CN115053139A - Test socket for detecting tested device - Google Patents

Test socket for detecting tested device Download PDF

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Publication number
CN115053139A
CN115053139A CN202180013460.6A CN202180013460A CN115053139A CN 115053139 A CN115053139 A CN 115053139A CN 202180013460 A CN202180013460 A CN 202180013460A CN 115053139 A CN115053139 A CN 115053139A
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CN
China
Prior art keywords
hole
insulating member
test socket
probe
vertical direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180013460.6A
Other languages
Chinese (zh)
Inventor
郑永倍
徐廷允
赵炫哲
姜文一
全瑱雅
高柱焕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
ISC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020200178539A external-priority patent/KR102455150B1/en
Application filed by ISC Co Ltd filed Critical ISC Co Ltd
Publication of CN115053139A publication Critical patent/CN115053139A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A test socket is provided for electrically connecting a test device to a device under test. The test socket includes: a housing, a probe, and an insulating member. A through hole is formed in the housing in a vertical direction. The probe is disposed in the through hole in a vertical direction. The probe is configured to be contractible and extensible in the vertical direction, and performs signal transmission in the vertical direction. The insulating member is disposed between an inner surface of the through-hole and an outer surface of the probe, and is configured to locate the probe in the through-hole. The insulating member includes a plurality of micro-pores.

Description

Test socket for detecting tested device
Technical Field
The present disclosure relates to a test socket for electrically connecting a test device with a device under test and for use in electrical testing of the device under test.
Background
In order to detect the operating characteristics of a device under test (device under test), a test socket which is provided between a detection apparatus and the device under test and electrically connects the detection apparatus and the device under test is used in the art. As such a test socket, a test socket having a probe (probe) that is contractible by a pressing force applied by a device under test is known.
The operating characteristics of a semiconductor device used in a mobile communication device in a high frequency band should be detected. In a test socket for high frequency band testing, in order to reduce signal loss, probes are positioned in a coaxial arrangement in holes formed in the test socket housing. As an example, korean patent laid-open publication No. 10-1534778 proposes a test socket in which probes are coaxially arranged.
In order to correspond to the fine pitch (fine pitch) of the terminals of the device under test, it is important that the holes of the housing are formed at the fine pitch. When the holes of the housing are formed at a fine pitch, it is necessary to reduce the size of the coaxially disposed dielectric body of the probe. However, improvements of the dielectric body to have a reduced size and a low dielectric constant have not been studied in the art.
Disclosure of Invention
Technical problem
In order to achieve a coaxial arrangement of the probe relative to the bore in the housing, a dielectric body for the coaxial arrangement of the probe is arranged between the bore in the housing and the probe. In order to reduce signal loss, it is preferable to keep the dielectric body coaxially disposed to have a low dielectric constant. However, since the existing test sockets focus only on realizing the coaxial arrangement by using a dielectric body having a high dielectric constant, the signal loss rate cannot be minimized. In addition, the dielectric body in the conventional test socket has a limitation in accordance with the tendency of fine pitch.
An embodiment of the present disclosure provides a test socket that can be effectively applied to high frequency detection and minimize signal loss. One embodiment of the present disclosure provides a test socket in which a coaxially disposed dielectric holding probes has a reduced dielectric constant.
Means for solving the problems
An embodiment of the present disclosure relates to a test socket disposed between a detection device and a device under test to electrically connect the detection device and the device under test. A test socket according to one embodiment includes a housing, a probe, and an insulating member. A through hole is formed in the housing in a vertical direction. The probe is disposed in the through hole of the housing in a vertical direction. The probe is configured to contract and extend in a vertical direction and perform signal transmission in the vertical direction. The insulating member is disposed between an inner surface of the through-hole and an outer surface of the probe, and is configured to locate the probe in the through-hole. The insulating member includes a plurality of micro-pores.
In one embodiment, the plurality of micropores are pores. The insulating member is made of a resin including the plurality of micro pores, and the pores are formed by a chemical reaction of the resin in a liquid state and a foaming agent.
In one embodiment, the plurality of micropores are hollow particles. The hollow particles may include a film made of any one of glass, silica, zirconia, ceramic, polymethyl methacrylate, polyethylene rubber, and acrylic resin. The hollow particles may include air contained within a membrane.
In an embodiment, the insulating part may include a plurality of micro pores of 1 vol% to 50 vol%.
In an embodiment, the insulating member includes the plurality of micro pores, and may be made of any one of resin, glass, silica, zirconia, and ceramic. The resin may be any one of rubber, polymethylmethacrylate, polyethylene, phenol, epoxy, and novolac.
In an embodiment, the insulating member is configured to position the probe coaxially with the through hole in a vertical direction.
In one embodiment, the insulating member includes: an upper insulating member having an upper fitting hole coaxially penetrating a central axis of the through hole and fitted to the through hole; and a lower insulating member having a lower fitting hole coaxially penetrating a central axis of the through hole and fitted to the through hole. The probe may be fitted to the upper side fitting hole and the lower side fitting hole so as to be positioned coaxially with the through hole.
