CN115071249A - Automatic production method of printing die - Google Patents
Automatic production method of printing die Download PDFInfo
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- CN115071249A CN115071249A CN202210678648.9A CN202210678648A CN115071249A CN 115071249 A CN115071249 A CN 115071249A CN 202210678648 A CN202210678648 A CN 202210678648A CN 115071249 A CN115071249 A CN 115071249A
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- nickel
- plating
- copper
- mould
- cleaning
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- 238000007639 printing Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 223
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 170
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 103
- 229910052802 copper Inorganic materials 0.000 claims abstract description 103
- 239000010949 copper Substances 0.000 claims abstract description 103
- 238000009713 electroplating Methods 0.000 claims abstract description 88
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 85
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 70
- 239000011651 chromium Substances 0.000 claims abstract description 70
- 238000005498 polishing Methods 0.000 claims abstract description 38
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 20
- 239000010959 steel Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000003754 machining Methods 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 73
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 35
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 32
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 25
- 238000005507 spraying Methods 0.000 claims description 25
- 238000007654 immersion Methods 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 14
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 13
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 13
- 235000011152 sodium sulphate Nutrition 0.000 claims description 13
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 12
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 12
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004327 boric acid Substances 0.000 claims description 9
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 9
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 9
- 238000012163 sequencing technique Methods 0.000 claims description 8
- 239000012459 cleaning agent Substances 0.000 claims description 7
- 238000005238 degreasing Methods 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 6
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 6
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000011780 sodium chloride Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 55
- 239000000428 dust Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 210000004243 sweat Anatomy 0.000 description 6
- 239000003086 colorant Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009459 flexible packaging Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/02—Engraving; Heads therefor
- B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/003—Forme preparation the relief or intaglio pattern being obtained by imagewise deposition of a liquid, e.g. by an ink jet
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/08—Deposition of black chromium, e.g. hexavalent chromium, CrVI
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Continuous Casting (AREA)
Abstract
The invention provides an automatic production method of a printing die, and belongs to the field of production and processing of printing dies. The method comprises the following steps: (1) machining; (2) nickel plating treatment; (3) copper plating treatment; (4) grinding and polishing; (5) electronic engraving; (6) carrying out chromium plating treatment; (7) and (6) proofing. The automatic production method of the printing mould takes the steel plate as the raw material, can efficiently and safely produce and manufacture the printing mould product through a plurality of continuous working procedures, has high production efficiency of the printing mould, stable combination of the metal coating and improves the utilization rate of metal electroplating raw materials.
Description
Technical Field
The invention belongs to the field of production and processing of printing dies, and particularly relates to an automatic production method of a printing die.
Background
Intaglio printing is called intaglio printing for short and is one of four printing modes. Intaglio printing is a direct printing method, which directly imprints the ink contained in the intaglio pits on a printing stock, wherein the shade level of the printed picture is determined by the size and the depth of the pits, if the pits are deeper, the contained ink is more, and the ink layer left on the printed matter after impressing is thicker; conversely, if the pit is shallow, the amount of ink contained is small, and the ink layer left on the substrate after the imprint is thin. Intaglio printing is one of printing processes, and the advantages of thick ink layer, bright color, high saturation, high printing plate printing resistance, stable quality of printed products, high printing speed and the like of the intaglio printing occupy an extremely important position in the fields of printing packaging and graphic publishing. The gravure printing roller is a mold product widely used for plastic flexible packaging, cigarette and wine paper packaging, decorative paper wallpaper, floor leather and capsule cover printing.
The kind of gravure printing is classified into two types according to the plate making method: engraved intaglio plates and etched intaglio plates. The existing corrosion printing plate processing easily has the problem that the corrosion is too incomplete or the depth is not enough to meet the requirement. The engraved intaglio may be divided into a manual engraved intaglio, a mechanical engraved intaglio and an electronic engraved intaglio according to a control method of a nicking tool. The problems of heavy manual labor, high plate-making cost and long period exist in the manual engraving intaglio processing, the problems of higher cost and long plate-making period exist in the mechanical engraving intaglio processing, the application range is limited, and the problem of electric engraving and needle punching caused by plating factors exists in the electronic engraving intaglio processing.
