CN115056565A - Method for reducing bubbles generated during film pressing by adopting normal-pressure plasma technology - Google Patents
Method for reducing bubbles generated during film pressing by adopting normal-pressure plasma technology Download PDFInfo
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- CN115056565A CN115056565A CN202210659603.7A CN202210659603A CN115056565A CN 115056565 A CN115056565 A CN 115056565A CN 202210659603 A CN202210659603 A CN 202210659603A CN 115056565 A CN115056565 A CN 115056565A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
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- Engineering & Computer Science (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of touch screen processing, in particular to a method for reducing bubbles generated during film pressing by adopting a normal-pressure plasma technology, which comprises the following steps: in the roll-to-roll conveying process, one surface of the dry film, which is pressed with the copper film, is sprayed by normal-pressure plasma, and then the dry film is conveyed and pressed with the copper film immediately. The invention overcomes the problem that the air bubbles are generated due to poor binding force between the dry film and the copper film caused by the smoothness and inertia of the surface of the dry film, has strong function and is convenient for operation and industrialized continuous treatment; according to the invention, the dry film is subjected to normal pressure plasma treatment, the roughness of the surface is improved after etching, new hydroxyl and carboxyl are generated on the surface, the original carboxyl of the dry film can also be activated, and then the dry film is pressed with the copper film, so that the problem that the active group fails due to timeliness is avoided.
Description
Technical Field
The invention relates to the technical field of touch screen processing, in particular to a method for reducing bubbles generated during film pressing by adopting a normal-pressure plasma technology.
Background
After uncharged ordinary gas is subjected to external high-energy action, energy absorbed by electrons in partial atoms becomes free electrons; at the same time, the atoms lose electrons and become positively charged ions. Thus, the original neutral gas will be converted into a substance consisting of a large number of free electrons, positively charged ions and a part of neutral atoms by ionization, which is called plasma. Plasma surface treatment is the physical and chemical reaction of the surface of a material by plasma generated by gas discharge. Plasma is an ionized gaseous substance with high energy that can bombard the surface of a polymer material to etch the surface, whereby the originally smooth or rough surface becomes more rough, so that the polymer material is more likely to engage with the material clinging to the surface. On the other hand, if the discharge gas contains oxygen, oxygen is introduced into the surface of the material in the form of active radicals (forming hydroxyl or carboxyl groups in the air). However, these reactive radicals have a certain aging property, i.e., they lose their activity after standing for a certain period of time. The action depth of the plasma surface treatment only relates to a very thin layer (a few nanometers to a few tens of nanometers) of the surface, and the action depth does not have any influence on the performance of the material body. Compared with the traditional chemical surface modification method, the low-temperature plasma technology is used as a novel surface modification means, and has the advantages of rapidness, high efficiency, no pollution and the like. Currently, most plasma sources are performed using low pressure glow discharge plasma. Because the vacuum equipment of the low-pressure glow discharge is numerous and complicated, the vacuum operation occupies most of energy consumption and processing cost, and the streamlined operation is difficult to realize, so that the application of the vacuum equipment is limited greatly. Therefore, the normal pressure plasma treatment material surface has more practical application value.
Film pressing is an important process in the manufacturing process of the touch screen functional sheet. Specifically, film pressing refers to applying a dry film to the surface of a copper film by a hot pressing mode by using a film pressing machine. The bonding force of the dry film and the copper film mainly comes from two forces: chemical and physical forces. Chemical force means that electronegative carboxylic acid groups and unsaturated organic compounds contained in the dry film can chemically react with electropositive copper to generate chemical bonds. Physical force refers to the interlocking of the dry film with the irregular, micro-roughened copper surface. When the bonding force between the dry film and the copper film is poor, a cavity can be formed between the dry film and the copper film, so that the subsequent exposure, development and etching links are seriously affected, and a defective product is further generated, so that the key is to improve the bonding force between the dry film and the copper film.
Disclosure of Invention
The invention aims to provide a method for reducing bubbles generated during film pressing by adopting a normal-pressure plasma technology so as to achieve the purposes of enhancing the binding force between a dry film and a copper film and avoiding bubbles, and solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a method for reducing bubbles generated during film pressing by adopting an atmospheric pressure plasma technology comprises the following steps: in the roll-to-roll conveying process, one surface of the dry film, which is pressed with the copper film, is sprayed by normal-pressure plasma, and then the dry film is conveyed and pressed with the copper film immediately.
Preferably, the film is plasma sprayed and then immediately etched to bond with the copper film.
Preferably, the atmospheric pressure plasma is distinguished from the vacuum plasma, which can be directly injected into the air without vacuum equipment.
Preferably, the plasma generating device comprises a plasma generator, a gas delivery pipeline, a plasma nozzle and the like.
Preferably, the dry film and the copper film are respectively pulled and pressed by the rotation of an upper roller and a lower roller which are tightly attached.
