CN115175438A - Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method - Google Patents

Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method Download PDF

Info

Publication number
CN115175438A
CN115175438A CN202210776659.0A CN202210776659A CN115175438A CN 115175438 A CN115175438 A CN 115175438A CN 202210776659 A CN202210776659 A CN 202210776659A CN 115175438 A CN115175438 A CN 115175438A
Authority
CN
China
Prior art keywords
micro
printed circuit
circuit board
channel
cantilever
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210776659.0A
Other languages
Chinese (zh)
Inventor
温杰
来晋明
王海龙
张剑
徐诺心
曾策
何腾龙
王超杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 29 Research Institute
Original Assignee
CETC 29 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 29 Research Institute filed Critical CETC 29 Research Institute
Priority to CN202210776659.0A priority Critical patent/CN115175438A/en
Publication of CN115175438A publication Critical patent/CN115175438A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes

Abstract

The invention relates to the technical field of microelectronic packaging, and particularly discloses a micro-channel embedded printed circuit board-based microwave assembly and an airtight packaging method. The microwave assembly comprises a metal packaging box body, a printed circuit board which is arranged in the metal packaging box body and is provided with a micro-channel, and a cantilever which is integrated with the printed circuit board and is communicated with the micro-channel; one end of the cantilever is integrally connected with the printed circuit board, and the other end of the cantilever penetrates through the metal packaging box body and is positioned on the outer side of the metal packaging box body; the cantilever is provided with a liquid inlet and a liquid outlet which are communicated with the micro-channel and are positioned outside the metal packaging box body. And a method of hermetically encapsulating a microwave assembly. The invention can effectively realize the integrated integration of the printed circuit board and the metal packaging structure and realize the airtight packaging; the heat dissipation device has good heat dissipation capacity and can realize the transmission of high-density electric signals; and can realize low flow resistance and uniform heat dissipation.

