CN115074660A - Gradient composite material based on mortise and tenon structure and preparation method thereof - Google Patents
Gradient composite material based on mortise and tenon structure and preparation method thereof Download PDFInfo
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- CN115074660A CN115074660A CN202210733423.9A CN202210733423A CN115074660A CN 115074660 A CN115074660 A CN 115074660A CN 202210733423 A CN202210733423 A CN 202210733423A CN 115074660 A CN115074660 A CN 115074660A
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- 239000002131 composite material Substances 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000002346 layers by function Substances 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 230000000994 depressogenic effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003929 acidic solution Substances 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 6
- 239000012670 alkaline solution Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000001962 electrophoresis Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229910000997 High-speed steel Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/20—Pretreatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a gradient composite material based on a mortise and tenon joint structure, which comprises a substrate layer and a functional layer, wherein the substrate layer is connected with the functional layer through the mortise and tenon joint structure; the substrate layer comprises an etching area and a non-etching area, and the etching area is etched to form a raised or depressed mortise and tenon structure; the base layer at least comprises two metallographic structures, wherein the first metallographic structure is an etching phase, and the second metallographic structure is a reserved phase. The invention also provides a preparation method of the gradient composite material, which comprises the following steps: (1) preparing a substrate layer; (2) etching; (3) cleaning; (4) coating; (5) and (5) post-treatment. The invention can provide more closely combined mortise and tenon force outside the bonding force and improve the bonding strength between the functional layer and the substrate layer.
Description
Technical Field
The invention relates to the technical field of gradient functional composite materials, in particular to a gradient composite material based on a mortise and tenon structure and a preparation method thereof.
Background
In the preparation of the gradient functional composite material, if the difference between the physical properties and the chemical properties of different gradient functional layers is large, the connecting force between the functional layers is weakened, and the problem of insufficient binding force is caused.
The application No. 202010889512.3 discloses an alloy material with multi-element gradient composite coating deposited on its surface and its preparation method, and discloses a preparation method of gradient composite functional material based on physical vapor deposition, and the binding force of its functional layer and base layer is realized by means of preferentially coating a layer of binding metal.
The application number 201710304392.4 high speed steel wire cone surface coating preparation method discloses a gradient composite functional material realized based on a high speed steel matrix and a physical vapor deposition coated functional layer. In the patent, a high-speed steel substrate and a physical vapor deposition functional layer are connected by depositing a Ti metal layer as a bonding layer by preferentially using a physical vapor deposition method.
According to the prior patent disclosure, the prior art simply relies on the adhesion of the adhesive layer to the substrate to ensure the adhesion of the surface functional layer to the substrate. The bonding force between the surface functional layer and the substrate depends on the bonding force between the bonding layer in the surface functional layer and the substrate. The material and type of the substrate matched with the surface functional layer are greatly limited, and the improvement of the bonding force between the functional layer and the substrate is also greatly limited. In the prior art, in order to ensure the binding force between the functional layer and the substrate, the component selection of the binding layer in the functional layer is also limited, so that the preparation of the functional layer is limited.
Disclosure of Invention
The present invention is directed to solving the above-mentioned problems of the prior art. The invention provides a gradient composite material based on a mortise and tenon structure and a preparation method thereof, which can provide a more tightly combined mortise and tenon force in addition to an adhesive force and improve the bonding strength between a functional layer and a substrate.
In order to solve the technical problems, the embodiment of the invention discloses a gradient composite material based on a mortise and tenon structure, which comprises a substrate layer and a functional layer, wherein the substrate layer is connected with the functional layer through the mortise and tenon structure;
the substrate layer comprises an etching area and a non-etching area, and the etching area is etched to form a raised or depressed mortise and tenon structure;
the base layer at least comprises two metallographic structures, the first metallographic structure is an etching phase, and the second metallographic structure is a reserved phase.
Besides the bonding force formed by the bonding layer and the substrate, the functional layer tightly holds the raised mortise and tenon structure of the substrate or is inserted into the recessed mortise and tenon structure, so that the mortise and tenon force which is more tightly combined is provided outside the bonding force, and the bonding strength between the functional layer and the substrate is improved.
Furthermore, the weight content of the etching phase in the etching area is 9-15%, and the weight content of the etching phase in the non-etching area is 6-10%.
Furthermore, the thickness of the etching area is 0-50 μm, and the content of the etching phase in the etching area is in gradient distribution.
Further, the average grain diameter of the matrix layer is <1 μm.
Further, the etching phase is any one of an added element, a composite metallographic structure or an original component in the matrix.
The etching phase in the matrix can be an added element or a composite metallographic structure, and can also be an original component in the matrix. In the case of cemented carbide, in practice, the binder phase formed by the cobalt element is used as the etching phase, and the binder phase formed by the cobalt element is the constituent of the cemented carbide.
The embodiment of the invention also discloses a preparation method of the gradient composite material based on the mortise and tenon structure, which comprises the following steps:
(1) preparing a substrate layer;
(2) etching: placing the substrate layer prepared in the step (1) in an acidic solution or an alkaline solution, etching and removing a layer of etching phase in the etching area, and keeping the phase protrusion after etching in the acidic solution to form a protruded mortise and tenon structure; etching the etching phase of the base layer material in an alkaline solution to form a downwards-recessed tenon-and-mortise structure;
(3) cleaning: cleaning the surface of the etched substrate layer by using a mode of matching deionized water, ethanol and ultrasonic waves;
(4) coating: coating a functional layer on the surface of the cleaned substrate layer;
(5) and (5) post-treatment.
In order to avoid insufficient connecting force between the reserved phase and the substrate after etching caused by excessive etching or corrosion, the connecting strength between the reserved phase and the substrate is controlled by the modes of shortening the etching time, etching for multiple times and the like and controlling the surface roughness.
Further, in step (2), the pH of the acidic solution is <2 and the pH of the basic solution is > 12.
Further, in the step (4), the functional layer is coated by physical vapor deposition, chemical vapor deposition, electroplating, electroless plating or electrophoresis.
Further, in the step (5), post-treatment of removing the protrusions or the depressions by polishing is adopted.
Further, the etching is etching or sand blasting.
Compared with the prior art, the invention has the following technical effects:
according to the invention, the raised or depressed tenon-and-mortise structure is formed on the surface layer of the substrate layer by an etching method, the prepared functional coating not only forms a bonding force with the substrate layer through the bonding layer, but also the functional layer tightly holds the raised tenon-and-mortise structure of the substrate layer or is inserted into the depressed tenon-and-mortise structure, so that a more tightly combined tenon-and-mortise force is provided in addition to the bonding force, and the bonding strength between the functional layer and the substrate layer is improved.
Drawings
FIG. 1 is a schematic diagram showing a mortise and tenon structure formed to protrude upwards after etching in example 1 of the present invention;
FIG. 2 is a schematic diagram illustrating a structure of a mortise and tenon which is formed to be concave downwards after etching in embodiment 2 of the present invention;
reference numerals:
1 functional layer, 2 substrate layer etched surface, 2-1 etched mortise and tenon surface, 2-2 etched common surface, 3 substrate layer, 3-1 etching phase and 3-2 retention phase.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure. While the invention will be described in conjunction with the preferred embodiments, it is not intended that features of the invention be limited to these embodiments. On the contrary, the invention is described in connection with the embodiments for the purpose of covering alternatives or modifications that may be extended based on the claims of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be practiced without these particulars. Moreover, some of the specific details have been left out of the description in order to avoid obscuring or obscuring the focus of the present invention. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
Example 1
The hard alloy matrix is prepared by utilizing a known process. The main component of the matrix is WC, and the average diameter of crystal grains is 0.5 mu m. Co is an etching phase, and the weight content is 6%; an etching layer is arranged in the depth of 20 mu m downwards from the surface of the substrate, the Co content in the etching layer is 1.5 times of the average Co content in the substrate, a Co-rich layer is formed, the Co content is in gradient distribution, and the Mo content in the etching layer is 4%. Placing the hard alloy at PH<1 in HCl solution; the etching phase is corroded, and the retained phase forms an upward convex mortise and tenon structure. And cleaning the corroded hard alloy substrate by using a mode of matching deionized water, ethanol and ultrasonic waves, wherein the cleaning time is 30 min. The coating is embedded into the tenon-and-mortise structure, and the coating tightly holds the protruding tenon-and-mortise structure of the substrate. Coating TiCN 8 μm thick and Al 8 μm thick by conventional CVD process 2 O 3 The combination coating serves as a functional layer. Testing the binding force between the functional layer and the substrate by a scratch method, and determining whether to polish and remove the bulge or the depression on the coated surface or not by the binding forceAnd (4) processing the points. The connection strength of the reserved phase and the matrix is controlled by the methods of shortening the etching time, controlling the surface roughness by multiple times of etching and the like.
The bonding force is tested by a scratch method, the loading speed is 100N/min, the scratch length is 5mm, and the termination load is 170N. The average critical load tested in example 1 was 104N.
Example 2
The hard alloy matrix is prepared by utilizing a known process. The main component of the matrix is WC, and the average diameter of crystals is more than 0.5 μm and less than 1 μm. Co is an etching phase, and the weight content is 8%; an etching layer is arranged in the depth of 30 mu m downwards from the surface of the substrate, the Co content in the etching layer is 1.5 times of the average Co content in the substrate, a Co-rich layer is formed, the Co content is in gradient distribution, and the Mo content in the etching layer is 2%. Placing the hard alloy at PH>13 in NaOH solution; so that part of the hard phase and Co are corroded to form a mortise and tenon structure sunken downwards. And cleaning the corroded hard alloy substrate by using a mode of matching deionized water, ethanol and ultrasonic waves, wherein the cleaning time is 30 min. Coating TiCN 8 μm thick and Al 6 μm thick by conventional CVD process 2 O 3 The combination coating serves as a functional layer. The coating is embedded into the tenon-and-mortise structure, and the coating tightly holds the protruding tenon-and-mortise structure of the substrate. And testing the binding force between the functional layer and the substrate by a scratch method, and determining whether to perform polishing treatment for removing the convex or concave points on the coated surface by the binding force. The connection strength of the reserved phase and the matrix is controlled by the methods of shortening the etching time, controlling the surface roughness by multiple times of etching and the like.
The bonding force is tested by a scratch method, the loading speed is 100N/min, the scratch length is 5mm, and the termination load is 170N. The average critical load tested in example 2 was 109N.
Comparative example 1
The conventional CVD process for non-corroded surfaces is used to apply TiCN and Al2O3 coatings of the same thickness. The bonding force is tested by a scratch method, the loading speed is 100N/min, the scratch length is 5mm, and the termination load is 170N. Comparative example 1 tested an average critical load of 89N.
Comparative example 2
The conventional CVD process for non-corroded surfaces is used to apply TiCN and Al2O3 coatings of the same thickness. The bonding force is tested by a scratch method, the loading speed is 100N/min, the scratch length is 5mm, and the termination load is 170N. Comparative example 2 the average critical load tested was 95N.
While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing is a more detailed description of the invention, taken in conjunction with the specific embodiments thereof, and that no limitation of the invention is intended thereby. Various changes in form and detail, including simple deductions or substitutions, may be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. The gradient composite material based on the tenon-and-mortise structure is characterized by comprising a base layer and a functional layer, wherein the base layer is connected with the functional layer through the tenon-and-mortise structure;
the substrate layer comprises an etching area and a non-etching area, and the etching area is etched to form a raised or depressed mortise and tenon structure;
the base layer at least comprises two metallographic structures, the first metallographic structure is an etching phase, and the second metallographic structure is a reserved phase.
2. The gradient composite material based on a mortise and tenon joint structure of claim 1, wherein the etching phase in the etching region is 9-15% by weight, and the etching phase in the non-etching region is 6-10% by weight.
3. The gradient composite material based on a mortise and tenon joint structure of claim 1, wherein the thickness of the etching region is 0-50 μm.
4. The gradient composite material based on a mortise and tenon joint structure of claim 1, wherein the average grain diameter of the matrix layer is less than 1 μm.
5. The gradient composite material based on the mortise and tenon joint structure of claim 1, wherein the etching phase is any one of an added element, a composite metallographic structure or an original component in a matrix.
6. A preparation method of the gradient composite material based on the mortise and tenon structure, which is described in any one of claims 1 to 5, is characterized by comprising the following steps:
(1) preparing a substrate layer;
(2) etching: placing the substrate layer prepared in the step (1) in an acidic solution or an alkaline solution, etching and removing a layer of etching phase in the etching area, and keeping the phase protrusion after etching in the acidic solution to form a protruded mortise and tenon structure; etching the etching phase of the base layer material in an alkaline solution to form a downwards-recessed tenon-and-mortise structure;
(3) cleaning: cleaning the surface of the etched substrate layer by using a mode of matching deionized water, ethanol and ultrasonic waves;
(4) coating: coating a functional layer on the surface of the cleaned substrate layer;
(5) and (5) post-treatment.
7. The method for preparing a gradient composite material based on a mortise and tenon joint structure according to claim 6, wherein in the step (2), the pH of the acidic solution is less than 2, and the pH of the alkaline solution is greater than 12.
8. The method for preparing a gradient composite material based on a mortise and tenon joint structure according to claim 6, wherein in the step (4), the functional layer is coated by physical vapor deposition, chemical vapor deposition, electroplating, chemical plating or electrophoresis.
9. The method for preparing a gradient composite material based on a mortise and tenon joint structure according to claim 6, wherein in the step (5), post-treatment for removing protrusions or depressions by polishing is adopted.
10. The method for preparing the gradient composite material based on the mortise and tenon joint structure according to claim 6, wherein the etching is corrosion or sand blasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210733423.9A CN115074660A (en) | 2022-06-24 | 2022-06-24 | Gradient composite material based on mortise and tenon structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210733423.9A CN115074660A (en) | 2022-06-24 | 2022-06-24 | Gradient composite material based on mortise and tenon structure and preparation method thereof |
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| Publication Number | Publication Date |
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| CN115074660A true CN115074660A (en) | 2022-09-20 |
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| CN202210733423.9A Pending CN115074660A (en) | 2022-06-24 | 2022-06-24 | Gradient composite material based on mortise and tenon structure and preparation method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11172361A (en) * | 1997-12-05 | 1999-06-29 | Sumitomo Electric Ind Ltd | Surface-coated cemented carbide and its production |
| US20150203953A1 (en) * | 2012-07-22 | 2015-07-23 | Technion Research & Development Foundation Limited | Diamond-coated substrates |
| CN105154825A (en) * | 2015-09-22 | 2015-12-16 | 华南理工大学 | Method for preparing TiCN component gradient hard coating through advanced plasma assisted arc (APA-Arc) technology |
| CN105603387A (en) * | 2016-02-11 | 2016-05-25 | 广东工业大学 | Boron nitride composite coating, graded superfine hard alloy cutter provided with same and preparation method thereof |
| JP2017013146A (en) * | 2015-06-29 | 2017-01-19 | 三菱マテリアル株式会社 | Diamond-coated hard metal cutting tool for improving edge strength |
| CN109913801A (en) * | 2019-04-24 | 2019-06-21 | 苏州大学 | The preparation method of matrix surface plasmaassisted laser texturing PVD coating |
-
2022
- 2022-06-24 CN CN202210733423.9A patent/CN115074660A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11172361A (en) * | 1997-12-05 | 1999-06-29 | Sumitomo Electric Ind Ltd | Surface-coated cemented carbide and its production |
| US20150203953A1 (en) * | 2012-07-22 | 2015-07-23 | Technion Research & Development Foundation Limited | Diamond-coated substrates |
| JP2017013146A (en) * | 2015-06-29 | 2017-01-19 | 三菱マテリアル株式会社 | Diamond-coated hard metal cutting tool for improving edge strength |
| CN105154825A (en) * | 2015-09-22 | 2015-12-16 | 华南理工大学 | Method for preparing TiCN component gradient hard coating through advanced plasma assisted arc (APA-Arc) technology |
| CN105603387A (en) * | 2016-02-11 | 2016-05-25 | 广东工业大学 | Boron nitride composite coating, graded superfine hard alloy cutter provided with same and preparation method thereof |
| CN109913801A (en) * | 2019-04-24 | 2019-06-21 | 苏州大学 | The preparation method of matrix surface plasmaassisted laser texturing PVD coating |
Non-Patent Citations (1)
| Title |
|---|
| 黄磊 等: ""金刚石薄膜与硬质合金刀具膜-基结合性能研究进展"", 集成技术, vol. 6, no. 4, pages 29 - 35 * |
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