CN115140365A - Equipment for taping or loading into material pipe after chip test burning and working method thereof - Google Patents

Abstract

The invention provides equipment for taping or loading a material pipe after chip testing and burning and a working method thereof. The invention relates to equipment for intelligent equipment for advanced manufacturing of an IC chip integrating machinery and electricity, wherein the IC chip is fed by a material pipe stacking frame, a material pipe is separated by a pipe pushing mechanism, the function of detecting the electrical property of a pin of the IC chip is realized, and the pin is pressed and detected by a golden finger; the device has the advantages of convenient operation, mature and stable structure, firm and durable parts, easy operation, accurate positioning and concise and elegant appearance.

Description

Equipment for taping or loading into material pipe after chip test burning and working method thereof

Technical Field

The invention belongs to the technical field of intelligent equipment for manufacturing IC chips, and particularly relates to equipment for taping or feeding a material pipe after chip testing and burning and a working method thereof.

Background

The current IC chip manufacturing process comprises the following steps of filling a plurality of packages (such as SOP/MSOP/SSOP/TSSOP/LSOP) into a TUBE rubber TUBE, then transferring to a test burning process for test burning, respectively filling good IC chips and defective IC chips selected by test into the TUBE rubber TUBE, or respectively carrying out bearing tape braiding and packaging on the good IC chips, wherein the traditional operation mode comprises the following steps: the IC in the material pipe is poured out through manual work, manual detection is carried out, good products are manually braided or manually installed in the pipe, different devices are used for braiding or installing the pipe, the equipment investment cost is increased for production enterprises, along with the labor cost of China, the enterprise profit is lower and lower, and the automatic mode is the trend of enterprise development.

Disclosure of Invention

The invention aims to provide equipment for braiding or loading a material pipe after chip test burning and a working method thereof.

The invention provides equipment for taping or loading a material pipe after chip testing and burning, which comprises a lower rack, a pipe pushing mechanism, a pipe turning mechanism, a blanking track, a material passing component, a first material distributing mechanism, a first carrying mechanism, a second carrying mechanism, an electrical testing component, a defective product accommodating device, a material taking manipulator, a second material distributing mechanism, a tape conveying mechanism, a sealing mechanism, a carrier tape winding mechanism, a connecting flow channel and a pipe lowering component, wherein the first material distributing mechanism, the first carrying mechanism and the second carrying mechanism are connected with the pipe turning mechanism; the pipe pushing mechanism comprises a material pipe inductive switch, a pipe pushing cylinder connected with the material pipe inductive switch, a pushing plate driven by the pipe pushing cylinder to move, a plurality of limiting blocks located near the pushing plate, supporting plates supported at two ends of the pushing plate, a material pipe limiting plate for limiting a material pipe of an IC chip, a material height limiting block and a guide plate located near the material pipe limiting plate, a pipe pushing cylinder and a material pipe stacking rack; the material pipe of the IC chip is placed in the material pipe stacking rack; the pipe overturning mechanism comprises a pipe clamping block for clamping a material pipe, a pipe clamping supporting plate for supporting the pipe clamping block, a pipe clamping cylinder fixing seat for fixing the pipe clamping cylinder, a overturning mechanism side plate fixedly connected with the pipe clamping cylinder fixing seat, a first pipe knocking cylinder and a second pipe knocking cylinder which are connected to the overturning mechanism side plate, an overturning mechanism rotating shaft connected with the overturning mechanism side plate, an overturning mechanism bearing fixing seat for fixing the overturning mechanism side plate, a pipe overturning cylinder fixedly connected with the overturning mechanism side plate and a pipe overturning cylinder fixing seat for supporting the pipe overturning cylinder.

Further, the blanking track comprises a product runner cover plate, a product runner base located below the product runner cover plate, a product runner cushion block located between the product runner cover plate and the product runner base, a material knocking block located at an inlet of the product runner cover plate, a material knocking cylinder, a tension spring connected with the material knocking block and the material knocking cylinder, a sensing block located below the material knocking block, a proximity switch located below the tension spring, a material distributing rod and a material blocking block located at the tail end of the product runner cover plate, a material distributing cylinder connected with the material distributing rod, an in-place photoelectric sensor located below the material distributing rod, and a material shortage photoelectric sensor connected with the product runner cover plate.

Further, first transport mechanism and second transport mechanism are the transport machinery hand, all include servo motor, support servo motor's motor fixing base, first synchronizing wheel with servo motor fixed connection, the bearing frame, fix the second pivot synchronizing wheel on the bearing frame, connect the hold-in range between first synchronizing wheel and second pivot synchronizing wheel, the slider that is located the hold-in range, transport fender material cylinder fixing base, fix the transport fender material cylinder on transport fender material cylinder fixing base, the transport fender material piece that is connected with transport fender material cylinder, be located near the origin response piece of transport fender material piece, be located near the hold-in range origin inductive switch of servo motor and be located near the material response correlation sensor of bearing frame.

Further, the electrical property test assembly includes a plurality of finger cylinders that set up side by side, supports the cylinder fixing base of finger cylinder, is located the golden finger that corresponds finger cylinder below, is located near insulating dominant force adhesive stick and the pressure stick fixing base that corresponds golden finger, keeps off the material axle, tests the gauge block, two rows of test gauge block cylinders, runner base backing plate, runner base, runner apron and the material position detects.

Further, the material passing assembly comprises a material distributing cylinder, a material blocking block, a material distributing rod, a first material arrival position induction, a second material arrival position induction, a material blocking shaft, a material blocking cylinder connected with the material blocking shaft, a guide cylinder and a guide claw connected with the guide cylinder.

Further, the material taking manipulator comprises a material taking servo motor, a material taking cam connected with the material taking servo motor, an upper silver sliding block, a suction nozzle rod fixing block fixed on the upper silver sliding block, a suction nozzle rod fixed on the suction nozzle rod fixing block, a glue suction nozzle fixed at the tail end of the suction nozzle rod, a proximity switch fixed on the material taking cam, a bearing fixing seat, a bearing retainer ring fixed on the bearing fixing seat, a material taking mechanism track plate, a connecting block, a material taking mechanism track plate and the upper silver sliding block are all connected with the bearing fixing seat and the material taking servo motor, a material taking mechanism X-direction adjusting base, a material taking mechanism Y-direction adjusting vertical plate, a rotating shaft penetrating through the bearing fixing seat and the bearing retainer ring, a negative pressure gauge and a material taking protective cover.

