CN115178851A - Lead frame welding method - Google Patents
Lead frame welding method Download PDFInfo
- Publication number
- CN115178851A CN115178851A CN202210833717.9A CN202210833717A CN115178851A CN 115178851 A CN115178851 A CN 115178851A CN 202210833717 A CN202210833717 A CN 202210833717A CN 115178851 A CN115178851 A CN 115178851A
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- CN
- China
- Prior art keywords
- lead frame
- welding
- carrier
- soldering
- head
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
Abstract
The invention provides a lead frame welding method, which comprises the following steps: s1, fixing a welding area of a lead frame to be welded above a welding area of a carrier and abutting against the carrier; s2, moving a welding head to the position above a welding area of the lead frame; s3, continuously pressing the welding head, monitoring the real-time pressure value of the welding head in the pressing process, and judging whether the real-time pressure value is smaller than a preset pressure value: if yes, returning to the step S3; if not, turning to the step S4; and S5, stopping pressing down the welding head and releasing vibration energy, wherein the vibration energy is transmitted to the lead frame through the welding head so as to generate high-speed vibration friction between the welding area of the lead frame and the welding area of the carrier for welding. The method has the advantages that the welding head is controlled to release vibration energy to weld the lead frame welding layer and the carrier welding layer, welding material media harmful to the environment cannot be generated, the welding speed is higher than that of reflow welding, and the production efficiency is higher.
Description
Technical Field
The invention relates to the technical field of lead frame welding, in particular to a lead frame welding method.
Background
At present, the connection between the lead frame and the carrier of the intelligent power module product is mainly realized through a reflow soldering process, the soldering material comprises solder paste, a solder sheet and the like, the soldering process utilizes the low melting point characteristic and the conductive characteristic of the soldering material, and the soldering process is cured after being heated by a reflow oven to realize the joint conduction between the lead frame and the carrier, but the following problems still exist at present:
1. excessive control factors such as temperature and humidity of a reflow oven, reflow atmosphere, solder quality and the like exist in the reflow process, so that the reflow process is easy to interfere and difficult to control;
2. less solder residues are generated after reflow soldering, the surface of a product is polluted, and larger tin balls can directly cause chip scrap and reduce the yield;
3. the product after reflow soldering generally has a pore phenomenon after soldering due to the reasons of insufficient welding flux deposition, poor coplanarity and the like, and the soldering quality is difficult to control;
4. the production speed of reflow soldering is limited by the number of devices, and the pursuit of higher yields for the same process means a rise in the cost of the devices.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a lead frame welding method, which specifically comprises the following steps:
s1, fixing a welding area of a lead frame to be welded above a welding area of a carrier and abutting against the carrier;
s2, moving a welding head to the position above the welding area of the lead frame;
s3, continuously pressing down the welding head, monitoring a real-time pressure value of the welding head in the pressing down process, and judging whether the real-time pressure value is smaller than a preset pressure value:
if yes, returning to the step S3;
if not, turning to the step S4;
and S3, stopping pressing the welding head and releasing vibration energy, wherein the vibration energy is transmitted to the lead frame through the welding head so as to generate high-speed vibration friction between the welding area of the lead frame and the welding area of the carrier for welding.
Preferably, an ultrasonic generator and a transducer connected to the ultrasonic generator are disposed in the welding head, and in step S4, after the welding head stops being pressed down, the ultrasonic energy released by the ultrasonic generator is converted into the vibration energy by the transducer, and is transmitted to the lead frame through the welding head.
Preferably, the lead frame is made of aluminum, and the carrier is made of copper.
Preferably, in step S3, high-speed vibration friction is generated between the lead frame and the carrier to achieve intermolecular fusion of aluminum and copper, thereby completing welding.
Preferably, the material of the welding head is high-hardness brittle alloy.
Preferably, in the step S1, the carrier is adsorbed and fixed by a vacuum adsorption jig, and a vacuum value of the vacuum adsorption jig for adsorbing the carrier is less than-85 Kpa.
Preferably, in step S1, when the soldering region of the lead frame is fixed above the soldering region of the carrier in step S1, a total tolerance between the soldering region of the lead frame and the soldering region of the carrier on a horizontal plane is less than 0.1mm, and a total tolerance on a vertical plane is less than 0.02mm.
Preferably, in the step S1, a clamp pressing claw is controlled by a servo motor to clamp and fix the lead frame body to be welded, and the clamp pressing claw is controlled to drive the welding area of the lead frame to move to a position above the welding area of the carrier.
The technical scheme has the following advantages or beneficial effects:
(1) The method abandons a reflow furnace, only controls the butt joint, and has simpler control logic;
(2) According to the method, welding materials are not used for welding, the welding head is controlled to release vibration energy to weld the lead frame welding layer and the carrier welding layer, welding material media harmful to the environment cannot be generated, the welding speed is higher than that of reflow welding, and the production efficiency is higher;
(3) The method does not use welding materials for welding, and does not have the air hole phenomenon;
(4) The method only needs to use the production equipment of the welding head, the number is not limited, and the cost is lower.
