CN115144124A

CN115144124A - Sensor and valve assembly

Info

Publication number: CN115144124A
Application number: CN202110339821.8A
Authority: CN
Inventors: 李琳龙; 万霞; 逯新凯; 饶欢欢; 金骑宏; 黄隆重; 黄宁杰
Original assignee: Hangzhou Sanhua Research Institute Co Ltd
Current assignee: Hangzhou Sanhua Research Institute Co Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2022-10-04

Abstract

A sensor and valve assembly is provided, the sensor including a housing, a circuit board, and a temperature sensing element; the sensor is provided with an inner cavity, and the circuit board is accommodated in the inner cavity; the shell comprises a first shell part and a second shell part which are fixed with each other; the circuit board is located between the second housing portion and the first housing portion in a height direction along the sensor; a portion of the first housing portion is disposed circumferentially around the second housing portion; the temperature sensing element comprises a first part and a second part which are connected; the first part is provided with a temperature sensing area; the second part is electrically connected with the first part and the circuit board; the shell is provided with a containing part penetrating through the inner wall surface and the outer wall surface of the shell, and the second part is at least partially positioned in the containing part; at least a portion of the second portion is secured to the housing. The sensor structure that this application provided is simpler.

Description

Sensor and valve assembly

Technical Field

The application relates to the technical field of signal detection devices, in particular to a sensor and a valve assembly.

Background

The sensor in the related art comprises a shell, a circuit board, a temperature sensing element and a pressure sensing element, wherein the circuit board is accommodated in an inner cavity enclosed by the shell, the temperature sensing element comprises a temperature sensing head and a slender conductive pin, the sensor shell is provided with a fluid channel, the temperature sensing head usually extends out in the direction far away from the circuit board through the channel as far as possible, so that the temperature sensing head can be closer to fluid to be detected, one end of the conductive pin is connected with the temperature sensing head, and the other end of the conductive pin is welded to the circuit board.

In some technologies, a closed tubular part is used for wrapping a temperature sensing element, or a protective sleeve is sleeved on part of pins of the temperature sensing element and the periphery of a temperature sensing head, so that the impact force of fluid on the pins can be reduced, the slender conductive pins are prevented from shaking and falling as much as possible, however, corresponding protective shells need to be added to the sensor, even other structures need to be arranged for fixing the protective shells, and the structure of the sensor shell is complex.

Disclosure of Invention

The purpose of the present application is to provide a sensor with a simple housing structure and a valve assembly including the sensor.

In one aspect, the present application provides a sensor comprising a housing, a circuit board, and a temperature sensing element; the sensor is provided with an inner cavity, and the circuit board is accommodated in the inner cavity;

the shell comprises a first shell part and a second shell part which are fixed with each other; a partial housing of the first housing portion circumferentially surrounds an outer peripheral side of the second housing portion;

the temperature sensing element comprises a first part and a second part which are connected; the first part is provided with a temperature sensing area; the second part is electrically connected with the first part and the circuit board;

the first shell part is of an integral structure and is provided with an accommodating part, the first shell part is provided with an inner wall surface close to the inner cavity and an outer wall surface far away from the inner cavity, the accommodating part penetrates through the inner wall surface and the outer wall surface, and at least part of the second part is positioned in the accommodating part; at least a portion of the second portion is secured with the first housing portion.

The application provides a sensor, the at least part of second portion is located between the internal face of first casing part and the outer wall, and the at least part of second portion is fixed with first casing part, sets up like this, is favorable to playing certain fixed and protection to second portion through the first casing part of shell to be favorable to simplifying the shell structure of sensor.

In another aspect, the present application further provides a valve assembly including a valve body and a sensor secured to the valve body; the valve body portion is provided with a cavity, and the sensor is at least partially positioned in the cavity;

the sensor comprises a shell, a circuit board and a temperature sensing element; the sensor is provided with an inner cavity, and the circuit board is accommodated in the inner cavity;

the housing includes a first wall having an inner wall surface proximate the interior cavity and an outer wall surface distal from the interior cavity; the first wall is provided with an accommodating part which penetrates through the inner wall surface and the outer wall surface, and the second part is at least partially positioned in the accommodating part; at least a portion of the second portion is secured to the first wall;

the valve body portion has a cavity wall surface forming the cavity portion; at least partial area of the outer wall surface is in contact with the wall surface of the cavity; or, the outer wall surface is not in contact with the cavity wall surface, and the valve assembly further comprises a gasket which is compressed between the sensor and the valve body; the gasket is in contact with the outer wall surface, and the gasket is in contact with the cavity wall surface.

The application provides a valve module, the second portion of temperature-sensing element is fixed with the first wall of shell at least partially, sets up like this, is favorable to playing certain fixed and protection to the second portion through the shell, has also simplified the structure of valve module when simplifying sensor shell structure.