Further, the tape transport mechanism comprises a closed-loop stepping motor, a pinwheel connected with the closed-loop stepping motor, a carrier tape main runner, a carrier tape baffle, a carrier tape cover plate, a carrier tape inlet supporting plate, a carrier tape outlet supporting plate, a carrier tape original point sensing device, a convex material sensing device, a cover tape limiting plate, a pressing plate, a tape transport base plate, a cutter device, a cutter cylinder connected with the cutter device, and a cutter cylinder fixing seat supporting the cutter cylinder.

Further, the involution mechanism includes that one-level pressure is pressed the band cylinder, second grade pressure is pressed the band cylinder, interior sword, outer blade, seal a sword ejector pin, seal a sword dustcoat, cover area guide pulley, cover area tensioning pivot, cover area tensioning piece, cover area preforming, the response piece, photoelectric switch, the lid dish, press from both sides a dish retaining ring in the lid area and press from both sides a dish regulating spindle in the lid area, CCD camera lens fixing base, with CCD camera lens fixing base fixed connection's CCD camera lens, adjust CCD camera lens Y of CCD camera lens to adjusting the angle seat, light source Y is to adjusting the angle seat, first light source Z is to adjusting the angle seat, second light source Z is to adjusting the angle seat, heating rod and seal a sword.

The invention also provides a working method of the equipment for braiding or loading the chip into the feeding tube after the chip is tested and burned, which comprises the following steps:

s1: placing an IC chip material pipe into a material pipe stacking frame of a pipe pushing mechanism;

s2: a pipe pushing cylinder of the pipe pushing mechanism separates the material pipe;

s3: a pipe pushing cylinder of the pipe pushing mechanism pushes a material pipe out to the pipe overturning mechanism;

s4: the tube turning mechanism clamps and turns over the tube, and the gravity of the material passing slides downwards;

s5: the first material distributing mechanism distributes materials, and then the first carrying mechanism carries the material pipe to a flow passage of the electrical property testing assembly and carries out electrical property testing;

s6: the second conveying mechanism conveys the IC chip defective products to the defective product accommodating device, conveys the IC chip defective products to a feed port of the material passing assembly, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism is used for distributing the materials, the material taking manipulator is used for clamping a material pipe;

s8: loading an IC chip in the carrier tape winding mechanism and detecting whether the IC chip, pins of the IC chip and poor characters exist or not;

s9: the sealing mechanism is used for sealing;

s10: the tape transport mechanism cuts and retracts the tape.

The invention also provides a working method of the equipment for taping or loading the material pipe after the chip is tested and burned, which comprises the following steps:

s1: placing an IC chip material pipe into a material pipe stacking frame of a pipe pushing mechanism;

s2: a pipe pushing cylinder of the pipe pushing mechanism separates the material pipe;

s3: a pipe pushing cylinder of the pipe pushing mechanism pushes a material pipe out to the pipe overturning mechanism;

s4: the tube turning mechanism clamps and turns over the tube, and the gravity of the material passing slides downwards;

s5: the first material distributing mechanism distributes materials, and then the first carrying mechanism carries the material pipe to a flow channel of the electrical test assembly and carries out electrical test;

s6: the second conveying mechanism conveys the IC chip defective products to the defective product accommodating device, conveys the IC chip defective products to a feed port of the material passing assembly, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism distributes materials;

s8: the material pipe of the empty pipe is placed into the material pipe stacking frame of the pipe pushing mechanism at one time;

s9: a pipe pushing cylinder of the pipe pushing mechanism pushes out an empty pipe, a pipe turning mechanism clamps and turns the pipe, and the pipe slides downwards under the action of material passing gravity;

s10: the conveying material blocking cylinder of the second conveying mechanism retracts, and the IC chip product slides down into the hollow pipe;

s11: after the IC chip is fully filled with the tubes, the limiting cylinder of the tube pushing mechanism retracts, the tube pushing cylinder of the tube pushing mechanism retracts, and the tube pushing cylinder of the tube pushing mechanism acts to push the full tubes into the box.

The invention integrates machinery and electricity into a whole, and the IC chip is fed by a material pipe stacking rack, a material pipe is separated by a pipe pushing mechanism, the IC chip has the function of detecting the electrical property of a pin of the IC chip, and is detected by a golden finger; the invention has the advantages of convenient operation, mature and stable structure, firm and durable parts, easy operation, accurate positioning and simple and elegant appearance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 and fig. 2 are schematic structural diagrams of an apparatus for taping or loading a material tube after chip testing and burning according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a pipe pushing mechanism of the apparatus according to the embodiment of the present invention;

FIGS. 4 and 5 are schematic structural views of a tube overturning mechanism of the device according to the embodiment of the invention;

FIG. 6 is a schematic structural diagram of a blanking track of the apparatus of the embodiment of the present invention;

FIG. 7 is a schematic structural view of a first carrying mechanism and a second carrying mechanism of the apparatus according to the embodiment of the present invention;

FIGS. 8 and 9 are schematic structural views of an electrical testing component of the apparatus according to the embodiment of the present invention;

fig. 10 and 11 are schematic structural views of a defective product storage device of the apparatus according to the embodiment of the present invention;

FIG. 12 is a schematic structural view of a material passing assembly of the apparatus according to the embodiment of the invention;

fig. 13 to 15 are schematic structural views of a material taking manipulator of the apparatus according to the embodiment of the present invention;

FIGS. 16 and 17 are schematic views showing the structure of a deck of an apparatus according to an embodiment of the present invention;

fig. 18 to 20 are schematic structural views of a sealing mechanism of an apparatus according to an embodiment of the present invention;

FIG. 21 is a schematic structural diagram of a carrier tape take-up mechanism of the apparatus according to an embodiment of the present invention;

