CN115132687B - Package stacking structure and package stacking method - Google Patents

Package stacking structure and package stacking method Download PDF

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Publication number
CN115132687B
CN115132687B CN202211068226.6A CN202211068226A CN115132687B CN 115132687 B CN115132687 B CN 115132687B CN 202211068226 A CN202211068226 A CN 202211068226A CN 115132687 B CN115132687 B CN 115132687B
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substrate
chip
pad
bonding pad
electrically connected
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CN115132687A (en
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何正鸿
张超
何林
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

The present disclosure provides a package stacking structure and a package stacking method, and relates to the technical field of semiconductors. The packaging stacked structure comprises a first substrate and a second substrate, wherein a first bonding pad and a second bonding pad are arranged on two opposite surfaces of the first substrate, the second bonding pad comprises at least two welding spots arranged at intervals, and the at least two welding spots are electrically connected by adopting a metal wire; the first welding pads are electrically connected with the welding points respectively; a first metal column is convexly arranged on the first bonding pad; the second substrate is provided with conductive adhesive, the first substrate is arranged on the second substrate in an overlapping mode, and the metal wire is electrically connected with the conductive adhesive. The buffer structure can play a good role in buffering in the stacking process, the deformation of the first substrate and the second substrate is relieved, and the packaging quality is improved.

Description

Package stacking structure and package stacking method
Technical Field
The invention relates to the technical field of semiconductors, in particular to a package stacking structure and a package stacking method.
Background
In the existing stacked package structure, different materials of different packages, that is, different thermal expansion coefficients. When stacking is performed, warp deformation easily occurs. In addition, reflow soldering, plastic package processes and the like are mostly adopted in the packaging process, and product warpage is easily caused. And the phenomena of layering, breaking or falling off are easy to occur after the warpage, the electric connection is unstable, and the packaging quality is seriously influenced.
Disclosure of Invention
The object of the present invention includes, for example, providing a package stack structure and a package stack method, which can alleviate the warpage of the structure, improve the deformation of the product, and improve the package quality.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a package stack structure, comprising:
a first substrate; a first bonding pad and a second bonding pad are arranged on two opposite surfaces of the first substrate, the second bonding pad comprises at least two welding spots arranged at intervals, and the at least two welding spots are electrically connected by adopting a metal wire; the first bonding pad is electrically connected with each welding spot respectively; a first metal column is convexly arranged on the first bonding pad;
a second substrate; the second substrate is provided with conductive adhesive, the first substrate is arranged on the second substrate in an overlapping mode, and the metal wire is electrically connected with the conductive adhesive.
In an optional implementation manner, a first through hole is formed in the first substrate, a second metal column is disposed in the first through hole, and the first pad and the second pad are electrically connected through the second metal column.
In an alternative embodiment, a first chip is also included; and a third bonding pad is arranged on one side of the first substrate, which is far away from the second bonding pad, the third bonding pad is electrically connected with the first chip, and the first chip is positioned between two adjacent first metal columns.
In an optional embodiment, a fourth pad is disposed on a side of the second substrate close to the first substrate, and the conductive adhesive is disposed on the fourth pad.
In an alternative embodiment, a second chip is also included; a fifth bonding pad which is positioned on the same side as the fourth bonding pad is arranged on the second substrate, and the second chip is electrically connected with the fifth bonding pad; the second chip is arranged between two adjacent fourth bonding pads.
In an optional embodiment, the first pad is grounded, the second chip is a flip chip, and a protective adhesive is disposed on one side of the second chip close to the second substrate; a conductive adhesive is arranged on one side, away from the second substrate, of the second chip;
and a conductive adhesive is arranged between every two adjacent second chips, and/or a conductive adhesive is arranged between the second chip and the fourth bonding pad.
In an optional embodiment, a second through hole is formed in the first substrate, a shielding adhesive is disposed on a side of the first substrate away from the second substrate, and the shielding adhesive covers the first chip and covers a portion of the first metal pillar;
the second through hole is used for allowing the shielding glue to pass through so that the shielding glue is filled between the first substrate and the second substrate, and the shielding glue is respectively connected with the metal wire and the conductive glue on the second chip.
In an optional embodiment, a groove is provided on a side of the first substrate close to the second substrate, and a groove wall of the groove is located on the scribe line of the first substrate.
In an optional embodiment, the groove walls of the groove include a first groove wall, a second groove wall and a third groove wall which are connected in sequence, and the first groove wall and the third groove wall are respectively designed symmetrically with respect to the second groove wall; and the first groove wall, the second groove wall and the third groove wall are respectively provided with a sawtooth structure, and the second groove wall is positioned on the cutting path.
In an optional embodiment, the first substrate is provided with a first grounding pad, the second substrate is provided with a second grounding pad, and the first grounding pad and the second grounding pad are connected by wire bonding; in the plurality of second bonding pads, part of the second bonding pads are grounded, the rest of the second bonding pads are functional bonding pads, and the grounded second bonding pads are electrically connected with the first metal columns.
In an optional embodiment, the display device further comprises a plastic package body, the plastic package body covers the first substrate and the second substrate respectively, and the plastic package body covers the first metal column partially or completely.
