CN114921748A - Polymer film surface modification treatment method for vacuum coating - Google Patents
Polymer film surface modification treatment method for vacuum coating Download PDFInfo
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- CN114921748A CN114921748A CN202210222555.5A CN202210222555A CN114921748A CN 114921748 A CN114921748 A CN 114921748A CN 202210222555 A CN202210222555 A CN 202210222555A CN 114921748 A CN114921748 A CN 114921748A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Abstract
The invention relates to a surface modification treatment method of a polymer film for vacuum coating, which comprises the following steps: fixing the polymer film on an unwinding roller, carrying out amination pretreatment through a plasma treatment area, then carrying out grafting molecular solution spraying on two sides of the polymer film, squeezing the polymer film to dry through a squeezing roller, then baking at high temperature, and finally fixing the polymer film on a winding roller. The invention has the advantages of high efficiency, rapidness, simplicity, uniformity and the like, and the obtained polymer film has better surface modification effect, and the binding force of a plating layer and the film is stronger after vacuum coating.
Description
Technical Field
The invention belongs to the field of vacuum coating, and particularly relates to a surface modification treatment method of a polymer film for vacuum coating.
Background
Along with the rapid development of vacuum coating technology, the defects of traditional production modes such as electroplating and chemical plating are more obvious and are not more and more suitable for the requirements of modern industrial manufacturing, and the vacuum coating technology is more and more widely applied to various industries by virtue of the green and environment-friendly process characteristics of the vacuum coating technology.
The vacuum coating comprises chemical vapor deposition and physical vapor deposition, wherein the physical vapor deposition comprises evaporation plating, sputtering plating, ion plating and the like, and the related coating base materials comprise various workpieces made of metal, ceramic, organic polymer plastic and the like. One of the difficulties in coating the surface of the polymer film is how to enhance the bonding force between the coating and the substrate film, and especially, the flexible polymer film widely used in production and life requires strong chemical inertness to maintain stability and durability. The surface inertia characteristic makes the coating not easy to form chemical bonding with coating metal or other non-metals, so that the coating bonding force is not firm, and the service life is reduced. Generally, in order to increase the bonding force, the surface of the film is pretreated before vacuum coating, and the ion source treatment is a common surface pretreatment method. Impurity foreign matters on the surface of the substrate are cleaned through high-energy ion bombardment, meanwhile, the chemical bonds of inert molecules on the surface layer are broken through by ions with higher energy, and gaseous small molecules are formed and volatilize to leave the surface, so that a new active surface layer is exposed. Although the activity of the exposed new surface layer is slightly improved, the application requirements of some specific industries are still difficult to achieve. Plasma treatment methods under an atmosphere of oxygen, nitrogen, or the like are also commonly used, but the plasma treatment effect is limited, and this problem cannot be solved. Therefore, how to break the inertia of the surface of the polymer film and increase the bonding force between the polymer film and the coating before vacuum coating is the key of the current vacuum coating production.
The reasons for the poor bonding force between the polymer film and the coating metal are as follows: firstly, the surface of the film is passivated and cannot form effective chemical acting force with the plating metal; secondly, the surface of the film is smooth, so that the bonding area between the film and the coating is small, and the bonding strength can not meet the bonding force requirement of a commercial application product; and thirdly, the surface of the film contains a functional group capable of dehydrating, so that the film is combined with the coating and then local instability such as dehydration bubbling and the like occurs at high temperature. The current methods of ion source treatment and the like used in industry can only solve the first problem, and few reports exist on realizing high bonding force between a film layer and a coating. Therefore, increasing the roughness of the film layer on the basis of removing the passivation layer on the surface of the polymer film and avoiding high temperature instability are a big challenge in the current research on the film coating on the surface of the polymer film.
Disclosure of Invention
The invention aims to solve the technical problem of providing a surface modification treatment method of a polymer film for vacuum coating, which has the advantages of high efficiency, rapidness, simplicity, uniformity and the like, and the obtained polymer film has good surface modification effect, and after vacuum coating, the coating and the film have strong binding force.
