CN115069670B - Slot type ultrasonic cleaning machine is used in processing of semiconductor wafer - Google Patents
Slot type ultrasonic cleaning machine is used in processing of semiconductor wafer Download PDFInfo
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- CN115069670B CN115069670B CN202210988411.0A CN202210988411A CN115069670B CN 115069670 B CN115069670 B CN 115069670B CN 202210988411 A CN202210988411 A CN 202210988411A CN 115069670 B CN115069670 B CN 115069670B
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- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 85
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims description 94
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a groove type ultrasonic cleaning machine for processing a semiconductor wafer, which relates to the technical field of ultrasonic cleaning and comprises a machine body mechanism, wherein the machine body mechanism comprises an ultrasonic generating device, the ultrasonic generating device is arranged on a base plate, the base plate is fixedly welded on the inner side of a bottom support, a water groove is arranged at the upper end of the bottom support, and the ultrasonic generating device comprises an ultrasonic generator arranged in the water groove. The connecting piece through the design is at first modified the vibration, does not change the vibration that annular connecting seat received simultaneously, makes two strands of vibrations can carry out the high efficiency because of the vibration is inconsistent when crossing and converges, makes the part that is in the wafer of two strands of different vibrations can carry out different ultrasonic vibration and wash, and the vibration of vibration intersection is different completely because of the direction of two strands of vibrations, makes the vibration of intersection more violent to the disturbance of water, and then washs the surface of wafer thoroughly more.
Description
Technical Field
The invention relates to the technical field of ultrasonic cleaning, in particular to a groove type ultrasonic cleaning machine for processing a semiconductor wafer.
Background
In the prior art, the structural form and the use mode between the existing ultrasonic cleaning machine used in the semiconductor wafer processing process and the conventional cleaning machine are not greatly different, in the vibration process of the ultrasonic cleaning machine, the vibration generated by the ultrasonic cleaning machine is continuously reflected back and forth in the water tank, but always stays in a more regular vibration intersection rule, so that the ultrasonic cleaning machine can be regarded as a net which cannot be changed, in the vibration intersection point of the net, the vibration at the position corresponding to the mesh is generally weak, and the vibration intersection net cannot be easily observed, when the wafer is placed in the water tank for ultrasonic cleaning, the vibration strength at the position where the wafer is placed cannot be determined, the cleaning time can only be prolonged to improve the cleaning degree of the wafer as much as possible, and the condition of energy waste exists.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provide a tank type ultrasonic cleaning machine for processing a semiconductor wafer based on a standing wave phenomenon and interference on the standing wave phenomenon.
In order to achieve the purpose, the invention adopts the following technical scheme: a groove type ultrasonic cleaning machine for processing semiconductor wafers comprises a machine body mechanism, wherein the machine body mechanism comprises an ultrasonic generator, the ultrasonic generator is arranged on a base plate, the base plate is fixedly welded on the inner side of a bottom support, a water tank is arranged at the upper end of the bottom support, the ultrasonic generator is arranged in the water tank, a built-in adjusting mechanism is arranged in the water tank, the built-in adjusting mechanism comprises a modifying mechanism, the modifying mechanism comprises a middle connecting post fixed on the ultrasonic generator, a connecting piece is fixedly welded on the middle connecting post, a first connecting rod is fixedly arranged at the edge of an upper port of the connecting piece, a connecting frame mechanism is fixedly arranged at one end of the first connecting rod, which is far away from the connecting piece, the connecting frame mechanism comprises an annular connecting seat fixed on the ultrasonic generator, the upper side of the annular connecting seat is fixedly welded with a connecting vertical plate, one end of the connecting vertical plate, which is far away from the annular connecting seat, is fixedly provided with a V-shaped connecting rod, one end of the V-shaped connecting rod is fixedly welded with the connecting piece, the V-shaped connecting rod and the connecting piece are fixedly connected with a placing mechanism, one end of the V-shaped connecting rod, which is far away from the connecting piece, is provided with an interference mechanism, the placing mechanism comprises an inner side tube, the inner side tube is an annular round tube, a placing groove is sunk in the upper surface of the inner side tube, a through hole is formed in the inner side tube corresponding to the placing groove in a penetrating manner, the placing mechanism further comprises an outer side tube, the outer side tube is an annular square tube, a placing plate frame is arranged on the outer side tube, a round hole communicated with the inside of the outer side tube is formed in the placing plate frame in a penetrating manner, and an inner side wafer disc is arranged on the placing groove, the placing plate frame is provided with an outer wafer disc, and the outer side pipe and the inner side pipe are connected with a negative pressure mechanism.
