CN115148938A - Organic light emitting diode display device and method of manufacturing the same - Google Patents
Organic light emitting diode display device and method of manufacturing the same Download PDFInfo
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- CN115148938A CN115148938A CN202210882291.6A CN202210882291A CN115148938A CN 115148938 A CN115148938 A CN 115148938A CN 202210882291 A CN202210882291 A CN 202210882291A CN 115148938 A CN115148938 A CN 115148938A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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Abstract
An organic light emitting diode display device and a method of manufacturing the same are provided. The organic light emitting diode display device comprises a display panel, a first back plate, a second back plate and a composite film. The display panel comprises a first plane part, a second plane part and a bending part, wherein the first plane part and the second plane part are oppositely arranged, and the bending part is connected to the first plane part and the second plane part. The first back plate is arranged on the surface of the first plane part facing the second plane part. The second back plate is arranged on the surface of the second plane part facing the first plane part. The composite film is arranged between the first back plate and the second back plate. The composite membrane comprises a porous adhesive layer, wherein the porous adhesive layer is provided with foam holes, and the porous adhesive layer is adhered to the first back plate. According to the application, the Emo adhesive layer and the foam in the SCF composite film layer are integrated to form the porous adhesive layer, so that the thickness of the existing SCF composite film layer is reduced, and the thickness of the organic light-emitting diode display device is reduced.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to an organic light emitting diode display device and a method for manufacturing the same.
Background
Organic Light Emitting Diode (OLED) display technology is widely used due to its advantages of self-luminescence, wide viewing angle, wide color gamut, foldability, and flexibility. One known OLED display device includes a display panel and an ultra Clean Foam (SCF) composite film on a backlight side of the display panel. The SCF composite film can play a buffering role in stress acting on the display panel, can emit heat generated by the display panel during working, and plays a certain protection effect on the display panel.
An SCF composite film is known to include an adhesive layer, a buffer layer, and a heat dissipation layer, which are sequentially stacked. The material of the bonding layer is Embo glue, which is reticulate glue and has the functions of bonding, fitting and exhausting. The material of the buffer layer is Foam (Foam), which plays a role in buffering. The heat dissipation layer is made of copper foil and has the functions of electric conduction, heat dissipation and shielding. The manufacture method of the SCF composite film comprises the steps of respectively manufacturing Embo adhesive, foam and copper foil, and compounding by a bonding process of a cutting factory. Such SCF composite films have many processing steps, resulting in high cost and large thickness.
Disclosure of Invention
In view of the above, the present disclosure provides an organic light emitting diode display device and a method for manufacturing the same, which can reduce the number of manufacturing processes, reduce the cost, and reduce the thickness.
The application provides an organic light emitting diode display device, it includes:
the display panel comprises a first plane part, a second plane part and a bending part, wherein the first plane part and the second plane part are oppositely arranged, and the bending part is connected to the first plane part and the second plane part;
a first back plate disposed on a surface of the first planar portion facing the second planar portion;
the second back plate is arranged on the surface, facing the first plane part, of the second plane part; and
a composite film disposed between the first backplane and the second backplane;
the composite membrane comprises a porous adhesive layer, wherein cells are formed in the porous adhesive layer, and the porous adhesive layer is bonded on the first back plate.
Optionally, in some embodiments, the porous adhesive layer has foamed particles dispersed therein, and the cells are formed inside the foamed particles.
Optionally, in some embodiments, the interior of the cells is in a vacuum state, and/or the cells are filled with a gas.
Optionally, in some embodiments, the porous subbing layer further comprises a foaming agent.
Optionally, in some embodiments, the composite film further includes conductive particles dispersed in the porous adhesive layer.
Optionally, in some embodiments, the material of the porous adhesive layer includes acrylic acid or polyurethane, and the material of the conductive particles is selected from at least one of Al, ag, ni, and Cu.
