CN104252081A - Liquid crystal micro-lens array and manufacturing method thereof - Google Patents
Liquid crystal micro-lens array and manufacturing method thereof Download PDFInfo
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- CN104252081A CN104252081A CN201410115949.6A CN201410115949A CN104252081A CN 104252081 A CN104252081 A CN 104252081A CN 201410115949 A CN201410115949 A CN 201410115949A CN 104252081 A CN104252081 A CN 104252081A
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Abstract
The invention relates to a liquid crystal micro-lens array and a manufacturing method thereof. The liquid crystal micro-lens array comprises a second transparent substrate, a transparent medium layer, a second transparent conductive film, a second alignment layer, a liquid crystal layer, a first alignment layer, a first transparent conductive film and a first transparent substrate, wherein the transparent medium layer is arranged on the second transparent substrate, and the upper surface of the transparent medium layer is provided with a recess corresponding to each micro-lens region; the second transparent conductive film is arranged above the transparent medium layer; the second alignment layer is arranged on the second transparent conductive film; the liquid crystal layer is arranged on the second alignment layer; the first alignment layer is arranged on the liquid crystal layer; the first transparent conductive film is arranged on the first alignment layer; the first transparent substrate is arranged on the first transparent conductive film. By adopting the liquid crystal micro-lens array and the manufacturing method, the defects of multi-electrode driving of a liquid crystal micro-lens, complex process and difficulty in uniformly controlling field distribution are effectively overcome.
Description
Technical field
The present invention relates to bore hole stereo display technique field, particularly relate to a kind of liquid crystal microlens array and preparation method thereof.
Background technology
Bore hole 3D (Three Dimensional) display does not need beholder's wearing spectacles or the helmet etc. to help just to watch 3D image depending on equipment, become the new development trend in display field.In actual applications, beholder often wish according to provide display image requirement freely switch between 3D display mode and 2D display mode, such display device is called 2D-3D switchable display device.Existing 2D-3D switchable display device generally adopts liquid crystal microlens, current attainable liquid crystal microlens is mainly divided into two classes: a class is active liquid crystal microlens, namely liquid crystal is limited in having in the lenticule shaped polymer of certain curvature radius, and has bipolar electrode to drive, the another kind of mode for multi-electrode driving, namely at the multiple mutual independently electrode of the side of liquid crystal layer arrangement, electrode applies discontinuous voltage's distribiuting, because the deflection angle of liquid crystal molecule becomes positive correlation with the electric field intensity applied thereon, then in the upper area applying high voltage electrode, liquid crystal deflecting element angle is greater than the deflection angle applying liquid crystal molecule in low voltage electrode upper area, each voltage swing is regulated to make liquid crystal layer become a lenticule, applying the liquid crystal microlens advantage that this kind of mode make is that deflection angle can by Control of Voltage, namely liquid crystal layer index distribution is controlled, thus the lenticule focal length formed also is controlled, and the shortcoming of this kind of method when making microlens array needs to introduce fine electrode preparation exactly, make driving circuit flow process comparatively complicated, and control because Electric Field Distribution is very difficult evenly, to affect display effect, when making microlens array, when microlens array area increases, when lenticule number increases, each lenticular electrode cannot be realized and well extract.
For the mode above shortcomings that multi-electrode drives, the present invention adopts liquid crystal microlens electrode separation to control Electric Field Distribution, forms liquid crystal microlens, proposes a kind of liquid crystal microlens array and preparation method thereof.
Summary of the invention
In view of this, the object of the invention is, for the large shortcoming of traditional multi-electrode liquid crystal microlens array manufacture craft difficulty, to provide a kind of liquid crystal microlens array and preparation method thereof.
The present invention adopts following scheme to realize: a kind of liquid crystal microlens array, is characterized in that, comprising:
One second transparency carrier;
One transparent dielectric layer, be arranged at above described second transparency carrier, and described transparent dielectric layer upper surface all has a recess corresponding to each lenticule region, described recess is by anisotropic etching silicon face or isotropic etching glass surface, be aided with follow-up soft printing and carry out Graphic transitions formation, or directly formed by 3D printing technique;
One second transparent conductive film, is arranged at above described transparent dielectric layer, and has the recess identical with described transparent dielectric layer upper surface;
One second both alignment layers, is arranged at above described second transparent conductive film, and described second both alignment layers upper surface is parallel with described second transparency carrier;
One liquid crystal layer, is arranged at above described second both alignment layers;
One first both alignment layers, is arranged at above described liquid crystal layer;
One first transparent conductive film, is arranged at above described first both alignment layers;
One first transparency carrier, is arranged at above described first transparent conductive film.