Drawings
FIG. 1 is a flow chart of the steps of the method according to the preferred embodiment of the present invention;
FIG. 2 is a schematic diagram of a lead frame during bonding according to a preferred embodiment of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. The present invention is not limited to the embodiment, and other embodiments may be made within the scope of the present invention as long as the gist of the present invention is satisfied.
In the preferred embodiment of the present invention, based on the above problems in the prior art, a method for bonding a lead frame is provided, as shown in fig. 1 and 2, which specifically includes the following steps:
s1, fixing a welding area of a lead frame 1 to be welded above a welding area of a carrier 2 and abutting against the carrier 2;
s2, moving a welding head 3 to the upper part of the welding area of the lead frame 1;
step S3, continuously pressing the welding head 3, monitoring a real-time pressure value of the welding head 3 in the pressing process, and judging whether the real-time pressure value is smaller than a preset pressure value:
if yes, returning to the step S3;
if not, turning to the step S4;
and S4, stopping pressing the welding head 3 and releasing vibration energy, wherein the vibration energy is transmitted to the lead frame 1 through the welding head 3, so that high-speed vibration friction is generated between the welding area of the lead frame 1 and the welding area of the carrier 2 for welding.
Specifically, in this embodiment, when the current lead frame and the carrier 2 are connected and conducted by heating in a reflow oven, the reflow process is easily interfered and difficult to control, and less solder residues are generated after reflow soldering, so that the surface of the product is polluted and the quality of the product is affected, therefore, the reflow oven is abandoned in the lead frame 1 soldering method in this embodiment, and the vibration energy is released by the soldering head 3 to generate high-speed vibration friction between the soldering area of the lead frame 1 and the soldering area of the carrier 2 for soldering, so that the problem caused by reflow soldering can be avoided.
Specifically, in this embodiment, the soldering head 3 is controlled by the servo motor, and continues to be pressed down after the soldering head 3 contacts the surface of the lead frame 1, and stops pressing down after the real-time pressure value reaches the preset pressure value, at this time, the gap between the lead frame 1, the carrier 2 and the soldering head 3 is completely eliminated, the soldering head 3 releases vibration energy and conducts the vibration energy between the lead frame 1 and the carrier 2, and the lead frame 1 and the carrier 2 generate high-frequency vibration friction under the action of the vibration energy to perform soldering.
In the preferred embodiment of the present invention, an ultrasonic generator and an energy converter connected to the ultrasonic generator are disposed in the welding head 3, and after the welding head 3 is stopped to be pressed in step S4, the ultrasonic energy released by the ultrasonic generator is converted into vibration energy by the energy converter, and the vibration energy is transmitted to the lead frame 1 through the welding head 3.
In a preferred embodiment of the present invention, the lead frame 1 is made of aluminum, and the carrier 2 is made of copper.
Specifically, in the present embodiment, the lead frame 1 is made of aluminum, and the carrier 2 is made of copper, so that friction and heat fusion are easier during the welding process.
In the preferred embodiment of the present invention, in step S4, high-speed vibration friction is generated between the lead frame 1 and the carrier 2 to achieve intermolecular fusion of aluminum and copper, thereby completing the welding.
In a preferred embodiment of the present invention, the material of the welding head 3 is a brittle alloy with high hardness.
Specifically, in this embodiment, the welding head 3 made of the high hardness brittle alloy does not react with the copper material and the aluminum material during the welding process, which is beneficial to reducing the loss of the welding head 3 and the metal debris contamination on the welding surface.
In a preferred embodiment of the present invention, in step S1, the fixing carrier 2 is adsorbed by a vacuum adsorption fixture, and the vacuum value of the vacuum adsorption fixture for adsorbing the fixing carrier 2 is less than-85 Kpa.
In a preferred embodiment of the present invention, in step S1, when the soldering region of the lead frame is fixed above the soldering region of the carrier, a total tolerance between the soldering region of the lead frame and the soldering region of the carrier on a horizontal plane is less than 0.1mm, and a total tolerance on a vertical plane is less than 0.02mm.
In a preferred embodiment of the present invention, in step S1, the clamp pressing claw is controlled by the servo motor to clamp and fix the lead frame to be welded, and the clamp pressing claw is controlled to drive the welding area of the lead frame 1 to move to above the welding area of the carrier 2.
Specifically, in this embodiment, the lead frame 1 can be fixed by a plurality of clamp pressing claws, and the carrier 2 is fixed by a vacuum adsorption clamp, so that when the welding head 3 is pressed down, the displacement between the lead frame 1 and the carrier 2 is reduced to the maximum extent, the static friction between the lead frame 1 and the carrier 2 is ensured, and the energy loss is effectively reduced.
