CN115101440B - Equipment for manufacturing packaging substrate of power electronic component - Google Patents
Equipment for manufacturing packaging substrate of power electronic component Download PDFInfo
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- CN115101440B CN115101440B CN202210635121.8A CN202210635121A CN115101440B CN 115101440 B CN115101440 B CN 115101440B CN 202210635121 A CN202210635121 A CN 202210635121A CN 115101440 B CN115101440 B CN 115101440B
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- workbench
- guide rail
- adhesive tape
- light source
- fixedly connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Abstract
The invention discloses equipment for manufacturing a packaging substrate of a power electronic component, which comprises a guide rail, a photo-curing resin applicator, laser equipment, a flushing water pipe, an ultraviolet light source, an adhesive tape, a cutting machine and a workbench, wherein the guide rail is connected with the workbench in a sliding manner, the photo-curing resin applicator and the laser equipment are fixed in a first working area, the cutting machine is arranged outside the guide rail, the flushing water pipe and the ultraviolet light source are fixed in a fourth working area, the upper surface of the workbench is symmetrically and fixedly connected with a stress relieving device, the adhesive tape is clamped and fixed between the stress relieving device and the workbench, the positioning in cutting is realized through a reciprocating mechanism and a stepping mechanism arranged inside the workbench, the product quality is ensured, and the processing efficiency of the packaging substrate is improved and the positioning deviation caused by manual movement is avoided by arranging all working procedures on the guide rail.
Description
Technical Field
The invention belongs to the technical field related to packaging substrates, and particularly relates to equipment for manufacturing a packaging substrate of a power electronic component.
Background
The packaging substrate is a carrier for packaging the semiconductor chip, and can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip, so as to realize the purposes of multi-pin, reduction of the volume of a packaging product, improvement of electric performance and heat dissipation, and ultrahigh density or multi-chip modularization. In the package substrate manufacturing process, a plurality of devices are arranged in a matrix on an electrode plate having a plurality of connection terminals corresponding to the connection terminals of the devices and having a lattice shape, and the electrode plate and the devices are integrated by a resin layer obtained by potting the resin from the surface of the devices, thereby forming a package substrate. The package substrate is cut along the four sides of the lattice where the devices are located, thereby dividing the individually packaged devices.
In the existing packaging substrate manufacturing process, the packaging substrate is separated by a cutting device with a cutting tool, cutting and positioning are carried out by means of a cutting scheduled line of an imaging component on the cutting device and the surface of the packaging substrate (for example, refer to patent document 1 and patent document 2), in addition, in the packaging substrate manufacturing process, a plurality of working procedures are needed, the packaging substrate is moved by means of manual matching machinery, and the positions of the packaging substrate and equipment are calibrated before each working procedure starts, the accuracy of the positioning mode cannot be ensured, so that a packaging device with smaller volume needs to be subjected to secondary screening processing (for example, refer to patent document 3), the production efficiency is lower due to the fact that the plurality of positioning procedures are carried out, meanwhile, the packaging substrate is required to be reduced in volume and divided accurately continuously due to the fact that electrical equipment such as a telephone and a computer is pursued increasingly, and the traditional working procedure manufacturing process cannot meet the requirements in terms of high efficiency and product quality.
Patent document 1: method for dividing CN201510817986.6 packaging substrate
Patent document 2: processing method of CN201310310927.0 packaging substrate
Patent document 3: cn201610074178.X a method for manufacturing and processing a package substrate based on a collapsible process control.
Disclosure of Invention
The present invention is directed to an apparatus for manufacturing a power electronic component package substrate, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a power electronic components encapsulation base plate manufacture equipment, includes guide rail, light-cured resin coating ware, laser equipment, wash pipe, ultraviolet light source, adhesive tape, cutting machine, workstation, guide rail sliding connection has the workstation, the guide rail is square to be fixed subaerial and regard its four limit as the reference to divide into four work areas, light-cured resin coating ware anticlockwise slip respectively carries out S1 to S7 step in order through four areas on the guide rail, its characterized in that: the light-cured resin applicator and the laser device are fixed in a first working area, the cutting machine is arranged on the outer side of the guide rail, the flushing water pipe and the ultraviolet light source are fixed in a fourth working area, the upper surface of the workbench is symmetrically and fixedly connected with a stress relieving device, an adhesive tape is clamped and fixed between the stress relieving device and the workbench, and a reciprocating mechanism and a stepping mechanism are arranged inside the workbench.