Preferably, the two rollers are tightly attached and have certain pressure, the two rollers have the same rotating speed, the upper roller for drawing the dry film has high temperature, and the roller for drawing the copper film has low temperature.
Preferably, the dry film component includes a base soluble polymer, a photoreactive monomer, a photoinitiator, a dye, and the like.
Preferably, the thickness of the dry film is several micrometers, and copper is plated on the surface of the PET by adopting an evaporation method to form a copper film.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention overcomes the problem that the air bubbles are generated due to poor binding force between the dry film and the copper film caused by the smoothness and inertia of the surface of the dry film, has strong function and is convenient for operation and industrialized continuous treatment;
2. according to the invention, the dry film is subjected to normal pressure plasma treatment, the roughness of the surface is improved after etching, new hydroxyl and carboxyl are generated on the surface, the original carboxyl of the dry film can also be activated, and then the dry film is pressed with the copper film, so that the problem of failure of active groups due to timeliness is avoided.
Drawings
FIG. 1 is a schematic view of a processing structure of the present invention.
In the figure: the plasma generating device comprises a plasma generating device 1, a power supply 2, a heater 3, a temperature control 4, a radio frequency 5, power 6, a spray head 7, gas A8, gas B9, a dry film 10, a copper film 11 and a guide roller 12.
Detailed Description
In order to overcome the defects of the prior art, the invention provides the following technical scheme:
the invention provides a method for reducing bubbles generated during film pressing by adopting a normal pressure plasma technology, aiming at solving the problem of insufficient adhesive force of a dry film and a copper film during film pressing. In the dry film treated by the normal pressure plasma, the roughness of the surface is improved after etching, new hydroxyl and carboxyl are generated on the surface, and the original carboxyl of the dry film can be activated. Then the dry film is pressed with the copper film, so that the active group has the problem of failure due to timeliness. The method has strong function, and is convenient for operation and industrialized continuous treatment.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
a method for reducing bubbles generated during film pressing by adopting an atmospheric pressure plasma technology comprises the following steps:
the dry film is conveyed on a guide roller at an adjustable speed, before a film pressing link is carried out, the surface of the dry film to be pressed with the copper film is sprayed, activated and modified by a normal-pressure plasma spray gun, and then the dry film and the copper film are pressed by a roll-to-roll mode.
As a preferred technical scheme of the invention, a spray head of the normal-pressure plasma spray gun is fixed above a conveying belt which moves at a constant speed, and the direction of the spray head is vertical to the direction of conveying the dry film.
As a preferred technical scheme of the invention, if physical etching is taken as a main target for the dry film, helium, argon or nitrogen plasma is selected; if the surface chemical activity of the dry film is considered simultaneously, oxygen and hydrogen plasmas can be selected; air plasma may be selected if one of the goals is to save costs.
As a preferred technical scheme of the invention, the distance between the nozzle of the normal pressure plasma and the dry film can be adjusted according to the treatment effect.
As a preferred technical scheme of the invention, the output power of the atmospheric pressure plasma equipment, the temperature of the spray head and the flow rate of the plasma are adjustable parameters of the treatment operation.
As a preferred technical scheme of the invention, the adjustable parameters of the dry film and the copper film after the plasma treatment under normal pressure during the lamination are the temperature of the upper and lower rollers, the pressure between the upper and lower rollers and the rotating speed of the upper and lower rollers determining the lamination speed.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Example 1
When the dry film is conveyed by the guide roller at 1.0m/min, one surface pressed with the copper film is sprayed by oxygen/helium atmospheric pressure plasma, and the processing parameters are as follows: the power is 10W, the temperature of the spray head is 100 ℃, and the flow rate of the plasma is 10L/min. The dry film is continuously conveyed by the guide roller and is pressed with the copper film, and the pressing parameters are as follows: the pressure between the upper and lower rollers was 0.4MPa, the temperatures of the upper and lower rollers were 110 ℃ and 60 ℃ respectively, and the speed of the upper and lower rollers was 1.0 m/min.
Example 2
When the dry film is conveyed by the guide roller at 1.0m/min, one surface pressed with the copper film is sprayed by oxygen/helium atmospheric pressure plasma, and the processing parameters are as follows: the power is 20W, the temperature of the spray head is 80 ℃, and the flow rate of the plasma is 15L/min. The dry film is continuously conveyed by the guide roller and is pressed with the copper film, and the pressing parameters are as follows: the pressure between the upper and lower rollers was 0.6MPa, the temperatures of the upper and lower rollers were 100 ℃ and 80 ℃ respectively, and the rotation speed of the upper and lower rollers was 1.0 m/min.
The above embodiments are merely preferred embodiments of the present invention, and the scope of the present invention should not be limited thereto, and those skilled in the art will be able to make various modifications without inventive changes from the above concepts and the scope of the present invention.
