CN115193763B

CN115193763B - High-low voltage test sorting machine for semiconductor components

Info

Publication number: CN115193763B
Application number: CN202211135289.9A
Authority: CN
Inventors: 单忠频; 陈伟明; 康茂; 缪来虎; 周圣军; 丁鑫锐; 陈树钊; 薛克瑞; 郭琼生; 黄仁发
Original assignee: Guangdong Gede Intelligent Equipment Co ltd
Current assignee: Guangdong Gede Intelligent Equipment Co ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2022-12-13
Anticipated expiration: 2042-09-19
Also published as: CN115193763A

Abstract

The invention relates to the technical field of component performance testing, and discloses a high-low pressure testing separator for semiconductor components, which comprises a feeding mechanism, a high-pressure testing mechanism, a sorting mechanism, a high-pressure unqualified recovery mechanism, a feeding mechanism, a main turntable conveying mechanism, an auxiliary turntable conveying mechanism, a low-pressure testing station, a marking device, a classified collection mechanism and a blanking mechanism, wherein the conveying, high-pressure testing and classifying, low-pressure testing and classified blanking and laser marking of semiconductor components are automatically completed in one station, and the testing productivity is improved. In addition, by arranging one low-voltage test station on the auxiliary disc conveying mechanism, all low-voltage test items can be completed at one time under the condition that the semiconductor element is clamped once by utilizing the advantage of long standing time of the auxiliary disc conveying mechanism, so that the arrangement quantity of low-voltage testers is reduced; the problem of yield reduction caused by multiple times of clamping of the pins of the semiconductor element can be avoided.

Description

High-low voltage test separator for semiconductor components

Technical Field

The invention relates to the technical field of component performance testing, in particular to a high-low voltage testing separator for semiconductor components.

Background

After the semiconductor element is manufactured, the performance of the semiconductor element needs to be tested and sorted, such as high-voltage testing and low-voltage testing, and then material distribution is carried out according to the test result; the existing high-voltage test equipment and low-voltage test equipment are independent from each other, for example, after a semiconductor element is tested by the high-voltage test equipment, the semiconductor element qualified by the high-voltage test needs to be manually transferred to the low-voltage test equipment and the low-voltage test equipment needs to be loaded, so that the continuous test of high-voltage and low-voltage projects cannot be realized, and the test productivity is difficult to further improve.

In addition, in the existing low-voltage testing equipment, multi-station transfer of semiconductor elements is mainly performed through a main turntable mechanism, and the conventional method is that a performance testing station is arranged on the periphery of the main turntable, and a driving motor drives a cam divider to move, so that the semiconductor elements on the main turntable mechanism can sequentially ascend, rotate in an indexing manner, descend and do static circular motion; because the performance test of the semiconductor element can only be carried out when the main turntable is at a static angle, but the angle division, the lifting and the static of the cam divider are designed according to a certain angle position, the indexing static time of the main turntable is fixed and the time length is short, and when the test time of the complete performance test item of the semiconductor element is longer than the indexing static time of the main turntable, the complete performance test item of the semiconductor element needs to be divided into a plurality of test items for carrying out. If the rest angle of the main turntable is 100 °, and each degree time is 1ms, the index rest time is 100ms, and the complete performance test time of the semiconductor device is 200ms, two test items each having a time of 100ms need to be split, but in practice, many test items are difficult to split equally. If according to the above test scheme, under the condition that the main turntable adopts single-suction-nozzle material transportation, the main turntable needs to be provided with 2 test stations, each test station needs to be provided with one tester, 2 testers are needed totally, the semiconductor element can be tested by clamping the contact probes for 2 times, and the increase of the contact clamping times can cause the deformation of pins of the semiconductor element and the increase of the test reject ratio. Similarly, if the main turntable adopts the dual-suction-nozzle material transportation according to the test scheme, 4 test stations need to be arranged on the main turntable, each test station needs to be provided with one tester, and 4 testers are needed in total.

In actual procurement and production, the equipment cost of the tester is very expensive, and if the configuration number of the tester cannot be reduced, the production cost and the selling price of the whole test equipment can be greatly increased, which is not beneficial to improving the market competitiveness of the equipment.

It is seen that improvements and enhancements to the prior art are needed.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a high-low voltage tester for semiconductor devices, which has a high-voltage testing function and a low-voltage testing function, and reduces the number of times of clamping and testing semiconductor devices and the number of testers.

In order to achieve the purpose, the invention adopts the following technical scheme:

a semiconductor element high-low pressure testing machine comprises a feeding mechanism, a high-pressure testing mechanism, a sorting mechanism, a feeding mechanism and a main turntable conveying mechanism which are sequentially connected, wherein the main turntable conveying mechanism is arranged on a workbench, an auxiliary turntable conveying mechanism, a classifying and collecting mechanism and a discharging mechanism are sequentially arranged on the periphery of the main turntable conveying mechanism in a surrounding manner, and a low-pressure testing station and a marking device are sequentially arranged on the periphery of the auxiliary turntable conveying mechanism in a surrounding manner; the indexing rest time of the auxiliary disc material conveying mechanism is longer than that of the main rotary disc material conveying mechanism; the sorting mechanism is used for transmitting the semiconductor elements which are qualified in the high-voltage test to the feeding mechanism and transmitting the semiconductor elements which are unqualified in the high-voltage test to the unqualified high-voltage recovery mechanism; the feeding mechanism is used for providing qualified semiconductor elements for the high-voltage test for the main turntable conveying mechanism; the main turntable conveying mechanism is used for picking up, putting down and carrying the semiconductor elements in an indexing way, the auxiliary turntable conveying mechanism is used for carrying the semiconductor elements in an indexing way, and a handover station is formed at the handover position of the main turntable conveying mechanism and the auxiliary turntable conveying mechanism; the low-voltage testing station is used for clamping the semiconductor element and carrying out low-voltage testing on the semiconductor element; the marking device is used for carrying out laser marking on the semiconductor element; the classified collection mechanism is used for classifying and collecting the semiconductor elements which do not reach the optimal performance parameters; the blanking mechanism is used for classifying and collecting the semiconductor elements with the optimal performance parameters.

Has the beneficial effects that:

compared with the prior art, the high-low voltage testing separator for the semiconductor components has a high-voltage testing function and a low-voltage testing function, and the feeding mechanism, the high-voltage testing mechanism, the sorting mechanism, the high-voltage unqualified recycling mechanism, the feeding mechanism, the main turntable conveying mechanism, the auxiliary turntable conveying mechanism, the low-voltage testing station, the marking device, the classified collecting mechanism and the blanking mechanism are connected, so that the conveying, the high-voltage testing and classifying, the low-voltage testing and classified blanking and the laser marking of the semiconductor components are automatically completed in one station, and the testing productivity is improved; the problem of high pressure test equipment and low pressure test equipment need artifical the material of plugging into midway because of independent setting is solved, degree of automation has further been improved. In addition, compared with the mode that a plurality of low-voltage test stations are arranged on the main turntable conveying mechanism respectively, only one low-voltage test station needs to be arranged on the auxiliary turntable conveying mechanism, all low-voltage test items can be completed at one time under the condition that the auxiliary turntable conveying mechanism is long in static time without disassembling the test items by utilizing the advantage that the auxiliary turntable conveying mechanism is long in static time, the number of the test instruments arranged in the low-voltage test stations can be reduced by half, and the equipment cost is greatly reduced; the problem of yield reduction caused by multiple times of clamping of the pins of the semiconductor element can be avoided.

Drawings

Fig. 1 is a first perspective view of a high-low voltage test handler for semiconductor devices.

Fig. 2 is a second perspective view of the semiconductor device high-low voltage test handler.

Fig. 3 is a third perspective view of the semiconductor component high-low voltage test handler.

Fig. 4 is a partially enlarged view of the region L1 in fig. 1.

Fig. 5 is a connection diagram of the feeding mechanism, the high-pressure testing mechanism and the sorting mechanism.

Fig. 6 is a partial structural schematic diagram of the high-voltage testing mechanism.

Fig. 7 is a schematic view of the assembly of the test transport track and the test blocking mechanism.

Fig. 8 is a perspective view of the sorting mechanism.

Fig. 9 is a schematic structural view of a second conveying air path on the sorting conveying track.

Fig. 10 is a schematic diagram of the connection between the sorting mechanism and the feeding mechanism.

Fig. 11 is an exploded view of the feeding mechanism.

Fig. 12 is a perspective view of the feeding mechanism.

Fig. 13 is a perspective view of the main turntable carrying mechanism.

Fig. 14 is a partially enlarged view of the region L2 in fig. 13.