Drawings

FIG. 1 is a schematic perspective view of a sensor according to the present application;

FIG. 2 is a schematic perspective view of the sensor shown in FIG. 1 at another angle;

FIG. 3 is an exploded view of a portion of the sensor shown in FIG. 1;

FIG. 4 is another exploded perspective view of a portion of the sensor shown in FIG. 1;

FIG. 5 is a corresponding schematic structural view of a portion of the components of a sensor of the present application;

FIG. 6 is a schematic view of another angle of a portion of the assembly of the sensor shown in FIG. 5;

FIG. 7 is a schematic diagram of one configuration of a pressure module of the present application;

FIG. 8 is a schematic view of another angle of the pressure module shown in FIG. 7;

FIG. 9 is a schematic perspective cross-sectional view of the sensor shown in FIG. 1;

FIG. 10 is another schematic angular cross-sectional view of the sensor shown in FIG. 9;

FIG. 11 is a schematic perspective cross-sectional view of a sensor in another embodiment of the present application;

FIG. 12 is a schematic perspective cross-sectional view of a sensor in yet another embodiment of the present application;

FIG. 13 is a schematic bottom view of the sensor portion shown in FIG. 12;

FIG. 14 is a perspective view of a portion of the sensor shown in FIG. 12;

FIG. 15 is a perspective view of a valve assembly of the present application;

fig. 16 is a corresponding cross-sectional schematic view of the valve assembly shown in fig. 15.

Detailed Description

In the fields of automobile air conditioners, household air conditioners, commercial air conditioners and the like, refrigerants are important heat exchange fluids in such heat management systems, and the pressure of the refrigerants is usually large, for example, to reach 500Psi in a general scene, the pressure change and the temperature change of the refrigerants are usually monitored through sensors.

Referring to fig. 1 to 14, a sensor 100 provided by the present application may be integrated with various valve components, such as a valve component formed by being installed on a valve body alone, or an electronic expansion valve, a thermal expansion valve, a solenoid valve, etc. The sensor 100 may be used to detect a temperature parameter of the refrigerant, and in some scenarios, may be used to detect both a temperature parameter and a pressure parameter of the refrigerant. Of course, the sensor 100 provided herein may also be used to detect pressure and temperature parameters of other fluids.

One embodiment of the present application provides a sensor 100 comprising a housing 1, a circuit board 2, and a temperature sensing element 3. The sensor 100 has an inner cavity 200, and the circuit board 2 is accommodated in the inner cavity 200. The housing 1 encloses at least part of the inner cavity 200.

The circuit board 2 includes a first surface 21 and a second surface 22 respectively located on different sides in a thickness direction thereof. The circuit board 2 is a plate-shaped component (PCB) having a certain thickness, and may be a circuit board whose main material is resin or a circuit board whose main material is ceramic. The circuit board 2 further includes an outer peripheral surface 23, the outer peripheral surface 23 is a circumferential side surface of the circuit board 2, and the outer peripheral surface 23 is connected between the first surface 21 and the second surface 22. The circuit board 2 may be a rectangular circuit board, or may be a circular circuit board or another circuit board. The first surface 21 may be an upper side surface of the circuit board 2 illustrated in the drawing, and the second surface 22 may be a lower side surface of the circuit board 2 illustrated in the drawing.

The temperature sensing element 3 includes a first portion 31 and a second portion 32. The first portion 31 is provided with a temperature sensing region 311. The second portion 32 is electrically connected to the first portion 31 and the circuit board 2. The Temperature sensing element 3 may be an NTC (Negative Temperature Coefficient) Negative Temperature Coefficient Temperature measuring element with an elongated pin. The first portion 31 may be a packaged thermistor, the exterior of the first portion is a resin composite material, the first portion has certain corrosion resistance, the temperature sensing region 311 may be in direct contact with the fluid, and the first portion 31 may sense a temperature signal of the fluid based on the temperature sensing region 311. The temperature sensing element 3 is a non-patch element, and the first portion 31 thereof is relatively far away from the circuit board 2, so that the first portion 31 can contact with the refrigerant earlier, and the path for transmitting the fluid to the temperature sensing area 311 is shorter, thereby being beneficial to reducing the sensing temperature difference and improving the accuracy of the temperature signal sensed by the temperature sensing element 3.

As shown in fig. 9 and 10, the housing 1 includes a first housing portion 11 and a second housing portion 12 fixed to each other, and a part of the first housing portion 11 is circumferentially surrounded on the outer circumferential side of the second housing portion 12. The circuit board 2 is located between the second housing part 12 and the first housing part 11 in the height direction of the sensor.

The first housing portion 11 is a unitary structure, and the "unitary structure" means that the first housing portion 11 itself may be a housing structure with a complete surface and without welding or bonding parts, and it is not assembled with other structural elements for two or more times, or the "unitary structure" of the first housing portion 11 may be a housing formed by welding or bonding a plurality of housing parts, and the plurality of housing parts form a complete housing after welding and bonding. The first housing part 11 comprises a first wall 13, and the cavity 200 and the first part 31 are located on different sides of the first wall 13 in the direction of the wall thickness. The wall thickness direction of the first wall 13 is substantially the same as the height direction of the sensor 100. The height direction of the sensor 100 can be referred to as H direction in fig. 1. At least a partial area of the second surface 22 of the two surfaces of the circuit board 2 may be opposite the first wall 13, "opposite" being within assembly tolerances, at least a partial area of the second surface 22 directly facing the first wall 13. Of course, glue may be applied between the second surface 22 of the circuit board 2 and the inner wall surface of the first wall 13 near the cavity 200, which are separated by the glue. The first wall 13 has an inner wall surface 131 close to the inner cavity 200 and an outer wall surface 136 remote from the inner cavity 200. Inner wall surface 131 and outer wall surface 136 may be planar or non-planar. That is, the first wall 13 may be a planar wall structure or a non-planar wall structure.

