CN109317227A - A kind of micro-fluidic chip driving plate and preparation method thereof and micro-fluidic chip - Google Patents
A kind of micro-fluidic chip driving plate and preparation method thereof and micro-fluidic chip Download PDFInfo
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- CN109317227A CN109317227A CN201811259438.6A CN201811259438A CN109317227A CN 109317227 A CN109317227 A CN 109317227A CN 201811259438 A CN201811259438 A CN 201811259438A CN 109317227 A CN109317227 A CN 109317227A
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- pad
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- pcb board
- fluidic chip
- driving plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/50273—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the means or forces applied to move the fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
- B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
Abstract
The invention discloses a kind of micro-fluidic chip driving plate and preparation method thereof and micro-fluidic chips.The micro-fluidic chip driving plate includes basic pcb board, basic pcb board includes substrate and the pad on substrate, has gap between pad, and the gap between pad is equipped with filling member, the flush of filling member and pad, filling member and pad are equipped with insulating hydrophobic layer.Pass through the gap setting filling member between pad, and the surface of filling member and the flush of pad, to which the surface smoothness of pcb board can be improved, applied to micro-fluidic chip driving plate, the breakdown frequency for causing drop to be electrolysed of insulating hydrophobic layer can reduce, reduce driving voltage, greatly improve driving success rate, the micro-fluidic chip driving plate can be saved using high-pressure modular bring cost, reduce operation difficulty.
Description
Technical field
The present invention relates to the preparation technical fields of pcb board, and in particular to a kind of micro-fluidic chip driving plate and its preparation side
Method and micro-fluidic chip.
Background technique
The microflow control technique of manipulation drop has obtained in fields such as chemical analysis, biologic medicals as the carrier for transporting drop
Very extensive application was obtained, which is referred to as " lab on A Chip " (Lab on a chip) or " micro-total analysis system "
(Micro total analysis systems) and now the driving electrodes plate overwhelming majority of micro-fluidic chip are using ITO
For substrate.In order to reduce the manufacturing cost of chip, many researchers start to explore using more cheap pcb board as substrate
Chip.
It is to reach Nano grade by the micro-fluidic chip driving plate of substrate of ITO, i.e. the difference in height of electrode block and substrate is
200-400nm, electrode block gap up to 25.4 μm, electrode block flatness < 10nm.But the PCB factory of most domestic
Family's manufacturing process reaches micron level, i.e. the difference in height of pad (relative to the electrode block in ITO) and substrate is 18-38 μm, weldering
Gap between disk is 152.4 μm -101.6 μm, pad block flatness is 1-2 μm.Thus it is evident that pcb board manufacture work
Skill and the manufacturing process of ito glass differ greatly, if it is desired to continue the chip using pcb board as substrate and reach and ITO substrate core
The same performance parameter of piece can also pass through other than changing outside and applying alive size, dielectric substance layer material and optimize PCB
The physical property of plate surface promotes the performance parameter of chip.
Current many researchers have the method for optimized PCB flatness:
1, the surface for directly skipping optimized PCB deposits above or sticks one layer of dielectric substance layer；
The disadvantages of this method are: the ito glass relative to Nano grade, pcb board surface pads reach with substrate height difference
30 μm are extremely out-of-flatnesses, it is desirable to not do optimization processing and directly stick one layer of dielectric substance layer, it is to improve that bring, which directly affects,
Driving voltage is up to 300V or more, it is intended that a, operator's operation with high pressure have very high requirement to operation attainment, no
Adapt to the popularization of the following micro-fluidic chip；B, it needs to design boost module and completes high voltage output, which not only improves be designed to
This, also increases the volume of whole equipment, not readily portable；
2, the smearing mode of hydrophobic material is spin coating operation；
It, can will be hydrophobic by the way of spin coating the disadvantages of this method are: since ito glass surface is approximate smooth
Material is evenly distributed on glass, but the surface roughness of pcb board is high, and spin coating mode can not uniformly divide hydrophobic material
Cloth and uncontrollable.
