CN115166913A - Wavelength division multiplexing common-package optical interconnection architecture based on microring - Google Patents
Wavelength division multiplexing common-package optical interconnection architecture based on microring Download PDFInfo
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29331—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by evanescent wave coupling
- G02B6/29335—Evanescent coupling to a resonator cavity, i.e. between a waveguide mode and a resonant mode of the cavity
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29379—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device
- G02B6/2938—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means characterised by the function or use of the complete device for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM
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Abstract
The invention relates to an optical interconnection framework and a packaging mode, in particular to a wavelength division multiplexing co-packaging optical interconnection method and framework based on a micro-ring, and aims to solve the technical problems of high power consumption and low integration level of the conventional co-packaging optical interconnection framework. The invention provides a wavelength division multiplexing co-packaging optical interconnection architecture based on a micro-ring, which comprises a laser array, a passive optical waveguide unit, an optical modulation unit, an integrated circuit chip and a processing unit, wherein the laser array, the passive optical waveguide unit, the optical modulation unit, the integrated circuit chip and the processing unit are sequentially connected, the passive optical waveguide unit, the optical modulation unit, the integrated circuit chip and the processing unit are all integrated and packaged on a substrate, and various packaging forms are arranged among the laser array, the passive optical waveguide unit and the substrate. The laser array is used for outputting N paths of laser signals with different wavelengths, the N paths of laser signals are output as K paths of optical signals to be modulated after passing through the passive optical waveguide unit, and the optical signals are output and transmitted after being modulated by the optical modulation unit, wherein the processing unit and the integrated circuit chip can apply analog driving signals to the optical modulation unit.
Description
Technical Field
The invention relates to an optical interconnection architecture and a packaging mode, in particular to a wavelength division multiplexing co-packaging optical interconnection architecture based on a micro-ring.
Background
With the development of internet technology and the improvement of economic level, the development of new technologies such as artificial intelligence, cloud computing and cloud storage is vigorous, personal terminal equipment is popularized, and the demand of users on communication capacity is increased. In the prior art, as a new interconnection mode, an optical interconnection architecture has extremely high communication bandwidth and extremely low loss, and interconnection between communication devices, between circuit boards, between chips and circuit boards or between chips is generally carried out in the form of light, wherein the light is transmitted through a waveguide or an optical fiber. However, as the system scale is enlarged, the problems of heat dissipation and packaging in the optical interconnection architecture are increasingly prominent, which leads to high power consumption, low integration level and reduced transmission efficiency of the conventional co-packaged optical interconnection architecture.
Disclosure of Invention
The invention aims to solve the technical problems of high power consumption and low integration level of the existing optical interconnection architecture and provides a wavelength division multiplexing co-encapsulation optical interconnection architecture based on a microring.
In order to solve the technical problems, the technical solution provided by the invention is as follows:
a wavelength division multiplexing common-package optical interconnection structure based on micro-ring is characterized in that: the device comprises a laser array, a passive optical waveguide unit, an optical modulation unit, an integrated circuit chip and a processing unit which are sequentially connected, wherein the passive optical waveguide unit, the optical modulation unit, the processing unit and the integrated circuit chip are all integrally packaged on a substrate;
the laser array comprises N lasers with different central wavelengths and is used for outputting N paths of laser signals with different wavelengths, wherein N is a positive integer;
the passive optical waveguide unit is used for outputting N paths of laser signals to be K paths of optical signals to be modulated after passing through the passive waveguide, wherein K is a positive integer;
the optical signal to be modulated comprises N paths of laser signals with different wavelengths, or comprises mixed optical signals with N different wavelengths;
the optical modulation unit comprises K paths of cascaded micro-ring modulator groups and is used for modulating K paths of optical signals to be modulated and outputting transmission optical signals;
the processing unit is used for receiving an external digital electric signal, processing the digital electric signal and then sending the processed digital electric signal to the integrated circuit chip;
the integrated circuit chip is used for converting the digital electric signal into an analog driving signal and transmitting the analog driving signal to the light modulation unit.