The second portion 32 includes a first sub-portion 321 and a connection fitting portion 322. The first sub-portion 321 is connected with the connection fitting portion 322. The first sub-portion 321 is located on a side of the inner wall surface 131 of the first wall 13 close to the cavity 200, that is, the first sub-portion 321 is located inside the cavity 200 and exposed from the inner wall surface 131 so as to be matched with the circuit board.

Referring to fig. 4, the first wall 13 is provided with an accommodating portion 132, and the accommodating portion 132 penetrates the inner wall surface 131 and the outer wall surface 136. Specifically, the accommodating portion 132 is formed with a first mouth portion 134 at the inner wall surface 131 of the first wall 13 close to the inner cavity 200, and the accommodating portion 132 is formed with a second mouth portion 135 at the outer wall surface of the first wall 13 far from the inner cavity 200. The housing 132 extends through the first wall 13 between the first port 134 and said second port 135. The receiving portion 132 may be a through hole structure disposed through the first wall 13, and of course, the receiving portion 132 may also be a groove structure, that is, the receiving portion 132 may extend along the wall thickness direction of the first wall 13, and the receiving portion 132 thereof is recessed in the wall thickness direction perpendicular to the first wall 13 to form a groove portion.

At least a portion of the first sub-portion 321 is fixed to the circuit board 2 as an integral structure. Specifically, at the time of processing and manufacturing, the circuit board 2 is provided with a third hole 25 penetrating the circuit board 2 in the thickness direction thereof. The first sub-portion 321 extends into the third hole 25 and may be partially exposed to the first surface 21 of the circuit board 2. The first surface 21 of the circuit board 2 is provided with a pad which may be arranged around the opening of the third hole 25 at the first surface 21. The portion of the first sub-portion 321 exposed on the first surface 21 of the circuit board 2 is fixed to the pad by soldering. Part of the solder may also flow into the gap between the wall of the hole forming the third hole 25 of the circuit board 2 and the first sub-portion 321 during the melting process, so that the fixation and sealing between the wall of the hole forming the third hole 25 of the circuit board 2 and the first sub-portion 321 is also achieved. Such a sealing and fixing manner is relatively simple and reliable. The second portion 32 of the temperature sensing element 3 is not easily detached. Of course, the first sub-portion 321 can be fixed to the circuit board 2 in other ways, for example, the circuit board 2 is not provided with the third hole 25, and the first sub-portion 321 can be soldered and fixed to the second surface 22 of the circuit board 2. The circuit board 22 can transmit signals to the first surface 21 of the circuit board 22 through the conductive wires, and then transmit the temperature signals sensed by the temperature sensing element 3 to the outside of the sensor 100 through other components electrically connected to the first surface 21. This is not to be unduly limited by this application.

The connection fitting portion 322 of the second portion 32 is located on the inner wall surface 131 of the first wall 13 away from the inner cavity 200, at least a part of the connection fitting portion 322 is fixed to the first wall 13 of the housing 1, and the end of the connection fitting portion 322 away from the first sub-portion 321 is connected to the first portion 31.

In some embodiments, referring to fig. 9 and 10, the connection fitting portion 322 includes a second sub-portion 323 and a third sub-portion 324, the second sub-portion 323 is connected between the first sub-portion 321 and the third sub-portion 324, and the third sub-portion 324 is connected between the second sub-portion 323 and the first portion 31.

The second sub-portion 323 is located between the inner wall surface 131 and the outer wall surface 136, the second sub-portion 323 is received in the receiving portion 132, the second sub-portion 323 is fixed to the first wall 13, and the third sub-portion 324 and the first portion 31 are located on a side of the first wall 13 away from the inner cavity 200. In this way, the first portion 31 for sensing the temperature signal may contact the fluid relatively earlier.

Referring to fig. 4, the first wall 13 is provided with a receiving portion 132, and the first wall 13 has a wall portion 133 forming the receiving portion 132. The sensor 100 also includes an insulating portion 16. The second sub-portion 323 and at least a portion of the insulating portion 16 are accommodated in the accommodating portion 132. The insulating portion 16 is located between the wall portion 133 and the second sub-portion 323. The insulating portion 16 is hermetically and fixedly connected to the wall portion 133, and the insulating portion 16 is hermetically and fixedly connected to the second sub-portion 323.

In one embodiment of the present application, the receiving portion 132 is a through hole structure penetrating the first wall 13, the first wall 13 and the second portion 32 are both made of metal, the insulating portion 16 is made of glass or ceramic, and the first wall 13, the second sub-portion 323, and the insulating portion 16 are sintered and fixed to form an integral structure. The second portion 32 can be made of metal to electrically connect the first portion 31 and the circuit board 2, and the housing of the sensor 100 can also be made of metal, and the insulating portion 16 can play an insulating role to ensure that the second portion 32 is not easily short-circuited or damaged. While metals can typically withstand the high temperatures of the sintering process. For example, the first wall 13 is made of aluminum, aluminum alloy or stainless steel, and the second portion 32 is made of aluminum, iron, steel or copper or other alloy.