Disclosure of Invention
The invention aims to provide an automatic production method of a printing mould aiming at the problems of the existing production process of the gravure printing mould. The method can improve the production efficiency of the printing mould, improve the utilization rate of raw materials and reduce the cost.
According to the technical scheme, the printing dies are processed in sets, and each set of printing die comprises at least one printing die. And determining the number of the specifically required printing molds of each set of printing molds according to the patterns and colors required by the actual printed products of customers.
In order to achieve the purpose, the technical scheme adopted by the invention is an automatic production method of a printing mold, which comprises the following steps:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold; processing in sets according to the printing requirements of customers, wherein each set of die comprises at least one blank die;
rough turning: processing each blank mould of the complete set of moulds through a common lathe in sequence to remove the natural color, and boring;
finish turning: sequentially processing each rough turning die of the die set to required precision through a numerical control lathe, and performing precision sequencing and marking on each die;
(2) nickel plating treatment
Cleaning: sequentially polishing each finish turning die of the die set into rough surfaces, and cleaning in a cleaning tank;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished;
(3) copper plating treatment
Putting the nickel plating mould into a copper plating bath, taking a copper plate as an anode and the nickel plating mould as a cathode, depositing a copper plating layer on the nickel plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished;
(4) grinding and polishing
Placing each copper plating mould of the set of moulds on a grinding machine to grind the copper plating layer, performing precision sorting again in the grinding process, and then placing the copper plating layer on a polishing machine to polish the surface of the copper plating layer to form a mirror surface;
(5) electronic carving
Placing each copper-plated mould of the polished complete set of moulds on an electronic engraving machine for electric engraving, and sequentially engraving the surfaces of the copper-plated moulds according to the previous precision sequence according to a pre-designed plate surface during electric engraving;
(6) treatment of chromium plating
Cleaning: cleaning the set of die subjected to the electronic engraving treatment;
and (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished;
and (3) chromium polishing: polishing each chromium plating mould of the complete set of moulds by using a polishing machine to obtain a complete set of printing moulds;
(7) proofing
And confirming whether the patterns on the printing mould set are consistent with the requirements of customers, proofing, checking and ensuring no errors, and then packaging the printing mould set according to the quantity of the finished mould products.
In the technical scheme of the invention, in order to improve the combination stability of the copper plating layer on the stainless steel die and avoid the phenomenon that the copper plating layer is layered or the direct copper plating damages the stainless steel body of the die to carry out nickel plating pretreatment when the copper plating layer is plated.
In the above technical solution of the present invention, in order to prevent the copper plating layer from being oxidized or worn, a chromium plating treatment is performed to form a chromium protection layer and to increase the surface hardness of the printing mold.
In a preferred embodiment of the present invention, the nickel electroplating solution in the nickel electroplating bath preferably contains 50-100g/L of nickel sulfamate, 15-20g/L of nickel chloride, 5-10g/L of sodium chloride and 35-40 g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.1-4.4, the temperature is 45-55 ℃, and the current density is 5-10A/dm 2 The electroplating time is 5-10min, and the thickness of the plating layer is 1-2 μm.
In a preferred embodiment of the present invention, the copper plating solution in the copper plating bath preferably contains copper sulfate 150-; the working conditions of the copper electroplating solution are that the pH value is 3.5-4, the temperature is 45-55 ℃, and the current density is 10-20A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 50-70 μm.
In a preferred embodiment of the present invention, the chromium plating solution in the chromium plating bath preferably contains 150g/L of chromic anhydride 100-; the working conditions of the chromium electroplating solution are that the pH value is 3-4, the temperature is 45-55 ℃, and the current density is 30-40A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 8-10 μm.
