CN115074709A

CN115074709A - Carrier storage and transportation device, equipment for controlling immersion plating thickness and deposition method

Info

Publication number: CN115074709A
Application number: CN202210878218.1A
Authority: CN
Inventors: 黄信翔; 黄信航; 其他发明人请求不公开姓名
Original assignee: Individual
Current assignee: Huang Xinxiang; Suzhou Xunzhan Technology Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-09-20
Anticipated expiration: 2042-07-25
Also published as: CN115074709B

Abstract

The invention discloses a carrier storage and transportation device, comprising: a milling array carrier including a crossbar and a bolster on which are connected; a set of slide rails on which the respective carriers are arranged by a crossbar, the slide rails including a pushing section and a blending section connected to each other; the pushing assembly comprises a power device, a differential unit, a first push plate and a second push plate; the power device is responsible for driving the pushing component to reciprocate, the pushing component drives the first push plate and the second push plate to move by different strokes, the carrier on the pushing section is responsible for moving by the first push plate, and the carrier on the allocating section is responsible for moving by the second plate; a allocating device for lifting and moving the carrier at a predetermined position of the allocating section, thereby allowing the modulated carrier to be allocated and stored by the carrier storing device by using different moving strokes.

Description

Carrier storage and transportation device, equipment for controlling immersion plating thickness and deposition method

Technical Field

The invention belongs to the technical field of forming a metal deposition layer on the surface of a circuit board, and particularly relates to a carrier storage and transportation device, and equipment and a method for controlling dip plating thickness.

Background

The chemical deposition process of the circuit board is to deposit a plurality of metal layers on specific positions of the circuit board in sequence through continuous processes such as pretreatment, multi-stage chemical deposition treatment, post-treatment and the like to form a multi-layer metal deposition layer, and because various circuit board products have different thickness specification requirements (such as nickel layers, gold layers, silver layers, copper layers, tin layers and the like) on various metal deposition layers, the corresponding soaking time is different. Wherein, if the required thickness of the metal deposition layer is thicker, the deposition soaking time is longer; if a thinner metal deposition layer is required, the deposition soaking time is relatively shorter.

In the continuous multi-stage chemical deposition process, the time of the circuit board in the respective chemical deposition tank can be adjusted in the primary processing, so as to precisely control the thickness of the respective metal deposition layer of each layer, but if the thickness of the specific metal deposition layer on the circuit board is reduced or increased due to the change of product specification in the processing, the machine must be stopped completely, the retention time of the circuit board in the specific chemical deposition tank is corrected, and the subsequent time of the subsequent adjacent chemical deposition process is corrected, so as to meet the requirement of the continuous multi-stage chemical deposition process, therefore, the correction and correction time is relatively time-consuming and troublesome, and therefore, the inventor considers the improved method.

The invention designs a device for controlling immersion plating thickness, which changes the position of a carrier for bearing a circuit board placed in a chemical deposition groove or controls the moving distance of the carrier in the chemical deposition groove, thereby changing the immersion time of the circuit board in the chemical deposition groove and achieving the purpose of controlling the immersion plating thickness. However, if the placement position of the carrier in the chemical deposition tank is changed or the residence time is changed, the number of carriers in the plating tank is changed; for example, the number of carriers in the plating tank is 60, and as the deposition thickness specification becomes smaller, there are 2 methods for shortening the immersion plating time: (1) a carrier is placed in a crossing mode; (2) number of skip chain wheel grids. After the calculation of computer program, the deposition thickness is reduced, the deposition time of the circuit board must be shortened, that is, the conveying speed must be increased, the immersion plating time in the tank can be reduced to 50 carriers, the 10 more carriers will be in the conventional uninterrupted circulation operation, problems will occur in the process of returning, storing and transporting, and the more carriers must be taken out manually, so the inventor also considers the improved technology synchronously.

Disclosure of Invention

The present invention provides a carrier storage and transportation device, and more particularly, to a method for moving a compact carrier on a set of rails according to different strokes, so as to timely allow a portion of the carriers to reach a storage-retaining state, thereby allowing the chemical deposition bath to change the immersion plating time for controlling the immersion plating thickness while allowing all carriers to operate in a normal cycle.

The invention has the secondary object of providing the deposition equipment and the deposition method for controlling the immersion plating thickness, and the purpose of controlling the immersion plating thickness is achieved by changing the position of the carrier for bearing the circuit board, which is placed in the chemical deposition groove, or controlling the moving distance of the carrier in the chemical deposition groove, so that the problem that the thickness of the deposition layer needs to be changed when a user faces different production batches is solved greatly.

In order to achieve the purpose, the invention adopts the following technical scheme:

a vehicle storage and transportation device, comprising: the method comprises the following steps that an array carrier, a slide rail, a pushing assembly and a blending device are modulated on the power, wherein the carrier comprises a cross rod and a bearing frame which are connected, and the bearing frame is used for placing a circuit board; scanning a plurality of carriers on the slide rail on the horizontal bar, wherein the plurality of carriers are sequentially arranged on the slide rail on the horizontal bar, the slide rail comprises a pushing section and a allocating section which are connected, the plurality of carriers in the pushing section slide according to a first stroke, and the plurality of carriers in the allocating section slide according to a second stroke, wherein the first stroke is larger than the second stroke; the pushing assembly comprises a power device, a differential unit, a first push plate and a second push plate; the power device is responsible for driving the differential unit to reciprocate, the differential unit drives the first push plate and the second push plate to move by different strokes, wherein the carrier on the pushing section is responsible for moving by the first push plate, and the carrier on the blending section is responsible for moving by the second push plate; the allocating device is responsible for hoisting the carrier at a predetermined position on the allocating section and moving to a position at one side of the slide rail for delivery.