Fig. 15 is a first schematic view of the connection between the main turntable material conveying mechanism and the auxiliary turntable material conveying mechanism.

Fig. 16 is a second schematic diagram of the connection between the main turntable carrying mechanism and the auxiliary turntable carrying mechanism.

Figure 17 is a perspective view of the holder.

Fig. 18 is a schematic view of the structure of the pinch grips.

Fig. 19 is a perspective view of a fixed frequency pulling rod mechanism.

Fig. 20 is a schematic structural view of the double grasping mechanism.

Fig. 21 is a schematic structural view of the strut assembly.

FIG. 22 is a diagram showing the states of the pulse signals in the operation of each mechanism.

Fig. 23 is a perspective view of the pull rod limiting mechanism.

Fig. 24 is a perspective view of the sorting and collecting mechanism.

FIG. 25 is a schematic view of a movable tube assembly of the sorting and collecting mechanism connected to a feeding track.

Fig. 26 is a perspective view of the elevating mechanism in the sorting and collecting mechanism.

Fig. 27 is a perspective view of the sorting carriage.

Detailed Description

The invention provides a high-low voltage test separator for semiconductor components, which is further described in detail below by referring to the attached drawings and embodiments in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of the invention.

Referring to fig. 1 to 4, the invention provides a high-low pressure testing machine for semiconductor elements, which comprises a feeding mechanism a, a high-pressure testing mechanism b, a sorting mechanism c, a feeding mechanism d and a main turntable conveying mechanism e which are connected in sequence, wherein the main turntable conveying mechanism e is arranged on a workbench p, an auxiliary turntable conveying mechanism f, a classified collecting mechanism h and a blanking mechanism j are sequentially arranged on the periphery of the main turntable conveying mechanism e in a surrounding manner, and a low-pressure testing station g and a marking device m are sequentially arranged on the periphery of the auxiliary turntable conveying mechanism f in a surrounding manner; the indexing rest time of the auxiliary disc conveying mechanism f is longer than that of the main rotary disc conveying mechanism e; the feeding mechanism a is used for providing a semiconductor element k for the high-voltage testing mechanism b, the high-voltage testing mechanism b is used for testing the high-voltage performance of the semiconductor element k, and the sorting mechanism c is used for transmitting the semiconductor element k which is qualified in the high-voltage test to the feeding mechanism d and transmitting the semiconductor element k which is unqualified in the high-voltage test to the high-voltage unqualified recovery mechanism c35; the feeding mechanism d is used for providing qualified semiconductor elements k for high-voltage testing for the main turntable conveying mechanism e; the main turntable conveying mechanism e is used for picking up, putting down and carrying the semiconductor elements k in an indexing manner, the auxiliary turntable conveying mechanism f is used for carrying the semiconductor elements k in an indexing manner, and a handover station e13 is formed at the handover position of the main turntable conveying mechanism e and the auxiliary turntable conveying mechanism f; the low-voltage testing station g is used for clamping the semiconductor element k and carrying out low-voltage testing on the semiconductor element k; the marking device m is used for carrying out laser marking on the semiconductor element k; the classified collection mechanism h is used for classifying and collecting the semiconductor elements k which do not reach the optimal performance parameters; the blanking mechanism j is used for classifying and collecting the semiconductor elements k with the optimal performance parameters.

The test procedure is briefly described below: the feeding mechanism a conveys the semiconductor elements k to the high-voltage testing mechanism b, the semiconductor elements k slide into the high-voltage testing mechanism b under the action of gravity, a plurality of semiconductor elements k are arranged to form a semiconductor element group and simultaneously carry out high-voltage testing, the high-voltage testing efficiency is high, the high-voltage testing mechanism b feeds back the high-voltage testing result of the semiconductor elements k to the control system, then the sorting mechanism c sorts and conveys the semiconductor element group according to the high-voltage testing result, and if all the semiconductor elements k in the semiconductor element group are tested to be qualified, the semiconductor element group is sorted and conveyed to the feeding mechanism d; if any one of the semiconductor elements k in the semiconductor element group is unqualified in test, the semiconductor element group is sorted and conveyed to a high-voltage unqualified recovery mechanism c35; then the feeding mechanism d carries out linear feeding on the main rotary disc conveying mechanism e, then the main rotary disc conveying mechanism e grabs the semiconductor element k on the feeding mechanism d, the main rotary disc conveying mechanism e conveys the semiconductor element k to a handing-over station e13, the auxiliary disc conveying mechanism f is in a static state at the moment, the main rotary disc conveying mechanism e transfers the semiconductor element k to be subjected to low-pressure testing to the auxiliary disc conveying mechanism f in a downward mode, then the auxiliary disc conveying mechanism f rotates in an indexing mode, the semiconductor element k to be tested leaves the handing-over station e13 and moves towards the low-pressure testing station g, meanwhile, the semiconductor element k subjected to low-pressure testing enters the handing-over station e13, and the main rotary disc conveying mechanism e grabs the semiconductor element k subjected to low-pressure testing; the low-voltage testing station g is used for clamping and low-voltage testing on the semiconductor element k to be tested, and testing all performance items under the condition of one-time clamping; finally, the low-voltage test station g feeds back a low-voltage test result of the semiconductor element k to the control system, the classifying and collecting mechanism h and the blanking mechanism j recover the semiconductor element k according to the low-voltage test result, if the low-voltage test result of the semiconductor element k does not reach the optimal performance parameter, the main turntable material conveying mechanism e conveys the semiconductor element k to the classifying and collecting mechanism h, and the classifying and collecting mechanism h performs classifying and recovering according to the performance parameter of the semiconductor element k; if the low-pressure test result of the semiconductor element k reaches the optimal performance parameter, the main turntable conveying mechanism e conveys the semiconductor element k to the blanking mechanism j for recycling and blanking. It is to be understood that the semiconductor elements k which do not reach the optimum performance parameters include low-voltage test rejects and rejects of various performance parameter grades.

Compared with the prior art, the semiconductor element high-low pressure testing machine provided by the invention has a high-pressure testing function and a low-pressure testing function, and the conveying, high-pressure testing and classifying, low-pressure testing and classifying blanking and laser marking of a semiconductor element k are automatically completed in one station mode by connecting the feeding mechanism a, the high-pressure testing mechanism b, the sorting mechanism c, the high-pressure unqualified recovery mechanism c35, the feeding mechanism d, the main turntable conveying mechanism e, the auxiliary turntable conveying mechanism f, the low-pressure testing station g, the marking device m, the classifying and collecting mechanism h and the blanking mechanism j, so that the testing productivity is improved; the problem of high pressure test equipment and low pressure test equipment because of independent setting, need artifical material transporting of plugging into midway is solved, degree of automation has further been improved. In addition, compared with the method that a plurality of low-voltage test stations g are respectively arranged on the main turntable conveying mechanism e, only one low-voltage test station g is arranged on the auxiliary turntable conveying mechanism f, and all low-voltage test items can be completed at one time under the condition that the semiconductor element k is clamped once by utilizing the advantage of long static time of the auxiliary turntable conveying mechanism f without disassembling the test items, so that the number of the test instruments arranged in the low-voltage test stations g can be reduced by half, and the equipment cost is greatly reduced; the problem of yield reduction caused by repeated clamping of the pins of the semiconductor element can be avoided.

Specifically, referring to fig. 5-7, the high-voltage testing mechanism b includes a high-voltage tester (not visible in the figure), a blanking conveying track b1 arranged in a downward inclination manner, a bottom plate b20, a testing conveying track b21 arranged on the bottom plate b20 and engaged with the blanking conveying track b1, a high-voltage testing area b25 arranged on the testing conveying track b21, a high-voltage clamping assembly b3, a sliding assisting mechanism b4 and a testing blocking mechanism b5 arranged in the high-voltage testing area b25, a blanking intercepting mechanism b6 is arranged between the blanking conveying track b1 and the testing conveying track b21, the high-voltage clamping assembly b3 includes a high-voltage module b31 and a high-voltage testing driving mechanism b32 located at two sides of the testing conveying track b21, the sliding assisting mechanism b4 is used for driving the semiconductor elements k on the testing conveying track b21 and the blanking conveying track b1 to be conveyed downstream, and the testing blocking mechanism b5 is used for limiting the semiconductor elements k of the testing conveying track b21 in the high-voltage testing area b25 or conveying the discharged semiconductor elements k in a downstream direction; the high-voltage power connection module b31 is electrically connected with the high-voltage tester, and the high-voltage test driving mechanism b32 is used for driving the two high-voltage power connection modules b31 to respectively move or reset towards one side of the semiconductor element k, so that a plurality of power connection terminals on the high-voltage power connection modules b31 are respectively butted with each semiconductor element pin one by one, and then the high-voltage power connection test is carried out on the semiconductor element k.

