CN113556910A

CN113556910A - Light modulation structure, manufacturing method thereof, electronic equipment shell and electronic equipment

Info

Publication number: CN113556910A
Application number: CN202110778872.0A
Authority: CN
Inventors: 王雷
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-09
Filing date: 2021-07-09
Publication date: 2021-10-26
Anticipated expiration: 2041-07-09
Also published as: CN113556910B; WO2023279841A1

Abstract

The application relates to a dimming structure, a manufacturing method of the dimming structure, an electronic equipment shell and electronic equipment. The light adjusting structure comprises a first substrate and a second substrate which are oppositely arranged at intervals, a first conductive film and a second conductive film which are oppositely arranged at intervals, frame glue and PDLC. The manufacturing method of the dimming structure comprises the following steps: providing a first substrate and a second substrate, and respectively forming a first conductive film and a second conductive film on one side surfaces of the first substrate and the second substrate; the first substrate and the second substrate are correspondingly arranged and are fixedly connected through frame glue to form a sealed cavity, wherein the first conductive film and the second conductive film are contained in the sealed cavity; vacuumizing the sealed cavity and injecting PDLC into the sealed cavity in sequence; and irradiating the PDLC with ultraviolet rays. By the mode, the PDLC can be directly poured into the sealed cavity, direct contact between the PDLC and the first substrate and direct contact between the PDLC and the second substrate are reduced, and the surfaces of the first substrate and the second substrate are not easily polluted by the PDLC.

Description

Light modulation structure, manufacturing method thereof, electronic equipment shell and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a dimming structure, a manufacturing method of the dimming structure, an electronic equipment shell and electronic equipment.

Background

Due to the limitation of the technical development, the electronic products such as mobile phones are more and more slowly changed, and the homogeneity of the products of the large manufacturers is higher and higher. In order to find the differentiation of products, various manufacturers aim to decorate the mobile phone housing, such as the mobile phone housing of the electronic device housing adopting the PDLC. When the electronic equipment shell adopting the PDLC is in severe environments such as high temperature, high humidity, salt mist and the like, the molecular weight of liquid crystal in the PDLC is very low, and the liquid crystal is easy to escape from a polymer to cause edge failure.

Disclosure of Invention

The application provides a dimming structure, a manufacturing method of the dimming structure, an electronic equipment shell and electronic equipment.

The embodiment of the application provides a structure of adjusting luminance includes:

the first substrate and the second substrate are oppositely arranged at intervals;

the first conductive film and the second conductive film are oppositely arranged at intervals, the first conductive film is arranged on the surface of the first substrate facing the second substrate, and the second conductive film is arranged on the surface of the second substrate facing the first substrate; and

the frame glue, one side surface of the frame glue is fixedly connected with the first substrate, the other side surface of the frame glue is fixedly connected with the second substrate, the frame glue, the first substrate and the second substrate form a sealed cavity in a surrounding mode, and the first conductive film and the second conductive film are contained in the sealed cavity; and

the PDLC is contained in the sealed cavity.

The embodiment of the application further provides a manufacturing method of the dimming structure, which comprises the following steps:

providing a first substrate and a second substrate;

forming a first conductive film and a second conductive film on one side surfaces of the first substrate and the second substrate, respectively;

the first substrate and the second substrate are correspondingly arranged and are fixedly connected through frame glue to form a sealed cavity, wherein the first conductive film and the second conductive film are contained in the sealed cavity;

vacuumizing the sealed cavity and injecting PDLC into the sealed cavity in sequence;

and irradiating the PDLC with ultraviolet rays.

An embodiment of the present application further provides an electronic device housing, including:

a light modulating structure; and

the first decorative film and the second decorative film are respectively positioned on the surfaces of two sides of the light adjusting structure, which are opposite to each other.

An embodiment of the present application further provides a middle electronic device, including:

an electronic device housing; and

the display screen is fixedly connected with the electronic equipment shell.

According to the manufacturing method of the dimming structure, the frame glue, the first substrate and the second substrate enclose the sealed cavity, so that the PDLC can be directly poured into the sealed cavity, the direct contact between the PDLC and the first substrate and the direct contact between the PDLC and the second substrate are reduced, and the surfaces of the first substrate and the second substrate are not easily polluted by the PDLC; in addition, the frame glue is directly and fixedly connected with the first substrate and the second substrate, so that the connection firmness of the frame glue is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic perspective view of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of the electronic device shown in FIG. 1 along direction A-A;

FIG. 3 is a schematic partial cross-sectional view of an electronic device housing of the electronic device shown in FIG. 2;

FIG. 4 is a schematic cross-sectional view of a dimming structure according to the prior art;

FIG. 5 is a schematic interface diagram of a second prior art dimming architecture;