FIG. 22 is a schematic view of a connecting flow passage of an apparatus according to an embodiment of the present invention;

fig. 23 and 24 are schematic structural views of a lower tube assembly of the apparatus according to the embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

As shown in fig. 1 and 2, the apparatus for braiding or loading a material tube after chip test burning of the present invention comprises: the automatic pipe feeding device comprises a lower frame 10, a pipe pushing mechanism 30, a pipe overturning mechanism 40, a discharging track 89, a material passing assembly 50, a first material distributing mechanism 61 connected with the pipe overturning mechanism 40, a first carrying mechanism 71, a second carrying mechanism 72, an electrical property testing assembly 81 positioned between the first carrying mechanism 71 and the second carrying mechanism 72, a defective product accommodating device 82, a material taking manipulator 83, a second material distributing mechanism 62 connected with the material taking manipulator 83, a tape conveying mechanism 84, a sealing mechanism 86, a tape carrying and winding mechanism 87, a connecting flow channel 88 and a lower pipe assembly 85.

The equipment meets the process requirements of type 2: firstly, filling a bearing belt braid after the IC chip packaged by TUBE rubber is tested and burned; and after the IC chip of the second TUBE rubber hose is tested and burned, the IC chip is transferred into the TUBE rubber hose.

As shown in fig. 3, the tube pushing mechanism 30 includes a tube sensing switch 34, a tube pushing cylinder 31 connected to the tube sensing switch 34, a pushing plate 33 driven by the tube pushing cylinder 31 to move, a plurality of stoppers 32 located near the pushing plate 33, support plates 35 supported at both ends of the pushing plate 33, a tube position limiting plate 37 for limiting the tube of the IC chip, a height limiting block 36 and a guide plate 39 located near the tube position limiting plate 37, a tube pushing cylinder 38, and a tube stacker 391.

The invention adopts the material pipe 100 (shown in figures 6 and 7) for feeding, thereby having the advantages of static electricity prevention, difficult material clamping, no impurities and the like, and wide general application. The material pipe stacking frame 391 can be used for placing about 50 pipes in a one-time mode, and the manual operation time is shortened. The working principle is as follows: firstly, manually placing a material pipe filled with an IC chip into a material pipe stacking frame 391 at one time, triggering a pipe pushing cylinder 31 to move to a limiting block 32 through a material pipe induction switch 34 in an induction way, enabling a pipe pushing cylinder 38 to move and push out the material pipe to a pipe overturning mechanism 40, and clamping the pipe in the next procedure. The material pipe limiting plate 37 is made to be adjustable and is used for material pipes with different IC chip widths.

As shown in fig. 4 and 5, the tube overturning mechanism 40 includes a tube clamping block 41 for clamping the tube 100, a tube clamping supporting plate 42 for supporting the tube clamping block 41, a tube clamping cylinder 43, a tube clamping cylinder fixing seat 44 for fixing the tube clamping cylinder 43, a tube overturning mechanism side plate 46 fixedly connected to the tube clamping cylinder fixing seat 44, a first tube knocking cylinder 451 and a second tube knocking cylinder 452 connected to the tube overturning mechanism side plate 46, an overturning mechanism rotating shaft 47 connected to the tube overturning mechanism side plate 46, an overturning mechanism bearing fixing seat 48 for fixing the tube overturning mechanism side plate 46, a tube overturning cylinder 491 fixedly connected to the tube overturning mechanism side plate 46, and a tube overturning cylinder fixing seat 492 for supporting the tube overturning cylinder 491.

When the pipe jacking cylinder 38 of the pipe pushing mechanism 30 pushes the material pipe 100 to a proper position, the pipe clamping block 41 acts to clamp the material pipe 100. The pipe clamping block 41 is horn-shaped and has a guiding function, so that the positions of the material pipes 100 are consistent; then the tube turning cylinder 491 acts to turn the material tube 100 to be horizontal to the blanking track 89, so that the material in the IC chip material tube 100 can smoothly slide into the blanking track; the pipe clamping cylinder fixing seat 44 is fixed on the side plate 46 of the turnover mechanism, the pipe clamping cylinder fixing seat 44 is provided with a U-shaped hole which can be adjusted forwards and backwards, and the pipe clamping block 41 is prevented from being eccentric with the blanking runner cavity due to machining errors. The pipe clamping cylinder fixing seat 44 is also provided with a U-shaped hole for fixing the pipe clamping cylinder 43, the position of the pipe clamping block 41 can be adjusted up and down, and the pipe 100 with IC chips of different thicknesses can be used universally.

As shown in fig. 6, the discharging rail 89 includes a product flow cover 897, a product flow base 896 located below the product flow cover 897, a product flow spacer 895 located between the product flow cover 897 and the product flow base 896, a knockout block 891 located at an inlet of the product flow cover 897, a knockout cylinder 892, a tension spring 893 connecting the knockout block 891 and the knockout cylinder 892, a sensor block 8992 located below the knockout block 891, a proximity switch 894 located below the tension spring 893, a material separating bar 8991 and a material blocking block 899 located at an end of the product flow cover 897, a material separating cylinder 898 connected to the material separating bar 8991, an in-position photoelectric sensor 8995 located below the material separating bar 8991, and a material shortage photoelectric sensor 8996 connected to the product flow cover 897.

The blanking track 89 and the horizontal plane form an angle of 55 degrees, the IC chip products enter the flow channel and fall freely under the action of gravity, a material knocking block 891 is arranged at the material inlet of the flow channel to sense whether the product is at the material inlet, if the sensing block 8992 is in quick contact with the approach switch 894, the material inlet is empty, the IC chip materials are sensed for a plurality of times continuously, and meanwhile, the tube overturning cylinder 491 overturns to the level of the push tube 100 if no product is sensed by the material shortage. The design of runner terminal department has divided material stick 8991, adopts and divides the material cylinder 898 to divide the material, keeps off material piece 899 and divides material stick 8991 cross action, moves unloading runner butt joint department when carrying the manipulator, then divides the action of material cylinder 898, divides the material stick 8991 to descend and separates second granule material and first granule material, keeps off material piece 899 and rises, and the product is in the runner tool in the manipulator device is slided to the first product fast under gravity and gas blowing device 8993 effect. The material knocking block 891 is not connected and fixed with the material distributing cylinder 898, and the tension spring 893 is adopted to prevent the product from being damaged. The IC chip product flow channel pad has a dust falling groove 8994 to prevent the dust from accumulating on the product flow channel base 896 and causing material jamming.