Compared with the prior art that the semiconductor elements k are conveyed to high-voltage testing equipment one by adopting vacuum chuck conveying, the high-voltage testing mechanism b is obliquely arranged, so long as the feeding is carried out at the upstream of the blanking conveying track b1, the semiconductor elements k can be guided by the blanking conveying track b1 and the testing conveying track b21 and conveyed downwards under the action of self weight and the sliding assisting mechanism b4, so that a plurality of semiconductor elements k can be arranged close to each other to form a semiconductor element group, and the high-voltage testing equipment is efficient and energy-saving; then the high voltage test driving mechanism b32 drives the two high voltage connection modules b31 to butt joint pins of the semiconductor element group, and the high voltage tester carries out high voltage test on all the semiconductor elements k in the semiconductor element group, so that the number of the semiconductor elements k in a single high voltage test is increased. In addition, the high-pressure testing mechanism provided by the invention also solves the technical problems that in the prior art, the semiconductor element k is sucked by a suction cup under negative pressure, and the negative pressure gas source needs to be shut down in order to avoid the danger of high-pressure electric sparks in the high-pressure testing process.

It should be noted that the feeding mechanism a mainly plays a role of automatically transferring the semiconductor element k to the blanking conveying rail b1, and the feeding mechanism is not a main invention point of the present application, and the feeding mechanism can be implemented by various feeding methods in the related art. Of course, manual feeding may also be used. Before the semiconductor elements k are classified and recycled, appearance detection needs to be carried out on the semiconductor elements k, so that visual detection equipment y is arranged between the classification collection mechanism h and the auxiliary disc material conveying mechanism f, and the visual detection equipment y can be specifically selected from 3D5S type equipment provided by Haike Yibang company.

The feeding mechanism a, the high-voltage testing mechanism b, the sorting mechanism c, the high-voltage unqualified recycling mechanism c35, the feeding mechanism d, the main turntable conveying mechanism e, the auxiliary turntable conveying mechanism f, the low-voltage testing station g, the marking device m, the classifying and collecting mechanism h and the blanking mechanism j are controlled to work through a control system, and the control system comprises a PLC and a related control circuit.

Furthermore, the high-voltage testing driving mechanism b32 is provided with one corresponding to each high-voltage power connection module b31, the high-voltage testing driving mechanism b32 comprises a testing driving push rod b321 and a high-voltage slide rail assembly b322, the testing driving push rod b321 is preferably an electric push rod or a pneumatic push rod, and the like, the high-voltage power connection module b31 can be slidably arranged on the bottom plate b20 through the high-voltage slide rail assembly b322, the testing driving push rod b321 is in transmission connection with the high-voltage power connection module b31, and the high-voltage power connection module b31 is driven by the testing driving push rod b321 to approach one side of the testing conveying track b21 and perform high-voltage testing or relative resetting; through the arrangement, the high-voltage test driving mechanism b32 is simple in structure, and drives the high-voltage power connection module b31 to move stably and smoothly.

In this embodiment, each high voltage test area b25 can test ten semiconductor devices k at a time, and the number of the high voltage connection modules b31 of the high voltage clamping assembly b3 is correspondingly set to be ten. During testing, ten semiconductor elements k are subjected to high-voltage testing simultaneously, and compared with the prior art, the testing effect and the testing stability are greatly improved.

Further, in this embodiment, there are two high-pressure test areas b25, and there are two high-pressure clamping assemblies b3 continuously arranged along the length direction of the tested conveying track b 21; correspondingly, two groups of test blocking mechanisms b5 are arranged, and through the arrangement, the high-voltage clamping assemblies b3 in the two high-voltage test areas b25 simultaneously clamp and test the semiconductor element group, so that the high-voltage test working efficiency of the semiconductor element k is effectively improved. And two high pressure clamping subassembly b3 share a high pressure test appearance, reduce equipment manufacturing cost.

In one implementation, two sides of the test conveying track b21 are respectively provided with a power connection avoiding port b27, and two side pins of the semiconductor element k in the test conveying track b21 are respectively communicated with the outside through the corresponding power connection avoiding ports b 27; through setting up like this, be convenient for both sides high voltage electricity module b31 carries out high-voltage test through connecing respectively and dodge mouthful b 27.

In one embodiment, a test conveying channel b211 is arranged in the test conveying track b21, the sliding-assistant mechanism b4 includes a plurality of falling-assistant air paths b41 which are arranged in the test conveying track b21 and are obliquely arranged along the downstream conveying direction and communicated with the test conveying channel b211, the plurality of falling-assistant air paths b41 are respectively communicated with the air flow generating device, and the air flow generating device generates air flow which enters the test conveying channel b211 through the falling-assistant air paths b41, so that the semiconductor element k is conveyed in the downstream direction; with this arrangement, the semiconductor element k is not only slid downward by gravity, but also smoothly conveyed downward by the urging of the falling-assist gas path b 41.

In an embodiment, the blanking intercepting mechanism b6 includes a first blocking cylinder b61 and a first blocking member b62, a blanking channel b11 is disposed in the blanking conveying track b1, a first avoiding hole b63 is disposed at a position of the blanking conveying track b1 corresponding to the blanking intercepting mechanism b6, and the first blocking member b62 of the blanking intercepting mechanism b6 can extend into the blanking channel b11 through the first avoiding hole b63 to achieve a blocking effect.

In one embodiment, the test blocking mechanism b5 includes a second blocking cylinder b51 and a second blocking member b52 disposed at an end of a piston rod of the second blocking cylinder b51, the test conveying track b21 is provided with a second avoiding hole b53 corresponding to the test blocking mechanism b5, and the second blocking member b52 of the test blocking mechanism b5 can extend into the test conveying channel b211 through the second avoiding hole b53 to achieve a blocking effect.

Referring to fig. 5 to 10, the sorting mechanism c is used for connecting the high-pressure testing mechanism b and the feeding mechanism d, and the sorting mechanism c includes a translation driving mechanism c32, a sorting conveying track c33, a sorting blocking mechanism c36 and a first power conveying mechanism; the sorting and conveying track c33 is connected with the testing and conveying track b21 through the arc guide track b26, the sorting and blocking mechanism c36 is used for limiting the entering semiconductor elements k in the sorting and conveying track c33, and the translation driving mechanism c32 is used for driving the sorting and conveying track c33 to be respectively butted with the feeding mechanism d or the high-pressure unqualified recovery mechanism c35, so that the first power conveying mechanism respectively conveys the semiconductor elements k qualified in the high-pressure testing to the feeding mechanism d.

Specifically, the translation driving mechanism c32 includes a mounting frame c321, a translation driving motor c322, a first belt pulley c323, a second belt pulley c324 and a transmission belt c325, the transmission belt c325 is disposed on the mounting frame c321, the first belt pulley c323 and the second belt pulley c324 are respectively wound around the transmission belt c325, the translation driving motor c322 is in transmission connection with the first belt pulley c323, the sorting conveying track c33 is disposed on the transmission belt c325 and is disposed on the mounting frame c321 through a guide assembly, and the sorting conveying track c33 is driven by the translation driving motor c322 to be respectively butted with the feeding mechanism d or the high-pressure unqualified recovery mechanism c35 in the translation direction; by such arrangement, the translation driving mechanism c32 has a simple structure, and the moving effect of driving the sorting conveying track c33 is rapid.

Preferably, the mounting frame c321 is provided with an air blowing recovery head c38, and after the sorting and conveying track c33 is in butt joint with the high-pressure unqualified recovery mechanism c35, the air blowing recovery head c38 blows air to the semiconductor element k on the sorting and conveying track c33 to push the semiconductor element k which is unqualified in the high-pressure test to enter the high-pressure unqualified recovery mechanism c 35.

Furthermore, a sorting conveying channel c331 is arranged in the sorting conveying track c33, the first power conveying mechanism comprises a plurality of first conveying air paths c61 which are arranged above the sorting conveying track c33 and communicated with the sorting conveying channel c331, and a plurality of second conveying air paths c63 which are arranged on the sorting conveying track c33 and communicated with the sorting conveying channel c331 in an inclined mode along the downstream conveying direction.

The first conveying air paths c61 and the second conveying air paths c63 are respectively communicated with an air flow generating device (not shown), and air flows entering the sorting and conveying channel c331 through the first conveying air paths c61 and the second conveying air paths c63 are generated by the air flow generating device, so that the semiconductor elements k are moved and conveyed to the feeding mechanism d.