FIG. 6 is a schematic cross-sectional view of the electronic device housing of FIG. 3 taken along direction B-B;

FIG. 7 is a schematic cross-sectional view of a dimming structure in the electronics housing shown in FIG. 6;

fig. 8 is a schematic cross-sectional view of a variation of the dimming structure shown in fig. 7;

FIG. 9 is a schematic cross-sectional view of the electronic device housing of FIG. 3 taken along the direction C-C;

fig. 10 is a flowchart of a method for manufacturing a dimming structure according to an embodiment of the present application;

fig. 11 is a sub-flowchart of step S02 in the method for manufacturing the dimming structure shown in fig. 10;

fig. 12 is a sub-flowchart of step S03 in the method for manufacturing the dimming structure shown in fig. 10;

fig. 13-17 are schematic cross-sectional views illustrating a method of fabricating the dimming structure of fig. 10;

FIG. 18 is a schematic cross-sectional view of a dimming structure in accordance with a further embodiment of the present application;

fig. 19 is a schematic cross-sectional view of a variation of the dimming structure shown in fig. 18.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, the present application provides an electronic device 1000. Specifically, the electronic device 1000 may be any of various types of computer system devices (only one modality shown in fig. 1 by way of example) that are mobile or portable and that perform wireless communications. Specifically, the electronic device 1000 may be a mobile phone or smart phone (e.g., an iPhone (TM) based, Android (TM) based phone), a Portable gaming device (e.g., a Nintendo DS (TM), a PlayStation Portable (TM), a Game Advance (TM), an iPhone (TM)), a laptop, a PDA, a Portable Internet device, a music player and data storage device, other handheld devices and devices such as a headset, and the like, and the electronic device 1000 may also be other wearable devices that require charging (e.g., a Head Mounted Device (HMD) such as an electronic bracelet, an electronic necklace, an electronic device or a smart watch).

The electronic device 1000 may also be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving Picture experts group (MPEG-1 or MPEG-2) Audio layer 3(MP3) players, portable medical devices, and digital cameras and combinations thereof.

In some cases, the electronic device 1000 may perform multiple functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device 1000 may be a device such as a cellular telephone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.

Referring to fig. 2 and fig. 3, an embodiment of the present application provides an electronic device 1000, which may include but is not limited to: the electronic device comprises an electronic device shell 100 and a display screen 200, wherein the display screen 200 is fixedly connected with the electronic device shell 100 and forms an accommodating space 101 with the electronic device shell 100, and the accommodating space 101 can be used for accommodating devices such as a battery, a mainboard and a camera assembly.

Referring to fig. 4, the electronic device housing 100 may include a light-adjusting structure 10, and a first decorative film 20 and a second decorative film 30 respectively disposed on two opposite side surfaces of the light-adjusting structure 10, wherein the first decorative film 20 faces one side of the display screen 200, and the second decorative film 30 faces away from the one side of the display screen 200. The first decorative film 20 and the second decorative film 30 are respectively fixedly connected to the light-adjusting structure 10 through the optical adhesive 40.

The dimming structure 10 can be in a transparent state in a power-on state, so that the surface of the electronic device casing 100 presents a mixed pattern formed by overlapping the first decorative film 20 and the second decorative film 30; in the power-off state, the electronic device housing 100 is in an opaque milky white state or a translucent state, so that the surface of the electronic device housing 100 only presents the pattern of the second decorative film 30. That is, the electronic device housing 100 can change the external decorative pattern of the electronic device housing 100 by adjusting the on/off state of the dimming structure 10.

It should be noted that the terms "first", "second" and "third" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

The electronic device housing 100 using the dimming structure 10 may encounter different scenes during use, such as severe environments with high temperature, high humidity, salt fog, etc., and may easily overflow from the PDLC layer, thereby causing the edge of the electronic device housing 100 to fail. Further, the liquid crystal in the PDLC layer usually occupies 40-60% of the volume fraction, and when the liquid crystal in the PDLC layer overflows, some holes are generated in the PDLC layer, which directly affects the bonding force of the PDLC layer, and in severe cases, the PDLC layer is delaminated. Particularly, in consumer electronics products that need to be moved frequently, when the electronic products are dropped accidentally, hit by external force, and vibrate slightly, the liquid crystal is easy to overflow, so that the light adjusting structure 10 is ineffective.

