位置设置一功能层：一张多孔铝薄膜；再150~200摄氏度，3~25分钟热压成型。
这种复合屏蔽功能碳纤维机壳用来屏蔽电子信号的工具，作用就是屏蔽外界电磁波对内部电路的影响和内部产生的电磁波向外辐射；采用碳纤维和金属复合的外壳具有很好的屏蔽功能，可以取代原有设备需要的内部主板屏蔽罩。
本实施例中，所述功能层位置设置在第1层及第2层基础材料层之间；当然，根据需求所述功能层也可以贴在本体的最内面或最外面上。
由于上述技术方案的运用，本发明与现有技术相比具有下列优点：
本发明所述的复合功能电子设备机壳及其制备方法，其中，所述复合功能电子设备机壳上设置有功能层；所述功能层设置在相邻所述基础材料层之间或本体的最内面上或本体的最外面上；所述功能层由散热片或吸波材料或屏蔽材料或天线制成；所述复合功能电子设备机壳结构简单，同时能增加复合功能；所述复合功能电子设备机壳的制备方法简单、可操作性强。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并加以实施，并不能以此限制本发明的保护范围，凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围内。

Claims (10)

1.一种复合功能电子设备机壳，包含本体；其特征在于：所述本体由多层基础材料层制成；所述本体上还设置有功能层；所述所述功能层具备散热或吸波或屏蔽或信号发射功能。
2.根据权利要求1所述的复合功能电子设备机壳，其特征在于：所述功能层设置在相邻所述基础材料层之间或本体的最内面上或本体的最外面上。
3.根据权利要求1所述的复合功能电子设备机壳，其特征在于：所述基础材料层至少由碳纤维、玻璃纤维、芳纶纤维中的一种制成。
4.根据权利要求1所述的复合功能电子设备机壳，其特征在于：所述功能层是片层结构。
5.根据权利要求1所述的复合功能电子设备机壳，其特征在于：所述复合功能电子产品外壳为复合功能手机外壳。
6.根据权利要求1所述的复合功能电子设备机壳，其特征在于：所述基础材料层厚度为0.1~5mm, 基础材料层有2~10层，每层厚度0.02~0.5mm。
7.根据权利要求5所述的复合功能电子设备机壳，其特征在于：所述基础材料层有6层，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层。
8.根据权利要求1所述的复合功能电子设备机壳的制备方法，其特征在于：选用基础材料纤维制成基础材料纤维预浸料，再一层层铺层到模具中，依据模具中铺层的顺序，在第1层及第2层基础材料层之间的对应功能位置设置一功能层；再140~240度，3~30分钟热压成型。
9.根据权利要求1所述的复合功能电子设备机壳的制备方法，其特征在于：所述功能层由人工石墨散热片制成，其对应需要散热的区域设置。
10.根据权利要求1所述的复合功能电子设备机壳的制备方法，其特征在于：所述功能层具备散热、吸波、屏蔽、信号发射功能中的一种或多种功能。
CN202210856641.1A 2022-07-11 2022-07-20 一种复合功能电子设备机壳及其制备方法 Pending CN115195219A (zh)

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