JPH05185576A - Flat intaglio - Google Patents

Abstract

PURPOSE:To stabilize the plate depth of a flat intaglio by enhancing the adhesion degree of a stopper layer to prevent the peeling of said layer. CONSTITUTION:Thick copper plating is applied to a substrate 2 to provide a substrate copper plating layer 3 and strike plating of nickel chloride is applied to the substrate copper plating layer 3 to provide a strike plating layer 7. A stopper layer 4 formed by applying nickel alloy plating to the strike plating layer 7, a pattern copper plating layer 5 formed by applying copper plating to the stopper layer 4 to apply pattern etching to the formed copper plating layer and a protective plating layer 6 formed by applying chromium plating in order to enhance printing durability are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planographic intaglio plate, and more particularly to a plano intaglio plate used for offset printing.

[0002]

2. Description of the Related Art Many techniques have been developed for printing, but conventionally, offset printing, which is excellent in print reproduction, has been widely used to obtain a fine pattern by printing. In recent years, color filters used in color display devices and the like have also been produced using this offset printing. The planographic intaglio plate used for offset printing for such a purpose had the following layer structure. As shown in FIG. 3, the planographic intaglio 1 includes a base copper plating layer 3 (copper plating thickness of about 30 μm) obtained by plating a substrate layer 2 (iron plate thickness of about 0.6 mm) made of a relatively thick iron plate with copper.
m), the surface is polished and smoothed, and nickel alloy plating is applied to provide a stopper layer 4 (nickel alloy plating thickness of about 1 μm). Then, a copper plating is applied on it and pattern etching is performed to form a pattern copper plating layer 5 (copper plating thickness about 10 μm), and in order to increase printing durability, chrome plating is applied to form a protective plating layer 6 (chrome plating thickness about 3 μm). ) Was provided.

[0003]

By the way, the above stopper layer prevents the etching action thereof from reaching the underlying copper plating layer side in the etching process for obtaining the patterned copper plating layer thereon. However, there is a problem in that the strength of the stopper layer itself against the etching solution is not sufficient, and the stopper layer is easily peeled off so that the plate depth is not stable. In particular, when the above plate is used in the case of obtaining a printed matter in which the ink film thickness of the color filter or the like as described above is stable and requires an extremely fine pattern,
There was a big problem that it was not possible to perform printing with a stable film thickness of the printed matter.

In view of the above circumstances, it is an object of the present invention to stabilize the plate depth of the planographic intaglio plate by increasing the degree of adhesion of the stopper layer so that the stopper layer does not come off.

[0005]

The present invention has been made in view of the above-mentioned problems, and the first invention is to provide a substrate layer and a thick copper plating on the substrate layer to smooth the surface. A base copper plating layer consisting of, a strike plating layer formed by performing strike plating of nickel chloride on the base copper plating layer, a stopper layer formed by performing nickel alloy plating on the strike plating layer, and copper plating on the stopper layer. A pattern copper plating layer formed by applying and pattern etching, and a protective plating layer formed by performing chrome plating on the pattern copper plating layer and the stopper layer exposed from the pattern copper plating layer. A planographic intaglio plate is provided, and the above-mentioned problems are solved by providing this plano intaglio plate.

A second aspect of the invention is to provide a substrate layer, an underlying copper plating layer obtained by thickly copper-plating the substrate layer to smooth the surface, and strike plating of nickel chloride on the underlying copper plating layer. And the lower strike plating layer,
A stopper layer formed by applying nickel alloy plating to the lower strike plating layer, an upper strike plating layer formed by strike plating of nickel chloride on the stopper layer, and copper patterning by performing pattern etching on the upper strike plating layer. And a protective plating layer formed by performing chrome plating on the patterned copper plating layer and the stopper layer exposed from the patterned copper plating layer by the pattern etching. This is an intaglio plate, and the planographic intaglio plate is provided to solve the above problems.

[0007]

In the present invention, the stopper layer made of nickel alloy plating is provided on the strike plating layer (the lower strike plating layer in the second invention), and the adhesion of the nickel alloy plating, that is, the stopper layer The adhesion is high and the stopper layer does not come off.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in FIGS. It should be noted that the same parts as those of the conventional example shown in FIG. FIG. 1 shows an embodiment according to the first invention. The planographic intaglio 1 is provided with the substrate layer 2 from a relatively thick iron plate (iron plate thickness about 0.6 mm) as in the conventional case. Then, the substrate layer 2 is plated with copper to form a base copper plating layer 3 having a plating thickness of about 30 μm. In obtaining the base copper plating layer 3, copper is plated to a thickness of 60 μm under the condition of a plating bath temperature of 30 ° C. for 2 hours, and 30 μm is polished and removed to make the surface smooth. A strike plating layer 7 is provided by plating nickel chloride on the base copper plating layer 3. The strike plating layer 7 is nickel chloride plated to a thickness of 0.5 μm or less, and the plating bath temperature is 30 ° C. for 4 minutes and the current value is 10 V and 100.
It was obtained under the conditions of A. Strike plating layer 7
A stopper layer 4 is formed by plating nickel alloy with a plating thickness of about 1 μm, and the plating conditions are a plating bath temperature of 60 ° C. and 15 minutes. On the stopper layer 4, a patterned copper plating layer 5 is provided by plating copper with a plating thickness of about 10 μm and etching this with a stripe pattern. The conditions for copper plating are a plating bath temperature of 25 ° C. and 40 minutes. Then, in order to improve the printing durability of the patterned copper plating layer 5, chromium plating is applied to the patterned copper plating layer 5 and the stopper layer 4 exposed as a striped pattern with a plating thickness of about 3 μm for protection plating. The planographic intaglio 1 is obtained by providing the layer 6. The conditions for chrome plating are a plating bath temperature of 30 ° C. and 50 minutes.