Preferably, the bottom of the workbench is provided with a sliding block, the workbench and the guide rail are in sliding connection through the sliding block, a base is fixedly connected to the upper side of the sliding block, a base is arranged at the top of the workbench, supporting rods are symmetrically arranged on four corners of the lower surface of the base, the base is fixedly connected with the base through the supporting rods, and a working panel is movably arranged on the upper surface of the base.
Preferably, a motor case is installed at the center of the upper surface of the workbench, the sliding block penetrates through the base and is controlled by the motor case, a first transmission guide rod is rotationally connected above the motor case, the other end of the first transmission guide rod is rotationally connected with a reciprocating mechanism, the left side of the motor case is rotationally connected with a second transmission guide rod, and the other end of the second transmission guide rod is rotationally connected with a stepping mechanism.
Preferably, the reciprocating mechanism comprises a disc cam, the disc cam is coaxially connected with the first transmission guide rod, the rotation direction of the disc cam is parallel to the upper surface of the base, the end of the disc cam node is rotationally connected with a driven rod, the other end of the driven rod is rotationally connected with a connecting rod, the driven rod is perpendicular to the connecting rod, and the other end of the connecting rod is fixedly connected with the right end of the lower surface of the working panel.
Preferably, the step motion mechanism comprises a limiting plate, the limiting plate is fixedly connected to the left end of the base, the limiting plate is vertically arranged with the base, a limiting bolt is rotatably arranged on the inner side surface of the limiting plate, a driven connecting rod is fixedly connected to the position of the limiting bolt deviating from the circle center, the driven connecting rod is rotatably connected with a second transmission guide rod, a tooth-meshing cam is sleeved on the outer ring of the limiting bolt, the tooth-meshing cam is driven by the limiting bolt to rotate on the inner side surface of the limiting plate, a driven tooth-meshing rack is connected to the upper side of the tooth-meshing cam through tooth meshing, and the driven tooth-meshing rack is fixedly connected to the left end of the working panel.
Preferably, the stress relieving device is totally four and symmetrically fixed on the upper surface of the working panel, the stress relieving device comprises a fixed frame, a limit bolt is arranged at the bottom of the left side of the fixed frame in a penetrating way and extends to the inside of the working panel, the stress relieving device is fixedly connected with the working panel through a limit hole arranged in the limit bolt, a guide chute is arranged at the top of the right side of the fixed frame in a penetrating way, a stress relieving spring is connected in the guide chute in a sliding way, a pressing block is fixedly connected with the other end of the stress relieving spring, the pressing block is pressed on a packaging substrate on the upper surface of the adhesive tape under the compression action of the stress relieving spring and is used for fixing the packaging substrate, the adhesive tape and the packaging substrate on the adhesive tape are subjected to resin solidification and rebound force generated by compression of the stress relieving spring in the guide chute, and the adhesive tape material adopts ultraviolet curing type plastics.
Preferably, the light-cured resin applicator is arranged in parallel with the laser device, the sliding direction of the workbench on the guide rail is taken as a reference, the laser device is placed in front of the light-cured resin applicator, the arrangement direction of the light-cured resin applicator and the laser device is perpendicular to the sliding direction of the guide rail, the brush below the light-cured resin applicator is tangent to the upper surface of the adhesive tape, the light-cured resin applicator adopts light-cured resin, the arrangement height of the laser device is higher than the upper surface of the adhesive tape, and the light source of the laser device adopts a light source matched with the absorption wavelength of the light-cured resin applicator.
Preferably, the cutting machine comprises a cutting tool, the cutting tool is tangential to the upper surface of the adhesive tape, the cutting tool is rotationally connected with a rotating shaft, the other end of the rotating shaft is sleeved with a transmission belt, the transmission belt is rotationally connected with a motor, the cutting machine is arranged on the outer side of the guide rail and can enter a second working area or a third working area along with the sliding of the workbench, and the cutting direction of the cutting tool is always parallel to the light-cured resin applicator.