Since the sorting barrier mechanism c36 has substantially the same structure as the testing barrier mechanism b5, the sorting barrier mechanism c36 may be disposed with reference to the testing barrier mechanism b 5.

Specifically, referring to fig. 10 and 12, the feeding mechanism d includes two feeding rails d21 arranged in parallel, a second power conveying mechanism d22, a material blocking assembly d23, and a component pushing mechanism d3, the sorting conveying rail c33 can be butted with each feeding rail d21, the second power conveying mechanism d22 is used for driving the semiconductor component k to be conveyed along the downstream of the feeding rail d21, the component pushing mechanism d3 is connected to the end of the feeding rail d21, the component pushing mechanism d3 includes two feeding stations d30 and a pushing driving assembly d33 for driving the feeding stations d30 to be relatively separated from and close to the end of the feeding rail d21, and the material blocking assembly d23 is arranged between the feeding rail d21 and the component pushing mechanism d3 and used for blocking or releasing the semiconductor component k from entering the feeding station d 30.

The material blocking assembly d23 comprises material blocking push rods d231, supports d232 and material blocking pieces d233, one material blocking piece d233 is arranged corresponding to each feeding station d30, the supports d232 are vertically and slidably connected to the fixing seat d31 through material blocking slide rail assemblies, the material blocking pieces d233 are arranged at the upper ends of the supports d232, the supports d232 are in transmission connection with the material blocking push rods d231, and the material blocking push rods d231 can movably drive the supports d232 along the direction of the material blocking slide rail assemblies to extend the corresponding material blocking pieces d233 to the outer sides of the feeding stations d30 or reset relatively; through setting up like this, keep off material subassembly d23 simple structure, keep off effectually.

The size of the feeding station d30 is about the size of one semiconductor element k, when the second power conveying mechanism d22 drives the semiconductor element k in the feeding track d21 to move towards the tail end, only one semiconductor element k enters the feeding station d30, after the semiconductor element k enters the feeding station d30, the component pushing mechanism d3 moves the feeding station d30 to be connected with the main turntable conveying mechanism e, and meanwhile, the material blocking member d233 of the material blocking assembly d23 extends out of the tail end of the feeding track d21 to limit the semiconductor element k inside the feeding station to feed outwards.

The component pushing mechanism d3 comprises a fixed seat d31 and a feeding frame d32, the pushing driving component d33 comprises a feeding driving motor d331 and an eccentric transmission member d332, the feeding station d30 is arranged on the feeding frame d32, the feeding frame d32 is longitudinally arranged on the fixed seat d31 in a sliding manner through a feeding slide rail component, the eccentric transmission member d332 is eccentrically arranged at the output end of the feeding driving motor d331, the feeding frame d32 is provided with a kidney-shaped hole d333 sleeved on the eccentric transmission member d332, and the feeding driving motor d331 enables the feeding frame d32 to approach or separate along one side of the tail end of the component conveying track d21 by driving the eccentric transmission member d332 to operate; through the arrangement, the component pushing mechanism d3 is simple in structure, and the driving feeding station d30 is stable and rapid in moving effect.

The second power transmission mechanism d22 and the first power transmission mechanism have the same structure and working principle, and the second power transmission mechanism d22 can be specifically set by referring to the first power transmission mechanism, which is not repeated herein

Specifically, referring to fig. 13 to 20, the main turntable conveying mechanism e includes a main turntable e11, a lifting disc e12 disposed above the main turntable e11, a fixing frame e40 disposed above the lifting disc e12, a first cam divider e71 for driving the main turntable e11 to rotate in an indexing manner and lifting the lifting disc e12, and a first driving motor e72 in driving connection with the first cam divider e 71; the auxiliary disc conveying mechanism f comprises an auxiliary disc f21 arranged beside a main rotary disc e11, a second cam divider f22 used for driving the auxiliary disc f21 to rotate in an indexing manner and a second driving motor (not visible in the figure) in driving connection with the second cam divider f22, a plurality of groups of double grabbing mechanisms e3 arranged in a circumferential array mode are arranged on the edge of the main rotary disc e11, the double grabbing mechanisms e3 can grab two semiconductor elements k, and a pressure rod assembly e4 used for driving the double grabbing mechanisms e3 to descend is arranged on the lifting disc e 12; the auxiliary plate f21 is provided with a plurality of groups of bearing areas which are arranged in a circumferential array, and each group of bearing areas is provided with at least two positioning seats. The index rest period of the second cam divider f22 is longer than the index rest period of the first cam divider e 71. The main turntable conveying mechanism e circularly moves according to the following action sequence in sequence, wherein T1 is that the lifting disc e12 ascends, T2 is that the main turntable e11 rotates in an indexing way, and T3 is that the lifting disc e12 descends and T4: the main turntable e11 is indexing and stationary, and correspondingly, the double-grabbing mechanism e3 is made to circularly move in 4 actions of ascending, indexing rotation, descending, stationary and the like. As can be seen from fig. 22, the length of time for each rest of the sub-disc f21 is substantially the same as the total length of time for the main rotary disc e11 to perform two indexing rotations, the lifting disc e12 to be lifted twice, and the main rotary disc e11 to be at rest once, thereby greatly lengthening the test time.

Specifically, referring to fig. 14 and 20, the double-grabbing mechanism e3 includes a first suction assembly e31 and a second suction assembly e32, where the first suction assembly e31 and the second suction assembly e32 both include a first spring fixing seat e301 fixed on the main turntable e11, a vertically extending suction pipe e302, and a suction nozzle e303 fixed at the bottom end of the suction pipe e 302; the suction pipe e302 is sleeved with a spring limiting block e304, a first spring e305 and a first washer e306, the first washer e306 is located below the main rotary disc e11, the spring limiting block e304 and the first spring e305 are located above the main rotary disc e11, an air inlet is formed in the suction pipe e302, an air receiving head e307 connected with the air inlet is fixedly arranged on the suction pipe e302, the air receiving head e307 is located below the first washer e306, the first spring e305 is arranged between the first spring fixing seat e301 and the spring limiting block e304, the suction pipe e302 penetrates through the first spring fixing seat e301, and the top of the suction pipe e302 is closed and provided with a bayonet pin e308 for limiting the spring limiting block e 304. The negative pressure enters the suction pipe e302 from the input end of the air receiving head e307, so that the suction nozzle e303 of the suction pipe e302 has negative pressure suction force, and the light and small semiconductor element k can be sucked at all times. It is to be understood that when the positive pressure air flow is applied to the suction head e307, the negative pressure environment in the suction pipe e302 may be broken, so that the suction nozzle e303 releases the semiconductor element k.

Specifically, referring to fig. 21, the pressing rod assembly e4 includes a vertically extending pressing rod e41, a pressing head e42 fixed at the bottom end of the pressing rod e41, a limiting head e43 fixed at the middle of the pressing rod e41, a second washer e44 fixedly sleeved on the pressing rod e41, and a guide block e45 arranged at the top end of the pressing rod e 41; a bushing e48 and a second spring fixing seat e46 are fixed on the lifting disc e12, the second washer e44 is located above the pressure head e42, a second spring e47 is arranged between the second spring fixing seat e46 and the second washer e44, and the pressure rod e41 penetrates through the bushing e48, the lifting disc e12, the second spring fixing seat e46 and the second spring e47 from top to bottom.

Under a normal state, the pressing rod assembly e4 moves along with the lifting disc e12, the lifting disc e12 will drive the whole pressing rod assembly e4 to descend, the pressing head e42 on the pressing rod e41 acts on the top of the suction pipe e302 to push the suction pipe e302 to descend, and since the elastic force of the second spring e47 is far greater than that of the first spring e305, the second spring e47 can buffer the rigid impact between the pressing rod e41 and the suction pipe e302, and the first spring e305 is stressed and compressed.

