CN115157044B - Low-temperature type efficient polishing method for pipe orifice for mold processing - Google Patents

Low-temperature type efficient polishing method for pipe orifice for mold processing Download PDF

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Publication number
CN115157044B
CN115157044B CN202210761307.8A CN202210761307A CN115157044B CN 115157044 B CN115157044 B CN 115157044B CN 202210761307 A CN202210761307 A CN 202210761307A CN 115157044 B CN115157044 B CN 115157044B
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Prior art keywords
polishing
ball
fixedly connected
adsorption
adsorption cylinder
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CN115157044A (en
Inventor
殷文元
谢善忠
崔卫东
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Jiangsu Wanli Machinery Co ltd
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Jiangsu Wanli Machinery Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/04Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning In General (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a low-temperature type efficient polishing method for a pipe orifice for die processing, which belongs to the field of mechanical die processing and is characterized in that when a pipe orifice is polished, a collision small ball is driven by movement of a polishing ball body to collide and rub to generate static electricity, meanwhile, two collision extrusion bag bodies collide with each other, barium hydroxide powder octahydrate is extruded downwards through collision impact force and is mixed with ammonium chloride powder to react, heat is absorbed, the temperature of the polishing ball body and a polishing ring body is reduced, ammonia gas is generated and blown into a telescopic hose, a piston is pushed to move to extrude a right side space and air of an adsorption cylinder, the left side space of the adsorption cylinder is increased, the extracted air is supplemented, the chips enter the polishing ball body to be collected under the action of air flow and electrostatic adsorption, the extruded air at the right side of the adsorption cylinder is blown into an attraction ball to react with oxygen to generate ferroferric oxide, and the chips are attracted into the polishing ring body through magnetic action, so that the collection and cleaning of the chips are more complete.

Description

Low-temperature type efficient polishing method for pipe orifice for mold processing
Technical Field
The invention relates to the field of machining of mechanical dies, in particular to a low-temperature type efficient polishing method for a pipe orifice for die machining.
Background
The mechanical mould is a tool for forming articles, the tool is composed of various parts, different moulds are composed of different parts, the processing of the appearance of the articles is realized mainly through the change of the physical state of formed materials, and the tool is used for forming blanks into articles with specific shapes and sizes under the action of external force in blanking, forming and stamping, die forging, cold heading, extrusion, powder metallurgy pressing and pressure casting and compression molding or injection molding of engineering plastics, rubber, ceramics and other products.
After the pipeline for the mechanical die is formed, the pipe orifice of the pipeline for the mechanical die needs to be polished, so that the pipeline achieves certain surface smoothness and precision, and the pipe orifice of the pipeline for the mechanical die in the prior art is insufficient and comprehensive in collection and cleaning of scraps generated in the polishing process, is easy to produce residues, and affects the environment and human health.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a low-temperature type efficient polishing method for a pipe orifice for die processing, which can realize that when the pipe orifice is polished, a collision small ball collides and rubs under the action of the movement of a polishing ball to generate static electricity, meanwhile, two collision extrusion bags collide with each other, the barium hydroxide octahydrate powder is extruded downwards by collision impact force and is mixed with ammonium chloride powder to react, heat is absorbed, the temperature of the polishing ball and a polishing ring body is reduced, ammonia gas is generated and blown into a telescopic hose, a piston is pushed to move to extrude the right side space and air of an adsorption cylinder, the left side space of the adsorption cylinder is increased, the air is extracted to supplement, chips are pushed open to conduct a valve under the action of air flow and electrostatic adsorption to enter the polishing ball to be collected, the air extruded on the right side of the adsorption cylinder is blown into an attraction ball to react with oxygen to generate ferroferric oxide, and the chips are attracted into the polishing ring body through the magnetic effect, so that the collection and cleaning of the chips are more complete.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
A low-temperature type efficient polishing method for a pipe orifice for mold processing comprises the following steps:
s1, firstly, placing a mechanical mould pipe to be polished on a workbench, fixing the mechanical mould pipe, and then mounting an adsorption type polishing ball on a polisher;
s2, driving the adsorption type polishing ball to rotate through a polishing machine to realize polishing treatment on the pipe orifice of the mechanical die pipe to be polished;
and S3, preparing polishing liquid after finishing polishing, uniformly smearing the polishing liquid on the pipe orifice of the polished mechanical die, polishing the pipe orifice, flushing the pipe orifice by using clear water, and drying the pipe orifice.
