CN115055861A - Alloy formula for wave soldering and manufacturing method thereof - Google Patents
Alloy formula for wave soldering and manufacturing method thereof Download PDFInfo
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- CN115055861A CN115055861A CN202210719231.2A CN202210719231A CN115055861A CN 115055861 A CN115055861 A CN 115055861A CN 202210719231 A CN202210719231 A CN 202210719231A CN 115055861 A CN115055861 A CN 115055861A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 72
- 239000000956 alloy Substances 0.000 title claims abstract description 72
- 238000005476 soldering Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910033181 TiB2 Inorganic materials 0.000 claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 12
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 72
- 239000000843 powder Substances 0.000 claims description 43
- 238000003756 stirring Methods 0.000 claims description 42
- 238000000498 ball milling Methods 0.000 claims description 37
- 238000002156 mixing Methods 0.000 claims description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 229910052718 tin Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 23
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 22
- 239000004327 boric acid Substances 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 238000003723 Smelting Methods 0.000 claims description 21
- WLQXLCXXAPYDIU-UHFFFAOYSA-L cobalt(2+);disulfamate Chemical compound [Co+2].NS([O-])(=O)=O.NS([O-])(=O)=O WLQXLCXXAPYDIU-UHFFFAOYSA-L 0.000 claims description 21
- 239000008367 deionised water Substances 0.000 claims description 21
- 229910021641 deionized water Inorganic materials 0.000 claims description 21
- 238000004070 electrodeposition Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 18
- 239000011812 mixed powder Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 3
- 238000009472 formulation Methods 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 9
- 238000005253 cladding Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 238000009736 wetting Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 238000005457 optimization Methods 0.000 abstract description 4
- 238000000265 homogenisation Methods 0.000 abstract description 2
- 230000006911 nucleation Effects 0.000 abstract description 2
- 238000010899 nucleation Methods 0.000 abstract description 2
- 230000008520 organization Effects 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011572 manganese Substances 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to the technical field of wave soldering, and discloses an alloy formula for wave soldering and a manufacturing method thereof, wherein the alloy formula is prepared from the following components in percentage by weight: zn 5-8%, Cu 1-2%, Ni0.3-0.8%, Cr 2-3%, Mn0.5-0.9%, and the balance Sn; the alloy for wave soldering prepared by the invention can obviously improve the organization structure of the alloy through the optimization of each component and the optimization of the proportion, and not only improves the wetting property of the alloy through introducing the coated titanium diboride, but also promotes the nucleation of the alloy in the solidification process, has the functions of metamorphism and homogenization, thereby improving the welding property of the solder alloy, particularly obviously improving the hardness property of welding spots and expanding the application field of the alloy.
Description
Technical Field
The invention relates to the technical field of wave soldering, in particular to an alloy formula for wave soldering and a manufacturing method thereof.
Background
Wave soldering is the soldering process in which the soldering surface of a plug-in board is directly contacted with high-temperature liquid tin to achieve the purpose of soldering, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device, so the wave soldering is called as wave soldering, and the main material of the wave soldering is a soldering tin bar.
The Sn-Pb alloy has excellent performance and low price, and is the most widely used brazing material in electronic assembly welding. However, due to the great harm of Pb element to human body and environment, lead-free is realized in the electronic field by domestic and foreign legislation, so that lead-free solder is produced and gradually popularized in various countries.
With the advance of lead-free, Sn-Zn alloy is continuously popularized and applied, but Sn-Zn alloy has the defect of poor wettability and oxidation resistance, and needs to be improved.
For example, chinese invention with prior art publication No. CN106041353B discloses a Sn-Zn-Bi system lead-free solder alloy and a manufacturing method thereof, wherein the lead-free solder alloy comprises the following elements by mass percent: zn: 6-8%, Bi: 1-3%, Ti: 0.2-1%, Al: 0.02-0.1%, B: 0.001-0.005% and Sn as the rest. Compared with the prior art, the Sn-Zn-Bi lead-free solder alloy provided by the invention has better welding spot bonding strength, better oxidation resistance and wettability, however, the welding performance is general, the expansibility of the solder is poorer, and the application of the solder is limited.
Based on the above, we propose an alloy formula for wave soldering, and hopefully solve the defects in the prior art.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an alloy formula for wave soldering and a manufacturing method thereof.
In order to achieve the purpose, the invention provides the following technical scheme:
an alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 5-8%, Cu 1-2%, Ni0.3-0.8%, Cr 2-3%, Mn0.5-0.9%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.2-1.6 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:1-2, the ball milling rotation speed is 120-150r/min, the ball milling is carried out under the protection of inert atmosphere, and the ball milling is carried out for 6-8h to obtain ball milling materials;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 40-50min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the surface deposition TC4 titanium alloy comprises the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 60-70 ℃, preserving heat, stirring for 30-40min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) taking a nickel plate as an anode, taking a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1-1.5A/dm 2 Carrying out electrodeposition treatment for 2-3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
As a further technical scheme, the mixing mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 12-15:1-2: 30-40.
