CN115122229B - Polishing device and polishing method for chip processing - Google Patents
Polishing device and polishing method for chip processing Download PDFInfo
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- CN115122229B CN115122229B CN202210834593.6A CN202210834593A CN115122229B CN 115122229 B CN115122229 B CN 115122229B CN 202210834593 A CN202210834593 A CN 202210834593A CN 115122229 B CN115122229 B CN 115122229B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing device and a polishing method for chip processing in the field of chip polishing, and the polishing device comprises a polishing disk, wherein a polishing pad is detachably arranged on the polishing disk; a feeding and discharging mechanism, a polishing solution supply mechanism and a finishing mechanism are respectively arranged beside the polishing disc; the polishing disc comprises a main disc fixedly arranged on a main transmission shaft, and the main transmission shaft is rotatably arranged on the rack; an annular belt-shaped sub disc is further arranged outwards along the radial direction of the main disc, a sub transmission shaft is fixedly arranged on the sub disc, the sub disc and the sub transmission shaft are arranged coaxially with the main disc and the main transmission shaft, and the sub disc is arranged on the periphery of the main disc in a sliding mode. The polishing disk is divided into a plurality of small polishing rings along the radial direction, and the linear speeds of the rotating rings are approximately the same when the rotating rings rotate under the drive of the same drive source through the adjustment of the drive mechanism, so that the abrasion of polishing pads with different radiuses during polishing is balanced, the service life of the polishing pad is prolonged, the replacement frequency of the polishing pad is reduced, the cost is saved, and the production efficiency is improved.
Description
Technical Field
The invention belongs to the field of chip polishing, and particularly relates to a polishing device and a polishing method for chip processing.
Background
In the production process of chips, a monocrystalline silicon substrate of the chip needs to be precisely polished, and a chemical mechanical polishing technology is usually adopted at present, and can effectively take global and local flatness of a processed surface into consideration. The method specifically comprises the following steps: during polishing, a chip to be polished is applied to a polishing pad rotating along with a polishing disc under a certain pressure, polishing liquid flows between the chip and the polishing pad and generates chemical reaction on the surface of the chip, and chemical reactants formed on the surface of the chip are removed by the mechanical friction action of abrasive materials in the polishing liquid. In the alternative process of chemical film formation and mechanical film removal, an extremely thin layer of material is removed from the surface of the chip through the combined action of chemistry and machinery, and finally ultra-precise surface machining is realized. In the studies it was found that the rotational speed of the polishing disc has an influence on the surface roughness of the material at constant pressure. Particularly, the minimum thickness of the polishing liquid film is increased because the flow speed of the polishing liquid on the polishing pad is increased due to the increase of the rotation speed of the polishing disc. The increase in the thickness of the polishing liquid film thus reduces the probability of the contact of the chip with the microscopic peaks on the surface of the polishing pad, and thus the increase in the polishing speed is advantageous for improving the surface quality of the workpiece. However, when the rotating speed is too high, the problems of excessive grinding and polishing of the workpiece, surface burn and the like can be caused. The rotational speed of the polishing disc has a value indicated.
However, because the polishing disk is circular, the local linear velocity of the polishing pad at the periphery of the polishing disk is higher than that at the inner side of the polishing disk at a constant rotation speed, which makes the polishing disk unable to reach the optimal velocity everywhere, and makes the polishing precision of the polished surface of the wafer uneven. At present, the drive chip is frequently used for rotating during polishing so as to make the polishing uniform. But this does not solve the problem of abrasion of the polishing pad. Because the area of the polishing pad can not be changed, the abrasion of different areas of the polishing pad is not balanced, the service life of the whole polishing pad is shortened, the polishing pad needs to be replaced in advance, the cost is increased, the labor intensity of workers is improved, and the working efficiency is reduced. There is therefore a need to address the above problems.
The invention provides a polishing device and a polishing method for chip processing.A polishing disk is divided into a plurality of small polishing rings along the radial direction, the linear speeds of the small polishing rings are approximately the same when the small polishing rings rotate under the drive of the same drive source through the adjustment of a drive mechanism, the abrasion of polishing pads with different radiuses during polishing is balanced while the optimal speed is achieved, the service life of the polishing pads is prolonged, the replacement frequency of the polishing pads is reduced, the cost is saved, and the production efficiency is improved.