Further, the adsorption polishing ball in S1 comprises a polishing ball body, the outer ends of the polishing ball body are fixedly connected with a polishing ring body, the outer ends of the polishing ball body and the polishing ring body are respectively provided with an adsorption port, the inner wall of each adsorption port is fixedly connected with a conduction valve, the initial state of each conduction valve is in a gathering state, an adsorption cylinder is fixedly connected in the polishing ball body, an air permeable frame is fixedly connected between the inner walls of the polishing ball body, the left end of the adsorption cylinder is fixedly connected with the right end of the air permeable frame, a plurality of collision small balls which are uniformly distributed are arranged in the air permeable frame, an air permeable connecting plate is fixedly connected between the inner walls of the adsorption cylinder, the right end of the air permeable connecting plate is fixedly connected with a reaction ball, the inside of the reaction ball is fixedly connected with two bilaterally symmetrical collision extrusion bags, and the inside of the reaction ball is filled with ammonium chloride powder, the inner wall of the collision extrusion bag body is filled with barium hydroxide octahydrate powder, the lower end of the collision extrusion bag body is provided with a plurality of evenly distributed release holes, a moving type injection bottle mouth is fixedly connected between the inner walls of the release holes, the upper end and the lower end of the reaction ball are fixedly connected with flexible hoses, the two flexible hoses are communicated with the inside of the reaction ball, the inner walls of the two flexible hoses are fixedly connected with ventilation films, the inside of the adsorption cylinder is slidably connected with a piston, the right ends of the two flexible hoses are fixedly connected with the left end of the piston, so that when the polishing ball body and the polishing ring body rotate and polish the pipe mouth, the collision small balls in the ventilation frame move along with the rotation of the polishing ball body, static electricity is generated by mutual collision friction, meanwhile, the two collision extrusion bag bodies in the reaction ball also move and collide with each other, the impact force generated by collision extrudes barium hydroxide octahydrate powder to be sprayed downwards through the moving type spraying bottle mouth, and the barium hydroxide octahydrate powder is mixed and reacted with ammonium chloride powder to absorb heat, so that the temperature is reduced, the temperature in polishing of a polishing ball body and a polishing ring body is effectively reduced, ammonia gas is generated to be blown into a telescopic hose, the telescopic hose extends to push a piston to move to the right side, the piston moves to the right side to extrude the right side space and air of an adsorption cylinder, so that the left side space of the adsorption cylinder is increased, and the air flows to the left side space of the adsorption cylinder to be supplemented along with the movement of the piston, so that under the action of air flow impact, a conduction valve is jacked up, the conduction valve is converted from a gathering state into an opening state, chips are adsorbed on a ventilation frame under the action of air flow and electrostatic adsorption, and the influence of chip splashing is reduced.
Further, the inside fixedly connected with of ring body of polishing attracts the ball, fixedly connected with intercommunication spacer between the inner wall of attracting the ball, it has reducibility iron powder to fill between intercommunication spacer and the attraction ball, the outer end fixedly connected with gas injection pipe of attraction ball, the gas injection pipe is linked together with the inside of attracting the ball, the gas injection pipe is located the right side of intercommunication spacer, the one end that the gas injection pipe kept away from the attraction ball runs through the spheroidal inner wall of polishing and the outer end of ring body of polishing in proper order to extend to the spheroidal inside of polishing, gas injection pipe and adsorption cylinder fixed connection, the gas injection pipe is linked together with the inside of adsorption cylinder, the inner wall fixedly connected with rubber seal piece, the initial state of rubber seal piece is closed state, moves along with the piston right side, and the air on adsorption cylinder right side is pressed into the gas injection pipe, and opens the rubber seal piece, enters into the attraction ball in, flows reducibility iron powder department through the intercommunication spacer, makes its oxygen reaction with air, generates ferroferric oxide, produces the reaction and the heat of oxidizing and the back-mixing of oxidation and the back-mixing, and the cooling effect of the back-down powder is fully cooled down, the absorption effect is fully reduced, the absorption effect is carried out with the back-down dust is cooled down, the dust is fully cooled down, and the dust is fully cooled down.
