CN116301117B

CN116301117B - Temperature control method and electronic equipment

Info

Publication number: CN116301117B
Application number: CN202310588790.9A
Authority: CN
Inventors: 钟光华
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-05-24
Filing date: 2023-05-24
Publication date: 2023-10-20
Anticipated expiration: 2043-05-24
Also published as: CN116301117A

Abstract

The embodiment of the application provides a temperature control method and electronic equipment, wherein the method comprises the following steps: acquiring the temperatures of m temperature detection points and the heat consumption of n heat sources; m is a natural number greater than 1, n is a natural number greater than 1; determining a first temperature predicted value of the m temperature detection points according to the temperatures of the m temperature detection points and the heat consumption of the n heat sources; determining temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points, wherein the temperature deviation values of the temperature detection points are used for indicating deviation values of the temperatures of the temperature detection points and target temperatures of the temperature detection points; and controlling the temperature of the n heat sources according to the first temperature predicted values and the deviation values of the m temperature detection points. The embodiment of the application can improve the temperature control effect of the electronic equipment.

Description

Temperature control method and electronic equipment

Technical Field

The present application relates to the field of temperature control technologies, and in particular, to a temperature control method and an electronic device.

Background

In order to ensure the use safety of the electronic equipment, the electronic equipment needs to be subjected to temperature control. The temperature control method of the electronic equipment comprises the following steps: detecting the shell temperature of the electronic equipment, comparing the shell temperature with a start control temperature, and when the shell temperature exceeds the start control temperature, performing frequency reduction processing on a system on chip (SoC) so that the shell temperature of the electronic equipment reaches a target temperature. However, in order to control the electronic device to reach the target temperature, the start control temperature is generally far lower than the target temperature, which affects the normal working temperature range of the electronic device, and further affects the normal working of the electronic device, and the temperature control effect of the electronic device is poor.

Disclosure of Invention

The application provides a temperature control method and electronic equipment, which can improve the temperature control effect of the electronic equipment.

In a first aspect, an embodiment of the present application provides a temperature control method, applied to an electronic device, where the method includes: acquiring the temperatures of m temperature detection points and the heat consumption of n heat sources; m is a natural number greater than 1, n is a natural number greater than 1; determining first temperature predicted values of m temperature detection points according to the temperatures of the m temperature detection points and the heat consumption of n heat sources; determining temperature deviation values of m temperature detection points according to the temperatures of the m temperature detection points, wherein the temperature deviation values of the temperature detection points are used for indicating deviation values of the temperatures of the temperature detection points and target temperatures of the temperature detection points; and controlling the temperature of the n heat sources according to the first temperature predicted values and the deviation values of the m temperature detection points. According to the method, temperatures of m temperature detection points and heat consumption of n heat sources in the electronic equipment are obtained, so that temperature control of the n heat sources is realized, and compared with a temperature control mode of controlling SoC frequency through shell temperature, the temperature control of the plurality of heat sources can be performed according to relatively more temperature information in the electronic equipment, and a relatively better temperature control effect is achieved.

In one possible implementation, the temperature control of the n heat sources according to the first temperature predicted value and the deviation value of the m temperature detection points includes: determining a target heat source from the n heat sources according to the temperatures of the m temperature detection points and/or the heat consumption of the n heat sources; and controlling the temperature of the target heat source according to the first temperature predicted value and the deviation value of the m temperature detection points. According to the method, the target heat source is determined from the n heat sources according to the temperatures of the m temperature detection points and/or the heat consumption of the n heat sources, and the temperature of the target heat source is controlled only, so that the heat source with relatively large influence on the temperature of the temperature detection points can be selected from the n heat sources to be controlled, namely the heat source with relatively large influence on the temperature of the electronic equipment is selected from the n heat sources to be controlled, the temperature control is more accurate, and the temperature control effect is improved.

In one possible implementation, the temperature control of the target heat source according to the first temperature predicted value and the deviation value of the m temperature detection points includes: determining a first feedback value according to the first temperature predicted value and the deviation value of the m temperature detection points; and controlling the temperature of the target heat source according to the first feedback value and the heat consumption of the n heat sources. The first feedback value may be, for example, a scene feedback value in a subsequent embodiment. In the method, the basis for temperature control of the target heat source is the first temperature predicted value and the deviation value of m temperature detection points and the heat consumption of n heat sources, so that the temperature control of the target heat source is more accurate, and the temperature control effect is improved.

In one possible implementation, determining the first feedback value according to the first temperature prediction value and the deviation value of the m temperature detection points includes: calibrating the first temperature predicted values of the m temperature detection points according to the temperatures of the m temperature detection points to obtain second temperature predicted values of the m temperature detection points; and determining a first feedback value according to the second temperature predicted value and the deviation value. In the method, the first temperature predicted value is calibrated, so that the first feedback value is more accurate, the temperature control of the target heat source is relatively more accurate, and the temperature control effect is improved.

In one possible implementation, determining the first temperature prediction value of the m temperature detection points according to the temperatures of the m temperature detection points and the heat consumptions of the n heat sources includes: for each temperature detection point, calculating a first temperature prediction value of the temperature detection point by using a preset first temperature rise function of the temperature detection point according to the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point; the first temperature rise function of the temperature detection point includes: a temperature rise model and a heat dissipation model of the temperature detection point; the temperature rise model of the temperature detection point is used for describing the influence of heat consumption of the heat source corresponding to the temperature detection point on the temperature of the temperature detection point, and the heat dissipation model of the temperature detection point is used for describing the influence of heat dissipation of the temperature detection point on the temperature of the temperature detection point.

In one possible implementation manner, calibrating the first temperature predicted value of the m temperature detection points according to the temperatures of the m temperature detection points to obtain the second temperature predicted value of the m temperature detection points includes: for each temperature detection point, carrying out parameter calibration on a first temperature rise function of the temperature detection point according to the temperature of the temperature detection point and a first temperature prediction value to obtain a second temperature rise function of the temperature detection point; and calculating a second temperature predicted value of the temperature detection point by using a second temperature rise function of the temperature detection point according to the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point.

In one possible implementation, determining the target heat source from the n heat sources according to the temperatures of the m temperature detection points and/or the heat consumptions of the n heat sources includes: selecting a first number of heat sources with the heat rate sequence being the front from the n heat sources as target heat sources according to the heat rate sequence of the n heat sources; or selecting a temperature detection point with the temperature exceeding the target temperature from m temperature detection points as a target temperature detection point, and taking a heat source corresponding to the target temperature detection point as a target heat source; or selecting a second number of heat sources with the heat consumption sequence being the front from the n heat sources as the first heat source according to the heat consumption sequence of the n heat sources; selecting a temperature detection point with the temperature exceeding the target temperature from the m temperature detection points as a target temperature detection point, and taking a heat source corresponding to the target temperature detection point as a second heat source; and determining the overlapped heat source in the first heat source and the second heat source as a target heat source.