Referring to fig. 15 to 18, the low voltage testing station g includes two low voltage testers (not visible in the drawings) and a clamping device g5, the clamping device g5 includes a base g511, a movable frame g512, a clamping driving mechanism g513, a link mechanism, a clamping and grabbing mechanism g52, a low voltage power connection module, a vertical linkage mechanism g516 and an opening and closing control mechanism g517, the movable frame g512 is disposed on the base g511 through a vertical sliding rail assembly g5112, the clamping and grabbing mechanism g52 includes a first clamping and grabbing assembly g521 and a second clamping and grabbing assembly g522 respectively disposed on the top of the movable frame g512 through a longitudinal sliding rail assembly g5111, the opposite inner sides of the first clamping and grabbing assembly g521 and the second clamping and grabbing assembly g522 are respectively provided with a low voltage power connection module, and the low voltage power connection module is electrically connected with the low voltage testers; the link mechanism is arranged between a first clamping and grabbing component g521 and a second clamping and grabbing component g522 and used for linking the first clamping and grabbing component g521 and the second clamping and grabbing component g522 to be relatively close to or separate from each other, the clamping driving mechanism g513 comprises a clamping driving motor g5131 and a transmission shaft g5132, a vertical linkage mechanism g516 is arranged between a movable frame g512 and the transmission shaft g5132, the vertical linkage mechanism g516 is used for linking the clamping and grabbing mechanism g52 to perform lifting movement in the vertical direction, an opening and closing control mechanism g517 is arranged between the link mechanism and the transmission shaft g5132 and used for linking the link mechanism to control the clamping and grabbing mechanism g52 to open or clamp, the clamping driving motor g5131 drives the transmission shaft g5132 to operate, so that the clamping and grabbing mechanism g52 clamps a semiconductor element k at a descending position to perform low-pressure test, and the clamping and grabbing mechanism g52 loosens the semiconductor element k at the ascending position.

During work, the clamping driving mechanism g513 drives the vertical linkage mechanism g516 and the opening and closing control mechanism g517 to move simultaneously, the clamping mechanism g52 is controlled to move in the vertical direction, and the clamping mechanism g52 is controlled to open or clamp respectively, so that the semiconductor element k is clamped by the clamping mechanism g52 at the descending position for low-pressure test, and the semiconductor element k is loosened by the clamping mechanism g52 at the ascending position, so that collision and interference between the clamping mechanism g52 and the clamping mechanism g52 at the descending position due to position switching of the next semiconductor element k can be avoided, and the reliability is good.

The link mechanism comprises a transmission connecting rod g515, the middle part of the transmission connecting rod g515 is rotatably connected to the movable frame g512, one end of the transmission connecting rod g515 is in transmission connection with a first clamping and grabbing component g521, the other end of the transmission connecting rod g515 is in transmission connection with a second clamping and grabbing component g522, and the first clamping and grabbing component g521 is in transmission connection with the opening and closing control mechanism g 517; through setting up like this, link mechanism sets up the mode simply, and transmission effect is good.

In one embodiment, the semiconductor element k has two pins per side and a total of four pins. The low-voltage power connection module comprises a group of first electric connectors g5181 arranged on the first grabbing arm g5213 and second electric connectors g5182 arranged on the second grabbing arm g 5223. Two sets of the first gripping arm g5213 and the second gripping arm g5223 are symmetrically arranged on the same clamping mechanism g52, so that the clamping mechanism g52 can simultaneously test the electrical performance of four pins of the semiconductor element k.

In one embodiment, two groups of the clamping mechanisms g52 are arranged on the movable frame g 512; by the arrangement, the low-voltage testing station g can clamp 4 semiconductor elements k at the same time for electrical performance testing, and the testing efficiency of the semiconductor elements k is improved.

Correspondingly, four positioning seats are arranged on each group of bearing areas, a fixed-frequency pull rod mechanism e6 for limiting the pressing rod assembly e4 to press down is further arranged on the fixed frame e40, and the fixed-frequency pull rod mechanism e6 comprises a pull plate support e61, a pull plate e62 capable of moving up and down relative to the pull plate support e61, a turning block e63 fixedly connected with the pull plate e62 and a pull rod driving motor e64 arranged beside the pull plate support e 61; a fixed-frequency cam e65 is arranged at the output end of the pull rod driving motor e64, a follower wheel e66 is arranged on the turning block e63, and the follower wheel e66 is abutted against the side surface of the fixed-frequency cam e65 to realize transmission; the pulling plate e62 is used for limiting the descending of the two guide blocks e 45. In the initial state, the pulling plate e62 and the turning block e63 descend under the action of self weight, the pulling plate e62 is at the lowest position, the follower wheel e66 is pressed against the circular part of the constant-frequency cam e65 at the moment, the pulling plate e62 is far away from the guide block e45, and the lifting of the guide block e45 and the pressing rod e41 is not interfered. When the pull rod driving motor e64 drives the fixed-frequency cam e65 to rotate until the follower wheel e66 is matched with the convex part of the fixed-frequency cam e65, the pull plate e62 is positioned at the highest position, and the pull plate e62 upwards supports the bottom of the guide block e45, so that when the guide block e45 and the press rod e41 have the tendency of moving downwards, the guide block e45 is pulled, and the press rod e41 is kept still. It is understood that during the test, the pull rod driving motor e64 is in continuous motion, and the rotation speed of the pull rod driving motor e64 is adaptively adjusted according to the duration and frequency of the lifting disc e 12.

A guide rod e49 for guiding the guide block e45 to vertically move is arranged on the fixed frame e40, so that the guide block e45 and the pressure rod e41 are prevented from self-rotating in the working process; on the other hand, the guide rod e49 is ensured to slide along the vertical direction all the time, and the lifting stability of the pressure rod e41 is improved.

Further, the pull plate e62 is connected with the pull plate support e61 in a sliding mode through the sliding block assembly, and therefore the pull plate e62 is guaranteed to move up and down smoothly; the pulling plate e62 is of an L-shaped structure, and two notches e621 allowing the pressing rod e41 to extend into are formed in the horizontal portion of the pulling plate e62, namely one pulling plate e62 can limit two pressing rods e41 at the same time.

Preferably, a low-level sensor e67 is arranged at the top of the pull plate support e61, a low-level contact e68 is arranged at the top of the pull plate e62, and if the low-level contact e68 cannot trigger the low-level sensor e67, the pull plate e62 is at the lowest level, and a signal can be fed back to a control system, so that further logic control is facilitated; if the low level contact e68 can trigger the low level sensor e67, it represents that the pulling plate e62 is in a lifting state.

For convenience of understanding, one bay of the auxiliary tray f21 is now set as a first bay f41, a previous bay of the first bay f41 is set as a second bay f42, and 4 positioning seats in the first bay f41 are sequentially a first positioning seat f31, a second positioning seat f32, a third positioning seat f33 and a fourth positioning seat f34, wherein the first positioning seat f31 is closest to the positioning and correcting device, and the fourth positioning seat f34 is farthest from the positioning and correcting device; one of the low-voltage testers is set as a first tester, and the other low-voltage tester is set as a second tester;

the working flow of transferring the semiconductor element k on the double-grabbing mechanism e3 to the auxiliary disc conveying mechanism f for low-voltage testing is briefly described as follows:

s01: the first cam divider e71 drives the lifting disc e12 to descend, the double-grabbing mechanism e3 located at the feeding station d30 grabs the semiconductor element k on the feeding mechanism d, the double-grabbing mechanism e3 is set as a first double-grabbing mechanism e01, the previous double-grabbing mechanism e3 of the first double-grabbing mechanism e01 is set as a second double-grabbing mechanism e02, and the first sucking component e31 and the second sucking component e32 on the first double-grabbing mechanism e01 respectively suck one semiconductor element k;

s02: the first cam divider e71 drives the lifting disc e12 to ascend, then the main rotating disc e11 rotates in an indexing manner, the second double-grabbing mechanism e02 rotates to the feeding station d30, the first cam divider e71 drives the lifting disc e12 to descend, the second double-grabbing mechanism e02 grabs the semiconductor elements k on the feeding mechanism d, and the first sucking assembly e31 and the second sucking assembly e32 on the second double-grabbing mechanism e02 suck one semiconductor element k respectively;

s03: after the first cam divider e71 drives the main rotary disc e11 and the lifting disc e12 to perform a plurality of times of circulating motions, the first double-grabbing mechanism e01 enters the handover station e13, the first bearing area f41 on the auxiliary disc f21 is located at the handover station e13, the first double-grabbing mechanism e01 is located right above the first positioning seat f31 and the second positioning seat f32, the fixed-frequency pull rod mechanism e6 limits the movement of the compression rod assembly e4, when the lifting disc e12 descends, the compression rod assembly e4 on the lifting disc e12 keeps still, the semiconductor element k on the first double-grabbing mechanism e01 keeps the original height and is far away from the first positioning seat f31 and the second positioning seat f32, and then the main rotary disc e11 enters the indexing static state;

