CN115183901A - Method and device for detecting ambient temperature, electronic equipment and storage medium - Google Patents
Method and device for detecting ambient temperature, electronic equipment and storage medium Download PDFInfo
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- CN115183901A CN115183901A CN202210742234.8A CN202210742234A CN115183901A CN 115183901 A CN115183901 A CN 115183901A CN 202210742234 A CN202210742234 A CN 202210742234A CN 115183901 A CN115183901 A CN 115183901A
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Abstract
The application relates to the technical field of environment temperature detection, and discloses a method for detecting environment temperature, which comprises the following steps: acquiring a temperature measurement value and a target heat source temperature; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Therefore, the temperature measurement value of the environment temperature sensor is corrected according to the stable conditions of the heat source temperature and the temperature field of the electronic equipment, and the environment temperature measured by the environment temperature sensor can be corrected in a targeted manner, so that the obtained environment temperature of the environment where the electronic equipment is located is more accurate. The application also discloses a device, electronic equipment and storage medium for detecting the ambient temperature.
Description
Technical Field
The present application relates to the field of ambient temperature detection technologies, and for example, to a method and an apparatus for detecting an ambient temperature, an electronic device, and a storage medium.
Background
A large amount of electronic equipment all is provided with ambient temperature sensor to the ambient temperature of the environment that detects electronic equipment is located, thereby makes the operation that electronic equipment can be better. Electronic devices typically include various heat generating components, such as: a processor. And these heat generating components are commonly referred to as heat sources. In the related art, the reading of an ambient temperature sensor carried by the electronic device is generally used directly as the ambient temperature of the environment in which the electronic device is located. However, the heat source of the electronic device can generate heat by itself during the operation process, so that the measurement of the ambient temperature sensor carried by the electronic device on the ambient temperature is affected, and the ambient temperature measured by the ambient temperature sensor is inaccurate. Therefore, how to accurately obtain the ambient temperature of the electronic device needs to be solved.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a method and a device for detecting an ambient temperature, an electronic device and a storage medium, so as to improve the accuracy of the acquired ambient temperature of the electronic device.
In some embodiments, the method for detecting ambient temperature includes obtaining a temperature measurement and a target heat source temperature; the temperature measurement value is characterized by a measurement value of an ambient temperature sensor in the electronic equipment; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of the temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient.
In some embodiments, the apparatus for detecting ambient temperature comprises: an acquisition module configured to acquire a temperature measurement and a target heat source temperature; the temperature measurement value is characterized by a measurement value of an ambient temperature sensor in the electronic equipment; a heat source temperature influence ratio determination module configured to determine a heat source temperature influence ratio based on the temperature measurement and the target heat source temperature; the heating deviation positive coefficient determining module is configured to determine a stable condition of a temperature field of the electronic equipment and determine a heating deviation positive coefficient according to the stable condition; and the correction module is configured to acquire the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heat generation correction coefficient.
In some embodiments, the electronic device comprises a processor and a memory storing program instructions, the processor being configured to perform the above-described method for detecting an ambient temperature when executing the program instructions.
In some embodiments, the storage medium stores program instructions that, when executed, perform the method for detecting an ambient temperature described above.
The method and the device for detecting the ambient temperature, the electronic device and the storage medium provided by the embodiment of the disclosure can realize the following technical effects: obtaining a temperature measurement value and a target heat source temperature; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Thus, the ambient temperature sensor readings may be affected by heat generation from the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
FIG. 1 is a schematic diagram of a method for detecting ambient temperature provided by embodiments of the present disclosure;
FIG. 2 is a schematic diagram of another method for detecting ambient temperature provided by embodiments of the present disclosure;
FIG. 3 is a schematic diagram of another method for detecting ambient temperature provided by embodiments of the present disclosure;
FIG. 4 is a schematic diagram of another method for detecting ambient temperature provided by embodiments of the present disclosure;
FIG. 5 is a schematic diagram of an apparatus for sensing ambient temperature provided by an embodiment of the present disclosure;
fig. 6 is a schematic diagram of an electronic device provided by an embodiment of the disclosure.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The term "plurality" means two or more unless otherwise specified.
In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.