The invention provides a surface modification treatment method of a polymer film for vacuum coating, which comprises the following steps:
fixing a polymer film on an unwinding roller, carrying out amination pretreatment through a plasma treatment area, then carrying out graft molecular solution spraying on two sides of the polymer film, squeezing the polymer film to dry through a squeezing roller, and finally fixing the polymer film on a winding roller after high-temperature baking; wherein, the spraying is carried out on two sides in the vertical direction of the operation of the polymer film, and the spraying flow is 1-10L/h.
Compared with a horizontal spraying mode, the method is not influenced by the difference of horizontal gravity and the difference of the time of the solution staying on the polymer film, so that the coating amount of the silane on the two sides has better uniformity and consistency.
The polymer is one or more of polyimide, polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene and polyacrylonitrile.
And controlling the tension balance of winding and unwinding of the polymer film through a tension roller. The tension setting range is 10-60 kg.
The gas adopted by the plasma treatment area is one or more of nitrogen, ammonia, nitrous oxide and nitrogen dioxide, and the gas flow is 300-3000 sccm. Gas is introduced from the middle of the pretreatment module and overflows from outlets at two ends so as to maintain the atmosphere composition in the region basically unchanged.
The discharge power of the plasma processing region is 200- 5 Pa) or low pressure (10-1000 Pa), the treatment time is 5-60s, and the treatment time can be realized by adjusting the running speed of the whole film.
The solute of the grafting molecule solution is one or more of alkyl series silane, amino series silane, sulfur series silane, vinyl series silane, methacryloxy series silane, epoxy series silane and coupling agent intermediate series silane; the solvent is one or more of water, ethanol, toluene, diethyl ether, N-dimethylformamide and dimethyl sulfoxide.
The temperature of the high-temperature baking oven is 50-200 ℃, and the time is 3-60 s.
The method is used for evaporation coating, sputtering coating or ion coating.
The invention has the advantages of high efficiency, rapidness, simplicity, uniformity and the like, and the obtained polymer film has better surface modification effect, and the binding force of a plating layer and the film is stronger after vacuum coating. In the surface modification process, firstly, high-energy plasma cleans and aminates the surface layer of the polymer film; the grafting group is then combined with functional groups on the polymer surface. On one hand, the surface of the aminated film and a silane coupling agent form stronger binding force through chemical binding; on the other hand, the coupling agent layer increases the roughness and diffusion depth of the surface of the polymer film, is beneficial to the strong and deep interaction between the plating metal and the coating metal, and greatly improves the chemical bonding between the surface of the polymer film and the subsequent vacuum plating metal, thereby realizing strong bonding force between the film and the metal plating. Therefore, the surface modification method realizes the strong combination of the polymer film and the metal, and has great promotion effect on the development of industries such as flexible conduction and electronic circuit manufacturing.
Advantageous effects
(1) The method has the advantages of simple operation, short processing time, no strict requirements on pressure and atmosphere, and no mechanical damage to the main body of the polymer film, so that the intrinsic physical properties of the polymer film are not obviously influenced.
(2) The chemical modification method disclosed by the invention realizes double-sided treatment in one step, the treatment effect is uniform, the treatment interface not only comprises a clean and passivated surface, but also comprises chemical bonding, so that the bonding force of the interface is promoted from Van der Waals acting force and a hydrogen bond to a covalent bond and a coordination bond, and the bonding force can be greatly improved.
(3) The chemical modification method can form stable large-area binding sites on the surface of the polymer film, the lifting capacity of the polymer film to the interface binding force is not weakened or passivated along with the prolonging of time, and more flexibility and production arrangement freedom are provided for production.
(4) The chemical modification method only changes the area of a few nanometers on the surface of the polymer film, does not cause obvious change to the thickness of the foil surface, and does not change the dimensional stability of the film.