In one embodiment, a probe includes: an upper plunger which is in contact with the device to be tested and moves through the upper fitting hole; a lower plunger contacting the detecting means and moving through the lower fitting hole; a sleeve supporting the upper plunger and the lower plunger such that the upper plunger and the lower plunger are movable in a vertical direction and fitted to the upper fitting hole and the lower fitting hole; and an elastic member disposed between the upper plunger and the lower plunger in the sleeve. The elastic member is made of a plurality of conductive particles that are conductively contactable in a vertical direction and an elastic substance that holds the plurality of conductive particles in the vertical direction.
Effects of the invention
According to an embodiment of the present invention, the insulating member positions the probe coaxially with a central axis of the through hole in the through hole of the housing, and the insulating member is made of an insulating material including a plurality of micro-pores. The insulating member including the micro-pores has a lower dielectric constant than an insulating member having the same size and made of only an insulating resin material. Therefore, the test socket according to an embodiment can reduce signal loss, can realize impedance matching, and can be effectively used for high-frequency detection of a device under test.
In addition, since the insulating member has microporosities and a low dielectric constant, the characteristics of the test socket are improved while maintaining the strength and workability of the insulating member without changing the material or size of the insulating member.
In addition, the insulating member having the micro-pores and the low dielectric constant can be formed to have a smaller size than the insulating member made of only the insulating resin material. Thus, the test socket according to an embodiment may achieve fine pitches between probes.
Drawings
Fig. 1 is a cross-sectional view schematically showing an example of applying a test socket according to an embodiment.
FIG. 2 is a cross-sectional view illustrating a portion of a test socket according to one embodiment.
Fig. 3 is a perspective view illustrating a portion of the test socket shown in fig. 2.
Fig. 4 is a cross-sectional view schematically showing a part of a probe according to an embodiment, and shows an example of microporosity.
Fig. 5 is a cross-sectional view schematically showing a part of a probe according to an embodiment, and shows another example of microporosities.
FIG. 6 is a cross-sectional view illustrating a portion of a test socket according to an embodiment and showing another example of a probe.
FIG. 7 is a graph illustrating simulation results for a test socket with respect to insertion loss according to an embodiment.
Fig. 8 is a graph showing simulation results with respect to insertion loss of the test socket according to the comparative example.
FIG. 9 is a graph illustrating simulation results for a test socket with respect to reflection loss according to an embodiment.
Fig. 10 is a graph showing simulation results regarding reflection loss of the test socket according to the comparative example.
Detailed Description
The embodiments of the present invention are shown for the purpose of illustrating the technical idea of the present invention. The scope of rights according to the invention is not limited to the examples presented below or the specific description of these examples.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. All terms used in the present invention are selected for the purpose of more clearly illustrating the present invention, and are not intended to limit the scope of rights according to the present invention.
Expressions such as "comprising", "having", and the like, as used in the present invention, are to be understood as open-ended terms (open-ended terms) including the possibility of other embodiments, unless otherwise stated in a sentence or article including the expression.
The singular expressions described in the present invention may include plural meanings unless otherwise specified, and are equally applicable to the singular expressions described in the claims.
Expressions such as "first", "second", and the like used in the present invention are used to distinguish a plurality of components from each other, and do not limit the order or importance of the respective components.
In the present invention, when it is referred to that a certain constituent is "connected" or "coupled" to another constituent, the particular constituent may be directly connected or coupled to the other component, it being understood that it may be connected or coupled via a new another constituent.
As used herein, the term "upper" is used to indicate the direction in which the test socket is disposed with respect to the test device, and the term "lower" indicates the opposite direction to the upper direction. It should be understood that the directional indicator of "vertical direction" used in the present invention includes an upper direction and a lower direction, but does not indicate a specific one of the upper direction and the lower direction.
Embodiments are described with reference to the examples shown in the drawings. In the drawings, the same or corresponding constituent elements are given the same reference numerals. In addition, in the following description of the embodiments, a repetitive description of the same or corresponding components may be omitted. However, even if the description of the components is omitted, it does not mean that the components are not included in a specific embodiment.
The embodiments described below and the examples shown in the figures relate to a test socket which can be used when testing a device under test. The test socket of the embodiment is arranged between the detection device and the detected equipment and can be used for electric connection and detection of the detection device and the detected equipment. As an example, the socket of the embodiment may be used for final electrical inspection of a semiconductor device in a post-process in a manufacturing process of the semiconductor device, but the socket of the embodiment is not limited to this example.
FIG. 1 illustrates an example of a suitable test socket according to an embodiment. Fig. 1 schematically shows a test socket, components of the test socket, a detection device, and a device under test, and the shape shown in fig. 1 is merely an example chosen for understanding the embodiments.
Referring to fig. 1, a test socket 10 according to an embodiment may be an assembly having a sheet (sheet) shape. In electrically testing the device under test 30, the test socket 10 is disposed between the testing apparatus 20 and the device under test 30. As an example, the test socket 10 may be disposed between the device under test 30 and the detection apparatus 20 for performing high frequency detection of the device under test 30.