Preferably, the ultraviolet light source is arranged in a direction perpendicular to the light-cured resin applicator, the ultraviolet light source is arranged at a height higher than the upper surface of the stress relieving device, the sliding direction of the workbench on the guide rail is taken as a reference, the ultraviolet light source is placed in front of the flushing water pipe, and the ultraviolet light source adopts ultraviolet rays matched with the absorption wavelength of the adhesive tape.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the steps of resin coating, resin solidification, substrate segmentation and washing pickup are carried out by sliding the workbench on the square guide rail into different working areas according to the process sequence, the packaging substrate does not need to be manually moved and positioned for multiple times in the complete manufacturing process, and is always fixed on the upper surface of the adhesive tape, so that the product quality is prevented from being reduced due to inaccurate positioning caused by transferring the packaging substrate among different working procedures, and in addition, the manufacturing efficiency of the packaging substrate is improved in the pipelined manufacturing process.
2. In the cutting process of the packaging substrate, the motor box controls the sliding block to stop moving, the reciprocating mechanism and the stepping mechanism controlled by the motor box in the workbench drive the packaging substrate to carry out cutting positioning respectively, the cutting device does not need to move, after transverse cutting is completed, the cutting device moves synchronously along with the sliding of the workbench to enter a third working area to carry out longitudinal cutting, at the moment, the reciprocating mechanism and the stepping mechanism are utilized again to carry out cutting positioning, the cutting positioning is not needed through modes such as a camera device, a division preset line and the like, the accuracy of cutting processing is improved, and therefore the processing requirement of a miniaturized packaging device is met.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a flow chart showing a power electronics package substrate manufacturing process;
FIG. 3 is a schematic view of the structure of the workbench of the invention;
FIG. 4 is a schematic view of the reciprocating motion of the table;
FIG. 5 is a schematic view of a step motion structure of a table
FIG. 6 is a schematic view of the work table of the present invention in a resin smeared and cured state;
FIG. 7 is a schematic view of a table of the present invention in a cut-and-split state;
FIG. 8 is a schematic view showing a stage of the present invention in a cleaning and ultraviolet irradiation state;
FIG. 9 is an enlarged partial cross-sectional view of FIG. 6 at A;
in the figure: 1. a guide rail; 2. a photo-curable resin applicator; 3. a laser device; 4. a flushing water pipe; 5. an ultraviolet light source; 6. an adhesive tape; 7. a cutting machine; 71. a cutting tool; 72. a rotating shaft; 73. a transmission belt; 74. a motor; 8. a work table; 81. a base; 82. a slide block; 83. a motor case; 84. a first transmission guide rod; 85. a second transmission guide rod; 86. a base station; 87. a support rod; 88. a work panel; 9. a stress relief device; 91. a fixed frame; 92. a guide chute; 93. a stress relief spring; 94. briquetting; 95. a limiting hole; 96. a limit bolt; 10. a reciprocating mechanism; 101. a disc cam; 102. a driven rod; 103. a connecting rod; 11. a step motion mechanism; 111. a driven connecting rod; 112. a tooth cam; 113. a limiting plate; 114. a limit bolt; 115. and a driven rack.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the embodiments of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention.
Referring to fig. 1 to 9, the present invention provides a technical solution: the utility model provides a power electronic components encapsulation base plate manufacturing facility, includes guide rail 1, light curing resin coating ware 2, laser equipment 3, wash pipe 4, ultraviolet light source 5, adhesive tape 6, cutting machine 7, workstation 8, guide rail 1 sliding connection has workstation 8, guide rail 1 is square fixed subaerial and regard its four limit as the reference to divide into four work areas, light curing resin coating ware 2 anticlockwise slip carries out S1 to S7 step through four areas in proper order respectively on guide rail 1, its characterized in that: the light-cured resin applicator 2 and the laser device 3 are fixed in a first working area, the cutting machine 7 is arranged outside the guide rail 1, the flushing water pipe 4 and the ultraviolet light source 5 are fixed in a fourth working area, the upper surface of the workbench 8 is symmetrically and fixedly connected with a stress relieving device 9, an adhesive tape 6 is clamped and fixed between the stress relieving device 9 and the workbench 8, and a reciprocating mechanism 10 and a stepping mechanism 11 are arranged inside the workbench 8.
