CN115055334A

CN115055334A - Intelligent glue spraying device applied to nixie tube and control method thereof

Info

Publication number: CN115055334A
Application number: CN202210618527.5A
Authority: CN
Inventors: 诸鑫炎; 袁英
Original assignee: Shaoxing Oubaisi Optoelectronic Technology Co ltd
Current assignee: Shaoxing Oubaisi Optoelectronic Technology Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-09-16

Abstract

The application relates to an intelligent glue spraying device applied to a nixie tube and a control method thereof, wherein the intelligent glue spraying device comprises a machine body; the glue storage tank is connected to the machine body and used for storing the prefabricated fluorescent glue; the injection valve is communicated with the glue storage tank and is used for injecting the fluorescent glue on the LED wafer; the positioning assembly is connected with the machine body and is used for controlling the injection valve and/or the LED chip to enable the injection valve and/or the LED chip to be opposite; and the control module is connected with the positioning assembly and the injection valve and used for controlling the operation of the positioning assembly and the injection valve. The method and the device have the effects of simplifying the machining process and reducing the workload.

Description

Intelligent glue spraying device applied to nixie tube and control method thereof

Technical Field

The application relates to the field of nixie tube processing, in particular to an intelligent glue spraying device applied to a nixie tube and a control method thereof.

Background

The LED nixie tube is an 8-shaped display device formed by packaging a plurality of light-emitting diodes together. The LED nixie tube has a plurality of light emitting colors, and there is no LED chip capable of directly emitting white light in mass production.

Therefore, manufacturers generally use fluorescent powder when manufacturing the white LED nixie tube, for example, the LED chip emits blue light, a yellow fluorescent sheet can be mounted on the LED chip, the blue light emitted by the LED chip excites the fluorescent powder in the fluorescent sheet to convert into yellow light, and the blue light and the yellow light are combined to form visual white light, so that the white LED nixie tube is developed.

Aiming at the related technologies, the inventor thinks that the fluorescent sheet installation needs a chip bracket and an SMT processing technology, and has the defects of complex procedures and large workload.

Disclosure of Invention

First aspect, in order to simplify manufacturing procedure, reduces work load, the application provides an intelligence of being applied to charactron spouts mucilage binding and puts.

The application provides a pair of be applied to intelligence of charactron and spout mucilage binding and put adopts following technical scheme:

the utility model provides a be applied to intelligence of charactron and spout mucilage binding and put, includes:

a body;

the glue storage tank is connected to the machine body and used for storing the prefabricated fluorescent glue;

the injection valve is communicated with the glue storage tank and is used for injecting the fluorescent glue on the LED wafer;

the positioning assembly is connected with the machine body and is used for controlling the injection valve and/or the LED chip to enable the injection valve and/or the LED chip to be opposite; and

and the control module is connected with the positioning assembly and the injection valve and used for controlling the positioning assembly and the injection valve to operate.

Through adopting above-mentioned technical scheme, the position of LED wafer or the PCB that contains the LED wafer can be fixed to the locating component, control module control injection valve is relative with the LED wafer, the fluorescence glue that the injection valve will store up in the glue jar is assembled into the liquid drop and is beaten on the LED wafer again, wait to form the fluorescent layer promptly after the fluorescence glue solidification, with this color development that changes the LED wafer, compare in original fluorescence piece installation, the use and the SMT processing technology of chip support have been reduced, machining process has been simplified, the work load is reduced, manufacturing cost has been reduced.

Preferably, the fluorescent glue comprises fluorescent powder, epoxy resin and a thickening agent.

By adopting the technical scheme, the external sealing glue of the packaging type digital tube is epoxy resin, the epoxy resin and silica gel are generally adopted as the glue, and the silica gel has high viscosity and high stability, but cannot be compatible with the epoxy resin, so that potential reliability hazards such as delamination and the like can be caused; the epoxy resin is used as the fluorescent glue, so that the problems of strong fluidity, incapability of planar forming, fluorescent powder sedimentation and the like exist; therefore, the thickening agent is added into the epoxy resin, so that the fluidity is reduced, the fluorescent glue is convenient to form on a plane, and the sedimentation phenomenon of the fluorescent powder is reduced, so that the fluorescent glue can tightly wrap the chip and cannot be delaminated from other epoxy resins.