As a preferred embodiment, interference mechanism includes the contact slider, the laminating setting that slides between the lateral surface of contact slider and the inner wall of basin, the fixed U type connecting plate that is equipped with on the inboard of contact slider, the centre department of U type connecting plate is equipped with step motor, step motor's output is connected with two sets of removal wheelsets through belt transmission, and is two sets of remove the wheelset and all install on U type connecting plate, and it sets up in the upside of U type connecting plate from the driving wheel part, and its connecting axle runs through U type connecting plate setting simultaneously, the upper and lower both sides of U type connecting plate all are connected with the guide rail slider through No. two connecting rods, the guide rail slider slides and sets up in the sliding tray of annular slide rail, fixed connection between the inner wall of annular slide rail through interference mechanism, bed plate and basin, the one side that U type connecting plate was kept away from to the guide rail slider is connected with the linking piece through L type connecting plate, the inboard of annular slide rail is equipped with annular link, the outside department of annular slide rail is equipped with the linking piece, be equipped with the caulking groove that agrees with the linking piece on the linking piece.
The beneficial effect of adopting the further scheme is that: the interference mechanism can move on the built-in adjusting mechanism through design, and the position of a contact point of the built-in adjusting mechanism is changed, so that different expression forms of the standing wave phenomenon are changed.
As a preferred embodiment, negative pressure mechanism includes the connector lever, one of connector lever serves fixed mounting has the negative pressure pump, seal installation has the connection house steward on the inlet port of negative pressure pump, the connection house steward is kept away from one of negative pressure pump and is served and be connected with branch pipe and No. two branch pipes, no. one divide the pipe to keep away from between the one end of connection house steward and the inside of outside pipe through connection, no. two branch pipes are kept away from between the one end of negative pressure pump and the inside of inboard pipe through connection, the outlet port department seal installation of negative pressure pump has the outlet pipe, the outlet pipe is fixed in on the connector lever, fixed connection between the one end that negative pressure pump was kept away from to the connector lever and the last port of basin.
The beneficial effect of adopting the further scheme is that: through the negative pressure mechanism of design for built-in guiding mechanism can utilize the negative pressure principle to adsorb fixedly to its structure, when guaranteeing joint strength, also can directly pull down through relieving the negative pressure state, and the very convenient to detach washs.
As a preferred embodiment, outside wafer dish includes circular connecting seat, circular connecting seat's bottom is sunken to be seted up No. two and is held the groove, no. two hold the position in groove and place the through-hole position on the plate rail and correspond the setting mutually, be equipped with No. two calibration bumps on the circular connecting seat's at groove place side No. two, the corresponding plate rail of placing that is equipped with of No. two calibration bumps aligns the caulking groove, circular connecting seat keeps away from on the side of No. two calibration bumps fixed mounting have No. two wafers to place the dish.
The beneficial effect of adopting the further scheme is that: hold the groove through No. two of design and place the through-hole on the plate rail and correspond for when the round hole produced the negative pressure, can take away the moisture in No. two appearance grooves, and circular connecting seat and the remaining moisture of placing between the plate rail can act as the effect of filling up the material, make to form the sealed of certain degree between the two.
As a preferred embodiment, the inboard wafer dish includes square connecting seat, sink on the side of square connecting seat and be equipped with the appearance groove No. one, be equipped with calibration bump No. one on the side of the square connecting seat at appearance groove place, be equipped with on the standing groove that calibration bump corresponds and aim at the caulking groove, square connecting seat keeps away from a side that holds the groove on fixed mounting have a wafer place the dish.
The beneficial effect of adopting the further scheme is that: appearance groove through the design corresponds with the through-hole for when the through-hole produced the negative pressure, can take away the moisture of appearance inslot, and remaining moisture can act as the effect of filling up the material between square connecting seat and the inboard pipe, make to form the sealed of certain degree between the two.
In a preferred embodiment, the connecting pieces are uniformly arranged corresponding to the annular connecting frames between two adjacent outer wafer disks.
The beneficial effect of adopting the further scheme is that: the position of the connecting piece is determined according to the standing wave phenomenon, so that the situation that when the connecting piece is positioned at a vibration weak point, the wafer on the radiant line of the connecting piece is weakened in vibration, and the ultrasonic cleaning efficiency is reduced is avoided.
In a preferred embodiment, the outer tube is fixedly welded to the annular connecting frame, and the connecting node between the annular connecting frame and the outer tube is disposed corresponding to the connecting piece.
The beneficial effect of adopting the further scheme is that: the connection node of the annular connection frame and the outer pipe is made to be at a vibration weak portion in the standing wave phenomenon while ensuring effective conduction of vibration.
As a preferred embodiment, the placing groove is correspondingly arranged at a position between the first connecting rod and two adjacent connecting nodes of the inner pipe.