The device under test 30 may be a semiconductor device in which a semiconductor IC chip and a plurality of terminals are packaged into a hexahedral shape by using a resin material. As an example, the detected device 30 may be a semiconductor device used in a mobile communication device, but is not limited thereto. The device under test 30 has a plurality of terminals 31 on its underside.
The sensing device 20 can sense various motion characteristics of the device under test 30. The detection device 20 may have a board on which detection is performed, and the board may have therein a detection circuit 21 for detecting the device 30 to be detected. The detection circuit 21 has a plurality of terminals 22 electrically connected to the terminals 31 of the device under test through the test socket 10. The terminals 22 of the detection device 20 may send electrical test signals and receive response signals.
The test socket 10 may be configured to contact the terminals 22 of the detection device 20 through the socket guides 40. In inspecting the device under inspection 30, the test socket 10 electrically connects the terminal 31 of the device under inspection and the terminal 22 of the inspection apparatus corresponding thereto in the vertical direction VD, and inspection of the device under inspection 30 is performed by the inspection apparatus 20 through the test socket 10. The socket guide 40 is detachably mounted to the detecting device 20. The socket guide 40 accommodates therein the device under test 30 transported to the test apparatus 20 manually or by transport equipment, and aligns the device under test 30 with respect to the test socket 10.
Referring to fig. 1, a test socket 10 according to an embodiment includes: a housing 110, at least one probe 120, and at least one insulating member 130. The housing 110 constitutes a main body of the test socket in which the probes 120 are arranged in the vertical direction VD. The housing 110 may be attached to the socket guide 40. The probe 120 is configured to transmit signals in the vertical direction VD. The probe 120 may contact the terminal 31 of the device under test 30 at its upper end and contact the terminal 22 of the test apparatus 20 at its lower end. The probe 120 is configured to be able to contract and elongate in the vertical direction VD. The insulating member 130 positions the probe 120 in the vertical direction VD in the housing 110.
To test the device under test 30, a pressurizing force P is applied to the test socket 10 by mechanical means or manually through the device under test 30. As the terminal 31 of the device under test presses the upper end portion of the probe 120 downward by the pressing force P, the probe 120 contracts so that its length in the vertical direction is reduced. As the pressurizing force P is applied to the test socket 10, the probes 120 are pressed in the vertical direction, and the probes 120 contact the terminals 31 of the device under test and the terminals 22 of the inspection apparatus. When the pressing force P is removed from the test socket 10, the probe 120 is extended to the original length in the vertical direction.
The test socket 10 may be provided with a plurality of probes 120. The plurality of probes 120 may be disposed in the housing 110 in a matrix form and spaced apart in the horizontal direction HD by the housing 110.
Reference is made to fig. 2-6 for an illustration of a test socket according to an embodiment. Fig. 2 to 6 schematically show the shapes of the components of the test socket. The shapes shown in fig. 2 to 6 are merely examples selected for understanding the embodiments. Fig. 2 is a sectional view illustrating a portion of a test socket according to an embodiment of the present application, and fig. 3 is a perspective view illustrating a portion of the test socket illustrated in fig. 2. Fig. 4 and 5 are cross-sectional views schematically illustrating a portion of a probe of a test socket according to an embodiment. FIG. 6 is a cross-sectional view schematically illustrating another example of a probe of a test socket according to an embodiment.
Referring to fig. 2 and 3, a test socket 10 according to an embodiment includes: a housing 110; a probe 120 disposed in the housing 110 and configured to perform signal transmission in a vertical direction VD; and an insulating member 130 for positioning the probe 120 in the housing 110.
The case 110 constitutes a main body of the test socket and may have a hexahedral shape. The housing 110 may be made of a metal material such as aluminum, but the material constituting the housing is not limited thereto. The probe 120 is disposed in the housing 110 and held by the housing 110 in the vertical direction VD. In order to dispose the probe 120 in the housing 110, a through hole 111 is formed in the housing 110 in a vertical direction. The through hole 111 penetrates the housing 110 in the vertical direction VD. That is, the through hole 111 is perforated in the housing in a vertical direction from the lower surface of the housing 110 to the upper surface of the housing 110.
In one embodiment, the housing 110 includes an upper housing 112 and a lower housing 113 joined in a vertical direction VD. An upper through hole 114 is perforated in the upper case 112 in the vertical direction VD, and a lower through hole 115 is perforated in the lower case 113 in the vertical direction VD. When the upper casing 112 and the lower casing 113 are combined, an upper through hole 114 and a lower through hole 115 form a through hole 111 penetrating the casing 110 in the vertical direction VD.
The probe 120 is disposed in the through-hole 111 of the housing in a vertical direction VD. The probe 120 is configured to be able to contract and extend in the vertical direction VD. The probe 120 held by the housing 110 electrically connects the detecting means and the device under test and performs signal transmission therebetween.