Preferably, the control module comprises a size acquisition submodule and an adjustment submodule, the size acquisition submodule is used for acquiring the wafer size of the LED wafer, and the adjustment submodule is connected with the size acquisition submodule and the injection valve and is used for controlling the single use amount and the injection pressure of the injection valve according to the wafer size.

Through adopting above-mentioned technical scheme, the LED wafer has multiple size, and the single quantity of the required fluorescence of different sizes is different, can lead to the color development to be more inclined to the primary color when fluorescence is not enough, and it is not obvious to change the colour promptly, and fluorescence is too much then can lead to changing the colour excessively, and the colour produces the deviation, also can cut down the luminance of LED wafer simultaneously.

Preferably, the control module comprises a light source collecting submodule and a color mixing analysis submodule, the light source collecting submodule is used for collecting the RGB value of the light emitted by the LED wafer, and the color mixing analysis submodule is used for controlling the single use amount of the injection valve according to the RGB value of the LED wafer.

By adopting the technical scheme, the color development of different LED wafers can be different or have larger color difference, so that the luminous RGB value of the LED wafer is collected by the light source collection submodule, the single dosage of the sprayed fluorescent glue is changed in a contrasting or calculating mode, the final color development is changed by adjusting the amount of the fluorescent powder, and the display quality is improved.

Preferably, the control module further comprises an image analysis submodule, the image analysis submodule is connected with an image acquisition submodule and a glue removing assembly, the image acquisition submodule is used for acquiring an installation image of the LED wafer covered with the fluorescent glue, and the image analysis submodule is used for acquiring and determining whether the fluorescent glue accurately covers the LED wafer according to the installation image;

if the LED chip is not accurately covered, the output is used for controlling the glue removing component to execute the glue removing operation so as to recover the fluorescent glue;

if the LED chip is accurately covered, the mounting process is completed.

By adopting the technical scheme, the installation image of the LED wafer after the fluorescent glue is sprayed is collected through the image collection submodule, whether abnormal phenomena such as askew spraying and the like occur in the fluorescent glue is analyzed through image identification contrast operation of the image analysis submodule, and if the abnormal phenomena occur, the fluorescent glue is recycled before the fluorescent glue is solidified, so that the defective rate of the LED wafer and a PCB containing the LED wafer is reduced.

Preferably, a viscosity detection assembly is arranged in the glue storage tank and used for detecting the viscosity of the fluorescent glue in the glue storage tank, and the control module comprises a judgment submodule used for acquiring the viscosity of the fluorescent glue and judging whether the viscosity exceeds a preset interval;

if yes, a prompt signal is output.

Through adopting above-mentioned technical scheme, detect the viscosity that stores up the interior fluorescence of gluing jar through viscosity detection subassembly, with this avoid fluorescence to glue the final colour development that viscosity appears changing and influence the LED wafer after using a period, fluorescence glue's viscosity too high probably leads to it because of being difficult to flow and can't cover the LED wafer completely, block up the injection valve even, fluorescence glue's viscosity crosses low then leads to fluorescence glue to appear the phenomenon of sputtering easily, perhaps can't form the fluorescent layer of effective thickness, and can surpass when presetting the interval at fluorescence glue viscosity through judging the submodule piece and indicate the staff to adjust in time.

Preferably, the viscosity detection assembly comprises a turbulence member positioned in the glue storage tank, a rotating shaft coaxially fixed with the turbulence member and a driving member connected to the rotating shaft, the turbulence member is immersed in the fluorescent glue, and the driving member is used for driving the rotating shaft to rotate;

be connected with the tachometer in the pivot, the tachometer is used for detecting the rotational speed rate of change of pivot, control module still includes viscosity calculation submodule piece, viscometer operator module is used for calculating the viscosity that generates the fluorescent glue according to rotational speed rate of change.