Disclosure of Invention
The invention aims to provide a polishing device and a polishing method for chip processing, which aim to solve the problems of the prior art in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a polishing device for chip processing comprises a polishing disk rotatably mounted on a rack, wherein a polishing pad is detachably mounted on the polishing disk; a feeding and discharging mechanism used for transferring a chip to be processed to the polishing disc, a polishing solution supply mechanism used for supplying polishing solution to the center of the polishing disc and a trimming mechanism used for trimming a polishing pad are respectively arranged at the side of the polishing disc; the polishing disc comprises a main disc fixedly arranged on a main transmission shaft, and the main transmission shaft is rotatably arranged on the rack; the radial outside still is provided with the zonal minute dish of ring along the master disk, the fixed minute transmission shaft that is provided with on the minute dish, divide dish, minute transmission shaft and master disk, the coaxial setting of final drive shaft, minute dish slidable mounting is in the periphery of master disk.
Preferably, the rack is further provided with a driving mechanism for driving the polishing disk to rotate, the driving mechanism comprises a first driving shaft externally connected with a driving source, the first driving shaft is in transmission connection with the polishing disk through a speed regulating gear set, and the speed regulating gear set is used for regulating the rotating speeds of the main disk and the sub-disk, so that the average linear speeds in the main disk region and the sub-disk region are the same when the polishing disk rotates.
Preferably, the polishing pad on the main disc is separated from the polishing pad on the sub disc.
Preferably, the speed regulating gear set comprises a main transmission gear and a branch transmission gear which are fixedly arranged on the driving shaft, a main driven gear meshed with the main transmission gear is fixedly arranged on the main transmission shaft, and a branch driven gear meshed with the branch transmission gear is fixedly arranged on the branch transmission shaft; the transmission ratio of the main transmission gear, the sub transmission gear, the main driven gear and the sub driven gear is the ratio of the average radius of the main disc to the reciprocal of the average radius of the sub disc.
Preferably, the feeding and discharging mechanism comprises a telescopic shaft which is vertically and slidably mounted on a driving box, and the driving box is fixedly mounted on the rack; the supporting rods are horizontally arranged along the circumferential direction of the telescopic shaft at intervals, at least 2 groups of clamping assemblies are arranged on the supporting rods along the extending direction of the supporting rods, the clamping assemblies are used for clamping and fixing chips, and the driving box drives the telescopic shaft to rotate for feeding and discharging; the telescopic shaft is contracted for applying a pressure to the chip so that the chip can be moved vertically downward to be brought into contact with the polishing pad with a constant pressure.
Preferably, the clamping assembly comprises a rotating column rotatably mounted on the supporting rod, a clamping mold for placing a chip is fixedly arranged at the lower end of the rotating column, the rotating column is hollow, a pneumatic assembly is further arranged on the telescopic shaft, and the pneumatic assembly is connected with the rotating column through an air pipe; the pneumatic assembly enables negative pressure and positive pressure of the clamping die through air suction and air discharge so as to clamp, fix and relax the lower chip.
Preferably, the rotating column is further fixedly provided with a rotating gear, the adjacent rotating gears are meshed with each other, and the supporting rod is further fixedly provided with a gear box for driving the rotating gear to rotate.
Preferably, the trimming mechanism comprises a barrel rotatably mounted on the rack, the barrel is horizontally placed, a spiral groove and a horizontal groove are formed in the barrel body of the barrel, the horizontal groove is arranged along the axis direction of the barrel, two ends of the horizontal groove are respectively connected with two ends of the spiral groove, the longitudinal section of the horizontal groove is an inclined plane, and the groove depth of one end, close to the polishing disc, of the horizontal groove is greater than that of the other end of the horizontal groove; the groove depth of the spiral groove is the same as that of one end of the horizontal groove close to the polishing disc; a sliding column is slidably mounted on the spiral groove, the sliding column is vertically slidably mounted on the sliding block, and a first spring is arranged between the sliding column and the sliding block along the sliding direction of the sliding column; the rack is also fixedly provided with a support column, the support column is provided with a sliding groove along the radial direction of the polishing disk, and the sliding block is horizontally and slidably arranged on the sliding groove; a second spring is arranged between the supporting column and the sliding block along the sliding direction of the sliding block; the sliding block is also fixedly provided with a trimming rod, and the trimming rod is horizontally arranged along the radial direction of the polishing disk; one end of the trimming rod, which is close to the polishing disc, is also provided with a trimming cutter; and the trimming cutter is vertically and slidably mounted on the trimming rod through a threaded rod.
Preferably, the drum is rotatably mounted on the rack through a rotating shaft, and the rotating shaft is in transmission connection with a second driving shaft of the driving box through a transmission assembly; the second driving shaft and the telescopic shaft synchronously rotate; the transmission ratio of the second driving shaft to the telescopic shaft is 1: n; and n is the number of the supporting rods arranged along the circumferential direction of the telescopic shaft.