In a second aspect, the present invention provides a package stacking method, comprising:
providing a first substrate; the two opposite surfaces of the first substrate are respectively provided with a first bonding pad and a second bonding pad, the second bonding pad comprises at least two welding spots arranged at intervals, and the two welding spots are electrically connected by adopting metal wires; the first bonding pad is electrically connected with the welding point; a first metal column is convexly arranged on the first bonding pad;
providing a second substrate; wherein the second substrate is provided with conductive adhesive;
and stacking the first substrate on the second substrate so as to electrically connect the metal wire with the conductive adhesive.
In an alternative embodiment, the step of providing the first substrate further comprises:
mounting a first chip on the first substrate; wherein the first chip is positioned between two adjacent first metal columns;
the step of providing a second substrate further comprises:
mounting a second chip on the second substrate; the second chip is located between two adjacent metal wires, and the conductive adhesive is arranged on the second substrate and/or the second chip.
The beneficial effects of the embodiment of the invention include, for example:
according to the packaging and stacking structure provided by the embodiment of the invention, the two welding spots arranged at intervals are electrically connected by adopting the metal wires, the wire arcs of the metal wires are electrically connected with the conductive adhesive on the second substrate, the electrical connection is stable and reliable, the electrical connection between the first substrate and the second substrate can be realized, and the stacking process is simpler. The arc of the metal wire can play a role in buffering, reduce stress and relieve deformation such as structure warping. And the arc of the metal wire has certain capillary action, so that the filling efficiency of the filling medium between the first substrate and the second substrate is higher, and the filling effect is better. In addition, the first metal column is beneficial to heat dissipation of the packaging stacked structure, and packaging quality and heat dissipation effect are improved.
The packaging and stacking method provided by the embodiment of the invention has the advantages of simpler process and higher packaging efficiency. The method can play a role in buffering, reduce stress, relieve deformation such as structure warping and the like, and is beneficial to improving the heat dissipation effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a first structural diagram of a package stack structure according to an embodiment of the invention;
fig. 2 is a partial structural diagram of a first substrate of a package stack structure according to an embodiment of the invention;
fig. 3 is a second structural diagram of a package stack structure according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a first substrate of a package stack structure according to an embodiment of the invention;
fig. 5 is a schematic diagram illustrating a third structure of a package stack structure according to an embodiment of the invention;
fig. 6 is a fourth structural diagram of a package stack structure according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a process for providing a first substrate in a package stacking method according to an embodiment of the invention;
FIG. 8 is a first process diagram illustrating a second substrate provided in the package stacking method according to the embodiment of the invention;
FIG. 9 is a second process diagram illustrating a second substrate provided in the package stacking method according to the embodiment of the invention;
fig. 10 is a process diagram of stacking a first substrate on a second substrate in the package stacking method according to the embodiment of the invention.
Icon: 100-package stack structure; 200-a first substrate; 211-a first pad; 213-second pad; 215-solder joint; 217-metal lines; 219-third pad; 220-a first metal pillar; 221-glue film; 223-opening; 230-a first chip; 243-second metal pillar; 245-a second via; 247-shielding glue; 250-a groove; 251-a first slot wall; 253-a second slot wall; 255-a third slot wall; 257-a sawtooth structure; 261-a first ground pad; 263-second ground pad; 300-a second substrate; 311-fourth pad; 313-a fifth pad; 315-sixth pad; 320-conductive adhesive; 330-a second chip; 331-protective glue; 333-a bump; 340-solder balls; 350-plastic package body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 and fig. 2, a package stack structure 100 provided in the present embodiment includes a first substrate 200 and a second substrate 300, wherein two opposite surfaces of the first substrate 200 are provided with a first bonding pad 211 and a second bonding pad 213, the second bonding pad 213 includes at least two spaced bonding pads 215, and at least two bonding pads 215 are electrically connected by a metal wire 217; the first pads 211 are electrically connected to the respective pads 215; a first metal pillar 220 is convexly arranged on the first bonding pad 211; the second substrate 300 is provided with a conductive adhesive 320, the first substrate 200 is stacked on the second substrate 300, and the metal wire 217 is electrically connected to the conductive adhesive 320. The two welding points 215 which are arranged at intervals are electrically connected by adopting the metal wire 217, the wire arc of the metal wire 217 is electrically connected with the conductive adhesive 320 on the second substrate 300, the electrical connection is stable and reliable, the electrical connection between the first substrate 200 and the second substrate 300 can be realized, and the stacking process is simpler. The arc of the metal wire 217 is in an arch bridge shape, so that a certain buffering effect can be achieved, and the structural stress is reduced; and the metal wire 217 is adopted for electric connection, so that the problems of structural warping and other deformation or fracture delamination caused by inconsistent thermal expansion coefficients among materials can be avoided. The arc of the metal wire 217 also has a certain capillary action, so that the filling efficiency of the filling medium between the first substrate 200 and the second substrate 300 is higher, and the filling effect is better. In addition, the first metal pillar 220 facilitates heat dissipation of the package stack structure 100, thereby improving the package quality and the heat dissipation effect.