The probe 120 includes: an upper plunger (plunger)121 provided on the upper side; a lower plunger 122 provided on the lower side; a sleeve (barrel)123 that supports and holds the upper and lower plungers 121, 122 so as to be movable in the vertical direction VD; an elastic member 124 is provided between the upper plunger 121 and the lower plunger 122 in the sleeve 123. The upper plunger 121 is in contact with the device under test. The lower plunger 122 is in contact with the detection device. The sleeve 123 may be formed in a cylindrical shape, and the upper side plunger 121 and the lower side plunger 122 are partially inserted into a cylindrical space of the sleeve 123. The elastic member 124 is disposed in the inner space of the sleeve 123. The elastic member 124 is located between the upper plunger 121 and the lower plunger 122, and applies an elastic force to the upper plunger 121 and the lower plunger 122 in the vertical direction VD. As an example, the elastic member 124 shown in fig. 2 may be a compression coil spring. The upper and lower plungers 121 and 122 and the sleeve 123 are made of a conductive metal material. The probe 120 is an assembly assembled of upper and lower plungers 121, 122 and a sleeve 123 and an elastic member 124. Such probes 120 are referred to in the art as contact probes or pogo pins.
The upper plunger 121 and the lower plunger 122 are pushed into the sleeve 123 by the elastic force of the elastic member 124 by a pressing force (see a pressure P shown in fig. 1) applied downward by the device under test. Accordingly, the probe 120 can be contracted in the vertical direction. When the pressing force is removed, the upper side plunger 121 and the lower side plunger 122 return to their original positions by the elastic force of the elastic member. Therefore, the probe 120 may be elongated in the vertical direction VD. In this way, the probe 120 can be contracted in the vertical direction due to the above-described pressurizing force applied to the device under test. In addition, when the above pressurizing force is removed, the probe 120 may be elongated to its original state.
The upper side plungers 121 are in contact with terminals (refer to the terminals 31 shown in fig. 1) of the device under test at the upper ends thereof. The lower plunger 122 is in contact at its lower end with a terminal (refer to the terminal 22 shown in fig. 1) of the detection device. The sleeve 123 is in electrically conductive contact with the upper plunger 121 and the lower plunger 122. Therefore, between the terminal 22 of the inspection apparatus corresponding to one probe 120 and the terminal 31 of the inspected device, signal transmission can be performed in the vertical direction with the probe 120 as a medium. Therefore, the test signal of the detection apparatus can be transmitted from the terminal 22 of the detection apparatus to the terminal 31 of the device under test through the probe 120, and the response signal of the device under test can be transmitted from the terminal 31 of the device under test to the terminal 22 of the detection apparatus through the probe 120.
The probes 120 are disposed in the through-holes 111 in the vertical direction VD by the insulating member 130. The insulating member 130 is configured such that the probes 120 are located in the through-holes 111. The insulating member 130 is disposed between the inner surface of the through-hole 111 and the outer surface of the probe 120. The insulating member 130 insulates the probe 120 from the case 110, and is made of an insulating material.
The probe 120 is disposed in the housing 110 so as to be coaxial with the central axis CA of the through hole 111 in the vertical direction VD. The insulating member 130 enables coaxial arrangement of the probe 120. In order to make the central axis CA of the through-hole 111 coincide with the central axis of the probe 120, the insulating member 130 positions the probe 120 in the through-hole 111. The insulating member 130 is configured such that the probe 120 is positioned coaxially with the through-hole 111 in the vertical direction VD. The insulating member 130 is formed in a ring shape. Therefore, the insulating member 130 is disposed between the inner surface of the through-hole 111 and the outer surface of the probe 120, and a portion of the probe 120 penetrates the insulating member 130 in the vertical direction VD.
In one embodiment, the insulating member 130 includes: an upper insulating member 131 and a lower insulating member 132 which can be fitted to the through-hole 111 of the case.
The upper insulating member 131 is provided in the upper casing 112, and is fitted to the upper through-hole 114 in the vicinity of the upper end of the upper through-hole 114. The upper insulating member 131 has an upper fitting hole 133 that penetrates the upper insulating member coaxially with the center axis CA of the through hole 111. The upper portion of the probe 120 is coupled to the upper insulating member 131 in a state where the upper end of the sleeve 123 is fitted into the upper fitting hole 133 in the vertical direction VD, the upper plunger 121 is inserted into the upper fitting hole 133, and the upper end of the upper plunger 121 protrudes upward. When the terminal of the device under test and the probe are brought into contact, the upper plunger 121 can be moved into the sleeve 123 through the upper fitting hole 133. The upper end surface of the upper insulating member 131 may be located at the same height as the upper surface of the upper case 112, and the upper end surface of the upper insulating member 131 may have a height difference in the vertical direction with respect to the upper surface of the upper case 112.
