CN115079741A - Temperature control device for microfluidic chip - Google Patents
Temperature control device for microfluidic chip Download PDFInfo
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- CN115079741A CN115079741A CN202110268606.3A CN202110268606A CN115079741A CN 115079741 A CN115079741 A CN 115079741A CN 202110268606 A CN202110268606 A CN 202110268606A CN 115079741 A CN115079741 A CN 115079741A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The embodiment of the application provides a microfluid chip temperature control device, includes: the constant temperature component comprises a plurality of constant temperature modules which are arranged at intervals; and the carrier is movably arranged on the constant temperature component and is used for carrying the microfluidic chip. This microfluid chip temperature control device, fluid chip set up on bearing the piece, can set up the constant temperature of every constant temperature module respectively based on the demand of fluid chip to reaction temperature, and it is moving on the constant temperature subassembly to bear the weight of fluid chip to bear the weight of the piece for fluid chip passes through a plurality of constant temperature modules in proper order, can make the microchamber of fluid chip carry out the reaction in different temperatures and realize the amplification of sample. The temperature of the constant temperature module is not required to be adjusted again in the sample amplification process, the power of the constant temperature module is not required to be changed, the accuracy of temperature control can be greatly improved, frequent temperature rise and temperature reduction are not required, the time required by temperature regulation can be saved, and the reaction efficiency of the microfluidic chip is greatly improved.
Description
Technical Field
The invention relates to the technical field of molecular biology, in particular to a temperature control device of a microfluid chip.
Background
The microfluid chip is an emerging technology in the fields of medicine, biology, life science and the like, which is an emerging technology for sample mixing, separation, product detection and analysis, wherein basic operations such as sample preparation, biochemical reaction, liquid separation, detection and analysis and the like involved in chemistry and biology are integrated on a chip with the size of a few square centimeters so as to complete different biochemical reactions.
In the specific working process, the fluid chip puts the sample solution into the micro chamber, and the heating device repeatedly heats and cools the sample solution to provide different reaction temperatures for the micro chamber, so that the amplification of the sample is realized. However, in the prior art, the heating device needs to be heated and cooled frequently, so that on one hand, inaccurate temperature control is caused, and the sample amplification efficiency is low; on the other hand, the time required for temperature rise and temperature reduction is long, so that the amplification efficiency of the sample is low.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
In view of the above, according to an embodiment of the present application, a microfluidic chip temperature control device is provided, including: the constant temperature component comprises a plurality of constant temperature modules which are arranged at intervals; and the carrier is movably arranged on the constant temperature component and is used for carrying the microfluidic chip.
In a first possible implementation of the embodiment of the application, the carrier is rotatably arranged on the thermostatic assembly.
In a second possible implementation manner of the embodiment of the present application, the microfluidic chip temperature control device further includes: one end of the rotating shaft is connected with the bearing part, and the other end of the rotating shaft is connected with the constant temperature component.
In a third possible implementation manner of the embodiment of the present application, the microfluidic chip temperature control device further includes: the slide rail sets up on the constant temperature component, and it sets up to hold carrier through the slide rail slip on the constant temperature component.
In a fourth possible implementation manner of the embodiment of the present application, the bearing member is provided with a bearing through hole, and the microfluidic chip can be sunk in the bearing through hole.
In a fifth possible implementation manner of the embodiment of the application, the carrier is provided with a heat conduction portion, the microfluidic chip is configured to be disposed on one side of the heat conduction portion, and the other side of the heat conduction portion is configured to abut against one of the plurality of thermostatic modules.
In a sixth possible implementation manner of the embodiment of the present application, the constant temperature component further includes: and the constant temperature modules are arranged on the support at intervals.
In a seventh possible implementation of the embodiment of the present application, the support includes a thermal insulation layer, and the plurality of constant temperature modules are arranged at intervals on the thermal insulation layer.
In an eighth possible implementation manner of the embodiment of the present application, at least a part of the plurality of constant temperature modules includes: a housing; a heating member disposed within the housing; the case is made of at least one of copper, aluminum, platinum, and nickel.