Optionally, in some embodiments, the porous adhesive layer includes a first surface and a second surface opposite to each other, the first surface has a cross-hatched pattern, the composite film further includes a conductive layer, the conductive layer is directly disposed on the second surface of the porous adhesive layer, and a material of the conductive layer includes a conductive silver paste.
Optionally, in some embodiments, the porous adhesive layer includes a first surface and a second surface opposite to each other, the first surface has a cross-hatched pattern, the composite film further includes a support layer disposed on the second surface of the porous adhesive layer, and a conductive layer disposed on a surface of the support layer away from the porous adhesive layer.
The present application provides a method of manufacturing an organic light emitting diode display device as described above, comprising the steps of:
providing the display panel;
forming the first back plate and the second back plate on the surface of the display panel at intervals;
adhering the composite film on the first backsheet;
arranging a reinforcing plate on the composite membrane;
bending the display panel and the second back plate to the back of the display panel to form the organic light-emitting diode display device;
the manufacturing method of the composite membrane comprises the following steps:
providing a substrate and a slurry, wherein the slurry comprises a matrix material and a solvent, and a slurry layer is formed on the substrate by using the slurry;
pre-baking to remove the solvent in the slurry layer; and
and foaming the slurry layer to form the porous adhesive layer.
Optionally, in some embodiments, the matrix material includes foamed particles, and the foaming the slurry layer to form the porous glue layer includes the steps of:
the high temperature heating expands the foamed particles to form cells inside the foamed particles.
According to the application, the Emo adhesive layer and the foam in the SCF composite film layer are integrated to form the porous adhesive layer, so that the thickness of the conventional SCF composite film layer is reduced, the thickness of the organic light-emitting diode display device is reduced, the porous adhesive layer can be formed by foaming the raw materials of the adhesive layer, the process that the Emo adhesive layer and the foam are independently formed respectively in the prior art and then are attached is replaced, the process steps are reduced, and the manufacturing cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an organic light emitting diode display device according to an embodiment of the present application.
FIG. 2 is a schematic diagram of the structure of one embodiment of the composite membrane of FIG. 1.
FIG. 3 is a schematic structural view of another embodiment of the composite membrane of FIG. 1.
FIG. 4 is a schematic structural view of yet another embodiment of the composite membrane of FIG. 1.
FIG. 5 is a schematic structural view of yet another embodiment of the composite membrane of FIG. 1.
Fig. 6 is a schematic step diagram of a method for manufacturing an organic light emitting diode display device according to an embodiment of the present application.
Fig. 7 is a schematic view illustrating a step of manufacturing a composite film in the method of manufacturing the organic light emitting diode display device of fig. 6.
Detailed Description
The technical solution in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any inventive step based on the embodiments in the present application, are within the scope of protection of the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features directly, or may comprise the first and second features not being directly connected but being in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The present application provides an organic light emitting diode display device. The organic light emitting diode display device in the embodiment of the present application may be a mobile phone, a tablet computer, an electronic reader, an electronic display screen, a notebook computer, a mobile phone, an Augmented Reality (AR) \ Virtual Reality (VR) device, a media player, a wearable device, a digital camera, a car navigation device, or the like. Specifically, the Organic Light emitting diode display device may be an Active Matrix Organic Light-emitting diode (AMOLED) display device, and may also be a Passive Matrix Organic Light-emitting diode (PMOLED) display device.
The organic light emitting diode display device comprises a display panel, a first back plate, a second back plate and a composite film. The display panel comprises a first plane part, a second plane part and a bending part, wherein the first plane part and the second plane part are oppositely arranged, and the bending part is connected to the first plane part and the second plane part. The first back plate is arranged on the surface of the first plane part facing the second plane part. The second back plate is arranged on the surface of the second plane part facing the first plane part. The composite film is arranged between the first back plate and the second back plate. The composite membrane comprises a porous adhesive layer, wherein the porous adhesive layer is provided with foam holes, and the porous adhesive layer is adhered to the first back plate.