In an embodiment of the present invention, described first transparency carrier and the second transparency carrier are clear glass, transparent inorganic material or transparent organic polymer material.
In an embodiment of the present invention, the micro-lenticular shape of described liquid crystal is circular or regular polygon.
In an embodiment of the present invention, described first transparent conductive film and the second transparent conductive film are the indium tin oxide films, metal doped zinc oxide film, metal-graphite alkene or the metal-carbon pipe laminated film that adopt vacuum coating or spraying technology to be formed.
In an embodiment of the present invention, described first both alignment layers and the second both alignment layers stand friction treatment, and frictional direction is consistent.
The present invention also provides a kind of preparation method of described liquid crystal microlens array, it is characterized in that, comprises the following steps:
S11: the Si substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
S12: with described aperture grating for mask, adopts potassium hydroxide solution, at described Si substrate surface anisotropic etching pass groove;
S13: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S14: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned over smooth for described silicon rubber negative norm plate on described transparent dielectric layer, apply a predetermined pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S15: described silicon rubber negative norm plate is separated with described transparent dielectric layer;
S16: at described transparent dielectric layer surface preparation the second transparent conductive film.
The present invention also provides the preparation method of the liquid crystal microlens array described in another kind, it is characterized in that, comprises the following steps:
S21: the glass substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
S22: with described aperture grating for mask, adopts hydrofluorite and ammonium fluoride mixed solution, at described glass baseplate surface isotropic etching pass groove;
S23: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S24: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned on described transparent dielectric layer by smooth for described silicon rubber negative norm plate, apply certain pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S25: described silicon rubber negative norm plate is separated with described transparent dielectric layer;
S26: at described transparent dielectric layer surface preparation the second transparent conductive film.
The present invention also provides the preparation method of the liquid crystal microlens array described in another, it is characterized in that, comprises the following steps:
S31: the second transparency carrier that a cleaning is provided;
S32: adopt 3D printing technique at described second transparency carrier printout surface pass groove, obtains the transparent dielectric layer surface with described recess;
S33: at described transparent dielectric layer surface preparation the second transparent conductive film.
Remarkable advantage of the present invention is: control liquid crystal molecule deflection in various degree by the electrode on liquid crystal layer both sides, reach the effect of liquid crystal microlens, and without the need to drawing more electrode, manufacture craft is simple and driving circuit is simpler; Further, the preparation of large-area liquid crystal microlens array can be realized.
For making object of the present invention, technical scheme and advantage clearly understand, below by specific embodiment and relevant drawings, the present invention will be described in further detail.
Accompanying drawing explanation
Fig. 1 is the regular concaveconvex shape in transparent dielectric layer of the present invention surface when carrying out Graphic transitions for being aided with follow-up soft printing by anisotropic etching silicon face, the structural representation of liquid crystal microlens array unit not added electric field.
Fig. 2 is the regular concaveconvex shape in transparent dielectric layer of the present invention surface when carrying out Graphic transitions for being aided with follow-up soft printing by anisotropic etching silicon face, and liquid crystal microlens array unit applies the structural representation of electric field.
Fig. 3 is the regular concaveconvex shape in transparent dielectric layer of the present invention surface when carrying out Graphic transitions for being aided with follow-up soft printing by isotropic etching glass surface, and liquid crystal microlens array unit applies the structural representation of electric field.
Fig. 4 be the regular concaveconvex shape in transparent dielectric layer of the present invention surface for being formed by 3D printing technique time, the structural representation of liquid crystal microlens array unit applying electric field.
Fig. 5 is in the embodiment of the present invention one, Si face anisotropic etching schematic diagram.