Description

Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method
Technical Field
The invention relates to the technical field of microelectronic packaging, in particular to a microwave assembly based on a micro-channel embedded printed circuit board and an airtight packaging method.
Background
With the wide application of the third generation semiconductor technology represented by GaN and the further increase of the integration density of electronic systems, the emission power of microwave components is increasing, the self-heating effect of power devices is becoming more prominent, and the thermal management problem has gradually become a technical bottleneck restricting the development of electronic systems. The traditional passive heat dissipation technology based on heat dissipation of the heat sink and the packaging box body cannot meet the heat dissipation requirement of a high-power device, and the heat management technology for enhancing heat dissipation by utilizing micro cooling fluid becomes an important solution.
The traditional high-power microwave component adopts a penetrating liquid cooling technology based on micro cooling fluid to realize high-efficiency heat dissipation, namely, liquid cooling micro channels are directly integrated in a metal packaging box body, a plurality of circuit substrates are installed and integrated on two sides of the box body, and electrical signals on the front side and the back side of the box body are interconnected by using a feed insulator. The integration mode has the characteristics of simple integration structure and excellent heat dissipation performance; however, the feed insulator occupies more box area, which limits the improvement of the integration density of the assembly.
The printed circuit board is a general electronic system substrate, is a provider of electrical connection of electronic components, and is an important carrier for realizing high-density integration of electronic systems. The traditional printed circuit board mainly comprises an organic dielectric layer and a copper wiring layer, and the requirement of high-density integration of a high-power device is difficult to meet due to the low thermal conductivity (generally less than 1W/m.K) of an organic material.
Chinese patent ZL202110118888.9 proposes a printed circuit board with embedded micro-channels and a method for making the same, which combines the micro-channel heat dissipation technology with the high density integrated technology of the printed circuit board to realize high heat flux density heat dissipation. However, this patent does not relate to a metal encapsulation structure and does not constitute a microwave assembly.
Conventional printed circuit boards utilize printed circuit board surface mount technology for packaging devices to achieve high density integration. However, for high power chips, in order to achieve their efficient heat dissipation, the thermal resistance at the package interface must be removed as much as possible. Direct integration of bare chips on the surface of micro-channels in printed circuit boards is one of the most effective methods for low thermal resistance integration. This puts higher demands on the package process of the components based on the embedded micro-channel printed circuit board. Particularly, for the application field of high-reliability packaging with air tightness requirement, the development of a microwave component based on a printed circuit board with an embedded micro-channel and an air tightness packaging method are urgently needed.
Chinese patent ZL202011304110.9 proposes a high-heat-dissipation digital-analog integrated packaging structure and a manufacturing method thereof, wherein a high-low frequency digital-analog composite printed circuit board is used as an integrated carrier of components, chips and the like, and compared with a common hybrid integrated microwave component, the integrated density is improved. However, the assembly still uses metal for passive heat conduction and has limited heat dissipation capability.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a microwave component based on an embedded micro-channel printed circuit board and an airtight packaging method; the printed circuit board and the metal packaging structure can be effectively integrated, and airtight packaging is realized; the heat dissipation device has good heat dissipation capacity and can realize the transmission of high-density electric signals; and can realize low flow resistance and uniform heat dissipation.
The technical problem to be solved by the invention is as follows:
on one hand:
the invention discloses a microwave assembly based on a micro-channel embedded printed circuit board, which comprises a metal packaging box body, a printed circuit board which is arranged in the metal packaging box body and is provided with a micro-channel, and a cantilever which is integrated with the printed circuit board and is communicated with the micro-channel;
one end of the cantilever is integrally connected with the printed circuit board, and the other end of the cantilever penetrates through the metal packaging box body and is positioned on the outer side of the metal packaging box body;
the cantilever is provided with a liquid inlet and a liquid outlet which are communicated with the micro-channel and are positioned outside the metal packaging box body.
According to the invention, the liquid inlet and the liquid outlet are respectively arranged at the outer sides of the airtight packaging assembly, so that the pollution of cooling liquid or cooling liquid steam to easily damaged components is avoided, and the reliability of the assembly is improved; the printed circuit board with embedded micro-channels is used as a substrate for electrical signal interconnection, and the printed circuit board with embedded micro-channels and the metal packaging structure are integrated to realize the structural function integration of the assembly; has good heat dissipation effect.
In some possible embodiments, the printed circuit board includes an upper wiring layer, a metal core board provided with micro channels, a lower wiring layer, and a vertical transmission structure provided on the metal core board and having two ends respectively connected to the upper wiring layer and the lower wiring layer; the outer side of the metal core plate is connected with the end part of the cantilever and is integrally formed.
