CN114667013A - Shell assembly and electronic equipment - Google Patents

Shell assembly and electronic equipment Download PDF

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Publication number
CN114667013A
CN114667013A CN202210226065.2A CN202210226065A CN114667013A CN 114667013 A CN114667013 A CN 114667013A CN 202210226065 A CN202210226065 A CN 202210226065A CN 114667013 A CN114667013 A CN 114667013A
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CN
China
Prior art keywords
substrate
housing assembly
magnetic
working medium
accommodating cavity
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Granted
Application number
CN202210226065.2A
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Chinese (zh)
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CN114667013B (en
Inventor
叶万俊
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN202210226065.2A priority Critical patent/CN114667013B/en
Publication of CN114667013A publication Critical patent/CN114667013A/en
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Publication of CN114667013B publication Critical patent/CN114667013B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0243Mechanical details of casings for decorative purposes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/37Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
    • G09F9/375Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the position of the elements being controlled by the application of a magnetic field
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279Improving the user comfort or ergonomics
    • H04M1/0283Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

Abstract

The application provides a casing subassembly and electronic equipment, this casing subassembly includes: the device comprises a first substrate, a second substrate, a magnetofluid working medium and a plurality of electromagnetic coils; the second substrate is arranged opposite to the first substrate, a rubber frame is clamped between the first substrate and the second substrate, and the rubber frame, the first substrate and the second substrate are surrounded to form an accommodating cavity; the magnetofluid working medium is filled in the accommodating cavity; the plurality of electromagnetic coils are arranged in the accommodating cavity in a preset pattern and can generate a magnetic field in a power-on state, so that the magnetic fluid working medium is driven to flow in the accommodating cavity, and a dynamic pattern effect is generated. The shell assembly utilizes the principle that the magnetofluid working medium moves under a changing magnetic field, the electromagnetic coil is arranged in the accommodating cavity for accommodating the magnetofluid working medium, the magnetic field of the electromagnetic coil is controlled, the magnetofluid working medium can be driven to flow, and the shell assembly can show a dynamic pattern effect.

Description

Shell assembly and electronic equipment
Technical Field
The invention relates to the technical field of shell structures of electronic equipment, in particular to a shell assembly and electronic equipment.
Background
With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become indispensable tools for people. When a consumer faces a mobile terminal product with full-purpose of enamel, not only needs to consider whether the functions of the product meet the requirements of the consumer, but also the appearance of the product is one of the important factors for judging whether the consumer purchases the product. However, as the mobile terminal is iterated, the appearance of each brand of mobile terminal gradually becomes homogeneous, the appearance identification is poor, and after the mobile terminal leaves the factory, the color and the pattern of the mobile terminal are usually fixed and are prone to aesthetic fatigue for a long time. Therefore, if an electronic equipment shell with a dynamic pattern display effect is designed, the competitiveness of the product can be greatly improved.
Disclosure of Invention
A first aspect of embodiments of the present application provides a housing assembly for an electronic device, the housing assembly comprising:
a light-transmissive first substrate;
the second substrate is arranged opposite to the first substrate, a rubber frame is clamped between the first substrate and the second substrate, and the rubber frame, the first substrate and the second substrate are enclosed to form an accommodating cavity;
the magnetofluid working medium is filled in the accommodating cavity; and
the electromagnetic coils are arranged in the accommodating cavity in a preset pattern and can generate a magnetic field in a power-on state, so that the magnetic fluid working medium is driven to flow in the accommodating cavity, and a dynamic pattern effect is generated.
In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a display screen module, a control circuit board, and the housing assembly in any one of the foregoing embodiments; the display screen module is matched with the shell assembly to form an accommodating space, the control circuit board is arranged in the accommodating space, and the control circuit board is electrically connected with the electromagnetic coil in the shell assembly and used for controlling the shell assembly to display a dynamic pattern effect.
