CN115039520A - 用于在衬底上生成导电图案的方法 - Google Patents
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Abstract
用于在衬底上生成导电图案的方法,其中,该方法包括以下步骤:在衬底上形成预定图案的粘合剂层,将导电固体颗粒添加到粘合剂层上,其中,颗粒粘接到粘合剂上,通过电磁辐射加热固体颗粒,其中,电磁波谱的波长在600‑1400nm的范围内,优选地在700‑1200nm的范围内,使得颗粒的温度超过其特征熔点,以及将加热的颗粒按压在衬底的压区中,颗粒在压区中被压平,使得颗粒彼此电连接并且由此形成导电图案。
Description
技术领域
本发明涉及一种用于在衬底上生成导电图案的方法和一种用于生成RFID标签的方法。
背景技术
现有技术-问题
在衬底上形成导电图案是已知的,其中,固体导电颗粒在衬底上形成预定图案。随后,通常在烘箱中通过热熔加热(thermal heating)对固体颗粒进行加热,在烘箱中,固体颗粒达到其特征熔点以上的温度。随后将颗粒按压入压区(nip)中使得颗粒被压平,其中,颗粒彼此电连接并且由此形成导电图案。
这种方法的一个缺点是在加热过程中不仅固体颗粒会吸收热量,而且衬底也会吸收热量。这可能会造成问题,例如纤维衬底在加热时会变干。这将导致衬底不必要的尺寸变化。此外,如果被加热至太高的温度,纤维会开始变成棕色,甚至燃烧。另外,热熔加热的能耗也比较高。
发明内容
发明目的
本发明的目的是提供一种至少部分地解决上述问题的在衬底上生成导电图案的方法。
本发明是一种用于在衬底上生成导电图案的方法,其中,所述方法包括以下步骤:
-在衬底上形成预定图案的粘合剂层,所述衬底由纤维素材料和聚合物材料中的至少一种制成,
-将导电固体颗粒添加到所述粘合剂层上,其中,所述颗粒粘接到所述粘合剂上,
-通过电磁辐射加热所述固体颗粒,其中,电磁波谱的波长在600-1400nm的范围内,优选地在700-1200nm的范围内,使得所述颗粒的温度超过其特征熔点,以及
-将加热的所述颗粒按压在所述衬底的压区中,所述颗粒在压区中被压平,使得所述颗粒彼此电连接并且由此形成所述导电图案。
此外,本发明是一种用于生成RFID标签的方法,其中,所述方法包括以下步骤:
-在衬底上形成预定图案的粘合剂层,所述衬底由纤维素材料和聚合物材料中的至少一种制成,
-将导电固体颗粒添加到所述粘合剂层上,其中,所述颗粒粘接到所述粘合剂上,
-通过电磁辐射加热所述固体颗粒,其中,电磁波谱的波长在600-1400nm的范围内,优选地在700-1200nm的范围内,使得所述颗粒的温度超过其特征熔点,以及
-将加热的所述颗粒按压在所述衬底的压区中,所述颗粒在压区中被压平,使得所述颗粒彼此电连接并且由此形成天线,以及
-将集成电路(IC)附接到所述天线上,使得在所述IC和所述天线之间建立电连接,其中,所述天线和所述IC形成所述RFID标签。
具体实施方式
以下将参照一些优选实施例对本发明的用于在衬底上生成导电图案的方法进行更详细地描述。
该方法包括以下步骤:在衬底上形成预定图案的粘合剂层。该粘合剂图案可以通过用于将粘合剂图案施加到衬底上的任何合适压区的方法施加,例如喷墨、柔版印刷、凸版印刷、凹版印刷、丝网印刷、喷涂、卷筒纸涂布、轮涂、刷涂,或者包括能够在衬底上沉积粘合剂图案的任何其他方法。所述粘合剂可以是用于此目的的任何合适的粘合剂。一种优选的粘合剂是丙烯酸基粘合剂,例如苯乙烯/丙烯酸酯、苯乙烯/丁二烯或PVAc乳剂。所述粘合剂也可以是淀粉基粘合剂,诸如改性淀粉。
所述衬底可以是纸或纸板材料,因为这些纤维素材料对导电图案具有非常好的粘合性能。此外,纸和纸板是环保的,因为它们是可生物降解和可回收的。一种优选的衬底是粒度为30至200gsm的纤维素衬底。此外,所述衬底可以是单个或多个衬底。另一种合适的纤维素衬底是由微纤化纤维素(micro fibrillated cellulose,MFC)制成的衬底或由微纤化纤维素制成的薄膜。
然而,本领域技术人员意识到的是,其他的非导电衬底也是可能的,诸如涤塔夫(polyester taffeta)或尼龙。如果产品(例如包含洗涤说明的衣服上的护理标签)将在潮湿的环境中使用,则上述聚合物衬底尤其适用。这些聚合物对热高度敏感,因此本发明也非常适用于这些材料。本领域技术人员还意识到的是,所述衬底可以由纤维素材料和聚合物材料的组合制成。