In a preferred embodiment of the present invention, in step (2), the finish turning mold is preferably cleaned by spraying with a metal cleaning agent, followed by cleaning with a 5-10% sulfuric acid solution, followed by spraying with pure water to clean the finish turning mold, followed by cleaning with a 5-10% sulfuric acid solution, followed by spraying with pure water.
In the technical scheme of the invention, in order to facilitate nickel plating treatment, oil stain, dust, fingerprints, sweat stain and other impurities on the surface of the finish turning die are cleaned and removed before nickel plating.
In a preferred embodiment of the present invention, in step (6), the set of dies after the electronic engraving treatment is preferably cleaned by spraying 5-10% sodium hydroxide solution for degreasing, spraying 5-10% sulfuric acid solution for degreasing, and then cleaning with pure water.
In the technical scheme of the invention, in order to facilitate the chromium plating treatment, the surface of the mold is cleaned and removed with grease stains, dust sweat stains and other impurities before chromium plating.
Further, in order to solve the problem of electric carving needle punching caused by over-thickness and over-hardness of the copper plating layer, nickel-copper alloy plating treatment is carried out after nickel plating and before copper plating, namely, before the copper plating treatment in the step (3), nickel-copper alloy plating treatment is also carried out.
In an optimized implementation scheme of the invention, preferably, the nickel-plated copper alloy treatment method is to place the mold after nickel plating treatment into a nickel-copper alloy plating bath, use the nickel-copper alloy as an anode and the nickel-plated mold as a cathode, deposit a nickel-copper alloy plating layer on the nickel-plated mold by adopting semi-immersion barrel plating, and perform pure water cleaning after the nickel-copper alloy plating is finished.
In the technical scheme of the invention, the transition layer formed by the nickel-plated copper alloy treatment further improves the bonding stability of the copper-plated layer.
In a preferred embodiment of the present invention, the nickel-copper alloy plating solution in the nickel-copper alloy plating bath preferably contains 30-50g/L of nickel sulfate, 150g/L of copper sulfate, 7-13g/L of sodium sulfate, and 35-40 g/L of boric acid; the working conditions of the nickel-copper alloy electroplating solution are that the pH value is 3.5-4, the temperature is 45-55 ℃, and the current density is 5-10A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 10-30 μm.
The invention has the beneficial technical effects that:
1. the automatic production method of the printing mould takes the steel plate as the raw material, can efficiently and safely produce and manufacture the printing mould product through a plurality of continuous working procedures, has high production efficiency of the printing mould, stable combination of the metal coating and improves the utilization rate of metal electroplating raw materials.
2. The invention carries out nickel plating treatment before copper plating, can avoid the delamination of a copper plating layer or the damage of a stainless steel body of the die by directly plating copper during copper plating, and improves the combination stability of the copper plating layer on the stainless steel die. In order to prevent the copper plating layer from being oxidized or worn, a chromium plating treatment is performed to form a chromium protective layer and increase the surface hardness of the printing mold. In order to facilitate nickel plating treatment, oil stain, dust, fingerprints, sweat stain and other impurities on the surface of the finish turning mold are cleaned and removed before nickel plating; in order to facilitate the chromium plating treatment, the surface of the mold is cleaned and removed of grease stains, dust sweat stains and other impurities before chromium plating.
3. The invention carries out nickel-copper alloy plating treatment after nickel plating and before copper plating, reduces welding stress, solves the problem of electric carving and needle punching caused by over-thickness and over-hardness of a copper plating layer, and simultaneously, a transition layer formed by nickel-copper alloy plating treatment further improves the combination stability of the copper plating layer.