Further, ventilative frame and ventilative connecting plate all adopt the ventilative material of polymer to make, the outer end of adsorption cylinder is loudspeaker form setting, can realize the circulation of air through ventilative frame and ventilative connecting plate that use the ventilative material of polymer to make, and establish the outer end of adsorption cylinder into loudspeaker form, be convenient for its extraction air.
Further, when the conduction valve is not extruded, the conduction valve is in a folded state, after being extruded, the conduction valve is in an open state, and in the folded state, fragments can be prevented from entering the polishing ball body and the polishing ring body, and after being extruded, the conduction valve is in the open state, so that the fragments can enter the polishing ball body and the polishing ring body to be collected.
Further, the outer end fixedly connected with sealing washer of piston, the outer end and the inner wall in adsorption tube of sealing washer in close contact, through the setting of sealing washer, reduce the air and take place the possibility of revealing through the gap between piston and the adsorption tube, improve the leakproofness, make the air fully blow into in the gas injection pipe.
Furthermore, the collision small ball is made of chemical fiber materials, the inside of the collision small ball is hollow, the collision small ball made of the chemical fiber materials is hollow, and the collision small ball is easy to move under the action of external force to generate static electricity, and chips are adsorbed through the electrostatic adsorption capacity.
Further, the inner wall of ventilative frame is equipped with the static enhancement layer, the left end of ventilative frame is equipped with the adhesive layer, through the setting of static enhancement layer, strengthens electrostatic adsorption ability, and the setting of adhesive layer makes the piece by the adhesion, is difficult for splashing again.
Further, the outer end of intercommunication spacer is excavated and is had a plurality of evenly distributed's ventilative micropore, ventilative micropore's aperture is less than the particle diameter of reducing iron powder, through ventilative micropore's setting, can realize that gas circulates through ventilative micropore, and ventilative micropore's aperture is less than the particle diameter of reducing iron powder, can prevent that reducing iron powder from leaking out through ventilative micropore.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
according to the scheme, when a pipe orifice is polished, the collision small ball is driven by movement of the polishing ball body to generate static electricity through collision friction, meanwhile, the two collision extrusion bag bodies are mutually collided, the barium hydroxide octahydrate powder is extruded downwards through collision impact force and reacts with ammonium chloride powder in a mixing mode, heat is absorbed, the temperature of the polishing ball body and the polishing ring body is reduced, ammonia gas is generated to be blown into a telescopic hose, the piston is pushed to move to extrude right side space and air of the adsorption cylinder, the left side space of the adsorption cylinder is increased, the air is extracted to supplement, chips are pushed up to conduct valves under the air flow and electrostatic adsorption effect, the chips enter the polishing ball body to be collected, the extruded air on the right side of the adsorption cylinder is blown into the suction ball body, the reducible iron powder reacts with oxygen, ferroferric oxide is generated, chips are attracted through magnetic effect to enter the polishing ring body, and the collection and cleaning of the chips are more fully and comprehensively.
Drawings
FIG. 1 is a flow chart of a tube orifice grinding and polishing process of the invention;
FIG. 2 is a schematic perspective view of an adsorption type grinding ball according to the present invention;
FIG. 3 is a schematic view of the overall structure of the adsorption type grinding ball of the present invention;
FIG. 4 is a schematic side sectional view of an adsorption type grinding ball according to the present invention;
FIG. 5 is a schematic cross-sectional view of a reaction ball according to the present invention;
FIG. 6 is an enlarged schematic view of the structure of FIG. 5A;
fig. 7 is a schematic cross-sectional view of the suction ball according to the present invention.