According to the application, the Emo adhesive layer and the foam in the SCF composite film layer are integrated to form the porous adhesive layer, so that the thickness of the conventional SCF composite film layer is reduced, the thickness of the organic light-emitting diode display device is reduced, the process steps are reduced, and the manufacturing cost is reduced.
Hereinafter, specific embodiments of the present application will be described with reference to the drawings.
Referring to fig. 1, the organic light emitting diode display device 1 includes:
the display panel 200 comprises a first plane part 201, a second plane part 202 and a bent part 203, wherein the first plane part 201 and the second plane part 202 are arranged oppositely, and the bent part 203 is connected to the first plane part 201 and the second plane part 202;
a first backplate 300 disposed on a surface of the first planar portion 201 facing the second planar portion 202;
a second back plate 400 disposed on a surface of the second planar portion 202 facing the first planar portion 201;
a composite film 100 disposed between the first back sheet 300 and the second back sheet 400; and
a stiffener (stiff) 500 disposed between the composite film 100 and the second back plate 400;
wherein, the porous adhesive layer 10 is adhered to the first back plate 300.
Referring to fig. 2, the composite film 100 includes a porous adhesive layer 10 and a conductive layer 20 stacked together. Alternatively, the layer of porous glue 10 may be a layer of reticulated glue. Specifically, the layer of porous glue 10 includes opposing first and second surfaces 10a, 10b. The first surface 10a has a cross-hatched pattern, and the second surface 10b is a flat surface with respect to the first surface 10 a. The porous adhesive layer 10 itself has adhesive properties, and the conductive layer 20 is adhered to the second surface 10b of the porous adhesive layer 10. Further, the conductive layer may be directly disposed on the second surface 10b.
The material of the porous adhesive layer 10 includes acrylic or polyurethane. The base of the porous adhesive layer 10 made of acrylic or urethane having tackiness functions as adhesion, and air release. When acrylic acid and polyurethane are used as base materials of the porous adhesive layer 10, the foaming strength of the acrylic acid is different, and the foaming strength of the acrylic acid is higher, and the buffering property is better. The porous subbing layer 10 has cells 11 formed therein. The cells 11 in the layer of porous adhesive 10 provide a cushioning function to the layer of porous adhesive 10 to replace the foam in the layers of the conventional SCF composite membrane 100. It should be noted that the cells 11, i.e., micropores, are the smallest structural units that make up the individual small cells of the foam. The small pores are partially or completely surrounded by cell walls and are formed by decomposing a foaming agent, mechanically introducing a gas, or volatilizing a volatile substance or dissolving out a soluble substance in the production of a foam.
The formation of the porous adhesive layer 10 of the present application may adopt two forms, namely, physical foaming and chemical foaming. The physical foaming method is divided into two methods: 1. filling soluble solid particles or expandable microspheres to form foam; 2. an inert gas (e.g., nitrogen) is added to the slurry to be foamed. Chemical foaming methods are also divided into two categories: thermal decomposition type foaming method and reaction type foaming method. It should be noted that physical foaming is preferred because of the difficulty in controlling chemical foaming and the high degree of precision.
In the present embodiment, the cells 11 are formed by physical foaming filled with expandable microspheres. That is, the foamed particles P are dispersed in the porous adhesive layer 10, and the cells 11 of the porous adhesive layer 10 are formed inside the foamed particles P. The expanded particles P are expandable microspheres, and the shell wall material of the expandable microspheres is mostly thermoplastic acrylic resin, polycarbonate, silicone resin, or the like. For example, expandable microspheres are particles of 3 microns or less prior to expansion. The expandable microspheres grow up at high temperature, and the solid expandable microspheres are converted into mesoporous materials at high temperature. Finally, the cells 11 are formed inside the expandable microspheres, and the inside of the cells 11 is in a vacuum state. Alternatively, when the spherical shell contains helium, nitrogen, or the like, the interior of the cell 11 may be filled with helium, nitrogen, or the like. The particle size of the expandable microspheres is 0.1 to 500 μm.