Drawings
FIG. 1 is a schematic process flow diagram of the present invention.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention can be made by those skilled in the art after reading the teaching of the present invention, and these equivalents also fall within the scope of the claims appended to the present application.
Example 1
The whole-roll polyimide film with the width of 1300mm is fixed on an unwinding roller, passes through a plasma processing area and a chemical modification area after passing through a guide roller and a tension roller, and is fixed on a winding roller. Through tension setting, the winding and unwinding tension balance of the whole roll of film is realized, and the tension value is 60 kg. The gas in the plasma treatment zone was turned on, using 3000sccm nitrogen, and the gas was admitted from the middle of the zone and flowed out from both sides. And after the atmosphere composition in the bin is stable, opening a plasma module switch, and setting the power to be 300W. And opening a solution spray pipe in the chemical modification area, controlling the flow to be 2L/h, controlling the concentration of the chemical modification solution to be 2g/L and controlling the temperature of the oven to be 150 ℃. And regulating and controlling the winding and unwinding system to make the film pass through the plasma treatment area and the chemical modification area at a constant speed, wherein the plasma treatment time is 25 s.
After the whole roll treatment, the film was sampled and tested for hydrophilicity (contact angle). Transferring the polyimide film into a winding type vacuum sputtering device, vacuumizing for sputtering coating, wherein the thickness of a chromium plating layer is about 30nm, the thickness of a copper plating layer is 170nm, and the temperature of the film is controlled to be 30 ℃ constantly in the coating process. After the film coating is finished, the bonding force between the coating and the polyimide film is tested by a Baige method, and the test conditions refer to GB/T9286-1998.
Example 2
Fixing the whole polyimide film with the width of 1300mm on an unwinding roller, passing through a plasma processing area after passing through a guide roller and a tension roller, and fixing the whole polyimide film on a winding roller. Through tension setting, the winding and unwinding tension balance of the whole roll of film is realized, and the tension value is 60 kg. The gas in the plasma treatment zone was turned on, using 3000sccm nitrogen, and the gas was admitted from the middle of the zone and flowed out from both sides. And after the atmosphere composition in the bin is stable, opening a plasma module switch, and setting the power to be 300W. And regulating and controlling the winding and unwinding system to make the film pass through the plasma processing area at a constant speed for 25 s. The whole plasma treatment process is placed in a vacuum chamber, and the pressure in the chamber is controlled to be 500Pa (shown by a vacuum gauge). And after the whole roll treatment is finished, the whole roll of polyimide film is transferred to another reeling and unreeling system, and is fixed on a reeling roller after passing through a guide roller, a tension roller and a chemical modification area, wherein the tension is 60 kg. And opening a solution spray pipe, controlling the flow to be 2L/h, controlling the chemical modification solution to be amino silane with the concentration of 2g/L, and controlling the temperature of the oven to be 150 ℃. And regulating and controlling the winding and unwinding system to make the film pass through the chemical modification area at a constant speed.
After the completion of the rolling treatment, the film was sampled and tested for hydrophilicity (contact angle). Transferring the polyimide film into a winding type vacuum sputtering device, vacuumizing and carrying out sputtering coating, wherein the thickness of a chromium plating layer is about 30nm, the thickness of a copper plating layer is 170nm, and the temperature of the film is controlled to be constant at 30 ℃ in the coating process. After the film plating is finished, the bonding force between the plating layer and the polyimide film is tested by using a Baige method, and the test conditions refer to GB/T9286-1998.
Example 3
The whole-roll polyimide film with the width of 1300mm is fixed on an unwinding roller, passes through a plasma processing area and a chemical modification area after passing through a guide roller and a tension roller, and is fixed on a winding roller. Through tension setting, the winding and unwinding tension balance of the whole roll of film is realized, and the tension value is 60 kg. The gas in the plasma treatment zone was turned on, using 3000sccm nitrogen, and the gas was admitted from the middle of the zone and flowed out from both sides. And after the atmosphere composition in the bin is stable, opening a plasma module switch, and setting the power to be 300W. And opening a solution spray pipe in the chemical modification area, controlling the flow to be 2L/h, controlling the concentration of the chemical modification solution to be 2g/L, and controlling the temperature of the oven to be 150 ℃. And regulating and controlling the winding and unwinding system to make the film pass through the plasma treatment area and the chemical modification area at a constant speed, wherein the plasma treatment time is 25 s.