In order to improve the efficiency of the manufacturing process of the packaging substrate and avoid moving the packaging substrate, a sliding block 82 is arranged at the bottom of the workbench 8, the workbench 8 is in sliding connection with the guide rail 1 through the sliding block 82, a base 81 is fixedly connected above the sliding block 82, a base 86 is arranged at the top of the workbench 8, supporting rods 87 are symmetrically arranged on four corners of the lower surface of the base 86, the base 81 is fixedly connected with the base 86 through the supporting rods 87, and a working panel 88 is movably arranged on the upper surface of the base 86. In addition, the cutting machine 7 comprises a cutting tool 71, the cutting tool 71 is tangential to the upper surface of the adhesive tape 6, the cutting tool 71 is rotationally connected with a rotating shaft 72, the other end of the rotating shaft 72 is sleeved with a transmission belt 73, the transmission belt 73 is rotationally connected with a motor 74, the cutting machine 7 is arranged outside the guide rail 1 and can enter a second working area or a third working area along with the sliding of the workbench 8, and the cutting direction of the cutting tool 71 is always parallel to the photo-curing resin applicator 2.
In order to accurately position the cutting position when the packaging substrate is cut, a motor box 83 is arranged at the center of the upper surface of the workbench 8, a sliding block 82 penetrates through a base 81 and is controlled by the motor box 83, a first transmission guide rod 84 is rotationally connected above the motor box 83, the other end of the first transmission guide rod 84 is rotationally connected with a reciprocating mechanism 10, the left side of the motor box 83 is rotationally connected with a second transmission guide rod 85, and the other end of the second transmission guide rod 85 is rotationally connected with a stepping mechanism 11. The reciprocating mechanism 10 comprises a disc cam 101, the disc cam 101 is coaxially connected with the first transmission guide rod 84, the rotation direction of the disc cam 101 is parallel to the upper surface of the base 81, a driven rod 102 is rotatably connected to the end of a node of the disc cam 101, a connecting rod 103 is rotatably connected to the other end of the driven rod 102, the driven rod 102 is perpendicular to the connecting rod 103, and the other end of the connecting rod 103 is fixedly connected to the right end of the lower surface of the working panel 88. The step motion mechanism 11 comprises a limit plate 113, the limit plate 113 is fixedly connected to the left end of the base 81, the limit plate 113 is perpendicular to the base 81, a limit bolt 114 is rotatably arranged on the inner side surface of the limit plate 113, a driven connecting rod 111 is fixedly connected to the position, deviating from the circle center, of the limit bolt 114, the driven connecting rod 111 is rotatably connected with the second transmission guide rod 85, a tooth cam 112 is sleeved on the outer ring of the limit bolt 114, the tooth cam 112 is driven by the limit bolt 114 to rotate on the inner side surface of the limit plate 113, a driven tooth rack 115 is connected above the tooth cam 112 through tooth engagement, and the driven tooth rack 115 is fixedly connected to the left end of the working panel 88.
In order to eliminate internal stress generated during resin solidification and cutting processing of the packaging substrate, four stress elimination devices 9 are arranged and symmetrically fixed on the upper surface of the working panel 88, each stress elimination device 9 comprises a fixed frame 91, a limit bolt 96 is arranged at the bottom of the left side of the fixed frame 91 in a penetrating mode and extends into the working panel 88, the stress elimination devices 9 and the working panel 88 are fixedly connected through limit holes 95 formed in the limit bolts 96, a guide chute 92 is arranged at the top of the right side of the fixed frame 91 in a penetrating mode, a stress elimination spring 93 is connected in the guide chute 92 in a sliding mode, a pressing block 94 is fixedly connected to the other end of the stress elimination spring 93, the pressing block 94 presses the packaging substrate on the upper surface of the adhesive tape 6 under the compression effect of the stress elimination spring 93 and fixes the pressing block, and warping stress generated during cutting processing of the adhesive tape 6 and the packaging substrate on the adhesive tape is offset by rebound force generated by compression of the stress elimination spring 93 in the guide chute 92, and the adhesive tape 6 is made of ultraviolet curing type plastics.