In a ninth possible implementation manner of the embodiment of the present application, at least a part of the plurality of constant temperature modules includes: a substrate; and a conductive film disposed on the substrate.
Compared with the prior art, the invention at least comprises the following beneficial effects: the embodiment of the application provides a microfluid chip temperature control device, through the setting of bearing the piece with the constant temperature subassembly, in the course of the work, can set up the fluid chip on bearing the piece, based on the demand of fluid chip to reaction temperature, set up the constant temperature of every constant temperature module respectively, it is moving on the constant temperature subassembly to bear the weight of the piece and bear the weight of the fluid chip, make the fluid chip pass through a plurality of constant temperature modules in proper order, can make the microchamber of fluid chip react in different temperatures, can make the microfluid circulation relapse through a plurality of constant temperature modules through bearing the piece repetitive motion, realize the amplification of sample. Need not to adjust the temperature of constant temperature module once more at the sample amplification in-process, need not to change the power of constant temperature module, can improve the accuracy of control by temperature change greatly, need not frequently to heat up simultaneously and cool down, can save the required time of frequent regulation temperature, and then improve microfluid chip's reaction efficiency.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a microfluidic chip temperature control device according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a microfluidic chip temperature control device according to yet another embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a thermostatic assembly of a microfluidic chip temperature control device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a carrier of a microfluidic chip temperature control device according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a carrier of a microfluidic chip temperature control device according to another embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a microfluidic chip according to another embodiment provided in the present application.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 6 is:
the device comprises a constant temperature module 1, a bearing part 2, a rotating shaft 3, a sliding rail 4, a bearing through hole 5, a heat conducting part 6, a supporting part 7 and a microfluid chip 8.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be described in further detail below with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
As shown in fig. 1 and 2, one embodiment of the present invention provides a microfluidic chip temperature control device, including: the constant temperature component comprises a plurality of constant temperature modules 1, and the constant temperature modules 1 are arranged at intervals; a carrier 2, the carrier 2 being movably arranged on the thermostatic assembly, the carrier 2 being for carrying a microfluidic chip 8.
The embodiment of the application provides a microfluid chip temperature control device, through the setting of bearing parts 2 with the constant temperature subassembly, in the course of the work, can set up microfluid chip 8 on bearing parts 2, based on microfluid chip 8 is to reaction temperature's demand, set up the constant temperature of every constant temperature module 1 respectively, bear parts 2 and bear microfluid chip 8 and move on the constant temperature subassembly, make microfluid chip 8 pass through a plurality of constant temperature modules 1 in proper order, can make microfluid chip 8's microchamber react in different temperatures, can make the microfluid circulation relapse through a plurality of constant temperature modules 1 through bearing parts 2 repetitive movement, realize the increase of sample. Need not to adjust the temperature of constant temperature module 1 once more at the sample amplification in-process, need not to change the power of constant temperature module 1, can improve the accuracy of control by temperature change greatly, need not frequently to heat up simultaneously and cool down, can save the required time of frequent regulation temperature, can improve microfluid chip 8's reaction efficiency.