Referring to fig. 5 and 6, in the prior art, the dimming structure 300 generally includes a first substrate 301, a first conductive film 302, a PDLC layer 303, a second conductive film 304, and a second substrate 305, which are sequentially stacked. To solve the liquid crystal overflow of the PDLC layer 303 in the dimming structure 300, the PDLC layer 303 is generally packaged in two ways: first, glue is directly coated on the edge of the light adjusting structure 300, that is, the encapsulation glue 306 is coated on the edges of the first substrate 301, the first conductive film 302, the PDLC layer 303, the second conductive film 304 and the second substrate 305 and cured, so as to achieve the purpose of encapsulating the PDLC layer 303. Although the above method is simple, on one hand, the glue is only applied to the surface of the light adjusting structure 300 and is easily removed, and on the other hand, the glue is easily overflowed from the edge of the light adjusting structure 300 to the surfaces of the first substrate 301 and the second substrate 305, which causes the appearance of the light adjusting structure 300 to be contaminated (as shown in fig. 5). Secondly, an edge sealing groove 307 penetrating through the first substrate 301, the first conductive film 302 and the PDLC layer 303 is formed on the surface of the light adjusting structure 300 by cutting, glue is directly applied to the edge sealing groove 307 to be cured to form an edge sealing glue 308 so as to encapsulate the PDLC layer 303, and then the edge sealing glue 308 and the light adjusting structure 300 are cut along a central line parallel to the edge sealing glue 308. By such design, it cannot be ensured that the glue can be completely leveled in the edge sealing groove 307, so that the edge sealing frame glue 308 deviating from the second conductive film 304 is not flush with the surface of the first substrate 301 deviating from the first conductive layer when the edge sealing groove 307 is not filled with the glue in actual operation, or the glue overflows from the edge sealing groove 307 to cause appearance pollution of the electronic device housing 100 (as shown in fig. 6). In view of the above problems, embodiments of the present application provide a new dimming structure.

Referring to fig. 7, the light-adjusting structure 10 may include a first substrate 11, a first conductive film 12, a Polymer Dispersed Liquid Crystal (PDLC) 13, a sealant 14, a second conductive film 15, and a second substrate 16. The first substrate 11 and the second substrate 16 are disposed opposite to each other with a gap therebetween, and the first conductive film 12 and the second conductive film 15 are disposed between the first substrate 11 and the second substrate 16, specifically, the first conductive film 12 is disposed on a surface of the first substrate 11 facing the second substrate 16, and the second conductive film 15 is disposed on a surface of the second substrate 16 facing the first substrate 11. The PDLC13 is located between the first conductive film 12 and the second conductive film 15, wherein one side surface of the sealant 14 is fixedly connected to the first substrate 11, the other side surface of the sealant 14 is fixedly connected to the second substrate 16, the sealant 14, the first substrate 11 and the second substrate 16 enclose a sealing cavity 102, the sealing cavity 102 is used for accommodating the PDLC13 and preventing the PDLC13 from overflowing, and the first conductive film 12 and the second conductive film 15 are accommodated in the sealing cavity 102 and used for applying an electric field to the PDLC 13.

It is to be understood that "the first substrate" and "the second substrate" appearing above and hereinafter may be replaced by each other and may be both expressed by "the substrate", and that "the first conductive film" and "the second conductive film" appearing above and hereinafter may be replaced by each other and may be both expressed by "the conductive film".

Wherein, the Polymer Dispersed Liquid Crystal (PDLC) is dispersed in the organic solid polymer matrix in micron-sized droplets. When the liquid crystal is freely aligned, its refractive index does not match that of the matrix, and light is strongly scattered by the droplets while passing through the matrix to assume an opaque milky white state or a translucent state. Application of an electric field can adjust the optical axis orientation of the liquid crystal droplets, which when index matched, appear transparent. Upon removal of the electric field, the liquid crystal droplets returned to their original dispersed state, which was opalescent.

Specifically, the first conductive film 12 and the second conductive film 15 are respectively located on two opposite sides of the PDLC13 to apply an electric field to the PDLC 13; the first substrate 11 is disposed adjacent to the first conductive film 12 for fixing the first conductive film 12; the second substrate 16 is disposed adjacent to the second conductive film 15 for fixing the second conductive film 15.

Optionally, the first substrate 11 and the second substrate 16 are both transparent structures, so that light can pass through the first substrate 11 and the second substrate 16. Specifically, the first substrate 11 and the second substrate 16 are made of the same material, and the first substrate 11 and the second substrate 16 may include one or more of PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide), and COP (cyclic olefin copolymer). The first substrate 11 is used for supporting and protecting the first conductive film 12, and the second substrate 16 is used for supporting and protecting the second conductive film 15.