The beneficial effect of adopting the further scheme is that: it is ensured that the placement groove can be located at the vibration intersection in the standing wave phenomenon.
As a preferred embodiment, a groove corresponding to the second branch pipe is arranged on the first connecting rod.
The beneficial effect of adopting the above further scheme is: through the groove, be convenient for place No. two minutes pipes.
Compared with the prior art, the invention has the advantages and positive effects that:
1. according to the invention, the vibration is modified through the designed connecting piece, and meanwhile, the vibration received by the annular connecting seat is not changed, so that two strands of vibration can be efficiently converged due to inconsistent vibration when the two strands of vibration are converged, the parts of the two strands of wafers in different vibrations can be cleaned by different ultrasonic vibrations, and the vibration at the vibration intersection is completely different in direction due to the two strands of vibration, so that the vibration at the intersection is more violent in disturbance on a water body, and further the surface of the wafer is cleaned more thoroughly.
2. According to the invention, different contact forms can be presented between the connecting block and the connecting piece in the ultrasonic cleaning device through the designed movable interference mechanism, and the connecting piece is connected with the built-in adjusting mechanism through the annular connecting frame, so that the overall vibration of the built-in adjusting mechanism is influenced by the contact between the connecting block and the connecting piece, and the vibration intersection point when the vibration is conducted in the built-in adjusting mechanism is changed by utilizing the phenomenon that different stress points in the standing wave phenomenon influence the vibration waves, so that the intersection point can change along with the contact between the connecting block and the connecting piece, and the intersection point can sweep across the surface of the wafer along with the movement of the connecting block, so that the whole wafer can be influenced by the severe vibration of the vibration intersection point, and the ultrasonic cleaning efficiency is further improved.
3. According to the invention, the negative pressure state is provided for the insides of the inner side tube and the outer side tube through the designed negative pressure mechanism, so that the holes on the insides can adsorb the outer side wafer disc and the inner side wafer disc, the connection strength between the inner side wafer disc and the inner side tube and between the outer side wafer disc and the outer side tube is ensured, and meanwhile, the connection strength between the inner side wafer disc and the outer side wafer disc and between the inner side tube and the outer side tube can be reduced along with the release of the negative pressure state, and the dismounting and cleaning of the inner side wafer disc and the outer side wafer disc are further facilitated.
Drawings
FIG. 1 is a schematic view of a tank-type ultrasonic cleaning machine for processing a semiconductor wafer according to the present invention;
FIG. 2 is a schematic structural diagram of a tank-type ultrasonic cleaning machine for processing a semiconductor wafer according to the present invention;
FIG. 3 is a schematic view of a connection structure of a built-in adjusting mechanism, a negative pressure mechanism and an interference mechanism of a groove type ultrasonic cleaning machine for processing a semiconductor wafer according to the present invention;
FIG. 4 is a schematic diagram of a position structure of a modification mechanism of a tank-type ultrasonic cleaning machine for processing a semiconductor wafer according to the present invention;
FIG. 5 is an enlarged structural view of the area A of the trough-type ultrasonic cleaning machine for processing semiconductor wafers according to the present invention;
FIG. 6 is a schematic view of a connection structure of a negative pressure mechanism of a tank type ultrasonic cleaning machine for processing a semiconductor wafer according to the present invention;
FIG. 7 is a schematic view of a connection structure between a placement mechanism and an annular connection frame of a tank-type ultrasonic cleaning machine for processing semiconductor wafers according to the present invention;
FIG. 8 is a schematic structural diagram of a link mechanism of a tank-type ultrasonic cleaning machine for processing semiconductor wafers according to the present invention;
FIG. 9 is a structural diagram of an outer wafer plate of a tank-type ultrasonic cleaning machine for processing semiconductor wafers according to the present invention;
FIG. 10 is a schematic view of an inner wafer disk of a tank-type ultrasonic cleaning machine for processing semiconductor wafers according to the present invention.