In order to improve the manufacturing efficiency of the packaging substrate, in the packaging resin layer process, a photo-curing resin applicator 2 and a laser device 3 are arranged, the sliding direction of a workbench 8 on a guide rail 1 is taken as a reference, the laser device 3 is placed in front of the photo-curing resin applicator 2, the arrangement direction of the photo-curing resin applicator 2 and the laser device 3 is perpendicular to the sliding direction of the guide rail 1, a brush below the photo-curing resin applicator 2 is tangent to the upper surface of an adhesive tape 6, the photo-curing resin applicator 2 adopts photo-curing resin, the laser device 3 is arranged at a height higher than the upper surface of the adhesive tape 6, and a light source matched with the absorption wavelength of the photo-curing resin applicator 2 is adopted as a light source of the laser device 3.
In order to prevent the encapsulated devices from scattering during the cutting process, an ultraviolet light source 5 is arranged, a flushing water pipe 4 is arranged for cleaning the cut waste materials and facilitating the picking up of the encapsulated devices, the arrangement direction of the ultraviolet light source 5 is vertical to the photo-curing resin applicator 2, the arrangement height of the ultraviolet light source 5 is higher than the upper surface of the stress relieving device 9, the sliding direction of the workbench 8 on the guide rail 1 is taken as a reference, the ultraviolet light source 5 is arranged in front of the flushing water pipe 4, and the ultraviolet light source 5 adopts ultraviolet light with the absorption wavelength matched with that of the adhesive tape 6.
When the automatic cutting machine is used, the guide rail 1 is arranged according to the field environment and the process requirements, four sides of the guide rail 1 are used as references to divide four working areas, the photo-curing resin applicator 2 and the laser device 3 are parallelly fixed in the first working area, the flushing water pipe 4 and the ultraviolet light source 5 are fixed in the fourth working area, the cutting machine 7 is arranged on the outer side of the guide rail 1 in the second working area, wherein the photo-curing resin applicator 2, the laser device 3 and the ultraviolet light source 5 are perpendicular to the sliding direction of the workbench 8, devices required by a process are arranged, a sliding groove is formed in the guide rail 1, the sliding block 82 at the bottom of the workbench 8 is arranged in the sliding groove in the guide rail 1, so that the sliding block 82 is positioned at the starting end of the first working area, the existing production line is used for conveying materials, namely, a set of simple AGV trolley is arranged in the sliding block 82 to drive the workbench 8 to move along the sliding groove of the guide rail 1, and the driving device is controlled by the motor box 83, and the equipment installation shown in fig. 1 is completed.
The ultraviolet curing adhesive tape 6 is placed on the upper surface of the working panel 88, at this time, the adhesive tape 6 is not irradiated with ultraviolet rays matched with the absorption wavelength thereof so as to maintain the adhesiveness, the electrode plate to be processed is horizontally placed in the center of the adhesive tape 6 so that the two are fixedly connected through the adhesion, and the two are fixed on the upper surface of the working panel 88 through the stress relieving device 9, and the motor box 83 is opened to control the power supply to complete the preparation work. The stress relieving device 9 is fixed with the working panel 88 through a limit bolt 96 fixed in a limit hole 95, and then the stress of the electrode plate in the processes of resin solidification and cutting processing can be counteracted by a stress relieving spring 93 compressed in a guide chute 92 through a pressing block 94, so that the packaging substrate is always horizontal, and the inaccuracy in processing caused by the stress and the damage to the packaging substrate are avoided.
After the package substrate is manufactured, the motor box 83 drives the sliding block 82 to slide on the guide rail 1 of the first working area to reach the position shown in fig. 6, at the moment, the control power supply of the photo-curing resin applicator 2 is turned on to brush photo-curing resin on the surface of the electrode plate to be processed through the brush tangential to the upper surface of the electrode plate, meanwhile, the workbench 8 continues to slide on the guide rail 1 to enable the photo-curing resin applicator 2 to uniformly coat the photo-curing resin on the surface of the electrode plate to finish a resin coating step S1, wherein the resin coating area is smaller than the surface area of the electrode plate so as to leave a tool withdrawal groove for cutting processing, the coated electrode plate continues to slide along with the workbench 8 to pass under the laser device 3, the power supply switch of the laser device 3 is turned on to release ultraviolet rays matched with the absorption wavelength of the coated photo-curing resin, and the coated resin is uniformly irradiated on the surface of the electrode plate to enable the coated resin to be solidified to form a resin layer, and the resin solidification step S2 is finished.