Preferably, the polishing solution supply mechanism comprises a solution containing box, the polishing disc is positioned in the solution containing box, and the solution containing box is used for recovering the polishing solution spilled from the polishing disc.
The invention also provides a polishing method for chip processing, which is suitable for the polishing device and mainly comprises the following steps:
s1: installing the polishing pad on a polishing disc, and starting a driving source to enable the polishing disc to rotate so as to drive the polishing pad to rotate; starting a polishing solution supply mechanism to supply polishing solution to the center of the polishing disk;
s2: the feeding and discharging mechanism sucks the chips by using negative pressure at a feeding station, the chips are respectively fixed on the clamping dies, and then the telescopic shaft rotates to transfer the clamping dies to the upper part of the polishing disc, so that the chips are arranged along the radial direction of the polishing disc;
s3: the telescopic shaft contracts downwards, so that the chip on the clamping die moves from top to bottom until the chip is contacted with the polishing pad on the polishing disc, and the surface to be polished of the chip is contacted with the rotating polishing pad at constant pressure to start polishing; during polishing, the gear box drives the rotating gear to rotate, and the rotating gear drives the clamping mold to rotate continuously;
s4: after polishing of a group of chips is finished; the telescopic shaft extends to enable the chip to be separated from the polishing pad; then the telescopic shaft rotates to switch the next group of chips; at the moment, the polishing disk is not stopped, and the trimming mechanism drives the trimming cutter to trim the polishing pad;
s5: and after the next group of chips is switched, stopping trimming by the trimming mechanism, shrinking the telescopic shaft, carrying out a new round of polishing, and circulating.
Compared with the prior art, the invention has the beneficial effects that:
1. the polishing disc is divided into a plurality of small polishing rings along the radial direction, the linear speeds of the rotating rings are approximately the same when the rotating rings rotate under the drive of the same drive source through the adjustment of the drive mechanism, the abrasion of polishing pads with different radiuses during polishing is balanced while the optimal speed is achieved, the service life of the polishing pads is prolonged, the replacement frequency of the polishing pads is reduced, the cost is saved, and the production efficiency is improved.
2. According to the invention, the supporting rod is provided with a plurality of chips for simultaneous processing, so that the processing efficiency is improved. The invention ensures that the negative pressure in the clamping mould is vacuum in a suction mode, so that the chip is fixed in the clamping mould and the clamping is stable; according to the invention, when the polishing pad rotates and polishes, the gear box is utilized to drive the rotating gear to rotate, and the rotating gear drives the clamping die to rotate continuously, so that the integral polishing precision of the polished surface of the chip is further ensured to be balanced.
3. The invention utilizes the time of replacing the next batch of chips by each rotation of the telescopic shaft to drive the barrel to rotate for a circle, so that the sliding column slides in the spiral groove, and the sliding block is driven to slide in the sliding groove when the sliding column slides, thereby driving the trimming cutter to trim the whole polishing pad and ensuring the integral polishing precision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a polishing apparatus for chip processing according to the present invention;
FIG. 2 is a schematic diagram of the construction of the polishing disk, polishing pad and drive mechanism of the present invention;
FIG. 3 is a schematic structural view of a loading and unloading mechanism and a trimming mechanism according to the present invention;
FIG. 4 is an enlarged view of a portion A of FIG. 3 according to the present invention;
FIG. 5 is a schematic view of the dressing mechanism of the present invention in half section;
FIG. 6 is a process flow diagram of a polishing method for chip processing according to the present invention.
In the drawings, the reference numbers indicate the following list of parts:
11-polishing disk, 12-polishing pad, 13-polishing liquid supply mechanism, 14-main disk, 15-main transmission shaft, 16-sub disk, 17-sub transmission shaft, 18-first driving shaft, 21-main transmission gear, 22-sub transmission gear, 23-main driven gear, 24-sub driven gear, 31-driving box, 32-telescopic shaft, 33-supporting rod, 41-rotating column, 42-clamping mould, 43-pneumatic component, 44-air pipe, 45-rotating gear, 46-gear box, 51-barrel, 52-spiral groove, 53-horizontal groove, 54-sliding column, 55-first spring, 56-supporting column, 57-sliding groove, 58-second spring, 59-trimming rod, 60-trimming cutter, 61-threaded rod, 62-sliding block, 71-rotating shaft, 72-second driving shaft and 73-liquid containing box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a polishing apparatus for chip processing, including a polishing disk 11 rotatably mounted on a frame, wherein a polishing pad 12 is detachably mounted on the polishing disk 11; a feeding and discharging mechanism for transferring a chip to be processed to the polishing disc 11, a polishing solution supply mechanism 13 for supplying polishing solution to the center of the polishing disc 11, and a trimming mechanism for trimming the polishing pad 12 are respectively arranged at the lateral side of the polishing disc 11; the polishing disc 11 comprises a main disc 14 fixedly arranged on a main transmission shaft 15, and the main transmission shaft 15 is rotatably arranged on the machine frame; an annular belt-shaped sub-disc 16 is further arranged radially outwards of the main disc 14, a sub-transmission shaft 17 is fixedly arranged on the sub-disc 16, the sub-disc 16 and the sub-transmission shaft 17 are coaxially arranged with the main disc 14 and the main transmission shaft 15, and the sub-disc 16 is slidably mounted on the periphery of the main disc 14.