By adopting the technical scheme, the turbulence member can be influenced by the resistance of the fluorescent glue when rotating in the fluorescent glue, the resistance is larger when the viscosity of the fluorescent glue is larger, so that the rotating speed of the turbulence member is more quickly attenuated when the turbulence member is driven without external force, and therefore, the viscosity of the fluorescent glue can be calculated by the viscosity calculation submodule through the rotating speed change rate measured by the tachometer, and a worker can be prompted to adjust the viscosity of the fluorescent glue in time when the viscosity of the fluorescent glue exceeds a preset interval; and the vortex piece also can stir fluorescent glue, reduces the fluorescent powder and sinks the end phenomenon on the one hand, and on the other hand can make the fluorescent glue viscosity in each region more even in the glue storage tank, promotes the quality of final fashioned fluorescent layer, promotes the precision that viscosity detected simultaneously.

Preferably, a fixing seat is arranged on the glue storage tank, a circular cavity and an air duct are formed in the fixing seat, the air duct is communicated with the circular cavity, the driving part comprises a vortex fan blade and an air pressure source which are coaxially fixed with the rotating shaft, and the air pressure source is communicated with the air duct.

By adopting the technical scheme, high-pressure gas generated by the air pressure source enters the air channel and passes through the circular cavity to drive the vortex fan blades in the circular cavity to rotate so as to drive the rotating shaft and the turbulence piece to rotate.

Preferably, the control module includes a drive control submodule connected to the driving member for controlling the driving member to drive the rotating shaft to rotate so as to close the driving member after the rotating speed reaches a set value, and at this time, the tachometer collects the rotating speed change rate of the rotating shaft.

By adopting the technical scheme, the driving piece is controlled by the drive control submodule so that the rotating speed of the rotating shaft reaches a set value, then the driving piece is closed, the turbulence piece is in an unpowered driving state, variable interference is reduced, and the precision of viscosity calculation is improved.

In order to simplify the processing procedure and reduce the workload, the present application provides a control method, which adopts the following technical solution:

a control method is realized by applying the intelligent glue spraying device applied to the nixie tube, and comprises the following steps:

collecting the position information of the LED wafer;

adjusting the position of the injection valve according to the position information to enable the injection valve to be opposite to the LED wafer;

collecting the size of an LED wafer and the RGB value of the luminous color of the LED wafer;

adjusting the single usage of the fluorescent glue sprayed by the spray valve according to the size of the LED wafer and the RGB value of the luminescent color of the LED wafer;

and controlling the injection valve to operate, and covering fluorescent glue on the LED wafer to form a fluorescent layer.

By adopting the technical scheme, the injection valve is controlled to be opposite to the LED wafer, the size of the LED wafer and the RGB value of the luminous color of the LED wafer reflect the information of the LED wafer such as the size of a fluorescent layer, the required amount of fluorescent powder and the like, the single use amount of the injection valve is adjusted, then the injection valve is controlled to converge the fluorescent glue in the glue storage tank into liquid drops to be sprayed on the LED wafer, and the fluorescent layer is formed after the fluorescent glue is solidified, so that the color development of the LED wafer is changed, the use of a chip support and an SMT processing technology are reduced, the processing procedure is simplified, the workload is reduced, and the production cost is reduced.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the control module controls the injection valve to be opposite to the LED wafer, then controls the injection valve to converge the fluorescent glue in the glue storage tank into liquid drops to be sprayed on the LED wafer, and forms a fluorescent layer after the fluorescent glue is solidified, so that the color development of the LED wafer is changed;

the LED wafer has various sizes, the single dosage of the fluorescent glue required by different sizes is different, when the fluorescent glue is insufficient, the color development is more biased to the primary color, namely, the color change is not obvious, and when the fluorescent glue is excessive, the color change is excessive, the color deviation is generated, and the brightness of the LED wafer is reduced;

3. detect the viscosity of storing up interior fluorescent glue of gluey jar through viscosity detection subassembly to this avoids fluorescent glue viscosity to appear changing and influence the final colour development of LED wafer after using a period, fluorescent glue's viscosity too high probably leads to it because of being difficult to flow and can't cover the LED wafer completely, block up the injection valve even, fluorescent glue's viscosity crosses low then leads to fluorescent glue to appear the sputtering phenomenon easily, perhaps can't form the fluorescent layer of effective thickness, and can surpass through judging the submodule piece and indicate the staff to carry out timely adjustment when predetermineeing the interval at fluorescent glue viscosity.