Then the motor box 83 continues to drive the sliding block 82 to enable the workbench 8 to slide on the guide rail 1 to enter the second working area until the workbench 8 stops when the workbench is positioned as shown in fig. 7, at the moment, the cutting tool 71 is tangent to the upper surface of the adhesive tape 6, the motor 74 is started to drive the driving belt 73 to rotate so as to drive the rotating shaft 72 to rotate, the rotating shaft 72 drives the cutting tool 71 to perform the transverse cutting step S3, the relative position of the cutting tool 7 is kept unchanged, the motor 74 is closed after the transverse cutting step S3 is completed through the reciprocating mechanism 10 and the stepping mechanism 11 in the workbench 8, the motor box 83 drives the sliding block 82 to enable the workbench 8 to slide on the guide rail 1 to enter the third working area, the cutting tool 7 synchronously moves to the outer side of the third working area along with the movement of the workbench 8, the cutting tool 71 is kept parallel to the photo-curable resin applicator 2 all the time in the process, after the relative position of the cutting tool 7 is kept unchanged by stopping moving the cutting tool 7 and the workbench 8, the relative position of the cutting tool 7 is kept unchanged after the relative position of the workbench 8 is reached, the cutting positioning is performed through the reciprocating mechanism 10 and the stepping mechanism 11 in the workbench 8, the longitudinal cutting step S4 is completed, the motor 74 is closed and the initial position of the cutting tool 7 is moved back to the original position after the longitudinal cutting step S4 is completed.
The principle of cutting and positioning is as follows: the motor case 83 controls the sliding block 82 to stop sliding and then drives the first transmission guide rod 84 rotationally connected with the sliding block 82 to rotate so as to drive the disc cam 101 to rotate in the direction parallel to the surface of the base 81, the disc cam 101 drives the driven rod 102 rotationally connected with the end of the node to do one-time telescopic motion in the process of rotating one circle, the connecting rod 103 rotationally connected with the other end of the driven rod 102 is driven by one-time telescopic motion of the driven rod 102 to do one-time reciprocating motion in the sliding direction of the workbench 8, so that the working panel 88 fixedly connected with the connecting rod 103 does one-time reciprocating motion on the upper surface of the base 86 along the sliding direction of the workbench 8, the cutting tool 71 aligned with the center line of the first row lattice and the second row lattice of the surface of the packaging substrate completes one-time transverse cutting of the packaging substrate in the process, then the motor case 83 drives the second transmission guide rod 85 rotationally connected with the second transmission guide rod 85 to rotate one circle, the second transmission guide rod 85 drives the driven connecting rod 111 to rotate for one circle so that the limit bolt 114 fixedly connected with the driven connecting rod 111 performs one circle movement on the inner side surface of the limit plate 113, the tooth-meshing cam 112 sleeved with the outer ring of the limit bolt 114 performs one circle movement under the drive of the limit bolt 114, the driven tooth-meshing rack 115 above the tooth-meshing cam 112 performs one step movement with the tooth-meshing cam 112 when the tooth-meshing cam 112 moves to the top end, the driven tooth-meshing rack 115 drives the working panel 88 fixedly connected with the driven tooth-meshing rack to perform one step movement on the upper surface of the base 86 so that the cutting tool 71 is aligned with the center lines of the second grid and the third grid on the surface of the packaging substrate, then the operation is repeated until the transverse division of all grids of the packaging substrate is completed, the cutting tool 71 does not change the cutting direction after entering the third working area, and the working platform 8 performs ninety degree steering in the sliding process, the package substrate can be divided longitudinally by repeating the above operations.