As shown in fig. 7, each of the first conveying mechanism 71 and the second conveying mechanism 72 is a conveying manipulator, and each of the first conveying mechanism 71 and the second conveying mechanism 72 includes a servo motor 911, a motor fixing base 912 for supporting the servo motor 911, a first synchronizing wheel 9191 fixedly connected with the servo motor 911, a bearing base 913, a second rotating shaft synchronizing wheel 914 fixed on the bearing base 913, a timing belt 9192 connected between the first synchronizing wheel 9191 and the second rotating shaft synchronizing wheel 914, a slider 9193 located in the timing belt 9192, a conveying material blocking cylinder fixing base 9196, a conveying material blocking cylinder 918 fixed on the conveying material blocking cylinder fixing base 9196, a conveying material blocking block 919 connected with the conveying material blocking cylinder 918, an origin sensing sheet 916 located near the conveying material blocking block 919, an origin sensing switch 915 located near the servo motor 911, and a material sensing correlation sensor 917 located near the bearing base 913.

The synchronous wheels 9191 and 914, the synchronous belt 9192 and the servo motor 911 are adopted to drive the sliding block guide structure to carry products, the structure is simple, the moving blocks are moved, servo driving is adopted, and the alignment precision is high. When the runner in the carrying manipulator 91 is aligned with the runner in the previous working procedure, the material distributing cylinder 898 acts, the IC chip product falls into the runner of the carrying manipulator 91, the carrying material blocking block 919 blocks the IC chip product, and meanwhile, the material sensing correlation sensor 917 senses the product, the servo motor 911 operates to enable the runner of the carrying manipulator 91 to be aligned with the runner in the detection assembly, and the runner repeatedly moves back and forth.

As shown in fig. 8 and 9, the electrical testing assembly 81 mainly tests the pins of the IC chip product, and includes a plurality of finger cylinders 811 arranged side by side, a cylinder fixing seat 812 supporting the finger cylinders 811, a gold finger 813 located below the corresponding finger cylinder 811, an insulating high-gravity rubber rod 814 and a pressing rod fixing seat 815 located near the corresponding gold finger 813, a material blocking shaft 816, a testing material blocking block 817, two rows of testing material blocking cylinders 818, a flow channel base plate 819, a flow channel base 8191, a flow channel cover 8192, and a material position detection 8193.

The electrical property testing component 81 is independently assembled and can be conveniently disassembled, the connecting plate 8194 is used for connecting the electrical property testing component 81 with the large panel, the height can be adjusted by jacking with screws to be aligned with the upper and lower flow passage butt joint, and the problem of material clamping is solved. If the material blocking device of the first material position detection part 8195 is used for storing 1 material, and the second material position detection part 8196 and the first material position detection part 8195 are sensed simultaneously, the first carrying mechanism 71 and the second carrying mechanism 72 do not carry the product to the flow channel interface, so that the product is ensured to reach the second material position detection part 8196 independently, the finger cylinder 811 is triggered to act by sensing the material, the electrical property of the product is detected by clamping, and the material blocking device of the third material position detection part can store 1 material to prepare for the next process. Because the test needs time, the equipment is additionally provided with four tests to improve the productivity of the IC chip.

As shown in fig. 10 and 11, the defective product storage device 82 is used for collecting the waste IC chip storage material, and does not damage the IC chip product. The defective product storage device 82 includes a material pipe guide plate 821 having 6 material pipe slots, an inductor 822 located in each material pipe slot, a pressing plate 823 for pressing the material pipe, and a carriage 824 for holding the material pipe.

When inductor 822 response has the waste pipe 101 of wasting discharge, first transport mechanism 71 and/or second transport mechanism 72 will detect the bad product of IC chip and carry to and accomodate in the defective products storage device 82, and the material pipe groove of material pipe deflector 821 goes into to have the R angle, conveniently wastes pipe 101 of wasting discharge, pushes down waste pipe 101 with preforming 823, prevents to waste pipe 101 and drops, installs layer board 824 additional, prevents to expect to fill out the material after deformation.

As shown in fig. 12, the material passing assembly 50 includes a material separating cylinder 51, a material blocking block 52, a material separating rod 53, a first material position sensor 54, a second material position sensor 55, a material blocking shaft 56, a material blocking cylinder 57 connected with the material blocking shaft 56, a pilot cylinder 58, and a pilot claw 59 connected with the pilot cylinder 58

The material passing assembly 50 forms an angle of 55 degrees with the horizontal plane, an IC chip product enters a flow channel and freely falls under the action of gravity, and a material distributing device is designed at the tail end of the flow channel. The material distributing cylinder 51 distributes materials for the finger cylinder, the material blocking block 52 and the material distributing rod 53 perform cross action, when the first conveying mechanism 71 and/or the second conveying mechanism 72 continuously conveys qualified materials in the electrical property testing assembly 81 into the second blanking flow channel assembly until the materials are fully charged and photoelectric sensing is performed, meanwhile, the second material feeding position sensing 55 senses that products exist, the material distributing cylinder 51 operates, the material distributing rod 53 descends to separate the second particles from the first particles, the material blocking block 52 ascends, the products slide to the material blocking block at the guiding position rapidly under the action of gravity and an air blowing device, the first material feeding position sensing 54 senses that products exist, if the process is braiding, the material blocking shaft 56 is in a jacking state to block the materials, the materials are fed to the position, the guiding cylinder 58 operates to open the guiding claw 59, and the material taking manipulator 83 takes the materials. If the process is tube loading, the material blocking block 52 is in a descending state, the pilot cylinder 58 does not act, and the IC chip product flows into the third blanking flow channel and slides into the material tube.