In other embodiments of the present application, the porous rubber layer 10 may adopt, as its foaming means, filling the slurry with the foamed particles P that have undergone internal foaming. In this case, the expanded particles P are microspheres having an elastic material. Microspheres with an elastomeric material differ from expandable microspheres only in the size of the ball or the material and stiffness of the walls.
Referring to fig. 3, in another embodiment of the present application, the porous rubber layer 10 is formed by filling the slurry with an inert gas. Specifically, the inert gas is nitrogen. In this embodiment, the cells 11 are also formed in the porous rubber layer 10, but the cells 11 are filled with an inert gas, and the foamed particles P are not present in the porous rubber layer 10.
In other embodiments of the present application, the slurry is foamed to form the porous rubber layer 10 by using a chemical foaming method, and releasing gas through a polymerization reaction or a decomposition reaction of the foaming agent. In this case, if the foaming agent is not completely reacted, the foaming agent may be contained in the porous rubber layer 10.
It is understood that the porous rubber layer 10 of the present application can also be formed by using a plurality of foaming methods in a mixed manner, or by using a plurality of foaming methods. This is not limited in this application.
The material of the conductive layer 20 is selected from at least one of Al, ag, ni, and Cu. The conductive layer 20 also provides heat dissipation and shielding functions. Optionally, the conductive layer 20 is a conductive silver paste layer or a copper foil layer. The conductive silver paste layer can be formed in a coating mode, so that the surface of the porous adhesive layer 10 has the functions of heat dissipation and shielding, and meanwhile, the thickness of the conductive silver paste layer is smaller, and the thickness of the composite film can be further reduced.
In the known SCF composite film 100 layer, a support layer is further provided between the conductive layer 20 and the foam. The material of the support layer is Polyethylene terephthalate (PET). By coating the Embo adhesive layer on the PET, the overflow of the Embo adhesive can be prevented. In this application, because porous glue film 10 can effectively avoid the condition of excessive gluey through the foam molding, consequently, can save the PET layer. It is understood that referring to fig. 4, PET may also be disposed between the conductive layer 20 and the porous adhesive layer 10 as the support layer 30 to increase the strength of the composite film 100.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a composite film according to still another embodiment of the present application.
The composite membrane 100 includes a porous adhesive layer 10. The material of the porous adhesive layer 10 includes acrylic or polyurethane. The base of the porous adhesive layer 10 made of acrylic or urethane having tackiness functions as adhesion, and air release. When acrylic acid and polyurethane are used as base materials of the porous adhesive layer 10, the foaming strength of the acrylic acid is different, and the foaming strength of the acrylic acid is higher, and the buffering property is better. The porous adhesive layer 10 has cells 11 formed therein. The cells 11 in the layer of porous adhesive 10 provide a cushioning function to the layer of porous adhesive 10 to replace the foam in the layers of the conventional SCF composite membrane 100.
The composite film 100 further includes conductive particles 12, the conductive particles 12 being dispersed in the porous adhesive layer 10. The material of the conductive particles 12 is at least one selected from Al, ag, ni, and Cu. The conductive particles 12 are previously added to the slurry of the porous adhesive layer 10 and uniformly distributed in the slurry through a stirring process. The conductive particles 12 not only can perform the function of conducting electricity, but also can perform the functions of heat dissipation and shielding. According to the present embodiment, the composite film 100 integrates the Embo adhesive, the foam, and the conductive layer (heat dissipation layer) into a whole, thereby further reducing the thickness of the composite film 100, eliminating the step of bonding, further reducing the manufacturing process, and reducing the cost.
Referring to fig. 6, the present application further provides a method for manufacturing the organic light emitting diode display device, which includes the following steps:
101: providing a display panel;
102: forming a first back plate and a second back plate on the surface of the display panel at intervals;
103: bonding a composite film on the first back sheet;
104: arranging a reinforcing plate on the composite membrane;
105: and bending the display panel and the second back plate to the back of the display panel to form the organic light-emitting diode display device.