Embodiment
As shown in Figure 1, the invention provides a kind of liquid crystal microlens array, comprising:
One second transparency carrier 102;
One transparent dielectric layer 104, be arranged at above described second transparency carrier 102, and described transparent dielectric layer 104 upper surface all has a recess (namely described transparent dielectric layer upper surface presents concaveconvex shape regularly) corresponding to each lenticule region, described recess is by anisotropic etching silicon face or isotropic etching glass surface, be aided with follow-up soft printing and carry out Graphic transitions formation, or directly formed by 3D printing technique;
One second transparent conductive film 105, is arranged at above described transparent dielectric layer 104, and has the recess identical with described transparent dielectric layer 104 upper surface;
One second both alignment layers 107, is arranged at above described second transparent conductive film 105, and described second both alignment layers 107 upper surface is parallel with described second transparency carrier 102;
One liquid crystal layer 108, is arranged at above described second both alignment layers 107;
One first both alignment layers 106, is arranged at above described liquid crystal layer 108, for the orientation of liquid crystal molecule;
One first transparent conductive film 103, is arranged at above described first both alignment layers 106;
One first transparency carrier 101, is arranged at above described first transparent conductive film 103;
Described transparent dielectric layer upper surface is that being aided with follow-up soft printing carries out Graphic transitions formation, or is directly formed by 3D printing technique by anisotropic etching silicon face or isotropic etching glass surface corresponding to the recess that each lenticule region has.
Preferably, described first transparency carrier and the second transparency carrier are clear glass, transparent inorganic material or transparent organic polymer material; Described liquid crystal microlens array is liquid crystal microlens arrays and liquid crystal microlens array, and the shape of described liquid crystal microlens is circular or regular polygon; Described first transparent conductive film and the second transparent conductive film are tin indium oxide (ITO) film, metal doped zinc oxide film, metal-graphite alkene or the metal-carbon pipe laminated film that adopt vacuum coating or spraying technology to be formed; The distance of this second transparent conductive film and the first transparent conductive film presents continuous or discrete regular change, for controlling Electric Field Distribution flexibly, forms liquid crystal microlens array; Described first both alignment layers and the second both alignment layers stand friction treatment, and frictional direction is consistent.
Be illustrated in figure 1 the present invention when the described first regular concaveconvex shape in transparent dielectric layer surface carries out Graphic transitions for being aided with follow-up soft printing by anisotropic etching silicon face, the structural representation of liquid crystal microlens array unit not added electric field.Now liquid crystal molecule is along arranging with substrate-parallel direction, and the long axis direction of liquid crystal molecule is consistent with the polarization direction of polarized light, can not have an impact to light path, therefore polarized light 109 passes straight through.When a field is applied, under the effect of electric field, there is certain deflection in liquid crystal molecule, when the first electrode and the second electrode distance less time, electric field is larger, liquid crystal molecule is deflected into vertical with substrate completely, maximum to the refractive index of polarized light, the first electrode and the second electrode distance increase, and between liquid crystal, electric field reduces, liquid crystal deflection angle also reduces, the refractive index of polarized light 109 is diminished, forms gradient index microlenses, as shown in Figure 2.
When the regular concaveconvex shape in described transparent dielectric layer surface carries out Graphic transitions for being aided with follow-up soft printing by anisotropic etching silicon face, as depicted in figs. 1 and 2, the preparation of regular concaveconvex shape electrode comprises following steps:
S11: as shown in Figure 5, provides the Si of a cleaning (100) substrate and adopts photoetching to make aperture grating on its surface;
S12: with described aperture grating for mask, adopts potassium hydroxide (KOH) solution, at described Si (100) substrate surface anisotropic etching pass groove;
S13: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S14: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned over (one side that namely described silicon rubber negative norm plate has pass groove is placed on described transparent dielectric layer) on described transparent dielectric layer by smooth for described silicon rubber negative norm plate, apply a predetermined pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S15: be separated with described transparent dielectric layer by described silicon rubber negative norm plate, obtains the transparent dielectric layer surface of regular concaveconvex shape;
S16: at described transparent dielectric layer surface preparation the second transparent conductive film, form regular concaveconvex shape electrode.