As shown in fig. 13 to 15, the material taking manipulator 83 includes a material taking servo motor 831, a material taking cam 832 connected to the material taking servo motor 831, an upper silver slider 833, a nozzle rod fixing block 834 fixed to the upper silver slider 833, a nozzle rod 835 fixed to the nozzle rod fixing block 834, a nozzle rod 836 fixed to the nozzle rod fixing block 834, a proximity switch 837 fixed to the material taking cam 832, a bearing fixing seat 8381, a bearing retainer 8382 fixed to the bearing fixing seat 8381, a material taking mechanism track plate 8384 connected to the bearing fixing seat 8381 and the material taking servo motor 831, a connecting block 8383 connecting the material taking mechanism track plate 8384 and the upper silver slider 833, a material taking mechanism X-direction adjusting base 8385, a material taking mechanism Y-direction adjusting vertical plate 8386, a rotating shaft 8387 passing through the bearing fixing seat 8381 and the bearing retainer 8382, a negative pressure gauge 8388, and a material taking shield 8389.

The material taking manipulator 83 adopts a material taking cam 832, a material taking mechanism track plate 8384 and a material taking servo motor 831 to drive a control structure, so that a product on the inclined rail can be horizontally placed in the tape carrying cavity; get material protection casing 8389 front end and have flange guardrail 8390, can prevent to get material manipulator 83 can injure the people in the motion process, promoted safe type. With servo drive and last silver slider 833, the precision is high, and the orbit in the feeding mechanism orbit board 8384 also is computer-based processing and forms, and the clearance between bearing 8391 and feeding mechanism orbit board 8384 is just, and the orbit of bearing 8391 in feeding mechanism orbit board 8384 slides smoothly and the clearance is little and even, has promoted the motion precision greatly, and feeding mechanism orbit board 8384 adds the hard processing, and is wear-resisting, has promoted performance. The position of the bearing fixing seat 8381, the connecting block 8383 and the shaft 8392 is limited by the bearing retainer ring 8382 instead of a clamp spring or a screw, and the position of the bearing retainer ring 8382 can be adjusted, so that the connecting block 8383 cannot move in the left-right direction in the movement process. The taking mechanism X has a shaping hole in the direction of the adjusting base 8385, the taking manipulator 83 can adjust the taking mechanism Y in the direction of the adjusting vertical plate 8386Y from left to right, the taking mechanism Y is provided with a U-shaped hole in the direction of the adjusting vertical plate 8386 and can adjust the position of the taking manipulator 83 in the direction of Y, a U-shaped hole is also formed in the direction of Z, and the suction height of the taking manipulator 83 can be adjusted in the direction of Z.

As shown in fig. 16 and 17, the tape transport mechanism 84 includes a closed-loop stepping motor 841, a pinwheel 842 connected to the closed-loop stepping motor 841, a tape carrying main runner 843, a tape carrying baffle 844, a tape carrying cover plate 845, a tape carrying in supporting plate 846, a tape carrying out supporting plate 847, a tape carrying origin sensing device 848, a protruding material sensing device 849, a cover tape limiting plate 8491, a pressing plate 8492, a tape transport base plate 8493, a cutter device 8494, a cutter cylinder 8495 connected to the cutter device 8494, and a cutter cylinder holder 96 holding the cutter cylinder 8495

The carrier band moves in the carrier band guide rail and is fixed by using a carrier band cover plate 845, qualified IC chip products of the material distribution mechanism are sent into the carrier band, enter the carrier band supporting plate 846, exit the carrier band supporting plate 847, a carrier band origin sensing device 848, a convex material sensing device 849, a cover band limiting plate 8491, a pressing plate 8492, a band moving bottom plate 8493, a cutter device 8494 and a manipulator take materials to break and fill the carrier band, a closed-loop stepping motor 841 drives a pin wheel 842 to enable the carrier band to move one cell, and the carrier band filled with the materials is continuously output in cycles. The cutter device 8494 is provided, and the tape can be automatically cut after the IC chip products are wound to a certain number and are sealed in an empty mode according to the requirements of customers. Two sides of the cover tape limiting plate 8491 are provided with limiting grooves, so that the carrier tapes with two widths can be shared.

As shown in fig. 18 to 20, the sealing mechanism 86 includes a primary press belt cylinder 861, a secondary press belt cylinder 862, an inner seal knife 863, an outer seal knife 864, a seal knife ejector pin 865, a seal knife outer cover 866, a cover belt guide wheel 867, a cover belt tensioning rotating shaft 868, a cover belt tensioning block 869, a cover belt press sheet 8691, an induction sheet 8692, a photoelectric switch 8693, a cover belt plate 8694, a cover belt inner clamp plate retainer ring 8695, a cover belt inner clamp plate adjusting shaft 8696, a CCD lens 8681, a CCD lens 8682 fixedly connected with the CCD lens 8681, a CCD lens Y direction adjusting angle 8683 for adjusting the CCD lens 8682, a light source Y direction adjusting angle 8684, a first light source Z direction adjusting angle 8685, a second light source Z direction adjusting angle 8686, a heating rod 7, and a seal knife seat 8688.

The CCD lens 8682 of the sealing mechanism 86, two light sources, take a picture 2 times, detect the product character once, detect the product pin once. When the automatic operation is performed, the actions of the first-stage belt pressing cylinder 861 and the second-stage belt pressing cylinder 862 alternate with the inching of the carrier belt, after the heating rod 8687 heats the sealing knife to a set temperature, the second-stage belt pressing cylinder 862 presses the high-temperature sealing knife down, and under the action of the temperature and the pressure, the cover belt and the carrier belt are subjected to hot melt bonding. The outer sealing blade 864 is fixed on the inner sealing blade 863. The inner sealing knife 863 is provided with a U-shaped hole, the height of the outer sealing blade 864 can be adjusted up and down, and the sealing effect can be prevented from being influenced by uneven heights of a main flow channel of the carrier tape and a carrier tape baffle of the tape transport part. In addition, to switch 16 wide carrier bands from 12 wide carrier bands, the outer sealing blade 864 is turned over to be fixed, the sealing position can be adjusted back and forth, and 4 screws on the sealing blade seat 8688 need to be loosened, and the sealing blade Y-direction adjusting nut 8689 is turned counterclockwise or clockwise until the sealing blade is sealed at a proper position of the carrier bands. The CCD light source is fixedly provided with the sliding block, the light source can move up and down, and when the CCD is badly detected, the light source can be lifted up, so that manual waste discharge and IC chip feeding are facilitated.