As a preferred embodiment, the slide rail has two sets of parallel rails, and each carrier is disposed on the slide rail from two ends of the cross bar.

In a preferred embodiment, the power device is a pneumatic cylinder or a servo motor, and the power device can control the extension and contraction of the output shaft, and the output shaft is connected with the differential unit to reciprocate.

As a preferred embodiment, the first push plates are respectively disposed in parallel on the outer sides of the slide rails, and the first push plates can reciprocate parallel to the pushing section, a plurality of first push-assisting blocks capable of rotating only in one direction are equally spaced on the first push plates, and the carrier on the pushing section is pushed by the first push-assisting blocks to move, a distance between two adjacent first push-assisting blocks is equal to the first stroke plus the second stroke, and the first stroke plus the second stroke is equal to the total actuation stroke of the output shaft of the power device.

As one of the preferred embodiments, the pushing assembly comprises: a first connecting plate, a sliding rod and a connecting rod, wherein the first connecting plate is connected with the output shaft of the power device and is combined with the first push plate; the two ends of the sliding rod are fixed on a support extended from the first push plate, the sliding rod is provided with a sliding block capable of sliding, an immovable retreating-assisting ring and a boosting ring, the sliding block is positioned between the retreating-assisting ring and the boosting ring, and the distance between the retreating-assisting ring and the boosting ring is the first stroke and is smaller than the total actuation stroke of the output shaft of the power device; one end of the connecting rod is connected with the sliding block, and the other end of the connecting rod is combined with the second push plate through a second connecting plate.

As a preferred embodiment, the adjusting device includes a moving assembly and a hanging assembly, the moving assembly is used to drive the hanging assembly to move horizontally and lift, and then the hanging assembly hooks the cross bar of the carrier to move.

The invention relates to a device for controlling immersion plating thickness, which comprises: the chemical deposition tank comprises a tank body and a transmission chain set, the transmission chain set is arranged on the periphery of the tank body and comprises a motor, a transmission assembly and two groups of chain sets, the two groups of chain sets are respectively arranged on the outer side of the long groove wall of the tank body, the chain sets are provided with a plurality of receiving pieces, and the motor drives the two chain sets to synchronously operate through the transmission assembly; the picking and placing mechanism comprises a lifting mechanism capable of controlling the lifting of the support, the support is provided with a moving carrying platform which moves in a reciprocating manner, the moving carrying platform is provided with a rotating platform, the rotating platform controls the bearing hoisting piece to rotate, two ends of the bearing hoisting piece are respectively provided with a group of lifting hooks, the picking and placing mechanism is operated to control the lifting hooks to move the carrier for a preset distance in a program mode, the carrier is placed on the corresponding bearing piece to control the detention time of the circuit board in the groove body, the thickness of the deposited metal deposition layer is further controlled, and the moving direction of the moving carrying platform is parallel to the advancing direction of the carrier in the groove body; (ii) a The carrier can bear a circuit board; thus, the carrier is lifted up and placed on the bearing piece at the corresponding position after moving for a program preset distance, and the moving distance is logically calculated by a computer program; so as to control and change the detention time of the circuit board in the groove body and further control the thickness of the metal deposition layer formed on the surface of the circuit board.

As one of the preferred embodiments, the angle of each rotation of the motor is increased, so that the advancing distance of the carrier in the groove body can be synchronously increased.

The invention relates to a deposition method for controlling immersion plating thickness, which comprises the following steps: driving the bearing hanging piece to hoist the carrier to the highest point; rotating the carrying hanger to place the carrier above the tank body of a chemical deposition tank; moving the bearing hanging piece for a program preset distance along the advancing direction of the carrier in the groove body; the bearing hanging piece is descended to enable the carrier and the circuit board to enter the groove body; and controlling the carrier to move in the groove body at a preset speed.

As a preferred embodiment, the moving distance of the carriers in the tank is changed, and the carriers are moved by 1, 2 or 3 chain pitches (in design, 1 carrier can be placed in each pitch) at a time, so as to control the thickness of the deposited metal layer.

As one of the preferable embodiments, the device further comprises a pick-and-place mechanism, the pick-and-place mechanism comprises a lifting mechanism capable of controlling the lifting of a support, the support is provided with a movable carrying platform capable of moving back and forth, the movable carrying platform is provided with a rotating platform, the rotating platform controls the bearing hanging piece to rotate, two ends of the bearing hanging piece are respectively provided with a group of lifting hooks, and the carrier is lifted by the lifting hooks; the rotary carrier is used for corresponding to the opening direction of the lower plate of the carrier.

As a preferred embodiment, the chemical deposition tank comprises a tank body and a transmission chain set, wherein the transmission chain set is arranged on the periphery of the tank body and comprises a motor, a transmission assembly and two groups of chain sets, the two groups of chain sets are respectively arranged on the outer side of the long groove wall of the tank body, the chain sets are provided with a plurality of receiving pieces, the motor drives the two chain sets to synchronously operate through the transmission assembly, the receiving pieces can receive the carriers, and the moving distance of the carriers in the tank body is controlled by operating the transmission chain set.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention arranges a pick-and-place mechanism capable of controlling the placing position (or distance) of the carrier on one side of the chemical deposition tank, and synchronously changes the detention time of the circuit board in the chemical deposition tank by changing the placing position, thereby achieving the purpose of controlling the thickness of the deposition layer.

2. When the user needs to change the thickness of the circuit board with different metal deposition layer due to the production lot number, it is not necessary to readjust the number of the carriers of all the deposition equipments, so as to shorten the calibration and adjustment time and greatly save the working hours.

3. When the invention can be widely applied to various chemical deposition tanks, the deposited metal can be a plurality of metals such as a nickel layer, a gold layer, a silver layer, a copper layer or a tin layer.