Optionally, a first through hole is formed in the first substrate 200, a second metal pillar 243 is disposed in the first through hole, and the first pad 211 and the second pad 213 are electrically connected through the second metal pillar 243. It is understood that the first pads 211 and the second pads 213 are electrically connected by solid vias. Of course, other electrical connection methods may be used, such as electrical connection through internal wiring of the first substrate 200, and the like, which is not particularly limited herein. In this embodiment, the number of the welding points 215 is two, and in other embodiments, the number may be three, four or more, and is not limited herein.
Optionally, the package stack structure 100 further includes a first chip 230 disposed on the first substrate 200; the side of the first substrate 200 away from the second bonding pad 213 is provided with a third bonding pad 219, the third bonding pad 219 is electrically connected to the first chip 230, and the first chip 230 is located between two adjacent first metal pillars 220.
Optionally, a fourth pad 311 is disposed on one side of the second substrate 300 close to the first substrate 200, and a conductive adhesive 320 is disposed on the fourth pad 311. A second chip 330 is also attached to the second substrate 300. A fifth bonding pad 313 located on the same side as the fourth bonding pad 311 is arranged on the second substrate 300, and the second chip 330 is electrically connected to the fifth bonding pad 313; the second chip 330 is disposed between two adjacent fourth pads 311. It is easily understood that the first chip 230 and the second chip 330 may be a front-mounted chip or a flip chip. If the normal chip is adopted, the normal chip is connected with the first substrate 200 or the second substrate 300 by wire bonding. If a flip chip is used, the flip chip is bonded to the third pads 219 or the fifth pads 313.
In this embodiment, the first chip 230 and the second chip 330 are flip chips, respectively. The bottom of the first chip 230 is provided with a protective adhesive 331, and the protective adhesive 331 is used for protecting the bump 333 and the third pad 219 at the bottom of the first chip 230, so that the bump 333 and the third pad 219 are ensured to be electrically connected reliably, and delamination or fracture is prevented. Meanwhile, the protective adhesive 331 plays an insulating role with an external conductive medium to prevent short circuit. The protection adhesive 331 may fill the bottom of the first chip 230 and climb a portion along the sidewall of the first chip 230, which is more effective. Similarly, a side of the second chip 330 close to the second substrate 300 is provided with a protective adhesive 331, that is, the bottom of the second chip 330 is provided with the protective adhesive 331. The protective adhesive 331 on the bottom of the second chip 330 is disposed in the same manner and has the same effect as the protective adhesive 331 on the bottom of the first chip 230. The number of the first chips 230 may be one or more, and the number of the second chips 330 may be one or more, and may be flexibly set according to actual needs, which is not particularly limited herein.
Optionally, the first pad 211 is grounded, and a side of the second chip 330 away from the second substrate 300 is provided with a conductive adhesive 320. A conductive adhesive 320 is disposed between two adjacent second chips 330, and/or a conductive adhesive 320 is disposed between the second chip 330 and the fourth pad 311. It is understood that if the first pad 211 is grounded, the second pad 213, the metal line 217, the first metal pillar 220, and the conductive paste 320 connected to the metal line 217 all have a grounding property. The first metal pillar 220 plays an electromagnetic shielding role for the first chip 230. A conductive adhesive 320 is disposed between two adjacent second chips 330, and the conductive adhesive 320 is electrically connected to the conductive adhesive 320 on the back side of the second chip 330 (the side of the second chip 330 far away from the second substrate 300) and electrically connected to the conductive adhesive 320 on the fourth pad 311. Since the conductive adhesive 320 on the fourth pad 311 is electrically connected to the arch bridge-shaped metal line 217, that is, the fourth pad 311 is grounded, the electromagnetic shielding of the second chip 330 can be achieved. It is easy to understand that if all of the plurality of second pads 213 are grounded, the second chip 330 disposed between two adjacent second pads 213 can achieve electromagnetic shielding. In which case functional pads may be provided elsewhere on the first substrate 200 and the second substrate 300. Of course, it is also possible to ground a part of the second pads 213, so that the electromagnetic shielding of the partial second chip 330 can be realized by the arch-shaped metal wire 217, and the rest of the second pads 213 can be used as functional pads. It can be understood that, if a portion of the second pad 213 is grounded, the metal wire 217 electrically connected to the portion of the second pad 213 has a grounding property, and the metal wire 217 having the grounding property surrounds the outer circumference of the second chip 330, so that the second chip 330 has an electromagnetic shielding effect.
With reference to fig. 3, optionally, a second through hole 245 is formed on the first substrate 200, a shielding adhesive 247 is disposed on a side of the first substrate 200 away from the second substrate 300, and the shielding adhesive 247 covers the first chip 230 and covers a portion of the first metal pillar 220. The shield paste 247 has conductivity. The second through hole 245 is used for the shielding glue 247 to pass through, so that the shielding glue 247 is filled between the first substrate 200 and the second substrate 300, and the shielding glue 247 is connected with the metal wire 217 and the conductive glue 320 on the second chip 330 respectively. This may achieve electromagnetic shielding of the first chip 230 and the second chip 330. After the second through holes 245 are provided, a shielding adhesive 247 may be dispensed on a side of the first substrate 200 away from the second substrate 300, and the shielding adhesive 247 may be dropped from the second through holes 245 and filled between the first substrate 200 and the second substrate 300. The dot shielding glue 247 is simpler in operation, high in efficiency, better in filling effect and more stable and reliable in electric connection. It is easy to understand that the metal wire 217 is an arch-bridge-shaped wire arc, and has a certain capillary action, so that the fluidity of the shielding adhesive 247 can be increased, and the filling effect can be further improved.