Therefore, a kind of method that can reduce pcb board surface roughness is found, to obtain the high pcb board of surface smoothness,
Studying influence and development portable micro-fluidic chip equipment of the pcb board parameters to chip performance to scientific research personnel in the future has one
Determine meaning.
Summary of the invention
In order to solve the above technical problem, the present invention provides a kind of micro-fluidic chip driving plate and preparation method thereof and miniflows
Chip is controlled, the surface smoothness of the micro-fluidic chip driving plate is high.
The technical scheme adopted by the invention is that: a kind of micro-fluidic chip driving plate, including basic pcb board, the basis
Pcb board includes substrate and the pad on the substrate, has gap between the pad, and the gap between the pad is set
There are filling member, the flush on the surface of the filling member and the pad, the filling member and the pad are equipped with insulation
Hydrophobic layer.
Filling member is insulation filling part, it is preferable that the material of the filling member is insulative polymer material.
It is further preferred that the insulative polymer material includes Teflon fluoropolymer (AF), liquid photosensitive welding resistance oil
At least one of ink, polytetrafluoroethylene (PTFE) (PTFE) and polyamide (Polyimide).Wherein, AF is that a kind of extremely difficult removal is hydrophobic
Material, the preferred AF of insulative polymer material, concretely AF1600, AF2400 etc..
Preferably, the material of the insulating hydrophobic layer includes at least one of AF and Cytop.The corresponding material of Cytop
Entitled perfluoro (1-butenyl vinyl ether) polymer, is a kind of fluoropolymer of noncrystalline high transparency
Object.
The present invention also provides a kind of preparation methods of above-mentioned micro-fluidic chip driving plate, comprising the following steps:
S1, take or prepare basic pcb board, the basis pcb board includes substrate and the pad on the substrate, described
There is gap between pad；
Insulating polymer coating is arranged in S2, the one side that pad is equipped on the basic pcb board, and between the pad between
The flush on the surface of insulating polymer coating and the pad in gap；
Insulating polymer coating on S3, the basic pcb board of removal after step S2 processing above pad；
S4, insulating hydrophobic layer is set on through step S3 treated basic pcb board.
Preferably, in step s 2, using screen printing technique, the one side that pad is equipped on the basic pcb board prints
Brush insulating polymer solution then evaporates the solvent in the insulating polymer solution, forms insulating polymer coating；Single
Or be repeated several times and carry out the above operation, until the surface of insulating polymer coating and the pad in gap between the pad
Flush.
Due to the rough surface of basic pcb board, it is not suitable for traditional spin coating mode, in order to by insulating polymer coating
Uniformly and controllably distribution setting is on basic pcb board, by the way of silk-screen printing, insulating polymer solution is placed preparatory
On designed mold, mold is placed on the top of basic pcb board, the nethike embrane for having filament to be woven on the mold, wherein one
Part can leak, and size and basic pcb board shape match.The tension and mesh number for designing nethike embrane are polymerize using the inswept insulation of wiper
Object solution, and then the insulating polymer coating for preparing required thickness and being uniformly attached on basic pcb board.Compared to spin coating skill
Art is more suitable for being evenly coated in the insulative polymer materials such as AF on the biggish basic pcb board of roughness using screen printing technique,
More save material cost.
Preferably, the solvent in the insulating polymer solution be volatile solvent, specifically can be selected FC-43, FC-40,
FC-77, FC-3282 etc..
Preferably, before step S2 further include: carried out using laser grinding technology to the pad on the basic pcb board
Polishing, reduces the height of the pad.The height is specially vertical range of the pad top surface to real estate.
It, usually can not be accurately right using now common sanding and polishing technology since the electrode block distribution of chip is very intensive
Single or a part of pad is individually handled, and operability is low.In this regard, laser grinding technology can be used, with laser marking machine
For the laser equipment of representative, calcination is carried out to pad metal using the thermal energy of laser beam and reaches grinding effect, and made in software end
It can be derived that the pad of different height, just with the power of software adjustment laser and polishing time by adjusting the area of laser beam polishing
Domain form and dimension recycles optical correction just can polish well single pad, such accurate parameter adjustment,
It can be accurately controlled the height of polishing pad, improve operability.