When the regular concaveconvex shape in described transparent dielectric layer surface carries out Graphic transitions for being aided with follow-up soft printing by isotropic etching glass surface, as shown in Figure 3, the preparation of regular concaveconvex shape electrode comprises following steps:
S21: the glass substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
S22: with described aperture grating for mask, adopts hydrofluorite (FH) and ammonium fluoride (NH
4f) mixed solution, at described glass baseplate surface isotropic etching pass groove;
S23: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S24: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned over (one side that namely described silicon rubber negative norm plate has pass groove is placed on described transparent dielectric layer) on described transparent dielectric layer by smooth for described silicon rubber negative norm plate, apply certain pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S25: be separated with described transparent dielectric layer by described silicon rubber negative norm plate, obtains the first transparent dielectric layer surface of described regular concaveconvex shape;
S26: at described transparent dielectric layer surface preparation the second transparent conductive film, form regular concaveconvex shape electrode.
When the regular concaveconvex shape in described transparent dielectric layer surface be formed by 3D printing technique time, as shown in Figure 4, the preparation of regular concaveconvex shape electrode comprises following steps:
S31: the second transparency carrier that a cleaning is provided;
S32: adopt 3D printing technique at described second transparency carrier printout surface pass groove, obtains the transparent dielectric layer surface that regular concaveconvex shape has described recess;
S33: at described regular concaveconvex shape transparent dielectric layer surface preparation the second transparent conductive film, form regular concaveconvex shape electrode.
In the drawings, in order to represent the clear thickness being exaggerated layer and region, but should not be considered to as schematic diagram the proportionate relationship strictly reflecting physical dimension.Reference diagram is the schematic diagram of idealized embodiments of the present invention, and illustrated embodiment should not be considered to the given shape being only limitted to the region shown in figure, but comprises obtained shape (such as manufacturing the deviation caused).All represent with rectangle in the present embodiment, the expression in figure is schematic, but this should not be considered to limit the scope of the invention.
Better the present invention is understood in order to allow those skilled in the art, preferably, in the specific embodiment of the invention, glass substrate selected by transparency carrier, transparent conductive film selects tin indium oxide (ITO), transparent dielectric layer selects acrylic (PMMA), both alignment layers selects polyimide (PI), and the silastic material for making silicon rubber negative norm plate selects dimethyl silicone polymer (PDMS) and the ratio column selection 10:1 of monomer whose and crosslinking chemical.The concrete preparation method of liquid crystal microlens array is introduced below by embodiment.
Embodiment one
As depicted in figs. 1 and 2, the present embodiment is for when the regular concaveconvex shape in described transparent dielectric layer surface carries out Graphic transitions for being aided with follow-up soft printing by anisotropic etching silicon face, the preparation method of liquid crystal microlens array, its concrete scheme comprises the following steps:
S11: the Si of a cleaning (100) substrate is provided and adopts photoetching to make aperture grating on its surface;
Choose single-sided polishing Si (100) substrate, (volume ratio is Win-10: DI water=3: 97) to be placed in the aqueous solution of cleaning fluid Win-10, the ultrasonic machine cleaning 15min utilizing frequency to be 32KHz, after spray 2min, (volume ratio is Win-41: DI water=5: 95) to be placed in the aqueous solution of cleaning fluid Win-41 again, the ultrasonic machine cleaning 10min utilizing frequency to be 40KHz, after circulation tap water spray rinsing 2min, recycling frequency is that the ultrasonic machine of 28KHz cleans 10min in DI pure water, dry up through nitrogen gun and be placed on that to be incubated more than 30min in 50 DEG C of cleaning ovens for subsequent use.
As shown in Figure 5, at above-mentioned cleaning substrate Si (100) substrate surface, using plasma strengthens chemical vapor deposition (PECVD) method deposition about 100 nm SiO
2film, at SiO
2film evenly applies one deck photoresist RJZ304, and 110 DEG C are toasted after 20 minutes, at SiO after overexposure and development
2foamed film is formed the photoresist with aperture grating array (corresponding lens arra slightly) pattern; Take photoresist as mask, adopt reactive ion etching method, by the SiO exposed
2the removing of film etching, by the SiO that photoresist is protected
2film stays, and after photoresist cleaning, forms SiO
2membrane pores grating array (have the hollow out aperture portion of aperture grating pattern photoresist, in the present embodiment, hollow out aperture portion is circular, corresponding microlens array).