Preferably, the machine frame is further provided with a driving mechanism for driving the polishing disk 11 to rotate, the driving mechanism includes a first driving shaft 18 externally connected with a driving source, the first driving shaft 18 is in transmission connection with the polishing disk 11 through a speed-regulating gear set, and the speed-regulating gear set is used for regulating the rotating speeds of the main disk 14 and the sub-disk 16, so that the average linear speeds in the main disk 14 area and the sub-disk 16 area are the same when the polishing disk 11 rotates.
Preferably, the polishing pads 12 on the main tray 14 are separated from the polishing pads 12 on the sub-tray 16.
Preferably, the speed regulating gear set comprises a main transmission gear 21 and a sub transmission gear 22 which are fixedly arranged on a driving shaft, a main driven gear 23 meshed with the main transmission gear 21 is fixedly arranged on the main transmission shaft 15, and a sub driven gear 24 meshed with the sub transmission gear 22 is fixedly arranged on the sub transmission shaft 17; the transmission ratio of the main transmission gear 21, the branch transmission gear 22, the main driven gear 23 and the branch driven gear 24 is the ratio of the average radius of the main disc 14 to the reciprocal of the average radius of the branch disc 16.
During polishing, a wafer to be polished is applied to a polishing pad 12 rotating with a polishing disk 11 with a certain pressure, a polishing liquid flows between the wafer and the polishing pad 12, and a chemical reaction is generated on the surface of the wafer, and a chemical reactant formed on the surface of the wafer is removed by the mechanical friction action of an abrasive in the polishing liquid. In the alternative process of chemical film formation and mechanical film removal, an extremely thin layer of material is removed from the surface of the chip through the combined action of chemistry and machinery, and finally ultra-precise surface machining is realized. In practical production, it is found that the inner ring and the outer ring of the polishing pad 12 wear unevenly under the condition of constant rotation speed of the polishing pad 12 on the polishing disc 11 due to the design of the shape of the polishing pad. If not replaced in time, the subsequent chip polishing precision is affected. The invention divides the polishing disk 11 into a plurality of small polishing rings along the radial direction, and the linear velocities of the rotating rings are approximately the same when the rotating rings rotate under the drive of the same drive source through the adjustment of the drive mechanism, thereby balancing the abrasion of the polishing pads 12 with different radiuses during polishing and prolonging the service life of the polishing pads 12. The present invention provides an embodiment, during polishing, the loading and unloading mechanism moves the chip to the upper side of the polishing disk 11 and presses down to provide pressure. As shown in fig. 1 and 2, a partial area of the chip is located on the main tray 14, and a partial area is located on the sub-tray 16. An external power supply drives the first driving shaft 18 to rotate, the first driving shaft 18 drives the main driving gear 21 and the sub driven gear 24 to rotate at the same speed, and the main driving gear 21 is meshed with the main driven gear 23 to drive the main disc 14 to rotate; the branch driving gear 22 is meshed with the branch driven gear 24 to drive the branch disc 16 to rotate, and the main disc 14 and the branch disc 16 rotate in the same direction. Since the polishing pads 12 are also separately mounted on the main plate 14 and the sub-plate 16, the rotational speeds of the polishing pads 12 on the main plate 14 and the sub-plate 16 are different. The linear velocities of the main disc 14 and the sub-disc 16 are approximately the same according to the setting of the transmission ratios of the main transmission gear 21 and the sub-transmission gear 22 and the main driven gear 23 and the sub-driven gear 24. Therefore, during polishing, the abrasion speeds of the polishing pads 12 on the main disc 14 and the sub disc 16 and the chips are approximately the same, so that the service lives of the polishing pads 12 on the main disc 14 and the sub disc 16 are ensured to be consistent, and the polishing pads can be replaced simultaneously, thereby reducing the number of times of shutdown replacement. Because the rotating speed of the polishing pad 12 also affects the final polishing precision, the arrangement of the present invention also ensures that the polishing precision of different regions on the same chip is the same, and avoids the repeated polishing due to the polishing precision of partial regions, so that the overall polishing time is reduced. The average radius in the present invention refers to the distance from the axis of the main plate 14 to the position of the average width on the end surface of the main plate 14 and the branch plate 16. As shown in fig. 2, as the disks 16 are arranged to extend in the radial direction of the main disk 14, the outer disks 16 rotate at a slower speed. Theoretically, the smaller the width of the subpad 16, the more even the wear of the polishing pad 12 will be. By setting the illustrated width of the sub-disc 16, it is achieved that the main disc 14 and the polishing pad 12 on the sub-disc 16 wear at approximately the same rate.