Specifically, in this embodiment, the displacement between the lead frame 1 and the carrier 2 can be further reduced by controlling the total tolerance on the horizontal plane and the vertical plane of the lead frame 1 and the carrier 2, and the welding effect is improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention.
Claims (8)
1. A lead frame welding method is characterized by comprising the following steps:
the method comprises the following steps that S1, a welding area of a lead frame to be welded is fixed above a welding area of a carrier and is abutted to the carrier;
s2, moving a welding head to the position above the welding area of the lead frame;
s3, continuously pressing the welding head, monitoring a real-time pressure value of the welding head in the pressing process, and judging whether the real-time pressure value is smaller than a preset pressure value:
if yes, returning to the step S3;
if not, turning to the step S4;
and S4, stopping pressing the welding head and releasing vibration energy, wherein the vibration energy is transmitted to the lead frame through the welding head so as to generate high-speed vibration friction between the welding area of the lead frame and the welding area of the carrier for welding.
2. The method as claimed in claim 1, wherein an ultrasonic generator and a transducer connected to the ultrasonic generator are disposed in the bonding head, and the ultrasonic energy released from the ultrasonic generator is converted into the vibration energy by the transducer after the bonding head is stopped to be pressed in step S4, and then transmitted to the lead frame through the bonding head.
3. The method of claim 1, wherein the leadframe is made of aluminum and the carrier is made of copper.
4. The lead frame soldering method according to claim 3, wherein in step S4, high-speed vibration friction is generated between the lead frame and the carrier to achieve intermolecular fusion of aluminum and copper, thereby completing the soldering.
5. The lead frame soldering method according to claim 1, wherein the material of the soldering tip is a brittle alloy having a high hardness.
6. The lead frame soldering method according to claim 1, wherein in the step S1, the carrier is fixed by suction with a vacuum chuck having a vacuum value of less than-85 Kpa.
7. The lead frame soldering method according to claim 1, wherein in the step S1, when the soldering region of the lead frame is fixed above the soldering region of the carrier, the total tolerance between the soldering region of the lead frame and the soldering region of the carrier is less than 0.1mm in a horizontal plane and less than 0.02mm in a vertical plane.
8. The lead frame welding method according to claim 1, wherein in the step S1, a clamp pressing claw is controlled by a servo motor to clamp and fix the lead frame body to be welded, and the clamp pressing claw is controlled to drive the welding area of the lead frame to move to the position above the welding area of the carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210833717.9A CN115178851A (en) | 2022-07-15 | 2022-07-15 | Lead frame welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210833717.9A CN115178851A (en) | 2022-07-15 | 2022-07-15 | Lead frame welding method |
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| Publication Number | Publication Date |
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| CN115178851A true CN115178851A (en) | 2022-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210833717.9A Pending CN115178851A (en) | 2022-07-15 | 2022-07-15 | Lead frame welding method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025078A (en) * | 2001-07-10 | 2003-01-28 | Dowa Mining Co Ltd | Copper, copper-base alloy and method of manufacturing the same |
| US20110260304A1 (en) * | 2008-10-13 | 2011-10-27 | Tyco Electronics Amp Gmbh | Leadframe for electronic components |
| CN103732346A (en) * | 2011-08-19 | 2014-04-16 | 日立汽车系统株式会社 | Friction stir welding structure and power semiconductor device |
| CN112382580A (en) * | 2020-11-10 | 2021-02-19 | 周宗涛 | Method for manufacturing intelligent label chip molding packaging module through gold-tin eutectic welding and application of method |
| CN214477423U (en) * | 2021-02-05 | 2021-10-22 | 嘉兴斯达半导体股份有限公司 | IPM module using ultrasonic welding lead frame |
-
2022
- 2022-07-15 CN CN202210833717.9A patent/CN115178851A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025078A (en) * | 2001-07-10 | 2003-01-28 | Dowa Mining Co Ltd | Copper, copper-base alloy and method of manufacturing the same |
| US20110260304A1 (en) * | 2008-10-13 | 2011-10-27 | Tyco Electronics Amp Gmbh | Leadframe for electronic components |
| CN103732346A (en) * | 2011-08-19 | 2014-04-16 | 日立汽车系统株式会社 | Friction stir welding structure and power semiconductor device |
| CN112382580A (en) * | 2020-11-10 | 2021-02-19 | 周宗涛 | Method for manufacturing intelligent label chip molding packaging module through gold-tin eutectic welding and application of method |
| CN214477423U (en) * | 2021-02-05 | 2021-10-22 | 嘉兴斯达半导体股份有限公司 | IPM module using ultrasonic welding lead frame |
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