Drawings
FIG. 1 is a process flow diagram of the automated method of manufacturing a printing mold according to the present invention;
Detailed Description
The technical solutions of the present invention are clearly and completely illustrated by the following embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In this embodiment, since the customer actually prints a single color in the pattern of the product, one set of printing mold only needs to make one printing mold. The specific preparation method comprises the following steps:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold;
rough turning: processing the blank mould through a common lathe to remove the true color, and boring;
finish turning: machining the rough turning die to the required precision through a numerical control lathe, and marking;
(2) nickel plating treatment
Cleaning: sequentially polishing the finish turning die into rough surfaces, and cleaning in a cleaning tank; when the finish turning mold is cleaned, firstly, a metal cleaning agent is used for spraying and cleaning, then, a 5% sulfuric acid solution is used for cleaning, then, when the finish turning mold is cleaned by spraying and cleaning with pure water, firstly, the metal cleaning agent is used for spraying and cleaning, then, the 5% sulfuric acid solution is used for cleaning, and then, the pure water is used for spraying and cleaning;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished; the nickel electroplating solution in the nickel electroplating bath comprises 50g/L of nickel sulfamate, 15g/L of nickel chloride, 5g/L of sodium chloride and 35 g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.4, the temperature is 45 ℃, and the current density is 5A/dm 2 Electroplating for 5min, wherein the thickness of the coating is 1 mu m;
(3) copper plating treatment
Putting the nickel plating mould into a copper plating bath, taking a copper plate as an anode and the nickel plating mould as a cathode, depositing a copper plating layer on the nickel plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished; the copper electroplating solution in the copper electroplating bath contains 150g/L of copper sulfate, 5g/L of sodium sulfate and 35 g/L of sulfuric acid; the working conditions of the copper electroplating solution are that the pH value is 4, the temperature is 45 ℃, and the current density is 10A/dm 2 Electroplating time is 15min, and the thickness of a plating layer is 50 mu m;
(4) grinding and polishing
Placing the copper plating mould on a grinding machine to grind the copper plating layer, then placing the copper plating mould on a polishing machine, and polishing the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) electronic carving
Placing the copper plating mould on an electronic engraving machine for electric engraving, wherein the surface of the copper plating mould is engraved according to a pre-designed layout during electric engraving;
(6) treatment of chromium plating
Cleaning: cleaning the die subjected to the electronic engraving treatment; when the die after the electronic engraving treatment is cleaned, 5% sodium hydroxide solution is adopted for degreasing and spraying, then 5% sulfuric acid solution is sprayed, and then pure water is used for cleaning;
and (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished; the chromium electroplating solution in the chromium electroplating bath contains 100g/L of chromic anhydride, 8-12g/L of sodium sulfate and 40g/L of sulfuric acid; the working conditions of the chromium electroplating solution are pH value 4, temperature 45 ℃ and current density 30A/dm 2 Electroplating time is 15min, and the thickness of a coating is 8 mu m;
and (3) chromium polishing: polishing the chromium plating mould by using a polishing machine to obtain a printing mould;
(7) proofing
And (5) confirming whether the patterns on the printing mold are consistent with the requirements of customers, proofing, checking and ensuring that the patterns are correct, and then packaging.
In the embodiment, the nickel plating treatment is carried out before the copper plating, so that the phenomenon that the stainless steel body of the die is damaged by the direct copper plating when the copper plating layer is layered or copper plating is carried out can be avoided, and the bonding stability of the copper plating layer on the stainless steel die is improved. In order to prevent the copper plating layer from being oxidized or worn, a chromium plating treatment is performed to form a chromium protective layer and increase the surface hardness of the printing mold. In order to facilitate nickel plating treatment, oil stain, dust, fingerprints, sweat stain and other impurities on the surface of the finish turning mold are cleaned and removed before nickel plating; in order to facilitate the chromium plating treatment, the surface of the mold is cleaned and removed of grease stains, dust sweat stains and other impurities before chromium plating.