The lower insulating member 132 is provided in the lower case 113, and is fitted to the lower through hole 115 near the lower end of the lower through hole 115. The lower insulating member 132 has a lower fitting hole 134 that penetrates the lower insulating member coaxially with the center axis CA of the through hole 111. The lower end portion of the sleeve 123 is fitted into the lower fitting hole 134 in the vertical direction VD, the lower plunger 122 is inserted into the lower fitting hole 134, and the lower end portion of the lower plunger 122 protrudes downward, and the lower portion of the probe 120 is coupled to the lower insulating member 132. When the terminals of the detection device and the probe are brought into contact, the lower plunger 122 can be moved into the interior of the sleeve 123 through the lower fitting hole 133.
The central axes of the upper and lower fitting holes 133 and 134 are coaxial with the central axis CA of the through hole 111 of the housing 110. The probe 120 is fitted to the upper-side fitting hole 133 and the lower-side fitting hole 134 in the vertical direction VD. The probe 120 is provided in the through-hole 111 in a state of being supported by the upper insulating member 131 and the lower insulating member 132, and is positioned coaxially with the center axis CA of the through-hole 111.
The upper fitting hole 133 is formed such that the upper end portion of the sleeve 123 is fitted to the upper fitting hole and the upper plunger 121 is inserted into the upper fitting hole with a certain clearance from the upper fitting hole. The lower side fitting hole 134 is formed such that the lower end portion of the sleeve 123 is fitted to the lower side fitting hole and the lower side plunger 122 is inserted into the lower side fitting hole with a certain clearance from the lower side fitting hole. The upper insulating member 131 may be fitted to the upper through hole 114 from the bottom up, and the lower insulating member 132 may be fitted to the lower through hole 115 from the top down. The lower end of the upper insulating member 131 has a flange 135, and the upper end of the lower insulating member 132 has a flange 135. The upper through hole 114 and the lower through hole 115 have a stepped portion 116 corresponding to the flange portion 135, and the flange portion 135 can be fitted to the stepped portion 116.
As an example, the test socket 10 may be assembled and manufactured by joining the upper housing 112 and the lower housing 113. The upper insulating member 131 is provided in the upper through hole 114 of the upper housing 112, and the upper end portion of the probe 120 can be inserted into the upper fitting hole 133 of the upper insulating member 131. Therefore, the upper end portion of the probe 120 can be temporarily assembled to the upper housing 112. Next, the lower insulating member 132 may be provided to the lower through hole 115 of the lower case 113. Thereafter, the upper case 112 and the lower case 113 may be coupled in the vertical direction VD in order to insert the lower end portion of the probe 120 into the lower fitting hole 134 of the lower insulating member 132. Accordingly, the probe pin 120 is provided to assemble and manufacture the test socket 10 while being coaxial with the central axis CA of the through-hole 111 of the housing 110.
The insulating member 130 positions the probe 120 in the through-hole 111 coaxially with the center axis of the through-hole, and functions as a dielectric body in signal transmission of the probe 120. According to the test socket of an embodiment, the insulating member 130 is not only made of an insulating material, but also configured to have a low dielectric constant. The insulating material constituting the upper insulating member 131 and the lower insulating member 132 as the insulating members may be any of resin, glass, silica, zirconia, and ceramic. In addition, the resin constituting the insulating member may be any one of rubber, polymethyl methacrylate (polymethyl methacrylate), polyethylene, phenol, epoxy resin, and novolac (novolac), but is not limited thereto.
In the through hole 111 of the housing 110, the upper and lower insulating members 131 and 132 and the probe 120 are disposed coaxially with the central axis CA of the through hole 111. Due to such coaxial arrangement, the loss of the signal passing through the probe 120 can be reduced at the time of high-frequency detection of the device under test. In addition, the housing 110 may eliminate leakage current generated when the signal of the probe 120 is transmitted.
In the signal transmission of the probe 120, the dielectric constants of the upper and lower insulating members have an effect of reducing signal loss. The lower the dielectric constants of the upper insulating member and the lower insulating member are, the more the signal loss can be reduced significantly. Further, the lower the dielectric constants of the upper insulating member and the lower insulating member are, the better the impedance of the probe 120 can be matched with the impedance of the device under test and the impedance of the detection circuit of the detection apparatus. The upper and lower insulating members are machined to have a specific shape and size for positioning the probe 120 in a coaxial arrangement. Therefore, the lower dielectric constant of the upper and lower insulating members while maintaining the workability of the upper and lower insulating members will contribute to reduction of signal loss and impedance matching.
According to an embodiment, the insulating member 130 of the test socket 10 may be made of the above-described insulating material, and have a porous structure to have a low dielectric constant. That is, the upper insulating member 131 and the lower insulating member 132 are made of an insulating material having a porous structure. The upper insulating member 131 and the lower insulating member 132 are formed to have a shape and a size for coaxial arrangement of probes, and include a plurality of micro pores (micropores) in order to reduce a dielectric constant. As such, the upper insulating member 131 and the lower insulating member 132 include a plurality of micro-pores and are made of the insulating material described above. The upper-side insulating part 131 and the lower-side insulating part 132 including the micro-pores have a lower dielectric constant than the insulating part without micro-pores, and can further reduce signal loss in signal transmission of the probe 120. Such micropores may be included in the upper insulating member 131 and the lower insulating member 132 in the form of pores (gas pores) or hollow particles (hollow particles), but the form of the micropores is not limited to the pores or the hollow particles.