The stopper layer 4 of the planographic intaglio plate 1 having the above structure is not peeled off even after pattern etching, and a printed matter having a stable film thickness can be obtained.

FIG. 2 shows an embodiment according to the second invention. The planographic intaglio 1 has a thickness of about 0.
Copper plating is performed on a substrate layer 2 made of a 6 mm iron plate to provide a base copper plating layer 3 having a plating thickness of about 30 μm. In obtaining the base copper plating layer 3, copper is plated to a thickness of 60 μm under the condition of a plating bath temperature of 30 ° C. for 2 hours, and 30 μm is polished and removed to make the surface smooth. On the base copper plating layer 3, nickel chloride plating is applied and a lower strike plating layer 8 is provided. The lower strike plating layer 8 is nickel chloride plated.
Plating bath temperature 30 ° C, 4
It was obtained by conducting the test for 10 minutes under the condition of a current value of 10V and 100A. A stopper layer 4 is provided on the lower strike plating layer 8 by plating nickel alloy with a plating thickness of about 1 μm. The plating condition is a plating bath temperature of 60 ° C.
15 minutes. On the stopper layer 4, nickel chloride plating is applied again, and an upper strike plating layer 9 is provided. The upper strike plating layer 9 is plated with nickel chloride in the same manner as the lower strike plating layer 7.
Plating bath temperature 30 ° C, 4
It was obtained by conducting the test for 10 minutes under the condition of a current value of 10V and 100A. On the upper strike plating layer 9, a pattern copper plating layer 5 is provided by plating copper with a plating thickness of about 10 μm and etching this with a stripe pattern. The conditions for copper plating include a plating bath temperature of 25 ° C. and 40
It's a minute. By the pattern etching,
The pattern-corresponding portion of the upper strike plating layer 9 is etched away. And pattern copper plating layer 5
And the stopper layer 4 exposed as a striped pattern are plated with chrome to a thickness of about 3 μm to form a protective plating layer 6 to obtain the planographic intaglio 1. The conditions for chrome plating are a plating bath temperature of 30 ° C. and 50 minutes.

As in the first embodiment of the present invention, the stopper layer 4 of the planographic intaglio 1 having the above structure is not peeled off even after pattern etching, and a printed matter having a stable film thickness can be obtained. It was

[0012]

The present invention has the structure described above. As a result, the stopper layer has an increased degree of adhesion due to the presence of a layer formed by strike plating of nickel chloride, which is an underlying layer, and is not peeled off even after pattern etching. As a result, it is possible to obtain a printed matter having a stable plate depth and a stable film thickness, which is excellent in practicality.

[Brief description of drawings]

FIG. 1 is an explanatory view showing in cross section one embodiment of a planographic intaglio plate according to the first invention.

FIG. 2 is an explanatory view showing in cross section one embodiment of a planographic intaglio plate according to the second invention.

FIG. 3 is an explanatory diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Planographic intaglio 2 ... Substrate layer 3 ... Underlayer copper plating layer 4 ... Stopper layer 5 ... Pattern copper plating layer 6 ... Protective plating layer 7 ... Strike plating layer 8 ... Lower strike plating layer 9 ... Upper strike plating layer

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Katsuhiro Kimura 1-5-1 Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.

Claims (2)

[Claims] 1. A substrate layer, an underlying copper plating layer obtained by thickly copper-plating the substrate layer to smooth the surface, and a strike plating layer obtained by performing strike plating of nickel chloride on the underlying copper plating layer. A stopper layer formed by nickel-plating the strike plating layer, a pattern copper plating layer formed by pattern etching the copper plating on the stopper layer, the pattern copper plating layer and the pattern copper plating layer. A planographic intaglio plate, comprising: a protective plating layer formed by performing chrome plating on the stopper layer that comes out. 2. A substrate layer, a base copper plating layer formed by thickly copper-plating the substrate layer to smooth the surface, and a lower strike plating formed by performing strike plating of nickel chloride on the base copper plating layer. A layer, a stopper layer formed by plating the lower strike plating layer with a nickel alloy, an upper strike plating layer formed by striking nickel chloride on the stopper layer, and a copper plating pattern formed on the upper strike plating layer. A patterned copper plating layer formed by etching; and a protective plating layer formed by performing chrome plating on the patterned copper plating layer and the stopper layer exposed from the patterned copper plating layer by the pattern etching. Plano intaglio.