As shown in fig. 6, taking the amplification of DeoxyriboNucleic Acid (DNA) by the microfluidic chip 8 as an example, at least one of the plurality of constant temperature modules 1 is a first constant temperature module, at least one of the plurality of constant temperature modules 1 is a second constant temperature module, and at least one of the plurality of constant temperature modules 1 is a third constant temperature module. The constant temperature of the first constant temperature module is in a high-temperature denaturation temperature zone, the constant temperature of the second constant temperature module is in a low-temperature annealing temperature zone, and the constant temperature of the third constant temperature module is in a pairing amplification temperature zone. After a sample is input into a microchamber of the microfluidic chip 8, the microfluidic chip 8 is arranged on the bearing piece 2, and the bearing piece 2 moves on the constant temperature component, so that the microfluidic chip 8 sequentially passes through the first constant temperature module, the second constant temperature module and the third constant temperature module. When the micro-fluid chip 8 is positioned above or near the first constant temperature module, the sample in the micro-chamber is in a high-temperature denaturation temperature zone, DNA in the sample is melted into a single strand, the micro-fluid chip 8 moves to the second temperature module through the bearing piece 2, the sample can be subjected to low-temperature annealing in the low-temperature annealing temperature zone, then the micro-fluid chip 8 moves to the third constant temperature module through the bearing piece 2, the sample can be melted into the single strand DNA in the pairing amplification temperature zone, the single strand DNA can be paired through a primer in the sample and a template in a base complementation mode, so that the DNA double strand synthesis can realize selective in-vitro half-retention replication of double strand DNA fragments, thus realizing one-time amplification of the DNA, driving the micro-fluid chip 8 to reciprocate among the first constant temperature module, the second constant temperature module and the third constant temperature module through the bearing piece 2, realizing multiple amplification, and generating millions of DNA fragments after 25-30 cycles through the mode, thereby rapidly achieving the purpose of amplifying a large amount of template DNA. The operation mode and the working power of the first constant temperature module, the second constant temperature module and the third constant temperature module are not required to be adjusted for multiple times in the whole circulation process, so that the temperature control is more accurate, frequent temperature rise and temperature reduction are not required, the time for temperature adjustment is not required to wait in the DNA amplification process, and the amplification efficiency can be greatly improved.
Wherein the constant temperature of the high-temperature denaturation temperature zone is 90-95 ℃, the constant temperature of the low-temperature annealing temperature zone is 55-60 ℃, and the constant temperature of the paired amplification temperature zone is 70-72 ℃.
In some examples, the microfluidic chip temperature control device may further include a positioning member and a positioning hole, and the positioning member may be disposed on each of the thermostatic modules 1. One side of the bearing part 2 is provided with a bearing area for bearing the microfluidic chip, the positioning hole is formed in the other side of the bearing part 2, and the positioning part can be clamped in the positioning hole. When bearing piece 2 moves for the constant temperature subassembly, the microfluid chip is directly over constant temperature module 1, the setting element can be pegged graft in the locating hole, can play the fixed effect that bears piece 2, makes microfluid chip 8 be directly over constant temperature module 1 under the circumstances of not receiving external force. When an external force is applied to the bearing member 2, so that the bearing member 2 overcomes the resistance of the positioning member, the bearing member 2 can continue to drive the microfluidic chip 8 to move, so that the microfluidic chip 8 moves right above the other constant temperature modules 1. So set up the location of being convenient for microfluid chip 8, constant temperature module 1 can carry out the heat transfer with microfluid chip 8 better.
In some examples, the positioning hole is formed with a gentle slope on the periphery thereof, so that the positioning member is inserted into the positioning hole during the movement of the carrier relative to the thermostatic assembly, and the positioning member can be separated from the positioning hole when an external force is applied to the carrier 2.
In some examples, the microfluidic chip temperature control device may further include a first magnetic member and a second magnetic member, the first magnetic member is attracted to the second magnetic member, the first magnetic member is disposed on the thermostatic assembly, the second magnetic member is disposed on the carrier 2, and when the first magnetic member is attracted to the second magnetic member, that is, the second magnetic member is located above the first magnetic member, the microfluidic chip 8 on the carrier 2 is located directly above one of the plurality of thermostatic modules 1. So set up the location of being convenient for microfluid chip 8, constant temperature module 1 can carry out the heat transfer with microfluid chip 8 better.
In some examples, the area of the heating surface of each thermostatic cartridge 1 may be slightly larger than the surface of the microfluidic chip 8, so that the thermostatic cartridge 1 can regulate the temperature of the microchamber within the microfluidic chip 8 more quickly when the microfluidic chip 8 is on the thermostatic cartridge 1.
As shown in fig. 1, in some examples, the carrier 2 is rotatably disposed on the thermostatic assembly.
As shown in fig. 1, rotationally set up on the constant temperature component through holding carrier 2, microfluid chip 8 can set up in the top that holds carrier 2, rotate for the constant temperature component through holding carrier 2 and can make microfluid chip 8 loop through a plurality of warm areas for microfluid chip 8, make the temperature change that the greenhouse in the microfluid chip 8 can realize the abrupt change, thereby avoid because the time waste that heating and refrigerated circulation process lead to, and then shorten 8 samples of microfluid chip and expand the required time greatly.