Furthermore, the passive optical waveguide unit and the optical modulation unit are integrated on a silicon substrate chip, the laser array is heterogeneously bonded or heteroepitaxially grown on the silicon substrate chip, and the silicon substrate chip is integrated on the substrate.
Furthermore, the passive optical waveguide unit and the optical modulation unit are integrated on a silicon substrate chip, the silicon substrate chip is integrated on the substrate, and the laser array is arranged on the outer side of the substrate.
Further, the laser array and the passive optical waveguide unit are integrated on a iii-v compound semiconductor material substrate chip integrated on the substrate.
Further, the passive optical waveguide unit includes a waveguide power splitter; the waveguide power beam splitter is used for dividing N ways behind the laser signal waveguide into N ways of first laser signal groups, and N ways of first laser signal groups are output after crossing the waveguide to be K ways of second laser signal groups, wherein, first laser signal groups include K ways of laser signals that the wavelength is the same, second laser signal groups include N ways of laser signals of different wavelengths.
Furthermore, each micro-ring modulator group comprises two parallel coupling waveguides and N micro-ring structures arranged along the extension direction of the coupling waveguides, and the two coupling waveguides are coupled with the micro-ring structures; the two coupling waveguides comprise an input coupling waveguide and an output coupling waveguide, the input coupling waveguide comprises N coupling regions, and the N coupling regions are independently arranged and respectively correspond to the N micro-ring structures one by one.
Further, the passive optical waveguide unit comprises a waveguide power beam splitter and a waveguide power beam combiner; the waveguide power beam splitter is used for dividing N way laser signal into N way first laser signal group, N way first laser signal group exports behind the crossing waveguide for K way second laser signal group, waveguide power beam combiner is used for with K way second laser signal group is K way the mixed light signal, wherein, first laser signal group includes that K way wavelength is the same laser signal, second laser signal group includes that N way different wavelength the laser signal.
Furthermore, each micro-ring modulator set comprises a coupling waveguide and N micro-ring structures coupled with the coupling waveguide, and the N micro-ring structures are arranged along the extending direction of the coupling waveguide.
Compared with the prior art, the invention has the following beneficial effects:
1. the wavelength division multiplexing co-packaged optical interconnection framework based on the microring is characterized in that the laser array, the passive optical waveguide unit and the optical modulation unit are sequentially connected, and the passive optical waveguide unit, the optical modulation unit, the processing unit and the integrated circuit chip are integrated and packaged on the substrate, so that the distance between an optical module comprising the laser array, the passive optical waveguide unit and the optical modulation unit and the integrated circuit chip is shortened, the shortest photoelectric interconnection is realized, the size of the whole co-packaged optical interconnection framework is reduced, the integration level is higher, the power consumption is lower, the structure is more compact, and the application scene is wide.
2. According to the passive optical waveguide unit in the wavelength division multiplexing co-packaged optical interconnection framework based on the microring, on one hand, N paths of laser signals with different wavelengths are converted into K paths of first laser signal groups with the same power, so that adverse effects on optical signal transmission and modulation due to overlarge laser power are avoided; on the other hand, N paths of laser signals with different wavelengths can be converted into K paths of mixed optical signals with N different wavelengths, so that wavelength division multiplexing of the optical signals is realized, and the information carrying efficiency of the optical signals is improved.