S12: with described aperture grating for mask, adopts potassium hydroxide (KOH) solution, at Si (100) substrate surface anisotropic etching pass groove;
SiO will be provided with
2si (100) substrate of membrane pores grating array 110 is placed in 30 wt.% potassium hydroxide (KOH) aqueous solution, solution temperature is 80 DEG C, because the etching speed of KOH solution to Si (100) face is far longer than the etching speed to Si (111) face, inverted triangle conical socket as shown in Figure 5 will be formed.
S13: adopt silicon rubber to prepare the negative norm plate of pass groove;
Get the sealing of the Si substrate containing inverted triangle conical socket array prepared in described step S12 be placed in trimethyl chlorosilane molecule (TMCS) is housed container in, to place after about 5 minutes taking-up, now this Si substrate surface self assembly one deck TMCS molecule, for antiseized.Prepare the potpourri of monomer and crosslinking chemical in ratio needed for described silicon rubber, the present embodiment presses ratio row configuration dimethyl silicone polymer (PDMS) potpourri of monomer and crosslinking chemical 10:1, is stirred to Homogeneous phase mixing.The Si substrate level of above-mentioned self assembly one deck TMCS is positioned in a container, pour dimethyl silicone polymer (PDMS) potpourri into, leave standstill about 30 minutes all to eliminate to bubbling, this container is put into 80 DEG C of baking ovens more than two hours, take out after PDMS solidifies completely, by PDMS and Si substrate separation, cutting PDMS forms the silicon rubber negative norm plate of pyrometric cone array.
S14: transparency carrier 102(second transparency carrier that a cleaning is provided), at its surface uniform coating layer of transparent dielectric layer (transparent dielectric layer), and be positioned on transparent dielectric layer by smooth for S13 gained silicon rubber negative norm plate, apply certain pressure, adopt the method for heating or UV-irradiation to make it solidify;
Get the glass substrate 102 of a cleaning, preferably, spin coating method is adopted to apply one deck PMMA at its surface uniform, be positioned over transparent dielectric layer on by smooth for S13 gained pyrometric cone array silicon rubber negative norm plate pyrometric cone array down, apply certain pressure to make on PMMA, form inverted triangle conical socket array, and adopt type of heating that PMMA is solidified.
S15: be separated with transparent dielectric layer by silicon rubber negative norm plate, obtains the transparent dielectric layer surface of described regular concaveconvex shape;
After PMMA solidification, silicon rubber negative norm plate is taken off, forms regular concaveconvex shape first transparent dielectric layer surface 104.
S16: prepare transparent conductive film on the transparent dielectric layer surface of regular concaveconvex shape, forms regular concaveconvex shape electrode;
Preferably, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on the first transparent dielectric layer surface of regular concaveconvex shape, form regular concaveconvex shape transparency conductive electrode 105.Equally, get the glass substrate 101 of another cleaning, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on its surface, form regular concaveconvex shape transparency conductive electrode 103.
S17: prepare liquid crystal alignment layer on the surface of transparency conductive electrode 103 and 105;
Adopt spin coating method evenly to apply the polyimide (PI) that a layer thickness is about 80nm on the surface of transparency conductive electrode 103 and 105, and be placed in 260 DEG C baking oven baking 2 hours after take out nature cooling after, adopt liquid crystal panel to prepare special rubbing machine and carry out friction orientation, in two transparency conductive electrodes, form PI liquid crystal alignment layer 106 and 107 respectively.
S18: prepared by liquid crystal microlens.
Adopt liquid crystal panel production standard technique, through steps such as frame offset printing brush, baseplate-laminating, perfusion liquid crystal, sealing, liquid crystal reorientations, form complete liquid crystal microlens.
Embodiment two
As shown in Figure 3, the present embodiment is for when the regular concaveconvex shape in described transparent dielectric layer surface carries out Graphic transitions for being aided with follow-up soft printing by isotropic etching glass surface, the preparation method of liquid crystal microlens array, its concrete scheme comprises the following steps:
S21: the glass substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
(volume ratio is Win-10: DI water=3: 97) glass substrate to be placed in the aqueous solution of cleaning fluid Win-10, the ultrasonic machine cleaning 15min utilizing frequency to be 32KHz, after spray 2min, (volume ratio is Win-41: DI water=5: 95) to be placed in the aqueous solution of cleaning fluid Win-41 again, the ultrasonic machine cleaning 10min utilizing frequency to be 40KHz, after circulation tap water spray rinsing 2min, recycling frequency is that the ultrasonic machine of 28KHz cleans 10min in DI pure water, dries up be placed on that to be incubated more than 30min in 50 DEG C of cleaning ovens for subsequent use through nitrogen gun.