The metal packaging box body is provided with a through hole for the cantilever to pass through, the through hole is provided with a sealing connector, and the cantilever and the metal packaging box body are effectively welded in an airtight mode through the sealing connector.
In some possible embodiments, a radio frequency module and a power supply module are integrated on the printed circuit board; and a heat dissipation unit is arranged in the micro flow channel and is positioned right below the radio frequency module.
Preferably, the heat flow density of the radio frequency module is more than or equal to 300W/cm 2 The high-power radio frequency chip comprises a high-power radio frequency chip and a heat sink;
in some possible embodiments, in order to effectively solve the problem of the layout of a heat dissipation network caused by the arrangement of radio frequency modules, multi-channel, low-flow-resistance uniform shunting and high-efficiency uniform heat dissipation are realized; meanwhile, the phenomena of cooling fluid leakage and the like caused by improper layout of a vertical transmission structure are avoided;
the micro flow channel comprises a plurality of parallel split liquid inlet flow channels communicated with the liquid inlet, micro flow channels connected with the outlet ends of the split liquid inlet flow channels, and liquid outlet flow channels connected with the outlet ends of the micro flow channels in series; the outlet end of the liquid outlet flow passage is communicated with a liquid outlet; the vertical transmission structure is positioned between the adjacent flow dividing liquid inlet flow channels.
In some possible embodiments, the cross-sectional area of the liquid outlet flow passage is larger than that of the split liquid inlet flow passage.
In some possible embodiments, in order to effectively realize the airtight welding of the sealing connector with the metal packaging box body and the cantilever respectively;
and overflow chutes are respectively arranged on the inner side and the outer side of the sealing connector.
On the other hand:
the invention also discloses an airtight packaging method of the microwave assembly based on the micro-channel embedded printed circuit board, which specifically comprises the following steps:
s1, preparing a printed circuit board embedded with a micro-channel, and enabling no wiring layer to exist on a cantilever;
step S2: integrating a radio frequency module and a power supply module on a printed circuit board by a low thermal resistance integration process, and integrating other components;
and step S3: assembling the printed circuit board and the metal packaging box body in the step S2;
s4, installing a sealing connector and a welding ring, and welding the outer side of the sealing connector with the inner wall of the through hole and the inner side of the sealing connector with the outer side of the cantilever;
and S5, sealing the cover by adopting laser seal welding or parallel seal welding.
In some possible embodiments, in order to effectively realize the integration of the radio frequency module and the power supply template;
the step S2 specifically includes:
the radio frequency module penetrates through the upper wiring layer and is integrated on the upper surface of the metal core plate through a low-thermal resistance integration process, and the radio frequency module is positioned right above the heat dissipation unit;
and integrating the power supply template on the lower surface of the lower wiring layer through a low-thermal resistance integration process.
In some possible embodiments, in order to effectively achieve a hermetic welding of the sealing connector to the through hole;
the step S4 specifically includes:
inserting the sealing connector and the solder ring on the through hole, so that the sealing connector is positioned between the through hole and the cantilever;
and welding to realize the airtight welding of the cantilever and the through hole.
Compared with the prior art, the invention has the following beneficial effects:
the printed circuit board with embedded micro-channels is used as a substrate for electrical signal interconnection, and is integrated with the structure of the metal packaging box body, so that the structural function integration of the assembly is realized; compared with the traditional penetration liquid cooling metal packaging, the integration density can be improved by more than one time.
The invention uses the printed circuit board embedded with the micro-channel as a substrate for electrical signal interconnection, and can realize 300W/cm by using the cooling fluid to enter the inner channel of the micro-channel through the liquid inlet and to be discharged through the liquid outlet 2 The heat is dissipated by the high heat flow density; compared with the common non-liquid cooling package, the high-efficiency heat dissipation capacity of the non-liquid cooling package is improved by more than 3 times.
The invention optimizes the welding structure and the welding mode, and realizes the airtight welding of the cantilevers of the liquid inlet and the liquid outlet of the printed circuit board with the embedded micro-channel and the metal packaging box body; compared with the traditional welding mode of the printed circuit board and the metal box body, the welding surface of the cantilever is removed with the organic material layer, so that the air tightness is higher; meanwhile, the liquid inlet and the liquid outlet are respectively arranged at the outer side of the airtight packaging component, so that the pollution of cooling liquid or cooling liquid steam to vulnerable components such as a chip in the component is avoided, and the reliability of the component is improved.