The second sub-portion 323 of the temperature sensing element 3, the first wall 13 of the housing 1 and the insulating portion 16 are sintered and fixed at the accommodating portion 132, so that fluid is difficult to pass through the fixed position of the housing 1 and the temperature sensing element 3 and upwards contact the circuit board 2, and thus the sensor assembly 100 of the present application has good sealing performance. Referring to fig. 9 and 10, in practical application, a separate metal column may be sintered with the first housing portion 11 having the first wall 13, the second sub-portion 323 is a part of the metal column, a blank (ceramic or glass) of the insulating portion 16 is filled between the wall portion 133 of the first wall 13 forming the accommodating portion 132 and the second sub-portion 323, the blank is converted into a compact body by a sintering process, solid particles of the blank are mutually bonded after molding, crystal grains grow up, gaps (air holes) and crystal boundaries gradually decrease, the total volume of the blank is shrunk, but the density is increased, and finally the compact sintered body is formed. The structure formed by the shell part fixed on the second sub-part 323 of the shell 1, the second sub-part 323 and the material blank corresponding to the insulating part 16 is heated to the temperature above the melting point of the material of the insulating part 16 and is kept at the temperature for a certain time, so that the polymer molecules are gradually transformed from the crystalline form to the amorphous form, and the dispersed structure particles are bonded into a continuous whole body through mutual melting and diffusion. The first wall 13, the insulating part 16 and the second sub-part 323 finally form an integral structure. Then, the first portion 31 is directly welded to the metal cylindrical body, i.e., the metal cylindrical body is the second portion 32. Or the pins integrally connected to the first portion 31 are welded to the metal pillar, that is, the second portion 32 includes the metal pillar and the pins integrally connected to the first portion 31. The integral structure facilitates the fixation of the second sub-portion 323, improving the connection strength and stability thereof, and thus, the second portion 32 of the temperature sensitive element 13 is fixed and positioned by both the circuit board 2 and the first wall 13 of the housing 1. The elongated second portion 32 is not easily shaken off, which is advantageous for the stability of the entire sensor 100. While also making it less likely that fluid will enter the interior cavity 200 from the location where the first wall 13 is provided with the receptacle 132, and thus the sensor 100 is more corrosion resistant. The sensor 100 may directly protect the second portion 32 of the temperature sensing element 3 with the housing 1. Accordingly, it is advantageous to reduce the need for an increased protection housing, and the housing structure of the sensor 100 can be simplified.

In another embodiment of the present application, referring to fig. 11 and 12, the insulating part 16 may be used as an adhesive material, and the second sub-part 323 is adhesively fixed to the first wall 13 through the insulating part 16. For example, the insulation 16 may be a high strength epoxy-based two-part construction adhesive or a one-part sealant construction adhesive. By selecting a suitable gel as the insulating portion 16 such that the second sub-portion 323 is in adhesive sealing fixed relation with the first wall 13 via the insulating portion 16, fluid does not readily flow from the lower side of the first wall 13 to the side near the upper side of the circuit board 2.

Optionally, the sensor 100 further includes a pressure sensing element 4, and the pressure sensing element 4 is electrically connected to the circuit board 2. The sensor 100 is further provided with a flow channel 201, and the first wall 13 is further provided with a first hole 17, the first hole 17 being at least a part of the flow channel 201. The circuit board unit 2 processes the collected temperature signal and pressure signal according to a certain logic algorithm mode by using the pressure signal sensed by the pressure sensing element 4 and the temperature signal sensed by the temperature sensing element 3, and converts the temperature signal and the pressure signal into a corresponding voltage value or current value or other detectable electric signal values. The circuit board 2 may further be provided with a conditioning chip 38 and the like, which is referred to fig. 13, and is used for performing processing such as denoising, signal amplification, signal compensation and the like on the pressure signal or the temperature signal, so as to improve the quality of the signal.

In the embodiment shown in fig. 3 to 10, the sensor 100 further includes an auxiliary board 5, the auxiliary board 5 is located on a side of the first wall 13 close to the inner cavity 200, the auxiliary board 5 is fixed to the second surface 22 of the circuit board 2, and the auxiliary board 5 is electrically connected to the circuit board 2. The auxiliary board 5 and the circuit board 2 may be fixed and electrically connected by conductive pins 55. The conductive pin 55 is fixedly connected to the auxiliary board 5 and the circuit board 2, respectively, such that the conductive pin 55 penetrates both the auxiliary board 5 and the circuit board 2 to laminate the auxiliary board 5 and the circuit board 2, and the conductive pin 55 and the auxiliary board 5 are fixed by soldering and the conductive pin 55 and the circuit board 2 are fixed by soldering. The auxiliary plate 5 is provided with a second hole 51, the second hole 51 communicating with the first hole 17. The second portion 32 may alternatively penetrate both the auxiliary board 5 and the circuit board 2 or may penetrate only the circuit board 2 while avoiding the auxiliary board 5. Auxiliary plate 5 can constitute integrative forced induction module with forced induction component 4, and this forced induction module can process alone and sell, and of course, the forced induction module can also include more components, and is corresponding, and sensor 100's product equipment processing is more convenient. More customization needs can be achieved. Especially when the size requirement of the sensor product is not uniform, for example, the size of the circuit board 2 is not uniform, the shell size is not uniform, and the like, the pressure sensing module with uniform size and uniform specification can be processed and prepared, and only the auxiliary board of the pressure sensing module can be electrically connected with the circuit board 2. The same pressure sensing module can be adapted to other structures of sensors with different models and specifications. The adaptability and the application range of the product are increased.