In this embodiment, when the shielding paste 247 is not provided, the arch bridge-shaped metal wire 217 has an electromagnetic shielding effect on the second chip 330 when having a grounding property. After the shielding glue 247 is provided, the electromagnetic shielding effect can be further enhanced. For example, the first chip 230 and the second chip 330 may be rf chips, and in the case where only the metal wire 217 is provided, the rf chips may perform an electromagnetic shielding function on high-frequency signals. If the shielding adhesive 247 is provided, it is possible to perform an electromagnetic shielding function not only for high-frequency signals but also for low-frequency signals.
In the same second bonding pad 213, the two pads 215 are electrically connected by the metal wire 217, and the metal wire 217 is shaped like an arch bridge wire. The metal wire 217 can play a role in buffering in the process of mounting the first substrate 200 to the second substrate 300 and in the plastic packaging process, so that the first substrate 200 and the second substrate 300 are prevented from being deformed or crushed due to too high mounting pressure or too high plastic packaging pressure. Secondly, the metal wire 217 has a capillary effect, so that the flowability of the plastic package body 350 or the shielding glue 247 is improved, and the phenomena of incomplete filling or void occurrence and the like caused by poor flowability due to an excessively small gap between the first substrate 200 and the second substrate 300 are avoided. In addition, the adoption of the metal wire 217 can also avoid the problems of warping deformation caused by inconsistent material thermal expansion coefficients due to the welding of the solder balls 340, bridging or insufficient welding and the like caused by the welding of the solder balls 340, effectively improve the packaging quality and ensure more stable and reliable electric connection.
Referring to fig. 4, optionally, a groove 250 is formed on the first substrate 200 at a side close to the second substrate 300, and a groove wall of the groove 250 is located on the scribe line of the first substrate 200. The dicing streets are provided to separate the package stack structure 100 into individual products in a subsequent process. Set up recess 250 on the cutting way, can reduce cutting thickness, reduce the cutting burr, the cutting edge is more level and smooth, improves cutting quality and cutting efficiency. Meanwhile, the abrasion of the cutting tool is reduced, and the service life of the cutting tool is prolonged.
Optionally, the slot walls of the slot 250 include a first slot wall 251, a second slot wall 253 and a third slot wall 255 which are connected in sequence, and the first slot wall 251 and the third slot wall 255 are respectively designed symmetrically with respect to the second slot wall 253, so that the buffering effect is better. In this embodiment, the first groove wall 251 and the second groove wall 253 form an obtuse angle, and the second groove wall 253 and the third groove wall 255 form an obtuse angle, i.e. the first groove wall 251 and the third groove wall 255 are respectively designed as an inclined slope. Therefore, the capillary action of the filling plastic package body 350 or the shielding glue 247 can be improved, the bonding force between the plastic package body 350 and the first substrate 200 can be improved, and the structural delamination can be avoided.
In this embodiment, the first groove wall 251, the second groove wall 253, and the third groove wall 255 are respectively provided with a saw tooth structure 257, and the second groove wall 253 is located on the cutting path. The sawtooth structures 257 can play a role in buffering, and prevent the first substrate 200 and the second substrate 300 from being deformed or crushed due to overlarge mounting pressure or plastic packaging pressure. Secondly, the sawtooth structures 257 have a capillary effect, so as to improve the flowability of the plastic package body 350 or the shielding adhesive 247, and avoid the phenomenon that the flowability is poor due to an excessively small gap between the first substrate 200 and the second substrate 300, so that the filling is incomplete or a cavity occurs. In addition, the sawtooth structures 257 can avoid the problem that the plastic package 350 and the first substrate 200 are layered due to the package warpage stress caused by the stress pulling during the cutting. It is easy to understand that the sawtooth structures 257 on the first groove wall 251 and the third groove wall 255 are located in the plastic package body 350, which can improve the bonding force between the plastic package body 350 and the first substrate 200. The sawtooth structures 257 on the second groove wall 253 can enhance the flowability of the plastic package body 350, improve the plastic package quality and prevent the occurrence of voids. Optionally, the length W of the second groove wall 253 is equal to the width of the cutting street, and after cutting, the second groove wall 253 and the serration structures 257 thereon are removed.
Of course, in some embodiments, the saw tooth structure 257 may be omitted, as shown in fig. 5, and is not limited in particular.