Optionally, the first conductive film 12 and the second conductive film 15 are also transparent structures. The first conductive film 12 and the second conductive film 15 may include one of ITO (indium tin oxide), FTO (fluorine doped tin oxide), or Metal mesh, the first conductive film 12 is formed on the surface of the first substrate 11 by photolithography, and the second conductive film 15 is formed on the surface of the second substrate 16 by photolithography. In this embodiment, the first substrate 11 is made of a PET flexible material, and the first conductive film 12 is formed by yellow etching of indium tin oxide. In particular, indium tin oxide has as its main characteristic a combination of electrical conductivity and optical transparency. Indium tin oxide is a mixture, is a transparent brown film or a yellow-to-gray block, is formed by mixing 90% of In2O3 and 10% of SnO2, and can be used for manufacturing liquid crystal displays, flat panel displays, plasma displays, touch screens, electronic paper, organic light emitting diodes, solar cells, antistatic coating films, EMI shielding transparent conductive coating films, various optical coating films and the like.

The PDLC13 further includes a first gap structure 17, the first gap structure 17 being located between the first conductive film 12 and the second conductive film 15 for supporting the first substrate 11 and the second substrate 16 on the one hand and for controlling the distance between the first conductive film 12 and the second conductive film 15 on the other hand.

Further, the first gap structures 17 may be randomly distributed between the first conductive film 12 and the second conductive film 15. The first gap structure 17 may be selected from one or more of plastic (fine acryl resin particles), glass (rod-like particles), and silicone (spherical particles). The first gap structures 17 have a grain size of about 9-20 μm, such as 9 μm, 12 μm, 15 μm, 20 μm, etc., which are not listed here, so that the distance between the first conductive film 12 and the second conductive film 15 is 9-20 μm. In the present embodiment, the particle size of the first gap structure 17 is 15 μm, so that the distance between the first conductive film 12 and the second conductive film 15 is ensured, the thickness of the PDLC13 is ensured, and the thickness of the light modulation structure 10 is reduced as much as possible, so that the electronic device case 100 is light and thin.

It can be understood that, since the materials of the substrate and the conductive film are different from each other, the adhesion performance of the sealant 14 and the substrate is much greater than that of the substrate and the conductive film, and therefore the sealant 14 is usually directly and fixedly connected to the first substrate 11 and the second substrate 16, so as to increase the bonding firmness of the sealant 14.

Specifically, the first conductive film 12 and the second conductive film 15 are completely accommodated in the sealed cavity 102 (as shown in fig. 7), that is, the first conductive film 12 is located in an inner ring range of the orthographic projection of the sealant 14 on the first substrate 11, and the second conductive film 15 is located in an inner ring range of the orthographic projection of the sealant 14 on the second substrate 16. By the above manner, the sealant 14 can be fully contacted with the first substrate 11 and the second substrate 16, so as to enhance the bonding firmness of the sealant 14 with the first substrate 11 and the second substrate 16 and the reliability of the sealed cavity 102.

Referring to fig. 8, in another embodiment, the first conductive film 12 and the second conductive film 15 may be partially accommodated in the sealed cavity 102. Specifically, the first conductive film 12 exceeds an inner ring range of the orthographic projection of the sealant 14 on the first substrate 11 but is located within an outer ring range of the orthographic projection of the sealant 14 on the first substrate 11, and the second conductive film 15 exceeds the inner ring range of the orthographic projection of the sealant 14 on the second substrate 16 but is located within an outer ring range of the orthographic projection of the sealant 14 on the second substrate 16. By the above method, the electric field range between the first conductive film 12 and the second conductive film 15 can be enlarged as much as possible, and the bonding firmness of the sealant 14 with the first substrate 11 and the second substrate 16 and the reliability of the sealed cavity 102 are not affected.

The sealant 14 includes a glue 141 and a second gap structure 142 mixed with the glue 141. The glue 141 is a thermosetting glue, an ultraviolet curing glue or a thermosetting and ultraviolet dual curing glue, so as to facilitate the fast curing of the frame glue 14. The second gap structure 142 is located between the first substrate 11 and the second substrate 16, wherein the second gap structure 142 occupies about 0.1-0.5% of the volume of the sealant 14, and is used for supporting the first substrate 11 and the second substrate 16, and controlling the distance between the first substrate 11 and the second substrate 16.

Specifically, the second gap structure 142 may be selected from one or more of a plastic system (acryl resin particles), a glass system (rod-shaped particles), and a silicon oxide system (spherical particles). The grain size of the second gap structure 142 is slightly larger than that of the first gap structure 17. The second gap structure 142 has a grain size of about 12-25 μm, such as 12 μm, 15 μm, 20 μm, 25 μm, etc., which are not listed here, so that the distance between the first conductive film 12 and the second conductive film 15 is 9-20 μm. In the present embodiment, the particle size of the first gap structure 17 is 20 μm.

