CN115121305A - Novel digital microfluidic chip and preparation method thereof - Google Patents
Novel digital microfluidic chip and preparation method thereof Download PDFInfo
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- CN115121305A CN115121305A CN202210823817.3A CN202210823817A CN115121305A CN 115121305 A CN115121305 A CN 115121305A CN 202210823817 A CN202210823817 A CN 202210823817A CN 115121305 A CN115121305 A CN 115121305A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 33
- 238000005516 engineering process Methods 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 97
- 238000000034 method Methods 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 39
- 238000011049 filling Methods 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000002390 adhesive tape Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 9
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000004720 dielectrophoresis Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000007888 film coating Substances 0.000 description 5
- 238000009501 film coating Methods 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
Abstract
The invention relates to a novel digital microfluidic chip and a preparation method thereof, belonging to the crossing field of digital microfluidic and MEMS technologies. The invention aims to simplify the manufacturing difficulty of the DMF chip and reduce the manufacturing cost of the chip, uses the solder mask layer in the PCB processing technology as the dielectric layer of the digital microfluidic chip, and only needs to prepare the hydrophobic layer subsequently, thereby saving the technology of laminating the PCB substrate and achieving the purpose of avoiding the laminating problem of the PCB chip. And the via holes on the PCB are filled, so that dielectrophoresis force or dielectric wetting force for driving the liquid drops to move can be formed, and the resistance of the liquid drops to move on the chip can be eliminated.
Description
Technical Field
The invention relates to the crossing field of digital micro-fluidic and MEMS technologies, in particular to a novel digital micro-fluidic chip and a preparation method thereof.
Background
Digital microfluidic technology (DMF), also known as micro-droplet technology, can control multiple micro-droplets in parallel on one chip, thereby achieving the work that can only be completed in a professional laboratory at ordinary times. Compared with the traditional method for operating in a professional laboratory, the digital microfluidic technology has the advantages of portability, easiness in operation, low use threshold and the like which cannot be replaced on the premise of ensuring the accuracy and reliability of the experiment. The method can greatly improve the detection efficiency and reduce the cost in all aspects. Therefore, the digital microfluidic technology has attracted much attention since its advent.
The microfluidic chip is a core element for realizing the DMF, and the types of the microfluidic chip are various. For example, a metal electrode is prepared on a glass substrate by using a photolithography process, a dielectric layer is covered on the metal electrode by using evaporation and spin-coating heating methods, and finally a hydrophobic layer is covered by using a spin-coating heating process. In addition, a film coating process can be used on the basis of the glass substrate and the metal electrode to obtain the recyclable digital microfluidic chip, and only the dielectric layer film and the hydrophobic layer need to be replaced each time. Besides the glass substrate, a chip substrate can be obtained by utilizing a Printed Circuit Board (PCB) process, and then the substrate is coated with a film to obtain the required digital microfluidic chip.
Compared with the former two methods, the PCB has simple process, can be produced in large scale and greatly reduces the production cost.
However, the existing digital microfluidic chip based on the PCB process needs to be coated with a film, which has to be faced with the problem caused by the coating. Firstly, the PCB film coating process is very complicated, and the requirements for the film coating environment and the cleanliness of the used film are high, and the film is usually cleaned by using substances such as isopropyl alcohol in a clean room and then coated. Secondly, since the dielectric layer is too thin (generally required to be less than 10 microns), the problem caused by static electricity is difficult to avoid in the film coating process, and the films are easy to be adsorbed together to form wrinkles, thereby influencing the movement of liquid drops. After the film covering is finished, redundant film materials can be combined with static electricity, and the cleanliness of the chip preparation environment is affected. In addition, according to the conventional coating method, the thin film is tightly adhered to the surface of the chip regardless of vacuum pumping or oil coating, and in the case of a PCB chip, the movement of liquid drops on the chip is seriously hindered by gaps between electrodes and via holes at the centers of the electrodes.