s04: the first receiving area f41 of the auxiliary disk f21 is located at the transfer station e13 and is in an indexing static state, the first cam divider e71 drives the lifting disk e12 to ascend, then the main rotating disk e11 rotates in an indexing manner, the first double-grabbing mechanism e01 rotates to a position right above the third positioning seat f33 and the fourth positioning seat f34, meanwhile, the second double-grabbing mechanism e02 rotates to a position right above the first positioning seat f31 and the second positioning seat f32, the fixed-frequency pull rod mechanism e6 releases the limitation on the press rod assembly e4, then the first cam divider e71 drives the lifting disk e12 to descend, the press rod assembly e4 on the lifting disk e12 presses down to drive the first double-grabbing mechanism e01 and the second double-grabbing mechanism e02 on the main rotating disk e11 to descend simultaneously, the semiconductor element k of the first double-grabbing mechanism e01 is transferred to the third positioning seat f33 and the fourth positioning seat f34, and the semiconductor element k of the second double-grabbing mechanism e02 is transferred to the first positioning seat f31 and the second positioning seat f 32;

s05: the first double-grabbing mechanism e01 and the second double-grabbing mechanism e02 loosen the semiconductor element k; then the second cam divider f22 drives the auxiliary disc f21 to rotate in an indexing manner, the second bearing area f42 of the auxiliary disc f21 enters the transfer station e13, the semiconductor elements k with the performance test completed are placed on the 4 positioning seats on the second bearing area f42 of the auxiliary disc f21, and then the first double-grabbing mechanism e01 and the second double-grabbing mechanism e02 correspondingly grab the semiconductor elements k with the performance test completed;

s06: the second cam divider f22 drives the auxiliary disc f21 to rotate in an indexing manner, so that the semiconductor elements k on the first positioning seat f31, the second positioning seat f32, the third positioning seat f33 and the fourth positioning seat f34 correspondingly rotate to a first clamping station g01, a second clamping station g02, a third clamping station g03 and a fourth clamping station g04 on the low-pressure testing station g, then the auxiliary disc f21 is in an indexing static state, the clamping device g5 clamps the semiconductor elements k, then the first low-pressure tester conducts low-pressure testing on the semiconductor elements k on the first clamping station g01, and the second low-pressure tester conducts low-pressure testing on the semiconductor elements k on the second clamping station g 02; after the semiconductor elements k on the first clamping station g01 and the second clamping station g02 are tested, the first low-pressure tester performs low-pressure test on the semiconductor elements k on the third clamping station g03, and the second low-pressure tester performs low-pressure test on the semiconductor elements k on the fourth clamping station g04 at the same time; when all the semiconductor devices k on the first receiving area f41 are tested, the second cam divider f22 drives the sub-tray f21 to rotate in an indexing manner.

Each double-grabbing mechanism e3 (i.e. grabbing station) in the low-voltage testing process adopts a 'double-suction' design, and each double-grabbing mechanism e3 can suck two semiconductor elements k at each time, namely, each carrying beat of the main turntable material conveying mechanism e carries two semiconductor elements k, so that the testing capacity is doubled compared with the conventional method that only one semiconductor element k can be carried in each carrying beat. In addition, by virtue of the advantage of long static time of the auxiliary disk f21, the low-voltage test station g can finish the tests of all performance items under the condition of clamping the semiconductor element k once, batch tests are not needed, the clamping times of the semiconductor element k are reduced to the greatest extent, and the yield is improved; preferably, four semiconductor elements k can be tested in turn by arranging two testers and one clamping device g5 in the low-voltage testing station g, so that the equipment cost is greatly reduced, and the market competitiveness of enterprises is improved.

In this embodiment, in order to better match the low-voltage testing station g for testing, the placement needs to be adjusted in advance according to the polarity of the semiconductor element k, so a position reversing mechanism r1 for changing the placement position of the semiconductor element k, a polarity detecting mechanism r2 for testing the polarity direction of the semiconductor element k, a polarity reversing mechanism r3 for reversing the direction of the semiconductor element k with the wrong polarity direction, and a positioning mechanism r4 for correcting the position of the semiconductor element k are sequentially arranged between the feeding mechanism a and the auxiliary tray material conveying mechanism f, a pull rod limiting mechanism s for preventing the press rod assembly e4 from pressing down is arranged on the fixing frame e40, and the pull rod limiting mechanism s is positioned right above the polarity reversing mechanism r 3.

When two semiconductor elements k are conveyed to the position reversing mechanism r1, the position reversing mechanism r1 horizontally rotates the semiconductor elements k by 90 degrees, the semiconductor elements k are better matched with a testing station on the polarity detection mechanism r2 to be tested, then the semiconductor elements k are conveyed to the polarity detection mechanism r2, the polarity direction of the semiconductor elements k is detected when the main turntable e11 is static, the detection result is fed back to the control system, then the lifting disc e12 ascends, the main turntable e11 rotates in an indexing manner, the two semiconductor elements k are conveyed to the position right above the polarity reversing mechanism r3, and the control system controls the pull rod limiting mechanism s and the polarity reversing mechanism r3 to act according to the following 4 detection results. It can be understood that two pressing rod assemblies e4 are disposed at the polarity reversing station, and two pull rod limiting mechanisms s are correspondingly disposed above the two pressing rod assemblies e4, for convenience of description, the pressing rod assembly e4 corresponding to the first suction assembly e31 is defined as a first pressing rod assembly, the pressing rod assembly e4 corresponding to the second suction assembly e32 is defined as a second pressing rod assembly, the pull rod limiting mechanism s corresponding to the first suction assembly e31 is defined as a first pull rod limiting mechanism, and the pull rod limiting mechanism s corresponding to the second suction assembly e32 is defined as a second pull rod limiting mechanism.

(1) If the semiconductor element k on the first suction assembly e31 and the semiconductor element k on the second suction assembly e32 are both in the correct polarity direction, the first pull rod limiting mechanism and the second pull rod limiting mechanism pull the pressure rods on the first pressure rod assembly and the second pressure rod assembly, and even if the lifting disc e12 descends, the first pressure rod assembly and the second pressure rod assembly are still kept, so that the semiconductor element k on the first suction assembly e31 and the semiconductor element k on the second suction assembly e32 cannot fall onto the polarity reversing mechanism r 3.

(2) If the polarity direction of the semiconductor element k on the first suction assembly e31 is wrong, and the polarity direction of the semiconductor element k on the second suction assembly e32 is correct, the first pull rod limiting mechanism keeps an initial state, the first pressure rod assembly is not limited, the second pull rod limiting mechanism pulls the pressure rod on the second pressure rod assembly, when the lifting disc e12 descends, the first pressure rod assembly descends along with the first pressure rod assembly, the first suction assembly e31 is driven by the first pressure rod assembly to descend, the semiconductor element k on the first suction assembly e31 descends to the polarity reversing mechanism r3, and the polarity reversing mechanism r3 horizontally rotates the semiconductor element k 180 degrees to realize direction conversion; the second pressing rod assembly is kept still, and no pressure is applied to the second suction assembly e32, so that the semiconductor element k on the second suction assembly e32 is kept still and does not fall onto the polarity reversing mechanism r 3.

(3) If the polarity direction of the semiconductor element k on the first suction assembly e31 is correct and the polarity direction of the semiconductor element k on the second suction assembly e32 is wrong, the first pull rod limiting mechanism pulls the press rod on the first press rod assembly, and the second pull rod limiting mechanism keeps an initial state and does not limit the second press rod assembly; when the lifting disc e12 descends, the first pressure lever assembly keeps still and does not apply pressure to the first suction assembly e31, so that the semiconductor element k on the first suction assembly e31 also keeps still and does not fall onto the polarity reversing mechanism r 3; and the second pressure lever component descends along with the follow-up, the second pressure lever component drives the second suction component e32 to descend, the semiconductor element k on the second suction component e32 descends to the polarity reversing mechanism r3, and the polarity reversing mechanism r3 horizontally rotates the semiconductor element k by 180 degrees to realize direction conversion.

(4) If the semiconductor element k on the first suction assembly e31 and the semiconductor element k on the second suction assembly e32 are both in a polarity direction error, the first pull rod limiting mechanism and the second pull rod limiting mechanism are both kept in an initial state, the first pressure rod assembly and the second pressure rod assembly are not limited, the first pressure rod assembly and the second pressure rod assembly descend along with the first pressure rod assembly, the first suction assembly e31 is driven to descend by the first pressure rod assembly, the second suction assembly e32 is driven to descend by the second pressure rod assembly, the semiconductor element k on the first suction assembly e31 and the semiconductor element k on the second suction assembly e32 both descend to the polarity reversing mechanism r3, and the polarity reversing mechanism r3 horizontally rotates the two semiconductor elements k by 180 degrees to realize direction conversion.