The pressure sensing element 4 is electrically connected to the auxiliary plate 5. The pressure sensing element 4 can be manufactured by a Micro Electro Mechanical System (MEMS) technology, and the size of the sensing element manufactured by the MEMS technology is small, and the size of the corresponding product is generally in the millimeter level, or even smaller. The pressure-sensitive element 4 includes a core portion 41, and the core portion 41 has a pressure-sensitive area 411 exposed to the flow path 201. The core portion 41 is fixed to the surface of the auxiliary plate 5 remote from the first wall 13, and the core portion 41 seals one end of the second hole 51. The second hole 51 is a part of the flow channel 201. The pressure sensing element 4 is provided with a sensing cavity 43, and the sensing cavity 43 is communicated with the second hole 51. The pressure sensing area 411 is at least partially exposed to the sensing chamber 43.

The circuit board 2 is provided with a notch portion 24 penetrating the circuit board 2 in the thickness direction thereof, and the pressure sensitive element 4 is at least partially accommodated in the notch portion 24. The second hole 51 is formed with a first aperture 511 at a surface of the auxiliary board 5 near the circuit board 2, and the core portion 41 is fixed to the auxiliary board 5 at a periphery of the first aperture 511 by one of bonding and eutectic bonding.

Referring to fig. 9 and 10, the core portion 41 of the pressure sensing element 4 is a three-layer structure, and includes a substrate layer, an intermediate layer, and a top layer, the substrate layer and the intermediate layer enclose a sensing cavity 43 with an opening, the pressure sensing element 4 may further include a vacuum cavity, the vacuum cavity may be enclosed by the top layer and the intermediate layer, the vacuum cavity is disposed on the other side of the sensing cavity 43 away from the second hole 51, the vacuum cavity is not communicated with the sensing cavity, and the vacuum cavity is beneficial to ensure that the fluid pressure sensed by the pressure sensing area 411 is absolute pressure, of course, some pressure sensing elements 4 may not be provided with a vacuum cavity, and accordingly, the fluid pressure sensed by the pressure sensing area 411 is relative pressure. The substrate layer can be a glass substrate, the middle layer can be a silicon element material, and the top layer can also be a glass material. The pressure sensing element 4 is a backpressure type pressure chip, fluid enters the sensing cavity 43 from a small hole at the bottom of the pressure sensing element 4, the front surface of the backpressure type pressure sensing element 4 is not contacted with the fluid, the middle layer of the silicon wafer of the chip part 41 is provided with a pressure sensing area 411 exposed in the sensing cavity 43, the pressure sensing area 411 realizes pressure detection through a piezoresistive Wheatstone bridge, when a circuit is connected, when no pressure acts on a film of the silicon chip, the Wheatstone bridge is balanced, and the output voltage is 0. When pressure is applied to the thin film of the silicon cell, the balance of the Wheatstone bridge is broken and a voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized.

Of course, in some other embodiments, the pressure sensing element 4 may not be provided with the sensing cavity 43, i.e. the core portion 41 of the pressure sensing element 4 may be in the form of a film, which seals the first orifice 511 of the second hole 51.

The fixing means between the core portion 41 and the auxiliary plate 5 includes one of adhesion, eutectic bonding, sintering fixation, and glass micro-fusion fixation. In actual processing and manufacturing, the fixing and sealing between the core part 41 and the auxiliary plate 5 can be realized by selecting a sealant adhesive and a eutectic welding mode, and the process is simple and easy to realize. Fluid does not readily leak out of the second bore 51 and the sensing chamber 43.

In order to ensure the tightness between the auxiliary plate 5 and the first wall 13. The sensor 100 further comprises a sealing element 61. In a plane perpendicular to the thickness direction of the circuit board 2, the area enclosed by the projected outlines of the first hole 17 and the second hole 51 is located within the enclosed range of the projection of the sealing member 61.

The sealing element 61 is in contact with the surface of the auxiliary plate 5 remote from the circuit board 2 and the first wall 13 respectively, the sealing element 61 is compressed between the auxiliary plate 5 and the first wall 13. The auxiliary plate 5 is in sealing engagement with the first wall 13 by means of a sealing element 61.

The temperature sensing element 3 can be located outside the sealing range of the sealing element 61, and the sealing element 61 can be reduced in size under the condition of ensuring the sealing and fixing between the second sub-portion 323 of the temperature sensing element 3 and the first wall 13, which is beneficial to reducing the product cost. In order to ensure that the position of the sealing element 61 does not move to a large extent, a sealing groove may be disposed on the first wall 13, and at least a portion of the sealing element 61 is accommodated in the sealing groove, so that the sealing element 61 is not easy to move, the sealing groove may position the sealing element 61, and the sealing element 61 may be an elastic sealing gasket, which is beneficial to improving the sealing performance.