4. The invention provides a carrier storage and transportation device, when the detention time of a circuit board in a chemical deposition tank is changed, a recovered carrier can be really recovered and detained by using the device and then is allocated and sent out, so that uninterrupted circulation operation is met.

Drawings

FIG. 1 is a side view of an apparatus for chemical deposition in accordance with the present invention;

FIG. 2 is a simplified schematic diagram of a chemical deposition apparatus according to the present invention;

FIG. 3 is a perspective view of the apparatus for controlling immersion plating thickness according to the present invention;

FIG. 4 is a side view of the apparatus for controlling immersion plating thickness of the present invention;

FIG. 5 is a flow chart of a deposition method for controlling immersion plating thickness using the present invention;

FIG. 6A is a schematic view of the present invention with the vehicle suspended;

FIG. 6B is a schematic view of the carrier being rotated to move above the tank in the present invention;

FIG. 6C is a schematic view of the carrier of the present invention being moved a predetermined distance;

FIG. 6D is a schematic view of the carrier of the present invention moving into the tank;

FIG. 6E is a schematic view of the movement of the carrier in the tank of the present invention;

FIG. 7 is a schematic view illustrating the movement of the carrier in the tank according to another embodiment of the present invention;

FIG. 8 is a perspective view of the vehicle storage and transportation device of the present invention mounted to an upper frame;

FIG. 9 is a perspective view of the carrier storage and transportation device of the present invention;

FIG. 10 is a side view of the vehicle storage and transportation apparatus of the present invention;

FIG. 11 is an enlarged view of a portion of the first booster block of the present invention;

FIG. 12 is an enlarged view of a portion of the second booster block of the present invention;

FIG. 13 is a perspective view of a dispensing device of the present invention;

FIG. 14 is a perspective view of the rotary carrier device of the present invention;

FIG. 15 is a schematic view of the present invention showing the initial state of the vehicle transportation apparatus;

FIG. 16 is a schematic diagram of the operation of the pushing assembly of the vehicle transportation device of the present invention;

FIG. 17 is a schematic view (one) of the operation of the allocating device of the vehicle transportation device of the present invention;

FIG. 18 is a schematic diagram (two) illustrating the operation of the dispensing device of the vehicle transportation device according to the present invention;

FIG. 19 is a schematic view (one) of the operation of the retraction of the pushing assembly of the vehicle transportation device of the present invention;

fig. 20 is a schematic view (two) illustrating the operation of the retraction of the pushing assembly of the vehicle transportation device according to the present invention.

In the figure:

10. a carrier; 11. a cross bar; 12. a support frame; 13. an opening; 20. a chemical deposition tank; 21. a trough body; 22. a transmission chain set; 221. a motor; 222. a transmission assembly; 223. a chain set; 2231. a receiving member; 30. a pick and place mechanism; 31. a lifting mechanism; 32. a support; 33. moving the carrier; 34. a rotating table; 35. a load bearing hanger; 351. a hook; 40. a rinsing bath; 50. a hanger unit; 51. a shifting hanger; 52. a first lifting hanger; 53. a second lifting hanger; 54. an upper frame; 55. a preparation area; 56. a delivery area; 60. a carrier storage and transportation device; 61. a slide rail; 611. a push section; 612. a blending section; 62. a push assembly; 621. a power plant; 6211. an output shaft; 622. a differential unit; 6221. a first connecting plate; 6222. a slide bar; 6223. a connecting rod; 6224. a slider; 6225. a withdrawal assisting ring; 6226. a boosting ring; 6227. a second connecting plate; 623. a first push plate; 6231. a first boost block; 6232. a first stopper post; 6233. a first inclined plane; 624. a second push plate; 6241. a second boost block; 6242. a second stopper post; 6243. a second inclined plane; 63. a blending device; 631. a moving assembly; 6311. a horizontal moving unit; 6312. a lifting unit; 632. a hanging component; 64. a rotary carrier device; 641. a lifting carrier unit; 642. a rotation unit; 643. a spreader; 6431. an hooking component; 5001-5004.

Detailed Description

The technical solution of the present invention will be clearly and completely described below with reference to the specific embodiments and the accompanying drawings. It will be understood that when an element is referred to as being "mounted on" or "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions indicate that up, down, left, right, front, rear, and the like are relative, and are used to explain that the structures and movements of the various components are relative in this case. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the positions of the elements changes, it is assumed that these representations will also change accordingly.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1 and 2 show a side view and a simplified structure of the chemical deposition apparatus according to the present invention. The chemical deposition apparatus of the present invention comprises a substrate holder 10, a chemical deposition bath 20, a pick-and-place mechanism 30, at least one rinsing bath 40, a hanger unit 50, and a holder transporting device 60. The carrier 10 is responsible for carrying the circuit board. The pick-and-place mechanism 30 is responsible for lifting, rotating and moving the carrier 10 carrying the circuit board into the chemical deposition tank 20 from the preparation area 55 (left position in the figure) of the hanger unit 50. The chemical deposition bath 20 can carry a plurality of carriers 10 and deposit metal layers on the surface of the circuit board in a piece-by-piece moving manner. The first rinsing bath 40 is responsible for rinsing the carrier 10 moved into this area to remove the attached chemical agent. The hanger unit 50 includes a shift hanger 51, a first elevation hanger 52, and a second elevation hanger 53. The shift crane 51 moves the carrier 10 up and down sequentially among the chemical deposition bath 20, the first rinsing bath 40, and a sending-out section 56 (right position in the drawing). The first lifting crane 52 is used to lift the empty carrier 10 from the delivery area 56 to the carrier storage and transportation device 60. The carrier storage and transportation device 60 is responsible for moving, rotating and collecting the moving carriers 10 in sequence. Finally, the carrier 10 to be used is lowered by the carrier storage and transportation device 60 by the second lifting and lowering hanger 53 and moved back into the preparation area 55. The continuous circulation can deposit metal layer on the surface of circuit board.