With reference to fig. 6, optionally, the first substrate 200 is provided with a first ground pad 261, the second substrate 300 is provided with a second ground pad 263, and the first ground pad 261 and the second ground pad 263 are wire-bonded. In this embodiment, for a single product, the first ground pad 261 is disposed at the edge of the first substrate 200, and the second ground pad 263 is disposed at the edge of the second substrate 300, so that electromagnetic shielding of all the second chips 330 on the second substrate 300 can be achieved. It should be understood that fig. 6 shows only one cross-sectional structural schematic, and fig. 6 shows only two wire bonds. In the actual three-dimensional stacking, the routing structures may be arranged along all directions, and the number of the routing structures may also be larger than two, so as to surround all the second chips 330, thereby realizing the full shielding of all the second chips 330. It can be understood that if the wire bonding is to achieve full shielding on the outermost edge of a single product, the first substrate 200 needs to be cut and separated along the cutting path of the second groove wall 253, separated into single pieces and then attached to the second substrate 300, so as to avoid the wire bonding space, and make the wire bonding operation of the first ground pad 261 and the second ground pad 263 easier. It is easily understood that, among the plurality of second pads 213, some of the second pads 213 are grounded, the rest of the second pads 213 are functional pads, and the grounded second pads 213 are electrically connected to the first metal posts 220. As shown, the figure includes four second pads 213 and four metal lines 217 connected to the second pads 213, wherein the middle two second pads 213 may be ground pads, and the outer two second pads 213 may be functional pads. The first chip 230 between the first metal posts 220 also has a shielding effect.
It should be noted that, if the shielding glue 247 is filled between the first substrate 200 and the second substrate 300, shielding of part or all of the second chip 330 is achieved. According to practical situations, fourth pad 311 may be partially used for a ground pad, and the rest for a functional wire bonding pad. The fourth pad 311, which is provided with a portion serving as a ground, may be optionally omitted, so that the shielding adhesive 247 is directly used to electrically connect the metal wire 217 and the conductive adhesive 320 on the back surface of the second chip 330, and the electromagnetic shielding function may also be achieved. Due to the arrangement, the structure is simpler, the process of dotting the conductive adhesive 320 on the fourth bonding pad 311 is omitted, and the improvement of the packaging efficiency is facilitated.
Optionally, a sixth pad 315 is further disposed on the back side of the second substrate 300 for disposing a solder ball 340. According to the actual requirement, part of the solder balls 340 is used for grounding and part is used for functional connection. The grounding of the first pad 211 or the second pad 213 may be implemented in various ways, for example, by a grounding circuit inside the first substrate 200. Alternatively, the ground is realized by the solder balls 340 on the back surface of the second substrate 300, which is not limited in particular.
Optionally, the package stack structure 100 further includes a molding compound 350, the molding compound 350 covers the first substrate 200 and the second substrate 300, respectively, and the molding compound 350 covers the first metal pillar 220 partially or completely. In this embodiment, the plastic package body 350 partially covers the first metal pillar 220, that is, the first metal pillar 220 exposes the plastic package body 350, which is beneficial to improving the heat dissipation effect. Optionally, the height of the first metal pillar 220 is greater than or equal to the height of the first chip 230, so that the electromagnetic shielding of the first chip 230 can be better achieved, and the anti-electromagnetic interference effect is better.
It should be understood that the first chip 230 is disposed between the plurality of first metal pillars 220, and other chips may be disposed on the first substrate 200, and the other chips are located outside the region surrounded by the plurality of first metal pillars 220. Optionally, a shielding layer may be further disposed outside the plastic package body 350, and the shielding layer is electrically connected to the first metal pillar 220. The shielding layer may be disposed only between the first metal pillars 220, and electromagnetic shielding of the first chip 230 in all directions is achieved. Of course, the shielding layer may cover the entire outer surface (including the top surface and the side surfaces) of the plastic package body 350, so as to achieve electromagnetic shielding of all chips on the first substrate 200 and the second substrate 300.
Second embodiment
With reference to fig. 7 to 9, an embodiment of the invention provides a package stacking method, including:
a first substrate 200 is provided. The first substrate 200 includes, but is not limited to, a base plate. Wherein, the two opposite surfaces of the first substrate 200 are respectively provided with a first bonding pad 211 and a second bonding pad 213. In this embodiment, the first substrate 200 has the first pads 211 and the third pads 219 on the front surface thereof, and the second pads 213 on the back surface thereof. The first pad 211 and the second pad 213 are electrically connected by a solid via (i.e., the second metal pillar 243). The third pads 219 are disposed between the two first pads 211, and the third pads 219 are used for mounting the first chip 230.
The second pad 213 includes at least two spaced pads 215. The two solder joints 215 are electrically connected to the solid vias, respectively. In this embodiment, the distance between two solder joints 215 is less than the diameter of a solid via. It is understood that the solder joint 215 can be directly disposed on the first substrate 200, or a pad can be disposed on the first substrate 200, and then a connection point at a different position on the pad can be selected as the solder joint 215. The first bonding pad 211 is a grounding pad, and the electrostatic discharge of the first metal pillar 220 and the electrostatic discharge of the first substrate 200 are realized through the grounding pad, so as to prevent the first chip 230 inside the package stack structure 100 from being broken down by static electricity.
A trench is formed in the first substrate 200. Optionally, a groove 250 is formed on the side having the second pad 213 (the back side of the first substrate 200 in this embodiment), including but not limited to forming the groove 250 by laser grooving or etching. Wherein, the groove 250 is located on the cutting path, a sawtooth structure 257 is formed on the wall of the groove 250, and the wall of the groove 250 has a certain inclination angle.