Drawings

Fig. 1 is an overall structure diagram of an intelligent glue spraying device applied to a nixie tube according to an embodiment of the application.

Fig. 2 is a partially enlarged schematic view at a in fig. 1.

Fig. 3 is a schematic view of a state where the LED chip is completely covered with the fluorescent paste.

Fig. 4 is a schematic cross-sectional view of the intelligent glue spraying device applied to the nixie tube along the radial direction of the glue storage tank according to the embodiment of the application, mainly showing the driving member.

Fig. 5 is a schematic block diagram of a control module of the intelligent glue spraying device applied to a nixie tube according to an embodiment of the present application.

Description of reference numerals: 1. a body; 11. a glue storage tank; 12. removing the glue component; 13. a positioning assembly; 131. a conveyor belt; 132. a cross sliding table; 2. a fixed seat; 21. a circular lumen; 3. an injection valve; 4. a viscosity detection component; 41. a spoiler; 42. a rotating shaft; 43. a drive member; 431. an eddy fan blade; 432. a source of air pressure; 5. an LED wafer.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses be applied to intelligence of charactron and spout mucilage binding and put. Referring to fig. 1 and 2, the intelligent glue spraying device applied to the nixie tube includes a machine body 1, a control module, a glue storage tank 11 connected to the machine body 1, an injection valve 3 communicated with the glue storage tank 11, and a positioning assembly 13 connected to the machine body 1. Be that prefabricated fluorescent glue has been stored in cylindric glue storage tank 11, control module connects in locating component 13 and injection valve 3, be used for controlling injection valve 3 and LED wafer 5 two relative, it sprays fluorescent glue on LED wafer 5 in order to cover LED wafer 5 to control injection valve 3 again, see figure 3 for details, fluorescent glue is located the superiorly, wait that fluorescent glue solidifies and form the fluorescent layer, the primary color light that middle LED wafer 5 sent excites the fluorescent powder in the fluorescent layer to change into the color of changing, primary color light and the compound required visual light that forms of color of changing, thereby make the LED charactron show required colour. As the injection valve 3, a PZT-JET5020C piezoelectric type can be used.

Referring to fig. 1 and 2, the positioning assembly 13 includes a cross slide 132 and a transmission belt 131, and the transmission belt 131 is located below the injection valve 3 and is used to cooperate with a special fixture to drive the LED chip 5 or the PCB including the LED chip 5 to move to a designated mounting position. The injection valve 3 is installed on the cross sliding table 132, and a worker can move the injection valve 3 to the installation station by controlling the cross sliding table 132, and make the nozzle of the injection valve 3 vertically opposite to the LED chip 5.

The fluorescent glue comprises fluorescent powder, epoxy resin and a thickening agent, wherein the fluorescent powder adopts photoinduced energy storage fluorescent powder, such as calcium halophosphate fluorescent powder. The outer sealing glue of the packaging type digital tube is epoxy resin, the glue is generally epoxy resin and silica gel, the silica gel has high viscosity and high stability, but the silica gel is incompatible with the outer sealing glue of the epoxy resin, and potential reliability hazards such as delamination and the like can occur. Therefore, the thickening agent is added into the epoxy resin, the thickening agent can be silicon dioxide, and the silicon dioxide is added into the epoxy resin according to a set proportion and is uniformly stirred together with the fluorescent powder to form the fluorescent glue. Fluorescent glue can realize rapid hardening in cooperation with the commonly used curing agent introduced into the injection valve 3, and the processing efficiency is improved.

The set proportion of the silicon dioxide and the epoxy resin is considered by the practical conditions that the fluorescent powder does not settle, the spraying pressure of the spraying valve 3 can be adapted to, the flowing state on the LED wafer 5 and the like, so that the fluorescent glue can completely cover the LED wafer 5, the color development finally presented by the LED wafer 5 is more uniform, the blocking phenomenon of the spraying valve 3 is reduced, and the delamination phenomenon with other epoxy resins cannot occur.