On above-mentioned cleaned glass surface, adopt magnetron sputtering deposition about 100 nm Cr film, Cr film evenly applies one deck photoresist RJZ304,110 DEG C of bakings, after 20 minutes, form the photoresist with aperture grating array (corresponding microlens array) pattern after overexposure and development on Cr film; Be placed in containing Ce(NH
4)
2(NO
3)
6and HClO
4aqueous solution etching liquid in; take photoresist as mask; the metallic member exposed (has the hollow out aperture portion of aperture grating pattern photoresist; in the present embodiment, hollow out aperture portion is for circular) be etched; stayed by the metal that photoresist is protected; after photoresist cleaning, final formation Cr membrane pores grating (corresponding microlens array).
S22: with described Cr membrane pores grating for mask, adopts hydrofluorite (FH) and ammonium fluoride (NH
4f) mixed solution, at substrate surface anisotropic etching pass groove;
To be provided with Cr membrane pores grating array glass substrate and be placed in 5 wt.% hydrofluorite (FH) aqueous solution, Cr membrane pores grating array is mask, etching glass under room temperature, will form lenticule shape pass groove.
S23: adopt silicon rubber to prepare the negative norm plate of pass groove;
Get the glass substrate containing lenticule shape pass groove prepared in described step S22, with watery hydrochloric acid go out surface Cr film, clean up rear sealing be placed in trimethyl chlorosilane molecule (TMCS) is housed container in, place after about 5 minutes and take out, now this glass substrate surface self assembly one deck TMCS molecule, for antiseized.Prepare the potpourri of monomer and crosslinking chemical in ratio needed for described silicon rubber, the present embodiment presses ratio row configuration dimethyl silicone polymer (PDMS) potpourri of monomer and crosslinking chemical 10:1, is stirred to Homogeneous phase mixing.The glass substrate of above-mentioned self assembly one deck TMCS is placed horizontally in a container, pour dimethyl silicone polymer (PDMS) potpourri into, leave standstill about 30 minutes all to eliminate to bubbling, this container is put into 80 DEG C of baking ovens more than two hours, take out after PDMS solidifies completely, be separated with glass by PDMS, cutting PDMS forms the silicon rubber negative norm plate (microlens shape) of pass groove.
S24: transparency carrier 202(second transparency carrier that a cleaning is provided), at its surface uniform coating layer of transparent dielectric layer (transparent dielectric layer), and be positioned on transparent dielectric layer by smooth for S23 gained silicon rubber negative norm plate, apply certain pressure, adopt the method for heating or UV-irradiation to make it solidify;
Get the glass substrate 202 of a cleaning, preferably, spin coating method is adopted to apply one deck PMMA at its surface uniform, be positioned over transparent dielectric layer on by smooth for S23 gained lenticule shape pass groove silicon rubber negative norm plate microlens array down, apply certain pressure to make on PMMA, form lenticule shape pass groove array, and adopt type of heating that PMMA is solidified.
S25: be separated with transparent dielectric layer by silicon rubber negative norm plate, obtains the transparent dielectric layer surface of described regular concaveconvex shape;
After PMMA solidification, silicon rubber negative norm plate is taken off, forms regular concaveconvex shape first transparent dielectric layer surface 204.
S26: prepare transparent conductive film on the transparent dielectric layer surface of regular concaveconvex shape, forms regular concaveconvex shape electrode;
Preferably, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on the transparent dielectric layer surface of regular concaveconvex shape, form regular concaveconvex shape transparency conductive electrode 205.Equally, get the glass substrate 201 of another cleaning, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on its surface, form regular concaveconvex shape transparency conductive electrode 203.
S27: prepare liquid crystal alignment layer on the surface of transparency conductive electrode 203 and 205;
Adopt spin coating method evenly to apply the polyimide (PI) that a layer thickness is about 80nm on the surface of transparency conductive electrode 203 and 205, and be placed in 260 DEG C baking oven baking 2 hours after take out nature cooling after, adopt liquid crystal panel to prepare special rubbing machine and carry out friction orientation, in two transparency conductive electrodes, form PI liquid crystal alignment layer 206 and 207 respectively.