Along with the function diversification of the electronic equipment and the chip calculation capacity improvement of the electronic equipment, the heating of the electronic equipment in the use process is an inevitable problem, and the reading of an environment temperature sensor carried by the electronic equipment can be greatly influenced by the heat generated by the electronic equipment. Resulting in inaccurate readings measured by the ambient temperature sensor of the electronic device. Especially, in the case where the inside of the electronic device is relatively closed and the temperature of the heat source is unstable, the reading of the ambient temperature sensor provided in the electronic device is more affected by the heat generated by the electronic device itself. Therefore, it is necessary to correct the reading measured by the ambient temperature sensor so as to accurately obtain the ambient temperature of the electronic device.
The application is applied to electronic equipment which comprises equipment provided with an ambient temperature sensor. And some or all of the heat generating components of the electronic device may generate heat during operation. Such as smart air conditioners, smart refrigerators, smart televisions, etc. This application corrects the reading of the electronic equipment from the ambient temperature sensor who takes through the stable condition of the temperature and the temperature field of the part that generates heat to improve the accuracy of the electronic equipment ambient temperature who obtains.
With reference to fig. 1, an embodiment of the present disclosure provides a method for detecting an ambient temperature, including:
step S101, the electronic equipment obtains a temperature measurement value and a target heat source temperature; the temperature measurement is indicative of a measurement of an ambient temperature sensor within the electronic device.
In step S102, the electronic equipment determines a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature.
In step S103, the electronic device determines a stable condition of the temperature field of the electronic device, and determines a heating bias coefficient according to the stable condition.
And step S104, the electronic equipment acquires the environment temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient.
By adopting the method for detecting the ambient temperature provided by the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Thus, the ambient temperature sensor readings may be affected by heat generation from the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate.
Optionally, the electronic device is provided with an ambient temperature sensor. Temperature measurements are obtained by: a reading of an ambient temperature sensor of the electronic device is determined as a temperature measurement.
Optionally, the target heat source temperature is obtained by: collecting alternative heat source temperatures every other first preset time; and storing the alternative heat source temperatures in sequence according to the collection sequence to form an alternative heat source temperature sequence; the alternative heat source temperature represents the temperature of a heat generating component in the electronic equipment; and determining the alternative heat source temperature at the preset position serial number in the alternative heat source temperature sequence as the target heat source temperature. Wherein, the first preset duration, for example: for 1 second. The position serial numbers of the alternative heat source temperature sequences are sequentially numbered from 1 according to the sequence from the acquisition of the alternative heat source temperature to the acquisition of the alternative heat source temperature. The alternative heat source temperature is the temperature of the heat generating components of the electronic device during operation. Thus, it takes a certain time for the heat emitted from the heat generating component in the electronic device to be transferred to other places of the electronic device, that is, the heat emitted from the heat generating component in the electronic device needs to influence the reading of the ambient temperature sensor after a certain time. Therefore, the alternative heat source temperature in the preset position serial number in the alternative heat source temperature sequence is determined as the target heat source temperature, and the heat source influencing the ambient temperature sensor at present can be accurately determined. The calculation is carried out according to the target heat source temperature, so that the correction of the environment temperature of the electronic equipment can be more accurate.
Further, the preset position serial number is determined in the following way: acquiring heat source conduction time; and dividing the heat source conduction time by the first preset time to obtain the position serial number. In this way, the position number of the candidate heat source temperature currently affecting the environment temperature sensor can be accurately determined.
Further, the heat source conduction time is preset. The heat source conduction period is set by: obtaining conduction time lengths of a plurality of sample heat sources; and determining the sample heat source conduction time length with the largest occurrence number as the heat source conduction time length. The conduction time of the sample heat source is the time when the heat emitted by the heating component in the electronic equipment influences the reading of the ambient temperature sensor at different ambient temperatures.
In some embodiments, the measurements of the alternative heat source temperature and the ambient temperature sensor are recorded separately and the sample heat source conduction duration is measured. For example, when the device is turned on, the alternative heat source temperature is acquired as a degrees celsius, and the measurement value of the ambient temperature sensor is acquired as b degrees celsius. And accumulating the conduction time length from the starting time of the equipment, and determining the accumulated conduction time length as the sample heat source conduction time length under the condition that the measurement values of the alternative heat source temperature and the environment temperature sensor are both increased by preset values.