The reference numerals in the figures illustrate:
1. polishing the sphere; 2. polishing the ring body; 3. an adsorption cylinder; 4. a ventilation frame; 5. collision of the pellets; 6. a ventilation connecting plate; 7. a reaction ball; 8. collision extrusion bag body; 9. a release hole; 10. sports type spray bottle mouth; 11. a flexible hose; 12. a breathable film; 13. a piston; 14. a valve is conducted; 15. a suction ball; 16. an air injection pipe; 17. rubber sealing sheets; 18. communicating with the spacer.
Detailed Description
The drawings in the embodiments of the present invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only a few embodiments of the present invention; but not all embodiments, are based on embodiments in the present invention; all other embodiments obtained by those skilled in the art without undue burden; all falling within the scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples:
referring to fig. 1, a low-temperature type efficient polishing method for a pipe orifice for mold processing includes the following steps:
s1, firstly, placing a mechanical mould pipe to be polished on a workbench, fixing the mechanical mould pipe, and then mounting an adsorption type polishing ball on a polisher;
s2, driving the adsorption type polishing ball to rotate through a polishing machine to realize polishing treatment on the pipe orifice of the mechanical die pipe to be polished;
and S3, preparing polishing liquid after finishing polishing, uniformly smearing the polishing liquid on the pipe orifice of the polished mechanical die, polishing the pipe orifice, flushing the pipe orifice by using clear water, and drying the pipe orifice.
Referring to fig. 2-6, the adsorption type polishing ball in S1 comprises a polishing ball 1, the outer ends of the polishing ball 1 are fixedly connected with a polishing ring body 2, the outer ends of the polishing ball 1 and the polishing ring body 2 are both cut with adsorption ports, the inner wall of each adsorption port is fixedly connected with a conduction valve 14, the initial state of each conduction valve 14 is in a gathering state, an adsorption cylinder 3 is fixedly connected in the polishing ball 1, an air permeable frame 4 is fixedly connected between the inner walls of the polishing ball 1, the left end of the adsorption cylinder 3 is fixedly connected with the right end of the air permeable frame 4, a plurality of collision pellets 5 which are uniformly distributed are arranged in the air permeable frame 4, an air permeable connecting plate 6 is fixedly connected between the inner walls of the adsorption cylinder 3, the right end of the air permeable connecting plate 6 is fixedly connected with a reaction ball 7, the inner part of the reaction ball 7 is fixedly connected with two bilaterally symmetrical collision extrusion capsules 8, and the inner part of the reaction ball 7 is filled with ammonium chloride powder, the inner wall of the collision extrusion bag body 8 is filled with barium hydroxide octahydrate powder, the lower end of the collision extrusion bag body 8 is provided with a plurality of evenly distributed release holes 9, a moving type injection bottle mouth 10 is fixedly connected between the inner walls of the release holes 9, the upper end and the lower end of the reaction ball 7 are fixedly connected with flexible hoses 11, the two flexible hoses 11 are communicated with the inside of the reaction ball 7, the inner walls of the two flexible hoses 11 are fixedly connected with ventilation films 12, the inside of the adsorption cylinder 3 is slidingly connected with pistons 13, the right ends of the two flexible hoses 11 are fixedly connected with the left ends of the pistons 13, so that when the polishing ball 1 and the polishing ring body 2 rotate and polish the pipe mouth, the collision small balls 5 in the ventilation frame 4 move along with the rotation of the release holes, static electricity is generated by mutual collision friction, meanwhile, the two collision extrusion bag bodies 8 in the reaction ball 7 also move, the mutual collision, the impact force produced by the collision extrudes the barium hydroxide octahydrate powder to be sprayed downwards through the movable injection bottle mouth 10, the barium hydroxide octahydrate powder is mixed with the ammonium chloride powder to react, the heat is absorbed, the temperature is reduced, the temperature in the polishing of the polishing ball body 1 and the polishing ring body 2 is effectively reduced, ammonia gas is generated to be blown into the telescopic hose 11, the telescopic hose is enabled to extend and push the piston 13 to move to the right side, the piston 13 is enabled to move to the right side to extrude the right side space and air of the adsorption cylinder 3, the left side space of the adsorption cylinder 3 is enabled to be enlarged, and along with the movement of the piston 13, the air is enabled to flow to the left side space of the adsorption cylinder 3 to be supplemented, so that under the impact of the air flow, the conduction valve 14 is pushed open, the conduction valve 14 is enabled to be converted into an open state from a gathering state, the chips enter the polishing ball body 1 under the air flow and electrostatic adsorption effect, the chips are adsorbed on the ventilation frame 4, the chip collection is achieved, and the influence of the chip splashing is reduced.