Then the workbench 8 continues to slide on the guide rail 1 to reach a fourth working area until the position shown in fig. 8, at this time, a valve of the flushing water pipe 4 is opened to enable the washing liquid to flow through the slit of the divided packaging substrate to finish the step S5 of flushing the waste, after the cutting waste is flushed away, a power switch of the ultraviolet light source 5 is turned on to enable the ultraviolet light source 5 to release ultraviolet light matched with the absorption wavelength of the adhesive tape 6, the adhesiveness of the surface of the adhesive tape 6 is reduced under the uniform irradiation of the ultraviolet light, so that the divided packaging substrate floats on the surface of the adhesive tape 6 to finish the step S6 of irradiating the ultraviolet light, and at this time, the step S7 of picking up the substrate can be performed to obtain the processed packaging substrate.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. A power electronics package substrate manufacturing apparatus, characterized in that: the novel high-precision laser cutting machine comprises a guide rail (1), a light-cured resin applicator (2), laser equipment (3), a flushing water pipe (4), an ultraviolet light source (5), an adhesive tape (6), a cutting machine (7) and a workbench (8), wherein the guide rail (1) is connected with the workbench (8) in a sliding mode, the guide rail (1) is fixed on the ground in a square mode and is divided into four working areas by taking four sides of the guide rail as references, the light-cured resin applicator (2) and the laser equipment (3) are fixed in a first working area, the cutting machine (7) is arranged on the outer side of the guide rail (1), the flushing water pipe (4) and the ultraviolet light source (5) are fixed in a fourth working area, the upper surface of the workbench (8) is symmetrically and fixedly connected with a stress relieving device (9), the adhesive tape (6) is clamped and fixed between the workbench (8), and a reciprocating mechanism (10) and a stepping mechanism (11) are arranged inside the workbench (8).
The automatic lifting device is characterized in that a sliding block (82) is arranged at the bottom of the workbench (8), the workbench (8) is in sliding connection with the guide rail (1) through the sliding block (82), a base (81) is fixedly connected above the sliding block (82), a base table (86) is arranged at the top of the workbench (8), supporting rods (87) are symmetrically arranged at four corners of the lower surface of the base table (86), the base (81) is fixedly connected with the base table (86) through the supporting rods (87), and a working panel (88) is movably arranged on the upper surface of the base table (86);
a motor box (83) is arranged at the center of the upper surface of the workbench (8), the sliding block (82) penetrates through the base (81) and is controlled by the motor box (83), a first transmission guide rod (84) is rotationally connected above the motor box (83), the other end of the first transmission guide rod (84) is rotationally connected with a reciprocating mechanism (10), a second transmission guide rod (85) is rotationally connected to the left side of the motor box (83), and a stepping mechanism (11) is rotationally connected to the other end of the second transmission guide rod (85);
the reciprocating mechanism (10) comprises a disc cam (101), the disc cam (101) is coaxially connected with the first transmission guide rod (84), the rotation direction of the disc cam (101) is parallel to the upper surface of the base (81), a driven rod (102) is rotationally connected to the end of a node of the disc cam (101), a connecting rod (103) is rotationally connected to the other end of the driven rod (102), the driven rod (102) is perpendicular to the connecting rod (103), and the other end of the connecting rod (103) is fixedly connected to the right end of the lower surface of the working panel (88);
the stepping motion mechanism (11) comprises a limiting plate (113), the limiting plate (113) is fixedly connected to the left end of the base (81), the limiting plate (113) is perpendicular to the base (81), a limiting bolt (114) is rotatably arranged on the inner side surface of the limiting plate (113), a driven connecting rod (111) is fixedly connected to the limiting bolt (114) at the position deviating from the circle center, the driven connecting rod (111) is rotatably connected with a second transmission guide rod (85), a tooth-engaging cam (112) is sleeved on the outer ring of the limiting bolt (114), the tooth-engaging cam (112) is driven by the limiting bolt (114) to rotate on the inner side surface of the limiting plate (113), a driven tooth-engaging rack (115) is connected to the upper side of the tooth-engaging cam (112) through tooth engagement, and the driven tooth-engaging rack (115) is fixedly connected to the left end of the working panel (88).