As a further technical scheme, the mixing mass ratio of the surface deposition TC4 titanium alloy powder to the titanium diboride powder is 1: 3-5.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tubular furnace is 500-600 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of the smelting furnace to 470-480 ℃, preserving heat for 20-30min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving heat for 40-50min to obtain intermediate liquid;
(3) adding the coated titanium diboride into the intermediate liquid, heating to 600-620 ℃, stirring, and keeping the temperature for 10-15 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Through the introduction of boric acid, can effectual reduction cathode surface activity, restrain crystal growth, promote the crystalline grain and refine, reduce the internal stress, improve the surface smoothness, simultaneously, can reduce the fragility of sedimentary deposit, can be in the grain boundary segregation through boron element, promote crystalline grain thermal stability, increase the degree of wetting of negative pole and the homogeneity that separates out cobalt to make cobalt can be at TC4 titanium alloy surface evenly distributed.
According to the invention, through a large amount of experimental researches, the components are reasonably proportioned, the prepared alloy formula for wave soldering is not easy to generate a tissue segregation phenomenon in the use process, the wettability is obviously improved, the spreadability is further enhanced, and meanwhile, the oxidation tendency is obviously inhibited in the use process, so that the welding quality is improved.
After the alloy for wave soldering is adopted for soldering, the problem that copper in a traditional Chinese welding spot and a printed circuit substrate is dissolved into molten solder, and if the problem occurs, the short circuit phenomenon of the welding spot is easily caused is solved.
Compared with the prior art, the invention provides an alloy formula for wave soldering, which has the following beneficial effects:
the alloy for wave soldering prepared by the invention can obviously improve the organization structure of the alloy through the optimization of each component and the optimization of the proportion, and not only improves the wetting property of the alloy through introducing the coated titanium diboride, but also promotes the nucleation of the alloy in the solidification process, has the functions of metamorphism and homogenization, thereby improving the welding property of the solder alloy, particularly obviously improving the hardness property of welding spots and expanding the application field of the alloy.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following are specific examples:
example 1
An alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 5%, Cu 1%, Ni0.3%, Cr 2%, Mn0.5%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.2 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:1, the ball milling rotation speed is 120r/min, ball milling is carried out under the protection of inert atmosphere, and ball milling is carried out for 6 hours to obtain a ball grinding material;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 40min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the titanium alloy with TC4 deposited on the surface comprises the following steps:
mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 60 ℃, keeping the temperature and stirring for 30min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
taking a nickel plate as an anode and a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1A/dm 2 Carrying out electrodeposition treatment for 2h, and then taking out the deposited TC4 titanium alloy;
and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
According to a further technical scheme, the mixing mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 12:1: 30.
As a further technical scheme, the mixing mass ratio of the surface deposited TC4 titanium alloy powder to the titanium diboride powder is 1: 3.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tube furnace is 500 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of the smelting furnace to 470 ℃, preserving the heat for 20min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving the heat for 40min to obtain intermediate solution;
(3) adding the coated titanium diboride into the intermediate liquid, heating to 600 ℃, stirring, and keeping the temperature for 10 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Example 2
An alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 6%, Cu1.2%, Ni0.4%, Cr2.3%, Mn0.6%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.3 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder and the titanium diboride powder deposited on the surface into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:1.2, the ball milling rotation speed is 125r/min, ball milling is carried out under the protection of inert atmosphere, and ball milling is carried out for 7 hours to obtain a ball grinding material;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 42min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the titanium alloy with TC4 deposited on the surface comprises the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 63 ℃, keeping the temperature and stirring for 35min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) using nickel plate asAnode, TC4 titanium alloy plate as cathode, single pulse current mode, and current density of 1.1A/dm 2 Carrying out electrodeposition treatment for 2.3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
According to a further technical scheme, the mixing mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 13:1.2: 35.
As a further technical scheme, the mixing mass ratio of the TC4 titanium alloy powder deposited on the surface to the titanium diboride powder is 1: 4.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tube furnace is 520 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of the smelting furnace to 472 ℃, preserving the heat for 25min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving the heat for 45min to obtain intermediate solution;
(3) adding the coated titanium diboride into the intermediate liquid, heating to 610 ℃, stirring, and keeping the temperature for 12 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Example 3
An alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 7%, Cu1.3%, Ni0.5%, Cr2.6%, Mn0.7%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.4 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:2, the ball milling rotation speed is 150r/min, ball milling is carried out under the protection of inert atmosphere, and ball milling is carried out for 6 hours to obtain a ball grinding material;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 50min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the titanium alloy with TC4 deposited on the surface comprises the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 60 ℃, keeping the temperature and stirring for 40min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) taking a nickel plate as an anode and a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1A/dm 2 Carrying out electrodeposition treatment for 3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
According to a further technical scheme, the mixing mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 13:1: 40.