A first metal pillar 220 is formed on the first pad 211. Alternatively, the adhesive film 221 is attached to the side of the first substrate 200 having the first pads 211, and the adhesive film 221 may be a photoresist. The photoresist opening 223 is exposed and developed to leak out of the first pad 211. Then, the first metal pillar 220 is formed by electroplating copper in the opening 223 by using an electroless plating method. Of course, the first metal pillar 220 can be formed by wire bonding or the like.
The first substrate 200 is turned over and the second pads 213 are placed facing upward. The two pads 215 are electrically connected by wire bonding using metal wires 217. The wire loop of the wire 217 is arch-bridge shaped.
The adhesive film 221 is removed. The photoresist may be cleaned and removed using a chemical cleaning solution, and the first substrate 200 may be baked for use.
A second substrate 300 is provided. The second substrate 300 includes, but is not limited to, a base plate. Wherein, the second substrate 300 is provided with a conductive adhesive 320; the first substrate 200 is stacked on the second substrate 300 so that the metal line 217 is electrically connected to the conductive paste 320.
Alternatively, the front surface of the second substrate 300 is provided with the fourth pads 311 and the fifth pads 313, and the back surface is provided with the sixth pads 315. The fourth pad 311 is used for attaching the conductive adhesive 320. The fifth pads 313 are used to mount the second chip 330. The sixth pads 315 are used for ball attachment, which includes disposing the grounding solder balls 340 and the functional solder balls 340. In this embodiment, the fourth pad 311 is a grounding pad, and is used as a grounding point of the electromagnetic shielding, and the grounding point can be connected to a grounding circuit inside the second substrate 300, and finally, grounding is achieved through the grounding solder ball 340 on the back side. In the fourth pads 311, according to actual needs, some of the fourth pads 311 are ground pads, and the rest of the fourth pads 311 are functional pads.
Optionally, a second chip 330 is mounted on the second substrate 300. The second chip 330 may be a front-mounted chip or a flip chip. In this embodiment, the second chip 330 is a flip chip, and after the flip chip is mounted on the fifth pad 313, the bottom of the second chip 330 is filled with a protective adhesive 331 for protection and insulation. Alternatively, the protective paste 331 may extend to the sidewall of the second chip 330, which is not particularly limited herein. The protective adhesive 331 is used to protect the bumps 333 and the circuits at the bottom of the second chip 330, so as to ensure that the fifth pads 313 are electrically connected to the second chip 330, thereby preventing delamination or fracture.
And a conductive paste 320 is dotted on the fourth pad 311 and the second chip 330.
The first substrate 200 is stacked on the second substrate 300. Wherein the metal line 217 is electrically connected to the conductive paste 320 on the fourth pad 311. It is understood that during the process of stacking the first substrate 200 on the second substrate 300, the metal line 217 contacts and enters the conductive paste 320, and the conductive paste 320 has conductive and adhesive properties and can fix the metal line 217 and electrically connect with the metal line 217.
A first chip 230 is mounted on the first substrate 200. Optionally, the first chip 230 is a flip chip, and the bottom of the first chip 230 is filled with the protective adhesive 331.
And (5) plastic packaging. The first substrate 200 and the second substrate 300 and the structures thereon are protected by a pressure plastic package or a steel mesh printing plastic package process. It can be understood that, because the sawtooth structure 257 and the metal wire 217 are arranged on the first substrate 200, the sawtooth structure and the metal wire 217 can respectively play a role in buffering, the deformation of the first substrate 200 and the second substrate 300 caused by the overlarge pressure of a plastic package mold during plastic package can be avoided, the deformation of the first substrate 200 caused by the overlarge mounting pressure during mounting the first substrate 200 can also be avoided, the contact area using the sawtooth structure 257 is larger, so that the capillary effect is improved, the flowability of the plastic package body 350 on the second substrate 300 is increased, and the defect that the flowability of the plastic package body 350 is poor due to the undersize gap between the first substrate 200 and the second substrate 300 of the plastic package body 350, so that a cavity is formed is avoided.
And (5) planting balls. Solder balls 340 are provided on the back surface of the second substrate 300.
And (6) cutting and separating. And cutting the packaged body after plastic packaging along the cutting path by adopting a cutting process to separate the packaged body into single products. Since serrated structure 257 is located on a cutting street, second groove wall 253 is cut away. The sawtooth structures 257 can avoid the problem of package warpage stress caused by stress pulling during dicing, and can also avoid the problem of delamination between the plastic package 350 and the second substrate 300 caused by warpage and the like. Meanwhile, the arrangement of the groove 250 and the sawtooth structures 257 can also reduce the cutting thickness and reduce the abrasion of the cutting tool.