Pad is polished to reduce pad height by laser, can reduce between pad setting for insulating polymer coating in gap
Thickness is set, insulating polymer coating is set for being repeated several times by the way of " printing-evaporation forms a film " using silk screen printing technique
Situation can reduce number of repetition, save time cost.In addition, due to the excessively thin feelings that voltage output may be brought unstable of pad
Condition, therefore pad polishing cannot be excessively thin, and pad is usually polishing to height at 1 μm or so, such as can be controlled in 0.5-2 μm.
Preferably, in step s3, the one side of insulating polymer coating is equipped on the basic pcb board, using exposure mask
Plate blocks the region on the basic pcb board in addition to pad corresponding region, using reactive ion etching technology by the pad
The insulating polymer coating of top etches removal.Using reactive ion etching technology, can farthest etch away on pad
The insulating polymers coating such as unwanted AF, making that treated, basic pcb board surface smoothness reaches sub-nanometer rank.
Preferably, in step s 4, using screen printing technique, setting is exhausted on through step S3 treated basic pcb board
Edge hydrophobic layer.
The above micro-fluidic chip driving plate surfacing can be applied to prepare micro-fluidic chip, therefore the present invention also provides one kind
Micro-fluidic chip, the micro-fluidic chip include any of the above micro-fluidic chip driving plate.
The method have the benefit that: the present invention provides a kind of micro-fluidic chip driving plate and preparation method thereof and micro-
Fluidic chip, by the gap setting filling member on basic pcb board between pad, and the surface on the surface of filling member and pad
Concordantly, so that the surface smoothness of basic pcb board can be improved, it is applied to micro-fluidic chip driving plate, insulating hydrophobic layer can be reduced
It is breakdown to lead to the frequency that drop is electrolysed.Specifically, filling member is not provided with for the gap between pad on basic pcb board
Situation, since there are gaps between pad, when preparing hydrophobic layer using conventional method spin coating on it setting hydrophobic material, in pad
Vertical sidewall on hydrophobic layer average thickness must be not as good as horizontal direction, or even there are some side walls not form hydrophobic layer,
And then it will lead to pad and directly contacted with drop, and then drop occur by Electrolysis, so that driving failure.The present invention passes through
Gap between pad is equipped with filling member, improves the surface smoothness of basic pcb board, is applied to micro-fluidic chip driving plate,
It can reduce driving voltage, greatly improve driving success rate, micro-fluidic chip driving plate drives effect good, can save using high pressure
Module bring cost reduces operation difficulty.
Detailed description of the invention
For the clearer technical solution illustrated in the embodiment of the present invention, will make below to required in embodiment description
Attached drawing briefly describes.
Fig. 1 is micro-fluidic chip driving plate preparation flow schematic diagram in the embodiment of the present invention 1.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiment 1
A kind of micro-fluidic chip driving plate, as shown in Figure 1, preparation method includes the following steps:
S1, basic pcb board is taken, which includes substrate and the pad on substrate, between having between pad
Gap.
Shown in S2, as shown in figure 1 (a), using laser grinding technology using the pad on 2 pairs of laser emitter basic pcb boards 1
It polishes, reduces the height of pad to 1 μm or so, the height of pad is detected by step instrument after polishing.The gained after polishing
Basic pcb board is shown as shown in figure 1 (b), including substrate 11, the pad 12 on substrate 11 and after polishing, between pad 12
With gap 13.
Shown in S3, as shown in figure 1 (c), AF1600 solution (solvent FC-43) is printed on through step using screen printing technique
The one side of rapid S2 treated basic pcb board is equipped with pad 12, is then placed on 85 DEG C of hot plates and heats 5min or so, make
Solvent evaporation in AF1600 solution, forms AF coating 14；Continue to print on AF coating 14 using screen printing technique
AF1600 solution, and heating evaporation falls the solvent in AF1600 solution；Repeat above operation and build high AF coating 14, until pad it
Between in gap the surface of AF coating 14 and pad 12 flush, i.e. the thickness of AF coating 14 height that is equal to pad 12.