In summary, the search for a PCB digital microfluidic chip that does not require a film coating process has become an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a novel digital microfluidic chip and a preparation method thereof.
In order to achieve the purpose, the invention provides the following scheme:
a preparation method of a novel digital microfluidic chip comprises the following steps:
filling via holes in the PCB substrate with a filling material;
pressing the PCB substrate filled with the filling material in the via hole, so that the surface of the filled via hole is flush with the surface of the PCB substrate;
coating copper on the laminated PCB substrate, etching electrodes and circuits, and then sequentially preparing a solder mask layer and a second hydrophobic layer to obtain a lower polar plate;
sequentially preparing a conductive layer and a first hydrophobic layer on a glass substrate to obtain an upper polar plate;
and bonding the lower polar plate and the upper polar plate by using a conductive adhesive tape to obtain the digital microfluidic chip.
Preferably, the via holes in the PCB substrate are filled with a resin or aluminum sheet as a filler material.
Preferably, a first via hole and a second via hole are prepared by adopting a multilayer PCB technology;
filling the first via hole with a solder resist layer preparation material as a filling material;
the first via hole and the second via hole are connected through a hidden layer wire.
Preferably, a first via hole and a second via hole are prepared by adopting a multilayer PCB technology;
filling the first via hole with resin or an aluminum sheet as a filling material;
the first via hole and the second via hole are connected through a hidden layer wire.
Preferably, the conductive layer is made of indium tin oxide.
A novel digital microfluidic chip is prepared by adopting the preparation method of the novel digital microfluidic chip; the novel digital microfluidic chip comprises: an upper plate and a lower plate; the upper polar plate and the lower polar plate are connected by adopting a conductive adhesive tape;
the lower plate includes: the PCB comprises a PCB substrate, a driving electrode, a solder mask layer, a second hydrophobic layer and a grounding electrode; a via hole structure is arranged on the PCB substrate; filling a first via hole in the via hole structure with a filling material; the driving electrode is arranged on the first via hole; the solder mask layer covers the driving electrode; the grounding electrode is arranged on two sides of the solder mask layer; the second hydrophobic layer covers the solder mask layer;
the upper plate includes: a glass substrate, a conductive layer and a first hydrophobic layer; the conducting layer is attached to the glass substrate; the first hydrophobic layer covers the conductive layer; and bonding the first hydrophobic layer and the second hydrophobic layer by using a conductive adhesive tape.
Preferably, when the PCB substrate is a multilayer structure, the via structure further includes: a second via hole; the first via hole and the second via hole are connected by a hidden layer wire.
Preferably, the first via hole is filled with a filling material.
Preferably, when the PCB has a single-layer structure, the filling material of the first via hole is a resin or an aluminum sheet.