Referring to fig. 2 and 4, the fluorescent glue may not completely cover the LED chip 5 due to difficulty in flowing, or even block the injection valve 3 due to too high viscosity, and the fluorescent glue may easily sputter due to too low viscosity, or may not form a fluorescent layer with an effective thickness. Based on this, set up viscosity detection subassembly 4 in storing up gluey jar 11, viscosity detection subassembly 4 is used for detecting the viscosity of storing up fluorescent glue in gluey jar 11, specifically includes spoiler 41, pivot 42 and driving piece 43. The spoiler 41 is located in the glue storage tank 11 and at the bottom, can adopt a propeller structure, and is wholly immersed in the fluorescent glue. Store up gluey jar 11 top and pass through the bolt fastening and have circular shape fixing base 2, pivot 42 one end and vortex piece 41 coaxial fixed, its other end penetrate in fixing base 2 and be connected with driving piece 43.

The fixing seat 2 is provided with a circular cavity 21 and two air ducts, the two air ducts are used for air inlet and air outlet respectively, and the two air ducts are communicated with the circular cavity 21 in a tangent mode and are located on two sides of the circular cavity 21 respectively. The driving member 43 includes a vortex fan 431 and an air pressure source 432 coaxially fixed with the rotating shaft 42, the fixing base 2 is provided with the air pressure source 432 through a bolt, the air pressure source 432 is communicated with an air duct for air intake, and the air pressure source 432 can be an air pump.

Referring to fig. 4 and 5, a tachometer (not shown) is connected to the rotating shaft 42, and the tachometer may be an encoder, and is used for detecting a speed change rate of the rotating shaft 42. The control module comprises a viscosity calculation submodule, a drive control submodule and a judgment submodule, and the drive control submodule is connected with the air pressure source 432. Specifically, when the high-pressure gas generated by the gas pressure source 432 enters the air duct and passes through the circular cavity 21, the vortex blades 431 are driven to rotate, so as to drive the rotating shaft 42 and the spoiler 41 to rotate. The driving control submodule is used for controlling the air pressure source 432 to be started and closed, the air pressure source 432 is closed after the rotating speed of the rotating shaft 42 reaches a set value, and at the moment, the tachometer acquires the rotating speed change rate, namely the attenuation rate, of the rotating shaft 42 under the condition of no power support.

The viscosity of the fluorescence glue is generated by the viscometer operator module according to the rotation speed change rate, the spoiler 41 is influenced by the resistance of the fluorescence glue when the fluorescence glue rotates, the larger the viscosity of the fluorescence glue is, the larger the resistance is, so that the rotation speed of the spoiler 41 is more quickly attenuated when no external force is applied to drive, the viscosity of the fluorescence glue can be reflected according to the rotation speed change rate, the specific viscosity can be obtained through comparison of test data, and the viscosity can also be obtained through calculation of existing formulas such as Poiseul formula.

Then the judgment submodule acquires the viscosity of the fluorescent glue and judges whether the viscosity exceeds a preset interval, wherein the preset interval comprises a preset upper limit value and a preset lower limit value;

if not, indicating that the viscosity of the fluorescent glue is normal;

if yes, prompting signals such as acousto-optic signals are output to prompt a worker to adjust in time, and the situation that the final color development of the LED chip 5 (shown in figure 2) is influenced due to the fact that the viscosity of the fluorescent glue changes after the fluorescent glue is used for a period of time is avoided.

The LED chip 5 (see fig. 2) has a plurality of sizes, and the single usage of the fluorescent glue required by different sizes is different, and insufficient fluorescent glue can result in insignificant color change, color difference in different areas or no fluorescent glue covering on part of the areas, and excessive fluorescent glue can result in excessive color change and low brightness. Based on this, control module still includes size collection submodule piece and regulation submodule piece, and the size collection submodule piece is used for gathering the wafer size of LED wafer 5 (see fig. 2), and the size collection submodule piece can adopt external input equipment such as keyboard, supplies the staff to input the wafer size, also can adopt the CCD camera, through the wafer image of shooing the gained, through image recognition technology extraction wafer size, also can adopt laser radar, through the extraction wafer size of the some clouds of gathering.