The chemical deposition equipment comprises two innovative technologies, namely equipment for controlling the immersion plating thickness and a carrier storage and transportation device 60, wherein the equipment for controlling the immersion plating thickness controls the position of a carrier 10 entering a chemical deposition groove 20 so as to control the residence time of a circuit board in the groove and achieve the purpose of controlling the thickness of a metal deposition layer formed on the surface of the circuit board. However, when the residence time of the carriers 10 in the chemical deposition bath 20 is changed, the retention problem of the original number of carriers 10 in the uninterrupted circulation operation occurs, and therefore, the carrier storage and transportation device 60 is designed to solve the problem.

First, the structure of the present invention for controlling the thickness of the immersion plating will be described. For convenience of illustration, on the basis of fig. 1, only some main components are shown in the following drawings for convenience of illustration: referring to fig. 3 and 4, there are shown a perspective view and a side view of an apparatus for controlling immersion plating thickness according to the present invention. The invention discloses equipment for controlling immersion plating thickness, which comprises: a plurality of carriers 10, a chemical deposition bath 20, and a pick-and-place mechanism 30. The carrier 10 is responsible for carrying a circuit board. The chemical deposition tank 20 includes a tank body 21 and a transmission chain set 22, wherein the transmission chain set 22 is used for carrying and driving the carrier 10 to move in the tank body 21. The pick-and-place mechanism 30 is responsible for lifting the carrier 10 and moving the carrier to a predetermined distance and then placing the carrier on a corresponding position of the transmission chain set 22, so as to control the position of the carrier 10 entering the tank 21, and further control the residence time of the circuit board in the tank 21, thereby achieving the purpose of controlling the thickness of the metal deposition layer formed on the surface of the circuit board.

A detailed description of the structure of each component is then given:

the chemical deposition tank 20 includes a tank body 21 and a transmission chain set 22, the transmission chain set 22 is installed on the periphery of the tank body 21, and includes a motor 221, a transmission assembly 222 and two sets of chain sets 223, the two sets of chain sets 223 are respectively installed on the outer side of the long groove wall of the tank body 21, please refer to fig. 4, the chain set 223 is provided with a plurality of supporting members 2231, the motor 221 drives the two chain sets 223 to synchronously operate through the transmission assembly 222, and two supporting members 2231 with opposite positions can be used for placing one carrier 10. In the present invention, the distance of each rotation of the motor 221 is controlled to control the staying time of the carrier 10 in the tank 21, and in addition, in order to control and change the thickness of the metal deposition layer, the present invention can also adjust the distance of each rotation of the motor 221, for example, increase the distance by 2 times or 3 times, thereby shortening the staying time of the circuit board in the tank 21, reducing the thickness of the metal deposition layer, and achieving the purpose of controlling the thickness of the metal deposition layer, and in addition, the position of the carrier 10 placed in the tank 21 includes an initial position, a plurality of relay positions and a final position, and the most basic and complete deposition operation is that the carrier 10 is carried by the bearing part 2231 into the tank 21 from the initial position, and the relay positions are moved step by step, and finally lifted up and taken out at the final position.

The pick-and-place mechanism 30 is located at one side of the chemical deposition tank 1 and is responsible for moving the carrier 10 to a specific position in the tank body 21, wherein the specific position is a distance from the right side wall of the chemical deposition tank 1 and represents that the carrier must be moved to a specific relay position, so as to change the staying time of the circuit board in the tank body 21 and control the immersion plating thickness. The pick-and-place mechanism 30 includes a lifting mechanism 31, and the lifting mechanism 31 can control a support 32 mounted thereon to be lifted and lowered. The support 32 is provided with a movable stage 33 capable of reciprocating, the moving direction of the movable stage 33 is parallel to the moving direction of the carrier 10 in the tank 21, wherein the linear moving modes of the lifting mechanism 31 and the movable stage 33 can be operated by a ball screw, a slide, a servo motor, and the like. The movable carrier 33 has a rotating platform 34, the rotating platform 34 can control a carrying hanger 35 to rotate, and two ends of the carrying hanger 35 are respectively provided with a set of hooks 351. The hooks 351 are responsible for hanging the carrier 10. The operation flow of the pick-and-place mechanism 30 is as follows: the lifting hook 351 is operated to lift the carrier 10 outside the tank 21 and then lift to a fixed position, the rotary table 34 drives the bearing hanger 35 to rotate, so that the carrier 10 moves to the upper side of the tank 21, the movable carrier 33 moves the bearing hanger 35 by a preset distance according to a set value, then the lifting mechanism 31 drives the bracket 32 to descend, the bearing hanger 35 also descends synchronously, and finally the two ends of the carrier 10 are located in the bearing pieces 2231 at opposite positions, so that the circuit board enters the tank 21.

The carrier 10 includes a cross bar 11 and two support frames 12, the two support frames 12 are symmetrically fixed on the cross bar 11, the support frames 12 are partially bent and hooked, the two support frames 12 have an opening 13 on the other side, and the opening 13 can be used for placing the circuit board. In actual operation, the carrier 10 is erected in the corresponding grooves of the two receiving parts 2231 from both ends of the cross bar 11.

Next, a description is made of the operation flow of the present invention, fig. 5 is a flow of the deposition method for controlling the immersion plating thickness according to the present invention, and fig. 6A to 6E are operation diagrams corresponding to the respective steps. The invention discloses a deposition method for controlling immersion plating thickness, which comprises the following steps:

step 5001, driving the bearing hanging piece 35 to hoist the carrier 10 to the highest point; as shown in fig. 6A, the lifting mechanism 31 operates and drives the support frame 32 to lift, the hook 351 of the carrying hanger 35 lifts the carrier 10 from the preparation area 55, and the carrier 10 carries a circuit board (not shown).