In this embodiment, the two pads 215 are connected to the second pad 213 of the first substrate 200 by a metal wire 217, and the arch bridge-shaped metal wire 217 is electrically connected to the conductive paste 320 on the second substrate 300. The mode replaces the mode of welding the solder balls 340 and the solder balls 340 in the prior art, can avoid the problems of layering fracture, bridging or false welding and the like caused by warping and the like in the welding of the solder balls 340, and has more reliable electric connection. In addition, the metal line 217 has a grounding property, and surrounds the second chip 330, so as to achieve an electromagnetic shielding effect of the second chip 330. Alternatively, the metal wire 217 is electrically connected to the fourth pad 311, and the fourth pad 311 is connected to an internal ground line of the second substrate 300, and finally connected to the ground solder ball 340 on the back surface of the second substrate 300. The second pad 213 is electrically connected to the first pad 211 through the solid via, so that heat can be transferred to the first metal pillar 220, thereby improving heat dissipation effect. Meanwhile, the first pad 211 and the second pad 213 are grounded, so that static electricity on the first substrate 200 can be dissipated and finally transferred to the grounding solder ball 340, thereby realizing static electricity discharge. Accordingly, the first metal pillar 220 can dissipate static electricity on the surface of the package stack structure 100 and prevent the static electricity from affecting the surface.
Optionally, in an embodiment, when the first substrate 200 is manufactured, the second through hole 245 may be further opened on the first substrate 200. After the first substrate 200 is stacked on the second substrate 300, the shielding glue 247 is filled above the first substrate 200 in a dispensing manner, the shielding glue 247 is poured into the space between the first substrate 200 and the second substrate 300 from the second through hole 245, and the shielding glue 247 covers the arch bridge-shaped metal wire 217, so that the electrical connection is more stable, and the effect of enhancing the electromagnetic shielding is achieved. The line arc of the arch bridge-shaped metal wire 217 can improve the colloid fluidity of the shielding glue 247, and the filling effect is better. Of course, in this manufacturing process, the wire bonding structure of the metal wire 217 and part of the fourth pad 311 may be omitted, and the shielding glue 247 is used to electrically connect the second pad 213 and the conductive glue 320 on the back surface of the second chip 330, so as to achieve the electromagnetic shielding effect. Optionally, the shielding glue 247 covers the first chip 230 and partially or completely covers the first metal pillar 220, and the fluidity of the shielding glue 247 can be improved by the first metal pillar 220. Thus, the electromagnetic shielding of the first chip 230 and the second chip 330 can be realized, the double-layer electromagnetic shielding is realized, and the anti-electromagnetic interference effect is better. In actual operation, the shielding adhesive 247 may be filled first, and then plastic packaging may be performed.
Referring to fig. 10, in an alternative embodiment, of the fourth pads 311, a fourth pad 311 (which may also be omitted) electrically connected to the first metal pillar 220 is used as a ground pad, and the rest of the fourth pads 311 are used as functional pads. In the second pad 213, a part is used for grounding. Thus, the arch bridge-shaped metal line 217 on the second pad 213, which is grounded, can achieve an electromagnetic shielding effect on a portion of the second chip 330 on the second substrate 300, and it can be understood that the second chip 330 surrounded by the arch bridge-shaped metal line 217 has an electromagnetic shielding effect. Furthermore, the first grounding pad 261 and the second grounding pad 263 are respectively arranged on the peripheries of the first substrate 200 and the second substrate 300, and the first grounding pad 261 and the second grounding pad 263 are connected in a routing manner, and because the routing of the first grounding pad 261 and the second grounding pad 263 is arranged on the outermost layer and surrounds all the second chips 330 on the second substrate 300, all the second chips 330 can be electromagnetically shielded, and the anti-interference effect is good. It should be understood that the first chip 230 still implements electromagnetic shielding by the first metal pillar 220. In actual operation, the first substrate 200 needs to be cut and separated, and then the separated first substrate 200 is attached to the second substrate 300, which is convenient for wire bonding operation of the first ground pad 261 and the second ground pad 263.
Alternatively, the sawtooth structures 257 on the first substrate 200 may be omitted when the first substrate 200 is manufactured. Only the groove 250 needs to be formed on the scribe line of the first substrate 200, and the first groove wall 251 and the third groove wall 255 of the groove 250 have a certain slope, so that the capillary action of the plastic package body 350 can be improved, the bonding force between the plastic package body 350 and the first substrate 200 and the bonding force between the plastic package body 350 and the second substrate 300 can be improved, and the delamination problem can be avoided.
The content of the part not mentioned in this embodiment is similar to the content described in the first embodiment, and is not described again here. It should be noted that, in the present application, a plurality of alternative embodiments are listed, and the embodiments may be combined with each other without conflict, and are not limited specifically herein.
In summary, the beneficial effects of the embodiment of the invention include:
in the package stack structure 100 provided by the embodiment of the invention, the two welding points 215 arranged at intervals are electrically connected by the metal wire 217, and the wire arc of the metal wire 217 is electrically connected with the conductive adhesive 320 on the second substrate 300, so that the electrical connection is stable and reliable, the electrical connection between the first substrate 200 and the second substrate 300 can be realized, and the stacking process is simpler. The arc of the metal wire 217 can play a role in buffering, reduce stress and relieve deformation such as structure warping. And the arc of the metal wire 217 has a certain capillary action, so that the filling efficiency of the filling medium (the plastic package body 350 or the shielding glue 247) between the first substrate 200 and the second substrate 300 is higher, and the filling effect is better. In addition, the first metal pillar 220 facilitates heat dissipation of the package stack structure 100, thereby improving package quality, package efficiency and heat dissipation effect.