The invention adopts the mutual matching of a plurality of groups of shunt inlet flow channels connected in parallel and liquid outlet flow channels connected in series, solves the problem of heat dissipation network layout caused by the arrangement of a high-power radio frequency module, and realizes the uniform shunting of multi-channel and low flow resistance and the uniform heat dissipation with high efficiency in the assembly; meanwhile, the phenomena of cooling fluid leakage and the like caused by improper layout of the vertical transmission structure are avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram showing the connection relationship between the RF module, the power module and the PCB according to the present invention;
FIG. 3 is a schematic view showing the connection relationship between a micro flow channel, a liquid inlet and a liquid outlet;
FIG. 4 is a schematic structural diagram of a metal package case according to the present invention;
FIG. 5 is a schematic diagram of the assembled printed circuit board and metal package case of the present invention;
FIG. 6 is a flow chart of the preparation method of the present invention;
wherein: 1. a microwave assembly; 2. a printed circuit board; 3, a liquid inlet; 4 a liquid outlet; 5. a radio frequency module; 6. a metal package case; 7. a flow dividing and liquid inlet flow channel; 8. a liquid outlet flow passage; 9. a through hole; 10. a cantilever; 11. a sealed connector; 12. a power supply module; 13. a lead wire; 14. a vertical transfer structure; 15. a metal wiring layer; 16. a prepreg and an insulating layer; 17. a metal core plate; 18 micro flow channels; 19 heat dissipating unit.
Detailed Description
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. Reference herein to "first," "second," and similar words, does not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. In the implementation of the present application, "and/or" describes an association relationship of associated objects, which means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, the plurality of positioning posts refers to two or more positioning posts. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The present invention will be described in detail below.
Example 1:
as shown in fig. 1-6:
the embodiment discloses a micro-channel embedded printed circuit board based microwave assembly 1, which comprises a metal packaging box body 6, a printed circuit board 2 which is arranged in the metal packaging box body 6 and is provided with a micro-channel 18, and a cantilever 10 which is integrated with the printed circuit board 2 and is communicated with the micro-channel 18;
one end of the cantilever 10 is integrally connected with the printed circuit board 2, and the other end of the cantilever passes through the metal packaging box body 6 and is positioned on the outer side of the metal packaging box body 6;
the cantilever 10 is provided with a liquid inlet 3 and a liquid outlet 4 which are communicated with the micro-channel 18 and are positioned outside the metal packaging box body 6.
In the invention, the liquid inlet 3 and the liquid outlet 4 are respectively arranged at the outer sides of the airtight packaging assembly, thereby avoiding the pollution of cooling liquid or cooling liquid steam on easily damaged components and improving the reliability of the assembly; the printed circuit board 2 embedded with the micro-channel 18 is used as a substrate for electrical signal interconnection, and the printed circuit board 2 embedded with the micro-channel 18 is integrated with a metal packaging structure, so that structural function integration of the assembly is realized; has good heat dissipation effect.
In some possible embodiments, the printed circuit board 2 includes an upper wiring layer, a metal core board 17 provided with micro flow channels 18, a lower wiring layer, and a vertical transmission structure 14 provided on the metal core board 17 and having two ends connected to the upper wiring layer and the lower wiring layer respectively; the outer side of the metal core plate 17 is connected with the end part of the cantilever 10 and is integrally formed.
Preferably, the metal core plate 17 comprises a first core plate which is provided with the micro flow channel 18 and is integrally formed with the cantilever 10 and a second core plate which is matched with the first core plate and is installed, and the first core plate is connected with the second core plate through welding; the liquid inlet 3 and the liquid outlet 4 are communicated with the micro-channel 18, and heat dissipation is realized through the flow of cooling fluid in the micro-channel 18;
preferably, the vertical transport structure 14 is not in communication with the fluidic channel 18.
The metal core plate 17 and the cantilever 10 are integrally formed and are made of copper; the upper and lower sides of the cantilever 10 are not provided with an upper wiring layer and a lower wiring layer, and the cantilever 10 is connected with the metal packaging box body 6 in an airtight mode.
Preferably, the upper wiring layer, the metal core board 17 and the lower wiring layer are connected by a lamination process.
The metal packaging box body 6 is provided with a through hole 9 through which the cantilever 10 penetrates, the through hole 9 is provided with a sealing connector 11, and the cantilever 10 and the metal packaging box body 6 are effectively welded in an airtight mode through the sealing connector 11.
Preferably, the cantilever 10 can be one or more groups; when the two liquid inlets are a group, the liquid inlet 3 and the liquid outlet 4 are arranged on the cantilever 10;
when the cantilever 10 is two sets, one set of cantilever 10 is provided with the liquid inlet 3, and the other set is provided with the liquid outlet 4.
The invention can realize 300W/cm by using the printed circuit board 2 as a substrate for electrical signal interconnection and adopting the flow in the cooling fluid micro-channel 18 2 The above high heat flow density dissipates heat. Compared with the common non-liquid cooling package, the high-efficiency heat dissipation capacity of the non-liquid cooling package is improved by more than 3 times.