Referring to fig. 2 and 5, the adjusting submodule is connected to the size collecting submodule and the injection valve 3, and is used for acquiring and controlling the single dose and the injection pressure of the injection valve 3 according to the wafer size. The adjusting sub-module adopts a program module and is provided with a preset reference sample library which can be taken, and the reference sample library is statistically provided with corresponding relations between sizes of wafers with different sizes and single dosage and jet pressure. The regulating submodule can directly retrieve the data of the single dose and the injection pressure of the corresponding injection valve 3 according to the wafer size. The larger the wafer size, the larger the single dose of phosphor paste and the corresponding spray pressure.

The control module also comprises a light source acquisition submodule and a color matching analysis submodule, and the light source acquisition submodule can adopt a CCD camera and the like. The staff supplies power to the LED wafer 5 first, and then shoots the picture of LED wafer 5 through the CCD camera, draws the RGB value of the pixel that corresponds LED wafer 5 according to image recognition technology, and here RGB value can take the RGB value average value of a plurality of pixels. The color mixing analysis submodule controls the single dosage of the injection valve 3 according to the RGB value of the LED wafer 5.

The color mixing analysis submodule can simulate the visual light finally presented after the primary color light of the LED wafer 5 and the color changing light of the fluorescent glue are compounded, the RGB value of the primary color light and the RGB value of the visual light are known, only the proportion of the color changing light needs to be adjusted, the more the single dosage of the fluorescent glue, the thicker the fluorescent layer, the higher the proportion of the color changing light is, and then the color value calculation formula according to color mixing is adopted: a- (A-B) (1-Q%) = C, A is the RGB value of the primary color light, B is the RGB value of the color-changed light, C is the RGB value of the visual light, wherein the R value, the G value and the B value are all independently calculated through the formula, the RGB value of the color-changed light can be calculated, the required single use amount can be obtained according to the RGB value of the color-changed light, and the corresponding relation between the RGB value of the color-changed light and the single use amount of the fluorescent glue can be obtained through test data.

After the fluorescent glue is sprayed, whether the fluorescent glue accurately covers the LED or not needs to be checked, so that the defective rate is reduced. Based on this, control module still includes the image analysis submodule piece, and the image analysis submodule piece is connected with image acquisition submodule piece and removes gluey subassembly 12. The image acquisition submodule can adopt a CCD camera and is used for acquiring an installation image of the LED wafer 5 covered with the fluorescent glue, the image analysis submodule is used for identifying a pixel point corresponding to the fluorescent glue by combining the installation image and the image of the LED wafer 5 before the fluorescent glue is not sprayed, and then whether the fluorescent glue accurately covers the LED wafer 5 is determined according to the covering position of the fluorescent glue on the LED wafer 5.

If the LED wafer 5 is accurately covered, namely the fluorescent glue completely covers the pixel points corresponding to the LED wafer 5, and the shape is consistent with the preset shape, the normal installation of the fluorescent glue is represented, and then the installation procedure is completed.

If the LED wafer 5 is not accurately covered, namely the fluorescent glue does not completely shield the pixel points corresponding to the LED wafer 5, the LED wafer 5 has the pixel points to overflow, or the LED wafer 5 is not positioned at the central position of the area where the fluorescent glue is positioned, or the shape of the fluorescent glue is inconsistent with the preset shape, the fluorescent glue is abnormally installed, and then the output is used for controlling the glue removing component 12 to execute the glue removing operation so as to recover the fluorescent glue.

Specifically, the predetermined shape is generally circular, and it is necessary to ensure that there is no separated fluorescent glue sputtered on the PCB board including the LED chip 5.

The adhesive removing assembly 12 comprises a negative pressure pipe and a negative pressure source, wherein the negative pressure source can adopt a vacuum pump, the negative pressure pipe is communicated with the negative pressure source and is arranged on one side of the injection valve 3, and one end of the negative pressure pipe is opposite to the LED wafer 5. Considering the high influence of the adsorption force and the extra devices on the PCB, the negative pressure tube can be driven to be close to the LED wafer 5 through a cylinder and the like (not shown in the figure), then the inaccurate fluorescent glue is adsorbed and covered, and after the adsorption is finished, whether the residual fluorescent glue exists can be checked through the image acquisition submodule and the image analysis submodule, so that the defective rate is reduced.