Preferably, the loading and unloading mechanism comprises a telescopic shaft 32 which is vertically slidably mounted on a driving box 31, and the driving box 31 is fixedly mounted on the rack; the supporting rods 33 are horizontally arranged along the circumferential direction of the telescopic shaft 32 at intervals, at least 2 groups of clamping assemblies are arranged on the supporting rods 33 along the extending direction of the supporting rods 33, the clamping assemblies are used for clamping and fixing chips, and the driving box 31 drives the telescopic shaft 32 to rotate for feeding and discharging; the telescopic shaft 32 is contracted for applying a pressure to the chip so that the chip can be moved vertically downward to be in contact with the polishing pad 12 with a constant pressure.
Preferably, the clamping assembly comprises a rotating column 41 rotatably mounted on the supporting rod 33, a clamping mold 42 for placing a chip is fixedly arranged at the lower end of the rotating column 41, the rotating column 41 is hollow, a pneumatic assembly 43 is further arranged on the telescopic shaft 32, and the pneumatic assembly 43 is connected with the rotating column 41 through an air pipe 44; the pneumatic assembly 43 is used for clamping, fixing and loosening the lower chip by enabling the clamping mold 42 to be under negative pressure and positive pressure through air suction and air discharge.
Preferably, the rotating column 41 is further fixedly provided with a rotating gear 45, adjacent rotating gears 45 are meshed with each other, and the supporting rod 33 is further fixedly provided with a gear box 46 for driving the rotating gears 45 to rotate.
The present invention provides an embodiment, as shown in fig. 3 and 4, when the processed chips are small, a plurality of chips can be disposed on the supporting rod 33 for processing at the same time, thereby improving the processing efficiency. The present invention fixes the chip in the clamping mold 42 by applying a negative pressure vacuum in the clamping mold 42 by suction. When unloading is required, the clamping die 42 is pressurized at normal pressure or even high pressure by the pneumatic assembly 43, and the chip is separated from the clamping die 42. When a plurality of chips need to be processed simultaneously, as shown in fig. 1, each chip is located in one sub-disc 16, so that when the polishing pad 12 rotates and polishes in a single sub-disc 16, the gear box 46 is used for driving the rotating gear 45 to rotate, and the rotating gear 45 drives the clamping die 42 to rotate continuously, thereby further ensuring the balance of the overall polishing precision of the chip polishing surface.
Preferably, the trimming mechanism comprises a barrel 51 rotatably mounted on the rack, the barrel 51 is horizontally placed, a spiral groove 52 and a horizontal groove 53 are formed in the barrel body of the barrel 51, the horizontal groove 53 is arranged along the axial direction of the barrel 51, two ends of the horizontal groove 53 are respectively connected with two ends of the spiral groove 52, the longitudinal section of the horizontal groove 53 is an inclined plane, and the groove depth of one end of the horizontal groove 53, which is close to the polishing disc 11, is greater than that of the other end; the groove depth of the spiral groove 52 is the same as that of one end of the horizontal groove 53 close to the polishing disc 11; a sliding column 54 is slidably mounted on the spiral groove 52, the sliding column 54 is vertically slidably mounted on a sliding block 62, and a first spring 55 is arranged between the sliding column 54 and the sliding block 62 along the sliding direction of the sliding column 54; a support column 56 is also fixedly mounted on the machine frame, a sliding groove 57 is formed in the support column 56 along the radial direction of the polishing disk 11, and the sliding block 62 is horizontally and slidably mounted on the sliding groove 57; a second spring 58 is provided between the support column 56 and the slider 62 in the sliding direction of the slider 62; a trimming rod 59 is fixedly arranged on the sliding block, and the trimming rod 59 is horizontally arranged along the radial direction of the polishing disk 11; one end of the trimming rod 59 close to the polishing disc 11 is also provided with a trimming cutter 60; the trimming cutter 60 is vertically slidably mounted on the trimming rod 59 by a threaded rod 61.