In one possible implementation, the method further includes: determining a usage field Jing Leixing of the electronic device; and determining target temperatures of m temperature detection points according to the use scene type of the electronic equipment. According to the method, the target temperatures of the m temperature detection points are determined according to the use scene type of the electronic equipment, so that the target temperatures of the m temperature detection points are more targeted and are suitable for the use scene type of the electronic equipment, and the temperature control effect is improved.

In one possible implementation, determining a usage scenario type of an electronic device includes: acquiring an application currently operated by the electronic equipment; and determining the use scene type corresponding to the application currently running by the electronic equipment as the use scene type of the electronic equipment.

In one possible implementation, the temperature control of the target heat source according to the first feedback value and the heat consumption of the n heat sources includes: calculating the difference value between the sum of the heat consumption of the n heat sources and the first feedback value to obtain a second feedback value; determining a thermal control parameter of the target heat source according to the second feedback value; when the second feedback value is a positive value, the thermal control parameter of the target heat source is used for reducing the heat consumption of the target heat source; and controlling the temperature of the target heat source according to the thermal control parameters of the target heat source. The second feedback value may be, for example, a heat consumption feedback in the subsequent embodiment.

In one possible implementation, at least some of the m temperature detection points are located on a housing of the electronic device.

In a second aspect, an embodiment of the present application provides an electronic device, including: a processor, a memory; wherein one or more computer programs are stored in the memory, the one or more computer programs comprising instructions, which when executed by the processor, cause the electronic device to perform the method of any of the first aspects.

In a third aspect, embodiments of the present application provide a computer-readable storage medium having a computer program stored therein, which when run on a computer causes the computer to perform the method of any of the first aspects.

In a fourth aspect, embodiments of the present application provide a computer program product comprising a computer program which, when run on a computer, causes the computer to perform the method of any of the first aspects.

In a fifth aspect, the application provides a computer program for performing the method of any of the first aspects when the computer program is executed by a computer. In one possible design, the program in the fifth aspect may be stored in whole or in part on a storage medium packaged with the processor, or in part or in whole on a memory not packaged with the processor.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a temperature control method according to an embodiment of the present application;

fig. 2A is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2B is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 3A is a schematic diagram of the experimental results of thermal test hysteresis provided in the examples of the present application;

FIG. 3B is a schematic flow chart of a temperature control method according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a circuit structure between a heat source and a temperature detecting point according to an embodiment of the present application;

FIG. 5 is a schematic flow chart of another temperature control method according to an embodiment of the present application;

FIG. 6 is a schematic flow chart of a temperature control method according to an embodiment of the present application;

FIG. 7 is a schematic diagram of an implementation flow of a step in the method shown in FIG. 6 according to an embodiment of the present application;

FIG. 8 is a schematic diagram illustrating a control principle of the method shown in FIG. 6 according to an embodiment of the present application;

FIG. 9 is a fourth schematic flow chart of a temperature control method according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a calibration principle provided by an embodiment of the present application;

fig. 11 is a schematic diagram of a control principle of the method shown in fig. 9 according to an embodiment of the present application.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments of the application only and is not intended to be limiting of the application.

In order to ensure the use safety of the electronic equipment, the electronic equipment needs to be subjected to temperature control. Referring to fig. 1, the temperature control method of the electronic device includes: detecting the shell temperature of the electronic equipment, comparing the shell temperature with the start control temperature, and performing frequency reduction treatment on the SoC when the shell temperature exceeds the start control temperature so that the shell temperature of the electronic equipment reaches the target temperature.

In order to control the electronic equipment to reach the target temperature, the start control temperature set in the temperature control method is generally far lower than the target temperature, so that the temperature range of normal operation of the electronic equipment is reduced, the system performance of the electronic equipment is further influenced, and the temperature control effect is poor.

The application provides a temperature control method and electronic equipment, which can better control the temperature of the electronic equipment and improve the temperature control effect.

Fig. 2A illustrates a schematic structural diagram of an electronic device according to an embodiment of the present application, where, as shown in fig. 2A, the electronic device 100 may include: processor 110, memory 120, temperature measurement module 130, and heat rate measurement module 140.

It should be understood that the illustrated structure of the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the application, electronic device 100 may include more or fewer components than shown, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware. For example, the electronic device 100 may further include: charge management module, power management module, battery, antenna, mobile communication module, wireless communication module, audio module, speaker, receiver, microphone, headset interface, sensor module, keys, motor, indicator, camera module, display screen, and/or subscriber identity module (subscriber identification module, SIM) card interface, etc. The sensor module may specifically include a pressure sensor, a gyroscope sensor, a barometric sensor, a magnetic sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.

The processor 110 may include one or more processing units, such as: the processors may include baseband processors, application processors (application processor, AP), modem processors, graphics processors (graphics processing unit, GPU), image signal processors (image signal processor, ISP), controllers, radio frequency codecs, digital signal processors (digital signal processor, DSP), baseband processors, and/or neural network processors (neural-network processing unit, NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more processors. The processor 110 may be, for example, a system on chip (SoC).

Memory 120 may be used to store computer-executable program code that includes instructions. The memory 120 may include a stored program area and a stored data area. The storage program area may store an application program (such as a sound playing function, an image playing function, etc.) required for at least one function of the operating system, etc. The storage data area may store data created during use of the electronic device 100 (e.g., audio data, phonebook, etc.), and so on. In addition, the memory 120 may include a high-speed random access memory, and may also include a nonvolatile memory, such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (universal flash storage, UFS), and the like. The processor 110 performs various functional applications and data processing of the electronic device 100 by executing instructions stored in the memory 120 and/or instructions stored in a memory provided in the processor.

The temperature measurement module 130 may be used to measure temperatures at various locations in the electronic device and send the measured temperatures to the processor 110.

In one example provided by the present application, temperature measurement probes may be provided at multiple locations in the electronic device, respectively, such that the temperature measurement module 130 may measure temperatures at multiple locations of the electronic device. In the embodiment of the present application, the above-mentioned position where the temperature measurement probe is provided is also referred to as a temperature detection point.

Alternatively, the temperature detection point may be a location on the electronic device where temperature control is required or where high temperature is likely to occur, for example, on a housing of the electronic device, on an internal component of the electronic device, for example, on a motherboard, or the like. In one example, some or all of the above temperature detection points are located on the housing of the electronic device to control the housing temperature of the electronic device.

In order to better control the temperature of the shell of the electronic equipment and improve the use experience of a user, the shell of the electronic equipment can be divided into areas, and temperature measuring probes are respectively arranged in a plurality of shell areas according to the divided shell areas, so that a plurality of temperature detection points are arranged on the shell of the electronic equipment. The above-described rule of dividing the shell area is not limited in the embodiment of the present application.

In the following embodiments of the present application, taking an example in which the temperature measurement module 130 includes m temperature measurement probes respectively disposed at m temperature detection points to measure temperatures of the m temperature detection points, the temperature measurement module 130 can measure temperatures of the m temperature detection points in real time, that is, can measure m temperatures. m is a natural number greater than 1.

The heat consumption measurement module 140 is configured to measure a voltage and a current of an internal heat source (hereinafter referred to as a heat source) of the electronic device, send the voltage and the current of each heat source to the processor 110, and accordingly, the processor 110 may calculate a heat consumption of the heat source according to the voltage and the current of the heat source.