Illustration of the drawings:
1. a body mechanism; 11. an ultrasonic wave generating device; 12. a base plate; 13. a bottom bracket;
2. a water tank;
3. an adjusting mechanism is arranged inside;
31. a modification mechanism; 311. a middle connecting column; 312. a connecting member; 313. a first connecting rod;
32. a connecting frame mechanism; 321. a ring-shaped connecting seat; 322. connecting a vertical plate; 323. a V-shaped connecting rod;
34. a placement mechanism; 341. an inner tube; 342. a placement groove; 343. a through hole; 344. an outer tube; 345. placing the plate frame;
35. an inner side crystal disc; 351. a square connecting seat; 352. a first accommodating groove; 353. calibrating the salient point; 354. a first wafer placing tray;
36. an outer side wafer disc; 361. a circular connecting seat; 362. a second accommodating groove; 363. calibrating the salient points; 364. a second wafer placing disc;
4. a negative pressure mechanism; 41. a connecting frame rod; 42. a negative pressure pump; 43. a water outlet pipe; 44. connecting a main pipe; 45. dividing the tube into a first tube; 46. dividing the tube into two parts;
5. an interference mechanism; 51. a contact slider; 52. a U-shaped connecting plate; 53. a stepping motor; 54. a moving wheel set; 55. a second connecting rod; 56. a guide rail slider; 57. an annular slide rail; 58. an L-shaped connecting plate; 59. a joining block; 510. an annular connecting frame; 511. a connecting piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-2, the present invention provides a technical solution: the utility model provides a slot type ultrasonic cleaner for semiconductor wafer processing, includes organism mechanism 1, organism mechanism 1 includes ultrasonic wave generating device 11, ultrasonic wave generating device 11 installs on bed plate 12, bed plate 12 fixed welding is in the inboard of bottom support 13, basin 2 is installed to the upper end of bottom support 13, ultrasonic wave generating device 11 is equipped with built-in guiding mechanism 3 including setting up in the inside supersonic generator of basin 2 in the basin 2, be equipped with negative pressure mechanism 4 and interference mechanism 5 on built-in guiding mechanism 3.
In the above embodiment, the present invention utilizes the standing wave phenomenon in the sound wave phenomenon, and utilizes the designed built-in adjusting mechanism 3 to guide and control the conduction of the sound wave, so that the path of sound wave diffusion is divided into multiple strands, and the strands are converged at different positions, and the positions are more powerfully washed and cleaned by the high energy generated by the wave band collision generated when the sound waves are converged.
Example 2
As shown in fig. 1-8, the built-in adjusting mechanism 3 includes a modifying mechanism 31, the modifying mechanism 31 includes a middle connecting column 311 fixed on the ultrasonic generator, so that the middle connecting column 311 can directly receive the ultrasonic wave generated by the ultrasonic generator, and the fixed connection mode also reduces the loss of the ultrasonic wave in the transmission process, a connecting piece 312 is fixedly welded on the middle connecting column 311, a first connecting rod 313 is fixedly installed at the edge of an upper port of the connecting piece 312, by designing the connecting piece 312 into a bowl shape, the original ultrasonic wave received by the connecting piece 312 is modified by using the characteristic that the amplitude is reduced along with the increase of the transmission distance when the ultrasonic wave is transmitted in the spherical surface, the amplitude is reduced, when the original ultrasonic wave is transmitted to the first connecting rod 313 arranged in a circular array, the wavelength and the amplitude of the ultrasonic wave can be completely different from those of the middle connecting column 311, a connecting frame mechanism 32 is fixedly installed on one end of the first connecting rod 313 far from the connecting piece 312, the ultrasonic wave is further conducted and diffused by the designed connecting frame mechanism 32, the annular connecting frame mechanism 32 includes an annular connecting frame 321 fixed on the ultrasonic generator, the upper side of the annular connecting frame 321 is fixedly connected with a vertical plate 322, one end of the vertical plate 322, and the connecting frame 322 is connected to the ultrasonic wave which is connected to the connecting piece 323 and the ultrasonic wave is directly connected to the connecting frame 321, and the ultrasonic wave is not changed by the ultrasonic wave, and the ultrasonic wave which is connected to the connecting frame 323, and the connecting frame 321, the two ultrasonic waves meet to generate ultrasonic intersection impact with a certain rhythm, the combined ultrasonic waves diffused after the impact can generate disturbance with higher amplitude and shorter wavelength to water at the position of the ultrasonic waves, so that the wafer in the water is washed with high efficiency, meanwhile, the wafer can also receive the ultrasonic disturbance from the diffusion, the ultrasonic disturbance of the wafer per se is intersected with the disturbance generated by the ultrasonic waves diffused by the water, and the disturbance intersection is positioned on the surface of the wafer due to different conduction efficiency of the water and the wafer to the ultrasonic waves, so that the ultrasonic cleaning of the surface of the wafer is completed, and the V-shaped connecting rod 323 and the connecting piece 312 are fixedly connected with the placing mechanism 34;
the placing mechanism 34 includes an inner tube 341, the inner tube 341 is an annular circular tube, a placing groove 342 is sunken in the upper surface of the inner tube 341, a through hole 343 is formed through the inner tube 341 corresponding to the placing groove 342, the inner tube 341 is designed to be annular circular tube-shaped and is matched with the through hole 343 formed through the inner tube 341, so that when the inner tube 341 is connected with a negative pressure device, the through hole 343 can perform negative pressure adsorption on an object covered on the inner tube 341, and then complete the fixation on the object, the placing mechanism 34 further includes an outer tube 344, the outer tube 344 is an annular square tube, the outer tube 344 is provided with a placing plate frame 345, the placing plate frame 345 is provided with a circular hole formed through the inner tube 344, the outer tube 344 is designed to be annular square tube-shaped and is matched with the circular hole formed through the placing plate frame 345, so that when the outer tube 344 is connected with the negative pressure device, the placing plate frame 345 can perform negative pressure adsorption on the object covered on the placing plate frame 345, and then complete the fixation on the object;
the outer pipe 344 and the annular connecting frame 510 are fixedly welded to ensure effective transmission of ultrasonic waves, the connecting node between the annular connecting frame 510 and the outer pipe 344 is arranged corresponding to the connecting piece 511, the placing groove 342 is correspondingly arranged at a position between two adjacent connecting nodes of the first connecting rod 313 and the inner pipe 341, and by utilizing the phenomenon that ultrasonic junction points are positioned at two sides of a contact point radiation line in a standing wave phenomenon, the contact point and a position for placing a wafer are staggered to ensure that the wafer is positioned at the ultrasonic junction point.