After the completion of the rolling treatment, the film was sampled and tested for hydrophilicity (contact angle). Transferring the polyimide film into a winding type vacuum sputtering device, vacuumizing and carrying out sputtering coating, wherein the thickness of a chromium plating layer is about 30nm, the thickness of a copper plating layer is 170nm, and the temperature of the film is controlled to be constant at 30 ℃ in the coating process. After the film plating is finished, the bonding force between the plating layer and the polyimide film is tested by using a Baige method, and the test conditions refer to GB/T9286-1998.
Comparative example 1
The polyimide film was directly sampled and tested for hydrophilicity (contact angle). And then transferring the polyimide film into a winding type vacuum sputtering device, vacuumizing and carrying out sputtering coating, wherein the thickness of a nickel-plated layer is about 30nm, the thickness of a copper-plated layer is 170nm, and the temperature of the film is controlled to be constant at 30 ℃ in the coating process. After the film plating is finished, the bonding force between the plating layer and the polyimide film is tested by using a Baige method, and the test conditions refer to GB/T9286-1998.
Comparative example 2
The experimental procedure was the same as the treatment method of example 1, except that the power of the plasma treatment zone was set to 0W.
Comparative example 3
The experimental procedure was the same as in the treatment method of example 1 except that the solute concentration of the chemical modification solution was adjusted to 0.
Analysis of results
The experimental results show that the plasma treatment can effectively improve the effect of chemical modification, but the plasma treatment can not realize strong combination of the coating and the substrate. Although the chemical modification does not obviously improve the hydrophilicity of the base material, the improvement of the bonding force of the coating film is obvious.
To sum up: the method successfully realizes the chemical modification of the surface of the coiled polymer film through plasma treatment and chemical modification, and enhances the binding force between the polymer film and the vacuum coating. The method has simple steps and easy operation, can effectively improve the quality of vacuum coating products on the surfaces of various polymer films, and has wide application value and great economic benefit.
Claims (8)
1. A surface modification treatment method of a polymer film for vacuum coating comprises the following steps:
fixing a polymer film on an unwinding roller, performing amination pretreatment through a plasma treatment area, then performing grafted molecular solution spraying on two sides of the polymer film, squeezing the polymer film by a squeezing roller, baking the polymer film at high temperature, and finally fixing the polymer film on a winding roller; wherein, the spraying is carried out on two sides in the vertical direction of the operation of the polymer film, and the spraying flow is 1-10L/h.
2. The method of claim 1, wherein: the polymer is one or more of polyimide, polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene and polyacrylonitrile.
3. The method of claim 1, wherein: and controlling the tension balance of winding and unwinding of the polymer film through a tension roller.
4. The method of claim 1, wherein: the gas adopted by the plasma treatment area is one or more of nitrogen, ammonia, nitrous oxide and nitrogen dioxide, and the gas flow is 300-3000 sccm.
5. The method of claim 1, wherein: the discharge power of the plasma treatment area is 200-1000W, the discharge air pressure is normal pressure or low pressure, and the treatment time is 5-60 s.
6. The method of claim 1, wherein: the solute of the grafting molecule solution is one or more of alkyl series silane, amino series silane, sulfur series silane, vinyl series silane, methacryloxy series silane, epoxy series silane and coupling agent intermediate series silane; the solvent is one or more of water, ethanol, toluene, diethyl ether, N-dimethylformamide and dimethyl sulfoxide.
7. The method of claim 1, wherein: the temperature of the high-temperature baking oven is 50-200 ℃, and the time is 3-60 s.