As shown in fig. 1, in some examples, the microfluidic chip temperature control device further comprises: and one end of the rotating shaft 3 is connected to the bearing part 2, and the other end of the rotating shaft 3 is connected to the constant temperature component.
As shown in fig. 1, one end of the rotating shaft 3 is connected to the carrier 2 and the other end is connected to the temperature control module by the rotating shaft 3, so that the carrier 2 can rotate relative to the thermostatic module, and the microfluidic chip 8 disposed on the carrier 2 can sequentially pass through the plurality of thermostatic modules 1 of the thermostatic module.
It can be understood that bearings can be arranged at both ends of the rotating shaft 3, and the two bearings are respectively embedded in the bearing member 2 and the thermostatic assembly.
As shown in fig. 3, in some examples, the plurality of thermostatic modules 1 may be arranged in a circumferential manner, so as to facilitate heat exchange between the microfluidic chip 8 disposed on the carrier 2 and the plurality of thermostatic modules 1.
As shown in fig. 2, in some examples, the microfluidic chip temperature control device further comprises: slide rail 4, slide rail 4 sets up on the constant temperature subassembly, and it sets up to carry thing 2 to slide through slide rail 4 on the constant temperature subassembly.
As shown in fig. 2, through the setting of slide rail 4, hold carrier 2 and can slide and set up at slide rail 4, hold carrier 2 and can move on the constant temperature subassembly through slide rail 4 for hold carrier 2 and can pass through a plurality of constant temperature modules 1 in proper order, can make the microchamber of microfluid chip 8 react in different temperatures, can make the microfluid circulation repeated through a plurality of constant temperature modules 1 through holding carrier 2 repetitive motion, realize the amplification of sample. Need not to adjust the temperature of constant temperature module 1 once more at the sample amplification in-process, need not to change the power of constant temperature module 1, can improve the accuracy of control by temperature change greatly, need not frequently to heat up simultaneously and cool down, can improve microfluid chip 8's reaction efficiency greatly.
As shown in fig. 2, in some examples, a plurality of constant temperature modules 1 are arranged in a straight line, the slide rail 4 may be two, two slide rails 4 are distributed on two sides of the plurality of constant temperature modules 1, the bearing member 2 is slidably disposed on the slide rail 4, and the microfluidic chip 8 and the microfluidic chip can be driven to exchange heat by moving the bearing member 2 along the direction of the slide rail 4.
As shown in fig. 4, in some examples, the carrier 2 has a through-hole 5, and the microfluidic chip 8 can be sunk in the through-hole 5.
As shown in fig. 4, the supporting through hole 5 is provided, the microfluidic chip 8 can be sunk in the supporting through hole 5, and in the process that the supporting member 2 moves on the thermostatic assembly, the microfluidic chip 8 can be directly contacted with any one thermostatic module 1 of the plurality of thermostatic modules 1 of the thermostatic assembly, and the microfluidic chip 8 and the thermostatic module 1 perform direct heat exchange, so that the temperature change efficiency of a greenhouse in the microfluidic chip 8 can be further improved, the reaction efficiency of the microfluidic chip 8 can be further improved, and the amplification efficiency of the microfluidic chip 8 can be increased.
In some examples, the hole wall of the through-hole 5 is a slope, the cross section of the through-hole 5 along the height direction of the carrier 2 is trapezoidal, the short side of the trapezoid is disposed toward the thermostatic module, and the length of the short side is smaller than the width of the microfluidic chip. The setting can control the sinking depth of the microfluid chip 8 in the bearing through hole, so that a certain gap is formed between the microfluid chip 8 and the constant temperature module 1, and the microfluid chip 8 is prevented from being worn.
As shown in fig. 2 and 5, in some examples, the carrier 2 is provided with a heat conduction portion 6, the microfluidic chip 8 is configured to be disposed on one side of the heat conduction portion 6, and the other side of the heat conduction portion 6 is configured to abut against one of the plurality of thermostatic modules 1.