The embodiment of the present application further provides a control method, which is implemented by applying the above intelligent glue spraying device, with reference to fig. 2 and 5, specifically including:

s100: the positional information of the LED chip 5 is collected.

S200: the position of the injection valve 3 is adjusted based on the position information so that the injection valve 3 is opposed to the LED chip 5.

Specifically, the position information may be obtained by laser radar scanning extraction or image recognition, and the position adjustment of the injection valve 3 may be realized by the positioning assembly 13, that is, the cooperation of the transmission belt 131 and the cross slide 132.

S300: the size of the LED chip 5 and the RGB values of its luminescent color are collected.

Specifically, the size collection of the LED chip 5 may be obtained by laser radar or image recognition, and the collection of the RGB values may be obtained by image shooting and pixel color extraction calculation.

S400: the single dosage of the fluorescent glue sprayed by the spray valve 3 is adjusted according to the size of the LED chip 5 and the RGB value of the luminous color thereof.

Specifically, the larger the size of the LED chip 5 is, the larger the single usage amount of the required fluorescent glue is, and the RGB value of the luminescent color thereof may also determine the single usage amount of the required fluorescent glue, which may be obtained according to the comparison data obtained by the experiment.

S500: collecting the viscosity in the glue storage tank 11, and judging whether the viscosity exceeds a preset interval;

if yes, outputting a prompt signal;

if not, the next procedure is normally executed.

Specifically, the viscosity can be acquired through the viscosity detection assembly 4, and the preset interval is set in advance by a worker.

S600: and controlling the injection valve 3 to operate, and injecting fluorescent glue to cover the LED wafer 5 to form a fluorescent layer.

S700: checking whether the fluorescent glue accurately covers the LED wafer 5;

if yes, the installation procedure is completed;

if not, executing glue removing operation.

Specifically, the spraying coverage area of the fluorescent glue can be determined through a front-back image contrast identification mode, whether the coverage area is overlapped with the LED wafer 5, whether the LED wafer 5 is centered, whether the shape of the coverage area is consistent with a preset shape and the like are judged, whether the installation is successful is judged, if the installation is unsuccessful, glue removing operation is needed, namely, the fluorescent glue which is not solidified is sucked through a negative pressure tube and a negative pressure source, and therefore the defective rate is reduced.

The implementation principle of the intelligent glue spraying device applied to the nixie tube in the embodiment of the application is as follows: the LED chip 5 and the injection valve 3 are positioned by the conveyor belt 131 and the cross slide 132, and then the size of the LED chip 5 and the RGB values of the light emission color of the LED chip 5 are collected, thereby dispensing the single dose of the fluorescent glue.

Then, the viscosity of the fluorescent glue in the glue storage tank 11 is obtained through the viscosity detection component 4, so that the phenomenon that the viscosity is too high or too low is avoided. Then, the injection valve 3 is controlled to inject the fluorescent glue so that the LED chip 5 is covered with the fluorescent glue to form a fluorescent layer. And finally, checking whether the fluorescent glue accurately covers the LED wafer 5 through the image acquisition submodule and the image analysis submodule. Compared with the installation of the original fluorescent plate, the use of the chip bracket and the SMT processing technology are reduced, the processing procedure is simplified, and the workload is reduced.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a be applied to intelligence of charactron and spout mucilage binding and put which characterized in that: comprises a machine body (1);

the glue storage tank (11) is connected to the machine body (1) and used for storing the prefabricated fluorescent glue;

the injection valve (3) is communicated with the glue storage tank (11) and is used for injecting the fluorescent glue onto the LED wafer (5);

a positioning assembly (13) connected to the body (1) for controlling the injection valve (3) and/or the LED chip (5) to be opposite; and

and the control module is connected with the positioning assembly (13) and the injection valve (3) and is used for controlling the operation of the positioning assembly (13) and the injection valve (3).

2. The intelligent glue spraying device applied to nixie tubes as claimed in claim 1, wherein: the fluorescent glue comprises fluorescent powder, epoxy resin and a thickening agent.