Fig. 4 and 5 show examples of microporosities, respectively. The shapes of the microporosities shown in fig. 4 and 5 are merely examples selected for understanding the embodiments.
In the test socket of an embodiment, the insulating member that positions the probe in the through-hole coaxially with the center axis of the through-hole may be made of an insulating material including a plurality of micro-pores. The insulating material may be the above resin, and the plurality of micropores may be pores. Referring to fig. 4, the upper insulating member 131 and the lower insulating member 132 include a plurality of pores 136 as the micro-pores. The air holes 136 are irregularly distributed in the entire insulating resin constituting the upper insulating member 131 and the lower insulating member 132.
The air holes 136 may be formed by a chemical reaction between a liquid resin constituting the insulating member and a foaming agent. A foaming agent may be added to the liquid resin for molding the upper and lower insulation members 131 and 132 when molding the upper and lower insulation members 131 and 132. The upper and lower insulating members 131 and 132 may be molded by injecting the above-described liquid resin into a molding die, and the above-described foaming agent may be added to the liquid resin. The foaming agent chemically reacts with the liquid resin to generate gas during the molding of the upper and lower insulating members. The generated gas is in the liquid resin, pushing the liquid resin away. Therefore, the generated gas partially lacks the liquid resin during the molding of the upper and lower insulating members 131, 132, so that a plurality of air holes 136 having various sizes can be formed throughout the upper and lower insulating members 131, 132. As another example, a resin work (work) including air holes may be prepared, and such a work may be processed into an insulating member.
The plurality of gas holes 136 may be filled with a gas. As an example, the plurality of gas holes 136 may be filled with gas generated in the process of forming the gas holes 136. Alternatively, the air holes 136 may be filled with air or may be vacuum.
In the test socket according to an embodiment, the insulating member may be made of the above-described insulating material while including a plurality of micro-pores, and the plurality of micro-pores may be hollow particles. Referring to fig. 5, the upper insulating member 131 and the lower insulating member 132 include a plurality of hollow particles 137 as the micro-pores. The hollow particles 137 are irregularly distributed in the entire insulating material constituting the upper insulating member 131 and the lower insulating member 132. As an example, the size of the hollow particles 137 may be about 10 μm to about 30 μm, but is not limited thereto. The hollow particles 137 may be added to the liquid insulating material for molding the upper and lower insulating members 131 and 132 when molding the upper and lower insulating members 131 and 132. The upper and lower insulating members 131 and 132 may be molded by injecting the above-described liquid material into a molding die, and the hollow particles 137 may be added to the liquid material. As another example, it is also possible to prepare a workpiece of the above-described insulating material including hollow particles, and to process the workpiece into an insulating member.
The hollow particles 137 may include a gas 138 and a membrane (shell)139 containing the gas. The membrane 139 can have any shape capable of containing the gas 138 therein. As an example, the film 139 may be in the shape of a sphere (sphere), but is not limited thereto. The film 139 may be made of the same substance as or a different substance from the insulating material constituting the upper insulating member 131 and the lower insulating member 132. As an example, the film 139 may be made of any one of glass, silica, zirconia, ceramic, polymethyl methacrylate (pmma), polyethylene rubber, and acrylic resin. The gas 138 contained within the membrane 139 may be air. As an example, when the upper and lower insulating members are made of epoxy resin, the dielectric constant of the epoxy resin may be about 3.6. The dielectric constant of the air contained in the hollow particles may be about 1. Therefore, the upper insulating member and the lower insulating member made of the resin material containing the hollow particles can exhibit a low dielectric constant. The gas 138 contained in the film 139 is not particularly limited. As another example, the inside of the membrane 139 may be a vacuum.
When the volume of the insulating part is taken as 100%, the insulating part may include a plurality of micro pores (pores 136 or hollow particles 137) of 1 vol% to 50 vol%. That is, when the volumes of the upper insulating member and the lower insulating member are taken as 100%, a plurality of micropores (pores 136 or hollow particles 137) are contained in the upper insulating member 131 and the lower insulating member 132 at a ratio of 1 vol% to 50 vol%. The dielectric constant of the insulating member can be adjusted by appropriately selecting the content of the micropores (pores or hollow particles). If the content of the pores or the hollow particles is too small, the effect of reducing the dielectric constant of the insulating member is small. When the content of the pores or the hollow particles exceeds 50 vol%, workability related to molding of the insulating member may be reduced, and durability of the insulating member may be deteriorated.
Fig. 4 shows that the upper and lower insulating members include air holes, and fig. 5 shows that the upper and lower insulating members include hollow particles. As another example, one of the upper insulating member and the lower insulating member may include air holes, and the other of the upper insulating member and the lower insulating member may include hollow particles.