Referring to fig. 7, the light-adjusting structure 10 may further include a first electrode 18 and a second electrode 19, the first electrode 18 is electrically connected to the first conductive film 12, the second electrode 19 is electrically connected to the second conductive film 15, and the first electrode 18 and the second electrode 19 are disposed in a staggered manner. Specifically, the first electrode 18 is formed on the surface of the first conductive film 12, and the second electrode 19 is formed on the surface of the second conductive film 15. The first electrode 18 and the second electrode 19 are formed after thermal curing by adopting a silk-screen silver paste process, so that the cost is low, the process is simple, and the mass production is convenient.

Specifically, the first electrode 18 and the second electrode 19 are used for supplying power to the electric field between the first conductive film 12 and the second conductive film 15. The first electrode 18 and the second electrode 19 are disposed in a staggered manner, so as to prevent the first electrode 18 and the second electrode 19 from blocking light to affect the ultraviolet curing of the PDLC 13. The first electrode 18 and the second electrode 19 may include, but are not limited to, a single-layer or multi-layer composite metal trace such as silver/silver paste curing, copper/copper paste curing, aluminum, molybdenum aluminum molybdenum, etc., which is not illustrated herein.

Referring to fig. 9, in an embodiment, the sealant 14 may include a first sealant 1401 and a second sealant 1402, wherein the second sealant 1402 is contained in the first sealant 1401, and the sealed cavity 102 is enclosed by the first sealant 1401, the second sealant 1402, the first substrate 11, and the second substrate 16. Taking the rear case of the electronic device 1000 such as the rear cover of a mobile phone as an example, the range of the second sealant 14 is a camera area for accommodating a camera component.

Referring to fig. 7, in the dimming structure 10 according to the embodiment of the present application, the sealant 14, the first substrate 11 and the second substrate 16 enclose a sealed cavity 102, and the sealed cavity 102 accommodates the PDLC13 to prevent the PDLC13 from leaking; in addition, the sealant 14 is directly fixed to the first substrate 11 and the second substrate 16, so that the reliability of the sealed cavity 102 can be enhanced.

Referring to fig. 10 to 17, an embodiment of the present application further provides a method for manufacturing a light modulation structure, including the following steps:

step S01: a first substrate 11 and a second substrate 16 are provided, and a first conductive film 12 and a second conductive film 15 are formed on one side surfaces of the first substrate 11 and the second substrate 16, respectively (as shown in fig. 13).

Specifically, the first substrate 11 and the second substrate 16 are both transparent structures, so that light can pass through the first substrate 11 and the second substrate 16. The first substrate 11 and the second substrate 16 are made of the same material, and the first substrate 11 and the second substrate 16 may include one or more of PET (polyethylene terephthalate), PC (polycarbonate), PI (polyimide), and COP (cyclic olefin copolymer), which is not limited herein.

In this step, the first conductive film 12 and the second conductive film 15 are formed by photolithography. Specifically, the first conductive film 12 and the second conductive film 15 may be formed by yellow etching one of ITO (indium tin oxide), FTO (fluorine doped tin oxide), or Metal mesh. The first conductive film 12 is formed by photolithography on the surface of the first substrate 11, and the second conductive film 15 is formed by photolithography on the surface of the second substrate 16.

In this embodiment, the first substrate 11 is made of a PET flexible material, and the first conductive film 12 is formed by yellow etching of indium tin oxide. In particular, indium tin oxide has as its main characteristic a combination of electrical conductivity and optical transparency. Indium tin oxide is a mixture, is a transparent brown film or a yellow-to-gray block, is formed by mixing 90% of In2O3 and 10% of SnO2, and can be used for manufacturing liquid crystal displays, flat panel displays, plasma displays, touch screens, electronic paper, organic light emitting diodes, solar cells, antistatic coating films, EMI shielding transparent conductive coating films, various optical coating films and the like.

Further, step S01 further includes the following steps: a first electrode 18 and a second electrode 19 are formed on the first conductive film 12 and the second conductive film 15, respectively, wherein the first electrode 18 and the second electrode 19 are disposed in a staggered manner.

In step S02, the first substrate 11 and the second substrate 16 are disposed correspondingly and fixedly connected by the sealant 14 to form a sealed cavity 102, wherein the first conductive film 12 and the second conductive film 15 are contained in the sealed cavity 102.

Specifically, step S02 may further include the steps of:

in step S21, a sealant 14 is formed on the surface of the first substrate 11 where the first conductive film 12 is disposed.

Before step S21, it is first ensured that the size of the first conductive film 12 is smaller than that of the first substrate 11, and the size of the second conductive film 15 is smaller than that of the second substrate 16. Namely, the first conductive film 12 at the edge of the first substrate 11 and the second conductive film 15 at the edge of the second substrate 16 are etched away, so that the sealant 14 can be directly and fixedly connected with the first substrate 11 and the second substrate 16. Because the materials of the substrate and the conductive film are greatly different, the bonding performance of the sealant 14 and the substrate is much greater than that of the substrate and the conductive film, so the sealant 14 is usually directly and fixedly connected with the first substrate 11 and the second substrate 16, and the bonding firmness of the sealant 14 can be improved.