The heat source may be selected from components of the electronic device that have relatively high heat consumption and/or have relatively high temperature effects on the m temperature detection points, for example, the heat source may include, but is not limited to: system on chip (SoC), radio frequency power amplifier (rf_pa), wi-Fi module, smart power amplifier (Smart PA), display screen, camera module, power management unit (power management unit, PMU), etc.

Alternatively, the heat consumption measurement module 140 may include several ammeters by which the voltage and current of each heat source are measured.

In the following embodiments of the present application, taking the heat consumption of n heat sources in an electronic device as an example, n is a natural number greater than 1, the heat consumption measurement module 140 may include n current meters, where each current meter corresponds to 1 heat source, and detects the voltage and current of the heat source.

The software system of the electronic device 100 may employ a layered architecture, an event driven architecture, a microkernel architecture, a microservice architecture, or a cloud architecture. In the embodiment of the application, an Android (Android) system with a layered architecture is taken as an example, and a software structure of the electronic device 100 is illustrated.

The layered architecture divides the software into several layers, each with distinct roles and branches. The layers communicate with each other through a software interface. In some embodiments, the Android system is divided into four layers, from top to bottom, an application layer, an application framework layer, an Zhuoyun row (Android run) and system libraries, and a kernel layer, respectively.

The application layer may include several applications.

The application framework layer provides an application programming interface (application programming interface, API) and programming framework for application programs of the application layer. The application framework layer includes a number of predefined functions.

The system library and Android Runtime layer includes a system library and an Android Runtime (Android run). The system library may include a plurality of functional modules. For example: surface manager, two-dimensional graphics engine, three-dimensional graphics processing library (e.g., openGL ES), etc. The two-dimensional graphic engine is used for realizing two-dimensional graphic drawing, image rendering, synthesis, layer processing and the like; the three-dimensional graphic processing library is used for realizing three-dimensional graphic drawing, image rendering, synthesis, layer processing and the like. The android running process is responsible for scheduling and managing an android system and specifically comprises a core library and a virtual machine. The core library comprises two parts: one part is a function required to be called by java language, and the other part is a core library of android; the virtual machine is used for running Android applications developed by using java language.

The kernel layer is a layer between hardware and software.

Referring to fig. 2B, a kernel layer of an electronic device according to an embodiment of the present application may include: temperature measurement drive, heat consumption measurement drive, temperature control module, etc.

The temperature measurement drive is used to drive the temperature measurement module.

The heat rate measurement drive is used to drive the heat rate measurement module.

The temperature control module is used for controlling the temperature according to the temperatures of the m temperature detection points measured by the temperature measurement module in real time and the heat consumption of the n heat sources measured by the heat consumption measurement module in real time.

The configuration shown in fig. 2B is only an example, and in other embodiments provided in the present application, the temperature control module may be disposed in other layers, such as an application layer or an application framework layer. For example, in the embodiment of the present application, the temperature control method may be a service provided by a system application program or a third party application program, and then the temperature control module may be set in an application program layer; alternatively, the temperature control method of the embodiment of the application can be a service provided by a system, and the temperature control module can be arranged on an application framework layer.

Hereinafter, a temperature control method according to an embodiment of the present application will be described with reference to the above-described configuration of the electronic device shown in fig. 2A and 2B.

The performance of temperature control in electronic devices can be affected by thermal test performance. The thermal test is to measure the temperature at which the temperature is balanced, which is related to the ambient temperature, humidity, etc.

Referring to fig. 3A, the thermal test has hysteresis, mainly due to: a thermal resistance exists between the heat source and a temperature detection point (for example, the position of a temperature measurement probe arranged on the shell), and the thermal resistance can obstruct heat transfer, so that a temperature difference exists between the heat source and the temperature detection point; due to the existence of specific heat capacity of the material, heat storage phenomenon exists in the heat transfer process, and the temperature detection point, especially the temperature detection point on the shell of the electronic equipment, is far slower than the heat source inside the electronic equipment in terms of the temperature rising speed; there are many internal heat sources in the electronic device, the heat flow paths of each heat source reaching the temperature detection point are different (thermal resistance and specific heat capacity), and heat exchange can be generated between the heat flow paths.

Because the thermal test has hysteresis, if the temperature of the electronic device is controlled by controlling the frequency of the SoC, and the case temperature reaches the target temperature and then the SoC is controlled to decrease, the case temperature exceeds the target temperature, so in order to be able to control the case temperature to the target temperature, the target temperature of the case temperature cannot be used as the start control temperature, and a temperature lower than the target temperature must be set as the start control temperature, for example, assuming that the target temperature is 35 ℃, the start control temperature is lower than 35 ℃, for example, may be 32 ℃. Moreover, the start control temperature and the target temperature are affected by the hysteresis degree of temperature measurement, the more serious the hysteresis degree is, the lower the start control temperature is, and the lower the start control temperature is, the more the temperature range of the SoC which can normally work is affected.

Therefore, in the temperature control method of the embodiment of the application, the temperatures of m temperature detection points and the heat consumption of n heat sources in the electronic equipment are measured in real time, and the temperature control processing is performed on part or all of the n heat sources according to the temperatures of the m temperature detection points and the heat consumption of the n heat sources, which are obtained by real-time measurement, so that the temperature control of the electronic equipment is realized and the temperature control effect is improved.

Further, in the temperature control method provided by the embodiment of the application, part of the heat sources which have relatively large influence on the temperature at present can be dynamically selected from n heat sources to serve as the target heat source, and the temperature control is only carried out on the target heat source, so that the temperature control in the electronic equipment is more accurate, and the temperature control effect is better.

Fig. 3B is a schematic flow chart of a temperature control method according to an embodiment of the present application, as shown in fig. 3B, the method may include:

step 301: the temperatures of m temperature detection points are obtained.

In connection with the electronic device architecture shown in fig. 2B, this step may be triggered to be performed by a temperature control module in the electronic device.

Alternatively, the temperature measurement drive may drive the temperature measurement module to measure the temperatures of the m temperature detection points, and the temperature control module may acquire the temperatures of the m temperature detection points from the temperature measurement drive.

Optionally, the temperature measurement driver may periodically drive the temperature measurement module to measure the temperatures of the m temperature detection points, and report the temperatures of the m temperature detection points to the temperature control module in real time, where the temperature control module may obtain the temperatures of the m temperature detection points that are received recently; or, in this step, when the temperature control module triggers to obtain the temperatures of the m temperature detection points, the temperature measurement drive is instructed to perform temperature measurement, and after receiving the indication of the temperature control module, the temperature measurement drive may drive the temperature measurement module to measure the temperatures of the m temperature detection points, report the measured temperatures of the m temperature detection points to the temperature control module, and correspondingly, the temperature control module may also obtain the temperatures of the m temperature detection points.

In this step, it is assumed that the time when the temperature control module triggers to acquire the temperatures of the m temperature detection points is t1.

Step 302: and calculating temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points and the target temperature.