The shell assembly for the electronic equipment provided by the embodiment of the application utilizes the principle that the magnetofluid working medium moves under the changed magnetic field, the electromagnetic coil is arranged in the containing cavity for containing the magnetofluid working medium, the magnetic field of the electromagnetic coil is controlled, the magnetofluid working medium can be driven to flow, the shell assembly can show a dynamic pattern effect, and the appearance expressive force of products is improved. The shell assembly in the embodiment has the characteristics of simple structure, light weight, thinness and accurate magnetic field control.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic overall structural diagram of an embodiment of a housing assembly for an electronic device according to the present application;
FIG. 2 is a schematic cross-sectional view of the housing assembly at A-A in the embodiment of FIG. 1;
FIG. 3 is a schematic cross-sectional view of an embodiment of a magnetic particle of the present application;
FIG. 4 is a schematic cross-sectional view of another embodiment of a magnetic particle of the present application;
FIG. 5 is a schematic view of a structure for forming a plating film on a base substrate;
FIG. 6 is a schematic diagram of magnetic particles formed after pulverization of a film layer;
FIG. 7 is a schematic cross-sectional view of another embodiment of the housing assembly of the present application;
FIG. 8 is a schematic structural view of a lead wire in the present embodiment;
FIG. 9 is a schematic front view of the construction of the housing assembly of the present application;
FIG. 10 is a schematic cross-sectional view of a housing assembly for an electronic device according to yet another embodiment of the present application;
FIG. 11 is a schematic overall structural view of another embodiment of a housing assembly for an electronic device according to the present application;
FIG. 12 is a schematic cross-sectional view of the housing assembly at B-B in the embodiment of FIG. 11;
FIG. 13 is a schematic diagram of the configuration of the electromagnetic coil in cooperation with the optical fiber;
FIG. 14 is a schematic cross-sectional view of another embodiment of a housing assembly for an electronic device of the present application;
FIG. 15 is a schematic cross-sectional structural view of yet another embodiment of the housing assembly of the present application;
FIG. 16 is a schematic structural diagram of an embodiment of an electronic device of the present application;
FIG. 17 is a schematic sectional view of the electronic device at C-C in the embodiment of FIG. 16;
fig. 18 is a block diagram illustrating a structural configuration of an embodiment of an electronic device according to the present application.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.
According to an aspect, an embodiment of the present application provides a housing assembly for an electronic device, please refer to fig. 1 and fig. 2 together, fig. 1 is a schematic overall structure diagram of an embodiment of a housing assembly for an electronic device, and fig. 2 is a schematic cross-sectional view of the housing assembly at a-a in the embodiment of fig. 1. The housing assembly 100 for an electronic device includes, but is not limited to, the following structures: the electromagnetic coil comprises a first substrate 110, a second substrate 120, a magnetic fluid working medium 130 and a plurality of electromagnetic coils 140.
Specifically, the second substrate 120 is disposed opposite to the first substrate 110, the rubber frame 150 is sandwiched between the first substrate 110 and the second substrate 120, and the rubber frame 150, the first substrate 110 and the second substrate 120 surround the first substrate 110 and the second substrate 120 to form the accommodating cavity 1100. The first substrate 110 may be made of a transparent material, and the second substrate 120 may be made of a transparent material or a non-transparent material. The adhesive frame 150 may be formed by transparent adhesive solidification. The first substrate 110 and the second substrate 120 may be made of PET (Polyethylene terephthalate, a condensation Polymer of terephthalic acid and ethylene glycol, commonly called as dacron resin), PMMA (poly (methyl methacrylate), polymethyl methacrylate, also called as acryl, or organic glass), PC (Polycarbonate, a high molecular Polymer containing carbonate in a molecular chain), PI (Polyimide), COP (Cyclo Olefin Polymer), and the like. Further material types for the first substrate 110 and the second substrate 120 are not enumerated and detailed herein, as would be understood by one of ordinary skill in the art.
Optionally, with continued reference to fig. 2, the magnetic fluid working medium 130 is filled in the accommodating chamber 1100. The magnetic fluid working medium 130 may include a solvent and magnetic particles doped in the solvent to have a color effect. The term "having a color effect" as used herein means that the magnetic particles may be formed by coating themselves with a colored paint or by refracting light to form a color effect, and the detailed structure will be described later.
The solvent in the magnetic fluid working medium 130 may be an organic solvent, such as simethicone, polyethylene glycol, and the like. In one embodiment, the magnetic particles may include a magnetic core of a magnetic material and a color layer disposed on a surface of the magnetic core. Referring to fig. 3, fig. 3 is a schematic cross-sectional view of an embodiment of the magnetic particle 131 of the present application, in which the magnetic particle includes a magnetic core 1311 made of magnetic materials such as iron, cobalt, and nickel, and a color layer 1312 wrapping an outer surface of the magnetic core 1311, where the color layer 1312 may be a paint having a color to form a color particle. The magnetic core 1311 is mainly used as a magnetic material so that the magnetic particles 131 can move under the driving of a magnetic field.