Example 2
In this embodiment, since the patterns of the actual printed product of the customer have 4 colors, one set of printing mold needs to make 4 printing molds. The specific manufacturing method comprises the following steps:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold; processing 4 blank molds as a set of printing molds according to the method;
rough turning: processing the 4 blank molds by a common lathe in sequence to remove the natural color, and boring;
finish turning: sequentially processing the 4 rough turning dies to the required precision through a numerical control lathe, and performing precision sequencing and marking on each die;
(2) nickel plating treatment
Cleaning: sequentially polishing 4 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning die is cleaned, firstly, a metal cleaning agent is used for spraying and cleaning, then, a 6% sulfuric acid solution is used for cleaning, and then, pure water is used for spraying;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished; the nickel electroplating solution in the nickel electroplating bath comprises 80g/L of nickel sulfamate, 18g/L of nickel chloride, 7g/L of sodium chloride and 38 g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.2, the temperature is 50 ℃, and the current density is 5A/dm 2 Electroplating time is 8min, and the thickness of a plating layer is 1.5 mu m;
(3) copper plating treatment
Putting the nickel plating mould into a copper plating bath, taking the copper plate as an anode and the nickel plating mould as a cathode, depositing a copper plating layer on the nickel plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished; the copper electroplating solution in the copper electroplating bath contains 175g/L of copper sulfate, 7g/L of sodium sulfate and 38 g/L of sulfuric acid; the working conditions of the copper electroplating solution are that the pH value is 3.7, the temperature is 50 ℃, and the current density is 15A/dm 2 Electroplating time is 18min, and the thickness of a coating is 60 mu m;
(4) grinding and polishing
Placing 4 copper plating moulds on a grinding machine to grind the copper plating layer, performing precision sequencing in the grinding process, and then placing on a polishing machine to polish the copper plating layer to form a mirror surface on the surface;
(5) electronic carving
Placing the 4 polished copper-plated dies on an electronic engraving machine for electric engraving, and sequentially engraving the surfaces of the copper-plated dies according to the previous precision sequence according to a pre-designed plate surface during electric engraving;
(6) treatment of chromium plating
Cleaning: cleaning the 4 molds subjected to the electronic engraving treatment; the complete set of mould after the electronic carving treatment is cleaned by degreasing and spraying 6 percent sodium hydroxide solution, spraying 6 percent sulfuric acid solution and then cleaning with pure water
And (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished; the chromium electroplating solution in the chromium electroplating bath contains 120g/L of chromic anhydride, 10g/L of sodium sulfate and 45 g/L of sulfuric acid; the working conditions of the chromium electroplating solution are that the pH value is 3.5, the temperature is 50 ℃, and the current density is 35A/dm 2 Electroplating time is 18min, and the thickness of a coating is 9 mu m;
and (3) chromium polishing: polishing the 4 moulds by using a polishing machine to obtain a set of printing moulds;
(7) proofing
And (4) confirming whether the patterns on the printing mould set are consistent with the requirements of customers, and proofing to check and ensure that the patterns are correct.
Example 3
In this embodiment, since the patterns of the actual printed product of the customer have 6 colors, one set of printing mold needs to make 6 printing molds. The specific manufacturing method comprises the following steps:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold; processing 6 blank molds as a set of printing molds according to the method;
rough turning: processing the 6 blank molds by a common lathe in sequence to remove the natural color, and boring;
finish turning: sequentially processing the 6 rough turning dies to the required precision through a numerical control lathe, and performing precision sequencing and marking on each die;
(2) nickel plating treatment
Cleaning: sequentially polishing 6 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning mold is cleaned, firstly, a metal cleaning agent is used for spraying and cleaning, then, a 10% sulfuric acid solution is used for cleaning, and then, pure water is used for spraying;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished; the nickel electroplating solution in the nickel electroplating bath comprises 100g/L of nickel sulfamate, 20g/L of nickel chloride, 10g/L of sodium chloride and 40g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.1, the temperature is 55 ℃, and the current density is 10A/dm 2 Electroplating time is 10min, and the thickness of a coating is 2 mu m;
(3) copper plating treatment