Preferably, the drum 51 is rotatably mounted on the frame through a rotating shaft 71, and the rotating shaft 71 is in transmission connection with a second driving shaft 72 of the driving box 31 through a transmission assembly; the second driving shaft 72 rotates synchronously with the telescopic shaft 32; the transmission ratio of the second driving shaft 72 to the telescopic shaft 32 is 1: n; the n is the number of the support rods 33 arranged along the circumferential direction of the telescopic shaft 32.
The present invention utilizes the timing of replacing the next batch of chips by rotating the telescopic shaft 32 each time to drive the dressing tool 60 to dress the whole polishing pad 12, so as to ensure the polishing precision of the whole, as shown in fig. 5, when the telescopic shaft 32 rotates to replace the batch of chips, the transmission assembly drives the drum 51 to rotate. The transmission assembly of the present invention is shown in fig. 3 as a set of synchronizing wheels and a set of bevel gears. The telescopic shaft 32 is rotated for changing the angle of one batch, and the drum 51 rotates exactly one circle. As shown in fig. 5, the drum 51 rotates to slide the sliding column 54 in the spiral groove 52, the sliding column 54 drives the sliding block 62 to slide in the sliding groove 57 when sliding, and moves inward along the radial direction of the polishing disk 11, the sliding block 62 moves to drive the trimming rod 59 to move, the trimming rod 59 is provided with the trimming cutter 60, and the polishing pad 12 is trimmed when moving. When the telescopic shaft 32 is rotated and replaced, the barrel 51 rotates for just one circle, the sliding column 54 enters the horizontal groove 53 from the spiral groove 52, and the sliding column 54 is reset at the driving slide block 62 under the restoring force of the second spring 58. The threaded rod 61 of the present invention is provided to adjust the dressing depth of the dressing tool 60.
Preferably, the polishing liquid supply mechanism 13 includes a liquid containing box 73, the polishing disc 11 is located in the liquid containing box 73, and the liquid containing box 73 is used for recovering the polishing liquid spilled from the polishing disc 11. The purpose of this setting is to utilize polishing solution feed mechanism 13 to retrieve the polishing solution in processing containing box 73, makes it can recycle, green.
The invention also provides a polishing method for chip processing, which is suitable for the polishing device and mainly comprises the following steps:
s1: installing a polishing pad 12 on a polishing disk 11, and starting a driving source to enable the polishing disk 11 to rotate so as to drive the polishing pad 12 to rotate; starting the polishing liquid supply mechanism 13 to start supplying polishing liquid to the center of the polishing disk 11;
s2: the loading and unloading mechanism sucks the chips by using negative pressure at a loading station, the chips are respectively fixed on the clamping dies 42, and then the telescopic shaft 32 rotates to transfer the clamping dies 42 to the upper part of the polishing disc 11, so that the chips are arranged along the radial direction of the polishing disc 11;
s3: the telescopic shaft 32 contracts downwards, so that the chip on the clamping die 42 moves from top to bottom until the chip is contacted with the polishing pad 12 on the polishing disk 11, and the surface to be polished of the chip is contacted with the rotating polishing pad 12 at a constant pressure to start polishing; during polishing, the gear box 46 drives the rotating gear 45 to rotate, and the rotating gear 45 drives the clamping die 42 to rotate continuously;
s4: after polishing of a group of chips is finished; the telescoping shaft 32 is extended to bring the chip out of contact with the polishing pad 12; then the telescopic shaft 32 rotates to switch the next group of chips; at this time, the polishing disk 11 is not stopped, and the dressing mechanism drives the dressing cutter 60 to dress the polishing pad 12;
s5: and after the next group of chips is switched, the trimming mechanism stops trimming, the telescopic shaft 32 contracts, a new round of polishing is carried out, and the cycle is repeated.