Shown in S4, as shown in figure 1 (d), the one side of AF coating 14 is equipped on basic pcb board, using mask plate shielding basis
Region on pcb board in addition to pad corresponding region, using reactive ion etching technology by 14 quarter of AF coating of the top of pad 12
Etching off removes.
Shown in S5, as shown in figure 1 (e), using screen printing technique, setting is exhausted on through step S4 treated basic pcb board
Edge hydrophobic layer 15, the material of insulating hydrophobic layer are AF1600, and micro-fluidic chip driving plate, the micro-fluidic chip driving plate packet is made
Basic pcb board is included, basic pcb board includes substrate 11, and substrate 11 is equipped with pad 12, has gap, pad 12 between pad 12
Between gap filling have AF coating 14, and the flush on the surface of AF coating 14 and pad 12, AF coating 14 and pad 12
Upper surface is equipped with insulating hydrophobic layer 15.
Embodiment 2
A kind of micro-fluidic chip driving plate, preparation method includes the following steps:
S1, basic pcb board is prepared, which includes substrate and the pad on substrate, between having between pad
Gap.
S2, AF2400 solution (solvent FC-40) is printed on basic PCB substrate equipped with weldering using screen printing technique
The one side of disk is then placed on 90 DEG C of hot plates and heats 5min or so, evaporates the solvent in AF2400 solution, forms AF coating；
Continue to print AF2400 solution on AF coating using screen printing technique, and heating evaporation falls the solvent in AF2400 solution；
It repeats above operation and builds high AF coating, until the surface of AF coating is concordant with bond pad surface in gap between pad, i.e. AF coating
Thickness be equal to pad height.
S3, the one side that AF coating is equipped on basic pcb board, using removing on the pcb board of mask plate shielding basis, pad is corresponding
AF coating above pad is etched removal using reactive ion etching technology by the region other than region.
S4, insulating hydrophobic layer is arranged on through step S4 treated basic pcb board using screen printing technique, insulation is dredged
The material of water layer is Cytop, and micro-fluidic chip driving plate is made.
Embodiment 3
A kind of micro-fluidic chip driving plate, preparation method includes the following steps:
S1, basic pcb board is taken, which includes substrate and the pad on substrate, between having between pad
Gap.
S2, it is polished using laser grinding technology the pad on basic pcb board, reduces the height of pad to 1 μm of left side
The right side, the height of pad can be detected by step instrument after polishing；
S3, polyamide solution (solvent FC-77) is printed on base after step S2 processing using screen printing technique
Plinth PCB substrate is equipped with the one side of pad, is then placed on 80 DEG C of hot plates and heats 5min or so, makes the solvent in polyamide solution
Evaporation forms insulating polymer coating；Continue to print polyamide solution on insulating polymer coating using screen printing technique,
And heating evaporation falls the solvent in polyamide solution；It repeats above operation and builds high insulating polymer coating, until between pad
The surface of insulating polymer coating is concordant with bond pad surface in gap, i.e. height of the thickness of insulating polymer coating equal to pad.
S4, the one side that insulating polymer coating is equipped on basic pcb board, using being removed on the pcb board of mask plate shielding basis
The insulating polymer coating etching above pad is gone using reactive ion etching technology in region other than pad corresponding region
It removes.
S5, insulating hydrophobic layer, insulating hydrophobic layer are arranged on through step S4 treated basic pcb board using spin coating technique
Material be AF1600, be made micro-fluidic chip driving plate.