所述方法还包括以下步骤:将导电固体颗粒添加到所述粘合剂层图案上,其中,所述颗粒粘接到所述粘合剂上。固体颗粒可以以多种不同的方式添加,并且本发明不限于特定的添加方法。例如,所述添加步骤可以是将所述固体颗粒吹到所述粘合剂上,将所述衬底浸渍到颗粒床上,其中,所述颗粒粘接到粘合剂图案上,或者通过静电转移方式。
导电固体颗粒优选地由非共晶合金的焊料材料制成。然而,最优选的是包含锡和铋的合金或仅包含锡的合金。锡和铋是无铅的,并且因此更加环保。而且,它们具有相对较低的熔化温度以及相对良好的导电性。
上述方法还包括至少一个加热步骤。加热是通过电磁辐射加热所述固体颗粒执行的,其中,电磁波谱的波长在600-1400nm的范围内,优选地在700-1200nm的范围内,使得颗粒的温度超过其特征熔点。
电磁辐射的能量辐射在1.5-2.8MW/μm m2的范围内。
测试表明,在这些短波长下的电磁辐射非常适合加热/熔化非共晶合金的固态焊料颗粒。在这个范围内,辐射激发分子振动的组合和谐波。这意味着在电磁波谱的这一部分中摩尔吸收率通常很小,其结果是许多高分子化合物没有很强的吸收率,并且因此在通过如此短的电磁辐射波长照射时不容易被加热。具有这些短波长的电磁辐射有可能有选择性地对在这部分光谱中具有强吸收率的材料进行加热,并且所述电磁辐射固有的能量密度将使其获得高速度,而下层衬底将使得辐射能够穿透衬底,从而避免损坏。具有这种短波长的电磁辐射也被称为近红外(Near Infrared)或NIR。电磁辐射可以直接施加到面对固体颗粒的衬底的正面上,或者施加到远离固体颗粒的衬底的背面上,或者同时施加到衬底的两侧上。
因此,纸、纤维基衬底和大多数常见的塑料包装在这些短波长下并不会明显地吸收辐射。这意味着对衬底不必要的加热大大减少,而这种加热会对由纸、纸板、聚酯纤维和尼龙制成的衬底间接地造成负面影响。
所述方法还包括以下步骤:将加热的所述颗粒按压在衬底上。所述按压在压区中进行,所述压区的表面温度低于颗粒的特征熔化温度。对所述压区的按压将使得颗粒被压平,使得颗粒彼此电连接并且由此形成导电图案。
该按压最好在辐射加热之后尽快施加,其中,颗粒仍然保持在几乎熔化的状态。因此,先前熔化的材料以基本上连续的导电图案的形式进行固化。
所述压区可以是非加热的压区。然而,优选地,将所述压区的表面加热到比所述特征熔化温度稍低的温度(诸如30-60℃)。例如,这确保了熔体不会在被按压到所述衬底上之前过早地凝固。所述压区将使得初始固态导电颗粒的先前熔化的材料再次固化,但是这次不是以分离的颗粒的形式固化,而是以按预定图案排列的基本上连续的导电层的形式固化。
所述方法还可以涉及一个或多个附加的加热步骤的实施例。这些附加的加热步骤可以设置在短波长电磁辐射步骤之前和/或之后。
所述附加的加热步骤可以是波长为1500nm及以上的红外辐射(infraredradiation,IR)加热。IR源优选地为2×2kW的IR灯或4×2kW的IR灯。一个优选的实施例是通过波长范围为600-1400nm的电磁辐射步骤之后,进行波长为1500nm及以上的IR加热。
所述附加的加热步骤也可以是在烘箱中进行的热熔加热。所述烘箱的温度在200℃以下。
附加的加热步骤可能是有利的,因为导体可能为具有各种形状和尺寸的几何形状。不同加热步骤的组合可以对不同的几何形状进行不同的加热。例如,一种加热方法首先加热固体图案的狭窄形状或边缘,而另一种加热方法可以首先加热固体图案的中心。因此,在本发明的电磁辐射加热步骤(波长600-1400nm)中伴随有IR和/或热熔加热可能是有益的,以达到多种几何形状的平衡和均匀的加热轮廓。
在本发明的一个优选实施例中,形成的导电图案是天线,优选地是用于RFID标签的天线。
在另一实施例中,本发明包括一种用于生成RFID标签的方法。该实施例与上述实施例相同,此外,该实施例包括以下步骤:将集成电路(integrated circuit,IC)或微芯片附接到所述导电图案,即天线上,以便在IC和天线之间建立电连接,其中,天线和IC形成RFID标签。
可以以各种方式实现IC到天线的附接。在第一实施例中,通过在IC和天线垫区域之间施加粘合剂并且将IC按压到RFID天线上,从而将IC附接到天线上。在第二实施例中,所述IC通过焊接进行附接。
与现有技术相比,根据本发明的方法的一些优点是:
·衬底将吸收较少的热量,这意味着衬底损坏的风险较小。
·由于热量被引导至需要热量的地方,因此能源消耗将会减少。
·由于本发明的加热步骤,即使使用了附加的加热,能源消耗也将减少。
·本发明的方法使得可以使用热敏衬底。