The interference mechanism 5 is installed on one end, far away from the connecting piece 312, of the V-shaped connecting rod 323, the interference mechanism 5 comprises a guide rail sliding block 56, one side, far away from the U-shaped connecting plate 52, of the guide rail sliding block 56 is connected with a connecting piece 59 through an L-shaped connecting plate 58, an annular connecting frame 510 is arranged on the inner side of the annular sliding rail 57, a connecting piece 511 is arranged on the outer side of the annular connecting frame 510, and a caulking groove matched with the connecting piece 59 is formed in the connecting piece 511;
in the above embodiment, when the ultrasonic wave is generated by the ultrasonic wave generator, the ultrasonic wave is transmitted to the connecting member 312 through the middle connecting column 311, and then the ultrasonic wave is transmitted from the connecting member 312 to the V-shaped connecting rod 323 through the connecting rod 313 and then transmitted to the outer tube 344, so that the placing disk rack 345 on the outer tube 344 can also be subjected to the ultrasonic wave, and the outer tube 344 transmits the ultrasonic wave to the annular connecting rack 510 and the connecting block 59 through the connecting member 511 on the annular connecting rack 510, and simultaneously, the ultrasonic wave generated by the ultrasonic wave generator is also transmitted to the annular connecting seat 321 and the V-shaped connecting rod 323 through the connecting vertical plate 322, and is converged with the ultrasonic wave transmitted from the middle connecting column 311 in the process of being transmitted from the V-shaped connecting rod 323, thereby completing the transmission of the whole ultrasonic wave.
Example 3
As shown in fig. 1, 2, 3 and 5, the interference mechanism 5 further includes a contact slider 51, the outer side surface of the contact slider 51 is in sliding fit with the inner wall of the water tank 2, a U-shaped connecting plate 52 is fixedly disposed on the inner side of the contact slider 51, a stepping motor 53 is disposed in the middle of the U-shaped connecting plate 52, an output end of the stepping motor 53 is connected with two sets of moving wheel sets 54 through belt transmission, the two sets of moving wheel sets 54 are both mounted on the U-shaped connecting plate 52, a driven wheel portion of the moving wheel set is disposed on the upper side of the U-shaped connecting plate 52, a connecting shaft of the moving wheel set penetrates through the U-shaped connecting plate 52, upper and lower sides of the U-shaped connecting plate 52 are both connected with guide rail sliders 56 through a second connecting rod 55, the guide rail sliders 56 are slidably disposed in a sliding groove of an annular sliding rail 57, and the annular sliding rail 57 is fixedly connected with the inner wall of the water tank 2 through the interference mechanism 5 and the base plate 12.
In the above embodiment, the moving wheel set 54 is driven to rotate by the designed stepping motor 53 in a belt transmission manner, and the design that the guide rail slider 56 is slidably disposed in the rail groove of the annular slide rail 57 is combined, so that the stepping motor 53 can drive the interference mechanism 5 to integrally move on the annular slide rail 57, and the contact slider 51 is designed to integrally contact the interference mechanism 5 with the water tank 2, so that the ultrasonic wave received by the interference mechanism 5 can be conducted away, and the situation that the structure is damaged due to amplitude diffusion when the interference mechanism 5 is at the vibration end is avoided.