In some embodiments, the first preset duration is 1 second. The temperature of the alternative heat source is collected to be 32 ℃, the temperature of the alternative heat source is collected to be 33 ℃ after 1 second, and the temperature of the alternative heat source is collected to be 34 ℃ after 1 second. And storing the alternative heat source temperatures in turn according to the collection sequence to form an alternative heat source temperature sequence of 32 ℃, 33 ℃ and 34 ℃. The numbers are sequentially numbered from 1 in the order of the alternative heat source temperature and the subsequent collection, and 34 ℃ is the position number 1, 33 ℃ is the position number 2, and 32 ℃ is the position number 3. And obtaining the heat source conduction time length as 2 seconds, and dividing the heat source conduction time length by a first preset time length to obtain a position serial number as 2. And determining the alternative heat source temperature ' 33 ℃ in the preset position serial number ' 2 ' in the alternative heat source temperature sequence as the target heat source temperature.
Optionally, determining a heat source temperature influence ratio based on the temperature measurement and the target heat source temperature comprises: and calculating by using the temperature measured value and the target heat source temperature according to a first preset algorithm to obtain the heat source temperature influence ratio.
Further, the calculating is performed by using the temperature measurement value and the target heat source temperature according to a first preset algorithm to obtain a heat source temperature influence ratio, and the calculating method comprises the following steps: computing
Obtaining a heat source temperature influence ratio; wherein i is a heat source temperature influence ratio; r is a preset constant; t is b Is a target heat source temperature; t is a Is a temperature measurement; "X" is a multiplication.
Optionally, determining a heat source temperature influence ratio based on the temperature measurement and the target heat source temperature comprises: performing table look-up operation on the temperature measurement value and the target heat source temperature by using a preset heat source temperature influence ratio database to obtain a heat source temperature influence ratio corresponding to the temperature measurement value and the target heat source temperature; the heat source temperature influence ratio database stores the corresponding relationship among the temperature measurement value, the target heat source temperature and the heat source temperature influence ratio.
Optionally, determining a stable condition of the temperature field of the electronic device comprises: acquiring the equipment running time of the electronic equipment; determining that the stable condition of the temperature field of the electronic equipment is stable under the condition that the equipment operation time is longer than or equal to a second preset time; and under the condition that the equipment operation time is shorter than a second preset time, determining that the stable condition of the temperature field of the electronic equipment is unstable. Thus, the heat generating components can reach a stable operation state after the electronic equipment is operated for a period of time. At this time, the influence of the electronic device on the ambient temperature measured by the ambient temperature sensor is kept constant. Therefore, the stable condition of the temperature field of the electronic equipment is determined, the correction of the environmental temperature measured by the electronic equipment according to the condition is facilitated, and the accuracy of the acquired environmental temperature of the electronic equipment is improved.
Optionally, the stable condition is stable or unstable; determining the heating deviation coefficient according to the stable condition, comprising: determining a preset numerical value as a heating deviation coefficient under the condition that the stable condition is stable; determining the heat dissipation condition of the electronic equipment under the condition that the stable condition is unstable; determining the running time of the correction equipment according to the heat dissipation condition; and determining the heating deviation coefficient according to the running time of the correction equipment. Among them, preset values, for example: 1. thus, heat dissipation may not be completed because the electronic device is started. At this time, the electronic apparatus is already in a heat generating state at the time of startup. If the device operation time length is directly used for correcting the environmental temperature, the influence of the electronic device on the environmental temperature sensor can be evaluated in a wrong way, so that the correction of the environmental temperature of the electronic device is inaccurate. Therefore, the environment temperature can be corrected more accurately by determining the heat dissipation condition of the electronic equipment.
With reference to fig. 2, another method for detecting an ambient temperature is provided in an embodiment of the present disclosure, including:
step S201, the electronic equipment acquires a temperature measurement value and a target heat source temperature; step S202 is then executed.
Step S202, the electronic equipment determines a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; then step S203 is performed.
In step S203, the electronic device determines whether the temperature field of the electronic device is stable. If the temperature field of the electronic device is stable, executing step S204; if the temperature field of the electronic device is unstable, step S205 is executed.
Step S204, the electronic equipment determines a preset numerical value as a heating deviation coefficient; step S206 is then performed.
Step S205, the electronic equipment determines the heat dissipation condition of the electronic equipment; determining the running time of the correction equipment according to the heat dissipation condition; determining a heating deviation coefficient according to the running time of the correction equipment; step S206 is then performed.