·由纤维素和/或聚合物制成的衬底不会显著吸收在这些短波长下的辐射。这意味着对衬底的不必要加热大大减少,因为已经表明对衬底的加热和冷却会增加衬底中的应力,而这可能会导致裂纹等。
在前述内容中,已经基于一些优选的实施例对本发明进行了描述。然而,本领域技术人员意识到的是,附加的实施例和变型在所附权利要求的范围内是可能的。
例如,本发明不仅适用于生产用于RFID标签的天线。本领域技术人员意识到的是,本发明的方法可以用于生产其它导电图案,诸如印刷布线、用于柔性电池的导体、显示器、传感器、加热器或类似物。
Claims (14)
1.一种用于在衬底上生成导电图案的方法,其中,所述方法包括以下步骤:
-在衬底上形成预定图案的粘合剂层,所述衬底由纤维素材料和聚合物材料中的至少一种制成,
-将导电固体颗粒添加到所述粘合剂层上,其中,所述颗粒粘接到所述粘合剂上,
-通过电磁辐射加热所述固体颗粒,其中,电磁波谱的波长在600-1400nm的范围内,优选地在700-1200nm的范围内,使得所述颗粒的温度超过其特征熔点,以及
-将加热的所述颗粒按压在所述衬底的压区中,所述颗粒在压区中被压平,使得所述颗粒彼此电连接并且由此形成所述导电图案。
2.根据权利要求1所述的方法,其中,所述方法还包括至少一个附加的加热步骤,在所述附加的加热步骤中,所述颗粒被加热至低于所述特征熔点的温度。
3.根据权利要求2所述的方法,其中,所述附加的加热步骤是通过红外辐射加热进行加热的,其中,IR源的波长为1500nm及以上。
4.根据权利要求2或3所述的方法,其中,所述附加的加热步骤是在烘箱中进行的热熔加热,其中,所述烘箱的温度低于200℃。
5.根据权利要求1至4中任一项所述的方法,其中,所述电磁辐射的能量辐射在1.5-2.8MW/μm m2的范围内。
6.根据权利要求1至5中任一项所述的方法,其中,所述固体颗粒是由共晶合金制成的。
7.根据权利要求6所述的方法,其中,所述共晶合金包括锡,优选地包括锡和铋。
8.根据权利要求1至7中任一项所述的方法,其中,所述衬底由纸或纸板材料制成。
9.根据权利要求1至7中任一项所述的方法,其中,所述衬底由聚酯纤维或尼龙制成。
10.根据权利要求1至9中任一项所述的方法,其中,所述导电图案是天线。
11.根据权利要求10所述的方法,其中,所述方法还包括以下步骤:将集成电路(IC)附接到所述天线上,从而在所述IC和所述天线之间建立电连接,其中,所述天线和所述IC形成RFID标签。
12.用于生成RFID标签的方法,其中,所述方法包括以下步骤:
-在衬底上形成预定图案的粘合剂层,所述衬底由纤维素材料和聚合物材料中的至少一种制成,
-将导电固体颗粒添加到所述粘合剂层上,其中,所述颗粒粘接到所述粘合剂上,
-通过电磁辐射加热所述固体颗粒,其中,电磁波谱的波长在600-1400nm的范围内,优选地在700-1200nm的范围内,使得所述颗粒的温度超过其特征熔点,以及
-将加热的所述颗粒按压在所述衬底的压区中,所述颗粒在压区中被压平,使得所述颗粒彼此电连接并且由此形成天线,以及
-将集成电路(IC)附接到所述天线上,使得在所述IC和所述天线之间建立电连接,其中,所述天线和所述IC形成所述RFID标签。
13.根据权利要求12所述的方法,其中,通过将所述IC粘接和按压到所述天线上,以将所述集成电路(IC)附接到所述天线上。
14.根据权利要求12所述的方法,其中,所述集成电路(IC)是通过焊接附接的。
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JP2009181727A (ja) * | 2008-01-29 | 2009-08-13 | Panasonic Corp | マイクロ波処理装置 |
CN102437415A (zh) * | 2010-08-12 | 2012-05-02 | 三管有限公司 | 通过烧结金属制造天线的方法以及通过此方法制造的天线 |
JP2013082077A (ja) * | 2011-10-06 | 2013-05-09 | Hitachi Metals Ltd | スクリーン印刷方法 |
CN104206030A (zh) * | 2012-01-30 | 2014-12-10 | 斯塔诺阿埃索澳吉有限公司 | 用于在表面上产生导电图案的方法和装置 |
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