In another embodiment, the magnetic particles may comprise a magnetic core of a magnetic material and a layer of a photorefractive material provided on a surface of the magnetic core. Referring to fig. 4, fig. 4 is a schematic cross-sectional view of another embodiment of the magnetic particle of the present application. The magnetic particles 131 in this embodiment may include a magnetic core 1311 made of magnetic material such as iron, cobalt, nickel, etc., and a light refracting material layer 1313 wrapped around the outer surface of the magnetic core 1311. In the present embodiment, the light refracting material layer 1313 may include silicon oxide (e.g., silicon dioxide) layers 13131 and titanium oxide (e.g., titanium dioxide) layers 13132 alternately stacked in this order. The silicon oxide layer 13131 and the titanium oxide layer 13132 are particles having an optical effect formed mainly by refraction of light.
Optionally, with continued reference to FIG. 4, the magnetic particle 131 of the present embodiment further comprises a connection strengthening layer 1314, and the connection strengthening layer 1314 is disposed between the magnetic core 1311 and the light refractive material layer 1313. In this embodiment, a layer of the photorefractive material layer 1313 close to the magnetic core 1311 may be silicon dioxide, the material of the magnetic core 1311 may be nickel, the connection strengthening layer 1314 may be cadmium, and Cr may be SiO2And Ni adhesion material capable of improving Ni and SiO2And the adhesion therebetween.
Alternatively, in this embodiment, the magnetic particles 131 may be formed by sequentially coating TiO on the substrate base plate based on an evaporation coating technique2、SiO2Cr, Ni, etc. Referring to fig. 5, fig. 5 is a schematic structural diagram of such a coating formed on a substrate, after the coating is completed, the film 1310 is completely peeled off from the substrate 1320, and the film 1310 is prepared into powder (magnetic particles 131) with uniform particle size by using a pulverizing technique (specifically, a jet milling device). Referring to fig. 6, fig. 6 is a schematic view of magnetic particles formed after the film is pulverized. Alternatively, the particle size of the magnetic particles 131 can be controlled to about 10 μm, because if the particle size is too large, the granular feeling is too strong, the fineness of the appearance is not sufficient, and the fluidity is worse, and if the particle size is too small, the cost is greatly increased. And then mixing the magnetic particles 131 with an organic solvent to obtain the magnetofluid working medium 130.
In this embodiment, a laminated structure of the light refractive material layer 1313 and a method for manufacturing the same are only schematically shown, and in some other embodiments, a person skilled in the art can design the material, the number of laminated layers, and the laminated relationship of the light refractive material layer 1313 according to the requirement of the magnetic particles 131 for light refraction, which will not be further described herein.
Alternatively, referring to fig. 1 and 2, the plurality of electromagnetic coils 140 are arranged in the accommodating cavity 1100 in a predetermined pattern shape, and the plurality of electromagnetic coils 140 are connected to an external control circuit (not shown). The arrangement pattern of the plurality of electromagnetic coils 140 can be designed by those skilled in the art, and only one type of "Z" arrangement pattern is illustrated in the illustrated embodiment of the present application. The plurality of electromagnetic coils 140 can generate a magnetic field in the energized state, so as to drive the magnetic fluid working medium 130 to flow in the accommodating cavity 1100, thereby generating a dynamic pattern effect. Compared with the conventional technical scheme in which an electromagnet is attached to the outside of the magnetic fluid working medium packaging structure, the shell assembly in the embodiment has a lighter and thinner volume by arranging the miniature electromagnetic coil in the packaged magnetic fluid working medium.
The shell assembly for the electronic equipment provided by the embodiment of the application utilizes the principle that the magnetofluid working medium moves under the changed magnetic field, and the electromagnetic coil is arranged in the containing cavity for containing the magnetofluid working medium, and the magnetic field of the electromagnetic coil is controlled to drive the magnetofluid working medium to flow, so that the shell assembly can present a dynamic pattern effect, and the appearance expressive force of a product is improved. The shell assembly in the embodiment has the characteristics of simple structure, light weight, thinness and accurate magnetic field control.