As shown in FIG. 21, the carrier tape take-up mechanism 87 includes a take-up motor 871, a take-up spool 872 and a take-up arm 873 fixedly connected to the take-up motor 871, a take-up induction rotating shaft 874 fixed below the take-up arm 873, a take-up induction tensioning block 875 connected to the take-up induction rotating shaft 874, and a take-up induction tensioning wheel 876 connected to the take-up induction tensioning block 875.

The take-up motor 871 intermittently operates to drive the take-up reel 872 to rotate the take-up carrier tape. Because the radius is bigger and bigger in the process of belt collection, the pulling force is bigger and bigger. In order to prevent the carrier tape from being damaged by pulling, the carrier tape winding mechanism 87 is provided with a tape collecting induction tension block 875 and a tape collecting induction tension wheel 876, the tape collecting induction tension block 875 and the tape collecting induction tension wheel 876 are lightened, the tape collecting motor 871 stops rotating, and otherwise, the tape collecting motor 871 rotates.

As shown in fig. 22, the connecting flow channel 88 includes a connecting flow channel base plate 881, a connecting flow channel base 882, a connecting flow channel cover 883, a knocking cylinder 884, a knocking cylinder holder 885, a correlation photoelectric sensor 886, a correlation photoelectric holder 887, and a material jamming sensor 888.

A switching flow passage is arranged between the second material passing blanking assembly and the lower pipe assembly, so that the IC chip products in the second blanking assembly fall into the material pipe through the connecting flow passage 88 under the action of gravity. An optical fiber is arranged at the joint of the connecting flow passage 88 and the material pipe to detect whether the material is clamped or not, and a material knocking cylinder 884 is also arranged to convey the clamped material into the material pipe.

As shown in fig. 23 and fig. 24, the lower pipe assembly 85 includes a pipe pushing cylinder 851, a pipe clamp 852, a pipe pushing plate 853, a pipe pushing slider 854, a pipe sensor 855, a pipe support backing plate 856, a pipe limiting plate 857, a pipe clamping cylinder plate 8581, a pipe clamping clamp 8582, a pipe supporting plate 8583, a pipe clamping slider 8584, a micro switch 8585, a pipe knocking cylinder 8586, a pipe knocking shaft 8587, a pipe knocking block 8588, a rotating shaft 8589, a pipe jacking cylinder 8691, a pipe jacking connecting block 8592, a pipe jacking block 8693, and a pipe knocking cylinder fixing base 8594.

The material pipe is adopted to collect the qualified products, so that the automation of the process can be facilitated, and the cost is saved. The material pipe stacking frame 391 can be used for placing about 50 pipes in a one-time mode, and the manual operation time is shortened.

Firstly, manually placing a material pipe filled with an empty pipe into the material pipe stacking frame 391 at one time, triggering a pipe jacking cylinder to act through material pipe induction, jacking the material pipe to a position contacting with a connecting flow channel, and clamping the pipe by using a pipe clamping cylinder. After the material is filled, the jacking cylinder descends, and the pipe pushing cylinder pushes the filled pipe into the material pipe storage box. The material pipe limiting plate 857 is provided with a U-shaped hole, so that material pipes with different widths can be used universally, and the position of the material pipe can be adjusted. A microswitch 8585 is added at the pipe clamping position to detect whether the material pipe is clamped or not. The top pipe connecting block 8592 is provided with a spring which can support the material pipe and avoid damaging the material pipe. The tube knocking cylinder fixing seat 8594 is provided with a tension spring screw, the tube knocking block 8588 is also provided with a tension spring screw, and the tube knocking cylinder fixing seat 8594 is connected with the tension spring to reset the position of the tube knocking block 8588. The tube knocking cylinder 8586 acts, the tube knocking block 8588 rotates, an inclined tube can be knocked to be horizontally placed with the tube support backing plate 856, and the tube knocking shaft 8587 is provided with U-shaped glue, so that the tube can be prevented from being jacked to be damaged.

The invention also discloses a working method of the equipment for braiding or loading the chip into the material pipe after the chip is tested and burned, which comprises the following steps:

s1: the IC chip material pipe is placed in a material pipe stacking frame 391 of the pipe pushing mechanism 30;

s2: a pipe pushing cylinder 31 of the pipe pushing mechanism 30 separates the material pipes;

s3: a pipe jacking cylinder 38 of the pipe pushing mechanism 30 pushes out the material pipe to a pipe overturning mechanism 40;

s4: the pipe turning mechanism 40 clamps and turns the pipe, and the material passing gravity slides downwards;

s5: the first material distributing mechanism 61 distributes the material, and then the first carrying mechanism 71 carries the material pipe to the flow channel of the electrical test assembly 81 for electrical test;

s6: the second conveying mechanism 72 conveys the defective IC chips to the defective product accommodating device 82, conveys the defective IC chips to a feed port of the material passing assembly 50, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism 62 distributes the material, and the material taking manipulator 83 grips the material pipe;

s8: the carrier tape winding mechanism 87 loads the IC chip and detects whether the IC chip, the pins of the IC chip and the character are bad;

s9: the sealing mechanism 86 performs sealing;

s10: the tape deck 84 cuts and retracts the tape.

The method realizes that the bearing belt braid is filled after the IC chip of the TUBE rubber hose is tested, burned and recorded.