Above embodiments 1-3 insulate by using gap filling of the screen printing technique on basic pcb board between pad
Polymer coating makes the flush of insulating polymer coating in bond pad surface, to keep pcb board body surface face flat, on it
When by coating hydrophobic material, hydrophobic material is evenly distributed, and forms smooth hydrophobic layer, and can avoid PCB surface out-of-flatness causes
The problem for driving effect undesirable, resulting micro-fluidic chip driving plate surface smoothness is high, can be applied to prepare micro-fluidic core
Piece, driving work well, it is ensured that driving voltage be 100V in be successfully driven drop, so as to save use high-pressure modular band
The cost come reduces operation difficulty.
Although specifically showing and describing the present invention in conjunction with preferred embodiment, those skilled in the art should be bright
It is white, it is not departing from the spirit and scope of the present invention defined by described claims, it in the form and details can be right
The present invention makes a variety of changes, and is protection scope of the present invention.
Claims (10)
1. a kind of micro-fluidic chip driving plate, which is characterized in that including basic pcb board, the basis pcb board includes substrate and sets
Pad on the substrate has gap between the pad, and the gap between the pad is equipped with filling member, the filling
The flush on the surface of part and the pad, the filling member and the pad are equipped with insulating hydrophobic layer.
2. micro-fluidic chip driving plate according to claim 1, which is characterized in that the material of the filling member is that insulation is poly-
Close object material.
3. micro-fluidic chip driving plate according to claim 2, which is characterized in that the insulative polymer material includes
At least one of AF, liquid photosensitive solder mask, polytetrafluoroethylene (PTFE) and polyamide.
4. micro-fluidic chip driving plate according to any one of claim 1-3, which is characterized in that the insulating hydrophobic layer
Material include at least one of AF and Cytop.
5. the preparation method of micro-fluidic chip driving plate of any of claims 1-4, which is characterized in that including following
Step:
S1, basic pcb board is taken or prepares, the basis pcb board includes substrate and the pad on the substrate, the pad
Between have gap；
Insulating polymer coating is arranged in S2, the one side that pad is equipped on the basic pcb board, and between the pad in gap
The flush on the surface of insulating polymer coating and the pad；
Insulating polymer coating on S3, the basic pcb board of removal after step S2 processing above pad；
S4, insulating hydrophobic layer is set on through step S3 treated basic pcb board.
6. the preparation method of micro-fluidic chip driving plate according to claim 5, which is characterized in that in step s 2, adopt
With screen printing technique, the one side that pad is equipped on the basic pcb board prints insulating polymer solution, then evaporates institute
The solvent in insulating polymer solution is stated, insulating polymer coating is formed；It is single or multiple to repeat the above operation, until institute
State the flush on the surface of insulating polymer coating and the pad in gap between pad.
7. the preparation method of micro-fluidic chip driving plate according to claim 5, which is characterized in that before step S2 also
Include: to be polished using laser grinding technology the pad on the basic pcb board, reduces the height of the pad.
8. the preparation method of micro-fluidic chip driving plate according to claim 7, which is characterized in that the height of the pad
It is reduced to 0.5-2 μm.
9. the preparation method of micro-fluidic chip driving plate according to claim 5, which is characterized in that step S3 specifically:
The one side of insulating polymer coating is equipped on the basic pcb board, using on basis pcb board described in mask plate shielding except pad
The insulating polymer coating etching above the pad is gone using reactive ion etching technology in region other than corresponding region
It removes.
10. a kind of micro-fluidic chip, which is characterized in that driven including micro-fluidic chip of any of claims 1-4
Plate.
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| CN201811259438.6A CN109317227A (en) | 2018-10-26 | 2018-10-26 | A kind of micro-fluidic chip driving plate and preparation method thereof and micro-fluidic chip |
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| CN201811259438.6A CN109317227A (en) | 2018-10-26 | 2018-10-26 | A kind of micro-fluidic chip driving plate and preparation method thereof and micro-fluidic chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115121305A (en) * | 2022-07-13 | 2022-09-30 | 北京理工大学 | Novel digital microfluidic chip and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106457827A (en) * | 2014-04-16 | 2017-02-22 | 雅培制药有限公司 | Droplet actuator fabrication apparatus, systems, and related methods |
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