Referring to fig. 7, the method for manufacturing the composite film includes the following steps:
201: a substrate and a slurry are provided, the slurry including a base material and a solvent, and a slurry layer is formed on the substrate using the slurry.
In particular, the substrate may be a release film with a textured pattern to form a textured porous glue layer. The substrate may also be a substrate without a cross-hatch pattern. The slurry with low modulus and strong fluidity can be formed and then pasted with the release film with the mesh belt reticulate pattern, and the slurry with high modulus and weak fluidity can be pasted with the release film with the mesh belt reticulate pattern.
The slurry layer is formed by coating. In step 201, the paste further comprises acrylic or polyurethane as a matrix material of the porous glue layer. The matrix material in the slurry may be synthesized in a known manner. The solvent in the slurry is used to dissolve the matrix material, facilitating the formation of a slurry layer on the substrate. The solvent can be selected according to the subsequent volatilization temperature, and the solvent with high boiling point can be used when the volatilization temperature of the solvent is high, and the solvent with low boiling point can be used when the volatilization temperature of the solvent is low. In order to facilitate solvent evaporation, a low boiling point solvent, for example, methanol, ethanol or a hydrocarbon solvent, is preferable.
According to the foaming mode of the subsequent porous rubber layer, other components can be included in the slurry.
Optionally, if a foaming manner of filling the soluble solid particles or the expandable microspheres to form a foam is adopted, the slurry further includes foaming particles, i.e., the soluble solid particles or the expandable microspheres.
Alternatively, if an inert gas foaming process is used, the slurry may not include the foamed particles.
Alternatively, if a chemical foaming process is used, it may be desirable to include a foaming agent in the slurry.
Optionally, the slurry may further include conductive particles. The material of the conductive particles is at least one selected from the group consisting of Al, ag, ni, and Cu.
The buffer performance of the porous rubber layer is regulated and controlled by parameters such as the size and density of pores of foaming particles, the molecular weight of slurry and the like, so that the porous rubber layer has specific buffer performance requirements.
It should be noted that the thickness of the slurry layer is determined according to the thickness of the finally formed porous adhesive layer, and the thickness of the slurry layer is larger than that of the porous adhesive layer due to the subsequent baking to remove the solvent, for example, if the thickness of the manufactured porous adhesive layer is 100 micrometers, the thickness of the slurry layer needs to reach 300 micrometers.
The slurry may further contain other auxiliary agents such as a crosslinking agent.
202: prebaking to remove the solvent from the slurry layer.
In step 202, the substrate with the slurry layer formed thereon is pre-baked in an oven to remove the solvent. The pre-baking temperature may be 80 to 100 degrees celsius.
203: and foaming the slurry layer to form the porous adhesive layer.
In step 203, the conditions for foaming the slurry to form the porous rubber layer are different according to the foaming manner.
Alternatively, when expandable microspheres are used for foaming, the foamed particles are expanded by heating at high temperature to form cells inside the foamed particles.
Optionally, if an inert gas foaming manner is adopted, an inert gas, such as nitrogen, needs to be introduced into the slurry during the foaming process.
Optionally, if a chemical foaming method is adopted, the foaming agent reacts in a high-temperature and stirring manner, and the gas is released to form the porous adhesive layer.
Optionally, when the slurry includes conductive particles, the conductive particles are uniformly distributed in the porous adhesive layer by stirring.
In some embodiments, step 203 is followed by the steps of:
204: and forming a conductive layer on the surface of the porous adhesive layer far away from the substrate.
The material of the conductive layer is selected from at least one of Al, ag, ni, and Cu. Specifically, a conductive silver paste may be coated on the surface of the porous adhesive layer away from the substrate to form a conductive layer, or a copper foil may be bonded on the surface of the porous adhesive layer away from the substrate to form a conductive layer.