In another embodiment provided by the present application, the sealing element 61 may not be provided, and the pressure sensing element 4 may be directly fixed and sealed with the housing 1. Specifically, as shown in fig. 11, the circuit board 2 is provided with a notch 24 penetrating the circuit board 2 in the thickness direction thereof, and the pressure sensitive element 4 is at least partially accommodated in the notch 24.

The pressure-sensitive element 4 includes a core portion 41, and the core portion 41 has a pressure-sensitive area 411 exposed to the flow path 201. The core portion 41 is fixed to the first wall 13 on the side close to the inner cavity 200, and the core portion 41 seals one end of the first hole 17.

In yet another embodiment provided by the present application, as shown in fig. 12, the pressure sensing element 4 is located on the side of the second surface 22 of the circuit board 2. The sensor 100 also includes a gel material 62. The pressure sensing element 4 may be a positive MEMS pressure chip.

At least a part of the gel material 62 is located between the pressure-sensitive element 4 and the flow channel 201 in the thickness direction of the circuit board 2. The gel material 62 has a surface exposed to the runner 201. The pressure-sensitive element 4 is provided with a pressure-sensitive area 411. The gel material 62 covers at least a portion of the pressure sensing element 4 and is in contact with the pressure sensing region 411. The gel material 62 may also encapsulate the conditioning chip 38.

The pressure sensing element 4, the main core portion of which usually needs to be electrically connected with the pads 105 of the circuit board 2 through the binding wires 42, because the sensor 100 needs to be suitable for the high-pressure environment of the refrigerant, the binding wires 42 are prone to be disconnected when the fluid is in a straight surface, and the gel material 62 can cover at least part of the binding wires 42, so that at least part of the binding wires 42 are not easy to be in direct contact with the high-pressure fluid under the protection effect of the gel material 62. The gel material 62 may be a flexible silicone gel, the gel material 62 may be disposed to cover the pressure sensing element 4, and the gel material 62 may serve as a medium for pressure transmission. This can prevent the refrigerant from corroding the pressure sensing element 4, and on the other hand, provide a certain buffer between the pressure sensing element 4 and the fluid to protect the pressure sensing element 4, and the gel material 62 can protect the thin binding lines 42 from being damaged by the fluid impact, and on the other hand, is favorable for preventing the fluid from entering the upper space of the circuit board 2 from the flow channel 201. The gel material 62 has a certain flexibility, and the pressure of the refrigerant is firstly applied to the gel material 62, and then the gel material 62 transmits the pressure to the pressure sensing area 411 of the pressure sensing element 4.

Optionally, the sensor 100 further includes a sleeve portion 44, the sleeve portion 44 is a hollow cylindrical structure, that is, the sleeve portion 44 has a through hole, and the flow channel 201 includes a part of the through hole of the sleeve portion 44. At least a portion of the pressure sensitive element 4, at least a portion of the conditioning chip 38, and at least a portion of the gel material 62 are located within the through-hole, and at least a portion of the inner peripheral wall of the sleeve portion 44 forming the through-hole is adhered to the gel material 62. The sleeve portion 44 may provide a larger area of attachment surface for the gel material 62, such that the gel material 62 is not easily removed from the sleeve portion 44, and the inner wall of the sleeve portion 44 may limit the extent of the gel material 62 and the gel layer thickness of the gel material 62 along the axial direction of the first hole 341.

One end of the sleeve portion 44 in the axial direction may be fixed to the circuit board 2 by soldering or by gluing. The pressure sensitive element 4 is fixed on the second Surface 22 of the circuit board 2 by using Surface Mount Technology (SMT).

Alternatively, in fig. 12, the sensor 100 may also include an auxiliary board 5, the auxiliary board 5 is fixed on the second surface 22 of the circuit board 2, and the auxiliary board 5 is electrically connected to the circuit board 2. The pressure sensing element 4 is indirectly electrically connected with the circuit board 2 through the auxiliary board 5. Accordingly, the sleeve portion 44 and the auxiliary plate 5 can be fixed by soldering.

In some embodiments provided herein, the housing 1 includes a first housing portion 11 and a second housing portion 12, and the first housing portion 11 and the second housing portion 12 may be enclosed to form an inner cavity 200. The first housing part 11 comprises a first wall 13, a second wall 14 and a bend 15.

The second wall 14 is arranged circumferentially around at least a partial region of the second housing part 12, the second wall 14 being arranged around the circuit board 2. One end of the second wall 14 in the axial direction is connected to the first wall 13, and the other end is connected to the bent portion 15. The bent portion 15 extends from the second wall 14 in a direction close to the axis of the second wall 14. The circuit board 2 is located between the second housing portion 12 and the first wall 13, the second housing portion 12 presses against the circuit board 2, and the bent portion 15 presses against the second housing portion 12.

The sensor 100 further includes a plurality of conductive members 70, and the second housing portion 12 defines openings 121 that mate with the conductive members 70. A part of the conductive member 70 is accommodated in the opening 121, and one end of the conductive member 70 is in contact with the pad on the first surface 21 side of the circuit board 2 and the other end is exposed from the opening 121, so that a signal can be transmitted to the outside.