In step S206, the electronic device obtains the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio, and the heat generation correction coefficient.
By adopting the method for detecting the ambient temperature provided by the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Thus, the ambient temperature sensor readings may be affected by heat generation from the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate.
Further, determining the heat dissipation condition of the electronic device includes: acquiring the equipment power-off duration of the electronic equipment; when the power-off duration of the electronic equipment is greater than or equal to a second preset duration, determining that the heat dissipation condition of the electronic equipment is heat dissipation completion; and under the condition that the power-off time of the equipment is less than a second preset time, determining that the heat dissipation condition of the electronic equipment is not finished. Therefore, after the electronic equipment is powered off, the corresponding relation exists between the temperature change of the heat source of the electronic equipment and the power-off time of the equipment. Therefore, the heat dissipation condition of the electronic equipment can be prepared and determined through the power-off time of the equipment.
In some embodiments, the device power-off duration is obtained by: and acquiring a time stamp of the electronic equipment when the electronic equipment is powered on, and subtracting the last time point recorded by the electronic equipment from the time stamp to acquire the equipment power-off duration of the electronic equipment. If the electronic device is a non-networking device, the electronic device needs to acquire a current operating time point of the electronic device through a clock chip and a battery built in the electronic device.
Further, the heat dissipation condition is heat dissipation completion or heat dissipation is not completed; determining the operation time of the correction equipment according to the heat dissipation condition, comprising the following steps: acquiring the equipment running time of the electronic equipment; determining the equipment operation time length as the correction equipment operation time length under the condition that the heat dissipation condition is the heat dissipation completion; determining an initial value of the running time of the equipment under the condition that the heat dissipation is not finished; and determining the sum of the initial value of the equipment running time length and the equipment running time length as the corrected equipment running time length.
Optionally, determining an initial value of the running time of the device includes: performing table look-up operation on the target heat source temperature by using a preset first initial value database to obtain an initial value of equipment operation duration corresponding to the target heat source temperature; the first initial value database stores the corresponding relation between the target heat source temperature and the initial value of the equipment operation time length.
Optionally, determining an initial value of the running time of the device includes: calculating by using the target heat source temperature according to a preset fourth preset algorithm to obtain the heat dissipation time of the equipment; performing table look-up operation on the equipment heat dissipation duration by using a preset second initial value database to obtain an equipment operation duration initial value corresponding to the equipment heat dissipation duration; the second initial value database stores the corresponding relationship between the heat dissipation time length of the equipment and the initial value of the operation time length of the equipment.
Further, a fourth preset algorithm is obtained by the following method: obtaining sample heat source temperatures corresponding to different heat dissipation durations; establishing a plane rectangular coordinate system, determining the heat dissipation time length as an abscissa, determining the sample heat source temperature as an ordinate, and fitting sample heat source temperature coordinate points corresponding to the heat dissipation time lengths in the coordinate system to obtain a first function; the first function is determined as a fourth preset algorithm. The temperature of the sample heat source is the temperature of a heating component of the electronic equipment after power failure.
Optionally, determining the heating deviation coefficient according to the operation duration of the correction device includes: and calculating by utilizing the running time of the correction equipment according to a second preset algorithm to obtain the heating deviation coefficient.
Further, calculating by using the running time of the correction device according to a second preset algorithm to obtain a heating deviation coefficient, including: calculation f =1- (10-t) 1 ) 2 /10 2 Obtaining a heating deviation coefficient; wherein f is a heating bias coefficient; t is t 1 To correct the equipment operating time.
Optionally, determining the heating deviation coefficient according to the operation duration of the correction device includes: and calculating by utilizing the running time of the correction equipment according to a fifth preset algorithm to obtain the heating deviation coefficient.
Further, a fifth preset algorithm is obtained by: acquiring sample temperature differences corresponding to different equipment operation durations; dividing the temperature difference of each sample by a preset expected value of the difference to obtain each heating deviation coefficient; establishing a rectangular plane coordinate system, determining the running time of the equipment as an abscissa, determining the heating eccentricity coefficient as an ordinate, fitting the heating eccentricity coefficient coordinate points corresponding to the running time of each equipment in the coordinate system to obtain a second function, and determining the second function as a fifth preset algorithm. The sample temperature difference is a difference value between an actual environment temperature of the electronic equipment and an environment temperature measured by an environment temperature sensor of the electronic equipment.