In some embodiments, step 203 is followed by the steps of:
205: and adhering a support layer on the surface of the porous adhesive layer far away from the substrate.
In some embodiments, step 203 is followed by the steps of:
205: and adhering a support layer on the surface of the porous adhesive layer far away from the substrate.
206: and forming a conductive layer on the surface of the support layer far away from the porous adhesive layer.
The material of the conductive layer is selected from at least one of Al, ag, ni, and Cu. Specifically, a conductive silver paste may be coated on the surface of the porous adhesive layer away from the substrate to form a conductive layer, or a copper foil may be bonded on the surface of the porous adhesive layer away from the substrate to form a conductive layer.
In some embodiments, when the substrate is a substrate without a cross-hatch pattern, step 203 further comprises the following steps:
207: and attaching a grid release film to the surface of the porous adhesive layer far away from the substrate so as to form a reticulate pattern on the surface of the porous adhesive layer.
In a specific embodiment, a method of making a composite film of the present application comprises the steps of:
301: a substrate and a slurry including a base material and a solvent are provided to form a slurry layer on the substrate with the slurry.
The substrate is a release film with a reticulate pattern so as to form a porous adhesive layer with reticulate patterns. The slurry is applied to the substrate to form a slurry layer. The slurry comprises acrylic acid and the solvent is methanol. Expandable microspheres are also included in the slurry as the foamed particles, and Al as the conductive particles. The thickness of the slurry layer was 300 microns.
302: and pre-baking to remove the solvent in the slurry layer.
In step 302, the substrate with the slurry layer formed thereon is pre-baked in an oven to remove the solvent. The temperature of the pre-bake may be 80 degrees celsius.
303: and foaming the slurry layer to form a porous adhesive layer.
In step 303, the substrate with the slurry layer is placed at a high temperature of 150 ℃ to expand and serve the expandable microspheres, so that a foamed adhesive porous adhesive layer with viscosity is obtained, and the conductive particles are uniformly distributed in the porous adhesive layer by stirring.
According to the manufacturing method of the composite membrane, the foaming particles are added into the Embo adhesive slurry, and after the substrate is coated with the slurry, the Embo adhesive is foamed to form a porous adhesive layer, so that the porous Embo adhesive with the buffering function is obtained.
In some embodiments, the conductive particles are added into the slurry to replace the scheme of attaching the conductive layer to the surface of the Embo adhesive, so that the process is further simplified, and the cost is reduced.
The foregoing provides a detailed description of embodiments of the present application, and the principles and embodiments of the present application have been described herein using specific examples, which are presented solely to aid in the understanding of the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An organic light emitting diode display device, comprising:
the display panel comprises a first plane part, a second plane part and a bending part, wherein the first plane part and the second plane part are oppositely arranged, and the bending part is connected to the first plane part and the second plane part;
a first back plate disposed on a surface of the first planar portion facing the second planar portion;
the second back plate is arranged on the surface, facing the first plane part, of the second plane part; and
a composite film disposed between the first and second backplates;
the composite membrane comprises a porous adhesive layer, wherein cells are formed in the porous adhesive layer, and the porous adhesive layer is bonded on the first back plate.
2. The organic light emitting diode display device of claim 1, wherein the porous adhesive layer has foamed particles dispersed therein, and the cells are formed inside the foamed particles.
3. The organic light emitting diode display device of claim 1, wherein the inside of the cells is in a vacuum state, and/or the cells are filled with a gas.
4. The organic light emitting diode display device of claim 1, wherein the porous gel layer further comprises a foaming agent.
5. The organic light emitting diode display device of claim 1, wherein the composite film further comprises conductive particles dispersed in the porous glue layer.
6. The organic light emitting diode display device of claim 5, wherein a material of the porous gel layer comprises acryl or urethane, and a material of the conductive particles is at least one selected from the group consisting of Al, ag, ni, and Cu.