Step 5002, rotating the hanging member 35 to make the carrier 10 above the tank 21 of the chemical deposition tank 20; as shown in fig. 6B, the rotation table 34 operates to rotate the carrying hanger 35 by 180 degrees, so that the carrier 10 moves to above the trough 21.

Step 5003, moving the hanging member 35 in a predetermined distance in a direction parallel to the forward direction of the carrier 10 in the tank 21; as shown in fig. 6C, the moving stage 33 is activated, so that the carrying hanger 35 moves a preset distance toward the advancing direction of the carrier 10 in the trough 21.

Step 5004, lowering the bearing hanging piece 35 to enable the carrier 10 and the circuit board to enter the groove body 21; as shown in fig. 6D, the lifting mechanism 31 operates to drive the bracket 32 to descend, so that the carrying hanger 35 descends, the carrier 10 and the circuit board enter the slot body 21, and then the carrier 10 is received by the receiving member 2231.

Step 5005, controlling the carrier 10 to move in the tank 21 at a predetermined speed; as shown in fig. 6E, after the carrier 10 is received by the receiving member 2231, the carrier is driven by the transmission chain set 22 to move forward in the tank 21 in a predetermined direction (e.g., move forward from left to right in the figure), and the hanging member 35 exits from the tank 21, and then a carrier 10 is hung according to the steps 5001 to 5004. The invention controls the position of the carrier 10 entering the tank 21, namely, the carrier is placed at one of the preset relay positions, and the deposition time of the circuit board staying in the tank 21 is controlled, thereby controlling the thickness of the metal deposition layer of immersion plating.

In the above embodiment, the deposition time of the circuit board in the tank 21 is changed by using different positions of the carrier 10 placed in the tank 21, and the thickness of the metal deposition layer is further controlled, but not limited thereto, as shown in fig. 7, in the embodiment, the conveying speed of the transmission chain set 22 is changed, and when the conveying speed is faster, the retention deposition time of the circuit board in the tank 21 is shortened, so that the thickness of the metal deposition layer is thinner. In this embodiment, the fast conveying speed means that the motor 121 increases the rotation distance to increase the moving distance by three times each time, and sequentially moves at each relay position, so that the moving distance of the carrier 3 is increased each time, which generates the phenomenon of empty 2 grids as shown in the figure, thereby shortening the retention time of the carrier 10 in the trough 21, and also shortening the retention time of the circuit board, which reduces the thickness of the metal deposition layer, although the moving distance can be changed according to the requirement, for example, the design is changed to the empty 1 grid or 3 grid mode.

When the apparatus for controlling a plating thickness according to the present invention is operated, as shown in fig. 2, if the distance between the carriers 10 located in the chemical deposition bath 20 increases, the carriers 10 may be retained during the recycling, and in the carrier storage and transportation device 60 according to the present invention, a part of the number of carriers 10 may be retained, so that the same total number of carriers 10 may be continuously circulated.

As shown in fig. 1 and 8, the vehicle transportation device 60 of the present invention is installed at the upper frame 54 and located between the first lifting hanger 52 and the second lifting hanger 53. Some components of the carrier transportation device 60 are also combined with the vertical fixing frames of the first lifting frame 52 and the second lifting frame 53, so that the whole device is more stable. Since the first and second lifting/lowering cradles 52 and 53 are similar to the conventional structure, they will not be described in detail. First lifting frame 52 is used to lift empty carriers 10 from drop-out area 56 to carrier storage and transport device 60. The second lifting/lowering hanger set 53 then lowers the carrier 10 to be used from the carrier storage and transportation device 60 back into the preparation area 55.

Fig. 9 and 10 are a perspective view and a side view of the vehicle transportation device according to the present invention. The carrier storage and transportation device 60 includes a slide rail 61, a pushing assembly 62, a dispensing device 63, and a rotary carrier device 64. The slide rail 61 for cutting the carriers 10 on the slide rail 61 by the beam 11, the slide rail 61 comprising a pushing section 611 and a dispensing section 612 connected thereto; the pushing assembly 62 comprises a power device 621, a differential unit 622, a first push plate 623 and a second push plate 624; the power device 621 is responsible for driving the differential unit 622 to reciprocate, and the differential unit 622 can drive the first push plate 623 and the second push plate 624 to move with different strokes. The carriers 10 on the pushing section 611 are moved by the first push plate 623, and the carriers 10 on the blending section 612 are moved by the second push plate 624; the allocating device 63 is responsible for lifting the carrier 10 at a predetermined position on the allocating section 612 and moving to the leftmost position, i.e. the position where one side of the slide rail 61 is ready to be sent out. The rotary carrier device 64 is responsible for lifting and steering the carrier 10, so that the carrier 10 can be restored to the original operation orientation. Thereby allowing the carriers 10 to be collected, rotated, retained and stored therein.

A description is then given of the components and the detailed mode of operation.

The slide rails 61, which are provided in two sets in this embodiment, are arranged in parallel between the first hanger set 52 and the second hanger set 53, and are responsible for sliding the digital cutting carrier 10 thereon, while serving the purpose of collecting the carrier 10. Each carrier 10 is disposed on two sets of slide rails 61 from two ends of the cross bar 11. Each slide rail 61 includes a pushing section 611 and a dispensing section 612 connected to each other, the pushing section 611 corresponds to the first lifting frame 51, and each carrier 10 moving to the pushing section 611 slides according to a first stroke each time. Each carrier 10 entering the deployment section 612 then slides along a second stroke each time, with the end of the deployment section 612 being connected to the second lifting cradle 52. Wherein the first stroke is greater than the second stroke, so that most of the carriers 10 are collected at the deployment section 612.