As a further technical scheme, the mixing mass ratio of the TC4 titanium alloy powder deposited on the surface to the titanium diboride powder is 1: 3.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tube furnace is 520 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of a smelting furnace to 480 ℃, preserving heat for 20min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving heat for 50min to obtain an intermediate solution;
(3) adding the coated titanium diboride into the intermediate liquid, heating to 600 ℃, stirring, and keeping the temperature for 15 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Example 4
An alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 7%, Cu1.8%, Ni0.6%, Cr2.8%, Mn0.6%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.5 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:1, the ball milling rotation speed is 120r/min, ball milling is carried out under the protection of inert atmosphere, and ball milling is carried out for 6 hours to obtain a ball grinding material;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 50min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the titanium alloy with TC4 deposited on the surface comprises the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 70 ℃, keeping the temperature and stirring for 40min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) taking a nickel plate as an anode and a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1A/dm 2 Carrying out electrodeposition treatment for 3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain the surface deposited TC4 titanium alloy powder.
As a further technical scheme, the mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 15:2: 30.
As a further technical scheme, the mixing mass ratio of the TC4 titanium alloy powder deposited on the surface to the titanium diboride powder is 1: 3.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tube furnace is 600 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of the smelting furnace to 470 ℃, preserving the heat for 30min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving the heat for 40min to obtain intermediate solution;
(3) adding the coated titanium diboride into the intermediate solution, heating to 620 ℃, stirring, and keeping the temperature for 15 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Example 5
An alloy formula for wave soldering is prepared from the following components in percentage by weight: zn 8%, Cu 2%, Ni0.8%, Cr 3%, Mn0.9%, and the balance Sn.
As a further technical scheme, titanium diboride accounting for 1.6 percent of the total weight of the alloy formula is further added into the alloy formula for wave soldering.
As a further technical scheme, the titanium diboride is subjected to TC4 titanium alloy coating treatment to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:2, the ball milling rotation speed is 150r/min, ball milling is carried out under the protection of inert atmosphere, and ball milling is carried out for 8 hours to obtain a ball grinding material;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 50min, and naturally cooling to room temperature to obtain the coated titanium diboride.
As a further technical scheme, the manufacturing method of the titanium alloy with TC4 deposited on the surface comprises the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 70 ℃, keeping the temperature and stirring for 40min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) taking a nickel plate as an anode and a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1.5A/dm 2 Carrying out electrodeposition treatment for 3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
As a further technical scheme, the mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 15:2: 40.
As a further technical scheme, the mixing mass ratio of the TC4 titanium alloy powder deposited on the surface to the titanium diboride powder is 1: 5.
As a further technical scheme, the inert atmosphere is nitrogen.
As a further technical scheme, the heating temperature in the tube furnace is 600 ℃.
A manufacturing method of an alloy formula for wave soldering comprises the following steps:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of a smelting furnace to 480 ℃, preserving heat for 30min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuously preserving heat for 50min to obtain intermediate liquid;
(3) adding the coated titanium diboride into the intermediate solution, heating to 620 ℃, stirring, and keeping the temperature for 15 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
Comparative example 1: the difference from the embodiment 1 is that the coated titanium diboride is not added.
Comparative example 2: the difference from the embodiment 1 is that TC4 titanium alloy powder deposited on the surface is not added in the preparation of the coated titanium diboride.
And (3) testing:
carrying out wetting property detection on samples of examples and comparative examples, and referring to GB/T11364-2008;
TABLE 1
As can be seen from Table 1, the alloy for wave soldering prepared by the invention has excellent wetting property, and the spreading rate and the wetting angle are both greatly improved, so that the welding property is obviously improved.
The hardness of welding spots of the samples of the examples and the comparative examples is detected by referring to GB 7997-;
TABLE 2
| hardness/HV | |
| Example 1 | 303.8 |
| Example 2 | 311.2 |
| Example 3 | 308.8 |
| Example 4 | 310.6 |
| Example 5 | 301.5 |
| Comparative example 1 | 235.3 |
| Comparative example 2 | 270.1 |
As can be seen from Table 2, the hardness of the welded spot of the alloy for wave soldering prepared by the method of the invention is greatly increased.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The alloy formula for wave soldering is characterized by comprising the following components in percentage by weight: zn 5-8%, Cu 1-2%, Ni0.3-0.8%, Cr 2-3%, Mn0.5-0.9%, and the balance Sn.