Preferably, when the PCB has a multi-layer structure, the filling material of the first via hole is a solder resist material, a resin, or an aluminum sheet.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
according to the novel digital microfluidic chip and the preparation method thereof, provided by the invention, the purpose of simplifying the manufacturing difficulty of the DMF chip and reducing the manufacturing cost of the chip is achieved, the solder mask layer in the PCB processing technology is used as the dielectric layer of the digital microfluidic chip, only the hydrophobic layer needs to be prepared subsequently, and the technology of coating a PCB substrate with a film is omitted, so that the purpose of avoiding the problem of coating the film on the PCB chip is achieved. And the via holes on the PCB are filled, so that dielectrophoresis force or dielectric wetting force for driving the liquid drops to move can be formed, and the resistance of the liquid drops to move on the chip can be eliminated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a novel digital microfluidic chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a novel digital microfluidic chip according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a novel digital microfluidic chip according to a third embodiment of the present invention;
description of the symbols:
the manufacturing method comprises the following steps of 1-a glass substrate, 2-an indium tin oxide layer, 3-a first hydrophobic layer, 4-a conductive adhesive tape, 5-a second hydrophobic layer, 6-a solder mask layer, 7-a grounding electrode, 8-a first via hole, 9-a driving electrode, 10-a PCB substrate, 11-a second via hole and 12-a hidden layer lead.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a novel digital microfluidic chip and a preparation method thereof, aiming at simplifying the manufacturing difficulty of a DMF chip and reducing the manufacturing cost of the chip. Because the solder mask material in the PCB processing technology is a dielectric material, the invention provides that the solder mask in the PCB processing technology is used as the dielectric layer of the digital microfluidic chip, only the hydrophobic layer needs to be prepared subsequently, the technology of coating the PCB substrate is omitted, and the purpose of avoiding the problem of coating the PCB chip is achieved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Because the PCB substrate has a via hole, if the solder mask is directly covered with oil without processing, the electrodes or the leads thereof cannot be completely covered when the solder mask is coated. If the digital microfluidic chip manufactured by the method is used, when the micro-droplets move to the driving electrode, conduction is formed at the part which is not covered by the solder mask layer, dielectrophoresis force or dielectric wetting force for further driving the droplets to move cannot be formed, and the chip fails. Therefore, the via hole in the center of the electrode needs to be completely filled.
Based on the above, the invention provides different methods for preparing the novel digital microfluidic chip, which specifically comprise the following steps:
example one
And filling the via holes with filling materials (such as resin and aluminum sheets) until the filling materials are flush with the upper surface of the PCB substrate 10, and after the via holes are filled, performing oil covering on the solder mask layer 6 on the PCB substrate.
The specific process comprises the following steps: after the copper deposition and copper electroplating process is carried out on the via hole, the via hole of the PCB is plugged by using a filling material, then the via hole is pressed, so that the surface of the PCB chip is smooth, and then the surface of the PCB chip is coated with copper. And obtaining the electrode and the circuit by etching. And finally, covering a solder mask layer 6 material on the surface for photocuring to obtain the PCB chip bottom plate substrate plugged with the resin. And subsequently, a spin coating heating method is used for obtaining the second hydrophobic layer 5, and a PCB chip bottom plate is obtained. The on-chip plate process is the same as the glass-based plate process, a first hydrophobic layer 3 is attached to the surface of conductive glass (composed of a glass substrate 1 and an indium tin oxide layer 2) by a spin-coating heating method, and finally, the upper and lower plates of the chip are connected by a conductive adhesive tape 4, so that the novel digital microfluidic chip based on the PCB substrate 10 is obtained, and the structure of the novel digital microfluidic chip is shown in FIG. 1.
The first hydrophobic layer 3 and the second hydrophobic layer 5 each have a conductive function. The conductive adhesive tape 4 is used for connecting the upper and lower polar plates; the solder mask layer 6 is formed by photo-curing and serves as a dielectric layer of the digital microfluidic chip; the grounding electrode 7 is exposed outside the solder resist layer 6, is obtained by etching, and is covered by a mask when the solder resist layer 6 is photocured so as to prevent the grounding electrode from being covered by the solder resist layer 6; the first via hole 8 can be communicated with circuits at two ends, and the interior of the first via hole is filled with filling materials so as to prevent the solder mask layer 6 from leaking downwards through the via hole; the driving electrodes 9 are obtained by etching, each electrode is connected with a lead on the bottom layer of the PCB substrate 10 through the first through hole 8, and theoretically, the center of the first through hole 8 and the center of the driving electrode 9 are positioned on the same vertical line; the grounding electrode 7, the solder resist layer 6, the driving electrode 9 and the PCB substrate 10 form a chip lower electrode plate without a hydrophobic layer obtained by using a PCB processing technology, and the chip lower electrode plate can be matched with an upper electrode plate to form the novel digital microfluidic chip shown in figure 1 by adding the second hydrophobic layer 5.