3. The wavelength division multiplexing co-packaged optical interconnection framework based on the microring, provided by the invention, provides various implementation modes for technicians in the field in practical application through various packaging forms of the laser array, the passive optical waveguide unit and the substrate, and widens application scenes.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of a wavelength division multiplexing-co-packaged optical interconnection architecture based on microrings according to the present invention;
fig. 2 is a schematic diagram of an embodiment of a passive optical waveguide unit according to the first embodiment of fig. 1;
FIG. 3 is a schematic diagram of another embodiment of a passive optical waveguide unit in the first embodiment of FIG. 1;
FIG. 4 is a schematic diagram of a second embodiment of a wavelength division multiplexing-co-packaged optical interconnection architecture based on microrings according to the present invention;
FIG. 5 is a third exemplary view of a wavelength division multiplexing co-packaged optical interconnection structure based on microrings according to an embodiment of the present invention;
description of reference numerals:
the laser device comprises a 1-laser array, 11-lasers, 12-laser signals, 2-passive optical waveguide units, 21-first laser signal groups, 22-second laser signal groups, 3-optical modulation units, 31-micro-ring structures, 32-micro-ring modulator groups, 4-processing units, 5-integrated circuit chips and 6-substrates.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Example one
Referring to fig. 1, the invention provides a wavelength division multiplexing co-packaged optical interconnection architecture based on a microring, which comprises a laser array 1, a passive optical waveguide unit 2, an optical modulation unit 3, an integrated circuit chip 5 and a processing unit 4, which are connected in sequence, wherein the passive optical waveguide unit 2, the optical modulation unit 3, the processing unit 4 and the integrated circuit chip 5 are all integrated and packaged on a substrate 6, the passive optical waveguide unit 2 and the optical modulation unit 3 are all integrated on a silicon substrate chip, the laser array 1 is grown on the silicon substrate chip in a heterogeneous bonding or heterogeneous epitaxy manner, and the silicon substrate chip is integrated on the substrate 6.
In one embodiment, the laser 11 is a distributed feedback laser and is made of a III-V compound semiconductor material with an output wavelength in the 1260-1360nm or 1530-1625nm bands. The laser array 1 includes N lasers 11 with different center wavelengths, and is capable of outputting N laser signals 12 with different wavelengths, where N is a positive integer. In this embodiment, the laser 11 is a distributed feedback laser, and its output power is related to the number of the laser arrays 1 and the insertion loss of the optical interconnection structure, and the larger the number of the laser arrays 1 is, the larger the insertion loss of the optical interconnection structure is, the higher its output power is.
The passive optical waveguide unit 2 is configured to output N laser signals 12 as K optical signals to be modulated after passing through a passive waveguide, where K is a positive integer. The optical signal to be modulated includes N laser signals 12 with different wavelengths, or a mixed optical signal with N different wavelengths.
As shown in fig. 2, in the first embodiment, the passive optical waveguide unit 2 includes a waveguide power splitter, the waveguide power splitter can be used to waveguide and split the N laser signals 12 into a first laser signal group 21, and the N first laser signal groups 21 are output as K second laser signal groups 22 after crossing the waveguide, where the first laser signal group 21 includes K laser signals 12 with the same wavelength, the second laser signal group 22 includes N laser signals 12 with different wavelengths, and K is a positive integer. In this embodiment, the waveguide power beam splitter includes N × K-1Y-type waveguide beam splitters connected end to end, and if the number of the Y-type waveguide beam splitters is K-1, every K-1Y-type waveguide beam splitters are connected end to end, so that one path of laser signal 12 with a single wavelength can be divided into K paths of laser signals 12 with the same wavelength. The light modulation unit 3 comprises K paths of cascaded micro-ring modulator groups 32, each path of micro-ring modulator group 32 comprises two parallel coupling waveguides and N micro-ring structures 31 arranged along the extension direction of the coupling waveguides, the two coupling waveguides are coupled with the micro-ring structures 31 and comprise input coupling waveguides and output coupling waveguides, each input coupling waveguide comprises N coupling areas, the N coupling areas are independently arranged and respectively correspond to the N micro-ring structures 31 one by one. For the micro-ring modulator, it is necessary to satisfy the resonance condition of the micro-ring modulator, and the optical signal is coupled into the micro-ring structure 31 and forms a resonance in the micro-ring structure 31. After the passive optical waveguide unit 2 outputs K paths of second laser signal groups 22, the K paths of second laser signal groups 22 are respectively input into K paths of cascaded micro-ring modulator groups 32, and N paths of laser signals 12 with different wavelengths in the second laser signal groups 22 respectively enter N cascaded micro-ring modulators in the micro-ring modulator groups 32. The waveguide of the micro-ring modulator is made of silicon materials, the thickness of the waveguide is 200-1000nm, and the micro-ring modulator is used for realizing wavelength division multiplexing of 1260nm-1360nm wave bands or 1530nm-1625nm wave bands.