In this embodiment, referring to fig. 14, 21 and 23, the pull rod limiting mechanism s includes a limiting bracket s1, a draw hook s2 pivotally connected to the limiting bracket s1, and a limiting cylinder s3 disposed above the draw hook s2, a piston rod end of the limiting cylinder s3 faces downward and is hinged to a top of the draw hook s2 through a limiting joint, a cylinder body end of the limiting cylinder s3 is hinged to the limiting bracket s1, and the draw hook s2 is used for limiting the guide block e45 to descend. When the piston rod of the limiting cylinder s3 extends out, the draw hook s2 is driven to rotate, the hook head of the draw hook s2 extends into the bottom of the guide block e45, so that when the guide block e45 and the pressing rod e41 have a downward moving trend, the guide block e45 is pulled, and the pressing rod e41 is kept still. On the contrary, when the piston rod of the limiting cylinder s3 retracts, the draw hook s2 rotates away from the guide block e45, the guide block e45 and the press rod e41 are not interfered, and the limiting cylinder s3 is controlled to act through the control system.

It should be understood that the position reversing mechanism r1, the polarity detecting mechanism r2, the polarity reversing mechanism r3, and the positioning mechanism r4 are not essential to the present application, and the specific structure may be configured by existing equipment.

Specifically, referring to fig. 24 to 27, the sorting and collecting mechanism h includes a bottom frame h1, a sorting and feeding track h2 disposed on the bottom frame h1 and extending in a transverse direction, an air blowing mechanism h3 disposed in front of the sorting and feeding track h2, and a moving material pipe assembly h4 disposed behind the sorting and feeding track h2 and capable of being abutted to the sorting and feeding track h2, where the moving material pipe assembly h4 includes a vertical frame h41, a sorting carriage h42 slidably disposed on the vertical frame h41, and a lifting mechanism h43 for driving the sorting carriage h42 and moving up and down, a plurality of grading layers h44 are disposed on the sorting carriage h42, a transversely extending material pipe h92 is disposed on each grading layer h44, and the air blowing mechanism h3 is configured to blow a semiconductor element k on the sorting and feeding track h2 into a corresponding material pipe h 92.

In this embodiment, the hierarchical layer h44 on the sorting carriage h42 is provided with eight layers, each layer represents a performance parameter interval of a semiconductor element k, that is, the quality of the semiconductor element k is divided into eight performance levels, a screening determination rule program is pre-recorded in the control system, the semiconductor element k is subjected to a low-pressure test by the low-pressure test station g and then feeds back a detection result to the control system, the semiconductor element k is further automatically distributed to the corresponding hierarchical layer h44 according to the performance level of the semiconductor element k, and a material pipe h92 is arranged on each hierarchical layer h44 to collect and store the semiconductor element k.

The classifying and collecting mechanism h automatically controls the lifting mechanism h43 to adjust the height of the classifying carriage h42 according to the performance parameters of the semiconductor element k, so that a graded layer h44 corresponding to the performance grade of the semiconductor element k is lifted to the joint of the classifying and feeding track h2, and a material pipe h92 in the graded layer h44 is waited for receiving the semiconductor element k; then, the blowing mechanism h3 pushes the semiconductor component k to move along a guide track formed by the sorting feeding track h2 and the limiting cover plate h22, so that the semiconductor component k is automatically collected into the corresponding material pipe h 92.

The sorting carriage h42 comprises a sliding base plate h423 and a front pipe clamp h421 and a rear pipe clamp h422 which are arranged on the sliding base plate h423, and the front pipe clamp h421 and the rear pipe clamp h422 are respectively provided with grading layers h44 which are the same in number and correspond to each other one by one. When the material pipe h92 is installed, after the graded layer h44 is selected, the material pipe h92 is inserted into the rear pipe clamp h422 from the rear end of the rear pipe clamp h422, then moves towards the front pipe clamp h421, and then is inserted into the front pipe clamp h421, so that the front end face of the material pipe h92 is flush with the front end face of the front pipe clamp h 421.

Preferably, a microswitch h45 for sensing whether the material pipe h92 is installed or not is arranged at each graded layer h44 of the front pipe clamp h 421. After the material pipe h92 is inserted into the grading layer h44, the material pipe h92 is continuously triggered to the micro switch h45, the micro switch h45 feeds back a signal to the control system, the material pipe h92 in the grading layer h44 is installed in place, and the grading layer h44 can store the semiconductor element k.

Preferably, an elastic pressing strip h46 for fixing the material pipe h92 is arranged at each graded layer h44 of the front pipe clamp h 421. The elastic pressing strip h46 presses the material pipe h92 in the front pipe clamp h421 by using elastic force, so that the material pipe h92 is prevented from self-moving.

Specifically, the lifting mechanism h43 comprises a motor support h431 at the top of a fixed vertical frame h41, a classification driving motor h432 downwards arranged on the motor support h431, a screw rod h433 vertically arranged below the classification driving motor h432, and a screw rod nut h434 sleeved on the screw rod h433, wherein the screw rod nut h434 is connected with the sliding base plate h423 through a joint h437, and the top end of the screw rod h433 is rotatably connected with a shaft seat h435 arranged on the vertical frame h 41; the main shaft of the classification driving motor h432 is in transmission connection with the top end of a screw rod h433, and the bottom end of the screw rod h433 is in rotary connection with a lower shaft seat h436 arranged on the vertical frame h 41. Preferably, the classification driving motor h432 is a servo motor and has a forward and reverse rotation function, the classification driving motor h432 drives the screw nut h434, the joint h437 and the classification carriage h42 to vertically move by driving the screw rod h433 to rotate, it can be understood that a control program that the operation time of the classification driving motor h432 is matched with the height of each grade layer h44 is preset in the control system, after the control system analyzes the performance grade of the semiconductor element k according to the performance data of the semiconductor element k, the semiconductor element k is distributed to the corresponding grade layer h44, the control system controls the operation of the classification driving motor h432 to accurately adjust the height of the classification carriage h42, so that the corresponding grade layer h44 is in butt joint with the classification feeding track h2, and the semiconductor element k is blown into the material pipe h92 of the grade layer h44.

Preferably, an upper sensor h61 and a lower sensor h62 positioned below the upper sensor h61 are arranged on the vertical frame h41, a contact piece h63 is arranged on the sorting carriage h42, when the contact piece h63 triggers the upper sensor h61, the contact piece represents that the sorting carriage h42 moves to an upper limit position, when the contact piece h63 triggers the lower sensor, the contact piece represents that the sorting carriage h42 moves to a lower limit position, and the upper limit position and the lower limit position are set, so that the sorting driving motor h432 can determine an initial zero position conveniently, and the lifting stroke of the sorting carriage h42 can be limited. The upper sensor h61 and the lower sensor h62 are preferably groove type photoelectric switches.

The blanking mechanism j mainly plays a role of automatically recycling the semiconductor element k to the material pipe h92, is not a main invention point of the present application, and can be realized through various existing blanking modes.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

It should be understood that equivalents and modifications to the disclosed embodiments and inventive concepts may occur to persons skilled in the art, and all such modifications and/or alterations are intended to fall within the scope of the present invention.

Claims

1. A high-low voltage testing and sorting machine for semiconductor components is characterized by comprising a feeding mechanism, a high-voltage testing mechanism, a sorting mechanism, a feeding mechanism and a main rotary disc conveying mechanism which are connected in sequence, wherein the main rotary disc conveying mechanism is arranged on a workbench, an auxiliary disc conveying mechanism, a classification collecting mechanism and a blanking mechanism are sequentially arranged on the periphery of the main rotary disc conveying mechanism in a surrounding manner, and a low-voltage testing station and a marking device are sequentially arranged on the periphery of the auxiliary disc conveying mechanism in a surrounding manner; the indexing rest time of the auxiliary disc material conveying mechanism is longer than that of the main rotary disc material conveying mechanism; the sorting mechanism is used for transmitting the semiconductor elements which are qualified in the high-voltage test to the feeding mechanism and transmitting the semiconductor elements which are unqualified in the high-voltage test to the unqualified high-voltage recovery mechanism; the feeding mechanism is used for providing qualified semiconductor elements for the high-voltage test for the main turntable conveying mechanism; the main turntable conveying mechanism is used for picking up, placing and indexing and conveying semiconductor elements, the auxiliary turntable conveying mechanism is used for indexing and conveying the semiconductor elements, and a joint position is formed at the joint of the main turntable conveying mechanism and the auxiliary turntable conveying mechanism; the low-voltage testing station is used for clamping the semiconductor element and carrying out low-voltage testing on the semiconductor element; the marking device is used for carrying out laser marking on the semiconductor element; the classified collection mechanism is used for classifying and collecting the semiconductor elements which do not reach the optimal performance parameters; the blanking mechanism is used for classifying and collecting the semiconductor elements with the optimal performance parameters.