As for the first housing portion 11, in some embodiments, the first wall 13, the second wall 14 and the bent portion 15 are an integral structure, and when the sensor 100 is assembled, specifically, the bent portion 15 first extends in the longitudinal direction in the same vertical state as the second wall 14, the second shell 52 and the circuit board 2 are at least partially aligned in the longitudinal direction, the second shell 52 is press-fitted above the circuit board 2, the circuit board 2 is clamped and positioned between the second shell 52 and the first wall 13, and then the vertical bent portion 512 is inwardly press-flanged by a tool. The bending portion 512 can press against the second housing portion 12, and the second housing portion 12 presses against the circuit board 2. Therefore, the second case portion 12 can be stably attached to the first case portion 11 without falling. The second housing portion 12 and the bent portion 15 are limited in the thickness direction of the circuit board 2, that is, the second housing portion 12 is limited from being far away from the circuit board 2 in the thickness direction of the circuit board 2. Therefore, the first housing part 11, the second housing 52 and the circuit components in the housing can be assembled and fixed through the physical structure, so that the welding procedures are reduced, and the processing and assembling complexity of the sensor 100 is reduced.

Optionally, the first housing portion 11 is made of metal to facilitate the processing of the flanging structure, and the second housing portion 12 may be a plastic shell, so as to reduce the weight and cost of the sensor 100.

Alternatively, the first housing part 11 may be a plastic housing, and specifically, the first housing part 11 is a plastic housing that is injection-molded by using the second part 32 as an injection insert. I.e. by injection moulding the first housing part 11 and the second part 32 of the temperature sensitive element 3 as a unitary structure. It is also possible to realize that the second part of the temperature sensing element 3 is fixed by the first housing part 11. Resulting in improved stability of the sensor 100.

As shown in fig. 15 and 16, the present application further provides a valve assembly including a valve body 900 and a sensor 100, where the sensor 100 may be the sensor of the previous embodiments. The valve body 900 is provided with a cavity 90, the cavity 90 includes an installation cavity 901, the sensor 100 is fixedly connected with the valve body 900 at the installation cavity 901, and at least part of the sensor 100 is accommodated in the installation cavity 901 of the valve body 900. The cavity portion 90 also includes a channel 902 for fluid flow. In the sectional structure illustrated in fig. 16, the sensor 100 includes a housing 1, a circuit board 2, and a temperature-sensitive element 3, and the circuit board 2 is housed in an inner cavity 200 of the sensor 100.

The temperature sensing element 3 comprises a first portion 31 and a second portion 32 connected to each other, the first portion 31 is provided with a temperature sensing region 311, and at least a part of the first portion 31 is located in the cavity portion 90. The temperature sensitive region 311 can be at least partially exposed to the cavity portion 90, e.g., the temperature sensitive region 311 can be exposed to the channel 902. So that the temperature sensing region 311 can be in contact with the fluid. The housing 1 of the sensor 100 may be a split-type housing or an integrated housing. The housing 1 comprises a first wall 13, the circuit board 2 and at least part of the first portion 31 being located on different sides of the first wall 13 in the height direction of the sensor 100. The first wall 13 may be a transversely disposed wall portion, the first wall 13 having an inner wall surface 131 proximate the cavity 200 and an outer wall surface 136 distal from the cavity 200. The first wall 13 is provided with an accommodating portion 132, and the accommodating portion 132 penetrates the inner wall surface 131 and the outer wall surface 136. The second portion 32 of the temperature sensing element 3 is at least partially located in the accommodating portion 132. At least part of the second portion 32 is fixed to the first wall 13.

In some embodiments, referring to fig. 16, the valve body 900 has a cavity wall 92 forming the cavity 90, and the valve assembly further comprises a gasket 903 between the first wall 13 and the valve body 900, the gasket 903 being compressible between the valve body 900 and the first wall 13. The gasket 903 may have some elasticity. The gasket 903 seals between the first wall 13 and the valve body 900 so that the flow channel 201 of the sensor 100 forms a fluid-tight passage allowing fluid to flow axially therealong. The outer wall surface 136 of the first wall 13 may be entirely free from contact with the cavity wall surface 92 or may be partially free from contact as illustrated in fig. 16.

In other embodiments, the valve assembly may be provided without the gasket 903, and other sealing means may be used to seal between the valve body 900 and the sensor 100. Accordingly, at least a portion of outer wall surface 136 may be in direct contact with chamber wall surface 92.

In some embodiments, the valve assembly further includes a compression nut or the like, the compression nut may be engaged with the first housing portion 11, the compression nut is in a ring shape and is disposed on an outer peripheral side of the second wall 14, the outer periphery of the compression nut is screwed with the valve body portion 900, and the compression nut is pressed on an upper side of the first wall 13 to fix the sensor 100 and the valve body portion 900 together. The valve assembly provided in the present embodiment may further include a fluid control assembly fixed to the valve body 900. The fluid control component can be an electronic expansion valve and is used for controlling the flow of the refrigerant in the automobile air conditioning system to realize the throttling of the refrigerant. The fluid control assembly correspondingly comprises a coil assembly and other structures, and redundant description is not repeated for the fluid control assembly.