The cantilever 10 and the metal packaging box body 6 are welded in an airtight mode through the sealing connector 11, and compared with the traditional mode that the printed circuit board 2 and the metal box body are welded, due to the fact that no wiring layer (a lower wiring layer and an upper wiring layer) is arranged on the welding surface of the cantilever 10, the airtightness is higher; meanwhile, the liquid inlet 3 and the liquid outlet 4 are respectively communicated with a micro-channel 18 in the metal core plate 17 and are arranged on the cantilever 10, and after the metal core plate is assembled, the liquid inlet 3 and the liquid outlet 4 are positioned at the outer side of the metal packaging box body 6; the pollution of cooling liquid or cooling liquid steam to the easily damaged components is avoided, and the reliability of the assembly is improved; meanwhile, heat dissipation can be effectively realized.
In some possible embodiments, a radio frequency module 5 and a power module 12 are integrated on the printed circuit board 2; a heat dissipation unit 19 is arranged in the micro flow channel 18, and the heat dissipation unit 19 is located right below the radio frequency module 5.
Preferably, as shown in fig. 2, the rf module 5 is integrated on the metal core 17 through the upper wiring layer and connected to the upper wiring layer through the lead 13, and the power module 12 is integrated on the side of the lower wiring layer away from the metal core 17 and connected to the lower wiring layer, and combined with the vertical transmission structure 14, to implement the nearby power supply of the rf module 5. By integrating the radio frequency module 5 on the surface of one side of the metal core board 17 close to the upper wiring layer, the transmission path length of radio frequency signals is shortened and power loss is reduced by adopting a mode of being close to the signal output end of the component.
In some possible embodiments, in order to effectively solve the problem of the layout of the heat dissipation network caused by the arrangement of the radio frequency module 5, multi-channel, low-flow-resistance uniform shunting and high-efficiency uniform heat dissipation are realized; meanwhile, the phenomena of cooling fluid leakage and the like caused by improper layout of the vertical transmission structure 14 are avoided;
the micro flow channel 18 comprises a plurality of flow dividing liquid inlet flow channels 7 connected with the liquid inlet 3 in parallel, micro flow channels connected with the outlet ends of the flow dividing liquid inlet flow channels 7 and a liquid outlet flow channel 8 connected with the outlet ends of the micro flow channels in series; the outlet end of the liquid outlet flow passage 8 is communicated with the liquid outlet 4; the vertical transmission structure 14 is located between two adjacent split liquid inlet flow channels 7, so that the vertical transmission structure 14 and the micro flow channel 18 will not be communicated, and the cooling fluid in the micro flow channel 18 is prevented from entering the vertical transmission structure 14.
The arrangement mode of a plurality of parallel shunting inlet flow channels 7 communicated with the liquid inlet 3, micro flow channels arranged in one-to-one correspondence with the inlet flow channels and series-connected series-flow outlet flow channels 8 is adopted, so that the problem of heat dissipation network layout caused by the arrangement of the left side edge of the radio frequency module 5 shown in figure 3 is solved, and the uniform shunting of multiple channels and low flow resistance and the efficient uniform heat dissipation in the assembly are realized; meanwhile, the phenomena of cooling fluid leakage and the like caused by improper layout of the vertical transmission structure 14 are avoided.
In some possible embodiments, the cross-sectional area of the liquid outlet flow passage 8 is larger than the cross-sectional area of the split liquid inlet flow passage 7.
In some possible embodiments, in order to effectively achieve hermetic welding of the hermetic connector 11 to the metal package body 6, respectively the cantilever 10;
the inner side and the outer side of the sealing connector 11 are respectively provided with an overflow groove.
The sealing connector 11 is sleeved in the through hole 9, the cantilever 10 is inserted into the sealing connector 11 and penetrates through the sealing connector 11, and the sealing connector 11 is hermetically welded with the metal packaging box body 6 and the cantilever 10 by arranging overflow grooves on the inner side and the outer side of the sealing connector 11.
Preferably, a radio frequency connector and a low frequency connector are further mounted on the metal packaging box body 6.
Example 2:
as shown in fig. 6:
the embodiment also discloses an airtight packaging method of embodiment 1, which specifically includes the following steps:
s1, preparing a printed circuit board 2 embedded with a micro-channel 18, and enabling no wiring layer to exist on a cantilever 10;
step S2: integrating the radio frequency module 5 and the power module 12 on the printed circuit board 2 by a low thermal resistance integration process, and integrating other components; specifically, the method comprises the following steps:
the radio frequency module 5 penetrates through the upper wiring layer and is integrated on the surface of the metal core board 17 board through a low-heat resistance integration process, and the radio frequency module is positioned right above the heat dissipation unit 19;
integrating a power supply template on the surface of the lower wiring layer through a low-thermal resistance integration process;
and step S3: assembling the printed circuit board 2 in the step S2 with the metal packaging box body 6;
s4, installing a sealing connector 22 and a welding ring, and welding the outer side of the sealing connector 11 with the inner wall of the through hole 9 and the inner side of the sealing connector 11 with the outer side of the cantilever 10; the method specifically comprises the following steps:
inserting the sealing connector 11 and the solder ring onto the through hole 9 such that the sealing connector 11 is located between the through hole 9 and the cantilever 10;
welding to realize the airtight welding of the cantilever 10 and the through hole 9;
and S5, sealing the cover by adopting laser sealing welding or parallel sealing welding.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (10)