S28: the micro-microlens fabrication of liquid crystal.
Adopt liquid crystal panel production standard technique, through steps such as frame offset printing brush, baseplate-laminating, perfusion liquid crystal, sealing, liquid crystal reorientations, form complete liquid crystal microlens.
Embodiment three
As shown in Figure 4, the present embodiment for when the surperficial regular concaveconvex shape of described transparent dielectric layer be formed by 3D printing technique time, the preparation method of liquid crystal microlens array, its concrete scheme comprises the following steps:
S31: the transparency carrier (the second transparency carrier) that a cleaning is provided;
(volume ratio is Win-10: DI water=3: 97) glass substrate to be placed in the aqueous solution of cleaning fluid Win-10, the ultrasonic machine cleaning 15min utilizing frequency to be 32KHz, after spray 2min, (volume ratio is Win-41: DI water=5: 95) to be placed in the aqueous solution of cleaning fluid Win-41 again, the ultrasonic machine cleaning 10min utilizing frequency to be 40KHz, after circulation tap water spray rinsing 2min, recycling frequency is that the ultrasonic machine of 28KHz cleans 10min in DI pure water, dries up be placed on that to be incubated more than 30min in 50 DEG C of cleaning ovens for subsequent use through nitrogen gun.
S32: adopt 3D printing technique at described second transparency carrier printout surface pass groove, obtain the transparent dielectric layer surface 304 of described regular concaveconvex shape;
S33: prepare transparent conductive film on transparent dielectric layer 304 surface of regular concaveconvex shape, form regular concaveconvex shape electrode 305;
Preferably, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on transparent dielectric layer 304 surface of regular concaveconvex shape, form regular concaveconvex shape transparency conductive electrode 305.Equally, get the glass substrate 301 of another cleaning, adopt magnetron sputtering to prepare the ITO transparent conductive film that thickness is 300nm on its surface, form regular concaveconvex shape transparency conductive electrode 303.
S34: prepare liquid crystal alignment layer on the surface of transparency conductive electrode 303 and 305;
Adopt spin coating method evenly to apply the polyimide (PI) that a layer thickness is about 80nm on the surface of transparency conductive electrode 303 and 305, and be placed in 260 DEG C baking oven baking 2 hours after take out nature cooling after, adopt liquid crystal panel to prepare special rubbing machine and carry out friction orientation, in two transparency conductive electrodes, form PI liquid crystal alignment layer 306 and 307 respectively.
S35: prepared by liquid crystal microlens.
Adopt liquid crystal panel production standard technique, through steps such as frame offset printing brush, baseplate-laminating, perfusion liquid crystal, sealing, liquid crystal reorientations, form complete liquid crystal microlens.
Above-listed preferred embodiment; the object, technical solutions and advantages of the present invention are further described; be understood that; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention; within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a liquid crystal microlens array, is characterized in that, comprising:
One second transparency carrier;
One transparent dielectric layer, is arranged at above described second transparency carrier, and described transparent dielectric layer upper surface all has a recess corresponding to each lenticule region;
One second transparent conductive film, is arranged at above described transparent dielectric layer, and has the recess identical with described transparent dielectric layer upper surface;
One second both alignment layers, is arranged at above described second transparent conductive film, and described second both alignment layers upper surface is parallel with described second transparency carrier;
One liquid crystal layer, is arranged at above described second both alignment layers;
One first both alignment layers, is arranged at above described liquid crystal layer;
One first transparent conductive film, is arranged at above described first both alignment layers;
One first transparency carrier, is arranged at above described first transparent conductive film.
2. a kind of liquid crystal microlens array according to claim 1, is characterized in that: described first transparency carrier and the second transparency carrier are clear glass, transparent inorganic material or transparent organic polymer material.
3. a kind of liquid crystal microlens array according to claim 1, is characterized in that: the shape of described liquid crystal microlens is circular or regular polygon.
4. a kind of liquid crystal microlens array according to claim 1, is characterized in that: described first transparent conductive film and the second transparent conductive film are the indium tin oxide films, metal doped zinc oxide film, metal-graphite alkene or the metal-carbon pipe laminated film that adopt vacuum coating or spraying technology to be formed.