The temperature deviation value of each temperature detection point is the deviation value of the temperature detection point relative to the target temperature.

In the embodiment of the application, the set of the temperature deviation values of m temperature detection points is called a temperature control feedforward TDF, the temperature control feedforward TDF can be recorded as an m-dimensional array, and the numerical value in the array is the temperature deviation value of each temperature detection point.

Alternatively, 1 target temperature may be preset in the electronic device as the target temperature of each temperature detection point, that is, m temperature detection points have the same target temperature; or, a corresponding target temperature may be preset for each temperature detection point in the electronic device, and target temperatures corresponding to different temperature detection points may be the same or different.

In one possible implementation, if the electronic device is set with the same target temperature for m temperature detection points The temperature deviation value of each temperature detection point can be the temperature of each temperature detection point and the target temperatureThe calculating the temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points and the target temperature may include: for each temperature detection point, calculating the temperature of the temperature detection point and the target temperatureAs a temperature deviation value of the temperature detection point. At this time, the temperature-controlled feedforward TDF may be recorded as ，Is a temperature detection pointiIs used for the temperature control of the liquid crystal display device,i=1,2,…,m。

in another possible implementation manner, if the electronic device sets the corresponding target temperatures for the m temperature detection points, the temperature deviation value of each temperature detection point may be a difference between the temperature of the temperature detection point and the target temperature corresponding to the temperature detection point, and calculating the temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points and the target temperatures may include: for each temperature detection point, calculating a difference value between the temperature of the temperature detection point and a target temperature corresponding to the temperature detection point as a temperature deviation value of the temperature detection point. At this time, the temperature-controlled feedforward TDF may be recorded as ，/>Is a temperature detection point iThe corresponding target temperature is set to be the target temperature,i=1,2,…,m。

in combination with the electronic device structure shown in fig. 2B, the temperature control module may be preset with the target temperature, and the temperature control module may calculate the temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points obtained from the temperature measurement drive and the preset target temperature.

Step 303: and acquiring the voltage and the current of the n heat sources, and calculating the heat consumption of each heat source according to the voltage and the current of each heat source.

Alternatively, the heat consumption of heat source jThe method can be calculated by the following formula:

wherein,,j=1,2,…,n，is the current of heat source j +.>Is the voltage of the heat source j, tx is a preset value, and the specific value is not limited in the embodiment of the present application. In connection with the electronic device architecture shown in fig. 2B, this step may be triggered to be performed by a temperature control module in the electronic device. Optionally, the temperature control module may obtain real-time voltages and currents of the n heat sources from the heat consumption measurement drive, and calculate heat consumption of each heat source according to the voltages and currents of each heat source, so as to obtain heat consumption of the n heat sources.

Optionally, the heat consumption measurement drive may periodically drive the heat consumption measurement module to measure the voltages and currents of the n heat sources, and report the voltages and currents of the n heat sources to the temperature control module in real time, so that the temperature control module in this step may obtain the voltages and currents of the n heat sources that are received recently; or, in this step, when the temperature control module triggers to obtain the voltages and currents of the n heat sources, the heat consumption measurement drive may be instructed to perform heat consumption measurement, and after receiving the instruction of the temperature control module, the heat consumption measurement drive may drive the heat consumption measurement module to measure the voltages and currents of the n heat sources, report the measured voltages and currents of the n heat sources to the temperature control module, and correspondingly, the temperature control module may also obtain the voltages and currents of the n heat sources.

In this step, it is assumed that the time when the temperature control module triggers to acquire the voltages and currents of the n heat sources is t2.

The time t1 and the time t2 may be the same time, or may be 2 times spaced by not more than a preset time period, and the time t1 may be before or after the time t2. The specific value of the preset time period is not limited in the embodiment of the present application, and in general, the closer the time t1 and the time t2 are separated, that is, the smaller the preset time period is, the more accurate the temperature control in the embodiment of the present application is.

Step 304: and calculating first temperature predicted values of the m temperature detection points according to the temperatures of the m temperature detection points and the heat consumption of the n heat sources.

In the embodiment of the application, the heat source and the temperature detection point may have a corresponding relationship, and optionally, the temperature detection point corresponding to each heat source may be the temperature detection point closest to the heat source, or the temperature detection point where the temperature of the heat source is most easily affected by the temperature change of the heat source. Alternatively, each heat source may correspond to 1 temperature detection point, and each temperature detection point may correspond to 1 or more heat sources.

Optionally, a first temperature rising function corresponding to each temperature detecting point in the m temperature detecting points may be preset in the electronic device, and a variable of the first temperature rising function corresponding to each temperature detecting point may include: the heat consumption of the heat source corresponding to the temperature detection point and the temperature of the temperature detection point; in this step, for each temperature detection point, the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point may be substituted into the first temperature rising function of the temperature detection point, so as to calculate a first temperature prediction value of the temperature detection point. For example, assuming that the heat sources corresponding to the temperature detection point 1 are the heat source 1, the heat source 2, and the heat source 3, the variables of the first temperature rising function of the temperature detection point 1 may include: in this step, the temperature of the temperature detection point 1, the heat consumption of the heat source 2, and the heat consumption of the heat source 3 are substituted into the first temperature rise function of the temperature detection point 1 by the temperature of the temperature detection point 1 at time t1, and the heat consumption of the heat source 1, the heat source 2, and the heat source 3 at time t2, so that the first temperature prediction value of the temperature detection point 1 can be calculated.

In the embodiment of the application, the set of the first temperature predicted values of the m temperature detection points is called first temperature rising feedforward, the first temperature rising feedforward can be recorded as an m-dimensional array, and the numerical value in the array is the first temperature predicted value of each temperature detection point.

The first temperature rising function corresponding to each temperature detecting point can be established in advance through a simulation method and preset in the electronic equipment. Hereinafter, an exemplary method for establishing the first temperature rise function corresponding to each temperature detection point is described.

The first temperature rising function corresponding to each temperature detection point i may include a temperature rising model and a heat dissipation model, where the temperature rising model is used to describe a temperature influence of heat consumption of the heat source corresponding to the temperature detection point i on the temperature detection point i, and the heat dissipation model is used to describe a temperature influence of heat dissipation of the temperature detection point i on the temperature detection point i. For example, the first temperature rise function Y (t) corresponding to each temperature detection point may be implemented by the following formula:

wherein R (Q) is used for representing a temperature rise model of the temperature detection point,and the heat dissipation model is used for representing the temperature detection points.

The temperature rise model and the heat dissipation model of each temperature detection point can be established in advance through a simulation method.

Hereinafter, an exemplary description will be made of a temperature rise model of the temperature detection point.

Assuming that the temperature detection point i corresponds to k heat sources, the heat flow paths of the k heat sources reaching the temperature detection point i (the temperature measurement probe of the temperature detection point i) are different, so that the k heat sources gradually merge at different nodes and finally reach the temperature detection point i, for example, in fig. 4, the temperature detection point i includes 3 heat sources, and the nodes where the 3 heat sources are respectively VF1, VF2, and VF3 are taken as examples, the nodes VF1 and VF2 reach the node VF4 through different paths, merge at the node VF4, then merge with another node VF3 at the node VF5, and finally reach the node VF6, and the node VF6 is the node where the temperature detection point i is located.