Claims (4)
1. The utility model provides a burnishing device is used in chip processing which characterized in that: the polishing device comprises a polishing disk (11) rotatably arranged on a rack, wherein a polishing pad (12) is detachably arranged on the polishing disk (11); a feeding and discharging mechanism used for transferring a chip to be processed to the polishing disc (11), a polishing solution supply mechanism (13) used for supplying polishing solution to the center of the polishing disc (11) and a trimming mechanism used for trimming a polishing pad (12) are respectively arranged at the lateral side of the polishing disc (11); the polishing disc (11) comprises a main disc (14) fixedly arranged on a main transmission shaft (15), and the main transmission shaft (15) is rotatably arranged on the rack; an annular belt-shaped sub-disc (16) is further arranged outwards along the radial direction of the main disc (14), a sub-transmission shaft (17) is fixedly arranged on the sub-disc (16), the sub-disc (16) and the sub-transmission shaft (17) are coaxially arranged with the main disc (14) and the main transmission shaft (15), and the sub-disc (16) is slidably arranged on the periphery of the main disc (14);
the rack is also provided with a driving mechanism for driving the polishing disc (11) to rotate, the driving mechanism comprises a first driving shaft (18) externally connected with a driving source, the first driving shaft (18) is in transmission connection with the polishing disc (11) through a speed regulating gear set, and the speed regulating gear set is used for regulating the rotating speeds of the main disc (14) and the sub disc (16), so that the average linear speeds in the main disc (14) area and the sub disc (16) area are the same when the polishing disc (11) rotates;
the polishing pad (12) on the main disc (14) and the polishing pad (12) on the sub disc (16) are separated;
the speed regulating gear set comprises a main transmission gear (21) and a branch transmission gear (22) which are fixedly arranged on a driving shaft, a main driven gear (23) meshed with the main transmission gear (21) is fixedly arranged on the main transmission shaft (15), and a branch driven gear (24) meshed with the branch transmission gear (22) is fixedly arranged on the branch transmission shaft (17); the transmission ratio of the main transmission gear (21), the sub transmission gear (22), the main driven gear (23) and the sub driven gear (24) is the ratio of the average radius of the main disc (14) to the reciprocal of the average radius of the sub disc (16);
the feeding and discharging mechanism comprises a telescopic shaft (32) which is vertically and slidably arranged on a driving box (31), and the driving box (31) is fixedly arranged on the rack; the device comprises a telescopic shaft (32), supporting rods (33) which are horizontally arranged are arranged along the circumferential direction of the telescopic shaft (32) at intervals, at least 2 groups of clamping assemblies are arranged on the supporting rods (33) along the extension direction of the supporting rods (33), the clamping assemblies are used for clamping and fixing chips, and a driving box (31) drives the telescopic shaft (32) to rotate for feeding and discharging; the telescopic shaft (32) is contracted for applying a pressure to the chip so that the chip can be moved vertically downward to be in contact with the polishing pad (12) with a constant pressure;
the clamping assembly comprises a rotating column (41) rotatably mounted on a supporting rod (33), a clamping mold (42) used for placing a chip is fixedly arranged at the lower end of the rotating column (41), the rotating column (41) is hollow, a pneumatic assembly (43) is further arranged on the telescopic shaft (32), and the pneumatic assembly (43) is connected with the rotating column (41) through an air pipe (44); the pneumatic assembly (43) enables the clamping mould (42) to have negative pressure and positive pressure through air suction and air discharge so as to clamp, fix and relax the lower chip;
rotating gears (45) are further fixedly mounted on the rotating columns (41), adjacent rotating gears (45) are meshed with each other, and a gear box (46) used for driving the rotating gears (45) to rotate is further fixedly arranged on the supporting rod (33);
the trimming mechanism comprises a barrel (51) which is rotatably installed on a rack, the barrel (51) is horizontally placed, a spiral groove (52) and a horizontal groove (53) are formed in the barrel body of the barrel (51), the horizontal groove (53) is arranged along the axis direction of the barrel (51), two ends of the horizontal groove (53) are respectively connected with two ends of the spiral groove (52), the longitudinal section of the horizontal groove (53) is an inclined plane, and the groove depth of one end, close to the polishing disc (11), of the horizontal groove (53) is greater than that of the other end of the horizontal groove; the groove depth of the spiral groove (52) is the same as that of one end of the horizontal groove (53) close to the polishing disc (11); a sliding column (54) is slidably mounted on the spiral groove (52), the sliding column (54) is vertically slidably mounted on the sliding block (62), and a first spring (55) is arranged between the sliding column (54) and the sliding block (62) along the sliding direction of the sliding column (54); the machine frame is also fixedly provided with a supporting column (56), the supporting column (56) is provided with a sliding groove (57) along the radial direction of the polishing disk (11), and the sliding block (62) is horizontally and slidably arranged on the sliding groove (57); a second spring (58) is arranged between the supporting column (56) and the sliding block (62) along the sliding direction of the sliding block (62); the sliding block (62) is also fixedly provided with a trimming rod (59), and the trimming rod (59) is horizontally arranged along the radial direction of the polishing disk (11); one end of the trimming rod (59) close to the polishing disc (11) is also provided with a trimming cutter (60); the trimming cutter (60) is vertically and slidably mounted on the trimming rod (59) through a threaded rod (61).