The sealant 14 includes a glue 141 and a second gap structure 142 mixed with the glue 141. The second gap structure 142 is located between the first substrate 11 and the second substrate 16, wherein the second gap structure 142 occupies about 0.1-0.5% of the volume of the sealant 14, and is used for supporting the first substrate 11 and the second substrate 16, and controlling the distance between the first substrate 11 and the second substrate 16.

Specifically, the second gap structure 142 may be selected from one or more of a plastic system (acryl resin particles), a glass system (rod-shaped particles), and a silicon oxide system (spherical particles). The second gap structure 142 has a grain size of about 12-25 μm, such as 12 μm, 15 μm, 20 μm, 25 μm, etc., which are not listed here, so that the distance between the first conductive film 12 and the second conductive film 15 is 9-20 μm. In the present embodiment, the particle size of the first gap structure 17 is 20 μm.

The glue 141 of the sealant 14 can be applied to the surface of the first substrate 11 by a screen printing process or a dispensing process. The viscosity of the glue 141 depends on different processing technologies, the silk-screen printing technology selects 10000cps, and the dispensing technology selects 1000 cps and 5000 cps.

Further, step S21 includes step S211:

an opening 1403 is formed in the sealant 14 (as shown in fig. 14).

It can be understood that, in the subsequent step S24, when the first substrate 11 and the second substrate 16 are fixedly connected by the sealant 14 to form the sealed cavity 102, the opening 1403 can be used as an exhaust port to exhaust the air in the sealed cavity 102, so as to prevent the air in the sealed cavity 102 from being unable to be exhausted during the process of the first substrate 11 approaching the second substrate 16, which affects the reliability of the sealed cavity 102. In this step, the number of the openings 1403 is at least one, but may also be two or three, which is not listed here.

In step S22, the first gap structures 17 are sprayed on the surface of the second conductive film 15 disposed on the second substrate 16.

Specifically, the first gap structures 17 may be randomly distributed between the first conductive film 12 and the second conductive film 15. The first gap structure 17 may be selected from one or more of plastic (fine acryl resin particles), glass (rod-like particles), and silicone (spherical particles). The first gap structures 17 have a grain size of about 9-20 μm, such as 9 μm, 12 μm, 15 μm, 20 μm, etc., which are not listed here, so that the distance between the first conductive film 12 and the second conductive film 15 is 9-20 μm. In the present embodiment, the particle size of the first gap structure 17 is 15 μm, so that the distance between the first conductive film 12 and the second conductive film 15 is ensured, the thickness of the PDLC13 is ensured, and the thickness of the light modulation structure 10 is reduced as much as possible, so that the electronic device case 100 is light and thin. The grain size of the second gap structure 142 is slightly larger than that of the first gap structure 17, and specifically, the grain size of the second gap structure 142 is approximately equal to the sum of the grain size of the first gap structure 17 and the thicknesses of the first conductive film 12 and the second conductive film 15.

In step S23, the first substrate 11 and the second substrate 16 are disposed in correspondence with each other, and the second conductive film 15 is disposed facing the first conductive film 12.

This step is used to adjust the position of the first substrate 11 relative to the second substrate 16, so that the first substrate 11 and the second substrate 16 are correspondingly disposed.

Step S24, the sealant 14 and the surface of the second substrate 16 away from the second conductive film 15 are fixedly connected to form a sealed cavity 102 (as shown in fig. 15).

Specifically, the surface of the sealant 14 away from the first substrate 11 is directly bonded to the surface of the second substrate 16, so as to improve the reliability of the bonding of the sealant 14.

It can be understood that the sealant 14 is in a gel state, and the sealant 14 needs to be cured quickly to ensure the bonding firmness of the sealant 14. The glue 141 of the sealant 14 is a thermosetting glue 141, an ultraviolet curing glue 141, or one of thermosetting and ultraviolet dual curing glues 141, so as to facilitate the rapid curing of the sealant 14.

In step S25, the sealant 14 is cured.

In this embodiment, the glue 141 of the sealant 14 is an ultraviolet curing glue 141, that is, the glue 141 is rapidly cured by irradiating the first substrate 11 and the second substrate 16 with ultraviolet rays.

In step S03, the sealed chamber 102 is sequentially evacuated and filled with PDLC13 (as shown in fig. 16).

Step S03 includes the following steps:

in step S31, the sealed chamber 102 is evacuated through the opening 1403.