1. A microwave assembly based on a micro-channel embedded printed circuit board is characterized by comprising a metal packaging box body, the printed circuit board which is arranged in the metal packaging box body and is provided with a micro-channel, and a cantilever which is integrated with the printed circuit board and is communicated with the micro-channel;
one end of the cantilever is connected with the printed circuit board in an integrated manner, and the other end of the cantilever penetrates through the metal packaging box body and is positioned on the outer side of the metal packaging box body;
the cantilever is provided with a liquid inlet and a liquid outlet which are communicated with the micro-channel and are positioned outside the metal packaging box body.
2. The micro-channel embedded printed circuit board based microwave assembly of claim 1, wherein the printed circuit board comprises an upper wiring layer, a metal core board provided with the micro-channel, a lower wiring layer, and a vertical transmission structure disposed on the metal core board and having two ends connected to the upper wiring layer and the lower wiring layer respectively, which are stacked in sequence; the outer side of the metal core plate is connected with the end part of the cantilever and is integrally formed.
3. The micro flow channel embedded printed circuit board based microwave assembly as claimed in claim 2, wherein the metal packaging box body is provided with a through hole for the cantilever to pass through, and the through hole is provided with a sealing connector.
4. The micro-fluidic embedded printed circuit board-based microwave assembly of claim 3, wherein a radio frequency module and a power module are integrated on the printed circuit board; and a heat dissipation unit is arranged in the micro flow channel and is positioned right below the radio frequency module.
5. The micro-channel printed circuit board based microwave module as claimed in claim 4, wherein the micro-channel comprises a plurality of parallel split feed channels connected to the inlet, micro-channels connected to the outlet of the split feed channels, and outlet channels connected to the outlet of the micro-channels in series; the outlet end of the liquid outlet flow passage is communicated with the liquid outlet.
6. The micro-fluidic embedded PCB assembly of claim 5, wherein the cross-sectional area of the liquid outlet channel is larger than that of the liquid inlet channel.
7. The micro-channel embedded printed circuit board based microwave module as claimed in claim 3, wherein the sealing connector has overflow grooves formed on both the inner and outer sides thereof.
8. The method for hermetically encapsulating a microwave component based on a micro-fluidic channel printed circuit board according to any one of claims 1 to 7, comprising the following steps:
s1, preparing a printed circuit board embedded with a micro-channel, and enabling no wiring layer to exist on a cantilever;
step S2: integrating a radio frequency module and a power supply module on a printed circuit board by a low thermal resistance integration process, and integrating other components;
and step S3: assembling the printed circuit board and the metal packaging box body in the step S2;
s4, installing a sealing connector and a welding ring, and welding the outer side of the sealing connector with the inner wall of the through hole and the inner side of the sealing connector with the outer side of the cantilever;
and S5, sealing the cover by adopting laser sealing welding or parallel sealing welding.
9. The method for hermetically encapsulating a microwave module based on a micro-channel embedded printed circuit board according to claim 8, wherein the step S2 specifically comprises:
the radio frequency module penetrates through the upper wiring layer and is integrated on the upper surface of the metal core plate through a low-thermal resistance integration process;
and integrating the power supply template on the lower surface of the lower wiring layer through a low-thermal resistance integration process.
10. The method for hermetically encapsulating a microwave module based on a micro-channel embedded printed circuit board according to claim 8, wherein the step S4 specifically comprises:
inserting the sealing connector and the solder ring into the through hole so that the sealing connector is positioned between the through hole and the cantilever;
and welding to realize the airtight welding of the cantilever and the through hole.
CN202210776659.0A 2022-07-04 2022-07-04 Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method Pending CN115175438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210776659.0A CN115175438A (en) 2022-07-04 2022-07-04 Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210776659.0A CN115175438A (en) 2022-07-04 2022-07-04 Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method