In this embodiment, the processing flow of the PCB substrate 10 is: cutting → drilling → copper deposition → electroplated copper → filling material hole → grinding → outer layer pattern → pattern electroplating → etching → solder mask → surface treatment → molding → electrical measurement. In order to improve the performance of the chip, a gold immersion process and a gold electroplating process can be selected to replace the copper immersion process and the copper electroplating process.
Example two
In this example, the fabrication was performed using multilayer PCB technology.
Firstly, the solder mask layer 6 is used as a filling material to fill the first via hole 8 to be flush with the upper surface of the PCB substrate 10, secondly, after the driving electrode 9 is manufactured, the solder mask layer 6 is covered with oil on the PCB substrate, namely, the solder mask layer 6 material is filled in the via hole (the first via hole 8) of the upper PCB substrate 10.
Before the solder mask 6 covering is carried out, the solder mask 6 material is filled in the via hole (the first via hole 8) communicated with the upper surface of the chip by using a photo-curing method. And (3) coating the solder mask layer 6 material on the surface for photocuring to obtain the PCB chip bottom plate substrate using the resin plug hole (the second via hole 11). And subsequently, a spin coating heating method is used for obtaining the second hydrophobic layer 5, and a lower polar plate of the PCB chip is obtained. The process of the plate on the chip is the same as the preparation process of the glass-based plate on the prior art, the second hydrophobic layer 5 is attached to the surface of the conductive glass by a spin-coating heating method, and finally the upper plate and the lower plate of the chip are connected by the conductive adhesive tape 4, so that the novel digital microfluidic chip structure shown in figure 2 is obtained.
In this embodiment, the first via 8 and the second via 11 are located at different layers on the same PCB substrate 10 for connecting the circuits at both ends; the hidden layer wire 12 is used for connecting the first via hole 8 and the second via hole 11. Filling the first via hole 8 with a solder mask 6 material; the driving electrode 9 is connected with a lead of the bottom layer of the PCB through the first via hole 8, and theoretically, the center of the first via hole 8 and the center of the driving electrode 9 are located on the same vertical line.
In this embodiment, the processing flow of the PCB bottom plate is: cutting → inner layer pattern of buried via → Automatic Optical Inspection (AOI) → press fitting → copper deposition → copper electroplating → inner layer pattern → AOI → press fitting → drill via → copper electroplating → outer layer pattern → pattern electroplating → etching → filling of solder resist → surface treatment → molding → electrical measurement. In order to improve the performance of the chip, a gold immersion process and a gold electroplating process can be selected to replace the copper immersion process and the copper electroplating process.
EXAMPLE III
And (3) plugging the via hole communicated with the upper surface of the PCB substrate 10 by using filling materials such as resin, aluminum sheets and the like, then laminating, and coating copper on the surface to obtain a flat surface. And then copper is coated on the surface. And obtaining the electrode and the circuit by etching. And finally, covering a solder mask layer 6 material on the surface for photocuring to obtain the PCB chip bottom plate substrate plugged with the resin. And subsequently, obtaining a hydrophobic layer by using a spin coating heating method to obtain a bottom plate. The upper plate process is the same as the existing glass-based upper plate process, a first hydrophobic layer 3 is attached to the surface of the conductive glass by a spin-coating heating method, and finally the upper and lower plates of the chip are connected by a conductive adhesive tape 4, so that the novel digital microfluidic chip shown in fig. 3 is obtained.
The structure of the novel digital microfluidic chip in this embodiment is the same as that of the novel digital microfluidic chip provided in the second embodiment, and the difference between the structure and the structure is only that the material filling the first via hole 8 is different.
In this embodiment, the processing flow of the PCB bottom plate is: opening → inner layer pattern of buried via → AOI → pressing → copper deposition → electroplated copper → inner layer pattern → AOI → pressing → through hole drilling → copper deposition → electroplated copper → filling material plug hole → grinding → outer layer pattern → pattern electroplating → etching → solder resist → surface treatment → molding → electrical connection. In order to improve the performance of the chip, a gold immersion process and a gold electroplating process can be selected to replace the copper immersion process and the copper electroplating process.