The pushing assembly 62 includes a power device 621, a differential unit 622, a first pushing plate 623 and a second pushing plate 624. The pushing assembly 62 is responsible for allowing the carriers 10 on the pushing section 611 and the deployment section 612 to slide with different first and second strokes each time. The power device 621 is a pneumatic cylinder or a servo motor to control the extension and retraction of the output shaft 6211, the output shaft 6211 is connected to the differential unit 622 for reciprocating movement, and the differential unit 622 drives the first push plate 623 and the second push plate 624 to move with different strokes. The first push plate 623 is provided with two pieces in this embodiment, and is respectively disposed on the outer sides of the two slide rails 61 in parallel, and in this embodiment, the first push plate 623 is mounted on the outer side of the pushing section 611 of the slide rail 61 by a structure such as a slider and a slide seat, so that the first push plate 623 can reciprocate parallel to the pushing section 611. A plurality of first push blocks 6231 capable of rotating only in one direction are provided at equal intervals on the first push plate 623. The distance between two adjacent first boost blocks 6231 is equal to the first stroke plus the second stroke. The first stroke is equal to most of the total actuation stroke of the output shaft 6211 of the power device 621.

As shown in fig. 11, the first push-up block 6231 is attached to the first push plate 623 with a rotation axis in the middle, and can rotate to a limited extent, and the center of gravity is shifted by design, so that the first push-up block 6231 is upright in the normal absence of external force. In addition, the first push plate 623 is further provided with a first stopping column 6232 for the position of each first boosting block 6231, and the first stopping column 6232 limits the first boosting block 6231 from rotating in a specific direction, which means that the first boosting block 6231 cannot rotate clockwise in this embodiment. The top of the first boosting block 6231 further has a first inclined surface 6233, and the first inclined surface 6233 is located in a region protruding from the top surface of the sliding rail 61. In the present embodiment, when the first boosting block 6231 moves leftwards and contacts the cross bar 11 of the carrier 10, the first stopping column 6232 is abutted against and does not rotate clockwise, so as to push the carrier 10 to move. When the first push plate 623 retracts (e.g., moves rightward), during the process that the first boost block 6231 moves rightward, if the first inclined surface 6233 contacts another cross bar 11, the first boost block 6231 will rotate counterclockwise and pass through the cross bar 11, and will not drive the vehicle 10 to move rightward. Thereby, in the process of the reciprocating movement of the first push plate 623, the carrier 10 is driven to move one stroke at a time on the pushing section 611.

The second pushing plate 624 is also provided with two pieces, which are respectively disposed in parallel on the outer sides of the two sets of sliding rails 61, and in this embodiment, the second pushing plate 624 is mounted on the outer side of the allocating section 612 of the sliding rails 61 by a structure such as a sliding block or a sliding seat, so that the second pushing plate 624 can reciprocate parallel to the allocating section 612. A plurality of second push blocks 6241 capable of rotating only in one direction are provided at equal intervals on the second push plate 624. The distance between two adjacent second boosting blocks 6241 is equal to the second stroke.

As shown in fig. 12, the second booster block 6241 is attached to the second pusher 624 with a rotation axis located in the middle, and can rotate to a limited extent, and the center of gravity is shifted by design, so that the second booster block 6241 is upright in a normal state without an external force. In addition, the second push plate 624 is provided with a second stopping column 6242 for each second boosting block 6241, and the second stopping column 6242 limits the second boosting block 6241 from rotating in a specific direction, which means that the second push plate cannot rotate clockwise in this embodiment. The top of the second boosting block 6241 further has a second inclined surface 6243, and the area of the second inclined surface 6243 protrudes from the top surface of the sliding rail 61. In the present embodiment, when the second boosting block 6241 moves leftwards and contacts the cross bar 11 of the carrier 10, the second stopping column 6242 is abutted against and does not rotate clockwise, so that the carrier 10 can be pushed to move. When the second pushing plate 624 retracts (moves rightwards), in the process that the second boosting block 6241 moves rightwards, when the second inclined surface 6343 contacts the cross bar 11, the second boosting block 6241 rotates anticlockwise and passes through the cross bar 11, and the carrier 10 is not driven to move rightwards. Thereby, during the reciprocating movement of the second pushing plate 624, the carrier 10 is driven to move on the allocating section 612 one second stroke at a time.

The following describes the operation flow of the differential unit 622 to make the first push plate 623 and the second push plate 624 generate different moving strokes: the differential unit 622 includes a first connecting plate 6221, a slide bar 6222 and a connecting rod 6223. The end of the output shaft 6211 of the power device 621 is connected to a first connecting plate 6221, and the first connecting plate 6221 is U-shaped and combines with two first push plates 623. The sliding rod 6222 has two ends fixed to the bracket extended from the first push plate 623, the sliding rod 6222 is provided with a sliding block 6224, and a position-adjustable and fixed retraction-assisting ring 6225 and a push-assisting ring 6226, the sliding block 6224 is located between the retraction-assisting ring 6225 and the push-assisting ring 6226, the distance between the retraction-assisting ring 6225 and the push-assisting ring 6226 is called a first stroke and is smaller than the total actuating stroke of the power device 621, and the total stroke is equal to the first stroke plus the second stroke. The connecting rod 623 has one end connected to the slider 624 and the other end connected to the second push plate 624 via a second connecting plate 6227. The sliding bar 6222, the connecting bar 6223, the sliding block 6224, the retraction-assisting ring 6225, the push-assisting ring 6226 and the second connecting plate 6227 are two in number and are symmetrically distributed outside the two sets of sliding rails 61. Thus, the first connecting plate 6221 makes the first push plate 623 move by the first stroke plus the second stroke each time (i.e. the total actuation stroke of the power device 621), and the differential structure makes the second push plate 624 move by the second stroke shorter each time.