2. The power electronic component package substrate manufacturing apparatus according to claim 1, wherein: the four stress relief devices (9) are symmetrically fixed on the upper surface of the working panel (88), the stress relief devices (9) comprise a fixed frame (91), limit bolts (96) are arranged at the bottom of the left side of the fixed frame (91) in a penetrating mode and extend into the working panel (88), the stress relief devices (9) are fixedly connected with the working panel (88) through limit holes (95) formed in the limit bolts (96), guide sliding grooves (92) are arranged at the top of the right side of the fixed frame (91) in a penetrating mode, stress relief springs (93) are connected inside the guide sliding grooves (92) in a sliding mode, pressing blocks (94) are fixedly connected with the other ends of the stress relief springs (93), the pressing blocks (94) are pressed on the packaging substrate on the upper surface of the adhesive tape (6) under the compression action of the stress relief springs (93) and fix the sealing substrate, and the adhesive tape (6) and the packaging substrate on the adhesive tape are subjected to resin solidification and the stress generated by cutting processing is counteracted by the rebound force generated by the stress relief springs (93) in the guide sliding grooves (92);
the light-cured resin applicator (2) is arranged in parallel with the laser device (3), the working table (8) is used as a reference in the sliding direction on the guide rail (1), the laser device (3) is placed in front of the light-cured resin applicator (2) and the arrangement direction of the light-cured resin applicator (2) and the laser device (3) is perpendicular to the sliding direction of the guide rail (1), a brush below the light-cured resin applicator (2) is tangent to the upper surface of the adhesive tape (6), and the light-cured resin applicator (2) adopts light-cured resin.
3. The power electronic component package substrate manufacturing apparatus according to claim 2, wherein: the adhesive tape (6) is made of ultraviolet curing type plastic.
4. The power electronic component package substrate manufacturing apparatus according to claim 2, wherein: the laser device (3) is arranged at a height higher than the upper surface of the adhesive tape (6), and a light source matched with the absorption wavelength of the photo-curing resin applicator (2) is adopted as a light source of the laser device (3).
5. The power electronic component package substrate manufacturing apparatus according to claim 2, wherein: the cutting machine (7) comprises a cutting tool (71), the cutting tool (71) is tangent to the upper surface of the adhesive tape (6), the cutting tool (71) is rotationally connected with a rotating shaft (72), the other end of the rotating shaft (72) is sleeved with a rotating belt (73), the rotating belt (73) is rotationally connected with a motor (74), the cutting machine (7) is arranged on the outer side of the guide rail (1) and can follow the sliding of the workbench (8) to enter a second working area or a third working area, and the cutting direction of the cutting tool (71) is always parallel to the photocurable resin applicator (2).
6. The power electronic component package substrate manufacturing apparatus according to claim 1, wherein: the ultraviolet light source (5) is arranged in the direction perpendicular to the light-cured resin applicator (2), the ultraviolet light source (5) is arranged at a height higher than the upper surface of the stress relieving device (9), the sliding direction of the workbench (8) on the guide rail (1) is taken as a reference, the ultraviolet light source (5) is placed in front of the flushing water pipe (4), and the ultraviolet light source (5) adopts ultraviolet rays with the absorption wavelength matched with that of the adhesive tape (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210635121.8A CN115101440B (en) | 2022-06-07 | 2022-06-07 | Equipment for manufacturing packaging substrate of power electronic component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210635121.8A CN115101440B (en) | 2022-06-07 | 2022-06-07 | Equipment for manufacturing packaging substrate of power electronic component |
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| Publication Number | Publication Date |
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| CN115101440A CN115101440A (en) | 2022-09-23 |
| CN115101440B true CN115101440B (en) | 2023-06-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5009254B2 (en) * | 2008-08-14 | 2012-08-22 | 株式会社ディスコ | Resin coating equipment |
| JP5373517B2 (en) * | 2009-09-14 | 2013-12-18 | 株式会社ディスコ | Conveying mechanism and processing device |
| JP6004725B2 (en) * | 2012-04-24 | 2016-10-12 | 株式会社ディスコ | Chuck table mechanism of processing equipment |
| JP2018113281A (en) * | 2017-01-06 | 2018-07-19 | 株式会社ディスコ | Processing method of resin package substrate |
| JP7258416B2 (en) * | 2018-12-06 | 2023-04-17 | 株式会社ディスコ | Workpiece processing method, device chip manufacturing method |
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Effective date of registration: 20230602 Address after: 276826, Shandong, Rizhao City, Yantai northbound head Applicant after: RIZHAO POLYTECHNIC Address before: Building 1, No. 60, Kecheng Road, Jiulongpo District, Chongqing 400050 (Chongqing Integrated Circuit Industrial Park) Applicant before: Cheng Yuanxue |
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