The invention also discloses a working method of the equipment for braiding or loading the chip into the material pipe after the chip is tested and burned, which comprises the following steps:

s1: the IC chip material pipe is placed in a material pipe stacking frame 391 of the pipe pushing mechanism 30;

s2: a pipe pushing cylinder 31 of the pipe pushing mechanism 30 separates the material pipes;

s3: a pipe jacking cylinder 38 of the pipe pushing mechanism 30 pushes out the material pipe to a pipe overturning mechanism 40;

s4: the pipe turning mechanism 40 clamps and turns the pipe, and the material passing gravity slides downwards;

s5: the first material distributing mechanism 61 distributes the material, and then the first carrying mechanism 71 carries the material pipe to the flow channel of the electrical test assembly 81 for electrical test;

s6: the second conveying mechanism 72 conveys the defective IC chips to the defective product accommodating device 82, conveys the defective IC chips to a feed port of the material passing assembly 50, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism 62 distributes the materials;

s8: the empty material pipe is placed into the material pipe stacking frame 391 of the pipe pushing mechanism 30 at one time;

s9: the pipe pushing cylinder 38 of the pipe pushing mechanism 30 pushes out the empty pipe, the pipe turning mechanism 40 clamps the pipe and turns the pipe, and the material passing gravity slides downwards;

s10, retracting the conveying material blocking cylinder 918 of the second conveying mechanism 72, and sliding the IC chip product into an empty pipe;

s11, after the IC chip is fully filled with the tubes, the limiting cylinder of the tube pushing mechanism 30 retracts, the tube pushing cylinder 38 of the tube pushing mechanism 30 retracts, and the tube pushing cylinder 31 of the tube pushing mechanism 30 acts to push the fully filled tubes into the box.

The method realizes that the TUBE rubber TUBE is loaded after the IC chip of the TUBE rubber TUBE is tested and burned.

The invention can be compatible with various packaged SOP/MSOP/SSOP/TSSOP/LSOP chips, thereby promoting the modernized operation; the invention realizes that one device can realize the requirements of 2 types of processes: firstly, filling a bearing belt braid after the IC chip packaged by TUBE rubber is tested and burned; the IC chip of the second TUBE rubber hose is transferred into the TUBE rubber hose after being tested and burned, so that the equipment value is improved; the equipment test burning needs time, four tests are additionally arranged to improve the efficiency and improve the productivity of the IC chip; the equipment provided by the invention is provided with a group of CCDs, so that the carrier tape braids are guaranteed to be good IC chips; in the device, defective IC chips sorted in the test burning process are all accommodated in a mode of filling TUBE rubber TUBEs; the good product output of the IC chip of the equipment can select a bearing belt braid or load a TUBE rubber TUBE, and is suitable for diversified requirements.

The invention integrates machinery and electricity into a whole, and the IC chip is fed by a material pipe stacking rack, a material pipe is separated by a pipe pushing mechanism, the IC chip has the function of detecting the electrical property of a pin of the IC chip, and is detected by a golden finger; the invention has the advantages of convenient operation, mature and stable structure, firm and durable parts, easy operation, accurate positioning and simple and elegant appearance.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A device for braiding or loading a material pipe after chip test burning is characterized by comprising a lower rack, a pipe pushing mechanism, a pipe turning mechanism, a discharging track, a material passing component, a first material distributing mechanism, a first carrying mechanism, a second carrying mechanism, an electrical test component, a defective product accommodating device, a material taking mechanical arm, a second material distributing mechanism, a tape conveying mechanism, a sealing mechanism, a carrier tape winding mechanism, a connecting flow channel and a pipe discharging component, wherein the first material distributing mechanism, the first carrying mechanism, the second carrying mechanism and the second carrying mechanism are connected with the pipe turning mechanism; the pipe pushing mechanism comprises a material pipe inductive switch, a pipe pushing cylinder connected with the material pipe inductive switch, a pushing plate driven by the pipe pushing cylinder to move, a plurality of limiting blocks located near the pushing plate, supporting plates supported at two ends of the pushing plate, a material pipe limiting plate for limiting a material pipe of an IC chip, a material height limiting block and a guide plate located near the material pipe limiting plate, a pipe pushing cylinder and a material pipe stacking rack; the material pipe of the IC chip is placed in the material pipe stacking rack; the pipe overturning mechanism comprises a pipe clamping block for clamping a material pipe, a pipe clamping supporting plate for supporting the pipe clamping block, a pipe clamping cylinder fixing seat for fixing the pipe clamping cylinder, a overturning mechanism side plate fixedly connected with the pipe clamping cylinder fixing seat, a first pipe knocking cylinder and a second pipe knocking cylinder which are connected to the overturning mechanism side plate, an overturning mechanism rotating shaft connected with the overturning mechanism side plate, an overturning mechanism bearing fixing seat for fixing the overturning mechanism side plate, a pipe overturning cylinder fixedly connected with the overturning mechanism side plate and a pipe overturning cylinder fixing seat for supporting the pipe overturning cylinder.

2. The apparatus for taping or feeding a material pipe after chip test burning according to claim 1, wherein the feeding track comprises a product flow channel cover plate, a product flow channel base located below the product flow channel cover plate, a product flow channel cushion block located between the product flow channel cover plate and the product flow channel base, a material knocking block located at an inlet of the product flow channel cover plate, a material knocking cylinder, a tension spring connecting the material knocking block and the material knocking cylinder, a sensing block located below the material knocking block, a proximity switch located below the tension spring, a material distributing rod and a material blocking block located at the tail end of the product flow channel cover plate, a material distributing cylinder connected with the material distributing rod, an in-place photoelectric sensor located below the material distributing rod, and a material shortage photoelectric sensor connected with the product flow channel cover plate.

3. The apparatus for taping or feeding a material tube after chip testing and burning according to claim 1, wherein the first carrying mechanism and the second carrying mechanism are carrying manipulators, each of which comprises a servo motor, a motor fixing seat for supporting the servo motor, a first synchronizing wheel fixedly connected with the servo motor, a bearing seat, a second rotating shaft synchronizing wheel fixed on the bearing seat, a synchronous belt connected between the first synchronizing wheel and the second rotating shaft synchronizing wheel, a sliding block located in the synchronous belt, a carrying material blocking cylinder fixing seat, a carrying material blocking cylinder fixed on the carrying material blocking cylinder fixing seat, a carrying material blocking block connected with the carrying material blocking cylinder, an origin induction sheet located near the carrying material blocking block, a synchronous belt induction switch located near the servo motor, and a material induction correlation sensor located near the bearing seat.