Referring to fig. 2-7, a plurality of evenly distributed attraction balls 15 are fixedly connected to the inside of the polishing ring body 2, a communication spacer 18 is fixedly connected between the inner walls of the attraction balls 15, reductive iron powder is filled between the communication spacer 18 and the attraction balls 15, an air injection pipe 16 is fixedly connected to the outer end of the attraction balls 15, the air injection pipe 16 is communicated with the inside of the attraction balls 15, the air injection pipe 16 is positioned on the right side of the communication spacer 18, one end of the air injection pipe 16 far away from the attraction balls 15 sequentially penetrates through the inner wall of the polishing ball body 1 and the outer end of the polishing ring body 2 and extends to the inside of the polishing ball body 1, the air injection pipe 16 is fixedly connected with the adsorption cylinder 3, the air injection pipe 16 is communicated with the inside of the adsorption cylinder 3, the inner wall of the air injection pipe 16 is fixedly connected with a rubber sealing sheet 17, the initial state of the rubber sealing sheet 17 is in a closed state, air on the right side of the adsorption cylinder 3 is extruded and blown into the air injection pipe 16, and pushes the rubber sealing sheet 17 open, the air on the right side of the adsorption cylinder is fed into the attraction balls 15, the suction ball 15 is flowed through the communication spacer 18, the air is enabled to sequentially penetrate through the inner walls of the iron powder 1 and the outer end of the polishing ring body 2, the inner wall of the suction ball is fully cooled down, the air is fully generated by the oxidation reaction powder, the reaction of the air and the air is fully cooled down, the air is fully generated, the magnetic powder is cooled down, the magnetic powder is generated, the magnetic powder is fully and the magnetic powder is fully has the absorption effect is cooled down, and the magnetic powder is fully and the magnetic powder is cooled down, and the magnetic powder is fully and the magnetic absorption effect is cooled down, and the dust and has the magnetic absorption effect and the magnetic absorption effect is fully is cooled down.
Referring to fig. 2-4, the ventilation frame 4 and the ventilation connection plate 6 are made of high polymer ventilation materials, the outer end of the adsorption cylinder 3 is in a horn shape, ventilation can be achieved through the ventilation frame 4 and the ventilation connection plate 6 made of the high polymer ventilation materials, the outer end of the adsorption cylinder 3 is in a horn shape, air is conveniently extracted, the conduction valve 14 is in a furled state when not extruded, the conduction valve 14 is in an open state after being extruded, the conduction valve 14 can prevent fragments from entering the grinding ball 1 and the grinding ring body 2 in the furled state, and after being extruded, the conduction valve 14 is in the open state, so that the fragments can enter the grinding ball 1 and the grinding ring body 2 for collection.
Referring to fig. 2-4, a sealing ring is fixedly connected to the outer end of the piston 13, the outer end of the sealing ring is in close contact with the inner wall of the adsorption cylinder 3, the possibility that air leaks through a gap between the piston 13 and the adsorption cylinder 3 is reduced by the arrangement of the sealing ring, the tightness is improved, the air is fully blown into the gas injection pipe 16, the collision small ball 5 is made of chemical fiber materials, the inside of the collision small ball 5 is hollow, and the collision small ball 5 made of the chemical fiber materials is made into a hollow shape, so that the collision small ball is easy to move under the action of external force, static electricity is generated, and chips are adsorbed through the electrostatic adsorption capacity.