Example 4
As shown in fig. 3, 4, 6, 7, 9 and 10, an inner wafer disc 35 is disposed on the placement groove 342, the inner wafer disc 35 includes a square connection seat 351, a first accommodating groove 352 is disposed in one side surface of the square connection seat 351, a first calibration bump 353 is disposed on one side surface of the square connection seat 351 where the first accommodating groove 352 is located, an alignment caulking groove is disposed on the placement groove 342 corresponding to the first calibration bump 353, a first wafer placement disc 354 is fixedly mounted on one side surface of the square connection seat 351 away from the first accommodating groove 352, a plurality of water leakage through holes are disposed on a bottom plate of the first wafer placement disc 354 in a penetrating manner, and a protruding point for lifting up a wafer is disposed on an inner bottom surface of the first wafer placement disc 354;
meanwhile, an outer wafer disc 36 is arranged on the placing disc rack 345, the outer wafer disc 36 comprises a circular connecting seat 361, a second accommodating groove 362 is formed in the bottom of the circular connecting seat 361 in a sinking mode, the position of the second accommodating groove 362 is arranged corresponding to the position of a through hole 343 in the placing disc rack 345, a second calibration bump 363 is arranged on one side face of the circular connecting seat 361 where the second accommodating groove 362 is located, an alignment embedding groove is formed in the placing disc rack 345 corresponding to the second calibration bump 363, a second wafer placing disc 364 is fixedly arranged on one side face, far away from the second calibration bump 363, of the circular connecting seat 361, a plurality of water leakage through holes penetrate through the bottom plate of the second wafer placing disc 364, and a bump for lifting a wafer is arranged on the bottom face of the inner side of the second wafer placing disc 364;
the connecting pieces 511 are uniformly arranged corresponding to the annular connecting frames 510 between two adjacent outer wafer disks 36;
wherein, a groove corresponding to the second branch pipe 46 is arranged on the first connecting rod 313.
In the above embodiment, the first wafer placing tray 354 and the second wafer placing tray 364 are designed to place wafers, the first accommodating groove 352 corresponds to the through hole 343, and the second accommodating groove 362 corresponds to the circular hole on the placing tray rack 345, the design enables the square connecting seat 351 and the circular connecting seat 361 to be fixed in cooperation with the negative pressure suction of the inner tube 341 and the outer tube 344, and the second calibration bump 363 and the first calibration bump 353 are designed to help a user to perform position calibration in order to avoid the hole-to-groove misalignment, so as to ensure the aligned placement of the hole and the groove.
Example 5
As shown in fig. 1, 3 and 6, the outer tube 344 and the inner tube 341 are connected to a negative pressure mechanism 4, the negative pressure mechanism 4 includes a connecting frame rod 41, one end of the connecting frame rod 41 is fixedly installed with a negative pressure pump 42, a connecting main tube 44 is hermetically installed on an air inlet port of the negative pressure pump 42, one end of the connecting main tube 44 far away from the negative pressure pump 42 is connected with a first branch tube 45 and a second branch tube 46, one end of the first branch tube 45 far away from the connecting main tube 44 is connected with the inside of the outer tube 344 in a penetrating manner, one end of the second branch tube 46 far away from the negative pressure pump 42 is connected with the inside of the inner tube 341 in a penetrating manner, an air outlet port of the negative pressure pump 42 is hermetically installed with an outlet tube 43, the outlet tube 43 is fixed on the connecting frame rod 41, and one end of the connecting frame rod 41 far away from the negative pressure pump 42 is fixedly connected with an upper port of the water tank 2.
In the above embodiment, the second branch pipe 46 is communicated with the inner side pipe 341, and the first branch pipe 45 is communicated with the outer side pipe 344, so that the negative pressure generated by the negative pressure pump 42 can be transmitted to the inner side pipe 341 and the outer side pipe 344 through the connecting main pipe 44, the second branch pipe 46 and the first branch pipe 45, and by combining the negative pressure suction design of the above design, when the negative pressure pump 42 is turned on, the square connecting seat 351 and the second accommodating groove 362 can be sucked and fixed, the strength of the combination between the circular connecting seat 361 and the placing tray frame 345 and between the square connecting seat 351 and the inner side pipe 341 is enhanced, and the effective transmission of ultrasonic waves is ensured.