Claims (8)
1. A method for reducing bubbles generated during film pressing by adopting a normal pressure plasma technology is characterized by comprising the following steps: the method comprises the following steps: in the roll-to-roll conveying process, one surface of the dry film, which is pressed with the copper film, is sprayed by normal-pressure plasma, and then the dry film is conveyed and pressed with the copper film immediately.
2. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 1, wherein: the film is first plasma sprayed and then etched immediately to be pressed with the copper film.
3. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 2, wherein: atmospheric pressure plasma is distinguished from vacuum plasma, which can be directly injected into air without vacuum equipment.
4. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 3, wherein: the plasma generator consists of a plasma generator, a gas conveying pipeline, a plasma nozzle and the like.
5. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 4, wherein the method comprises the following steps: the dry film and the copper film are respectively pulled and pressed by the rotation of an upper roller and a lower roller which are tightly attached.
6. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 5, wherein: the two rollers are tightly attached and have certain pressure, the two rollers have the same rotating speed, the upper roller for pulling the dry film has high temperature, and the roller for pulling the copper film has low temperature.
7. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 6, wherein: the dry film component comprises alkali soluble polymer, photoreactive monomer, photoinitiator, dye, etc.
8. The method for reducing bubbles generated during squeeze film by using the atmospheric pressure plasma technology as claimed in claim 7, wherein: the thickness of the dry film is several micrometers, and copper is plated on the surface of the PET by adopting an evaporation method to form a copper film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659603.7A CN115056565A (en) | 2022-06-13 | 2022-06-13 | Method for reducing bubbles generated during film pressing by adopting normal-pressure plasma technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659603.7A CN115056565A (en) | 2022-06-13 | 2022-06-13 | Method for reducing bubbles generated during film pressing by adopting normal-pressure plasma technology |
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| CN115056565A true CN115056565A (en) | 2022-09-16 |
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| CN202210659603.7A Pending CN115056565A (en) | 2022-06-13 | 2022-06-13 | Method for reducing bubbles generated during film pressing by adopting normal-pressure plasma technology |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080030839A (en) * | 2006-10-02 | 2008-04-07 | 주식회사 코오롱 | Surface modified polyimide film using plasma, its manufacturing method and copper clad laminates |
| CN103665413A (en) * | 2012-09-20 | 2014-03-26 | 苏州市奥普斯等离子体科技有限公司 | Method for performing material surface modification under normal pressure via plasma graft polymerization |
| CN106965273A (en) * | 2017-04-17 | 2017-07-21 | 南京林业大学 | The method that environment-friendly plywood is prepared using standard atmosphere plasma modified plastic sheeting |
| CN107371338A (en) * | 2016-05-13 | 2017-11-21 | 苏州卫鹏机电科技有限公司 | A kind of preparation method of the printed substrate of ultra-thin metal layer |
| CN108440780A (en) * | 2018-02-10 | 2018-08-24 | 朱东洋 | A kind of preparation method of the special PET film of polyester copper plating film |
| CN109814336A (en) * | 2019-01-21 | 2019-05-28 | 深圳市道尔顿电子材料有限公司 | Alkali soluble negative photosensitive polyimide resin combination |
| CN112574442A (en) * | 2019-09-27 | 2021-03-30 | 柯尼卡美能达株式会社 | Film roll and method for producing same |
| CN215301003U (en) * | 2020-12-31 | 2021-12-24 | 佛山市彩龙镀膜包装材料有限公司 | Anti-interference shielding copper plating film |
-
2022
- 2022-06-13 CN CN202210659603.7A patent/CN115056565A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080030839A (en) * | 2006-10-02 | 2008-04-07 | 주식회사 코오롱 | Surface modified polyimide film using plasma, its manufacturing method and copper clad laminates |
| CN103665413A (en) * | 2012-09-20 | 2014-03-26 | 苏州市奥普斯等离子体科技有限公司 | Method for performing material surface modification under normal pressure via plasma graft polymerization |
| CN107371338A (en) * | 2016-05-13 | 2017-11-21 | 苏州卫鹏机电科技有限公司 | A kind of preparation method of the printed substrate of ultra-thin metal layer |
| CN106965273A (en) * | 2017-04-17 | 2017-07-21 | 南京林业大学 | The method that environment-friendly plywood is prepared using standard atmosphere plasma modified plastic sheeting |
| CN108440780A (en) * | 2018-02-10 | 2018-08-24 | 朱东洋 | A kind of preparation method of the special PET film of polyester copper plating film |
| CN109814336A (en) * | 2019-01-21 | 2019-05-28 | 深圳市道尔顿电子材料有限公司 | Alkali soluble negative photosensitive polyimide resin combination |
| CN112574442A (en) * | 2019-09-27 | 2021-03-30 | 柯尼卡美能达株式会社 | Film roll and method for producing same |
| CN215301003U (en) * | 2020-12-31 | 2021-12-24 | 佛山市彩龙镀膜包装材料有限公司 | Anti-interference shielding copper plating film |
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