8. The method of claim 1, wherein: the method is used for evaporation coating, sputtering coating or ion coating.
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| CN202210222555.5A CN114921748A (en) | 2022-03-09 | 2022-03-09 | Polymer film surface modification treatment method for vacuum coating |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006059845A1 (en) * | 2004-11-30 | 2006-06-08 | Korea Research Institute Of Chemical Technology | Method of surface modification of polyimide film using silanes coupling agent, manufacturing method of flexible copper clad laminate and its product thereby |
| US20100035074A1 (en) * | 2006-11-10 | 2010-02-11 | Yoram Cohen | Atmospheric pressure plasma-induced graft polymerization |
| CN101831079A (en) * | 2009-03-13 | 2010-09-15 | 中国纺织科学研究院 | Method and device for modifying surface of polymer material |
| CN101890314A (en) * | 2010-07-20 | 2010-11-24 | 东华大学 | Surface hydrophilic modification method for polytetrafluoroethylene bulked membrane |
| CN101979429A (en) * | 2010-10-14 | 2011-02-23 | 中国科学院宁波材料技术与工程研究所 | Surface modification method for polytetrafluoroethylene product |
| CN102786708A (en) * | 2012-08-20 | 2012-11-21 | 太原理工大学 | Method for preparing antimicrobial medical polymer material |
| CN103849001A (en) * | 2012-12-04 | 2014-06-11 | 中国科学院大连化学物理研究所 | Composite membrane for lithium sulphur battery and preparation method thereof |
| CN109957133A (en) * | 2017-12-25 | 2019-07-02 | 中国石油化工股份有限公司 | A kind of polyurethane hydrophilic method of modifying based on plasma surface modification |
| CN211897085U (en) * | 2019-12-31 | 2020-11-10 | 赫得纳米科技(昆山)有限公司 | Continuous double-sided EMI (electro-magnetic interference) coating equipment |
| CN216192654U (en) * | 2021-10-12 | 2022-04-05 | 成都兴科维真空科技有限公司 | Continuous coating equipment convenient for double-sided coating |
-
2022
- 2022-03-09 CN CN202210222555.5A patent/CN114921748A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006059845A1 (en) * | 2004-11-30 | 2006-06-08 | Korea Research Institute Of Chemical Technology | Method of surface modification of polyimide film using silanes coupling agent, manufacturing method of flexible copper clad laminate and its product thereby |
| US20100035074A1 (en) * | 2006-11-10 | 2010-02-11 | Yoram Cohen | Atmospheric pressure plasma-induced graft polymerization |
| CN101831079A (en) * | 2009-03-13 | 2010-09-15 | 中国纺织科学研究院 | Method and device for modifying surface of polymer material |
| CN101890314A (en) * | 2010-07-20 | 2010-11-24 | 东华大学 | Surface hydrophilic modification method for polytetrafluoroethylene bulked membrane |
| CN101979429A (en) * | 2010-10-14 | 2011-02-23 | 中国科学院宁波材料技术与工程研究所 | Surface modification method for polytetrafluoroethylene product |
| CN102786708A (en) * | 2012-08-20 | 2012-11-21 | 太原理工大学 | Method for preparing antimicrobial medical polymer material |
| CN103849001A (en) * | 2012-12-04 | 2014-06-11 | 中国科学院大连化学物理研究所 | Composite membrane for lithium sulphur battery and preparation method thereof |
| CN109957133A (en) * | 2017-12-25 | 2019-07-02 | 中国石油化工股份有限公司 | A kind of polyurethane hydrophilic method of modifying based on plasma surface modification |
| CN211897085U (en) * | 2019-12-31 | 2020-11-10 | 赫得纳米科技(昆山)有限公司 | Continuous double-sided EMI (electro-magnetic interference) coating equipment |
| CN216192654U (en) * | 2021-10-12 | 2022-04-05 | 成都兴科维真空科技有限公司 | Continuous coating equipment convenient for double-sided coating |
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