Based on the circuit structure similar to that shown in FIG. 4, the equivalent circuit structure between k heat sources and the temperature detection point i can be deduced, and a temperature rise model of the temperature detection point i is established according to the equivalent circuit structure。

Wherein,,temperature of the heat source 1 representing temperature detection point i, +.>Indicating the heat consumption of the heat source 1 +.>Indicating the mass of the node 1 where the heat source 1 is located, < + >>Represents the specific heat capacity of the node 1 where the heat source is located, < ->Represents the heat loss of heat source k-1, +.>Representing the mass of the node k-1 where the heat source k-1 is located,/i>Representing the specific heat capacity of the node k-1 where the heat source k-1 is located, < > >Temperature of heat source k-1 indicating temperature detection point i, +.>Temperature of heat source k representing temperature detection point i, +.>Temperature +.>Radiating speed corresponding to ambient temperature Te +.>Represents the heat loss of the heat source k +.>Is the thermal resistance from node k-1 to node k, < >>Is the quality of node k, +.>Is the specific heat capacity of node k +.>Indicating the mass of temperature detection point i, < >>Represents the specific heat capacity of the temperature detection point i,the comprehensive temperature rise coefficient of the temperature detection point i is shown.

In the above formula, the temperature of the temperature detection point i is dividedOther parameters except the heat consumption of the nodes 1-k can be determined through simulation.

Hereinafter, a heat dissipation model will be exemplarily described.

The heat dissipation model of the temperature detection point i may be, for example:

wherein,,the unit of the heat dissipation capacity of the temperature detection point i can be w; tw represents the temperature of the temperature detection point i, and the unit may be °c; to is ambient temperature, which may be in units of ℃; f is the heat dissipation area of the temperature detection point i, and the unit can be；Is the comprehensive heat exchange coefficient of the temperature detection point i. After the temperature detection point i is determined, the heat dissipation area of the temperature detection point iCertain of the components, such as the components,can be determined by means of simulation.

Heat dissipation capacity at temperature detection point i in incubator environment Is a fixed value, and is calibrated according to temperature rise curve measurementAnd by excitation of different heat sources is obtained exactly +.>Finally, a first temperature rising function corresponding to each temperature detection point can be obtained by utilizing the superposition principle.

In connection with the electronic device architecture shown in fig. 2B, this step may be performed by a temperature control module.

It should be noted that the execution sequence between the steps 302 and 303-304 is not limited.

Step 305: and controlling the temperature of the n heat sources according to the first temperature predicted values and the deviation values of the m temperature detection points.

Alternatively, in this step, the temperature control may be performed on all of the n heat sources, or the temperature control may be performed by selecting a part of the heat sources from the n heat sources. Specific implementation may refer to the following embodiments, which are not described herein.

Optionally, the step may include:

determining a scene feedback value according to the first temperature predicted value and the deviation value of the m temperature detection points;

and controlling the temperature of the target heat source according to the scene feedback value and the heat consumption of the n heat sources.

In connection with the electronic device architecture shown in fig. 2B, this step may be performed by a temperature control module. Optionally, the temperature control module in this step may send the thermal control parameter to the target heat source or the driving of the target heat source, so as to control the target heat source to perform temperature control according to the thermal control parameter.

In the method shown in fig. 3B, temperatures of m temperature detection points and heat consumption of n heat sources are obtained, first temperature prediction values and deviation values of the m temperature detection points are calculated, temperature control of the n heat sources is performed accordingly, and temperature control can be performed on the plurality of heat sources according to relatively more temperature information, so that a relatively better temperature control effect is achieved, compared with the method in which operating frequency of SoC is controlled according to temperatures of 1 temperature detection point.

In another embodiment of the temperature control method provided by the embodiment of the application, the target temperature of the temperature detection point can be associated with the use scene type of the electronic equipment, so that the temperature control of the embodiment of the application can be specific to the use scene type of the electronic equipment, and the temperature control is adapted to the use scene type of the electronic equipment, thereby the temperature control is more targeted, and the accuracy and the control effect of the temperature control are improved.

As shown in fig. 5, with respect to the method shown in fig. 3B, the following steps 501 to 502 may be further included before step 301, and accordingly, the target temperature used in step 301 is the target temperature included in the temperature target information determined according to the usage scenario type of the electronic device.

Step 501: the type of a usage scenario of the electronic device is obtained.

Optionally, the step specifically may include: and acquiring the application currently running by the electronic equipment, and determining the use scene type of the electronic equipment according to the application currently running.

Optionally, the usage scene types corresponding to different applications may be preset in the electronic device, for example, the scene types may include: video call scenes, game scenes, payment scenes, shopping scenes, etc., applications providing video call services may be categorized in video call scenes, applications providing game services may be categorized in game scenes, applications providing electronic payment services may be categorized in payment scenes, applications providing electronic merchant services may be categorized in shopping scenes. Accordingly, the temperature control module can query and obtain the use scene type corresponding to the currently running application as the use scene type of the electronic equipment. For example, if the application currently running in the electronic device is application 1 for providing the service of the electronic device, the usage scenario type corresponding to application 1 may be obtained from the correspondence relationship as a shopping scenario, and it is determined that the usage scenario type of the electronic device is a shopping scenario.

Step 502: and determining temperature control target information according to the type of the use scene of the electronic equipment.

Optionally, temperature control target information corresponding to different usage scenario types may be preset in the electronic device, and in this step, the corresponding relationship may be queried to obtain temperature control target information corresponding to the usage scenario type of the electronic device.

Optionally, a uniform target temperature may be set for all the temperature detection points, and the temperature control target information may include a preset target temperature; alternatively, in order to perform finer temperature control, a corresponding target temperature may be set for each temperature detection point, and then the temperature control target information may include target temperatures corresponding to m different temperature detection points, where the target temperatures corresponding to different temperature detection points may be the same or different.

Optionally, if the temperature detection point is set on the casing of the electronic device, a plurality of casing areas may be obtained by dividing a part or all of the casing of the electronic device in advance, where a dividing rule of the casing areas is not limited, for example, the casing areas may be divided evenly, or irregularly according to a heat source density degree corresponding to the casing, and so on; and respectively determining 1 temperature detection point for setting a temperature measurement probe in the divided shell areas.

Alternatively, when the heat source density corresponding to the shell is irregularly divided, the area with relatively higher heat source density can be divided into the shell areas with relatively smaller area, so as to facilitate finer and more accurate temperature control.

In connection with the electronic device architecture shown in fig. 2B, this step may be performed by a temperature control module. For example, the corresponding relation between different usage scenario types and temperature control target information can be preset in the temperature control module, and then the temperature control module can query the corresponding relation to obtain the temperature control target information corresponding to the usage scenario types of the electronic equipment.

In yet another embodiment of the temperature control method provided in the embodiments of the present application, a possible implementation method of step 305 in the embodiments shown in fig. 3B and fig. 5 is provided.