As shown in fig. 2 and 5, the heat conducting portion 6 is formed on the carrier 2, the microfluidic chip 8 may be disposed on the heat conducting portion 6, and one side of the heat conducting portion 6 abuts against the thermostatic module 1 and the other side abuts against the microfluidic chip 8 during the movement of the carrier 2 on the thermostatic assembly, so that the temperature changing efficiency of the greenhouse inside the microfluidic chip 8 can be further improved, the reaction efficiency of the microfluidic chip 8 can be further improved, and the amplification efficiency of the microfluidic chip 8 can be increased. Meanwhile, heat exchange is carried out between the microfluid chip 8 and the constant temperature module 1 through the heat conduction part 6, friction between the microfluid chip 8 and the constant temperature module 1 in the process of movement of the microfluid chip 8 relative to the constant temperature assembly can be avoided, abrasion of the microfluid chip 8 can be avoided, and the service life can be prolonged.
It is understood that the heat conducting portion 6 may be made of a material having a large thermal conductivity to improve the heat conducting efficiency, facilitating the heat exchange between the microfluidic chip 8 and the thermostatic module 1.
As shown in fig. 1-3, in some examples, the thermostatic assembly further includes: a support 7 on which a plurality of thermostatic modules 1 are arranged.
In this embodiment, by the arrangement of the support 7, a mounting position is provided for a plurality of thermostatic modules 1, and a plurality of thermostatic modules 1 of the thermostatic assembly can be arranged at intervals on the support 7. In case the microfluidic chip temperature control device comprises a support 7, the carrier 2 is movable relative to the support 7. In case the microfluidic chip temperature control device comprises a spindle 3, one end of the spindle 3 may be connected to the support 7 and the other end to the carrier 2. In case the microfluidic chip temperature control device comprises a slide 4, the slide 4 may be disposed on the support 7, and the carrier 2 is slidably disposed on the slide 4.
In some examples, in the case that the carrier 2 is rotatably disposed in the thermostatic assembly, the microfluidic chip temperature control device may further include a driving member and a driving member controller, wherein an output end of the driving member passes through the supporting member 7 and is connected to a rotating shaft for rotating the carrier 2; the driving piece controller is in communication connection with the driving piece and used for controlling the steering and starting and stopping of the driving piece. The carrier 2 is facilitated to rotate relative to the thermostatic assembly by the provision of the drive member. Through the setting of driving piece controller, can control the rotation and the rotational speed of driving piece, and then can through the steering of control driving piece with open and stop the rotational position who adjusts carrier 2, realize microfluid chip 8's position control.
In some examples, the support 7 comprises an insulating layer on which a plurality of thermostatic modules 1 are arranged at intervals.
In this embodiment, the supporting member 7 includes the insulating layer, and a plurality of constant temperature modules 1 interval sets up on the insulating layer, can avoid taking place the heat transfer between a plurality of constant temperature modules 1 and lead to temperature control inaccurate, has ensured the accuracy of every constant temperature module 1 control by temperature change, and then can provide stable heat source for microfluid chip 8's reaction temperature control is accurate, can improve microfluid chip 8's reaction efficiency and reaction accuracy.
It will be appreciated that the insulating layer may be made of a material having a low thermal conductivity, or the entire support 7 may be made of a material having a low thermal conductivity.
In some examples, at least some of the plurality of thermostatic modules 1 comprise: a housing provided on the support 7; a heating member disposed within the housing; the case is made of at least one of copper, aluminum, platinum and nickel.
In this embodiment, the thermostatic module 1 includes a housing and a heating element, the heating element is disposed in the housing as a heat source, the heat generated by the heating element is transmitted to the housing, and the housing is transmitted to the microfluidic chip 8 through the carrier 2, so as to provide heat for the reaction of the microfluidic chip 8.
In this embodiment, the housing is made of at least one of copper, aluminum, platinum, and nickel, which can improve the heat transfer capability of the housing, facilitating the transfer of thermal energy to the microfluidic chip 8.
In some examples, the heating element may be a resistive wire that generates heat energy when connected to a power source.