The working principle is as follows:
as shown in fig. 1-10, when the present invention is used, first, the outer wafer disc 36 or the inner wafer disc 35 is placed in the corresponding inner tube 341 or the placing plate rack 345, then the negative pressure pump 42 is started to pump the inner tube 341 and the outer tube 344 to a negative pressure state, so as to complete the connection between the inner wafer disc 35 and the inner tube 341 and between the outer wafer disc 36 and the outer tube 344, then the wafer is placed in the second wafer placing plate 364 or the first wafer placing plate 354, so that the ultrasonic generator can be started, the ultrasonic wave generated by the ultrasonic generator can enter the whole of the built-in adjusting mechanism 3 through the conduction of the middle connecting column 311 and the annular connecting seat 321, and the contact adapter 511 is changed at the moment of the connecting block 59 to change the variable of the conductive medium vibrating in the conduction process, thereby changing the standing wave phenomenon, further changing the position of the wafer to be at a different vibration junctions, and further changing the contact between the adapter block 59 and the adapter 511 to cover the whole surface of the wafer, thereby ensuring that the wafer can cover the high energy vibration junction of the wafer, and improving the ultrasonic cleaning efficiency.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (9)
1. The utility model provides a semiconductor wafer processing is with slot type ultrasonic cleaner, includes organism mechanism (1), its characterized in that: the machine body mechanism (1) comprises an ultrasonic generating device (11), the ultrasonic generating device (11) is installed on a base plate (12), the base plate (12) is fixedly welded on the inner side of a bottom support (13), a water tank (2) is installed at the upper end of the bottom support (13), the ultrasonic generating device (11) comprises an ultrasonic generator arranged inside the water tank (2), a built-in adjusting mechanism (3) is arranged in the water tank (2), the built-in adjusting mechanism (3) comprises a modifying mechanism (31), the modifying mechanism (31) comprises a middle connecting column (311) fixed on the ultrasonic generator, a connecting piece (312) is fixedly welded on the middle connecting column (311), a first connecting rod (313) is fixedly installed at the edge of an upper port of the connecting piece (312), a connecting frame mechanism (32) is fixedly installed at one end, far away from the connecting piece (312), of the first connecting rod (313), the connecting frame mechanism (32) comprises an annular connecting seat (321) fixed on the ultrasonic generator, the upper side of the annular connecting seat (321) is fixedly connected with a vertical plate (322), one end, far away from the annular connecting rod (321), a V-shaped connecting rod (323) is fixedly installed between the connecting rod (323) and the connecting piece (323), the V-shaped connecting rod (323) and the connecting piece (312) are fixedly connected with the placing mechanism (34), one end, far away from the connecting piece (312), of the V-shaped connecting rod (323) is provided with an interference mechanism (5), the placing mechanism (34) comprises an inner side tube (341), the inner side tube (341) is an annular round tube, a placing groove (342) is formed in the upper surface of the inner side tube (341) in an inward sinking mode, a through hole (343) is formed in the inner side tube (341) corresponding to the placing groove (342) in a penetrating mode, the placing mechanism (34) further comprises an outer side tube (344), the outer side tube (344) is an annular square tube, a placing disc frame (345) is arranged on the outer side tube (344), a round hole communicated with the inner portion of the outer side tube (344) is formed in the placing disc frame (345) in a penetrating mode, an inner side wafer disc (35) is arranged on the placing groove (342), an outer side wafer disc (36) is arranged on the placing disc frame (345), and the outer side tube (344) and the inner side tube (341) are connected with a negative pressure mechanism (4).
2. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 1, wherein: the interference mechanism (5) comprises a contact sliding block (51), the outer side surface of the contact sliding block (51) is in sliding fit with the inner wall of the water tank (2), a U-shaped connecting plate (52) is fixedly arranged on the inner side of the contact sliding block (51), a stepping motor (53) is arranged in the middle of the U-shaped connecting plate (52), the output end of the stepping motor (53) is connected with two sets of moving wheel sets (54) through belt transmission, the two sets of moving wheel sets (54) are both arranged on the U-shaped connecting plate (52), a driven wheel part of the moving wheel sets is arranged on the upper side of the U-shaped connecting plate (52), a connecting shaft of the moving wheel sets penetrates through the U-shaped connecting plate (52), the upper side and the lower side of the U-shaped connecting plate (52) are both connected with a guide rail sliding block (56) through a second connecting rod (55), the guide rail sliding block (56) is arranged in a sliding groove of an annular sliding rail (57), the annular sliding rail (57) is fixedly connected between the inner walls of the annular sliding rail (57) through the interference mechanism (5) and a base plate (12), an annular connecting piece (510) is arranged on the outer side of the guide rail (56) far away from the U-shaped connecting plate (52), and an annular connecting frame connecting piece (511) is connected with an annular connecting piece (510), the connecting piece (511) is provided with a caulking groove matched with the connecting block (59).
3. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 1, wherein: negative pressure mechanism (4) are including connecting bracket pole (41), fixed mounting has negative pressure pump (42) in one end of connecting bracket pole (41), sealed mounting has connection house steward (44) on the inlet port of negative pressure pump (42), one of keeping away from negative pressure pump (42) of connecting house steward (44) serves and is connected with branch pipe (45) and No. two branch pipes (46), no. one branch pipe (45) are kept away from between the one end of connecting house steward (44) and the inside of outside pipe (344) through connection, no. two branch pipes (46) are kept away from between the one end of negative pressure pump (42) and the inside of inboard pipe (341) through connection, the sealed mounting that gives vent to anger of negative pressure pump (42) has outlet pipe (43), outlet pipe (43) are fixed in connecting bracket pole (41), fixed connection between the one end that negative pressure pump (42) was kept away from to connecting bracket pole (41) and the upper port of basin (2).
4. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 1, wherein: the outer wafer disc (36) comprises a circular connecting seat (361), a second accommodating groove (362) is formed in the bottom of the circular connecting seat (361) in a sinking mode, the position of the second accommodating groove (362) corresponds to the position of a through hole (343) in a placing disc frame (345) in a mutual arrangement mode, a second calibration salient point (363) is arranged on one side face of the circular connecting seat (361) where the second accommodating groove (362) is located, an alignment embedded groove is formed in the placing disc frame (345) corresponding to the second calibration salient point (363), and a second wafer placing disc (364) is fixedly installed on one side face, far away from the second calibration salient point (363), of the circular connecting seat (361).
5. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 1, wherein: inboard brilliant disc (35) are including square connecting seat (351), it has a volume groove (352) to sink on the side of square connecting seat (351), be equipped with a calibration bump (353) on the side of square connecting seat (351) at volume groove (352) place, be equipped with the alignment caulking groove on standing groove (342) that a calibration bump (353) corresponds, square connecting seat (351) keep away from a side of holding groove (352) on fixed mounting have a wafer place dish (354).
6. The ultrasonic trough cleaning machine for processing semiconductor wafers as recited in claim 2, wherein: the connecting pieces (511) are uniformly arranged corresponding to the annular connecting frames (510) between two adjacent outer wafer disks (36).
7. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 2, wherein: the outer side pipe (344) and the annular connecting frame (510) are fixedly welded, and connecting nodes between the annular connecting frame (510) and the outer side pipe (344) are arranged corresponding to the connecting pieces (511).
8. The tank-type ultrasonic cleaning machine for processing the semiconductor wafer as claimed in claim 1, wherein: the placing groove (342) is correspondingly arranged between the first connecting rod (313) and two adjacent connecting nodes of the inner pipe (341).
9. The ultrasonic trough cleaning machine for processing semiconductor wafers as recited in claim 3, wherein: the first connecting rod (313) is provided with a groove corresponding to the second branch pipe (46).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210988411.0A CN115069670B (en) | 2022-08-17 | 2022-08-17 | Slot type ultrasonic cleaning machine is used in processing of semiconductor wafer |
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| CN202210988411.0A CN115069670B (en) | 2022-08-17 | 2022-08-17 | Slot type ultrasonic cleaning machine is used in processing of semiconductor wafer |
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| CN115069670B true CN115069670B (en) | 2022-11-11 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328561A (en) * | 2016-08-26 | 2017-01-11 | 北京七星华创电子股份有限公司 | Nondestructive cleaning device of graphic wafer capable of improving cleaning uniformity |
| US20180056340A1 (en) * | 2016-08-26 | 2018-03-01 | Beijing Sevenstar Electronics Co.,Ltd. | Ultrasonic/megasonic cleaning device |
| CN114308842A (en) * | 2022-03-14 | 2022-04-12 | 智程半导体设备科技(昆山)有限公司 | Automatic cleaning tank for semiconductor wafer tank type cleaning machine |
| CN114589157A (en) * | 2022-03-11 | 2022-06-07 | 智程半导体设备科技(昆山)有限公司 | Wafer groove type cleaning machine with cleaning liquid flowing circularly |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3338926B2 (en) * | 1998-01-16 | 2002-10-28 | 東京エレクトロン株式会社 | Ultrasonic cleaning equipment |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328561A (en) * | 2016-08-26 | 2017-01-11 | 北京七星华创电子股份有限公司 | Nondestructive cleaning device of graphic wafer capable of improving cleaning uniformity |
| US20180056340A1 (en) * | 2016-08-26 | 2018-03-01 | Beijing Sevenstar Electronics Co.,Ltd. | Ultrasonic/megasonic cleaning device |
| CN114589157A (en) * | 2022-03-11 | 2022-06-07 | 智程半导体设备科技(昆山)有限公司 | Wafer groove type cleaning machine with cleaning liquid flowing circularly |
| CN114308842A (en) * | 2022-03-14 | 2022-04-12 | 智程半导体设备科技(昆山)有限公司 | Automatic cleaning tank for semiconductor wafer tank type cleaning machine |
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