Taking the embodiment shown in fig. 5 as an example, referring to fig. 6, step 305 may include the following steps 601 to 602.

Step 601: and calculating a scene feedback value according to the first temperature predicted value and the deviation value of the m temperature detection points.

Optionally, the electronic device may preset a weighted value of the first temperature predicted value of each temperature detection point, and the weighted value of the temperature deviation value of each temperature detection point, and correspondingly, in this step, the scene feedback value may be calculated according to the first temperature predicted values, the temperature deviation values, and the weighted values of the m temperature detection points The calculation formula may be, for example:

wherein,,is the first temperature predicted value of the temperature detection point i, < >>Is a weighted value of the first temperature predicted value of the temperature detection point i, li is the first temperature predicted value of the temperature detection point i, ">Is a weighted value of the temperature deviation value of the temperature detection point i.

It can be understood that the above weight values may be set autonomously in practical applications, and embodiments of the present application are not limited.

Step 602: and controlling the temperature of the n heat sources according to the scene feedback values.

Alternatively, referring to fig. 7, the step may include:

step S1: and calculating heat consumption feedback according to the heat consumption and scene feedback values of the n heat sources.

Optionally, the step may include:

calculating the sum of heat consumption of n heat sources：/>；

Calculating the sum of heat consumptionAnd scene feedback value +.>And taking the calculated difference as the heat consumption feedback delta Q.

Wherein the heat consumption feedback Δq may be a positive value, a negative value, or 0.

Step S2: and determining the target heat source according to the temperatures of the m temperature detection points and/or the heat consumption of the n heat sources.

This step may be performed at any time after the temperatures of the m temperature detection points are acquired, and the embodiment of the present application is not limited.

In one possible implementation, the step may include:

acquiring a temperature detection point with the temperature exceeding the target temperature in the m temperature detection points as a target temperature detection point;

and acquiring a heat source corresponding to the target temperature detection point according to the corresponding relation between the heat source and the temperature detection point, and taking the heat source as the target heat source.

In the implementation manner, the target heat source is determined according to the relation between the temperature of the temperature detection point and the target temperature, so that the heat source causing the temperature rise can be determined more accurately, and the temperature control of the heat source in the subsequent step is more accurate.

In a second possible implementation manner, the step may include:

and selecting a preset number of heat sources with the front ranking from the n heat sources as target heat sources according to the ranking of the heat consumption of the n heat sources from high to low, namely selecting a preset number of heat sources with relatively high heat consumption from the n heat sources as target heat sources. The preset number is smaller than n.

For example: assuming n is 5, the preset number is 3, and the heat source sequence from high heat consumption to low heat consumption is as follows: if the heat sources 1, 3, 5, 2, and 4 are selected, 3 heat sources 1, 3, and 5 may be selected as target heat sources.

In the implementation manner, the heat source with the heat consumption arranged in front is used as the target heat source, so that the heat source with the temperature rising can be determined more accurately, and the temperature of the heat source in the subsequent step is controlled more accurately.

In a third possible implementation manner, the step may include:

acquiring a heat source corresponding to the target temperature detection point according to the corresponding relation between the heat source and the temperature detection point, and taking the heat source as a first heat source;

selecting a preset number of heat sources with front sequencing from the n heat sources according to the heat consumption sequencing of the n heat sources as a second heat source;

a common heat source of the first heat source and the second heat source is selected as the target heat source.

For example: the first heat source is assumed to include: heat source 1, heat source 2, and heat source 3, while the second heat source comprises: the heat source 2, the heat source 3 and the heat source 5, then the common heat source of the first heat source and the second heat source is the heat source 2 and the heat source 3, and the heat source 2 and the heat source 3 are the target heat sources.

In the implementation manner, the heat source causing the temperature rise of the temperature detection point, namely the target heat source, is accurately screened out from the heat sources according to the heat consumption sequence of the heat sources and whether the corresponding temperature exceeds the target temperature, so that the temperature control of the heat source in the subsequent step is more accurate.

Step S3: and determining the thermal control parameters of the target heat source according to the heat consumption feedback.

Optionally, an adjustment policy of the thermal control parameter of each target heat source based on the heat consumption feedback may be preset, and in this step, the thermal control parameter of the second target heat source may be determined according to the adjustment policy of the thermal control parameter of the target heat source based on the heat consumption feedback. Alternatively, the adjustment strategy of each thermal control parameter may be a function taking the heat consumption feedback as a variable, and the specific implementation of the function is not limited by the embodiment of the present application. Optionally, other variables, such as the current parameter value of the thermal control parameter, etc., may be included in the function corresponding to each thermal control parameter.

Alternatively, if the heat consumption feedback is a positive number, the heat control parameter of the target heat source may be adjusted in a direction such that the heat consumption of the target heat source is reduced.

Alternatively, if the heat consumption feedback is 0, the target heat source may not be subjected to the heat control process, that is, the heat control parameter of the target heat source may be kept unchanged;

alternatively, if the heat consumption feedback is 0 as a negative number, the heat control parameter of the target heat source may be maintained unchanged, or may be adjusted in a direction such that the heat consumption of the target heat source increases.

For example:

if the target heat source is a SoC, the thermal control parameters of the SoC may include: the number of cores, the highest operating frequency, the operating time and the like can be reduced when the delta Q is a positive value, so that the heat consumption of the SoC is reduced, and the number of cores and/or the highest operating frequency and/or the operating time and the like of the SoC can be improved when the delta Q is a negative value, so that the working efficiency of the SoC is improved.

If the target heat source is RF_PA, the thermal control parameters of RF_PA may include: the transmission power, the transmission time and the like can be reduced when the delta Q is positive, so that the heat consumption of the RF_PA is reduced, and the transmission power and/or the transmission time and the like of the RF_PA can be improved when the delta Q is negative, so that the working efficiency of the RF_PA is improved.

If the target heat source is Wi-Fi, the thermal control parameters of Wi-Fi may include: transmitting power, transmitting time, communication rate and the like, when delta Q is positive, the transmitting power, transmitting time, communication rate and the like of Wi-Fi can be reduced, so that the heat consumption of Wi-Fi is reduced, and when delta Q is negative, the transmitting power, transmitting time, communication rate and the like of Wi-Fi can be improved, so that the working efficiency of Wi-Fi is improved.

If the target heat source is Smart PA, the thermal control parameters of Smart PA may include: volume, etc., when Δq is positive, volume, etc., of Smart PA may be reduced, so that heat consumption of Smart PA is reduced, and when Δq is negative, volume, etc., of Smart PA may be increased, so as to improve playback effect of Smart PA.

If the target heat source is an organic light emitting diode (organic light-EmittingDiode, OLED) display, the thermal control parameters of the OLED display may include: brightness, refresh rate, resolution, etc., when Δq is positive, the brightness and/or refresh rate and/or resolution, etc. of the OLED display screen may be reduced, so that the heat consumption of the OLED display screen may be reduced, and when Δq is negative, the brightness and/or refresh rate and/or resolution, etc. of the OLED display screen may be improved, so as to improve the working efficiency of the OLED display screen.