As shown in fig. 3, in other embodiments, the passive optical waveguide unit 2 includes a waveguide power splitter and a waveguide power combiner, the waveguide power splitter can split the N laser signals 12 into the first laser signal groups 21 after being waveguided, the N first laser signal groups 21 are output as K second laser signal groups 22 after being crossed and waveguided, the waveguide power combiner can combine the K second laser signal groups 22 into K mixed optical signals, the mixed optical signals have N different wavelengths, wherein the first laser signal groups 21 include K laser signals 12 with the same wavelength, the second laser signal groups 22 include N laser signals 12 with different wavelengths, and K is a positive integer. In this embodiment, the waveguide power splitter includes N × K-1Y-type waveguide splitters connected end to end, and the waveguide power combiner includes K × N-1Y-type waveguide splitters connected end to end. If the number of the Y-type waveguide beam splitters is N-1, every N-1Y-type waveguide beam splitters are connected end to end, so that N laser signals 12 with different wavelengths can be combined into one mixed optical signal with N wavelengths. The optical modulation unit 3 comprises K cascaded micro-ring modulator groups 32, each micro-ring modulator group 32 comprises a coupling waveguide and a plurality of micro-ring structures 31 coupled with the coupling waveguide, and the n micro-ring structures 31 are arranged along the extending direction of the coupling waveguide. After the K paths of mixed optical signals are respectively input to the K paths of cascaded micro-ring modulator groups 32, if a certain wavelength in the mixed optical signals meets the resonance condition of a certain micro-ring structure 31, the wavelength is coupled into the micro-ring structure 31 from the coupling waveguide, and resonance is formed in the micro-ring structure 31.
The annular waveguide of the micro-ring modulator comprises a P-type doped region and an N-type doped region which are arranged close to the inside and the outside of the annular waveguide, and the P-type doped region and the N-type doped region form a reverse bias PN junction. The processing unit 4 sends the received external digital electric signal to the integrated circuit chip 5 through the substrate 6 after processing, and the integrated circuit chip 5 can convert the digital electric signal into an analog driving signal and transmit the analog driving signal to the light modulation unit 3 to realize modulation: under the action of the analog driving signal, the micro-ring structure 31 in the optical modulation unit 3 modulates the optical signal to be modulated, which is input from one end of the coupling waveguide and coupled into the micro-ring structure 31, and outputs a transmission optical signal.
Example two
Referring to fig. 4, the difference between the second embodiment and the first embodiment is that the passive optical waveguide unit 2 and the optical modulation unit 3 are integrated on a silicon substrate chip, the silicon substrate chip is integrated on a substrate 6, and the laser array 1 is disposed outside the substrate 6. In addition, the other parts of the second embodiment are the same as those of the first embodiment.
EXAMPLE III
Referring to fig. 5, the third embodiment is different from the first embodiment in that the laser array 1 and the passive optical waveguide unit 2 are integrated on a iii-v compound semiconductor material base chip which is integrated on the substrate 6. In addition, the other parts of the third embodiment are the same as those of the first embodiment.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and it is obvious for a person skilled in the art to modify the specific technical solutions described in the foregoing embodiments or to substitute part of the technical features, and these modifications or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions protected by the present invention.