Putting the nickel plating mould into a copper plating bath, taking the copper plate as an anode and the nickel plating mould as a cathode, depositing a copper plating layer on the nickel plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished; the copper electroplating solution in the copper electroplating bath contains 200g/L of copper sulfate, 10g/L of sodium sulfate and 40g/L of sulfuric acid; the working conditions of the copper electroplating solution are that the pH value is 3.5, the temperature is 55 ℃, and the current density is 20A/dm 2 Electroplating time is 20min, and the thickness of a plating layer is 70 mu m;
(4) grinding and polishing
Placing the 6 copper plating dies on a grinding machine to grind the copper plating layer, performing precision sorting again in the grinding process, and then placing the copper plating dies on a polishing machine to polish the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) electronic carving
Placing the polished 6 copper-plated molds on an electronic engraving machine for electric engraving, and sequentially engraving the surfaces of the copper-plated molds according to the previous precision sequence according to a pre-designed plate surface during electric engraving;
(6) treatment of chromium plating
Cleaning: cleaning 6 dies subjected to electronic engraving treatment; the complete set of mould after the electronic carving treatment is cleaned by degreasing and spraying 10 percent sodium hydroxide solution, then spraying 10 percent sulfuric acid solution, and then cleaning with pure water
And (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished; the chromium electroplating solution in the chromium electroplating bath contains 150g/L of chromic anhydride, 12g/L of sodium sulfate and 50g/L of sulfuric acid; the working conditions of the chromium electroplating solution are that the pH value is 3, the temperature is 55 ℃, and the current density is 40A/dm 2 Electroplating time is 20min, and the thickness of a coating is 10 mu m;
and (3) chromium polishing: polishing 6 molds by using a polishing machine to obtain a set of printing molds;
(7) proofing
And (4) confirming whether the patterns on the printing mould set are consistent with the requirements of customers, and proofing to check and ensure that 6 printing moulds are packaged in a set after no errors exist.
Example 4
In this embodiment, since the patterns of the actual printed product of the customer have 6 colors, one set of printing mold needs to make 6 printing molds.
Please refer to fig. 1, the specific manufacturing method is as follows:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold; processing 6 blank molds as a set of printing molds according to the method;
rough turning: processing the 6 blank molds by a common lathe in sequence to remove the natural color, and boring;
finish turning: sequentially processing the 6 rough turning dies to the required precision through a numerical control lathe, and performing precision sequencing and marking on each die;
(2) nickel plating treatment
Cleaning: sequentially polishing 6 finish turning dies into rough surfaces, and cleaning in a cleaning tank; when the finish turning mold is cleaned, firstly, a metal cleaning agent is used for spraying and cleaning, then, a 10% sulfuric acid solution is used for cleaning, and then, pure water is used for spraying;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished; the nickel electroplating solution in the nickel electroplating bath comprises 100g/L of nickel sulfamate, 20g/L of nickel chloride, 10g/L of sodium chloride and 40g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.1, the temperature is 55 ℃, and the current density is 10A/dm 2 Electroplating time is 10min, and the thickness of a coating is 2 mu m;
(3) copper plating treatment
Putting the mould after nickel plating treatment into a nickel-copper alloy electroplating bath, taking the nickel-copper alloy as an anode and the nickel-plating mould as a cathode, depositing a nickel-copper alloy coating on the nickel-plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after the nickel-copper alloy plating is finished; the nickel-copper alloy electroplating solution in the nickel-copper alloy electroplating bath contains 40g/L of nickel sulfate, 1750g/L of copper sulfate, 10g/L of sodium sulfate and 38 g/L of boric acid; the working conditions of the nickel-copper alloy electroplating solution are that the pH value is 3.8, the temperature is 50 ℃, and the current density is 5A/dm 2 Electroplating time is 18min, and the thickness of a coating is 20 mu m;
(4) copper plating treatment
Putting the nickel-plated copper alloy mould into a copper electroplating bath, taking the copper plate as an anode and the nickel-plated mould as a cathode, depositing a copper plating layer on the nickel-plated mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished; the copper electroplating solution in the copper electroplating bath contains 200g/L of copper sulfate, 10g/L of sodium sulfate and 40g/L of sulfuric acid; the working conditions of the copper electroplating solution are that the pH value is 3.5, the temperature is 55 ℃, and the current density is 20A/dm 2 Electroplating time is 20min, and the thickness of a plating layer is 70 mu m;
(5) grinding and polishing
Placing 6 copper plating moulds on a grinding machine to grind the copper plating layer, performing precision sequencing in the grinding process, and then placing on a polishing machine to polish the copper plating layer to form a mirror surface on the surface;