Referring to fig. 7, fig. 7 is a schematic cross-sectional view of another embodiment of the housing assembly of the present application, which is different from the foregoing embodiments, in the housing assembly 100 of the present embodiment, a conducting wire 160 is further disposed in the accommodating cavity 1100, wherein the conducting wire 160 may be disposed on at least one of the first substrate 110 and the second substrate 120 for enclosing a surface forming the accommodating cavity 1100; alternatively, the conducting wires 160 in this embodiment are simultaneously disposed on the first substrate 110 and the second substrate 120 to enclose the surface forming the accommodating cavity 1100, and two conducting wires 160 (respectively serving as a positive electrode and a negative electrode connected to an external circuit) connected to the same electromagnetic coil 140 form a group.
Optionally, referring to fig. 8, fig. 8 is a schematic structural diagram of the conductive line in the present embodiment, and the illustration takes one side of the first substrate as an example for description. The conductive wires in this embodiment may be thin films of materials such as Indium Tin Oxide (ITO), zinc aluminum oxide (AZO) tin oxide doped with Fluorine (FTO), or graphene, which are formed on the first substrate 110 and the second substrate 120 by Physical Vapor Deposition (PVD), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, and direct current discharge ion plating). In the embodiment, the ITO is taken as an example, and the film made of the ITO material has a good water vapor and oxygen blocking effect. A layout of the conductive line 160 as shown in fig. 8 is then formed by a process of masking and etching. The specific process can comprise film pressing, exposure, development, etching, film stripping, ultraviolet baking, protective film pasting and the like; the specific etching process for the ITO thin film is within the understanding of those skilled in the art and will not be described herein.
Optionally, in the present embodiment, the plurality of sets of conducting wires are provided, and each electromagnetic coil 140 is connected to an external control circuit through one set of conducting wires 160 (the conducting wires 160 are connected to the external circuit in a binding manner), so that the plurality of electromagnetic coils 140 can be controlled independently, and any one of the electromagnetic coils 140 can be energized through the conducting wires 160 and the magnetic field strength thereof can be controlled, so that the magnetic field generated by each electromagnetic coil 140 can be controlled accurately, and a controllable dynamic pattern effect can be achieved. Referring to fig. 9, fig. 9 is a schematic structural front view of the housing assembly of the present application, wherein the electromagnetic coils 140 are sequentially controlled according to the arrangement of the electromagnetic coils 140, so as to obtain a desired dynamic pattern effect. Taking fig. 9 as an example, the electromagnetic coils 140 may be sequentially controlled to be energized in the arrow direction, so as to generate a corresponding magnetic field to drive the magnetic fluid working medium 130 to move endlessly, and specifically, the magnetic fluid working medium 130 may be controlled to flow in the arrow direction, so as to obtain a dynamic colorful effect in a macroscopic view. In addition, in some other embodiments, the arrangement pattern of the electromagnetic coils 140 may be in other forms, and the control manner may be various, so as to obtain various dynamic pattern effects.
Referring to fig. 10, fig. 10 is a schematic cross-sectional view of a housing assembly for an electronic device according to another embodiment of the present disclosure, which is different from the foregoing embodiment, a second rubber frame 190 is further interposed between the first substrate 110 and the second substrate 120 in the present embodiment, the second rubber frame 190 at least partially covers the electromagnetic coil 140, and the electromagnetic coil 140 is isolated from the magnetic fluid working medium 130 by the second rubber frame 190, so that the service life of the electromagnetic coil 140 can be prolonged. The second glue frame 190 may be transparent resin glue or non-transparent glue, and is not limited herein. In the present embodiment, the second glue frame 190 is shown as being connected to the upper and lower sets of wires 160, respectively, but may be configured to enclose the wires 160 therein. In addition, in some other embodiments, a structure in which the second rubber frame 190 is directly bonded to the first substrate 110 and the second substrate 120 (that is, no conductive line is disposed or the second rubber frame 190 does not extend along the conductive line) may also be used, and details of the structural features of this part are not described herein again.
Referring to fig. 11 and 12 together, fig. 11 is a schematic overall structural diagram of another embodiment of a housing assembly for an electronic device according to the present application, and fig. 12 is a schematic structural sectional view at B-B of the housing assembly in the embodiment of fig. 11. Housing assembly 100 in this embodiment also includes a first substrate 110, a second substrate 120, a magnetic fluid working medium 130, and a plurality of electromagnetic coils 140. The second substrate 120 is disposed opposite to the first substrate 110, and a rubber frame 150 is sandwiched between the first substrate 110 and the second substrate 120, so as to form an accommodating cavity 1100 between the first substrate 110 and the second substrate 120. The magnetic fluid working medium 130 is filled in the accommodating cavity 1100. The plurality of electromagnetic coils 140 are arranged in the accommodating cavity 1100 in a preset pattern shape, and the plurality of electromagnetic coils 140 can generate a magnetic field in a power-on state, so that the magnetic fluid working medium 130 is driven to flow in the accommodating cavity 1100, and a dynamic pattern effect is generated. For the specific material, structure and preparation method of the magnetic fluid working medium 130, please refer to the related description of the foregoing embodiments, and further description is omitted here.