2. The polishing apparatus for chip processing according to claim 1, wherein: the drum (51) is rotatably mounted on the rack through a rotating shaft (71), and the rotating shaft (71) is in transmission connection with a second driving shaft (72) of the driving box (31) through a transmission assembly; the second driving shaft (72) and the telescopic shaft (32) synchronously rotate; the transmission ratio of the second driving shaft (72) to the telescopic shaft (32) is 1: n; and n is the number of the supporting rods (33) arranged along the circumferential direction of the telescopic shaft (32).
3. The polishing apparatus for chip processing according to claim 1, wherein: the polishing solution supply mechanism (13) comprises a liquid containing box (73), the polishing disc (11) is positioned in the liquid containing box (73), and the liquid containing box (73) is used for recovering the polishing solution spilled from the polishing disc (11).
4. A polishing method for chip processing, which is applied to the polishing apparatus according to any one of claims 1 to 3, characterized in that: the method mainly comprises the following steps:
s1: installing a polishing pad (12) on a polishing disk (11), and starting a driving source to enable the polishing disk (11) to rotate so as to drive the polishing pad (12) to rotate; starting a polishing solution supply mechanism (13) to start supplying polishing solution to the center of the polishing disk (11);
s2: the loading and unloading mechanism sucks the chips by using negative pressure at a loading station, the chips are respectively fixed on a plurality of clamping dies (42), and then the telescopic shaft (32) rotates to transfer the clamping dies (42) to the upper part of the polishing disc (11), so that the chips are arranged along the radial direction of the polishing disc (11);
s3: the telescopic shaft (32) contracts downwards, so that the chip on the clamping die (42) moves from top to bottom until the chip is contacted with the polishing pad (12) on the polishing disk (11), the surface to be polished of the chip is contacted with the rotating polishing pad (12) at constant pressure, and polishing is started;
during polishing, the gear box (46) drives the rotating gear (45) to rotate, and the rotating gear (45) drives the clamping die (42) to rotate continuously;
s4: after polishing of a group of chips is finished; the telescoping shaft (32) is extended to bring the chip out of contact with the polishing pad (12); then the telescopic shaft (32) rotates to switch the next group of chips; at the moment, the polishing disk (11) does not stop, and the dressing mechanism drives the dressing cutter (60) to dress the polishing pad (12);
s5: and after the next group of chips is switched, the trimming mechanism stops trimming, the telescopic shaft (32) contracts, a new round of polishing is carried out, and the cycle is repeated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834593.6A CN115122229B (en) | 2022-07-14 | 2022-07-14 | Polishing device and polishing method for chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834593.6A CN115122229B (en) | 2022-07-14 | 2022-07-14 | Polishing device and polishing method for chip processing |
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| CN115122229A CN115122229A (en) | 2022-09-30 |
| CN115122229B true CN115122229B (en) | 2023-03-14 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115592550B (en) * | 2022-12-14 | 2023-04-28 | 杭州中欣晶圆半导体股份有限公司 | Pumping device for wafer polishing and pumping method thereof |
| CN117862986B (en) * | 2024-03-06 | 2024-05-10 | 长沙韶光芯材科技有限公司 | Glass substrate grinding device and grinding method |
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|---|---|---|---|---|
| US6116991A (en) * | 1998-08-28 | 2000-09-12 | Worldwide Semiconductor Manufacturing Corp. | Installation for improving chemical-mechanical polishing operation |
| CN101168242A (en) * | 2007-11-20 | 2008-04-30 | 浙江工业大学 | Trimming device for polishing cushion |
| CN114393513A (en) * | 2022-01-24 | 2022-04-26 | 天津大学 | Central liquid supply semiconductor material surface processing device and use method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6905398B2 (en) * | 2001-09-10 | 2005-06-14 | Oriol, Inc. | Chemical mechanical polishing tool, apparatus and method |
| TWI647060B (en) * | 2018-04-30 | 2019-01-11 | 郭錫池 | Rotary multi-axis grinding equipment |
| US20200094375A1 (en) * | 2018-09-26 | 2020-03-26 | Cana Diamond Technology, LLC | Multiple zone pad conditioning disk |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6116991A (en) * | 1998-08-28 | 2000-09-12 | Worldwide Semiconductor Manufacturing Corp. | Installation for improving chemical-mechanical polishing operation |
| CN101168242A (en) * | 2007-11-20 | 2008-04-30 | 浙江工业大学 | Trimming device for polishing cushion |
| CN114393513A (en) * | 2022-01-24 | 2022-04-26 | 天津大学 | Central liquid supply semiconductor material surface processing device and use method thereof |
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