Publications (1)

Publication Number Publication Date
CN115175438A true CN115175438A (en) 2022-10-11

Family

ID=83490544

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210776659.0A Pending CN115175438A (en) 2022-07-04 2022-07-04 Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method

Country Status (1)

Country Link
CN (1) CN115175438A (en)

Similar Documents

Publication Publication Date Title
CN105188260B (en) Printed circuit board embeds runner liquid cooling heat-exchanger rig
US7353859B2 (en) Heat sink with microchannel cooling for power devices
CN105870085B (en) A kind of aluminium nitride multi-layer ceramics is without lead chip carrier encapsulation shell
WO2015086184A1 (en) Semiconductor stack arrangement and semiconductor module
CN111698824B (en) Integrated interconnection structure of self-airtight packaging functional module and implementation method
CN101814443B (en) Chip design method for multi-chip module of high-performance processor with optical interface
CN105470810A (en) Macro-channel liquid-cooling high-power semiconductor laser module and apparatus
CN110268520A (en) Method for integrated power chip and the busbar for forming radiator
CN113056087B (en) Printed circuit board embedded with micro-channel and preparation method thereof
CN114005812A (en) Fan-out type packaging structure and construction method thereof
CN112349691B (en) Airtight high-heat-conductivity LCP (liquid crystal display) packaging substrate, manufacturing method and multi-chip system-in-package structure
US11153996B2 (en) Thermal management assemblies for electronic assemblies mounted on a motor end
CN112635417A (en) Heat dissipation structure and preparation method thereof, chip packaging structure and chip packaging method
CN111769087A (en) Heat dissipation and integration integrated structure of high-power GaN device and manufacturing method
CN114256175B (en) Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof
CN115226290A (en) Microwave assembly based on embedded micro-channel printed circuit board and preparation method
CN115175438A (en) Micro-channel embedded printed circuit board-based microwave assembly and airtight packaging method
CN109348616A (en) A kind of wiring board and preparation method thereof with heat conduction structure
CN114256177A (en) High-power chip heat dissipation structure and preparation method thereof
CN111540717B (en) Power module
CN212848377U (en) Heat dissipation and integration integrated structure of high-power GaN device
CN113327904A (en) Double-sided efficient heat dissipation airtight packaging structure and preparation method thereof
CN114695322A (en) Power module
CN209659706U (en) A kind of wiring board with heat conduction structure
CN115315064A (en) Airtight packaging assembly based on embedded micro-channel printed circuit board and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination