CN115071249B - Automatic production method of printing die - Google Patents
Automatic production method of printing die Download PDFInfo
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- CN115071249B CN115071249B CN202210678648.9A CN202210678648A CN115071249B CN 115071249 B CN115071249 B CN 115071249B CN 202210678648 A CN202210678648 A CN 202210678648A CN 115071249 B CN115071249 B CN 115071249B
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- die
- cleaning
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- 238000007639 printing Methods 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 281
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 162
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 122
- 229910052802 copper Inorganic materials 0.000 claims abstract description 122
- 239000010949 copper Substances 0.000 claims abstract description 122
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 81
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 67
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 67
- 239000011651 chromium Substances 0.000 claims abstract description 67
- 238000009713 electroplating Methods 0.000 claims abstract description 40
- 238000005498 polishing Methods 0.000 claims abstract description 37
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 14
- 239000010959 steel Substances 0.000 claims abstract description 14
- 238000003754 machining Methods 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims description 72
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 35
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 33
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 27
- 238000005507 spraying Methods 0.000 claims description 23
- 238000007654 immersion Methods 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 15
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 15
- 235000011152 sodium sulphate Nutrition 0.000 claims description 15
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 12
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 12
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004327 boric acid Substances 0.000 claims description 9
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 9
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 9
- 239000012459 cleaning agent Substances 0.000 claims description 7
- 238000012163 sequencing technique Methods 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 claims description 6
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 6
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000011780 sodium chloride Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000010924 continuous production Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 53
- 239000010410 layer Substances 0.000 description 50
- 239000000428 dust Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 210000004243 sweat Anatomy 0.000 description 6
- 239000003086 colorant Substances 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/02—Engraving; Heads therefor
- B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/003—Forme preparation the relief or intaglio pattern being obtained by imagewise deposition of a liquid, e.g. by an ink jet
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Continuous Casting (AREA)
Abstract
The invention provides an automatic production method of a printing die, and belongs to the field of printing die production and processing. The method comprises the following steps: (1) machining; (2) nickel plating treatment; (3) copper plating treatment; (4) grinding and polishing; (5) electronic engraving; (6) chromium plating treatment; and (7) proofing. The automatic production method of the printing die uses the steel plate as the raw material, and can efficiently and safely produce and manufacture the printing die product through a plurality of continuous processes, the printing die has high production efficiency, stable combination of the metal coating and the utilization rate of the metal electroplating raw material is improved.
Description
Technical Field
The invention belongs to the field of production and processing of printing dies, and particularly relates to an automatic production method of a printing die.
Background
Gravure printing is simply gravure printing, which is one of four printing modes. Intaglio printing is a direct printing method, wherein the ink contained in the intaglio pits is directly stamped on a printing stock, the gradation of a printed picture is determined by the size and the depth of the pits, if the pits are deeper, more ink is contained, and the ink layer remained on the printing stock after stamping is thicker; conversely, if the pits are shallower, the ink content is smaller and the ink layer left on the substrate after imprinting is thinner. Gravure printing is used as one of printing processes, and takes up an extremely important position in the fields of printing packaging and graphic publishing by virtue of the advantages of thick ink layer, bright color, high saturation, high printing plate printing resistance, stable printing quality, high printing speed and the like of a printing plate. The gravure plate roller is a mould product widely used for printing plastic flexible packages, cigarette wine paper packages, decorative paper wallpaper, floor leather and capsule covers.
The types of intaglio printing are divided into two categories according to the platemaking method: engraving and etching intaglio. The problems that the existing corrosion printing plate is easy to corrode and the depth is not enough to meet the requirement are solved. The control method of the engraving plate according to the engraving knife can be divided into a manual engraving plate, a mechanical engraving plate and an electronic engraving plate. The problems of heavy manual labor, high plate making cost and long period exist in the manual engraving intaglio processing, the problems of higher cost and long plate making period exist in the mechanical engraving intaglio processing, the application range is limited, and the problem of electric engraving and injection caused by plating factors exists in the electronic engraving intaglio processing.
Disclosure of Invention
The invention aims to provide an automatic production method of a printing die, aiming at the problems existing in the prior art of gravure printing die production. The method can improve the production efficiency of the printing die, improve the utilization rate of raw materials and reduce the cost.
In the technical scheme of the invention, the printing dies are processed in a set, and each set of printing dies contains at least one printing die. And determining the number of the printing dies specifically needed by each set of printing dies according to the patterns and the colors needed by the actual printing products of the clients.
In order to achieve the above purpose, the technical scheme adopted by the invention is an automatic production method of a printing mold, comprising the following steps:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die; complete processing is carried out according to the printing requirements of customers, and each set of dies comprises at least one blank die;
Rough turning: sequentially machining each blank die of the die set by an ordinary lathe to remove the natural color, and boring;
Finish turning: sequentially machining each rough turning die of the die set to required precision through a numerical control lathe, and carrying out precision sequencing and marking on each die;
(2) Nickel plating treatment
Cleaning: sequentially polishing all finish turning dies of the die set into rough surfaces, and cleaning in a cleaning tank;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished;
(3) Copper plating treatment
The nickel plating mould is put into a copper plating bath, a copper plate is used as an anode, the nickel plating mould is used as a cathode, a semi-immersion barrel plating is adopted to deposit a copper plating layer on the nickel plating mould, and pure water is used for cleaning after copper plating is finished;
(4) Grinding and polishing
Placing each copper plating mould of the die set on a grinder to grind the copper plating layer, sequencing the copper plating layer in precision again in the grinding process, and then placing the copper plating layer on a polishing machine to polish the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) Electronic engraving
Placing each copper plating mould of the polished die set on an electronic engraving machine for engraving, and engraving the surfaces of each copper plating mould in sequence according to the previous precision sequence according to a plate surface designed in advance during engraving;
(6) Chromium plating treatment
Cleaning: cleaning the die set after the electronic engraving treatment;
Plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished;
chromium polishing: polishing each chrome-plated die of the die set by using a polishing machine to obtain a printing die set;
(7) Proofing of
And (3) confirming whether the pattern on the complete printing die is consistent with the customer requirement, and packaging the complete printing die according to the number of finished die products after proofing and checking to ensure no errors.
In the technical scheme, in order to improve the bonding stability of the copper plating layer on the stainless steel die, the copper plating layer is prevented from layering or directly plating copper to damage the stainless steel body of the die for nickel plating pretreatment.
In the above technical solution of the present invention, in order to prevent oxidation or abrasion of the copper plating layer, a chromium plating treatment is performed to form a chromium protective layer, and the surface hardness of the printing mold is increased.
In an optimized embodiment of the invention, preferably, the nickel plating solution in the nickel plating tank contains 50-100g/L of nickel sulfamate, 15-20g/L of nickel chloride, 5-10g/L of sodium chloride and 35-40g/L of boric acid; the working condition of the nickel electroplating solution is that the pH value is 4.1-4.4, the temperature is 45-55 ℃, the current density is 5-10A/dm 2, the electroplating time is 5-10min, and the thickness of the plating layer is 1-2 mu m.
In an optimized embodiment of the invention, preferably, the copper plating solution in the copper plating tank contains 150-200g/L of copper sulfate, 5-10g/L of sodium sulfate and 35-40g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 3.5-4, the temperature is 45-55 ℃, the current density is 10-20A/dm 2, the electroplating time is 15-20min, and the thickness of the plating layer is 50-70 mu m.
In an optimized embodiment of the invention, preferably, the chromium plating solution in the chromium plating bath contains 100 to 150g/L chromic anhydride, 8 to 12g/L sodium sulfate and 40 to 50g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 3-4, the temperature is 45-55 ℃, the current density is 30-40A/dm 2, the plating time is 15-20min, and the plating thickness is 8-10 mu m.
In an optimized embodiment of the invention, in the step (2), the metal cleaning agent is sprayed and cleaned firstly, then 5-10% sulfuric acid solution is used for cleaning the finish turning mold, then pure water is sprayed and cleaned firstly, then 5-10% sulfuric acid solution is used for cleaning the finish turning mold, and then pure water is used for spraying.
In the technical scheme of the invention, in order to facilitate nickel plating treatment, greasy dirt, dust, fingerprints, sweat stains and other impurities on the surface of the finish turning die are removed by cleaning before nickel plating.
In an optimized embodiment of the invention, in the step (6), the complete mould after the electronic engraving treatment is cleaned, degreasing and spraying are carried out by adopting 5-10% sodium hydroxide solution, then spraying 5-10% sulfuric acid solution, and then cleaning by using pure water.
In the technical scheme of the invention, in order to facilitate the chromium plating treatment, grease stains, dust sweat stains and other impurities on the surface of the die are removed by cleaning before chromium plating.
Further, in order to solve the problem of the electric carving injection caused by the too thick and too hard copper plating layer, the invention carries out nickel-plating copper alloy plating treatment before copper plating after nickel plating, namely, carries out nickel-plating copper alloy plating treatment before copper plating treatment in the step (3).
In an optimized embodiment of the present invention, preferably, the nickel-copper alloy plating method is to place the nickel-copper alloy plated mold into a nickel-copper alloy plating tank, nickel-copper alloy is used as an anode, nickel-copper alloy is used as a cathode, semi-immersion barrel plating is used to deposit nickel-copper alloy plating layer on the nickel-copper alloy plated mold, and pure water is used to clean after the nickel-copper alloy plating is completed.
In the technical scheme of the invention, the transition layer formed by the nickel-plated copper alloy treatment further improves the bonding stability of the copper plating layer.
In an optimized embodiment of the invention, preferably, the nickel-copper alloy electroplating solution in the nickel-copper alloy electroplating tank contains 30-50g/L nickel sulfate, 150-200g/L copper sulfate, 7-13g/L sodium sulfate and 35-40g/L boric acid; the working condition of the nickel-copper alloy electroplating solution is that the pH value is 3.5-4, the temperature is 45-55 ℃, the current density is 5-10A/dm 2, the electroplating time is 15-20min, and the thickness of a plating layer is 10-30 mu m.
The beneficial technical effects of the invention are as follows:
1. The automatic production method of the printing die uses the steel plate as the raw material, and can efficiently and safely produce and manufacture the printing die product through a plurality of continuous processes, the printing die has high production efficiency, stable combination of the metal coating and the utilization rate of the metal electroplating raw material is improved.
2. The invention carries out nickel plating treatment before copper plating, can avoid the damage of the stainless steel body of the die caused by direct copper plating when layering or copper plating occurs on the copper plating layer, and improves the bonding stability of the copper plating layer on the stainless steel die. In order to prevent oxidation or abrasion of the copper plating layer, a chromium plating treatment is performed to form a chromium protective layer, and the surface hardness of the printing mold is increased. In order to facilitate the nickel plating treatment, the surface of the finish turning mould is cleaned and removed with greasy dirt, dust, fingerprints, sweat and other impurities before nickel plating; in order to facilitate the chromium plating treatment, the surface of the die is cleaned and removed from grease stains, dust sweat stains and other impurities before chromium plating.
3. According to the invention, nickel-copper alloy plating treatment is performed after and before nickel plating, so that the welding stress is reduced, the problem of electric carving injection caused by too thick and too hard copper plating is solved, and meanwhile, the bonding stability of the copper plating is further improved by the transition layer formed by the nickel-copper alloy plating treatment.
Drawings
FIG. 1 is a process flow diagram of an automated production method for a graphic arts die of the present invention;
Detailed Description
The technical solutions of the present invention will be clearly and completely illustrated by the following examples, and it is obvious that the described examples are only some examples of the present invention, but not all examples. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
In this embodiment, since the pattern of the actual printed product is a single color, only one printing mold needs to be manufactured for one printing mold. The specific manufacturing method comprises the following steps:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die;
rough turning: the blank mould is processed by an ordinary lathe to remove the natural color, and boring treatment is carried out;
finish turning: machining the rough turning die to the required precision through a numerical control lathe, and marking;
(2) Nickel plating treatment
Cleaning: sequentially polishing the finish turning die into rough surfaces, and cleaning in a cleaning tank; when the finish turning mold is cleaned, firstly, spraying and cleaning are carried out by using a metal cleaning agent, then, spraying and cleaning are carried out by using 5% sulfuric acid solution, and then, when the finish turning mold is cleaned by using pure water, firstly, spraying and cleaning are carried out by using the metal cleaning agent, then, spraying and cleaning are carried out by using 5% sulfuric acid solution, and then, spraying by using pure water;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished; the nickel plating solution in the nickel plating bath contains 50g/L of nickel sulfamate, 15g/L of nickel chloride, 5g/L of sodium chloride and 35g/L of boric acid; the working condition of the nickel plating solution is that the pH value is 4.4, the temperature is 45 ℃, the current density is 5A/dm 2, the plating time is 5min, and the plating thickness is 1 mu m;
(3) Copper plating treatment
The nickel plating mould is put into a copper plating bath, a copper plate is used as an anode, the nickel plating mould is used as a cathode, a semi-immersion barrel plating is adopted to deposit a copper plating layer on the nickel plating mould, and pure water is used for cleaning after copper plating is finished; the copper plating solution in the copper plating tank contains 150g/L of copper sulfate, 5g/L of sodium sulfate and 35g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 4, the temperature is 45 ℃, the current density is 10A/dm 2, the electroplating time is 15min, and the thickness of a coating is 50 mu m;
(4) Grinding and polishing
Placing the copper plating mould on a grinder to grind the copper plating layer, then placing the copper plating mould on a polishing machine to polish the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) Electronic engraving
Placing the copper plating mould on an electronic engraving machine for engraving, and engraving the surface of the copper plating mould according to a plate designed in advance during engraving;
(6) Chromium plating treatment
Cleaning: cleaning the die subjected to the electronic engraving treatment; degreasing and spraying 5% sodium hydroxide solution, spraying 5% sulfuric acid solution, and cleaning with pure water;
plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished; the chromium plating solution in the chromium plating bath contains 100g/L chromic anhydride, 8-12g/L sodium sulfate and 40 g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 4, the temperature is 45 ℃, the current density is 30A/dm 2, the plating time is 15min, and the plating thickness is 8 mu m;
Chromium polishing: polishing the chromeplate mould by a polishing machine to obtain a printing mould;
(7) Proofing of
And (5) confirming whether the pattern on the printing die is consistent with the customer requirement, and packaging after proofing inspection is ensured to be correct.
In the embodiment, nickel plating treatment is performed before copper plating, so that the phenomenon that the stainless steel body of the die is damaged by direct copper plating when layering or copper plating occurs on the copper plating layer can be avoided, and the bonding stability of the copper plating layer on the stainless steel die is improved. In order to prevent oxidation or abrasion of the copper plating layer, a chromium plating treatment is performed to form a chromium protective layer, and the surface hardness of the printing mold is increased. In order to facilitate the nickel plating treatment, the surface of the finish turning mould is cleaned and removed with greasy dirt, dust, fingerprints, sweat and other impurities before nickel plating; in order to facilitate the chromium plating treatment, the surface of the die is cleaned and removed from grease stains, dust sweat stains and other impurities before chromium plating.
Example 2
In this embodiment, since the patterns of the actual printed product of the customer are 4 colors, one set of printing mold needs to make 4 printing molds. The specific manufacturing method comprises the following steps:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die; processing 4 blank molds as a set of printing molds according to the method;
Rough turning: sequentially processing the 4 blank dies by an ordinary lathe to remove the natural color, and boring;
finish turning: sequentially machining the 4 rough turning dies to required precision through a numerical control lathe, and sequencing and marking the precision of each die;
(2) Nickel plating treatment
Cleaning: sequentially polishing the 4 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning die is cleaned, firstly, spraying and cleaning with a metal cleaning agent, then, cleaning with a 6% sulfuric acid solution, and then, spraying with pure water;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished; the nickel plating solution in the nickel plating bath contains 80g/L of nickel sulfamate, 18g/L of nickel chloride, 7g/L of sodium chloride and 38g/L of boric acid; the working condition of the nickel plating solution is that the pH value is 4.2, the temperature is 50 ℃, the current density is 5A/dm 2, the plating time is 8min, and the plating thickness is 1.5 mu m;
(3) Copper plating treatment
The nickel plating mould is put into a copper plating bath, a copper plate is used as an anode, the nickel plating mould is used as a cathode, a semi-immersion barrel plating is adopted to deposit a copper plating layer on the nickel plating mould, and pure water is used for cleaning after copper plating is finished; the copper plating solution in the copper plating tank contains 175g/L of copper sulfate, 7g/L of sodium sulfate and 38g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 3.7, the temperature is 50 ℃, the current density is 15A/dm 2, the electroplating time is 18min, and the thickness of a coating is 60 mu m;
(4) Grinding and polishing
Placing the 4 copper plating molds on a grinder to grind the copper plating layers, sorting the copper plating layers in precision again in the grinding process, and then placing the copper plating layers on a polishing machine to polish the copper plating layers to form mirror surfaces on the surfaces of the copper plating layers;
(5) Electronic engraving
Placing the polished 4 copper plating molds on an electronic engraving machine for engraving, and sequentially engraving the surfaces of the copper plating molds according to the previous precision sequence according to the plates designed in advance during engraving;
(6) Chromium plating treatment
Cleaning: cleaning the 4 moulds subjected to the electronic engraving treatment; when the die set after electronic engraving treatment is cleaned, 6% sodium hydroxide solution is adopted for degreasing and spraying, then 6% sulfuric acid solution is sprayed, and then pure water is used for cleaning
Plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished; the chromium plating solution in the chromium plating bath contains 120g/L chromic anhydride, 10g/L sodium sulfate and 45g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 3.5, the temperature is 50 ℃, the current density is 35A/dm 2, the plating time is 18min, and the plating thickness is 9 mu m;
Chromium polishing: polishing the 4 moulds by using a polishing machine to obtain a complete set of printing moulds;
(7) Proofing of
And (5) confirming whether the patterns on the printing die sets are consistent with the requirements of customers, and checking the proofing to ensure that the 4 printing die sets are packaged after error-free.
Example 3
In this embodiment, since the patterns of the actual printed product of the customer are 6 colors, one set of printing mold needs to manufacture 6 printing molds. The specific manufacturing method comprises the following steps:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die; processing 6 blank molds as a set of printing molds according to the method;
Rough turning: sequentially processing the 6 blank molds through an ordinary lathe to remove the natural color, and boring;
finish turning: sequentially processing the 6 rough turning dies to required precision through a numerical control lathe, and sequencing and marking the precision of each die;
(2) Nickel plating treatment
Cleaning: sequentially polishing 6 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning die is cleaned, firstly, spraying and cleaning with a metal cleaning agent, then, cleaning with a 10% sulfuric acid solution, and then, spraying with pure water;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished; the nickel plating solution in the nickel plating bath contains 100g/L of nickel sulfamate, 20g/L of nickel chloride, 10g/L of sodium chloride and 40g/L of boric acid; the working condition of the nickel plating solution is that the pH value is 4.1, the temperature is 55 ℃, the current density is 10A/dm 2, the plating time is 10min, and the plating thickness is 2 mu m;
(3) Copper plating treatment
The nickel plating mould is put into a copper plating bath, a copper plate is used as an anode, the nickel plating mould is used as a cathode, a semi-immersion barrel plating is adopted to deposit a copper plating layer on the nickel plating mould, and pure water is used for cleaning after copper plating is finished; the copper plating solution in the copper plating tank contains 200g/L of copper sulfate, 10g/L of sodium sulfate and 40g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 3.5, the temperature is 55 ℃, the current density is 20A/dm 2, the electroplating time is 20min, and the thickness of a coating is 70 mu m;
(4) Grinding and polishing
Placing the 6 copper plating molds on a grinder to grind the copper plating layers, sorting the copper plating layers in precision again in the grinding process, and then placing the copper plating layers on a polishing machine to polish the copper plating layers to form mirror surfaces on the surfaces of the copper plating layers;
(5) Electronic engraving
Placing the polished 6 copper plating molds on an electronic engraving machine for engraving, and sequentially engraving the surfaces of the copper plating molds according to the previous precision sequence according to the plates designed in advance during engraving;
(6) Chromium plating treatment
Cleaning: cleaning the 6 moulds subjected to the electronic engraving treatment; when the die set after electronic engraving treatment is cleaned, 10% sodium hydroxide solution is adopted for degreasing and spraying, 10% sulfuric acid solution is sprayed, and then pure water is used for cleaning
Plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished; the chromium plating solution in the chromium plating bath contains 150g/L chromic anhydride, 12g/L sodium sulfate and 50g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 3, the temperature is 55 ℃, the current density is 40A/dm 2, the plating time is 20min, and the plating thickness is 10 mu m;
chromium polishing: polishing the 6 moulds by using a polishing machine to obtain a complete set of printing moulds;
(7) Proofing of
And (5) confirming whether the patterns on the printing die sets are consistent with the requirements of customers, and checking the proofing to ensure that the 6 printing die sets are packaged after error-free.
Example 4
In this embodiment, since the patterns of the actual printed product of the customer are 6 colors, one set of printing mold needs to manufacture 6 printing molds.
Referring to fig. 1, the specific manufacturing method is as follows:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die; processing 6 blank molds as a set of printing molds according to the method;
Rough turning: sequentially processing the 6 blank molds through an ordinary lathe to remove the natural color, and boring;
finish turning: sequentially processing the 6 rough turning dies to required precision through a numerical control lathe, and sequencing and marking the precision of each die;
(2) Nickel plating treatment
Cleaning: sequentially polishing 6 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning die is cleaned, firstly, spraying and cleaning with a metal cleaning agent, then, cleaning with a 10% sulfuric acid solution, and then, spraying with pure water;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished; the nickel plating solution in the nickel plating bath contains 100g/L of nickel sulfamate, 20g/L of nickel chloride, 10g/L of sodium chloride and 40g/L of boric acid; the working condition of the nickel plating solution is that the pH value is 4.1, the temperature is 55 ℃, the current density is 10A/dm 2, the plating time is 10min, and the plating thickness is 2 mu m;
(3) Copper plating treatment
Putting the nickel-plated mould into a nickel-copper alloy electroplating bath, taking nickel-copper alloy as an anode, taking the nickel-plated mould as a cathode, adopting semi-immersion barrel plating to deposit a nickel-copper alloy coating on the nickel-plating mould, and cleaning with pure water after the nickel-copper alloy coating is finished; the nickel-copper alloy electroplating solution in the nickel-copper alloy electroplating bath contains 40g/L of nickel sulfate, 1750g/L of copper sulfate, 10g/L of sodium sulfate and 38g/L of boric acid; the working condition of the nickel-copper alloy electroplating solution is that the pH value is 3.8, the temperature is 50 ℃, the current density is 5A/dm 2, the electroplating time is 18min, and the thickness of a coating is 20 mu m;
(4) Copper plating treatment
Placing a nickel-plated copper alloy die into a copper plating bath, taking a copper plate as an anode, taking the nickel-plated die as a cathode, adopting semi-immersion barrel plating to deposit a copper plating layer on the nickel-plated die, and cleaning with pure water after copper plating is finished; the copper plating solution in the copper plating tank contains 200g/L of copper sulfate, 10g/L of sodium sulfate and 40g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 3.5, the temperature is 55 ℃, the current density is 20A/dm 2, the electroplating time is 20min, and the thickness of a coating is 70 mu m;
(5) Grinding and polishing
Placing the 6 copper plating molds on a grinder to grind the copper plating layers, sorting the copper plating layers in precision again in the grinding process, and then placing the copper plating layers on a polishing machine to polish the copper plating layers to form mirror surfaces on the surfaces of the copper plating layers;
(6) Electronic engraving
Placing the polished 6 copper plating molds on an electronic engraving machine for engraving, and sequentially engraving the surfaces of the copper plating molds according to the previous precision sequence according to the plates designed in advance during engraving;
(7) Chromium plating treatment
Cleaning: cleaning the 6 moulds subjected to the electronic engraving treatment; when the die set after electronic engraving treatment is cleaned, 10% sodium hydroxide solution is adopted for degreasing and spraying, 10% sulfuric acid solution is sprayed, and then pure water is used for cleaning
Plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished; the chromium plating solution in the chromium plating bath contains 150g/L chromic anhydride, 12g/L sodium sulfate and 50g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 3, the temperature is 55 ℃, the current density is 40A/dm 2, the plating time is 20min, and the plating thickness is 10 mu m;
chromium polishing: polishing the 6 moulds by using a polishing machine to obtain a complete set of printing moulds;
(8) Proofing of
And (5) confirming whether the patterns on the printing die sets are consistent with the requirements of customers, and checking the proofing to ensure that the 6 printing die sets are packaged after error-free.
Unlike example 4, this example was treated with nickel-plated copper alloy before copper plating after nickel plating, and was mainly used for solving the problem of electric engraving and pin punching due to too thick and too hard copper plating.
In the technical scheme of the embodiment, the transition layer formed by the nickel-plated copper alloy treatment further improves the bonding stability of the copper plating layer.
While the invention has been described with respect to the preferred embodiments, it will be apparent to those skilled in the art that various changes and substitutions can be made herein without departing from the scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. An automated production method of a printing mold, comprising:
(1) Machining treatment
Cutting and welding: cutting a steel plate into a required size through a plate shearing machine, rolling into a cylinder with corresponding specification, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs with the cylinder to obtain a blank die; complete processing is carried out according to the printing requirements of customers, and each set of dies comprises at least one blank die;
Rough turning: sequentially machining each blank die of the die set by an ordinary lathe to remove the natural color, and boring;
Finish turning: sequentially machining each rough turning die of the die set to required precision through a numerical control lathe, and carrying out precision sequencing and marking on each die;
(2) Nickel plating treatment
Cleaning: sequentially polishing all finish turning dies of the die set into rough surfaces, and cleaning in a cleaning tank; when the finish turning die is cleaned, firstly, spraying and cleaning with a metal cleaning agent, then, cleaning with 5-10% sulfuric acid solution, and then, spraying with pure water;
Nickel plating: in a nickel electroplating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a semi-immersion barrel plating is adopted to deposit a nickel coating on the finish turning mold, and pure water is used for cleaning after the nickel plating is finished; putting the nickel-plated mould into a nickel-copper alloy electroplating bath, taking nickel-copper alloy as an anode, taking the nickel-plated mould as a cathode, adopting semi-immersion barrel plating to deposit a nickel-copper alloy coating on the nickel-plating mould, and cleaning with pure water after the nickel-copper alloy coating is finished;
(3) Copper plating treatment
Continuously placing the die set into a copper plating bath, taking a copper plate as an anode, taking a nickel plating die as a cathode, adopting semi-immersion barrel plating to deposit a copper plating layer on the nickel plating die, and cleaning with pure water after copper plating is finished;
(4) Grinding and polishing
Placing each copper plating mould of the die set on a grinder to grind the copper plating layer, sequencing the copper plating layer in precision again in the grinding process, and then placing the copper plating layer on a polishing machine to polish the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) Electronic engraving
Placing each copper plating mould of the polished die set on an electronic engraving machine for engraving, and engraving the surfaces of each copper plating mould in sequence according to the previous precision sequence according to a plate surface designed in advance during engraving;
(6) Chromium plating treatment
Cleaning: cleaning the die set after the electronic engraving treatment; degreasing and spraying 5-10% sodium hydroxide solution, spraying 5-10% sulfuric acid solution, and cleaning with pure water;
Plating chromium: placing the cleaned mould into a chromium plating bath, taking a lead-tin alloy plate as an anode, taking an electronic engraving mould as a cathode, adopting semi-immersion barrel plating to deposit a chromium coating on the electronic engraving mould, and cleaning with pure water after the chromium plating is finished;
chromium polishing: polishing each chrome-plated die of the die set by using a polishing machine to obtain a printing die set;
(7) Proofing of
And (3) confirming whether the pattern on the complete printing die is consistent with the customer requirement, and packaging the complete printing die according to the number of finished die products after proofing and checking to ensure no errors.
2. The automated production method of a graphic arts die as claimed in claim 1, further comprising: the nickel plating solution in the nickel plating bath contains 50-100g/L of nickel sulfamate, 15-20g/L of nickel chloride, 5-10g/L of sodium chloride and 35-40g/L of boric acid; the working condition of the nickel electroplating solution is that the pH value is 4.1-4.4, the temperature is 45-55 ℃, the current density is 5-10A/dm 2, the electroplating time is 5-10min, and the thickness of the plating layer is 1-2 mu m.
3. The automated production method of a graphic arts die as claimed in claim 1, further comprising: the copper electroplating solution in the copper electroplating bath contains 150-200g/L of copper sulfate, 5-10g/L of sodium sulfate and 35-40g/L of sulfuric acid; the working condition of the copper electroplating solution is that the pH value is 3.5-4, the temperature is 45-55 ℃, the current density is 10-20A/dm 2, the electroplating time is 15-20min, and the thickness of the plating layer is 50-70 mu m.
4. The automated production method of a graphic arts die as claimed in claim 1, further comprising: the chromium plating solution in the chromium plating bath contains 100-150g/L chromic anhydride, 8-12g/L sodium sulfate and 40-50g/L sulfuric acid; the working condition of the chromium plating solution is that the pH value is 3-4, the temperature is 45-55 ℃, the current density is 30-40A/dm 2, the plating time is 15-20min, and the plating thickness is 8-10 mu m.
5. The automated production method of a graphic arts die as claimed in claim 1, further comprising: the nickel-copper alloy electroplating solution in the nickel-copper alloy electroplating bath contains 30-50g/L of nickel sulfate, 150-200g/L of copper sulfate, 7-13g/L of sodium sulfate and 35-40g/L of boric acid; the working condition of the nickel-copper alloy electroplating solution is that the pH value is 3.5-4, the temperature is 45-55 ℃, the current density is 5-10A/dm 2, the electroplating time is 15-20min, and the thickness of a plating layer is 10-30 mu m.
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