The same structural parts of the novel digital microfluidic chip provided in the three embodiments are referred to each other, and the details are not repeated herein.
In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (10)
1. A preparation method of a novel digital microfluidic chip is characterized by comprising the following steps:
filling via holes in the PCB substrate with a filling material;
pressing the PCB substrate filled with the filling material in the via hole, so that the surface of the filled via hole is flush with the surface of the PCB substrate;
coating copper on the laminated PCB substrate, etching electrodes and circuits, and then sequentially preparing a solder mask layer and a second hydrophobic layer to obtain a lower polar plate;
sequentially preparing a conductive layer and a first hydrophobic layer on a glass substrate to obtain an upper polar plate;
and bonding the lower polar plate and the upper polar plate by using a conductive adhesive tape to obtain the digital microfluidic chip.
2. The method for preparing the novel digital microfluidic chip according to claim 1, wherein the via hole in the PCB substrate is filled with a resin or an aluminum sheet as a filling material.
3. The method for preparing the novel digital microfluidic chip according to claim 1, wherein a first via hole and a second via hole are prepared by multilayer PCB technology;
filling the first via hole with a solder resist layer preparation material as a filling material;
the first via hole and the second via hole are connected through a hidden layer wire.
4. The method for preparing the novel digital microfluidic chip according to claim 1, wherein a first via hole and a second via hole are prepared by multilayer PCB technology;
filling the first via hole with resin or an aluminum sheet as a filling material;
the first via hole and the second via hole are connected through a hidden layer wire.
5. The method for preparing the novel digital microfluidic chip according to claim 1, wherein the conductive layer is prepared from indium tin oxide.
6. A novel digital microfluidic chip, which is prepared by the preparation method of the novel digital microfluidic chip according to any one of claims 1 to 4; the novel digital microfluidic chip comprises: an upper plate and a lower plate; the upper polar plate and the lower polar plate are connected by a conductive adhesive tape;
the lower plate includes: the PCB comprises a PCB substrate, a driving electrode, a solder mask layer, a second hydrophobic layer and a grounding electrode; a through hole structure is arranged on the PCB substrate; filling a first via hole in the via hole structure with a filling material; the driving electrode is arranged on the first via hole; the solder mask layer covers the driving electrode; the grounding electrode is arranged on two sides of the solder mask layer; the second hydrophobic layer covers the solder mask layer;
the upper plate includes: a glass substrate, a conductive layer and a first hydrophobic layer; the conducting layer is attached to the glass substrate; the first hydrophobic layer covers the conductive layer; and bonding the first hydrophobic layer and the second hydrophobic layer by using a conductive adhesive tape.
7. The novel digital microfluidic chip according to claim 6, wherein when the PCB substrate is a multilayer structure, the via structure further comprises: a second via hole; the first via hole and the second via hole are connected by a hidden layer wire.
8. The novel digital microfluidic chip according to claim 7, wherein said first via hole is filled with a filling material.
9. The novel digital microfluidic chip according to claim 8, wherein when the PCB is a single-layer structure, the filling material of the first via hole is a resin or an aluminum sheet.
10. The novel digital microfluidic chip according to claim 8, wherein when the PCB board is a multilayer structure, the filling material of the first via hole is a solder resist material, a resin or an aluminum sheet.
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| CN212441253U (en) * | 2020-04-02 | 2021-02-02 | 军事科学院系统工程研究院卫勤保障技术研究所 | Bonding-free electrified micro-nanofluidic chip |
| CN114686374A (en) * | 2022-04-26 | 2022-07-01 | 澳门大学 | DMF (dimethyl formamide) chip, rapid PCR (polymerase chain reaction) system and PCR method |
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