Further, the expected value of the difference is obtained by: acquiring a sample difference value between the actual environment temperature of the electronic equipment and the environment temperature measured by an environment temperature sensor of the electronic equipment under the condition that the temperature field of the electronic equipment is stable; and determining the sample difference value with the largest occurrence number as the expected difference value.
With reference to fig. 3, another method for detecting an ambient temperature is provided in an embodiment of the present disclosure, including:
step S301, the electronic equipment acquires a temperature measurement value and a target heat source temperature; then step S302 is performed.
Step S302, the electronic equipment determines a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; then, step S303 is performed.
In step S303, the electronic device determines whether the temperature field of the electronic device is stable. If the temperature field of the electronic device is stable, executing step S304; if the temperature field of the electronic device is unstable, step S305 is executed.
Step S304, the electronic equipment determines a preset numerical value as a heating deviation coefficient; then, step S309 is performed.
Step S305, the electronic equipment acquires the equipment running time; then step S306 is performed.
Step S306, the electronic equipment determines whether the heat dissipation of the electronic equipment is finished; in the case where the heat dissipation is finished, step S307 is executed; in the case where the heat dissipation is not finished, step S308 is executed.
Step S307, the electronic equipment determines the equipment operation duration as the correction equipment operation duration; determining a heating deviation coefficient according to the running time of the correction equipment; then, step S309 is performed.
Step S308, the electronic equipment determines an initial value of the running time of the equipment; determining the sum of the initial value of the equipment running time length and the equipment running time length as the corrected equipment running time length; determining a heating deviation coefficient according to the running time of the correction equipment; then, step S309 is performed.
In step S309, the electronic device obtains the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio, and the heat generation correction coefficient.
By adopting the method for detecting the ambient temperature provided by the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained. And determining the influence ratio of the heat source temperature according to the temperature measured value and the target heat source temperature. And determining different heating bias coefficients according to the stable condition of the temperature field of the electronic equipment and the heat dissipation condition of the electronic equipment. And acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Thus, the ambient temperature sensor readings may be affected by heat generation from the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate. Meanwhile, if the ambient temperature is corrected by directly using the running time of the device, the influence of the electronic device on the ambient temperature sensor may be erroneously evaluated, which may result in inaccurate correction of the ambient temperature of the electronic device. Therefore, the environment temperature can be corrected more accurately by determining the heat dissipation condition of the electronic equipment.
Optionally, obtaining the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio, and the heat generation bias coefficient, includes: and calculating by using the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient according to a third preset algorithm to obtain the environment temperature.
Further, according to a third preset algorithm, calculating by using the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient to obtain the ambient temperature, including: calculating T 0 ＝T a -i × C, obtaining ambient temperature; wherein, T 0 Is ambient temperature; t is a Is a temperature measurement; i is a heat source temperature influence ratio; c is the heat generation bias coefficient.
Optionally, after obtaining the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio, and the heat generation correction coefficient, the method further includes: the ambient temperature is presented to the user.
Optionally, presenting the ambient temperature to a user comprises: and pushing the ambient temperature to a preset client.
Optionally, presenting the ambient temperature to a user, comprises: and sending the ambient temperature to a preset display screen, and triggering the display screen to display the ambient temperature.
With reference to fig. 4, another method for detecting an ambient temperature is provided in an embodiment of the present disclosure, including:
in step S401, the electronic device obtains a temperature measurement value and a target heat source temperature.
In step S402, the electronic device determines a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature.
In step S403, the electronic device determines a stable condition of the temperature field of the electronic device, and determines a heat generation bias coefficient according to the stable condition.
In step S404, the electronic device obtains the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio, and the heat generation correction coefficient.
In step S405, the electronic device displays the ambient temperature to the user.
By adopting the method for detecting the ambient temperature provided by the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. The ambient temperature is presented to the user. Thus, the ambient temperature sensor readings may be affected by heat generated by the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate. The ambient temperature is displayed for the user, so that the user can conveniently know the ambient temperature of the electronic equipment.