Referring to fig. 2-7, an electrostatic enhancement layer is disposed on an inner wall of the ventilation frame 4, an adhesive layer is disposed on a left end of the ventilation frame 4, electrostatic adsorption capacity is enhanced by the arrangement of the electrostatic enhancement layer, and the adhesive layer is disposed to adhere scraps, so that the scraps are not prone to splash again, a plurality of uniformly distributed ventilation micropores are cut at an outer end of the communication spacer 18, the pore diameters of the ventilation micropores are smaller than those of the reducing iron powder, through the arrangement of the ventilation micropores, gas can circulate through the ventilation micropores, and the pore diameters of the ventilation micropores are smaller than those of the reducing iron powder, so that the reducing iron powder can be prevented from leaking out through the ventilation micropores. .
In the invention, when a technician in the related process rotates and polishes the pipe orifice through the polishing ball 1 and the polishing ring body 2, the collision small ball 5 in the ventilation frame 4 moves along with the rotation of the polishing ball, the mutual collision friction generates static electricity, meanwhile, the two collision extrusion bag bodies 8 in the reaction ball 7 also move, the mutual collision is carried out, the barium hydroxide octahydrate powder is extruded by the impact force generated by the collision and is sprayed downwards through the movable injection bottle mouth 10 to be mixed and reacted with the ammonium chloride powder, the heat is absorbed, the temperature is reduced, the temperature in the polishing of the polishing ball 1 and the polishing ring body 2 is effectively reduced, ammonia gas is generated and blown into the telescopic hose 11, the piston 13 is extended and pushed to move to the right, the right side space and the air of the adsorption cylinder 3 are extruded by the piston 13, the left side space of the adsorption cylinder 3 is increased along with the movement of the piston 13, the air flows to the left space of the adsorption cylinder 3 to be supplemented, so that under the action of air flow impact, the conduction valve 14 is jacked up to be converted into an open state from a gathering state, chips enter the polishing ball body 1 under the action of air flow and electrostatic adsorption and are adsorbed on the ventilation frame 4 to realize chip collection, the influence of chip splashing is reduced, the air on the right side of the adsorption cylinder 3 is extruded and blown into the gas injection pipe 16 along with the movement of the piston 13 to the right side, the rubber sealing piece 17 is jacked up to be opened and enters the suction ball 15, the reductive iron powder flows through the communication spacer 18 to react with oxygen in the air to generate ferroferric oxide, heat generated by the reaction is mixed with barium hydroxide powder octahydrate and ammonium chloride powder to react to absorb heat and cool down, the temperature is alternated, the temperature influence is reduced, and the ferroferric oxide has magnetic effect, the chip capable of attracting the flying test is pushed open to enter the polishing ring body 2 to collect and clean, so that the collection and cleaning of the chip are more complete and the cleaning effect is effectively enhanced.
The above; is only a preferred embodiment of the present invention; the scope of the invention is not limited in this respect; any person skilled in the art is within the technical scope of the present disclosure; equivalent substitutions or changes are made according to the technical proposal of the invention and the improved conception thereof; are intended to be encompassed within the scope of the present invention.