3. The intelligent glue spraying device applied to nixie tubes as claimed in claim 1, wherein: the control module comprises a size acquisition submodule and an adjustment submodule, the size acquisition submodule is used for acquiring the wafer size of the LED wafer (5), and the adjustment submodule is connected with the size acquisition submodule and the injection valve (3) and is used for controlling the single dosage and the injection pressure of the injection valve (3) according to the wafer size.

4. The intelligent glue spraying device applied to nixie tubes as claimed in claim 1, wherein: the control module comprises a light source collecting submodule and a color mixing analysis submodule, the light source collecting submodule is used for collecting the RGB value of the light emitted by the LED wafer (5), and the color mixing analysis submodule is used for controlling the single use amount of the injection valve (3) according to the RGB value of the LED wafer (5).

5. The intelligent glue spraying device applied to nixie tubes as claimed in claim 1, wherein: the control module further comprises an image analysis submodule, the image analysis submodule is connected with an image acquisition submodule and a glue removing assembly (12), the image acquisition submodule is used for acquiring an installation image of the LED wafer (5) covered by the fluorescent glue, and the image analysis submodule is used for acquiring and determining whether the fluorescent glue accurately covers the LED wafer (5) according to the installation image;

if the LED chip (5) is not accurately covered, the output is used for controlling the glue removing component (12) to execute glue removing operation so as to recover the fluorescent glue;

if the LED chip (5) is covered accurately, the mounting process is completed.

6. The intelligent glue spraying device applied to nixie tubes as claimed in claim 1, wherein: the control module comprises a control module and a glue storage tank (11), wherein a viscosity detection assembly (4) is arranged in the glue storage tank (11), the viscosity detection assembly (4) is used for detecting the viscosity of fluorescent glue in the glue storage tank (11), the control module comprises a judgment submodule, and the judgment submodule is used for obtaining the viscosity of the fluorescent glue and judging whether the viscosity exceeds a preset interval or not;

if yes, a prompt signal is output.

7. The intelligent glue spraying device applied to nixie tubes as claimed in claim 6, wherein: the viscosity detection assembly (4) comprises a turbulence piece (41) positioned in the glue storage tank (11), a rotating shaft (42) coaxially fixed with the turbulence piece (41) and a driving piece (43) connected to the rotating shaft (42), the turbulence piece (41) is immersed in the fluorescent glue, and the driving piece (43) is used for driving the rotating shaft (42) to rotate;

be connected with the tachometer on pivot (42), the tachometer is used for detecting the rotational speed rate of change of pivot (42), control module still includes viscosity calculation submodule piece, viscometer operator module is used for calculating the viscosity that generates the fluorescence glue according to rotational speed rate of change.

8. The intelligent glue spraying device applied to nixie tubes as claimed in claim 7, wherein: store up and be provided with fixing base (2) on gluey jar (11), circular chamber (21) and wind channel have been seted up on fixing base (2), the wind channel communicates in circular chamber (21), driving piece (43) include with pivot (42) coaxial fixed vortex flabellum (431) and atmospheric pressure source (432), atmospheric pressure source (432) and wind channel intercommunication.

9. The intelligent glue spraying device applied to nixie tubes as claimed in claim 7, wherein: the control module comprises a drive control submodule which is connected to the driving part (43) and used for controlling the driving part (43) to drive the rotating shaft (42) to rotate so as to enable the rotating speed to reach a set value and then close the driving part (43), and at the moment, the tachometer acquires the rotating speed change rate of the rotating shaft (42).

10. A control method implemented by the intelligent glue spraying device applied to the nixie tube according to any one of claims 1 to 9, comprising the following steps:

collecting the position information of the LED wafer (5);

adjusting the position of the injection valve (3) according to the position information to enable the injection valve (3) to be opposite to the LED chip (5);

collecting the size of the LED wafer (5) and the RGB value of the luminous color thereof;

adjusting the single usage of the injection valve (3) for injecting the fluorescent glue according to the size of the LED chip (5) and the RGB value of the luminous color of the LED chip;

and controlling the injection valve (3) to operate, and covering fluorescent glue on the LED chip (5) to form a fluorescent layer.