Step S4: and controlling the temperature of the target heat source according to the thermal control parameters of the target heat source.

In combination with the electronic device structure shown in fig. 2B, the temperature control module may transmit the thermal control parameter of the target heat source to the target heat source or the driving of the target heat source, so as to implement temperature control of the target heat source, for example, if the target heat source includes an SoC, the temperature control module may send the thermal control parameter of the SoC to the SoC; if the target heat source comprises an OLED display screen, the temperature control module may send thermal control parameters of the OLED display screen to the display driver.

Referring to fig. 8, a control principle structure diagram of the temperature control method shown in fig. 5 is shown, as shown in fig. 8, temperature control feedforward is determined according to temperature of a temperature detection point and temperature control target information, temperature rise feedforward is determined according to heat consumption of a heat source and temperature of the temperature detection point, scene feedback values are determined according to the temperature rise feedforward and the temperature control feedforward, and temperature control of the heat source is performed according to the scene feedback values, so that temperature control is performed by adopting a closed-loop control model, heat consumption of the heat source can be controlled more accurately, temperature control of electronic equipment is more accurate, and control effect is better.

In yet another embodiment of the temperature control method provided in the embodiment of the present application, another possible implementation method of step 305 in the embodiment shown in fig. 3B and fig. 5 is provided.

Taking the embodiment shown in fig. 5 as an example, referring to fig. 9, step 305 may include the following steps 901 to 903.

Step 901: and calibrating the first temperature predicted values of the m temperature detection points according to the temperatures of the m temperature detection points to obtain second temperature predicted values.

Optionally, the step may include:

for each temperature detection point, carrying out parameter calibration on a first temperature rise function of the temperature detection point according to the temperature of the temperature detection point and a first temperature prediction value to obtain a second temperature rise function of the temperature detection point;

And calculating a second temperature predicted value of the temperature detection point by using a second temperature rising function of the temperature detection point according to the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point.

It can be understood thatHere, in performing parameter calibration of the first temperature rise function, the parameter (hereinafter referred to as parameter to be calibrated) of the required calibration may be a parameter other than the temperature at the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point in the first temperature rise function, other than the determined parameter such as specific heat capacity, mass, thermal resistance, and the like. For example, in the foregoing exemplary first temperature rise function, the parameters to be calibrated may include: the integrated temperature rise coefficient of each temperature detection point (e.g. the coefficient of the temperature detection point i described above) Ambient temperature to.

In one possible implementation manner, for each temperature detection point, parameter calibration is performed on a first temperature rising function of the temperature detection point according to the temperature of the temperature detection point and a first temperature prediction value, and the method may include:

and for each temperature detection point, calculating the temperature offset of the temperature detection point according to the temperature of the temperature detection point and the first temperature predicted value, calculating the parameter value of the parameter to be calibrated in the first temperature rise function according to the temperature offset, setting the parameter value of the parameter to be calibrated in the first temperature rise function as the parameter value obtained by calculation, and thus completing the parameter calibration of the first temperature rise function and obtaining the second temperature rise function.

Alternatively, the temperature offset may be a positive value, a negative value, or 0. The calibration strategy of the parameter to be calibrated in the first temperature rise function based on the temperature offset can be preset in the electronic equipment, so that the parameter value of the parameter to be calibrated in the first temperature rise function can be calculated according to the temperature offset and the calibration strategy corresponding to the parameter to be calibrated in the step.

Alternatively, the calibration strategy for each parameter may include a function that is a function of the temperature offset, or a function that is a function of the temperature offset and the current parameter value for that parameter, etc.

By the coefficient of the temperature detection point iFor example, based on the foregoing example +.>Formula of (2), coefficient>The larger the size of the container,the larger the corresponding first temperature prediction value is, the larger the coefficient can be lowered when the temperature offset is positive>When the temperature offset is negative, the coefficient +.>When the temperature offset is 0, the coefficient +.>Unchanged, the above-mentioned reduction coefficient->And increase the coefficient->The specific magnitude of (2) can be determined based on the temperature offset, for example, when the temperature offset is positive, the larger the temperature offset is, the coefficient +.>The larger the decrease amplitude of (2), the smaller the temperature offset, the coefficient +.>The smaller the decrease in amplitude.

Taking the above-mentioned ambient temperature to as an example, based on the above-mentioned exampleThe greater the ambient temperature to +.>The smaller the corresponding first temperature prediction value is, the larger,therefore, when the temperature offset is positive, the ambient temperature to can be reduced, when the temperature offset is negative, the ambient temperature to can be increased, when the temperature offset is 0, the ambient temperature to can be kept unchanged, the specific amplitude of the reduced ambient temperature to and the increased ambient temperature to can be determined based on the temperature offset, for example, when the temperature offset is positive, the larger the temperature offset, the larger the amplitude of the reduced ambient temperature to, the smaller the temperature offset, the smaller the amplitude of the reduced ambient temperature to, and when the temperature offset is negative, the adjustment mode is similar, and the aim is to calculate the second temperature rising function to obtain the temperature of which the second temperature predicted value is close to the temperature detection point.

Optionally, the calculating the second temperature predicted value of the temperature detection point according to the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point by using the second temperature rising function of the temperature detection point may include: substituting the temperature of each temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point into a second temperature rise function corresponding to the temperature detection point, and calculating to obtain a second temperature predicted value of each temperature detection point.

In the embodiment of the application, the set of the second temperature predicted values of the m temperature detection points is called second temperature rise feedforward, and the second temperature rise feedforward can be recorded as an m-dimensional array.

Step 902: and determining a scene feedback value according to the second temperature predicted value and the deviation value of the m temperature detection points.

An implementation of this step may refer to step 601, with the main difference that the first temperature predictor in step 601 is replaced by the second temperature predictor in this step.

Step 903: and controlling the temperature of the n heat sources according to the scene feedback values.

The implementation of this step may refer to step 602, which is not described here in detail.

In the method shown in fig. 9, although the temperature balance result of the temperature detection point cannot be obtained in a short time, the curve of the temperature detection point at the time of excitation can be obtained, so that the method can be used for calibrating the first temperature rising function, and since the heat consumption and the temperature of the heat source are both measured in real time, the first temperature rising function of the temperature detection point is calibrated by using the real-time heat consumption and the real-time temperature, and the finally calculated second temperature rising feedforward contains two important information, namely the temperature at the time of temperature balance and the time of reaching the temperature balance, as shown in fig. 10, the influence of the continuous change of the heat dissipation condition of the electronic equipment, such as the heat dissipation condition of the surface of the shell, can be eliminated through the feedback closed loop by calculating the scene feedback value through the second temperature rising feedforward.

The temperature control feedforward records the temperature deviation value of each temperature detection point, namely the deviation value of the temperature and the target temperature, and calculates the scene feedback value according to the temperature control feedforward, and the real-time temperature of each temperature detection point in the embodiment of the application is difficult to exceed the target temperature because the heat consumption of the heat source is the result of closed-loop control, thereby accurately controlling the temperature and improving the temperature control effect.