As shown in fig. 5, an embodiment of the present disclosure provides an apparatus for detecting an ambient temperature, including: an acquisition module 501 configured to acquire a temperature measurement value and a target heat source temperature; the temperature measurement value represents a measurement value of an ambient temperature sensor in the electronic device; a heat source temperature influence ratio determination module 502 configured to determine a heat source temperature influence ratio based on the temperature measurement value and the target heat source temperature; a heat generation bias coefficient determination module 503 configured to determine a stable condition of a temperature field of the electronic device, and determine a heat generation bias coefficient according to the stable condition; and a correction module 504 configured to obtain the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heat generation bias coefficient.
By adopting the device for detecting the ambient temperature provided by the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained through the obtaining module; the heat source temperature influence ratio determining module determines a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; the heating deviation positive coefficient determining module determines the stable condition of the temperature field of the electronic equipment and determines the heating deviation positive coefficient according to the stable condition; and the correction module acquires the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient. Thus, the ambient temperature sensor readings may be affected by heat generation from the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measuring value of the ambient temperature sensor is corrected according to the stable conditions of the heat source temperature and the temperature field of the electronic equipment, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate.
As shown in fig. 6, an embodiment of the present disclosure provides an electronic device including a processor (processor) 600 and a memory (memory) 601. Optionally, the apparatus may also include a Communication Interface 602 and a bus 603. The processor 600, the communication interface 602, and the memory 601 may communicate with each other via a bus 603. The communication interface 602 may be used for information transfer. The processor 600 may call logic instructions in the memory 601 to perform the method for detecting ambient temperature of the above embodiments.
In addition, the logic instructions in the memory 601 may be implemented in the form of software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products.
The memory 601 is a computer readable storage medium, and can be used for storing software programs, computer executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 600 executes functional applications and data processing, i.e. implements the method for detecting ambient temperature in the above-described embodiments, by executing program instructions/modules stored in the memory 601.
The memory 601 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal device, and the like. In addition, the memory 601 may include a high speed random access memory, and may also include a non-volatile memory.
Optionally, the electronic device is a computer or a server.
By adopting the electronic equipment of the embodiment of the disclosure, the temperature measurement value and the target heat source temperature are obtained; determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature; determining the stable condition of a temperature field of the electronic equipment, and determining a heating bias coefficient according to the stable condition; the ambient temperature is obtained from the temperature measurement value, the heat source temperature influence ratio, and the heat generation bias coefficient, so that the reading of the ambient temperature sensor is influenced by the heat generation of the heat source of the electronic device. Meanwhile, the heat source generates heat to affect the environment temperature sensor differently before and after the temperature field of the electronic equipment is stabilized. The temperature measurement value of the ambient temperature sensor is corrected according to the heat source temperature of the electronic equipment and the stable condition of the temperature field, and the ambient temperature measured by the ambient temperature sensor can be corrected in a targeted manner, so that the obtained ambient temperature of the environment where the electronic equipment is located is more accurate.
The embodiment of the disclosure provides a storage medium, which stores program instructions, and when the program instructions are executed, the method for detecting the environment temperature is executed.
The disclosed embodiments provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the above-described method for detecting an ambient temperature.
The computer-readable storage medium described above may be a transitory computer-readable storage medium or a non-transitory computer-readable storage medium.
The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for enabling a computer device (which may be a personal computer, an electronic device, or a network device) to execute all or part of the steps of the method of the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium comprising: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes, and may also be a transient storage medium.
The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. Furthermore, the words used in the specification are words of description only and are not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Without further limitation, an element defined by the phrase "comprising a …" does not exclude the presence of additional like elements in a process, method, or apparatus that comprises the element. In this document, each embodiment may be described with emphasis on differences from other embodiments, and the same and similar parts between the respective embodiments may be referred to each other. For methods, products, etc. of the embodiment disclosures, reference may be made to the description of the method section for relevance if it corresponds to the method section of the embodiment disclosure.
Those of skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software may depend upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments. It can be clearly understood by the skilled person that, for convenience and brevity of description, the specific working processes of the system, the apparatus and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, apparatuses, etc.) may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units may be merely a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form. The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to implement the present embodiment. In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than disclosed in the description, and sometimes there is no specific order between the different operations or steps. For example, two sequential operations or steps may in fact be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. Each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Claims (10)
1. A method for sensing ambient temperature, comprising:
acquiring a temperature measurement value and a target heat source temperature; the temperature measurement value is characterized by a measurement value of an ambient temperature sensor in the electronic equipment;
determining a heat source temperature influence ratio according to the temperature measurement value and the target heat source temperature;
determining the stable condition of the temperature field of the electronic equipment, and determining the heating bias coefficient according to the stable condition;
and acquiring the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heating deviation coefficient.