5. a kind of liquid crystal microlens array according to claim 1, is characterized in that: described first both alignment layers and the second both alignment layers stand friction treatment, and frictional direction is consistent.
6. a preparation method for liquid crystal microlens array as claimed in claim 1, is characterized in that, the making of described second transparent conductive film comprises the following steps:
S11: the Si substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
S12: with described aperture grating for mask, adopts potassium hydroxide solution, at described Si substrate surface anisotropic etching pass groove;
S13: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S14: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned over smooth for described silicon rubber negative norm plate on described transparent dielectric layer, apply a predetermined pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S15: described silicon rubber negative norm plate is separated with described transparent dielectric layer;
S16: at described transparent dielectric layer surface preparation the second transparent conductive film.
7. a preparation method for liquid crystal microlens array as claimed in claim 1, is characterized in that, the making of described second transparent conductive film comprises the following steps:
S21: the glass substrate of a cleaning is provided and adopts photoetching to make aperture grating on its surface;
S22: with described aperture grating for mask, adopts hydrofluorite and ammonium fluoride mixed solution, at described glass baseplate surface isotropic etching pass groove;
S23: adopt silicon rubber to prepare the silicon rubber negative norm plate of described pass groove;
S24: the second transparency carrier that a cleaning is provided, at its surface uniform coating layer of transparent dielectric layer, and be positioned on described transparent dielectric layer by smooth for described silicon rubber negative norm plate, apply certain pressure, adopt the method for heating or UV-irradiation that described transparent dielectric layer is solidified;
S25: described silicon rubber negative norm plate is separated with described transparent dielectric layer;
S26: at described transparent dielectric layer surface preparation the second transparent conductive film.
8. a preparation method for liquid crystal microlens array as claimed in claim 1, is characterized in that, the making of described second transparent conductive film comprises the following steps:
S31: the second transparency carrier that a cleaning is provided;
S32: adopt 3D printing technique at described second transparency carrier printout surface pass groove, obtains the transparent dielectric layer surface with described recess;
S33: at described transparent dielectric layer surface preparation the second transparent conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410115949.6A CN104252081A (en) | 2014-03-26 | 2014-03-26 | Liquid crystal micro-lens array and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108646423A (en) * | 2018-06-25 | 2018-10-12 | 福州大学 | Polarization spectro is multiplexed film manufacturing method and applies its composite backlight |
| CN109782496A (en) * | 2017-11-13 | 2019-05-21 | 黑芝麻国际控股有限公司 | The unrelated liquid crystal microlens array of the polarization of electric tunable |
| CN111190315A (en) * | 2018-11-14 | 2020-05-22 | 成都微晶景泰科技有限公司 | Lens array image conversion device and imaging apparatus |
| CN112538608A (en) * | 2020-12-23 | 2021-03-23 | 武昌理工学院 | Preparation method of three-focus liquid crystal micro-lens array for large-field-depth light field camera |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109782496A (en) * | 2017-11-13 | 2019-05-21 | 黑芝麻国际控股有限公司 | The unrelated liquid crystal microlens array of the polarization of electric tunable |
| CN109782496B (en) * | 2017-11-13 | 2022-02-22 | 黑芝麻智能科技有限公司 | Electrically tunable polarization independent liquid crystal microlens array |
| CN108646423A (en) * | 2018-06-25 | 2018-10-12 | 福州大学 | Polarization spectro is multiplexed film manufacturing method and applies its composite backlight |
| CN108646423B (en) * | 2018-06-25 | 2020-11-03 | 福州大学 | Polarization splitting multiplexing film manufacturing method and multiplexing type backlight source using same |
| CN111190315A (en) * | 2018-11-14 | 2020-05-22 | 成都微晶景泰科技有限公司 | Lens array image conversion device and imaging apparatus |
| CN112538608A (en) * | 2020-12-23 | 2021-03-23 | 武昌理工学院 | Preparation method of three-focus liquid crystal micro-lens array for large-field-depth light field camera |
| CN112538608B (en) * | 2020-12-23 | 2022-10-04 | 武昌理工学院 | Preparation method of three-focus liquid crystal micro-lens array for large-field-depth light field camera |
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