The above embodiments are only used for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood based on the descriptions of directions such as "front", "back", "left", "right", "upper", "lower", etc. for those skilled in the art, and although the present application has been described in detail in the present application with reference to the above embodiments, those skilled in the art should understand that those skilled in the art can still make modifications or equivalent substitutions on the present application, and all technical solutions and modifications thereof that do not depart from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A sensor comprising a housing, a circuit board and a temperature sensing element; the sensor is provided with an inner cavity, and the circuit board is accommodated in the inner cavity;

the first shell part is of an integral structure and is provided with an accommodating part, the first shell part is provided with an inner wall surface close to the inner cavity and an outer wall surface far away from the inner cavity, the accommodating part penetrates through the inner wall surface and the outer wall surface, and at least part of the second part is positioned in the accommodating part; at least part of the second portion is fixed with the first housing portion.

2. The sensor according to claim 1, wherein the circuit board includes a first surface and a second surface respectively located on different sides in a thickness direction thereof; the first housing part comprises a first wall, and the first wall is positioned on the side of the second surface of the circuit board; at least part of the second shell part is positioned on the side of the first surface of the circuit board;

the accommodating part is a through hole arranged on the first wall;

the second portion includes a first sub-portion, a second sub-portion, and a third sub-portion;

the first sub-portion is positioned in the inner cavity, and at least part of the first sub-portion is fixed with the circuit board; the second sub-portion is connected between the first sub-portion and the third sub-portion, and the third sub-portion is connected between the second sub-portion and the first portion; the second sub-part is accommodated in the accommodating part and is fixed with the first wall; the third sub-portion and the first portion are both located on a side of the first wall away from the internal cavity.

3. The sensor of claim 2, wherein the first wall has a wall portion forming the receptacle; the sensor further comprises an insulating portion;

the second sub-part and at least part of the insulation part are accommodated in the accommodating part; at least part of the insulating portion is located between the wall portion and the second sub-portion; the insulating part is sealed and fixedly connected with the wall part, and the insulating part is sealed and fixedly connected with the second sub-part.

4. The sensor of claim 3, wherein the first wall and the second portion are both made of metal, the insulating portion is made of glass or ceramic, and the first wall, the second sub-portion and the insulating portion are sintered and fixed;

alternatively, the insulating portion may be an adhesive, and the second sub-portion may be fixed to the first wall by the insulating portion.

5. The sensor of claim 4, further comprising a pressure sensing element electrically connected to the circuit board; the distance between the pressure sensing element and the first surface is smaller than that between the pressure sensing element and the second surface;

the sensor is further provided with a flow channel, the first wall is further provided with a first hole, the first hole is at least one part of the flow channel, and the pressure sensing element seals one end of the flow channel.

6. The sensor of claim 5, further comprising an auxiliary board positioned on a side of the first wall adjacent to the cavity and affixed to the second surface of the circuit board, the auxiliary board being electrically connected to the circuit board; the auxiliary plate is provided with a second hole which is communicated with the first hole; the second aperture is part of a flow channel;

the pressure sensing element is electrically connected with the auxiliary plate; the pressure sensing element includes a core portion having a pressure sensing area exposed to the flow passage; the core portion is fixed to a surface of the auxiliary plate away from the first wall, and the core portion seals one end of the second hole.

7. The sensor of claim 6, further comprising a sealing element; in a plane perpendicular to the thickness direction of the circuit board, the area enclosed by the projection outlines of the first hole and the second hole is positioned in the enclosed range of the projection of the sealing element;

the sealing element is respectively contacted with the surface of the auxiliary board far away from the circuit board and the first wall, and the sealing element is pressed between the auxiliary board and the first wall; the auxiliary plate is in sealing engagement with the first wall via the sealing element.

8. The sensor according to claim 5, wherein the circuit board is provided with a notch portion penetrating the circuit board in a thickness direction thereof, and the pressure-sensitive element is at least partially accommodated in the notch portion;

the pressure sensing element comprises a core body part, wherein the core body part is provided with a pressure sensing area exposed to the flow channel; the core portion is fixed to a side of the first wall near the inner cavity, and the core portion seals one end of the first hole.

9. The sensor of claim 4, further comprising a pressure sensing element and a gel material; the pressure sensing element is electrically connected with the circuit board; the pressure sensing element is positioned on the side of the second surface of the circuit board;

the sensor is also provided with a flow channel, and at least part of the gel material is positioned between the pressure sensing element and the flow channel in the thickness direction of the circuit board; the gel material has a surface exposed to the flow channel; the pressure sensing element is provided with a pressure sensing area; the gel material covers at least part of the pressure sensing element and is in contact with the pressure sensing area.

10. A valve assembly, characterized by: comprises a valve body part and a sensor fixed with the valve body part; the valve body portion is provided with a cavity, and the sensor is at least partially positioned in the cavity;

the shell comprises a first wall, and the circuit board and at least part of the first part are respectively positioned on different sides of the first wall along the height direction of the sensor; the first wall has an inner wall surface close to the inner cavity and an outer wall surface far away from the inner cavity; the first wall is provided with an accommodating part, the accommodating part penetrates through the inner wall surface and the outer wall surface, and the second part is at least partially positioned in the accommodating part; at least a portion of the second portion is secured to the first wall;

the valve body portion has a cavity wall surface forming the cavity portion; at least partial region of the outer wall surface is in contact with the cavity wall surface; or, the outer wall surface is not in contact with the cavity wall surface, and the valve assembly further comprises a gasket which is compressed between the sensor and the valve body; the gasket is in contact with the outer wall surface and the gasket is in contact with the wall surface.