Referring to fig. 13, which is a perspective view of the deployment device of the present invention, the deployment device 63 is used to lift the carrier 10 at a predetermined position in the deployment section 612, and as shown in fig. 8, the deployment device 63 is fixed at the upper frame 54. The dispensing device 63 includes a moving component 631 and a hanging component 632. The moving assembly 631 drives the hanging assembly 632 to move horizontally and vertically, and the hanging assembly 632 then moves to hook the cross bar 11 of the carrier 10. The moving assembly 631 includes a horizontal moving unit 6311 and an elevating unit 6312, wherein the horizontal moving unit 6311 controls the horizontal moving position of the elevating unit 6312, and the elevating unit 6312 controls the elevating position of the hanging assembly 632. In addition, a sensor (not shown) is disposed at a position in the dispensing section 612 on the slide rail 61, and the sensor provides information of a blank space (i.e. without a carrier) so that the dispensing device 63 can move to a fixed point.

Fig. 14 is a perspective view of the rotary carrier device of the present invention. The rotary carrier device 64 is used to lift the carrier 10 in the pushing section 611 and rotate it by 180 degrees, so as to achieve the purpose of turning the carrier 10. As shown in fig. 8, the rotary carrier device 64 is also fixed at the upper frame 54. The rotary carrier device 64 includes an elevation carrier unit 641, a rotation unit 642 and a hanger 643, wherein the elevation carrier unit 641 is fixed to the upper frame 54 to control the elevation of the rotation unit 642, the rotation unit 642 controls the rotation of the hanger 643, two groups of hooks 6431 are provided at 180 degrees apart from the hanger 643, and the hooks are contacted with the crossbar 11 by the hooks 6431 to be lifted.

The operation of the vehicle transporting and transporting apparatus 60 of the present invention is described as follows:

as shown in fig. 15, in the initial state, the first push plate 623 is provided with 5 first boosting blocks 6231 in the present embodiment, which represent that each carrier 10 has 5 moving strokes on the pushing section 611. The second push 624 has 25 second boost blocks 6241 representing 25 subsequent strokes of the vehicle 10 moving to the deployment section 612, the total number is determined by the actual design, which is just one of the embodiments, and finally achieves moving the vehicle 10 to the far left at the far right of the slide rail 61. In addition, the number of carriers 10 that can be operated by the chemical deposition bath 20 is equal to the number that can be stored by the carrier stocker 60, and the carriers 10 can be operated in a continuous cycle in a normal state, which is not described in this section, but when the number of the chemical deposition baths 20 is changed due to the change of the immersion time, the carriers 10 will be left behind, which will be described later.

As shown in fig. 16, the power device 621 is activated, and the output shaft 6211 extends for most of the stroke (the first stroke), so that the first connecting plate 6221 is fixed to the first push plate 623, and the first push plate 623 drives the cross bar 11 of the carrier 10 to move for the first stroke by the first boosting block 6231. During the movement of the first push plate 623, the slider 6224 slides on the slide rod 6222 before the slide rod 6224 contacts the push-aid ring 6226, and thus cannot slide, the output shaft 6211 continues to extend completely, and the connecting rod 6223, the second connecting plate 6227, and the second push plate 624 are synchronously driven to move, so that the stroke is short (the second stroke), and the second push plate 624 drives the cross rod 22 of the carrier 10 to move by the second push-aid block 6241 by the second stroke, so that the second stroke is much smaller than the first stroke, and most of the carriers 10 are stored on the allocation section 612.

As shown in fig. 17, the immersion plating time in the bath 21 is changed, and therefore, several spaces appear in the dispensing section 612. At this time, the deploying device 63 is moved to the position where the carrier 10 is located and is ready to be hoisted.

As shown in fig. 18, the allocating device 63 lifts the carrier 10 and moves to the leftmost position of the slide rail 61, and waits for the second lifting frame 53 to move the carrier 10 downward.

As shown in fig. 19, when the power device 621 is activated, the output shaft 6211 retracts slowly, the first push plate 623 and the slide bar 6222 also retract rightward synchronously, and the retraction assisting ring 225 contacts the slide block 6224, so as to synchronously drive the connecting rod 6223 to drive the second push plate 624 to move. In addition, the carrier 10 under the carrier rotating device 64 is rotated 180 degrees (as shown by the dotted line) to change the direction of the opening 13 of the rack 12 from right to left.

As shown in fig. 20, during the retraction of the output shaft 6211, when the first and second boosting

blocks

6231, 6241 contact the crossbar 11, they can be rotated counterclockwise to avoid driving the carrier 10, and finally retracted to the state shown in fig. 15.

In summary, the chemical deposition apparatus of the present invention is provided with a pick-and-place mechanism 30 capable of controlling the placement position (or distance) of the carrier on one side of the chemical deposition tank 20, so as to achieve the purpose of controlling the thickness of the deposition layer by changing the residence time of the circuit board in the chemical deposition tank, wherein the chemical deposition tank is not limited to be suitable for specific metals, for example, the deposited metal may be a nickel layer, a gold layer, a silver layer, a copper layer, or a tin layer. The problem that a producer cannot change the circuit board with different deposition layer thicknesses in a short time in the continuous production process is solved, the recovered carriers 10 are moved on the slide rail 61 according to different strokes by the carrier storage and transportation device, and a part of the carriers 10 are timely brought into a storage and retention state, so that the continuous circulation operation can be realized, and the chemical deposition equipment can control the immersion plating thickness and smoothly operate.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the embodiment of the present invention. All equivalent changes and modifications made according to the claims of the present invention are covered by the claims of the present invention.