The sealed cavity 102 is vacuumized through the opening 1403, so that the PDLC13 can completely fill the sealed cavity 102, bubbles in the sealed cavity 102 are prevented, and the light transmittance and consistency of the PDLC13 are affected. In this step, the opening 1403 serves as a pumping port for exhausting the gas in the sealed chamber 102.

In step S32, the sealed chamber 102 is filled with PDLC13 through the opening 1403.

Based on step S31, since the sealed cavity 102 is in a vacuum state, the glue 141 can be injected into the sealed cavity 102 through the opening 1403 by the atmospheric pressure, so as to realize the crystal filling operation of the sealed cavity 102. In this step, the opening 1403 serves as a seed filling port for filling the PDLC13 into the sealed cavity 102.

In step S04, the PDLC13 is cured.

Because the poured PDLC13 has fluidity, PDLC13 needs to be cured to avoid overflowing PDLC 13. Specifically, the first substrate 11 and the second substrate 16 are irradiated with ultraviolet rays simultaneously, so that the PDLC13 is cured.

Step S05, cutting off the redundant part according to the preset shape to generate the light adjusting structure 10.

For example, taking the electronic device housing 100 such as a mobile phone back shell as an example, the mobile phone back shell is provided with a camera hole 104. In step S21, a first frame 1401 and a second frame sealant 1402 are formed on the surface of the first substrate 11 on which the first conductive film 12 is disposed. The first frame 1401, the second frame rubber 1402, the first substrate 11, and the second substrate 16 enclose a sealed cavity 102, and the second frame rubber 1402, the first substrate 11, and the second substrate 16 enclose a camera cavity 103. Wherein the sealed cavity 102 is used for injecting liquid crystal, and the camera cavity 103 is used for digging a hole to be used as a camera hole 104. In this step, a part of the structure at the position corresponding to the camera cavity 103 needs to be cut off.

In step S06, the opening 1403 is sealed by dispensing (as shown in fig. 17).

It can be understood that the opening 1403 is a passage through which the sealed cavity 102 communicates with the outside, and if the sealed cavity is not sealed, liquid crystal molecules in the PDLC13 are prone to overflow, thereby affecting the stability and reliability of the dimming structure 10.

Optionally, the glue used for sealing the opening 1403 may be the same as the glue 141 used for the sealant 14, so that the sealant 14 has the same structure, and other glue materials, such as epoxy resin, may also be used, which is not limited herein.

In step S07, the first decorative film 20 and the second decorative film 30 are formed on the surfaces of the first substrate 11 and the second substrate 16, respectively, to produce the electronic device case 100.

Referring to fig. 18, in an embodiment, in step S21, a first opening 1403a may be formed on the first frame 1401, and a second opening 1403b communicating with the sealed cavity 102 may be formed on the second sealant 14, where the first opening 1403a is used for communicating the sealed cavity 102 with the outside, so as to achieve the air exhaust and crystal filling of the sealed cavity 102. The second opening 1403b is used for communicating the camera cavity 103 with the sealed cavity 102, so that air in the camera cavity 103 can be exhausted from the sealed cavity 102 in the process of enabling the first substrate 11 to approach the second substrate 16, and the stability of connection between the first substrate 11 and the second substrate 16 is further ensured. Wherein the first opening 1403a can be located at any position of the first frame in the electronic device casing 100. In this embodiment, the first opening 1403a is located at the long side of the first frame, so that the die-filling speed can be increased, the die-filling efficiency can be improved, and the manufacturing process can be shortened.

It is to be understood that, in the process of sequentially evacuating the sealed chamber 102 and injecting the PDLC13 in step S03, the camera chamber 103 is simultaneously evacuated and injected with the PDLC 13. Step S04 irradiates ultraviolet light to the PDLC13 in the sealed chamber 102 and the camera chamber 103. Step S05 cuts out the dimming structure 10 at the position of the camera cavity 103 to generate the camera hole 104. In step S06, the first opening 1403a and the second opening 1403b are sealed by dispensing, so as to generate the light modulation structure 10.

Referring to fig. 19, in another embodiment, in step S21, a first opening 1403a may be formed in the first sealant 14, and a second opening 1403b may be formed in the first substrate 11 or the second substrate 16 corresponding to the camera cavity 103. Wherein the first opening 1403a is used for communicating the sealed cavity 102 with the outside so as to realize the air exhaust and crystal filling of the sealed cavity 102. The second opening 1403b is used for communicating the camera cavity 103 with the outside, so that air in the camera cavity 103 can be exhausted from the second opening 1403b in the process of enabling the first substrate 11 to approach the second substrate 16, and the stability of connection between the first substrate 11 and the second substrate 16 is further ensured.