(6) electronic carving
Placing the polished 6 copper-plated molds on an electronic engraving machine for electric engraving, and sequentially engraving the surfaces of the copper-plated molds according to the previous precision sequence according to a pre-designed plate surface during electric engraving;
(7) treatment of chromium plating
Cleaning: cleaning 6 molds subjected to electronic engraving treatment; the complete set of mould after the electronic carving treatment is cleaned by degreasing and spraying 10 percent sodium hydroxide solution, then spraying 10 percent sulfuric acid solution, and then cleaning with pure water
And (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished; the chromium electroplating solution in the chromium electroplating bath contains 150g/L of chromic anhydride, 12g/L of sodium sulfate and 50g/L of sulfuric acid; the working conditions of the chromium electroplating solution are that the pH value is 3, the temperature is 55 ℃, and the current density is 40A/dm 2 Electroplating time is 20min, and the thickness of a coating is 10 mu m;
and (3) chromium polishing: polishing 6 molds by using a polishing machine to obtain a set of printing molds;
(8) proofing
And (4) confirming whether the patterns on the printing mould set are consistent with the requirements of customers, and proofing to check and ensure that 6 printing moulds are packaged in a set after no errors exist.
Different from the embodiment 3, the embodiment performs nickel-plated copper alloy treatment after nickel plating and before copper plating, and is mainly used for solving the problem of electric carving and needle punching caused by over-thickness and over-hardness of a copper-plated layer.
In the technical solution of this embodiment, the transition layer formed by the nickel-plated copper alloy treatment further improves the bonding stability of the copper plating layer.
The above description is a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention, and all such changes or substitutions are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. An automated production method for a printing mold, comprising:
(1) machining process
Cutting and welding: cutting a steel plate into required sizes through a plate shearing machine, rolling the steel plate into a cylinder with corresponding specifications, welding gaps, adopting annular steel plates as plugs at two ends of the cylinder, and welding the plugs and the cylinder to obtain a blank mold; processing in sets according to the printing requirements of customers, wherein each set of die comprises at least one blank die;
rough turning: processing each blank mould of the set of moulds by a common lathe in sequence to remove the natural color, and boring;
finish turning: sequentially processing each rough turning mold of the set of molds to the required precision through a numerical control lathe, and performing precision sequencing and marking on each mold;
(2) nickel plating treatment
Cleaning: sequentially polishing each finish turning die of the die set into rough surfaces, and cleaning in a cleaning tank;
nickel plating: in a nickel plating bath, a nickel plate is used as an anode, a finish turning mold is used as a cathode, a nickel plating layer is deposited on the finish turning mold by adopting semi-immersion barrel plating, and pure water cleaning is carried out after nickel plating is finished;
(3) copper plating treatment
Putting the nickel plating mould into a copper plating bath, taking the copper plate as an anode and the nickel plating mould as a cathode, depositing a copper plating layer on the nickel plating mould by adopting semi-immersion barrel plating, and cleaning with pure water after copper plating is finished;
(4) grinding and polishing
Placing each copper plating mould of the set of moulds on a grinding machine to grind the copper plating layer, performing precision sequencing again in the grinding process, and then placing the copper plating layer on a polishing machine to polish the copper plating layer to form a mirror surface on the surface of the copper plating layer;
(5) electronic carving
Placing each copper-plated mould of the polished complete set of moulds on an electronic engraving machine for electric engraving, and sequentially engraving the surfaces of the copper-plated moulds according to the previous precision sequence according to a pre-designed plate surface during electric engraving;
(6) treatment of chromium plating
Cleaning: cleaning the set of die subjected to the electronic engraving treatment;
and (3) chromium plating: putting the cleaned mould into a chromium electroplating bath, taking a lead-tin alloy plate as an anode and an electronic engraving mould as a cathode, depositing a chromium coating on the electronic engraving mould by adopting semi-immersion barrel plating, and cleaning with pure water after chromium plating is finished;
and (3) chromium polishing: polishing each chromium plating mould of the complete set of moulds by using a polishing machine to obtain a complete set of printing moulds;
(7) proofing
And confirming whether the patterns on the printing mould set are consistent with the requirements of customers, proofing, checking and ensuring no errors, and then packaging the printing mould set according to the quantity of the finished mould products.