7. The oled display device claimed in claim 1, wherein the porous adhesive layer includes a first surface and a second surface opposite to each other, the first surface has a mesh pattern, the composite film further includes a conductive layer directly disposed on the second surface of the porous adhesive layer, and a material of the conductive layer includes a conductive silver paste.
8. The oled display device claimed in claim 1, wherein the porous adhesive layer includes first and second opposing surfaces, the first surface having a cross-hatched pattern, the composite film further including a support layer disposed on the second surface of the porous adhesive layer and a conductive layer disposed on a surface of the support layer remote from the porous adhesive layer.
9. A method of manufacturing an organic light emitting diode display device according to any one of claims 1 to 8, comprising the steps of:
providing the display panel;
forming the first back plate and the second back plate on the surface of the display panel at intervals;
adhering the composite film on the first backsheet;
arranging a reinforcing plate on the composite membrane;
bending the display panel and the second back plate to the back of the display panel to form the organic light-emitting diode display device;
the manufacturing method of the composite membrane comprises the following steps:
providing a substrate and a slurry, wherein the slurry comprises a matrix material and a solvent, and a slurry layer is formed on the substrate by using the slurry;
pre-baking to remove the solvent in the slurry layer; and
and foaming the slurry layer to form the porous adhesive layer.
10. The method of manufacturing an organic light emitting diode display device according to claim 9, wherein the base material includes foamed particles, and the foaming the slurry layer to form the porous adhesive layer includes the steps of:
the high temperature heating expands the foamed particles to form cells inside the foamed particles.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210882291.6A CN115148938A (en) | 2022-07-26 | 2022-07-26 | Organic light emitting diode display device and method of manufacturing the same |
| PCT/CN2023/078141 WO2024021596A1 (en) | 2022-07-26 | 2023-02-24 | Organic light-emitting diode display device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210882291.6A CN115148938A (en) | 2022-07-26 | 2022-07-26 | Organic light emitting diode display device and method of manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
| CN115148938A true CN115148938A (en) | 2022-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210882291.6A Pending CN115148938A (en) | 2022-07-26 | 2022-07-26 | Organic light emitting diode display device and method of manufacturing the same |
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| Country | Link |
|---|---|
| CN (1) | CN115148938A (en) |
| WO (1) | WO2024021596A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021596A1 (en) * | 2022-07-26 | 2024-02-01 | 武汉华星光电半导体显示技术有限公司 | Organic light-emitting diode display device and manufacturing method therefor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013148768A (en) * | 2012-01-20 | 2013-08-01 | Sony Corp | Display device and electronic apparatus |
| CN108878483A (en) * | 2018-06-22 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and electronic equipment |
| CN109065506B (en) * | 2018-08-10 | 2020-05-26 | 云谷（固安）科技有限公司 | Flexible display panel and display device |
| CN111028682B (en) * | 2019-11-21 | 2021-03-23 | 武汉华星光电半导体显示技术有限公司 | Flexible display device |
| CN113990915A (en) * | 2021-11-03 | 2022-01-28 | 合肥维信诺科技有限公司 | Buffer film, preparation method of buffer film and display panel |
| CN114093274B (en) * | 2021-12-09 | 2023-01-24 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
| CN115148938A (en) * | 2022-07-26 | 2022-10-04 | 武汉华星光电半导体显示技术有限公司 | Organic light emitting diode display device and method of manufacturing the same |
-
2022
- 2022-07-26 CN CN202210882291.6A patent/CN115148938A/en active Pending
-
2023
- 2023-02-24 WO PCT/CN2023/078141 patent/WO2024021596A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021596A1 (en) * | 2022-07-26 | 2024-02-01 | 武汉华星光电半导体显示技术有限公司 | Organic light-emitting diode display device and manufacturing method therefor |
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| Publication number | Publication date |
|---|---|
| WO2024021596A1 (en) | 2024-02-01 |
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