Claims (8)
1. A wavelength division multiplexing common-package optical interconnection structure based on micro-rings is characterized in that: the device comprises a laser array (1), a passive optical waveguide unit (2), an optical modulation unit (3), an integrated circuit chip (5) and a processing unit (4), wherein the passive optical waveguide unit (2), the optical modulation unit (3), the processing unit (4) and the integrated circuit chip (5) are sequentially connected and are integrally packaged on a substrate (6);
the laser array (1) comprises N lasers (11) with different central wavelengths and is used for outputting N laser signals (12) with different wavelengths, wherein N is a positive integer;
the passive optical waveguide unit (2) is used for outputting N paths of laser signals (12) as K paths of optical signals to be modulated after passing through the passive optical waveguide, wherein K is a positive integer;
the optical signal to be modulated comprises N laser signals (12) with different wavelengths, or comprises a mixed optical signal with N different wavelengths;
the optical modulation unit (3) comprises K paths of cascaded micro-ring modulator groups (32) and is used for modulating K paths of optical signals to be modulated and outputting transmission optical signals;
the processing unit (4) is used for receiving an external digital electric signal, processing the digital electric signal and then sending the processed digital electric signal to the integrated circuit chip (5);
the integrated circuit chip (5) is used for converting the digital electric signal into an analog driving signal and transmitting the analog driving signal to the light modulation unit (3).
2. The WDM-co-packaged optical interconnect architecture of claim 1, wherein: the passive optical waveguide unit (2) and the optical modulation unit (3) are integrated on a silicon substrate chip, the laser array (1) grows on the silicon substrate chip in a heterojunction or heteroepitaxy mode, and the silicon substrate chip is integrated on the substrate (6).
3. The WDM-based optical interconnect architecture of claim 1, wherein: the passive optical waveguide unit (2) and the optical modulation unit (3) are integrated on a silicon substrate chip, the silicon substrate chip is integrated on the substrate (6), and the laser array is arranged on the outer side of the substrate (6).
4. The WDM-co-packaged optical interconnect architecture of claim 1, wherein: the laser array (1) and the passive optical waveguide unit (2) are integrated on a III-V compound semiconductor material substrate chip, and the III-V compound semiconductor material substrate chip is integrated on the substrate (6).
5. A wavelength division multiplexing co-packaged optical interconnect architecture based on microrings according to any of claims 2-4, wherein: the passive optical waveguide unit (2) comprises a waveguide power splitter; the waveguide power beam splitter is used for dividing N way behind the laser signal (12) waveguide into N way first laser signal group (21), N way first laser signal group (21) export after crossing the waveguide for K way second laser signal group (22), wherein, first laser signal group (21) include K way laser signal (12) that the wavelength is the same, second laser signal group (22) include N way laser signal (12) of different wavelength.
6. The WDM-co-packaged optical interconnect architecture of claim 5, wherein: each path of micro-ring modulator group (32) comprises two parallel coupling waveguides and N micro-ring structures (31) arranged along the extension direction of the coupling waveguides, and the two coupling waveguides are coupled with the micro-ring structures (31); the two coupling waveguides comprise an input coupling waveguide and an output coupling waveguide, the input coupling waveguide comprises N coupling regions, the N coupling regions are independently arranged and respectively correspond to the N micro-ring structures (31) one by one.
7. A wavelength division multiplexing co-packaged optical interconnect architecture based on microrings according to any of claims 2-4, wherein: the passive optical waveguide unit (2) comprises a waveguide power beam splitter and a waveguide power beam combiner; the waveguide power beam splitter is used for dividing N way laser signal (12) into N way first laser signal group (21), N way first laser signal group (21) export after crossing waveguide for K way second laser signal group (22), waveguide power beam combiner is used for K way second laser signal group (22) are combined for K way the mixed optical signal, wherein, first laser signal group (21) include that K way wavelength is the same laser signal (12), second laser signal group (22) include N way different wavelength laser signal (12).
8. The WDM-co-packaged optical interconnect architecture of claim 7, wherein: each micro-ring modulator group (32) comprises a coupling waveguide and N micro-ring structures (31) coupled with the coupling waveguide, wherein the N micro-ring structures (31) are arranged along the extending direction of the coupling waveguide.
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