2. The automated print mold production method according to claim 1, characterized in that: the nickel electroplating solution in the nickel electroplating bath comprises 50-100g/L of nickel sulfamate, 15-20g/L of nickel chloride, 5-10g/L of sodium chloride and 35-40 g/L of boric acid; the working conditions of the nickel electroplating solution are that the pH value is 4.1-4.4, the temperature is 45-55 ℃, and the current density is 5-10A/dm 2 The electroplating time is 5-10min, and the thickness of the plating layer is 1-2 μm.
3. The automated print mold production method according to claim 1, characterized in that: the copper electroplating solution in the copper electroplating bath contains 150g/L of copper sulfate, 5-10g/L of sodium sulfate and 35-40 g/L of sulfuric acid; the working conditions of the copper electroplating solution are that the pH value is 3.5-4, the temperature is 45-55 ℃, and the current density is 10-20A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 50-70 μm.
4. The automated print mold production method according to claim 1, characterized in that: the chromium electroplating solution in the chromium electroplating bath contains 100-150g/L of chromic anhydride, 8-12g/L of sodium sulfate and 40-50 g/L of sulfuric acid; the working conditions of the chromium electroplating solution are that the pH value is 3-4, the temperature is 45-55 ℃, and the current density is 30-40A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 8-10 μm.
5. The automated print mold production method according to claim 1, characterized in that: and (4) before the copper plating treatment in the step (3), carrying out nickel-plated copper alloy treatment, wherein the nickel-plated copper alloy treatment method comprises the steps of putting the mould subjected to nickel plating treatment into a nickel-copper alloy plating bath, taking the nickel-copper alloy as an anode and the nickel-plated mould as a cathode, depositing a nickel-copper alloy plating layer on the nickel-plated mould by adopting semi-immersion barrel plating, and carrying out pure water cleaning after the nickel-copper alloy plating is finished.
6. The automated print mold production method according to claim 1, characterized in that: the nickel-copper alloy electroplating solution in the nickel-copper alloy electroplating bath contains 30-50g/L of nickel sulfate, 150g/L of copper sulfate, 7-13g/L of sodium sulfate and 35-40 g/L of boric acid; the working conditions of the nickel-copper alloy electroplating solution are that the pH value is 3.5-4, the temperature is 45-55 ℃, and the current density is 5-10A/dm 2 The electroplating time is 15-20min, and the thickness of the plating layer is 10-30 μm.
7. The automated print mold production method according to claim 1, characterized in that: in the step (2), when the finish turning mold is cleaned, a metal cleaning agent is firstly used for spraying and cleaning, then a 5-10% sulfuric acid solution is used for cleaning, and then pure water is used for spraying.
8. The automated print mold production method according to claim 1, characterized in that: in the step (6), 5-10% sodium hydroxide solution is adopted for degreasing and spraying when the complete set of mould after electronic engraving treatment is cleaned, 5-10% sulfuric acid solution is sprayed, and then pure water is used for cleaning.
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