Claims (7)

1. A low-temperature type efficient polishing method for a pipe orifice for mold processing is characterized by comprising the following steps of: the method comprises the following steps:
s1, firstly, placing a mechanical mould pipe to be polished on a workbench, fixing the mechanical mould pipe, and then mounting an adsorption type polishing ball on a polisher;
s2, driving the adsorption type polishing ball to rotate through a polishing machine to realize polishing treatment on the pipe orifice of the mechanical die pipe to be polished;
s3, preparing polishing liquid after polishing, uniformly smearing the polishing liquid on the pipe orifice of the polished mechanical die, polishing the pipe orifice, flushing the pipe orifice by using clear water and drying the pipe orifice;
the adsorption type polishing ball in S1 comprises a polishing ball body (1), the outer end of the polishing ball body (1) is fixedly connected with a polishing ring body (2), adsorption ports are formed in the outer ends of the polishing ball body (1) and the polishing ring body (2), inner walls of the adsorption ports are fixedly connected with a conduction valve (14), the initial state of the conduction valve (14) is a gathering state, an adsorption cylinder (3) is fixedly connected in the polishing ball body (1), a ventilation frame (4) is fixedly connected between the inner walls of the polishing ball body (1), the left end of the adsorption cylinder (3) is fixedly connected with the right end of the ventilation frame (4), a plurality of collision small balls (5) which are uniformly distributed are arranged in the ventilation frame (4), a ventilation connecting plate (6) is fixedly connected between the inner walls of the adsorption cylinder (3), the right end of the ventilation connecting plate (6) is fixedly connected with a reaction ball (7), two collision extrusion bag bodies (8) which are bilaterally symmetrical are fixedly connected, an inner wall of the reaction ball (7) is fixedly connected with a plurality of collision bag bodies (8), a plurality of collision bag bodies (8) are uniformly distributed in a spraying mode, a plurality of powder spraying holes (9) are uniformly distributed in the inner walls of the reaction ball (7) are filled with the inner walls, and the extrusion bag bodies (8) are uniformly distributed in a spraying mode, and the powder is sprayed on the inner wall of the powder spraying device is evenly (9, the upper end and the lower end of the reaction ball (7) are fixedly connected with flexible hoses (11), the two flexible hoses (11) are communicated with the inside of the reaction ball (7), the inner walls of the two flexible hoses (11) are fixedly connected with breathable films (12), the inside of the adsorption cylinder (3) is slidably connected with a piston (13), and the right ends of the two flexible hoses (11) are fixedly connected with the left end of the piston (13);
the inside fixedly connected with of ring body (2) of polishing attracts ball (15) a plurality of evenly distributed, fixedly connected with intercommunication spacer (18) between the inner wall of attracting ball (15), it has reducibility iron powder to fill between intercommunication spacer (18) and the attracting ball (15), the outer end fixedly connected with gas injection tube (16) of attracting ball (15), gas injection tube (16) are linked together with the inside of attracting ball (15), gas injection tube (16) are located the right side of intercommunication spacer (18), the one end that gas injection tube (16) kept away from attracting ball (15) runs through the inner wall of polishing spheroid (1) and the outer end of ring body (2) in proper order to extend to the inside of polishing spheroid (1), gas injection tube (16) are linked together with adsorption cylinder (3) fixedly, the inside fixedly connected with rubber seal piece (17) of gas injection tube (16) and adsorption cylinder (3), the initial state of rubber seal piece (17) is closed.
2. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the breathable frame (4) and the breathable connecting plate (6) are made of high-molecular breathable materials, and the outer end of the adsorption cylinder (3) is in a horn-shaped arrangement.
3. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the conduction valve (14) is in a folded state when not pressed, and the conduction valve (14) is in an open state after being pressed.
4. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the outer end of the piston (13) is fixedly connected with a sealing ring, and the outer end of the sealing ring is tightly contacted with the inner wall of the adsorption cylinder (3).
5. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the collision small ball (5) is made of chemical fiber materials, and the inside of the collision small ball (5) is hollow.
6. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the inner wall of the ventilation frame (4) is provided with an electrostatic enhancement layer, and the left end of the ventilation frame (4) is provided with an adhesive layer.
7. The method for efficiently polishing a nozzle for mold processing at a low temperature according to claim 1, wherein: the outer end of the communicating spacer (18) is provided with a plurality of uniformly distributed ventilation micropores, and the pore diameter of the ventilation micropores is smaller than the particle diameter of the reductive iron powder.
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CN117884991B (en) * 2024-03-15 2024-05-14 广州市联安汽车空调配件有限公司 Automobile part polishing equipment and application method thereof

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CN215616992U (en) * 2021-04-08 2022-01-25 河北敬业中厚板有限公司 Steel edge burr grinding and cutting equipment
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US4930264A (en) * 1989-09-26 1990-06-05 Huang Kan Chi Polishing device
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