It is understood that, in step S03, only the sealed cavity 102 is sequentially evacuated and filled with the PDLC 13. Step S04 performs ultraviolet light irradiation only on the PDLC13 of the sealed cavity 102. Step S05 cuts out the first substrate 11 and the second substrate 16 at the position of the camera cavity 103. In step S06, the first opening 1403a is sealed by dispensing, and the light modulation structure 10 is generated.

In other embodiments, when the light adjusting structure 10 is applied to the electronic device 1000, the first conductive film 12 and the second conductive film 15 are produced by photolithography in step S02, and the sizes of the first conductive film 12 and the second conductive film 15 can be flexibly adjusted to leave sufficient antenna clearance, so that the design can reduce the stress on the antenna design.

In the manufacturing method of the dimming structure 10 provided in the embodiment of the present application, the sealant 14, the first substrate 11 and the second substrate 16 enclose the sealed cavity 102, so that the PDLC13 can be directly poured into the sealed cavity 102, and direct contact between the PDLC13 and the first substrate 11 and the second substrate 16 is reduced, so that the surfaces of the first substrate 11 and the second substrate 16 are not easily contaminated by the PDLC 13; in addition, the sealant 14 is directly and fixedly connected with the first substrate 11 and the second substrate 16, so that the connection firmness of the sealant 14 is improved.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A dimming structure, comprising:

the first conductive film and the second conductive film are oppositely arranged at intervals, the first conductive film is arranged on the surface of the first substrate facing the second substrate, and the second conductive film is arranged on the surface of the second substrate facing the first substrate;

the PDLC is contained in the sealed cavity.

2. The structure of claim 1, further comprising a first gap structure between the first conductive film and the second conductive film for controlling a distance between the first conductive film and the second conductive film.

3. A light-adjusting structure according to claim 1, wherein the sealant includes a glue and a second gap structure mixed with the glue, and the glue is one of a thermosetting glue, an ultraviolet curing glue, or a thermosetting and ultraviolet dual curing glue.

4. The structure of any one of claims 1, wherein the first substrate, the first conductive film, the second conductive film and the second substrate are transparent.

5. A dimming structure as claimed in any one of claims 1 to 4, wherein the first and second substrates comprise one or more of polyethylene terephthalate, polycarbonate, polyimide, cyclic olefin copolymer.

6. The structure of any one of claims 1-4, wherein the first and second conductive films comprise one or more of indium tin oxide, fluorine-doped tin oxide, or metal mesh.

7. The structure of claim 1, further comprising a first electrode and a second electrode, wherein the first electrode is electrically connected to the first conductive film, the second electrode is electrically connected to the second conductive film, and the first electrode and the second electrode are disposed in a staggered manner.

8. A manufacturing method of a dimming structure is characterized by comprising the following steps:

providing a first substrate and a second substrate, and respectively forming a first conductive film and a second conductive film on one side surfaces of the first substrate and the second substrate;

and carrying out curing treatment on the PDLC.

9. The method for manufacturing a light control structure according to claim 8,

the first substrate and the second substrate are correspondingly arranged and fixedly connected through frame glue to form a sealing cavity, and the method comprises the following steps of:

forming frame glue on the surface of the first substrate, on which the first conductive film is arranged;

enabling the first substrate and the second substrate to be arranged correspondingly, and enabling the second conductive film to be arranged towards the first conductive film;

and fixedly connecting the frame glue with the surface of the second substrate departing from the second conductive film to form a sealing cavity.

10. The method for manufacturing a light control structure according to claim 9,

the first substrate and the second substrate are correspondingly arranged, and the step of arranging the second conductive film facing the first conductive film further comprises the following steps:

and spraying a first gap structure on the surface of the second substrate provided with the second conductive film.

11. The method for manufacturing a light control structure according to claim 8,

before the step of fixedly connecting the sealant and the surface of the second substrate departing from the second conductive film and forming a sealed cavity, the method further comprises the following steps:

opening an opening on the frame rubber;

the steps of sequentially vacuumizing the sealed cavity and injecting PDLC comprise:

vacuumizing the sealed cavity and injecting PDLC into the sealed cavity through the opening in sequence;

after the step of irradiating the PDLC with ultraviolet rays, the method further comprises the following steps:

and dispensing and sealing the opening.

12. The method for manufacturing a light control structure according to claim 8,

the method further comprises the following steps after the steps of forming a first conductive film and a second conductive film on one side surfaces of the first substrate and the second substrate respectively:

forming a first electrode and a second electrode on the first substrate and the second substrate, respectively;

wherein the first electrode and the second electrode are arranged in a staggered manner.

13. An electronic device housing, comprising:

a dimming structure as claimed in any one of claims 1 to 7; and

14. An electronic device, comprising

The electronic device housing of claim 13; and

the display screen is fixedly connected with the electronic equipment shell.