2. The high-low voltage testing and sorting machine for semiconductor components as claimed in claim 1, wherein the high-voltage testing mechanism includes a high-voltage tester, a blanking conveying track arranged in a downward inclination, a bottom plate, a testing conveying track arranged on the bottom plate and connected with the blanking conveying track, a high-voltage testing area arranged on the testing conveying track, a high-voltage clamping assembly arranged in the high-voltage testing area, a sliding assisting mechanism and a testing blocking mechanism, wherein a blanking intercepting mechanism is arranged between the blanking conveying track and the testing conveying track, the high-voltage clamping assembly includes a high-voltage power connection module and a high-voltage testing driving mechanism which are arranged on two sides of the testing conveying track, the sliding assisting mechanism is used for driving the semiconductor components on the testing conveying track and the blanking conveying track to be conveyed downstream, and the testing blocking mechanism is used for limiting the semiconductor components on the testing conveying track in the high-voltage testing area or conveying the discharged semiconductor components in a downstream direction; the high-voltage power connection module is electrically connected with the high-voltage tester, and the high-voltage test driving mechanism is used for driving the two high-voltage power connection modules to move or reset towards one side of the semiconductor element respectively, so that a plurality of power connection terminals on the high-voltage power connection modules are butted with pins of the semiconductor element one by one respectively, and high-voltage power-on test is carried out on the semiconductor element.

3. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 2, wherein the sorting mechanism comprises a translation driving mechanism, a sorting conveying track connected with the downstream end of the testing conveying track, a sorting blocking mechanism and a first power conveying mechanism; the sorting and conveying track is connected with the testing and conveying track through the arc guide track, the sorting and blocking mechanism is used for limiting the entering semiconductor elements in the sorting and conveying track, and the translation driving mechanism is used for driving the sorting and conveying track to be respectively butted with the feeding mechanism or the high-pressure unqualified recovery mechanism, so that the first power conveying mechanism respectively conveys the semiconductor elements qualified in the high-pressure testing to the feeding mechanism.

4. The semiconductor component high-low voltage testing separator according to claim 3, wherein the feeding mechanism comprises two feeding rails arranged side by side, a second power conveying mechanism, a material blocking assembly and a component pushing mechanism, the sorting conveying rails can be in butt joint with each feeding rail, the second power conveying mechanism is used for driving the semiconductor components to convey along the downstream of the feeding rails, the component pushing mechanism is connected to the tail end of the feeding rails and comprises two feeding stations and a pushing driving assembly for driving the feeding stations to be relatively separated from and close to the tail end of the feeding rails, and the material blocking assembly is arranged between the feeding rails and the component pushing mechanism and used for blocking or releasing the semiconductor components from entering the feeding stations.

5. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 1, wherein the main turntable material conveying mechanism comprises a main turntable, a lifting disc arranged above the main turntable, a fixed frame arranged above the lifting disc, a first cam divider for driving the main turntable to rotate in an indexing manner and lifting the lifting disc, and a first driving motor in driving connection with the first cam divider; the auxiliary disc conveying mechanism comprises an auxiliary disc arranged beside the main rotary disc, a second cam divider used for driving the auxiliary disc to rotate in an indexing manner and a second driving motor in driving connection with the second cam divider, a plurality of groups of double grabbing mechanisms arranged in a circumferential array are arranged on the edge of the main rotary disc, the double grabbing mechanisms can grab two semiconductor elements, and a pressure rod assembly used for driving the double grabbing mechanisms to descend is arranged on the lifting disc; the auxiliary disc is provided with a plurality of groups of bearing areas which are arranged in a circumferential array mode, and each group of bearing areas is provided with at least two positioning seats.

6. The high-low voltage test separator for the semiconductor components as claimed in claim 5, wherein the double-grabbing mechanism comprises a first sucking assembly and a second sucking assembly, and the first sucking assembly and the second sucking assembly respectively comprise a first spring fixing seat fixed on the turntable, a vertically extending suction pipe and a suction nozzle fixed at the bottom end of the suction pipe; the cover has spring stopper, first spring and first packing ring on the straw, first packing ring is located the below of main carousel, spring stopper and first spring are located the top of main carousel, the air inlet has been seted up on the straw, set firmly the head of meeting air that links up with the air inlet on the straw, should meet the below that the head is located first packing ring, first spring setting is between first spring fixing base and spring stopper, and the straw runs through first spring fixing base, the top of straw is established to seal and is equipped with and is used for carrying out spacing bayonet lock to the spring stopper.

7. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 6, wherein the compression bar assembly comprises a compression bar extending vertically, a compression head fixed at the bottom end of the compression bar, a limiting head fixed at the middle part of the compression bar, a second gasket fixedly sleeved on the compression bar and a guide block arranged at the top end of the compression bar; the lifting disc is fixedly provided with a bushing and a second spring fixing seat, the second gasket is positioned above the pressure head, a second spring is arranged between the second spring fixing seat and the second gasket, and the pressing rod penetrates through the bushing, the lifting disc, the second spring fixing seat and the second spring from top to bottom.

8. The high and low voltage testing and sorting machine for semiconductor components and parts as claimed in claim 5, wherein a position reversing mechanism for changing the placing positions of the semiconductor elements, a polarity detecting mechanism for testing the polarity directions of the semiconductor elements, a polarity reversing mechanism for reversing the directions of the semiconductor elements with wrong polarity directions, and a positioning mechanism for correcting the positions of the semiconductor elements are sequentially arranged between the feeding mechanism and the auxiliary tray conveying mechanism, and a pull rod limiting mechanism for preventing the pressing rod assembly from pressing down is arranged on the fixing frame and is positioned right above the polarity reversing mechanism.

9. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 7, wherein four positioning seats are arranged on each group of bearing areas, a fixed-frequency pull rod mechanism for limiting the downward pressing of the pressure rod assembly is further arranged on the fixed frame, and the fixed-frequency pull rod mechanism comprises a pull plate support, a pull plate capable of moving up and down relative to the pull plate support, a turning block fixedly connected with the pull plate, and a pull rod driving motor arranged beside the pull plate support; the output end of the pull rod driving motor is provided with a fixed-frequency cam, the turning block is provided with a follower wheel, and the follower wheel is pressed against the side surface of the fixed-frequency cam to realize transmission; the pulling plate is used for limiting the two guide blocks to descend.

10. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 9, wherein the low-voltage testing station comprises two low-voltage testers and a clamping device, the clamping device comprises a base, a movable frame, a clamping driving mechanism, a link mechanism, a clamping mechanism, a low-voltage power connection module, a vertical linkage mechanism and an opening and closing control mechanism, the movable frame is arranged on the base through a vertical slide rail assembly, the clamping mechanism comprises a first clamping assembly and a second clamping assembly which are respectively arranged at the top of the movable frame through a longitudinal slide rail assembly, the opposite inner sides of the first clamping assembly and the second clamping assembly are respectively provided with a low-voltage power connection module, and the low-voltage power connection module is electrically connected with the low-voltage testers; link mechanism locates first clamp and grabs between the subassembly is grabbed to the second clamp for first clamp of linkage is grabbed the subassembly and the second clamp and is grabbed the subassembly and be close to relatively or part, clamping actuating mechanism includes clamping driving motor and transmission shaft, and vertical link mechanism locates between adjustable shelf and the transmission shaft, vertical link mechanism is used for the linkage to press from both sides and grabs the mechanism and go up and down the activity in the ascending action of doing of vertical side, and the control mechanism that opens and shuts locates between link mechanism and the transmission shaft, the control mechanism that opens and shuts is used for the linkage link mechanism control to press from both sides opening or pressing from both sides tight of grabbing the mechanism, clamping driving motor passes through the operation of drive transmission shaft, makes and presss from both sides tight semiconductor element of grabbing mechanism when the decline position and carry out the low-voltage test to and make and press from both sides the semiconductor element of grabbing mechanism when the rising position.

11. The high-low voltage testing and sorting machine for the semiconductor components as claimed in claim 1, wherein the classification and collection mechanism comprises a bottom frame, a classification feeding rail arranged on the bottom frame and extending in the transverse direction, an air blowing mechanism arranged in front of the classification feeding rail, and a movable material pipe assembly arranged behind the classification feeding rail and capable of being in butt joint with the classification feeding rail, the movable material pipe assembly comprises a vertical frame, a classification carriage slidably arranged on the vertical frame, and a lifting mechanism used for driving the classification carriage to move up and down, the classification carriage is provided with a plurality of grading layers, each grading layer is provided with a material pipe extending in the transverse direction, and the air blowing mechanism is used for blowing the semiconductor components on the classification feeding rail into the corresponding material pipes.