Claims

1. A vehicle storage and transportation device, comprising:

scanning the array of carriers, the carriers comprising a crossbar and a shelf connected thereto, the shelf being for placing the circuit board;

a slide rail on which the carriers are sequentially arranged by the crossbar, the slide rail including a pushing section and an allocating section connected, a plurality of the carriers in the pushing section sliding according to a first stroke plus a second stroke, a plurality of the carriers in the allocating section sliding according to the second stroke, wherein the first stroke is greater than the second stroke;

the pushing assembly comprises a power device, a differential unit, a first push plate and a second push plate; the power device is used for driving the differential unit to reciprocate, the differential unit drives the first push plate and the second push plate to move in different strokes, the carrier on the pushing section is moved by the first push plate, and the carrier on the blending section is moved by the second push plate;

the allocation device is used for hoisting the carrier at the preset position on the allocation section and moving the carrier to the position where one side of the slide rail is ready to be sent out.

2. The vehicle transportation and storage device according to claim 1, wherein the rails are provided in two sets parallel to each other, and each vehicle is mounted on the rails from both ends of the rail.

3. The vehicle transportation and storage device according to claim 1, wherein the power device is a pneumatic cylinder or a servo motor, and the power device can control the extension and contraction of the output shaft, and the output shaft is connected with the differential unit for reciprocating movement.

4. The vehicle storage and transportation device according to claim 1, wherein the first push plates are respectively disposed in parallel on the outer sides of the sliding rails, and the first push plates can reciprocate parallel to the pushing section, a plurality of first push-assisting blocks capable of rotating only in one direction are disposed on the first push plates at equal intervals, and the vehicle on the pushing section is pushed by the first push-assisting blocks to move, a distance between two adjacent first push-assisting blocks is equal to the first stroke plus the second stroke, and the first stroke plus the second stroke is equal to a total actuation stroke of an output shaft of the power device.

5. The vehicle transportation apparatus according to claim 1, wherein the pushing assembly comprises:

the first connecting plate is connected with the output shaft of the power device and combined with the first push plate;

the two ends of the sliding rod are fixed on a support extending out of the first push plate, the sliding rod is provided with a sliding block capable of sliding, a fixed retreating-assisting ring and a fixed boosting ring, the sliding block is positioned between the retreating-assisting ring and the boosting ring, and the distance between the retreating-assisting ring and the boosting ring is the first stroke and is smaller than the total actuation stroke of the output shaft of the power device;

one end of the connecting rod is connected with the sliding block, and the other end of the connecting rod is combined with the second push plate through a second connecting plate.

6. The carrier storage and transportation device according to claim 1, wherein the adjustment device comprises a movement assembly and a hanging assembly, the movement assembly is configured to drive the hanging assembly to move horizontally and lift, and the hanging assembly hooks the cross bar of the carrier to move.

7. The vehicle transportation apparatus according to claim 6, wherein the moving assembly comprises a horizontal moving unit and a lifting unit, the horizontal moving unit controls a horizontal moving position of the lifting unit, and the lifting unit controls a lifting position of the hanging assembly.

8. An apparatus for controlling immersion plating thickness, comprising:

the chemical deposition tank comprises a tank body and a transmission chain group, wherein the transmission chain group is arranged on the periphery of the tank body and comprises a motor, a transmission assembly and two groups of chain groups, the two groups of chain groups are respectively arranged on the outer side of the long groove wall of the tank body, the chain groups are provided with a plurality of bearing pieces, and the motor drives the two chain groups to synchronously act through the transmission assembly;

a carrier, which can carry a circuit board and can be placed on the opposite bearing piece; it is characterized in that:

the lifting mechanism is operated to control the lifting hook to move the carrier back for a preset distance in a program mode, the lifting hook is placed on the corresponding receiving piece to control the residence time of the circuit board in the groove body, the thickness of a deposited metal deposition layer is further controlled, and the moving direction of the moving carrying platform is parallel to the advancing direction of the carrier in the groove body.

9. The apparatus of claim 8, wherein increasing the angle of each rotation of said motor is synchronized to increase the distance each time said carrier travels within said bath.

10. A deposition method for controlling immersion plating thickness, which operates a carrier carrying a circuit board, includes the steps of:

driving the bearing hanging piece to hoist the carrier to the highest point;

rotating the bearing hanging piece to enable the carrier to be positioned above a tank body of a chemical deposition tank;

moving the bearing hanging piece for a preset distance according to a forward direction parallel to the carrier in the groove body;

lowering the bearing hanging piece to enable the carrier and the circuit board to enter the groove body;

and controlling the carrier to move in the tank body at a preset speed.

11. The method as claimed in claim 10, wherein the distance the carrier moves within the bath is varied to control the thickness of the deposited metal layer.

12. A deposition method for controlling immersion plating thickness according to claim 10, further comprising a pick and place mechanism, wherein the pick and place mechanism comprises a lifting mechanism capable of controlling a support to lift, the support is provided with a movable platform capable of reciprocating, the movable platform is provided with a rotating platform, the rotating platform controls the bearing hanger to rotate, and a set of hooks is respectively arranged at two ends of the bearing hanger, and the carrier is lifted by the hooks.

13. A deposition method as claimed in claim 10, wherein the chemical deposition bath includes the bath body and a transmission chain set, the transmission chain set is installed at the periphery of the bath body and includes a motor, a transmission component and two sets of chain sets, the two sets of chain sets are respectively installed at the outer side of the long trough wall of the bath body, the chain set is provided with a plurality of receiving members, the motor drives the two chain sets to synchronously operate through the transmission component, the receiving members can receive the carriers, and the moving distance of the carriers in the bath body is controlled by operating the transmission chain set.