The packaging and stacking method provided by the embodiment of the invention has the advantages of simpler process and higher packaging efficiency. The method can play a role in buffering, reduce stress, relieve deformation such as structure warping and the like, and is beneficial to improving the heat dissipation effect.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are also within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (12)

1. A package stack, comprising:
the circuit comprises a first substrate, a second substrate and a third substrate, wherein a first bonding pad and a second bonding pad are arranged on two opposite surfaces of the first substrate, the second bonding pad comprises at least two welding spots arranged at intervals, and the at least two welding spots are electrically connected by adopting a metal wire; the first bonding pad is electrically connected with each welding spot respectively; a first metal column is convexly arranged on the first bonding pad;
the second substrate is provided with conductive adhesive, the first substrate is overlapped on the second substrate, and the metal wire is electrically connected with the conductive adhesive;
the first substrate is provided with a first through hole, a second metal column is arranged in the first through hole, and the first bonding pad is electrically connected with the second bonding pad through the second metal column.
2. The package stack structure of claim 1, further comprising a first chip; and a third bonding pad is arranged on one side of the first substrate, which is far away from the second bonding pad, the third bonding pad is electrically connected with the first chip, and the first chip is positioned between two adjacent first metal columns.
3. The package stack structure according to claim 2, wherein a fourth pad is disposed on a side of the second substrate close to the first substrate, and the conductive adhesive is disposed on the fourth pad.
4. The package stack of claim 3, further comprising a second chip; a fifth bonding pad which is positioned on the same side as the fourth bonding pad is arranged on the second substrate, and the second chip is electrically connected with the fifth bonding pad; the second chip is arranged between two adjacent fourth bonding pads.
5. The package stack structure according to claim 4, wherein the first pad is grounded, the second chip is a flip chip, and a side of the second chip close to the second substrate is provided with a protective adhesive; a conductive adhesive is arranged on one side, away from the second substrate, of the second chip;
and a conductive adhesive is arranged between every two adjacent second chips, and/or a conductive adhesive is arranged between the second chip and the fourth bonding pad.
6. The package stack structure according to claim 5, wherein a second through hole is formed in the first substrate, and a side of the first substrate away from the second substrate is provided with a shielding adhesive, the shielding adhesive covers the first chip and covers a portion of the first metal pillar;
the second through hole is used for allowing the shielding glue to pass through so that the shielding glue is filled between the first substrate and the second substrate, and the shielding glue is respectively connected with the metal wire and the conductive glue on the second chip.
7. The package stack structure of claim 1, wherein a side of the first substrate adjacent to the second substrate is provided with a groove, and a wall of the groove is located on the scribe line of the first substrate.
8. The packaging stack structure of claim 7, wherein the slot walls of the recess comprise a first slot wall, a second slot wall and a third slot wall connected in sequence, and the first slot wall and the third slot wall are symmetrically designed with respect to the second slot wall; and the first groove wall, the second groove wall and the third groove wall are respectively provided with a sawtooth structure, and the second groove wall is positioned on the cutting path.
9. The package stack of claim 1, wherein the first substrate is provided with a first ground pad, the second substrate is provided with a second ground pad, and the first ground pad and the second ground pad are wire bonded; in the plurality of second bonding pads, part of the second bonding pads are grounded, the rest of the second bonding pads are functional bonding pads, and the grounded second bonding pads are electrically connected with the first metal columns.
10. The package stack structure according to any one of claims 1 to 9, further comprising a molding compound covering the first substrate and the second substrate, respectively, the molding compound partially or completely covering the first metal pillar.
11. A package stacking method, comprising:
providing a first substrate; the first substrate is provided with a first bonding pad and a second bonding pad on two opposite surfaces, the second bonding pad comprises at least two welding spots arranged at intervals, and the two welding spots are electrically connected by adopting a metal wire; the first bonding pad is electrically connected with the welding point; a first metal column is convexly arranged on the first bonding pad; a first through hole is formed in the first substrate, a second metal column is arranged in the first through hole, and the first bonding pad and the second bonding pad are electrically connected through the second metal column;
providing a second substrate; the second substrate is provided with conductive adhesive;
and stacking the first substrate on the second substrate so as to electrically connect the metal wire with the conductive adhesive.
12. The package stacking method of claim 11, wherein the step of providing a first substrate further comprises:
mounting a first chip on the first substrate; wherein the first chip is positioned between two adjacent first metal columns;
the step of providing a second substrate further comprises:
mounting a second chip on the second substrate; the second chip is located between two adjacent metal wires, and the conductive adhesive is arranged on the second substrate and/or the second chip.
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EP1610375A3 (en) * 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
US6593527B1 (en) * 2002-04-17 2003-07-15 Delphi Technologies, Inc. Integrated circuit assembly with bar bond attachment
AU2003274530A1 (en) * 2002-11-08 2004-06-07 Koninklijke Philips Electronics N.V. Integrated circuit with at least one bump
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US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
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