According to the test socket of an embodiment, the upper insulating member 131 and the lower insulating member 132 include a plurality of micro-pores (air holes 136 or hollow particles 137). Therefore, the upper insulating member 131 and the lower insulating member 132 can have a lower dielectric constant and further reduce signal loss in signal transmission of the probe 120, as compared with an insulating member that does not have the above-described microporosities, is made of only an insulating resin material, and has the same outer diameter as that of the upper insulating member and the lower insulating member. In addition, since the impedance of the probe 120 matches the impedance of the device under test and the impedance of the detection circuit, signal loss due to impedance mismatch does not occur, and thus, the test socket according to an embodiment can be effectively used for high frequency inspection of the device under test.
By adding the above foaming agent or the above hollow particles to the material for molding of the upper insulating member and the lower insulating member, microporosities can be formed in the upper insulating member and the lower insulating portion. Therefore, while maintaining the workability of the upper and lower insulating members, the dielectric constants of the upper and lower insulating members can be reduced without changing the materials and dimensions constituting the upper and lower insulating members. In addition, the characteristic value of the test socket of an embodiment can be controlled by adjusting the volume ratio or the size of the pores or the hollow particles included in the upper insulating member and the lower insulating member. In addition, the upper and lower insulating parts having a lower dielectric constant due to the micro-pores may be formed to have a smaller outer diameter size, which may further reduce the spacing distance between the probes 120 (i.e., the pitch between the probes). Accordingly, the test socket of an embodiment may be configured such that the spacing between the probes 120 is further reduced. In addition, instead of the insulating member having no micro-pores as described above, the upper and lower insulating members according to an embodiment may be easily applied to the test socket, and excellent signal transmission capability may be easily imparted to the test socket while maintaining the strength and workability of the insulating member.
A columnar structure that is capable of conducting electricity in the vertical direction and also capable of contracting and expanding in the vertical direction may be used as the elastic member of the probe. Referring to fig. 6, the probe 120 is disposed in a sleeve 123, and has an elastic member 125 applying elastic force to the upper plunger 121 and the lower plunger 122. The elastic member 125 illustrated in fig. 6 has a columnar shape and is provided between the upper plunger 121 and the lower plunger 122. The elastic member 125 is in contact with the lower end of the upper plunger 121 at the upper end thereof and with the upper end of the lower plunger 122 at the lower end thereof. The elastic member 125 is made of a plurality of conductive particles 126 that can be conductively contacted in the vertical direction VD, and an elastic substance 127 that holds the plurality of conductive particles 126 in the vertical direction.
The plurality of conductive particles 126 are made of a metal material capable of conducting electricity. The conductive particles 126 are irregularly distributed in the upper end to the lower end of the elastic member 125. The conductive particles 126 are conductively contacted in the vertical direction VD and are collected in the vertical direction VD (for example, in a columnar shape). The conductive particles 126 that can be conductively contacted in the vertical direction VD serve as electrical conductors that perform signal transmission between the upper side plunger 121 and the lower side plunger 122. The elastic material 127 holds the conductive particles 126 in the vertical direction VD in order to make the conductive particles 126 gather in a columnar shape. The conductive particles 126 may be filled with an elastic substance 127 therebetween. The elastic material 127 is formed integrally with the conductive particles 126 to constitute an elastic member 125. The elastic substance 127 includes silicon rubber.
The elastic member 125 can be contracted in the vertical direction VD by the elastic restoring force of the elastic substance 127, and can also be expanded to the original state before the contraction. For example, when the device under test is detected, the elastic member 125 can be contracted in the vertical direction VD by the pressing force applied via the upper plunger 121. When the above pressurizing force is removed, the elastic member 125 expands to its original state due to the elastic restoring force of the elastic substance 127.
Software for simulating high frequency electromagnetic fields may be used to verify the improved performance of the test socket of an embodiment. Fig. 7 to 10 are graphs showing the results of simulation performed using software for simulating a high-frequency electromagnetic field. The above simulations were performed in the test socket according to an embodiment and the test socket according to the comparative example. In the graphs shown in fig. 7 to 10, the horizontal axis represents the value of frequency in GHz and the vertical axis has units of decibel dB. With regard to the above simulation, the upper insulating member and the lower insulating member of the test socket of an embodiment were made of epoxy resin having a dielectric constant of 3.6, and included the above hollow particles. The upper and lower insulating members of the test socket of the comparative example were made of epoxy resin having a dielectric constant of 3.6, but did not include the above hollow particles or the above air holes at all.
Fig. 7 and 8 show simulation results regarding insertion loss (insertion loss), which is a degree of signal loss at the time of signal transmission. Fig. 7 shows a curve corresponding to the test socket of an embodiment, and fig. 8 shows a curve corresponding to the test socket of a comparative example. In the graphs shown in fig. 7 and 8, a curve close to 0db indicates less signal loss. From comparison of fig. 7 and 8, it can be confirmed that the test socket of an embodiment has a smaller signal loss in a high frequency range of 0GHz to 50GHz than the test socket of a comparative example.