4. The device for taping or feeding a material pipe after chip testing and burning according to claim 1, wherein the electrical testing assembly comprises a plurality of finger cylinders arranged side by side, a cylinder fixing seat for supporting the finger cylinders, a golden finger positioned below the corresponding finger cylinder, an insulating high-strength adhesive rod and a pressing rod fixing seat positioned near the corresponding golden finger, a material blocking shaft, a testing material blocking block, two rows of testing material blocking cylinders, a flow channel base cushion plate, a flow channel base, a flow channel cover plate and material feeding position detection.

5. The equipment for taping or feeding the material pipe after chip testing and burning of claim 1, wherein the material passing assembly comprises a material separating cylinder, a material blocking block, a material separating rod, a first material to position induction, a second material to position induction, a material blocking shaft, a material blocking cylinder connected with the material blocking shaft, a pilot cylinder and a pilot claw connected with the pilot cylinder.

6. The device for testing and burning the chips and then taping or feeding the material pipes according to claim 1, wherein the material taking manipulator comprises a material taking servo motor, a material taking cam connected with the material taking servo motor, an upper silver slider, a nozzle rod fixing block fixed on the upper silver slider, a nozzle rod fixed on the nozzle rod fixing block, a glue nozzle fixed at the tail end of the nozzle rod, a proximity switch fixed on the material taking cam, a bearing fixing seat, a bearing retainer ring fixed on the bearing fixing seat, a material taking mechanism track plate connected with the bearing fixing seat and the material taking servo motor, a connecting block for connecting the material taking mechanism track plate and the upper silver slider, a material taking mechanism X-direction adjusting base, a material taking mechanism Y-direction adjusting vertical plate, a rotating shaft penetrating through the bearing fixing seat and the bearing retainer ring, a negative pressure gauge and a material taking protective cover.

7. The apparatus for braiding or feeding a material pipe after chip testing and burning according to claim 1, wherein the tape transport mechanism comprises a closed loop stepping motor, a pin wheel connected to the closed loop stepping motor, a carrier tape main flow channel, a carrier tape baffle, a carrier tape cover plate, a carrier tape feeding support plate, a carrier tape discharging support plate, a carrier tape origin sensing device, a protruding material sensing device, a cover tape limiting plate, a pressing plate, a tape transport base plate, a cutter device, a cutter cylinder connected to the cutter device, and a cutter cylinder fixing base for supporting the cutter cylinder.

8. The apparatus of claim 1, wherein the sealing mechanism comprises a primary tape pressing cylinder, a secondary tape pressing cylinder, an inner sealing knife, an outer sealing blade, a sealing knife top rod, a sealing knife outer cover, a cover tape guide wheel, a cover tape tensioning shaft, a cover tape tensioning block, a cover tape pressing sheet, an induction sheet, a photoelectric switch, a cover tape disk, a cover tape inner clamping disk retainer ring and a cover tape inner clamping disk adjusting shaft, a CCD lens holder, a CCD lens fixedly connected with the CCD lens holder, a CCD lens Y-direction adjusting angle seat for adjusting the CCD lens, a light source Y-direction adjusting angle seat, a first light source Z-direction adjusting angle seat, a second light source Z-direction adjusting angle seat, a heating rod and a sealing knife.

9. The working method of the equipment for taping or feeding the material pipe after the chip test burning as claimed in any one of claims 1 to 8, comprising the steps of:

s1: placing an IC chip material pipe into a material pipe stacking frame of a pipe pushing mechanism;

s2: a pipe pushing cylinder of the pipe pushing mechanism separates the material pipe;

s3: a pipe pushing cylinder of the pipe pushing mechanism pushes a material pipe out to the pipe overturning mechanism;

s4: the tube turning mechanism clamps and turns over the tube, and the gravity of the material passing slides downwards;

s5: the first material distributing mechanism distributes materials, and then the first carrying mechanism carries the material pipe to a flow channel of the electrical test assembly and carries out electrical test;

s6: the second conveying mechanism conveys the IC chip defective products to the defective product accommodating device, conveys the IC chip defective products to a feed port of the material passing assembly, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism distributes materials, and the material taking manipulator clamps the material pipe;

s8: the carrier tape winding mechanism is used for filling an IC chip and detecting whether the IC chip, the IC chip pin and the character are bad;

s9: sealing by a sealing mechanism;

s10: the tape transport mechanism cuts and retracts the tape.

10. The working method of the equipment for taping or feeding the material pipe after the chip test burning as claimed in any one of claims 1 to 8, comprising the steps of:

s1: placing an IC chip material pipe into a material pipe stacking frame of a pipe pushing mechanism;

s2: a pipe pushing cylinder of the pipe pushing mechanism separates the material pipe;

s3: a pipe pushing cylinder of the pipe pushing mechanism pushes a material pipe out to the pipe overturning mechanism;

s4: the pipe turning mechanism clamps and turns the pipe, and the material passing gravity slides downwards;

s5: the first material distributing mechanism distributes materials, and then the first carrying mechanism carries the material pipe to a flow passage of the electrical property testing assembly and carries out electrical property testing;

s6: the second conveying mechanism conveys the IC chip defective products to the defective product accommodating device, conveys the IC chip defective products to a feed port of the material passing assembly, and slides downwards under the gravity of material passing;

s7: the second material distributing mechanism distributes materials;

s8: the material pipe of the empty pipe is placed into the material pipe stacking frame of the pipe pushing mechanism at one time;

s9: a pipe pushing cylinder of the pipe pushing mechanism pushes out an empty pipe, a pipe turning mechanism clamps and turns the pipe, and the pipe slides downwards under the gravity of material passing;

s10: the conveying material blocking cylinder of the second conveying mechanism retracts, and the IC chip product slides down into the hollow pipe;

s11: after the IC chip is fully filled with the tubes, the limiting cylinder of the tube pushing mechanism retracts, the tube pushing cylinder of the tube pushing mechanism retracts, and the tube pushing cylinder of the tube pushing mechanism acts to push the full tubes into the box.

Images