In some examples, the thermostatic module 1 may further include: the heat insulation layer, the casing is the heating surface towards one side that holds carrier 2, the heat insulation layer parcel is on other faces except that the heating surface of casing to avoid constant temperature module 1's heat energy to disperse outward, be convenient for make constant temperature module 1's temperature maintain at constant temperature, avoided the operating condition of reciprocating adjustment heating member, make constant temperature module 1's heat energy can distribute to the microfluid chip 8 that holds carrier 2 better, can further improve microfluid chip 8's reaction efficiency.
In some examples, the inner wall of the shell is provided with a caulking groove, and the heating element is embedded in the caulking groove, so that the heating efficiency of the heating element can be improved.
In some examples, the thermostat module 1 may further include a temperature sensor for detecting a temperature of the housing, and a controller communicatively connected to the temperature sensor and the heating element, and may set a temperature threshold for the temperature sensor during use, and control the heating element to stop heating or reduce the operation power of the heating element when the temperature of the housing exceeds the temperature threshold. When the temperature of the shell is lower than the temperature threshold value, the controller controls the heating element to start heating or increases the working power of the heating element.
In some examples, at least some of the plurality of thermostatic modules 1 comprise: a base disposed on the support 7; and a conductive film disposed on the substrate.
In this embodiment, the thermostatic module 1 may include a substrate and a conductive film, wherein the conductive film generates heat energy when being electrified, and the conductive film may be disposed on a side of the substrate facing the carrier 2, so that the conductive film is closer to the microfluidic chip 8 on the carrier 2. The setting through the basement can play the isolated effect of one end, can avoid the loss of conductive film heat energy on the one hand, and on the other hand can play insulating effect.
In some examples, the substrate may be made of a glass material. Through the selection of glass material, can improve the thermal-insulated effect of basic height, avoid the loss of heat energy.
In some examples, the thermostatic module 1 may further include a temperature sensor for detecting a temperature of the conductive film, and a controller communicatively connected to the temperature sensor and the conductive film, and may set a temperature threshold for the temperature sensor during use, and control the conductive film to stop heating or reduce the operating power of the conductive film when the temperature of the conductive film exceeds the temperature threshold. When the temperature of the conductive film is lower than the temperature threshold value, the controller controls the conductive film to start heating or increases the working power of the conductive film.
In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically limited, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and simplification of the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In the present invention, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A microfluidic chip temperature control device, comprising:
the constant temperature assembly comprises a plurality of constant temperature modules which are arranged at intervals;
a carrier movably disposed on the thermostatic assembly, the carrier for carrying a microfluidic chip.
2. The microfluidic chip temperature control device of claim 1,
the bearing part is rotatably arranged on the constant temperature component.
3. The microfluidic chip temperature control device of claim 2, further comprising:
and one end of the rotating shaft is connected with the bearing piece, and the other end of the rotating shaft is connected with the constant temperature component.
4. The microfluidic chip temperature control device of claim 1, further comprising:
the slide rail sets up on the constant temperature component, it sets up to hold carrier through the slide rail slides on the constant temperature component.
5. The microfluidic chip temperature control device according to any one of claims 1 to 4,
the bearing piece is provided with a bearing through hole, and the microfluidic chip can be sunk in the bearing through hole.
6. The microfluidic chip temperature control device according to any one of claims 1 to 4,
the bearing piece is provided with a heat conduction part, the microfluidic chip is arranged on one side of the heat conduction part, and the other side of the heat conduction part is used for being abutted against one of the constant temperature modules.
7. The microfluidic chip temperature control device of claims 1 to 4, wherein the thermostatic assembly further comprises:
and the constant temperature modules are arranged on the support at intervals.
8. The microfluidic chip temperature control device of claim 7,
the support comprises a heat insulation layer, and the constant temperature modules are arranged on the heat insulation layer at intervals.
9. The microfluidic chip temperature control device according to any one of claims 1 to 4, wherein at least some of the plurality of thermostatic modules comprise:
a housing;
a heating member disposed within the housing;
the case is made of at least one of copper, aluminum, platinum, and nickel.
10. The microfluidic chip temperature control device according to any one of claims 1 to 4, wherein at least some of the plurality of thermostatic modules comprise:
a substrate;
a conductive film disposed on the substrate.
Priority Applications (1)
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