Unlike the previous embodiments, the housing assembly 100 in this embodiment further includes an optical fiber 170. The optical fiber 170 is disposed at an end thereof corresponding to a light source, and specifically, the optical fiber 170 may be disposed at an end thereof corresponding to a laser generator 171, or the optical fiber 170 may be disposed corresponding to light sources (not shown) such as a flash lamp of an electronic device, so as to emit light into the optical fiber 170, so that the optical fiber 170 may emit light, and supplement light to magnetic particles in the magnetic fluid working medium 130, so that the housing assembly 100 may display a dynamic pattern effect of the magnetic fluid working medium 130 in a dark environment. The optical fiber 170 is disposed in the accommodating cavity 1100 in a shape of a predetermined pattern, at least a portion of the plurality of electromagnetic coils 140 is disposed along the optical fiber 170, and optionally, the plurality of electromagnetic coils 140 in this embodiment are sequentially arranged along the predetermined pattern and respectively wound around the optical fiber 170. An electromagnetic coil 140 is wound around the optical fiber 170 at intervals. Referring to fig. 13, fig. 13 is a schematic diagram of a structure of the electromagnetic coil and the optical fiber, in which a dotted line represents a magnetic field generated by the electromagnetic coil 140.
The casing subassembly that this embodiment provided, through setting up the optic fibre structure, optic fibre can give out light on the one hand, forms and predetermines light pattern, and on the other hand can give the granule light filling in the magnetic fluid working medium through optic fibre, even if also can obtain better outward appearance effect in darker environment.
Referring to fig. 14, fig. 14 is a schematic cross-sectional view of another embodiment of the housing assembly for an electronic device in the present application, and is different from the embodiment in fig. 12 in that a second rubber frame 190 is further interposed between the first substrate 110 and the second substrate 120 in the present embodiment, the second rubber frame 190 at least partially covers the electromagnetic coil 140 and the optical fiber 170, and the electromagnetic coil 140 is wound around an outer periphery of the optical fiber 170. Optionally, the second frame 190 in this embodiment may be made of transparent resin, so that the light emitted from the optical fiber 170 can be transmitted through the second frame 190.
Further, the housing assembly 100 in the embodiment of the present application may further include a transparent housing, please refer to fig. 15, fig. 15 is a schematic cross-sectional view of a structure of another embodiment of the housing assembly of the present application, and the transparent housing 180 is attached to a surface of the first substrate 110 facing away from the accommodating cavity 1100. The material of the transparent casing 180 may be glass, resin, etc., and is not limited in particular.
In addition, an electronic device is further provided in the embodiment of the present application, please refer to fig. 16 and 17 together, fig. 16 is a schematic structural diagram of an embodiment of the electronic device of the present application, and fig. 17 is a schematic structural cross-sectional diagram of the electronic device at a position C-C in the embodiment of fig. 16. For a detailed structure of the housing assembly 100, please refer to the related description of the foregoing embodiments, which is not repeated herein.
Optionally, the display screen module 300 in this embodiment cooperates with the housing assembly 100 to form the accommodating space 1000, the control circuit board 200 is disposed in the accommodating space 1000, and the control circuit board 200 is electrically connected to the housing assembly 100 and the display screen module 300 and is configured to control the display surface of the display screen module 300 and the housing assembly 100 to display the dynamic pattern effect.
Optionally, the heating device 210 on the control circuit board 200 (which may be a device that generates heat obviously in a working state such as a chip on the control circuit board 200, and the type of the heating device 210 is not specifically limited here) may be attached to the housing assembly 100 (the attachment may be through a heat conduction material, or a contact attachment, as long as a good heat conduction performance can be achieved, and the specific attachment form is not specifically limited), and when the magnetic fluid working medium of the housing assembly 100 flows, a soaking effect may be achieved. Because the liquid has good heat-conducting property, the flowing magnetic fluid working medium can bring the heat in the area of the heating device 210 on the control circuit board 200 to other areas of the shell assembly 100, so that the heat distribution is more uniform, and the heat dissipation performance is improved.