Referring to fig. 11, a control principle structure diagram of the temperature control method shown in fig. 9 is shown, as shown in fig. 11, temperature control feedforward is determined according to the temperature of a temperature detection point and a target temperature, first temperature rise feedforward is determined according to the heat consumption of a heat source and the temperature of the temperature detection point, the first temperature rise feedforward is calibrated to be second temperature rise feedforward, a scene feedback value is determined according to the second temperature rise feedforward and the temperature control feedforward, heat consumption feedback is determined according to the heat consumption of the heat source and the scene feedback value, and the temperature of the heat source is controlled according to the heat consumption feedback, so that the temperature control of the electronic equipment by adopting a three-layer closed-loop control model is realized, the heat consumption of the heat source can be controlled more accurately, the temperature control of the electronic equipment is more accurate, and the control effect is better.

The embodiment of the application also provides electronic equipment which comprises a processor and a memory, wherein the processor is used for executing the method provided by any embodiment of the application.

Embodiments of the present application also provide a computer-readable storage medium having a computer program stored therein, which when run on a computer causes the computer to perform the method provided by any of the embodiments of the present application.

Embodiments of the present application also provide a computer program product comprising a computer program which, when run on a computer, causes the computer to perform the method provided by any of the embodiments of the present application.

In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "and/or", describes an association relation of association objects, and indicates that there may be three kinds of relations, for example, a and/or B, and may indicate that a alone exists, a and B together, and B alone exists. Wherein A, B may be singular or plural. The character "/" generally indicates that the context-dependent object is an "or" relationship. "at least one of the following" and the like means any combination of these items, including any combination of single or plural items. For example, at least one of a, b and c may represent: a, b, c, a and b, a and c, b and c or a and b and c, wherein a, b and c can be single or multiple.

Those of ordinary skill in the art will appreciate that the various elements and algorithm steps described in the embodiments disclosed herein can be implemented as a combination of electronic hardware, computer software, and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In several embodiments provided by the present application, any of the functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-Only Memory (hereinafter referred to as ROM), a random access Memory (Random Access Memory) and various media capable of storing program codes such as a magnetic disk or an optical disk.

The foregoing is merely exemplary embodiments of the present application, and any changes or substitutions that may be easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. The protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A temperature control method, characterized by being applied to an electronic device, the method comprising:

acquiring the temperatures of m temperature detection points and the heat consumption of n heat sources; m is a natural number greater than 1, n is a natural number greater than 1; the heat consumption of the heat source is calculated according to the voltage and the current of the heat source;

for each temperature detection point in the m temperature detection points, calculating a first temperature predicted value of each temperature detection point by using a preset first temperature rising function of each temperature detection point according to the temperature of each temperature detection point and the heat consumption of a heat source corresponding to each temperature detection point; determining temperature deviation values of the m temperature detection points according to the temperatures of the m temperature detection points, wherein the temperature deviation value of each of the m temperature detection points is used for indicating the difference value between the temperature of each temperature detection point and the target temperature of each temperature detection point;

Determining a target heat source from the n heat sources according to the temperatures of the m temperature detection points and/or the heat consumption of the n heat sources;

and controlling the temperature of the target heat source according to the first temperature predicted value and the temperature deviation value of the m temperature detection points.

2. The method of claim 1, wherein the temperature controlling the target heat source according to the first temperature prediction value and the temperature deviation value of the m temperature detection points comprises:

determining a first feedback value according to the first temperature predicted values of the m temperature detection points and the temperature deviation values;

and controlling the temperature of the target heat source according to the first feedback value and the heat consumption of the n heat sources.

3. The method of claim 2, wherein the determining a first feedback value from the first temperature prediction value of the m temperature detection points and the temperature deviation value comprises:

calibrating first temperature predicted values of the m temperature detection points according to the temperatures of the m temperature detection points to obtain second temperature predicted values of the m temperature detection points;

and determining a first feedback value according to the second temperature predicted value and the temperature deviation value.

4. The method of claim 1, wherein the predetermined first temperature rise function for each temperature detection point comprises: the temperature rise model and the heat dissipation model of each temperature detection point; the temperature rise model of each temperature detection point is used for describing the influence of the heat consumption of the corresponding heat source of each temperature detection point on the temperature of each temperature detection point, and the heat dissipation model of each temperature detection point is used for describing the influence of heat dissipation of each temperature detection point on the temperature of each temperature detection point.

5. A method according to claim 3, wherein calibrating the first temperature prediction value of the m temperature detection points according to the temperature of the m temperature detection points to obtain the second temperature prediction value of the m temperature detection points comprises:

and calculating a second temperature predicted value of the temperature detection point by using a second temperature rise function of the temperature detection point according to the temperature of the temperature detection point and the heat consumption of the heat source corresponding to the temperature detection point.

6. The method according to any one of claims 1 to 5, wherein said determining a target heat source from said n heat sources based on the temperatures of said m temperature detection points and/or the heat consumptions of said n heat sources comprises:

selecting a first number of heat sources with heat consumption sequences being front from the n heat sources as the target heat sources according to the heat consumption sequences of the n heat sources; or,

selecting a temperature detection point with the temperature exceeding a target temperature from the m temperature detection points as a target temperature detection point, and taking a heat source corresponding to the target temperature detection point as the target heat source; or,

selecting a second number of heat sources with heat consumption sequences being front from the n heat sources as a first heat source according to the heat consumption sequences of the n heat sources; selecting a temperature detection point with the temperature exceeding a target temperature from the m temperature detection points as a target temperature detection point, and taking a heat source corresponding to the target temperature detection point as a second heat source; and determining the coincident heat source in the first heat source and the second heat source as the target heat source.

7. The method according to any one of claims 1 to 5, further comprising:

determining a usage field Jing Leixing of the electronic device;

And determining the target temperatures of the m temperature detection points according to the use scene type of the electronic equipment.

8. The method of claim 7, wherein the determining the type of usage scenario of the electronic device comprises:

acquiring an application currently operated by the electronic equipment;

and determining the use scene type corresponding to the application currently running by the electronic equipment as the use scene type of the electronic equipment.

9. The method of claim 2, wherein said temperature controlling the target heat source based on the first feedback value and the heat consumptions of the n heat sources comprises:

calculating the difference value between the sum of the heat consumptions of the n heat sources and the first feedback value to obtain a second feedback value;

determining a thermal control parameter of the target heat source according to the second feedback value; when the second feedback value is a positive value, the thermal control parameter of the target heat source is used for reducing the heat consumption of the target heat source;

and controlling the temperature of the target heat source according to the thermal control parameters of the target heat source.

10. The method of any one of claims 1 to 5, wherein at least some of the m temperature detection points are located on a housing of the electronic device.

11. An electronic device, comprising:

a processor, a memory; wherein one or more computer programs are stored in the memory, the one or more computer programs comprising instructions, which when executed by the processor, cause the electronic device to perform the method of any of claims 1-10.

12. A computer readable storage medium, characterized in that the computer readable storage medium has stored therein a computer program which, when run on a computer, causes the computer to perform the method of any of claims 1 to 10.