Fig. 9 and 10 show simulation results of return loss (return loss), which is the degree of signal reflection at the time of signal transmission. Fig. 9 shows a curve corresponding to the test socket of an embodiment, and fig. 10 shows a curve corresponding to the test socket of a comparative example. In the graphs shown in fig. 9 and 10, a curve close to 0dB indicates a large signal reflection. From a comparison of fig. 9 and 10, it can be confirmed that the test socket of an embodiment has less signal reflection in the high frequency range of 20GHz to 40GHz as compared with the test socket of a comparative example. Therefore, the test socket of an embodiment in which the upper insulating member and the lower insulating member include a plurality of air holes or a plurality of hollow particles has reduced reflection loss, and in particular, less signal loss occurs in a high frequency range of 20GHz to 40GHz in which high frequency detection is performed.
In addition, it can be confirmed from the graphs of the simulation results shown in fig. 7 to 10 that the upper insulating member and the lower insulating member have dielectric constants lowered by about 10% in the test socket according to an embodiment.
Although the technical idea of the present invention has been described by the above embodiments and examples shown in the drawings, it should be understood that various substitutions, modifications and changes may be made within the scope of the technical idea and scope of the present invention as can be understood by those skilled in the art to which the present invention pertains. Further, such alternatives, modifications, and variations are intended to be included within the scope of the appended claims.

Claims (13)

1. A test socket for electrical connection of a test device to a device under test, comprising:
a housing formed with a through hole in a vertical direction;
a probe disposed in the through hole in the vertical direction, and configured to contract and elongate in the vertical direction and perform signal transmission in the vertical direction; and
an insulating part disposed between an inner surface of the through-hole and an outer surface of the probe, and configured such that the probe is located in the through-hole, and the insulating part includes a plurality of micro-pores.
2. The test socket of claim 1, wherein the plurality of microporosities are air holes.
3. The test socket of claim 2, wherein said insulating member is made of a resin including said plurality of micro-pores, said pores being formed by a chemical reaction of said resin in a liquid state and a foaming agent.
4. The test socket of claim 1, wherein the plurality of micro-pores are hollow particles.
5. The test socket of claim 4, wherein the hollow particles comprise a membrane made of any one of glass, silica, zirconia, ceramic, polymethylmethacrylate, polyethylene rubber, and acrylic resin.
6. The test socket of claim 5, wherein the hollow particles comprise air contained within the membrane.
7. The test socket of claim 1, wherein the insulating member comprises 1 vol% to 50 vol% of the plurality of micro-pores.
8. The test socket of claim 1, wherein the insulating member is made of any one of resin, glass, silica, zirconia, and ceramic while including the plurality of micro-pores.
9. The test socket of claim 8, wherein the resin is any one of rubber, polymethylmethacrylate, polyethylene, phenolic, epoxy, novolac.
10. The test socket of claim 1, wherein the insulating member is configured such that the probe is positioned coaxially with the through-hole in the vertical direction.
11. The test socket of claim 10, wherein said insulating member comprises:
an upper insulating member having an upper fitting hole coaxially penetrating a center axis of the through hole and fitted to the through hole; and
a lower insulating member having a lower fitting hole coaxially penetrating a central axis of the through hole and fitted to the through hole;
wherein the probe is fitted in the upper side fitting hole and the lower side fitting hole and positioned coaxially with the through hole.
12. The test socket of claim 11, wherein said probe comprises:
an upper plunger which contacts the device to be tested and moves through the upper mating hole;
a lower plunger contacting the detecting means and moving through the lower fitting hole;
a sleeve that supports the upper plunger and the lower plunger so that the upper plunger and the lower plunger can move in the vertical direction and fit in the upper fitting hole and the lower fitting hole; and
an elastic member is provided between the upper plunger and the lower plunger in the sleeve.
13. The test socket of claim 12, wherein the elastic member is made of a plurality of conductive particles that are conductively contactable in the vertical direction and an elastic substance that holds the plurality of conductive particles in the vertical direction.
CN202180013460.6A 2020-02-10 2021-02-02 Test socket for detecting tested device Pending CN115053139A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2020-0015516 2020-02-10
KR20200015516 2020-02-10
KR10-2020-0178539 2020-12-18
KR1020200178539A KR102455150B1 (en) 2020-02-10 2020-12-18 Test socket for use in testing device under test
PCT/KR2021/001333 WO2021162314A1 (en) 2020-02-10 2021-02-02 Test socket for testing device under test

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KR20240099579A (en) * 2022-12-22 2024-07-01 리노공업주식회사 Test socket
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JP2004325306A (en) * 2003-04-25 2004-11-18 Yokowo Co Ltd Coaxial probe for inspection, and inspection unit using the same
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JP2010127879A (en) * 2008-12-01 2010-06-10 Mitsubishi Cable Ind Ltd Probe pin and its support structure
KR101038270B1 (en) * 2009-07-24 2011-05-31 (주)케미텍 Anisotropic Conductive Connector And The Manufacturing Method Thereof
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