In addition, the detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein again.
Referring to fig. 18, fig. 18 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10.
Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941 or the like; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.
In the electronic device of the embodiment, the housing thereof may exhibit a dynamic pattern effect. Specifically, the shell assembly of the electronic device utilizes the principle that the magnetofluid working medium moves under a changing magnetic field, the electromagnetic coil is arranged in the containing cavity for containing the magnetofluid working medium, the magnetic field of the electromagnetic coil is controlled, the magnetofluid working medium can be driven to flow, the shell assembly can show a dynamic pattern effect, and the appearance expressive force of a product is improved. The shell assembly in the embodiment has the characteristics of simple structure, light weight, thinness and accurate magnetic field control. In addition, the shell assembly in the embodiment of the application can bring the heat of the heating device area of the control circuit board to other areas of the shell assembly by utilizing the flowing magnetic fluid working medium, so that the heat is distributed more uniformly, and further the heat dissipation efficiency of the electronic equipment is improved.
The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (15)

1. A housing assembly for an electronic device, the housing assembly comprising:
a light-transmissive first substrate;
the second substrate is arranged opposite to the first substrate, a rubber frame is clamped between the first substrate and the second substrate, and the rubber frame, the first substrate and the second substrate are enclosed to form an accommodating cavity;
the magnetofluid working medium is filled in the accommodating cavity; and
the electromagnetic coils are arranged in the accommodating cavity in a preset pattern and can generate a magnetic field in a power-on state, so that the magnetic fluid working medium is driven to flow in the accommodating cavity, and a dynamic pattern effect is generated.
2. The housing assembly of claim 1, further comprising a wire through which the plurality of electromagnetic coils are electrically connected to an external control circuit.
3. The housing assembly of claim 2, wherein the conductive lines comprise an ITO film disposed on a surface of at least one of the first and second substrates facing the receiving cavity.
4. The housing assembly of claim 2 wherein said leads are in a plurality of sets, each of said solenoids being electrically connected to said external control circuit through a set of said leads, thereby enabling said plurality of solenoids to be independently controlled.
5. The housing assembly of claim 1, further comprising an optical fiber, wherein an end of the optical fiber is disposed corresponding to the light source, the optical fiber is disposed in the receiving cavity in a predetermined pattern, and at least a portion of the plurality of electromagnetic coils is disposed along the optical fiber.
6. The housing assembly of claim 5, wherein the plurality of electromagnetic coils are sequentially arranged along the predetermined pattern and respectively wound around the optical fibers.
7. The housing assembly of any of claims 1-6, further including a second frame interposed between the first and second substrates, the second frame at least partially enclosing the electromagnetic coil.
8. The housing assembly of claim 1 wherein the magnetic fluid working substance comprises a solvent and magnetic particles doped with a color effect in the solvent.
9. The housing assembly of claim 8, wherein the magnetic particles comprise a magnetic core made of a magnetic material and a color layer disposed on a surface of the magnetic core.
10. The housing assembly of claim 8, wherein the magnetic particles comprise a magnetic core made of a magnetic material and a layer of light refracting material disposed on a surface of the magnetic core.
11. The housing assembly of claim 10, wherein the light refracting material layer includes silicon oxide layers and titanium oxide layers alternately stacked in sequence.
12. The housing assembly of claim 10, wherein the core is made of nickel; and a connection strengthening layer made of metal cadmium is also arranged between the magnetic core and the light refracting material layer.
13. The housing assembly of claim 1, further comprising a transparent housing attached to a surface of the first substrate facing away from the receiving cavity.
14. An electronic device comprising a display screen module, a control circuit board, and the housing assembly of any one of claims 1-13; the display screen module is matched with the shell assembly to form an accommodating space, the control circuit board is arranged in the accommodating space, and the control circuit board is electrically connected with the electromagnetic coil in the shell assembly and used for controlling the shell assembly to display a dynamic pattern effect.
15. The electronic device of claim 14, wherein the heat generating component on the control circuit board is attached to the housing assembly.
CN202210226065.2A 2022-03-09 2022-03-09 Housing assembly and electronic equipment Active CN114667013B (en)

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CN113453501B (en) * 2021-06-11 2022-11-29 Oppo广东移动通信有限公司 Electronic equipment and shell assembly thereof

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