2. The method of claim 1, wherein the target heat source temperature is obtained by:
collecting alternative heat source temperatures every other first preset time; and storing the alternative heat source temperatures in sequence according to the collection sequence to form an alternative heat source temperature sequence; the alternative heat source temperature is indicative of a temperature of a heat generating component in the electronic device;
and determining the alternative heat source temperature in the preset position serial number in the alternative heat source temperature sequence as the target heat source temperature.
3. The method of claim 1, wherein determining a heat source temperature influence ratio based on the temperature measurement and the target heat source temperature comprises:
and calculating by using the temperature measurement value and the target heat source temperature according to a first preset algorithm to obtain a heat source temperature influence ratio.
4. The method of claim 1, wherein determining a stable condition of the temperature field of the electronic device comprises:
acquiring the equipment running time of the electronic equipment;
determining that the stable condition of the temperature field of the electronic equipment is stable under the condition that the equipment operation time is longer than or equal to a second preset time;
and determining that the stability of the temperature field of the electronic equipment is unstable under the condition that the running time of the equipment is less than a second preset time.
5. The method of claim 1, wherein the stable condition is stable or unstable; determining a heating deviation coefficient according to the stable condition, comprising:
determining a preset numerical value as a heating deviation coefficient under the condition that the stable condition is stable;
determining the heat dissipation condition of the electronic equipment under the condition that the stable condition is unstable; determining the running time of the correction equipment according to the heat dissipation condition; and determining the heating deviation coefficient according to the running time of the correction equipment.
6. The method of claim 5, wherein determining a heat dissipation condition of the electronic device comprises:
acquiring the equipment power-off duration of the electronic equipment;
determining that the heat dissipation condition of the electronic equipment is heat dissipation completion under the condition that the power-off duration of the equipment is greater than or equal to a second preset duration;
and under the condition that the power-off duration of the equipment is less than a second preset duration, determining that the heat dissipation condition of the electronic equipment is not finished.
7. The method of claim 5, wherein the heat dissipation condition is heat dissipation complete or heat dissipation incomplete; determining the operation time of the correction equipment according to the heat dissipation condition, comprising the following steps:
acquiring the equipment running time of the electronic equipment;
determining the equipment operation duration as the equipment operation duration under the condition that the heat dissipation is finished;
determining an initial value of the running time of the equipment under the condition that the heat dissipation is not finished; and determining the sum of the initial value of the equipment running time length and the equipment running time length as the corrected equipment running time length.
8. An apparatus for sensing ambient temperature, comprising:
an acquisition module configured to acquire a temperature measurement and a target heat source temperature; the temperature measurement value is characterized by a measurement value of an ambient temperature sensor in the electronic equipment;
a heat source temperature influence ratio determination module configured to determine a heat source temperature influence ratio based on the temperature measurement and the target heat source temperature;
the heating deviation positive coefficient determining module is configured to determine a stable condition of a temperature field of the electronic equipment and determine a heating deviation positive coefficient according to the stable condition;
and the correction module is configured to acquire the ambient temperature according to the temperature measurement value, the heat source temperature influence ratio and the heat generation correction coefficient.
9. An electronic device comprising a processor and a memory storing program instructions, wherein the processor is configured to perform the method for detecting an ambient temperature of any one of claims 1 to 7 when executing the program instructions.
10. A storage medium storing program instructions which, when executed, perform a method for detecting an ambient temperature according to any one of claims 1 to 7.
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| CN202210742234.8A CN115183901A (en) | 2022-06-28 | 2022-06-28 | Method and device for detecting ambient temperature, electronic equipment and storage medium |
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| CN202210742234.8A CN115183901A (en) | 2022-06-28 | 2022-06-28 | Method and device for detecting ambient temperature, electronic equipment and storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116301117A (en) * | 2023-05-24 | 2023-06-23 | 荣耀终端有限公司 | Temperature control method and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116301117A (en) * | 2023-05-24 | 2023-06-23 | 荣耀终端有限公司 | Temperature control method and electronic equipment |
| CN116301117B (en) * | 2023-05-24 | 2023-10-20 | 荣耀终端有限公司 | Temperature control method and electronic equipment |
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