2. The alloy formulation for wave soldering according to claim 1, wherein titanium diboride is further added in an amount of 1.2 to 1.6% by weight based on the total weight of the alloy formulation.
3. The alloy formulation for wave soldering according to claim 2, wherein the titanium diboride is subjected to TC4 titanium alloy cladding to obtain clad titanium diboride.
4. The alloy formulation for wave soldering according to claim 3, wherein: the manufacturing method of the coated titanium diboride comprises the following steps:
(1) depositing nano cobalt particles on the surface of the TC4 titanium alloy to obtain surface-deposited TC4 titanium alloy powder;
(2) adding the TC4 titanium alloy powder deposited on the surface and the titanium diboride powder into a stirring device, and uniformly stirring to obtain mixed powder;
(3) placing the obtained mixed powder into a ball mill for ball milling treatment, wherein the ball-material ratio of the ball milling treatment is 10:1-2, the ball milling rotation speed is 120-150r/min, the ball milling is carried out under the protection of inert atmosphere, and the ball milling is carried out for 6-8h to obtain ball milling materials;
(4) and adding the obtained ball-milled material into a tube furnace for heating, preserving the heat for 40-50min, and naturally cooling to room temperature to obtain the coated titanium diboride.
5. The alloy formula for wave soldering according to claim 4, wherein the surface deposited TC4 titanium alloy is prepared by the following steps:
(1) mixing cobalt sulfamate, boric acid and deionized water to obtain an electrodeposition solution, which specifically comprises the following steps: adding cobalt sulfamate into deionized water, adjusting the temperature to 60-70 ℃, preserving heat, stirring for 30-40min, then dropwise adding boric acid while stirring, and uniformly mixing to obtain an electrodeposition solution;
(2) taking a nickel plate as an anode, taking a TC4 titanium alloy plate as a cathode, adopting a single pulse current mode, and adopting a current density of 1-1.5A/dm 2 Carrying out electrodeposition treatment for 2-3h, and then taking out the deposited TC4 titanium alloy;
(3) and crushing and grinding the deposited TC4 titanium alloy to obtain TC4 titanium alloy powder with the surface deposited.
6. The alloy formulation for wave soldering according to claim 5, wherein the mixing mass ratio of the cobalt sulfamate to the boric acid to the deionized water is 12-15:1-2: 30-40.
7. The alloy formulation for wave soldering according to claim 4, wherein: the mixing mass ratio of the surface deposition TC4 titanium alloy powder to the titanium diboride powder is 1: 3-5.
8. The alloy formulation for wave soldering according to claim 4, wherein: the inert atmosphere is nitrogen.
9. The alloy formulation for wave soldering according to claim 4, wherein the heating temperature in the tube furnace is 500-600 ℃.
10. A method of making an alloy formulation for wave soldering according to any one of claims 1 to 9, comprising the steps of:
(1) weighing tin ingots according to the weight percentage, then adding the tin ingots into a smelting furnace, and melting under the protection of nitrogen to obtain tin liquid;
(2) adjusting the temperature of the smelting furnace to 470-480 ℃, preserving heat for 20-30min, then adding Zn, Cu, Ni, Cr and Mn, stirring uniformly, and continuing preserving heat for 40-50min to obtain intermediate liquid;
(3) adding the coated titanium diboride into the intermediate liquid, heating to 600-620 ℃, stirring, and keeping the temperature for 10-15 min;
(4) after the smelting is uniform, slagging off is carried out, the molten alloy is cast into solder strips, and the solder strips are naturally cooled to room temperature.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN101214586A (en) * | 2008-01-04 | 2008-07-09 | 东南大学 | Tin-zinc base lead-free solder and preparation thereof |
| US20100200271A1 (en) * | 2009-02-12 | 2010-08-12 | International Business Machines Corporation | ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER |
| RU2446930C1 (en) * | 2010-12-15 | 2012-04-10 | Государственное образовательное учреждение высшего профессионального образования Волгоградский государственный технический университет (ВолгГТУ) | Flux-cored wire |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN101214586A (en) * | 2008-01-04 | 2008-07-09 | 东南大学 | Tin-zinc base lead-free solder and preparation thereof |
| US20100200271A1 (en) * | 2009-02-12 | 2010-08-12 | International Business Machines Corporation | ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER |
| RU2446930C1 (en) * | 2010-12-15 | 2012-04-10 | Государственное образовательное учреждение высшего профессионального образования Волгоградский государственный технический университет (ВолгГТУ) | Flux-cored wire |
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